KR20230100540A - Apparatus for treating a substrate and electrostatic monitoring method of treatment liquid - Google Patents

Abstract

The present invention provides a substrate processing apparatus. A substrate processing apparatus includes a substrate support unit supporting a substrate; a nozzle supplying a liquid to the substrate supported by the substrate support unit; a home port where the nozzle waits; and a charge measurement member for measuring the amount of charge of the liquid dispensed from the nozzle in the home port.

Description

Substrate processing apparatus and treatment liquid charging monitoring method {APPARATUS FOR TREATING A SUBSTRATE AND ELECTROSTATIC MONITORING METHOD OF TREATMENT LIQUID}

The present invention relates to a substrate processing apparatus and a method for monitoring charge of a treatment liquid.

A single-wafer type liquid processing device used in a semiconductor manufacturing process is configured to discharge a processing liquid from a nozzle onto the surface of a substrate held by a spin chuck, for example.

Examples of the liquid processing include a process of applying a resist liquid to a substrate to form a resist pattern, a process of supplying a developing solution to the exposed substrate, and a process of supplying a rinse liquid to the substrate to clean it. This treatment liquid is supplied to the nozzle through a pipe provided with equipment such as a valve, filter, pump, etc. on the way.

A flow path including piping or equipment is made of an insulating material such as fluororesin from the viewpoint of cleanliness or chemical resistance. When the treatment liquid passes through the passage (eg, a pipe), static electricity is generated due to friction between the treatment liquid and the inner surface of the passage, and the treatment liquid is charged. The amount of charge of the treatment liquid may increase depending on the type of treatment liquid or process conditions, and there is a concern about damage to members constituting the flow path due to electrostatic destruction or degradation of treatment process performance. In particular, if a treatment liquid having a large amount of charge is supplied to the substrate, the substrate to be treated may be charged by the treatment liquid or the treatment liquid may be discharged, causing damage to the substrate.

In addition, when a processing liquid having a large amount of charge circulates through a flow path in the substrate processing apparatus, various sensors (eg, temperature sensors or pressure sensors) installed in the flow path may malfunction or fail. These sensors are used, for example, for managing and maintaining substrate processing conditions. Therefore, malfunctions and failures of the sensor cause processing defects of the substrate.

Therefore, in order to solve the problem of static electricity generated during the substrate processing process, it is necessary to monitor the amount of charge of the processing liquid.

An object of the present invention is to provide a substrate processing apparatus capable of monitoring the amount of charge of a processing liquid supplied to a substrate and a method for monitoring the charge of a processing liquid.

An object of the present invention is to provide a substrate processing apparatus and a method for monitoring charge of a processing liquid capable of preventing contamination of a processing liquid supplied to a substrate while measuring the amount of charge of the processing liquid.

The problem to be solved by the present invention is not limited thereto, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to one aspect of the present invention, a substrate support unit for supporting a substrate; a nozzle supplying a liquid to the substrate supported by the substrate support unit; a home port where the nozzle waits; and a charge measuring member configured to measure the amount of charge of the liquid dispensed from the nozzle in the home port.

In addition, the charge measurement member may include a first measurement electrode provided in the home port to contact the liquid dispensed from the nozzle.

In addition, it further includes a liquid supply device for supplying liquid to the nozzle, wherein the liquid supply device includes a vent unit through which the liquid is vented; The charge measurement member may further include a second measurement electrode provided to contact the liquid vented through the vent unit.

In addition, the charge measuring member may further include a voltmeter for measuring a potential difference between the first measuring electrode and the second measuring electrode.

In addition, the liquid supply device may include an opening/closing valve provided on a flow path through which the liquid flows, and the voltmeter may measure a voltage change before and after opening of the opening/closing valve.

In addition, the liquid supply device includes a tank in which liquid is temporarily stored before being supplied to the nozzle; A pump supplying the liquid stored in the tank to the nozzle, and the vent unit includes a first vent line through which the liquid is vented from the tank; and a second vent line through which liquid is vented from the pump.

In addition, the second measuring electrode may be provided on the first vent line and the second vent line, respectively.

In addition, the first vent line and the second vent line may include a fitting part, and the second measuring electrode may include an electrode film provided on a surface of the fitting part in contact with a liquid.

In addition, the first measuring electrode and the second measuring electrode may be provided as a porous material.

In addition, the first measuring electrode and the second measuring electrode may have a contact surface having a concavo-convex or patterned surface to increase a contact area with the liquid.

In addition, the first measuring electrode may include an electrode film treated with ion implantation or coating on a surface of the body of the home port in contact with the liquid dispensed from the nozzle.

According to another aspect of the present invention, there is provided a liquid charge amount monitoring method capable of checking a change in liquid charge amount in real time by measuring the charge amount of liquid dispensed from a nozzle at a home port where a nozzle discharging the liquid is waiting. can

In addition, a change in liquid charge amount may be checked in real time by measuring the charge amount of liquid vented from a module provided on a liquid supply passage for supplying liquid to the nozzle.

In addition, a potential difference between the liquid dispensed from the nozzle and the liquid vented from the module may be measured in the home port.

Also, the module may include a pump and a tank.

According to another aspect of the present invention, a processing unit in which liquid processing of a substrate is performed; a home port provided outside the processing unit; a nozzle unit having a nozzle provided to discharge a processing liquid to a substrate located in the processing unit and to be movable between a processing position in which liquid processing is performed on the substrate in the processing unit and a standby position in the home port; a treatment liquid supply device supplying a treatment liquid to the nozzle and having a tank and a pump; and a charge measurement member measuring the amount of charge of the liquid dispensed from the nozzle waiting in the home port.

In addition, the charge measuring member may include a first measuring electrode provided in the home port to contact the liquid dispensed from the nozzle; A second measuring electrode installed on at least one of the vent lines respectively installed in the tank and the pump may be provided to contact a liquid vented from the vent line.

In addition, the charge measuring member may further include a voltmeter for measuring a potential difference between the first measuring electrode and the second measuring electrode.

In addition, the first measuring electrode and the second measuring electrode may be provided as a porous material.

In addition, the first measuring electrode and the second measuring electrode may have a contact surface having a concavo-convex or patterned surface to increase a contact area with the liquid.

According to an embodiment of the present invention, the amount of charge of the treatment liquid supplied to the substrate may be monitored.

According to an embodiment of the present invention, it is possible to prevent contamination of the treatment liquid supplied to the substrate while measuring the amount of charge of the treatment liquid.

The effects of the present invention are not limited to the above-mentioned effects, and effects not mentioned will be clearly understood by those skilled in the art from this specification and the accompanying drawings.

1 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of a substrate processing apparatus showing an application block or a developing block of FIG. 1 .
FIG. 3 is a plan view of the substrate processing apparatus of FIG. 1 .
FIG. 4 is a diagram showing an example of a hand of the conveying unit of FIG. 3 .
FIG. 5 is a schematic cross-sectional plan view of an embodiment of the heat treatment chamber of FIG. 3 .
6 is a front cross-sectional view of the heat treatment chamber of FIG. 5;
FIG. 7 is a diagram schematically illustrating an example of the liquid processing chamber of FIG. 3 .
FIG. 8 is a view for explaining the liquid supply unit, home port, and charge measuring member shown in FIG. 7 .
FIG. 9 is a view showing an example of the measuring electrode shown in FIG. 8 .
10 is a view showing another example of a first measuring electrode installed in a home port.
11 is a view showing still another example of a first measuring electrode installed in a home port.
12 is a view showing still another example of a first measuring electrode installed in a home port.
13 is a view showing another example of a second measuring electrode installed in a vent line of a pump unit.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. In addition, in describing preferred embodiments of the present invention in detail, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, the same reference numerals are used throughout the drawings for parts having similar functions and actions.

'Including' a certain component means that other components may be further included, rather than excluding other components unless otherwise stated. Specifically, terms such as "comprise" or "having" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features or It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Singular expressions include plural expressions unless the context clearly dictates otherwise. In addition, shapes and sizes of elements in the drawings may be exaggerated for clearer description.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms may be used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, the second element may also be termed a first element, without departing from the scope of the present invention.

It is understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may exist in the middle. It should be. On the other hand, when a component is referred to as “directly connected” or “directly connected” to another component, it should be understood that no other component exists in the middle. Other expressions describing the relationship between components, such as "between" and "directly between" or "adjacent to" and "directly adjacent to", etc., should be interpreted similarly.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in this application, they are not interpreted in an ideal or excessively formal meaning. .

The above detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and describe preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed in this specification, within the scope equivalent to the written disclosure and / or within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in the specific application field and use of the present invention are also possible. Therefore, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to cover other embodiments as well.

1 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the substrate processing apparatus showing a coating block or a developing block of FIG. 1, and FIG. 3 is a substrate processing apparatus of FIG. 1 is a plan view of

Referring to FIGS. 1 to 3 , the substrate processing apparatus 1 includes an index module 20 , a treating module 30 , and an interface module 40 . According to one embodiment, the index module 20, the processing module 30, and the interface module 40 are sequentially arranged in a line. Hereinafter, the direction in which the index module 20, the processing module 30, and the interface module 40 are arranged is referred to as the X-axis direction 12, and the direction perpendicular to the X-axis direction 12 when viewed from above is It is referred to as the Y-axis direction 14, and a direction perpendicular to both the X-axis direction 12 and the Y-axis direction 14 is referred to as the Z-axis direction 16.

The index module 20 transfers the substrate W from the container 10 in which the substrate W is stored to the processing module 30 and stores the processed substrate W into the container 10 . The longitudinal direction of the index module 20 is provided in the Y-axis direction 14 . The index module 20 has a load port 22 and an index frame 24. Based on the index frame 24, the load port 22 is located on the opposite side of the processing module 30. The container 10 in which the substrates W are stored is placed in the load port 22 . A plurality of load ports 22 may be provided, and the plurality of load ports 22 may be disposed along the Y-axis direction 14 .

As the container 10, an airtight container 10 such as a Front Open Unified Pod (FOUP) may be used. The vessel 10 may be placed on the loadport 22 by an operator or a transportation means (not shown) such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle. there is.

An index robot 2200 is provided inside the index frame 24 . A guide rail 2300 provided in the Y-axis direction 14 is provided in the index frame 24 , and the index robot 2200 may be provided to be movable on the guide rail 2300 . The index robot 2200 includes a hand 2220 on which a substrate W is placed, and the hand 2220 moves forward and backward, rotates in the Z-axis direction 16 as an axis, and rotates in the Z-axis direction 16. It may be provided to be movable along.

The processing module 30 performs a coating process and a developing process on the substrate (W). The processing module 30 has an application block 30a and a developing block 30b. The coating block 30a performs a coating process on the substrate W, and the developing block 30b performs a developing process on the substrate W. A plurality of application blocks 30a are provided, and they are provided to be stacked on each other. A plurality of developing blocks 30b are provided, and the developing blocks 30b are provided stacked on top of each other. According to the embodiment of FIG. 3 , two coating blocks 30a are provided and two developing blocks 30b are provided. The application blocks 30a may be disposed below the developing blocks 30b. According to an example, the two coating blocks 30a may perform the same process and may be provided with the same structure. Also, the two developing blocks 30b may perform the same process and have the same structure.

Referring to FIG. 3 , the coating block 30a has a heat treatment chamber 3200, a transfer chamber 3400, a liquid processing chamber 3600, and a buffer chamber 3800. The heat treatment chamber 3200 performs a heat treatment process on the substrate W. The heat treatment process may include a cooling process and a heating process. The liquid processing chamber 3600 supplies liquid to the substrate W to form a liquid film. The liquid film may be a photoresist film or an antireflection film. The transport chamber 3400 transports the substrate W between the heat treatment chamber 3200 and the liquid processing chamber 3600 within the coating block 30a.

The transfer chamber 3400 is provided with its longitudinal direction parallel to the X-axis direction 12 . A transfer unit 3420 is provided in the transfer chamber 3400 . The transport unit 3420 transports the substrate between the heat treatment chamber 3200 , the liquid processing chamber 3600 , and the buffer chamber 3800 . According to one example, the transport unit 3420 has a hand A on which a substrate W is placed, and the hand A moves forward and backward, rotates about the Z-axis direction 16, and rotates in the Z-axis direction. It may be provided movably along (16). A guide rail 3300 whose longitudinal direction is parallel to the X-axis direction 12 is provided in the transfer chamber 3400, and the transfer unit 3420 can be provided to be movable on the guide rail 3300. .

A plurality of liquid processing chambers 3600 are provided. Some of the liquid processing chambers 3600 may be stacked with each other. The liquid processing chambers 3600 are disposed on one side of the transfer chamber 3402 . The liquid processing chambers 3600 are arranged side by side along the first direction 12 . Some of the liquid processing chambers 3600 are provided adjacent to the index module 20 . Hereinafter, these liquid treatment chambers are referred to as a front liquid treating chamber 3602 (front liquid treating chamber). Other portions of the liquid processing chambers 3600 are provided adjacent to the interface module 40 . Hereinafter, these liquid treatment chambers are referred to as a rear heat treating chamber 3604 (rear heat treating chamber).

The front liquid processing chamber 3602 applies the first liquid on the substrate W, and the rear liquid processing chamber 3604 applies the second liquid on the substrate W. The first liquid and the second liquid may be different types of liquids. According to one embodiment, the first liquid is an antireflection film, and the second liquid is a photoresist. The photoresist may be applied on the substrate W coated with the anti-reflection film. Optionally, the first liquid may be a photoresist and the second liquid may be an antireflection film. In this case, the antireflection film may be applied on the substrate W to which the photoresist is applied. Optionally, the first liquid and the second liquid are the same type of liquid, and they may both be photoresists.

FIG. 4 is a diagram showing an example of a hand of the conveying unit of FIG. 3 . Referring to FIG. 4 , the hand A has a base 3428 and a support protrusion 3429 . The base 3428 may have an annular ring shape in which a part of the circumference is bent. The base 3428 has an inner diameter larger than the diameter of the substrate W. The support protrusion 3429 extends inwardly from the base 3428. A plurality of support protrusions 3429 are provided and support the edge area of the substrate W. According to one example, four support protrusions 3429 may be provided at equal intervals.

Referring back to FIG. 2 , a plurality of buffer chambers 3800 are provided. Some of the buffer chambers 3800 are disposed between the index module 20 and the transfer chamber 3400 . Hereinafter, these buffer chambers are referred to as a front buffer 3802 (front buffer). The front buffers 3802 are provided in plural numbers and are positioned to be stacked with each other along the vertical direction. Other portions of the buffer chambers 3802 and 3804 are disposed between the transfer chamber 3400 and the interface module 40 below. These buffer chambers are referred to as rear buffers 3804. The rear buffers 3804 are provided in plural numbers and are stacked on top of each other in the vertical direction. Each of the front-side buffers 3802 and the back-side buffers 3804 temporarily stores a plurality of substrates (W). The substrates W stored in the shearing buffer 3802 are carried in or out by the index robot 2200 and the transfer unit 3420 . The substrate W stored in the post buffer 3804 is carried in or out by the transfer unit 3420 and the first robot 4602 .

The developing block 30b has a heat treatment chamber 3200, a transfer chamber 3400, and a liquid treatment chamber 3600. The heat treatment chamber 3200, transfer chamber 3400, and liquid processing chamber 3600 of the developing block 30b are the heat treatment chamber 3200, transfer chamber 3400, and liquid processing chamber 3600 of the coating block 30a. ), since it is provided with a structure and arrangement substantially similar to that of, description thereof will be omitted. However, all of the liquid processing chambers 3600 in the developing block 30b are equally provided as a developing chamber 3600 that develops a substrate by supplying a developer solution.

The interface module 40 connects the processing module 30 to an external exposure device 50 . The interface module 40 has an interface frame 4100, an additional process chamber 4200, an interface buffer 4400, and a transfer member 4600.

A fan filter unit forming a descending airflow therein may be provided at an upper end of the interface frame 4100 . The additional process chamber 4200 , the interface buffer 4400 , and the transfer member 4600 are disposed inside the interface frame 4100 . The additional process chamber 4200 may perform a predetermined additional process before the substrate W, the process of which has been completed in the coating block 30a, is carried into the exposure apparatus 50 . Optionally, the additional process chamber 4200 may perform a predetermined additional process before the substrate W, which has been processed in the exposure apparatus 50, is transferred to the developing block 30b. According to an example, the additional process may be an edge exposure process of exposing the edge region of the substrate W, an upper surface cleaning process of cleaning the upper surface of the substrate W, or a lower surface cleaning process of cleaning the lower surface of the substrate W. can A plurality of additional process chambers 4200 may be provided, and they may be provided to be stacked on top of each other. Additional process chambers 4200 may all be provided to perform the same process. Optionally, some of the additional process chambers 4200 may be provided to perform different processes.

The interface buffer 4400 provides a space where the substrate W transported between the coating block 30a, the additional process chamber 4200, the exposure apparatus 50, and the developing block 30b temporarily stays during transport. A plurality of interface buffers 4400 may be provided, and the plurality of interface buffers 4400 may be stacked on top of each other.

According to an example, the additional process chamber 4200 may be disposed on one side of the transfer chamber 3400 in the longitudinal direction, and the interface buffer 4400 may be disposed on the other side.

The conveying member 4600 conveys the substrate W between the coating block 30a, the additional process chamber 4200, the exposure apparatus 50, and the developing block 30b. The transport member 4600 may be provided by one or a plurality of robots. According to an example, the transport member 4600 has a first robot 4602 and a second robot 4606 . The first robot 4602 transfers the substrate W between the application block 30a, the additional process chamber 4200, and the interface buffer 4400, and the interface robot 4606 transfers the substrate W between the interface buffer 4400 and the exposure device ( 50), the second robot 4604 may be provided to transfer the substrate W between the interface buffer 4400 and the developing block 30b.

The first robot 4602 and the second robot 4606 each include a hand on which the substrate W is placed, and the hand moves forward and backward, rotates about an axis parallel to the Z-axis direction 16, and Z-axis. It may be provided movably along the axial direction 16 .

Referring back to FIGS. 2 and 3 , a plurality of heat treatment chambers 3200 are provided. The heat treatment chambers 3200 are arranged in series along the first direction 12 . The heat treatment chambers 3200 are located on one side of the transfer chamber 3400 .

FIG. 5 is a plan view schematically illustrating an embodiment of the heat treatment chamber of FIG. 3 , and FIG. 6 is a front cross-sectional view of the heat treatment chamber of FIG. 5 .

Referring to FIGS. 5 and 6 , a heat treatment chamber 3200 includes a processing vessel (housing) 3201 , a cooling unit 3220 , and a heating unit 3230 .

The processing vessel 3201 has an interior space 3202 . The processing container 3201 is generally provided in the shape of a rectangular parallelepiped. An entrance (not shown) through which the substrate W is taken in and out is formed on the sidewall of the processing container 3201 . In addition, a door (not shown) may be provided to open and close the carrying port. The intake port may optionally be left open. The intake port may be formed in an area adjacent to the cooling unit 3220 .

A cooling unit 3220 and a heating unit 3230 are provided in the inner space 3202 of the processing container 3201 . A cooling unit 3220 and a heating unit 3230 are provided side by side along the Y-axis direction 14 .

An exhaust line 3210 may be connected to the processing container 3201 . The exhaust line 3210 may exhaust the gas supplied by the fan unit 3250 to the outside of the processing container 3201 . An exhaust line 3210 may be connected to the bottom of the processing vessel 3201 . However, it is not limited thereto, and the exhaust line 3210 may be connected to the side of the processing vessel 3201 or the like.

The cooling unit 3220 has a cooling plate 3222 . A substrate W may be seated on the cooling plate 3222 . The cooling plate 3222 may have a substantially circular shape when viewed from above. A cooling member (not shown) may be provided on the cooling plate 3222 . According to an example, the cooling member may be formed inside the cooling plate 3222 and provided as a passage through which cooling fluid flows. Accordingly, the cooling plate 3222 may cool the substrate W. The cooling plate 3222 may have a diameter corresponding to that of the substrate W. A notch may be formed at an edge of the cooling plate 3222 . The notch may have a shape corresponding to the support protrusion 3429 formed on the hand A described above. In addition, the number of notches corresponding to the number of support protrusions 3429 formed on the hand A may be formed at positions corresponding to the support protrusions 3429 . When the upper and lower positions of the hand A and the cooling plate 3222 are changed, the substrate W is transferred between the hand A and the cooling plate 3222 . A plurality of slit-shaped guide grooves 3224 are provided on the cooling plate 3222 . The guide groove 3224 extends from the end of the cooling plate 3222 to the inside of the cooling plate 3222 . The guide grooves 3224 are provided along the Y-axis direction 14 in their longitudinal direction, and the guide grooves 3224 are spaced apart from each other along the X-axis direction 12 . The guide groove 3224 prevents the cooling plate 3222 and the lift pins 3236 from interfering with each other when the substrate W is transferred between the cooling plate 3222 and the heating unit 3230 .

The cooling plate 3222 can move along the Y-axis direction 14 by an actuator 3226 mounted on a guide rail 3229 .

The heating unit 3230 is provided in the device 1000 to heat the substrate to a temperature higher than room temperature. The heating unit 3230 heats the substrate W under normal pressure or lower reduced pressure.

FIG. 7 is a diagram schematically illustrating an example of the liquid processing unit of FIG. 3 .

Referring to FIGS. 3 and 7 , each substrate processing unit 3602 performs a coating process of applying a treatment liquid such as a photoresist liquid on a substrate W. The substrate processing units may be sequentially arranged along the first direction 12 . For example, three substrate processing units may be positioned within the housing 3610 .

Each substrate processing unit 3602 includes a substrate support unit 3640, a processing container 3620, a liquid supply unit 700, a charge measuring member 800, and a home port 900.

The substrate support unit 3640 supports the substrate W in the inner space of the housing 3610 . The substrate support unit 3640 rotates the substrate W. The substrate support unit 3640 includes a spin chuck 3642 , a rotation shaft 3644 , and an actuator 3646 . A spin chuck 3642 serves as a substrate support member 3642 for supporting a substrate. The spin chuck 3642 is provided to have a circular plate shape. The upper surface of the spin chuck 3642 is in contact with the substrate W.

The rotary shaft 3644 and the driver 3646 are provided as rotary driving members 3644 and 3646 for rotating the spin chuck 3642 . A rotation shaft 3644 supports the spin chuck 3642 below the spin chuck 3642. The rotating shaft 3644 is provided so that its longitudinal direction is directed upward and downward. The rotation shaft 3644 is provided so as to be rotatable about its central axis. The driver 3646 provides a driving force so that the rotating shaft 3644 rotates.

The processing container 3620 is located in the inner space of the housing 3610 . The processing vessel 3620 is provided to have a cup shape with an open top. The processing vessel 3620 provides a processing space therein. The processing vessel 3620 is provided to wrap around the substrate support unit 3640 . That is, the substrate support unit 3640 is positioned in the processing space. The processing vessel 3620 includes an outer cup 3622 and an inner cup 3624. An outer cup 3622 is provided to wrap around the substrate support unit 3640, and an inner cup 3624 is positioned inside the outer cup 3622. Each of the outer cup 3622 and the inner cup 3624 is provided in an annular ring shape. A space between the outer cup 3622 and the inner cup 3624 functions as a recovery path through which liquid is recovered.

The nozzle unit 3660 supplies a treatment liquid onto the substrate W. The nozzle unit 3660 includes an arm 3662 and a treatment nozzle 3664 . A processing nozzle 3664 is installed on the bottom surface of the arm 3662 . Optionally, a plurality of arms 3662 may be provided, and a processing nozzle 3664 may be installed in each of the arms 3662 . In addition, the arm 3662 may be rotated by being coupled to a rotation shaft (not shown) having a longitudinal direction directed in a third direction.

The treatment nozzle 3664 is moved between a process position and a stand-by position by rotation of the rotary shaft. In the processing position, the processing nozzle 3664 discharges the processing liquid to the substrate supported by the substrate support unit 3640 to perform liquid processing on the substrate. While liquid processing is not performed on the substrate, the processing nozzle 4366 stands by at the stand-by position.

An auto-dispense operation, a pre-dispense operation, and a nozzle cleaning operation may be performed while the treatment nozzle 3664 is located in the home port 900, which is a standby position. The auto dispensing operation is an operation in which the treatment nozzle 3664 discharges the treatment liquid at regular time intervals when the treatment nozzle 3664 is on standby for a long time. Solidification of the treatment liquid in the nozzle unit 3660 by the auto dispensing operation is prevented. The pre-dispensing operation is an operation in which the processing liquid is previously discharged at a standby position before the processing liquid is discharged from the processing nozzle 3664 to the substrate. When the processing liquid is discharged to the substrate by the pre-dispensing operation, the processing liquid is smoothly performed.

Home port 900 is disposed on the outside of cup 3620. When viewed from above, the standby position of the treatment nozzle 3664 overlaps the home port 900 .

The liquid supply unit 700 supplies the treatment liquid to the treatment nozzle 3664 . In this embodiment, the liquid supply unit 700 is described as supplying the resist liquid used in the coating process, but is not limited thereto and can be applied to all liquid processing devices that process the substrate surface using the processing liquid.

FIG. 8 is a view for explaining the liquid supply unit, home port, and charge measuring member shown in FIG. 7 .

The home port 900 includes a cylindrical accommodation space 912 in which the upper part of the body is open and the nozzle tip of the treatment nozzle 3664 is accommodated therein, and a discharge space 914 in which the treatment liquid is dispensed from the treatment nozzle 3664. ) is provided.

The liquid supply unit 700 may include a bottle 710 , a trap tank 720 , a pump unit 730 and a supply passage 904 .

The bottle 710 is filled with a treatment liquid, and an inert gas supply line (not shown) and a first supply line 701 are connected. To the bottle 710, an inert gas (helium gas or nitrogen gas) is supplied through a regulator to make the inside of the sealed bottle 710 an inert gas atmosphere through an inert gas supply line, and the treatment liquid inside the bottle 710 is supplied at a relative pressure. It is moved to the trap tank 720 through the first supply line 701 .

In the trap tank 720, dissolved gas in the treatment liquid may be separated and removed. A second supply line 702 is connected to the trap tank 720 . The second supply line 702 is connected to the pump unit 730. A first vent line 728 is connected to the trap tank 920 . A portion of the treatment liquid stored in the trap tank 920 may be discharged through the first vent line 728 .

The pump unit 730 may supply the treatment liquid stored in the trap tank 720 to the treatment nozzle 3664 by fluid pressure generated by suction and discharge operations. Third supply lines 703 are connected to the pump unit 730 . The third supply line 703 may be connected to the processing nozzles 3664 of each of the liquid processing devices. An open/close valve*708 may be provided in the third supply line 703. A second vent line 738 may be provided in the pump unit 730 . Some of the treatment liquid pumped by the pump unit 730 may be discharged through the second vent line 738 .

The supply passage 704 may include a first supply line 701 , a second supply line 702 , and a third supply line 703 .

The charge measurement member 800 measures the amount of charge of the treatment liquid flowing in the liquid supply unit 700 . The charge measurement member 800 can measure the charge amount of the treatment liquid discharged from the treatment nozzle 3664 in the home port 900 and discarded. In addition, the charge measurement member 800 may measure the charge amount of the treatment liquid discharged through the second vent line 728 and the second vent line 738 . In addition, the charge measurement member 800 may measure a potential difference between the treatment liquid dispensed from the home port 900 and the treatment liquid discharged through the vent lines 728 and 738 .

According to an embodiment, the charge measuring member 800 may include a first measuring electrode 810, second measuring electrodes 820 and 830, and voltmeters 802 and 804. The first and second measurement electrodes 810 , 820 , and 830 may include a conductive material. Since the electrodes 810 , 820 , and 830 contact the treatment liquid discarded from the liquid supply unit 700 , there is no need to worry about contamination caused by contact between the electrode and the treatment liquid.

The first measurement electrode 810 may be provided in the home port 900 . The first measuring electrode 810 may be provided at a position where it can contact the treatment liquid dispensed from the treatment nozzle 3664 . For example, the first measurement electrode 810 may be provided on a sidewall of the home port 900 that contacts the discharge space 914 .

The second measuring electrodes 820 and 830 may be provided on the first vent line 728 and the second vent line 738 through which the treatment liquid is vented. The second measuring electrodes 820 and 830 may be provided at positions where they can come into contact with the treatment liquid discharged through the vent lines 728 and 738 .

The voltmeter 802 may measure a potential difference between the first measuring electrode 810 and the second measuring electrode 820 . Another voltmeter 804 may measure a potential difference between the first measuring electrode 810 and the second measuring electrode 830 . The voltmeters 802 and 804 may measure voltage changes before and after opening of the on/off valve 708 . A value measured by the charge measurement member 800 may be provided to an operator.

Meanwhile, the voltmeter 802 may measure a change in voltage between the first measuring electrode 810 and the second measuring electrodes 820 and 830 when the passage through which the treatment liquid passes in the pump unit 730 is connected to one.

The charge measuring member 800 may output an alarm when the amount of charge measured by the first measuring electrode 810 and the second measuring electrodes 820 and 830 exceeds an appropriate range.

Since the first measuring electrode 810 and the second measuring electrodes 820 and 830 are not provided on the flow path of the treatment liquid provided to the substrate, the first measuring electrode 810 and the second measuring electrodes 820 and 830 are provided to the substrate. It is not exposed to the discharged treatment liquid. Therefore, a problem of contaminating the substrate by being discharged to the substrate together with the processing liquid is not caused by foreign substances eluted from the measuring electrode.

FIG. 9 is a view showing an example of the measuring electrode shown in FIG. 8 .

As shown in FIG. 9 , the first and second measurement electrodes 810 , 820 , and 830 may be made of a porous material.

10 is a view showing another example of a first measuring electrode installed in a home port.

As shown in FIG. 10 , the first measurement electrode 810a may include a contact surface having an uneven surface 912 or a pattern in order to widen the contact area with the treatment liquid.

11 is a view showing still another example of a first measuring electrode installed in a home port.

As shown in FIG. 11 , the first measurement electrode 810b may be provided in the form of a conductive electrode film. The electrode film may be provided through an ion implantation process or a coating process on the surface of the body of the home port 900 in contact with the treatment liquid dispensed from the treatment nozzle 3664 .

12 is a view showing still another example of a first measuring electrode installed in a home port.

As shown in FIG. 12, the first measuring electrode 810c may be provided in the form of a fitting tube having an ion implanted surface, and the first measuring electrode 810c is processed while being inserted into the body of the home port 900. The conductivity of the liquid can be measured.

13 is a view showing another example of a second measuring electrode installed in a vent line of a pump unit.

As shown in FIG. 13 , the second measuring electrode 820 may be provided at the fitting part 739 of the second vent line 738 . The second measurement electrode 820 may be used by converting the fitting portion 739 into an electrode by ion implantation or coating.

This fitting part 739 is a pump unit ( 700) and may be provided on the vent line 738 sufficiently spaced apart. The second measuring electrode provided to the fitting part 739 can be equally applied to the vent line of the trap tank.

The above detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and describe preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed in this specification, within the scope equivalent to the written disclosure and / or within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in the specific application field and use of the present invention are also possible. Therefore, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to cover other embodiments as well.

900: home port 710: bottle
720: trap tank 704: supply flow path
730: pump unit 800: electrification measurement member
810: first measuring electrode 820: second measuring electrode
802: voltmeter

Claims (20)

In the device for processing the substrate,
a substrate support unit that supports the substrate;
a nozzle supplying a liquid to the substrate supported by the substrate support unit;
a home port where the nozzle waits; and
and a charge measuring member for measuring the amount of charge of the liquid dispensed from the nozzle in the home port. According to claim 1,
The charge measurement member
and a first measuring electrode provided in the groove port to contact the liquid dispensed from the nozzle. According to claim 2,
Further comprising a liquid supply device for supplying liquid to the nozzle,
The liquid supply device
Includes a vent portion through which the liquid is vented;
The charge measurement member
A substrate processing apparatus further comprising a second measuring electrode provided to contact the liquid vented through the vent unit. According to claim 3,
The charge measurement member
A substrate processing apparatus further comprising a voltmeter for measuring a potential difference between the first measuring electrode and the second measuring electrode. According to claim 4,
The liquid supply device
An on-off valve is provided on the flow path through which the liquid flows,
The voltmeter measures a voltage change before and after opening of the on-off valve. According to claim 3,
The liquid supply device
a tank in which liquid is temporarily stored before being supplied to the nozzle;
And a pump for supplying the liquid stored in the tank to the nozzle,
The vent part
a first vent line through which liquid is vented from the tank; and
A substrate processing apparatus comprising a second vent line through which the liquid is vented from the pump. According to claim 6,
The second measuring electrode is
A substrate processing apparatus provided on the first vent line and the second vent line, respectively. According to claim 6,
The first vent line and the second vent line include a fitting portion,
The second measuring electrode is
A substrate processing apparatus comprising an electrode film provided on a surface of the fitting portion in contact with the liquid. According to claim 3,
The first measuring electrode and the second measuring electrode are provided with a porous material. According to claim 3,
The first measuring electrode and the second measuring electrode have a contact surface having a concavo-convex or pattern to increase a contact area with the liquid. According to claim 2,
The first measuring electrode is
A substrate processing apparatus comprising an electrode film coated or ion implanted on a surface of the body of the home port in contact with the liquid dispensed from the nozzle. In the liquid charge amount monitoring method in a substrate processing apparatus using liquid:
A liquid charge amount monitoring method capable of checking a change in liquid charge amount in real time by measuring the charge amount of liquid dispensed from a nozzle at a home port where a nozzle discharging the liquid is waiting. According to claim 12,
A liquid charge amount monitoring method capable of checking a change in liquid charge amount in real time by measuring the charge amount of liquid vented from a module provided on a liquid supply passage for supplying liquid to the nozzle. According to claim 13,
A liquid charge amount monitoring method for measuring a potential difference between the liquid dispensed from the nozzle and the liquid vented from the module in the home hot pot. According to claim 13,
The module
Liquid charge amount monitoring method including pump and tank. In the apparatus for processing the substrate,
a processing unit in which liquid processing of the substrate is performed;
a home port provided outside the processing unit;
a nozzle unit having a nozzle provided to discharge a processing liquid to a substrate located in the processing unit and to be movable between a processing position in which liquid processing is performed on the substrate in the processing unit and a standby position in the home port;
a treatment liquid supply device supplying a treatment liquid to the nozzle and having a tank and a pump; and
and a charge measurement member measuring charge amount of liquid dispensed from the nozzle waiting in the home port. According to claim 16,
The charge measurement member
a first measuring electrode provided in the groove port to contact the liquid dispensed from the nozzle;
and a second measuring electrode installed on at least one of the vent lines installed in the tank and the pump and provided to contact a liquid vented from the vent line. According to claim 17,
The charge measurement member
A substrate processing apparatus further comprising a voltmeter for measuring a potential difference between the first measuring electrode and the second measuring electrode. According to claim 17,
The first measuring electrode and the second measuring electrode are provided with a porous material. According to claim 17,
The first measuring electrode and the second measuring electrode have a contact surface having a concavo-convex or pattern to increase a contact area with the liquid.

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