CN114623862A - Semiconductor measuring equipment and cleaning method - Google Patents
Semiconductor measuring equipment and cleaning method Download PDFInfo
- Publication number
- CN114623862A CN114623862A CN202011453148.2A CN202011453148A CN114623862A CN 114623862 A CN114623862 A CN 114623862A CN 202011453148 A CN202011453148 A CN 202011453148A CN 114623862 A CN114623862 A CN 114623862A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 69
- 239000004065 semiconductor Substances 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 19
- 235000012431 wafers Nutrition 0.000 claims abstract description 198
- 238000005259 measurement Methods 0.000 claims abstract description 15
- 238000012546 transfer Methods 0.000 claims abstract description 11
- 230000003749 cleanliness Effects 0.000 claims description 29
- 230000005611 electricity Effects 0.000 claims description 7
- 230000003068 static effect Effects 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 6
- 238000011109 contamination Methods 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 2
- 239000000356 contaminant Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000004064 recycling Methods 0.000 description 8
- 239000012535 impurity Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000009469 supplementation Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B6/00—Cleaning by electrostatic means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The application belongs to the technical field of semiconductor measurement, and particularly relates to a semiconductor measuring device and a cleaning method thereof, wherein the semiconductor measuring device comprises: the wafer loading port is used for storing wafers; the wafer measuring device is used for measuring parameters of the wafer; the wafer transfer device is used for transferring wafers among the modules of the measuring equipment; a cleaning module for cleaning the wafer load port, EFEM module and wafer metrology device while the semiconductor metrology apparatus is in operation. According to the semiconductor measuring equipment, the cleaning module is arranged in the semiconductor measuring equipment, so that the semiconductor measuring equipment can periodically clean the wafer loading port, the EFEM module, the wafer measuring device and the like in a non-stop state, and the production efficiency of the semiconductor measuring equipment is improved.
Description
Technical Field
The application belongs to the technical field of semiconductor detection, and particularly relates to semiconductor measuring equipment and a cleaning method.
Background
This section provides background information related to the present disclosure only and is not necessarily prior art.
After a plurality of processing processes are performed on a semiconductor wafer, parameter measurement needs to be performed on the processed wafer to ensure that the wafer meets the requirements of customers. Most wafers are measured by measuring equipment for measuring parameters such as thickness, morphology, defects, electrical properties, etc., the measuring equipment is usually an all-in-one machine and can measure a plurality of wafer parameters, and therefore, the wafers move through a plurality of positions in the measuring equipment. When a certain measuring station in the measuring device is contaminated or a wafer is contaminated, the contaminated area of the wafer is enlarged when the wafer moves in each measuring station, which may further cause contamination of a plurality of modules, and the contaminated measuring device may cause contamination to the wafer to be measured subsequently.
In the prior art, the pollution of each measuring station of each module in the measuring equipment is generally cleaned. However, the cleaning process requires the measurement equipment to be shut down, and the measurement shutdown process stops the production process, thereby reducing the production efficiency.
Disclosure of Invention
The present invention provides a semiconductor measuring apparatus, comprising: the wafer loading port is used for storing wafers; the wafer measuring device is used for measuring parameters of the wafer; an EFEM module to transfer wafers between the wafer load port and the wafer metrology device; a cleaning module for cleaning the wafer load port, the wafer metrology device, and the EFEM module while the semiconductor metrology apparatus is in operation.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the specific embodiments. The drawings are only for purposes of illustrating the particular embodiments and are not to be construed as limiting the application. Also, like parts are designated by like reference numerals throughout the drawings. Wherein:
fig. 1 is a schematic structural view of a semiconductor measuring apparatus of the present invention;
FIG. 2 is a diagram of an electrostatic wafer operating state of the cleaning module of FIG. 1;
FIG. 3 is a schematic view of a portion of the cleaning module of FIG. 1;
FIG. 4 is a flow chart of the steps of the cleaning method of the present invention.
Reference numerals are as follows:
100: a semiconductor measuring device;
10: a wafer load port;
20: EFEM module, 21: a mechanical arm;
30: a wafer measuring device;
40: cleaning module, 41: electrostatic wafer, 411: insulating member, 42: electrostatic wafer cassette, 43: an electrostatic wafer recycling box;
50: a cleanliness measuring module;
60: a control module;
70: a housing;
80: a chuck;
90: and (3) granules.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of the various chambers, layers and the relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and in practice, there may be deviations due to manufacturing tolerances or technical limitations, and those skilled in the art may additionally design chambers/layers having different shapes, sizes, relative positions, as the actual requirements dictate.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed.
As shown in FIG. 1, an embodiment of a first aspect of the present invention provides a semiconductor metrology apparatus 100, the semiconductor metrology apparatus 100 comprising: the semiconductor metrology apparatus includes a wafer load port 10, an EFEM module 20, a wafer metrology device 30, and a cleaning module 40, and more particularly, the wafer load port 10 is used to store a wafer, the wafer metrology device 30 is used to measure parameters of the wafer, the EFEM module 20 is used to transfer the wafer between the wafer load port 10 and the wafer metrology device 30, and the cleaning module 40 is used to clean the wafer load port 10, the wafer metrology device 30, and the EFEM module 20 when the semiconductor metrology apparatus 100 is in operation.
According to the semiconductor measuring apparatus 100 of the embodiment of the present invention, the cleaning module 40 is disposed in the semiconductor measuring apparatus 100, so that the semiconductor measuring apparatus 100 can clean the wafer loading port 10, the EFEM module 20, the wafer measuring device 30, and the like without stopping the apparatus, thereby preventing the productivity from being reduced due to the stop of the semiconductor measuring apparatus 100 caused by cleaning the semiconductor measuring apparatus 100, and meanwhile, the cleaning module 40 is an automatic module, which reduces the working pressure of the operator and the cost of the operator.
Specifically, the semiconductor measuring apparatus 100 further includes a housing 70, the wafer loading port 10 is disposed at one side of the housing 70, and the wafer loading port 10 is a temporary wafer storage, and a wafer cassette is prevented from being used for storing wafers on the wafer loading port 10. The wafer measuring device 30 is disposed in the housing 70 and opposite to the wafer loading port 10, and is disposed at the other side of the housing 70, and the wafer measuring device 30 is internally provided with a defect detecting module, a thickness detecting module, an electrical property detecting module, or the like, and the wafer is correspondingly detected in the wafer measuring device 30. In other embodiments of the present invention, the wafer measurement device 30 may be disposed on the same side of the wafer load port 10, and the wafer measurement device 30 may be disposed at any position as long as the space inside the housing 70 is sufficient. The EFEM module 20 is disposed between the wafer loading port 10 and the wafer measuring device 30, a robot arm 21 is disposed in the EFEM module 20, and the robot arm 21 transports the wafer temporarily stored in the wafer loading port 10 to the wafer measuring device 30, so that the wafer is detected by a detection module in the wafer measuring device 30. In addition, when the wafer loadport 10 and the wafer metrology device 30 are located on the same side of the housing 70, the EFEM module 20 may be located between the wafer loadport 10 and the wafer metrology device 30, or may be located within the housing 70 opposite to the wafer loadport 10 and the wafer metrology device 30. The cleaning module 40 is disposed within the housing 70 and is located in a chamber where the robot arm 21 can transfer.
In some embodiments of the present invention, the cleaning module 40 includes an electrostatic wafer 41, an electrostatic cassette 42, and an electrostatic reclaiming cassette 43, and specifically, the electrostatic cassette 40 is electrically connected to a power source that charges the electrostatic wafer 41 with static electricity through the electrostatic wafer 40. The robot arm 21 transfers the electrostatic wafer 41 with static electricity from the electrostatic wafer cassette 42 into the wafer loading port 10, so that the electrostatic wafer 41 adsorbs particles 90, impurities, etc. on the chuck 80 in the wafer loading port 10 (as shown in fig. 2), then the robot arm 21 transfers the electrostatic wafer 41 into the wafer measuring device 30, so that the electrostatic wafer 41 adsorbs the particles 90, impurities, etc. in the wafer measuring device 30, and finally the robot arm 21 transfers the electrostatic wafer 41 into the electrostatic wafer recycling cassette 43, so as to complete the cleaning of the semiconductor measuring apparatus 100 by cleaning the electrostatic wafer 41. The robot 21 may be configured to maintain the electrostatic wafer 41 in the EFEM module 20 and clean the EFEM module 20 while transferring the electrostatic wafer 41 from the wafer load port 10 to the wafer metrology device 30.
In this embodiment, the electrostatic wafer cassette 42 and the electrostatic wafer recycling cassette 43 may be disposed at the wafer loading port 10, and the electrostatic wafer cassette 42 and the electrostatic wafer recycling cassette 43 are disposed at the wafer loading port 10 for easy taking and placing, so as to facilitate periodic cleaning of the electrostatic wafer cassette 42 and the electrostatic wafer recycling cassette 43.
In other embodiments, the electrostatic unified pod 42 and the electrostatic unified pod 43 may also be disposed within the housing 70 and inside the EFEM module 20, and the positions of the electrostatic unified pod 42 and the electrostatic unified pod 43 do not affect the normal use of the robot 21. In other embodiments of the present invention, the electrostatic unified pod 42 and the electrostatic unified pod 43 may be located in any position within the housing 70 that does not interfere with the normal operation of the other modules.
Further, the used electrostatic wafer 41 in the electrostatic wafer recycling box 43 may be cleaned and then placed in the electrostatic wafer box 42 again to replenish the static electricity for recycling. The used electrostatic wafer 41 in the electrostatic wafer collection cassette 43 may be collected and discarded.
In some embodiments of the present invention, as shown in fig. 3, the semiconductor measuring apparatus 100 is provided with an element for removing static electricity, and an insulating member 411 having an insulating property for blocking current is attached to a bottom surface or a side surface of the electrostatic wafer 41, so as to prevent current leakage and prevent the electrostatic wafer 41 from being removed to lose an adsorption capability of the particles 90 or impurities when moving in the housing 70.
Further, the area of the insulating member 411 is much smaller than the area of the electrostatic wafer 41, so that the robot arm 21 can adsorb or clamp the electrostatic wafer 41, the situation that the robot arm 21 is difficult to clamp the electrostatic wafer 41 due to the excessively large area of the insulating member 411 is avoided, the normal movement of the electrostatic wafer 41 is ensured, and meanwhile, the situation that the cleaning efficiency is reduced due to the excessively large area of the insulating member can be avoided. In other embodiments, the area and position of the insulator 411 may be adjusted according to the area of the electrostatic wafer 41, as long as the insulator can achieve the insulating effect and does not affect the normal use of the electrostatic wafer 41.
In some embodiments of the present invention, the semiconductor metrology apparatus 100 further comprises a cleanliness measurement module 50, the cleanliness measurement module 50 is disposed inside the housing 70, the cleanliness measurement module 50 may be individually disposed at a fixed position, or a plurality of modules may be disposed inside the wafer load port 10, the EFEM module 20, and the wafer metrology device 30, respectively, and after the electrostatic wafer 41 cleans each chamber, the cleanliness measurement module 50 performs a cleanliness check on each chamber to determine whether each chamber has reached a cleanliness requirement, and if the cleanliness requirement has been reached, the cleaning process may be terminated, and if the cleanliness requirement has not been reached, the unreachable chamber may be secondarily cleaned to reach a standard position.
In some embodiments of the present invention, the semiconductor metrology apparatus 100 further comprises a control module 60, the control module 60 being electrically connected to the wafer load port 10, the robot 21 of the EFEM module 20, the wafer metrology device 30, the cleaning module 40, and the cleanliness metrology module 50. The control module 60 controls the robot 21 to transfer the wafer between the wafer load port 10 and the wafer metrology device 30 to complete the measurement of the defect or thickness of the wafer. The control module 60 controls the robot arm 21 to take the electrostatic wafer 41 out of the electrostatic wafer cassette 42 according to the condition that the cleanliness of each chamber, such as the wafer loading port 10, the EFEM module 20 and the wafer measuring device 30, monitored by the cleanliness measuring module 50 exceeds the standard, controls the robot arm 21 to place the electrostatic wafer 41 in the wafer loading port 10, the EFEM module 20 and the wafer measuring device 30, so that the electrostatic wafer 41 is placed in each chamber for a period of time to enable the electrostatic wafer 41 to adsorb particles 90 or impurities of the chamber as much as possible, then controls the robot arm 21 to place the electrostatic wafer 41 in the electrostatic wafer recycling cassette 43, and then the control module 60 determines whether to re-clean the respective chamber according to the monitoring condition of the cleanliness of each chamber by the cleanliness measuring module 50 to ensure that the cleanliness of each chamber reaches the measurement standard. In addition, the control module 60 controls the cleaning module 40 to clean the wafer loading port 10, the EFEM module 20, and the wafer measuring device 30 again according to the time when the cleaning module 40 stops operating, thereby implementing automation of the semiconductor measuring apparatus.
Embodiments of a second aspect of the present invention provide a cleaning method of a semiconductor metrology apparatus 100, as shown in FIG. 4, the cleaning method being performed by the semiconductor metrology apparatus 100 according to any of the embodiments described above, the cleaning method comprising the steps of:
s1: controlling the cleaning module to charge static electricity;
the control module controls the electrostatic wafer box to perform electrostatic supplementation on the electrostatic wafer so as to ensure that the electrostatic wafer has enough electrostatic quantity for adsorbing particles.
S2: loading a cleaning module;
the control module controls a mechanical arm in the EFEM module to take the electrostatic wafer out of the electrostatic wafer box and transfer the electrostatic wafer to a wafer loading port, the EFEM module or a wafer measuring device which needs to be cleaned.
S3: under the state that the semiconductor measuring equipment operates, the cleaning module is controlled to respectively clean the wafer loading port, the EFEM module and the wafer measuring device;
s4: acquiring cleanliness in the semiconductor measuring and measuring equipment;
and acquiring the cleanliness of a wafer loading port, an EFEM module or a wafer measuring device in the semiconductor measuring equipment.
S5: controlling the cleaning module to stop cleaning according to the fact that the cleanliness in the semiconductor measuring and testing device is higher than a cleanliness preset value;
and if the cleanliness of a certain cavity is higher than the preset cleanliness value, the cleaning module stops cleaning the cavity until the cleanliness of the wafer loading port, the EFEM module and the wafer measuring device in the semiconductor measuring equipment is higher than the preset cleanliness value, and the cleaning module stops cleaning.
S6: acquiring the cleaning stopping time of the cleaning module;
s7: and controlling the semiconductor measuring device to perform the next cleaning cycle according to the fact that the stop running time of the cleaning module is greater than or equal to the preset time value.
And controlling the cleaning module to periodically clean the wafer loading port, the EFEM module and the wafer measuring device through the time when the cleaning module stops running, thereby realizing the automation of the semiconductor measuring device. According to the cleaning method of the embodiment of the invention, the cleaning module 40 is arranged in the semiconductor measuring equipment 100, so that the semiconductor measuring equipment 100 can clean the wafer loading port 10, the EFEM module 20, the wafer measuring device 30 and the like in a non-stop state, thereby avoiding the condition of productivity reduction caused by stopping the semiconductor measuring equipment 100 due to cleaning the semiconductor measuring equipment 100, meanwhile, the cleaning module 40 is an automatic module, the working pressure of operators is reduced, and the cost of the operators is reduced.
Step S3 specifically includes the following steps:
s301: the electrostatic wafer of the cleaning module performs electrostatic adsorption on the wafer loading port;
s302: the electrostatic wafer carries out electrostatic adsorption on the EFEM module;
s303: the electrostatic wafer is electrostatically attracted to the wafer measuring device.
The control module controls the electrostatic wafer to be sequentially transferred in the wafer loading port, the EFEM module and the wafer measurement, and the electrostatic wafer stays in each cavity respectively so as to ensure that the electrostatic wafer has enough time to adsorb the dirt in the cavity.
The embodiments of the present disclosure have been described above. However, these examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. Those skilled in the art can also devise methods that are not exactly the same as those described above in order to achieve the same objectives. The scope of the disclosure is defined by the appended claims and equivalents thereof. Various alternatives and modifications can be devised by those skilled in the art without departing from the scope of the disclosure, and these alternatives and modifications are intended to fall within the scope of the disclosure.
Claims (10)
1. A semiconductor metrology apparatus, comprising:
the wafer loading port is used for storing wafers;
the wafer measuring device is used for measuring parameters of the wafer;
an EFEM module to transfer wafers between the wafer load port and the wafer metrology device;
a cleaning module for cleaning the wafer load port, the EFEM module, and the wafer metrology device while the semiconductor metrology apparatus is in operation.
2. The semiconductor metrology apparatus of claim 1, wherein the cleaning module comprises an electrostatic wafer, the electrostatic wafer being electrostatically charged, the electrostatic wafer being transferable between the wafer load port and the wafer metrology device by a robotic arm disposed within the EFEM module, the electrostatic wafer being configured to attract contamination from particles, contaminants, etc. within the wafer load port, the EFEM module, and the wafer metrology device.
3. The semiconductor metrology apparatus of claim 2, wherein the cleaning module further comprises an electrostatic cassette electrically connected to a power source, the electrostatic cassette configured to receive the electrostatic wafer and configured to replenish the electrostatic wafer with static electricity.
4. The semiconductor metrology apparatus of claim 2, wherein the cleaning module further comprises an electrostatic reclamation cassette for storing the wafers after use.
5. The semiconductor metrology apparatus of any one of claims 2-4, wherein an insulator is disposed on the electrostatic wafer.
6. The semiconductor measuring apparatus of claim 5, wherein the area of the insulating member is much smaller than the area of the electrostatic wafer.
7. The semiconductor metrology apparatus of any one of claims 2 to 4, further comprising a cleanliness measurement module for detecting the cleanliness of said wafer load port, said EFEM module and said wafer metrology device.
8. The semiconductor metrology apparatus of claim 7, further comprising a control module electrically connected to each of said EFEM module, said cleaning module, and said cleanliness metrology module.
9. A method of cleaning a semiconductor measurement apparatus, the method being performed according to any one of claims 1 to 8, the method comprising the steps of:
s1: controlling the cleaning module to replenish static electricity;
s2: controlling the electrostatic wafer of the cleaning module to be loaded to the area to be cleaned;
s3: controlling a cleaning module to respectively clean each area to be cleaned under the operating state of the semiconductor measuring equipment;
s4: acquiring cleanliness in the semiconductor measuring and measuring equipment;
s5: controlling the cleaning module to stop cleaning according to the fact that the cleanliness in the semiconductor measuring and testing device is higher than a cleanliness preset value;
s6: acquiring the cleaning stopping time of the cleaning module;
s7: and controlling the semiconductor measuring device to perform the next cleaning cycle according to the fact that the stop running time of the cleaning module is greater than or equal to the preset time value.
10. The cleaning method of claim 9, wherein the step S3 further comprises the steps of:
s301: controlling the electrostatic wafer to move to the wafer loading port and standing for a period of time at the wafer loading port;
s302: controlling the electrostatic wafer to move to the wafer transfer area and standing for a period of time in the EFEM module;
s303: controlling the electrostatic wafer to move to the wafer measuring device and standing for a period of time in the wafer measuring device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011453148.2A CN114623862B (en) | 2020-12-11 | 2020-12-11 | Semiconductor measuring equipment and cleaning method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011453148.2A CN114623862B (en) | 2020-12-11 | 2020-12-11 | Semiconductor measuring equipment and cleaning method |
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| CN114623862A true CN114623862A (en) | 2022-06-14 |
| CN114623862B CN114623862B (en) | 2024-04-16 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI246148B (en) * | 2004-09-07 | 2005-12-21 | Powerchip Semiconductor Corp | Cleaning fixture for wafer stage of semiconductor tool |
| KR20130007396A (en) * | 2011-06-30 | 2013-01-18 | 세메스 주식회사 | Apparatus for treating substrate and method for supercritical fluid ventilation |
| CN207503946U (en) * | 2017-12-04 | 2018-06-15 | 武汉新芯集成电路制造有限公司 | A kind of wafer device for loading and semiconductor processing equipment |
| TWI644164B (en) * | 2017-09-20 | 2018-12-11 | 台灣積體電路製造股份有限公司 | Semiconductor wafer processing method, semiconductor wafer processing system and method for cleaning semiconductor wafer processing system |
| CN109712906A (en) * | 2017-10-25 | 2019-05-03 | 长鑫存储技术有限公司 | Wafer storage device with cleaning function and semiconductor production equipment |
| CN109994401A (en) * | 2017-12-29 | 2019-07-09 | 长鑫存储技术有限公司 | Semiconductor equipment front-end module, semiconductor equipment and wafer processing method |
| CN111326403A (en) * | 2018-12-13 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | Wafer pretreatment method and semiconductor device |
-
2020
- 2020-12-11 CN CN202011453148.2A patent/CN114623862B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI246148B (en) * | 2004-09-07 | 2005-12-21 | Powerchip Semiconductor Corp | Cleaning fixture for wafer stage of semiconductor tool |
| KR20130007396A (en) * | 2011-06-30 | 2013-01-18 | 세메스 주식회사 | Apparatus for treating substrate and method for supercritical fluid ventilation |
| TWI644164B (en) * | 2017-09-20 | 2018-12-11 | 台灣積體電路製造股份有限公司 | Semiconductor wafer processing method, semiconductor wafer processing system and method for cleaning semiconductor wafer processing system |
| CN109712906A (en) * | 2017-10-25 | 2019-05-03 | 长鑫存储技术有限公司 | Wafer storage device with cleaning function and semiconductor production equipment |
| CN207503946U (en) * | 2017-12-04 | 2018-06-15 | 武汉新芯集成电路制造有限公司 | A kind of wafer device for loading and semiconductor processing equipment |
| CN109994401A (en) * | 2017-12-29 | 2019-07-09 | 长鑫存储技术有限公司 | Semiconductor equipment front-end module, semiconductor equipment and wafer processing method |
| CN111326403A (en) * | 2018-12-13 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | Wafer pretreatment method and semiconductor device |
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