KR101697500B1 - Teaching method and substrate treating apparatus using the same - Google Patents

Teaching method and substrate treating apparatus using the same Download PDF

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Publication number
KR101697500B1
KR101697500B1 KR1020150083362A KR20150083362A KR101697500B1 KR 101697500 B1 KR101697500 B1 KR 101697500B1 KR 1020150083362 A KR1020150083362 A KR 1020150083362A KR 20150083362 A KR20150083362 A KR 20150083362A KR 101697500 B1 KR101697500 B1 KR 101697500B1
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South Korea
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substrate
hand
support plate
robot
center
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KR1020150083362A
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Korean (ko)
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KR20160146289A (en
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김덕식
유준호
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세메스 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides a teaching method. 1. A teaching method for setting a position of a robot for carrying a substrate on a support plate for supporting a substrate, the method comprising the steps of: first detecting a center of a substrate placed on a hand in the robot, positioning the substrate on the support plate, Aligning the position of the substrate on the support plate, unloading the substrate placed on the support plate with the hand to detect the center of the substrate on the hand, and detecting the center of the first detected substrate and the center of the second detected substrate Calculates a difference value between centers, and sets the position of the robot based on the difference value.

Description

TECHNICAL FIELD [0001] The present invention relates to a teaching method, and a substrate processing apparatus using the same.

The present invention relates to a teaching method and a substrate processing apparatus using the same, and more particularly, to an automatic teaching method of a substrate transfer robot and a substrate processing apparatus using the same.

Various processes such as photolithography, etching, ashing, thin film deposition, and cleaning process are performed on the semiconductor device and the flat panel display panel. Among these processes, the photolithography is performed sequentially with the application, the exposure, and the development process. The coating step is a step of applying a photosensitive liquid such as a resist to the surface of the substrate. The exposure process is a process for exposing a circuit pattern on a substrate having a photosensitive film formed thereon. The developing step is a step of selectively developing the exposed region of the substrate.

The substrate transfer apparatus transfers the substrate to a processing unit (or process chamber) that processes each process. Therefore, the substrate transfer apparatus needs to set the position of the transfer robot in order to accurately supply the substrate to each processing unit. For example, a semiconductor manufacturing facility such as a spinner system or a scrubber has a plurality of processing units, and the substrate is transferred to the processing unit by the transfer robot. The processing unit advances each process, and the substrate is again transported to the outside by the transfer robot. At this time, it is very important that the substrate is accurately placed at the set position of the plate in the processing unit. If the substrate is placed incorrectly on the plate in the bake module or the application module, a process error such as failure to uniformly heat the entire substrate or uniform application of the photoresist occurs.

The present invention provides a method of teaching a robot and a substrate processing apparatus for accurately positioning a substrate at a predetermined position on a support plate.

It is another object of the present invention to provide a substrate processing apparatus with improved processing accuracy.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

The present invention provides a teaching method.

According to an embodiment of the present invention, there is provided a teaching method for setting a position of a robot for carrying a substrate on a support plate for supporting a substrate, the method comprising: first detecting a center of a substrate placed on a hand in the robot, Secondly detecting the center of the substrate on the hand by unloading a substrate placed on the support plate with the hand, positioning the substrate on the support plate, Calculates a difference value between the center and the center of the second detected substrate, and sets the position of the robot based on the difference value.

According to one embodiment, the hand of the robot includes a first hand and a second hand provided in a vertical direction, and positioning of the robot is performed for each of the first hand and the second hand.

According to one embodiment, the robot primarily detects the center of the substrate placed on the hand, positions the substrate on the support plate, aligns the position of the substrate on the support plate, Secondly detecting the center of the substrate on the hand by unloading with the hand is performed on the first hand and thereafter loading the substrate from the first hand onto the support plate, And calculating a difference between a center of the first detected substrate and a center of the second detected substrate in the first hand, and calculating a difference between the center of the first detected substrate and the center of the second detected substrate, Sets a position of the first hand based on the difference value, and determines a position of the second hand based on the center misalignment value detected on the second hand Determined.

According to an embodiment, there is provided a teaching method for setting a position of a robot for carrying a substrate on a supporting plate for supporting a substrate, the method comprising: positioning the substrate from the robot hand on the supporting plate; Detects a center deflection value of the substrate on the hand by unloading the substrate placed on the support plate with the hand, and sets the position of the robot based on the center deflection value.

According to one embodiment, the hand of the robot includes a first hand and a second hand provided in a vertical direction, and positioning of the robot is performed for each of the first hand and the second hand.

According to one embodiment, the substrate from the robot's hand is placed on the support plate, the position of the substrate on the support plate is aligned, and the substrate placed on the support plate is unloaded with the hand, Detecting a center misalignment value is performed for the first hand, and thereafter, positioning the substrate from the first hand on the support plate, unloading the substrate placed on the support plate with the second hand, Detecting a central deflection value of the substrate on the second hand and setting respective positions of the first hand and the second hand based on respective center deflection values detected on the first hand and the second hand.

According to one embodiment, the detection is performed using a sensor provided in the robot.

According to one embodiment, the detection is performed using a camera.

The present invention provides a substrate processing apparatus.

According to an embodiment of the present invention, there is provided a plasma processing apparatus comprising: a support plate for supporting a substrate; An alignment member provided on the support plate to align the substrate; A robot for carrying the substrate on the support plate with a hand on which the substrate is placed; A detector for detecting the center of the substrate on the hand; And a controller for controlling the robot and the detector;

Wherein the controller firstly detects the center of the substrate placed on the hand of the robot when setting the position of the robot and loads the substrate onto the support plate with the robot, And then controls the robot and the detector to secondly detect the center of the substrate on the hand by unloading the substrate from the support plate with the robot, and detecting the center of the first detected substrate and the second detected substrate And sets the position of the robot based on the difference value.

According to one embodiment, the hand of the robot includes a first hand and a second hand provided in a vertical direction, and positioning of the robot is performed for each of the first hand and the second hand.

According to one embodiment, when setting the position of the robot, the controller primarily detects the center of the substrate placed on the hand by the robot, positions the substrate on the support plate, Aligning the position of the substrate with respect to the substrate, and unloading the substrate placed on the support plate with the hand so that the second detection of the center of the substrate on the hand is performed on the first hand, Wherein the control unit controls the robot and the detector to detect a central deviation value of the substrate on the second hand by loading the substrate on the support plate and again on the second hand, Calculates a difference value between the center of the substrate and the center of the second detected substrate, sets the position of the first hand based on the difference value, On the basis of the center value of the second hand teuleojim sets the position of the second hand.

According to one embodiment, there is provided a plasma processing apparatus comprising: a support plate for supporting a substrate; An alignment member provided on the support plate; A robot for carrying the substrate on the support plate with a hand on which the substrate is placed; A detector for detecting the center of the substrate; And a controller for controlling the robot and the detector; Wherein the controller is configured to position the substrate on the support plate from the robot's hand, align the position of the substrate on the support plate, unload the substrate placed on the support plate with the hand, And the position of the robot is set based on the center misalignment value.

According to one embodiment, the hand of the robot includes a first hand and a second hand provided in a vertical direction, and positioning of the robot is performed for each of the first hand and the second hand.

According to one embodiment, the controller is configured to position the substrate on the support plate from the robot's hand, align the position of the substrate on the support plate, unload the substrate placed on the support plate with the hand, Detecting a center misalignment value of the substrate is performed for the first hand and thereafter positioning the substrate from the first hand on the support plate and unloading the substrate placed on the support plate with the second hand Controls the robot and the detector to detect the center of the substrate on the second hand, and based on each center deviation value detected on the first hand and the second hand, the first hand and the second hand Respectively.

According to one embodiment, the alignment member has an inclined surface inclined downward from the outside of the support plate toward the inside.

According to one embodiment, the detector is a sensor provided in the robot.

According to one embodiment, the detector is a camera.

According to the embodiment of the present invention, the substrate can be precisely positioned at the set position of the support plate when the substrate is transported or transported.

According to the embodiment of the present invention, the accuracy of the processing steps can be improved.

The effects of the present invention are not limited to the above-mentioned effects, and the effects not mentioned can be clearly understood by those skilled in the art from the present specification and attached drawings.

1 is a sectional view showing a substrate processing apparatus.
Fig. 2 is a cross-sectional view of the equipment of Fig. 1 viewed from the direction AA.
Fig. 3 is a cross-sectional view of the equipment of Fig. 1 viewed from the BB direction.
4 is a cross-sectional view of the installation of Fig. 1 viewed from CC direction.
FIG. 5 is a view showing the transfer robot of FIG. 1. FIG.
FIG. 6 is a view illustrating a substrate processing apparatus according to an embodiment of the present invention shown in FIG. 1. Referring to FIG.
7 is a view showing an alignment member provided on a support plate;
8 is a view showing a robot provided with a first hand and a second hand according to Modification 1 and Modification 2 of the present invention.
9 is a flowchart showing the teaching process according to the first embodiment of the present invention.
10 is a flowchart showing the teaching process according to the second embodiment of the present invention.
11 to 14 are diagrams showing a teaching process according to the first embodiment and the second embodiment of the present invention.
15 is a flowchart showing the teaching process according to the third embodiment of the present invention.
16 is a flowchart showing the teaching process according to the fourth embodiment of the present invention.
17 to 20 are diagrams showing the teaching process according to the third embodiment and the fourth embodiment.
FIG. 21 is a view showing a method of setting the position of the robot from the center of the first detected and second detected substrates according to the embodiment of the present invention. FIG.
FIG. 22 is a diagram illustrating a method of setting a position of a robot based on a set teaching value and a center deviation value of a substrate detected according to an embodiment of the present invention. FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. The shape of the elements in the figures is therefore exaggerated to emphasize a clearer description.

The facilities of this embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the apparatus of this embodiment can be used to perform a coating process and a developing process on a substrate, which is connected to an exposure apparatus. Hereinafter, a case where a wafer is used as a substrate will be described as an example.

Hereinafter, a substrate processing apparatus and a substrate processing apparatus of the present invention will be described with reference to FIGS. 1 to 5. FIG.

FIG. 1 is a view of the substrate processing apparatus viewed from above, FIG. 2 is a view of the apparatus of FIG. 1 viewed from the AA direction, FIG. 3 is a view of the apparatus of FIG. 1 viewed from the BB direction, In the CC direction.

1 to 4, the substrate processing apparatus 1 includes a load port 100, an index module 200, a first buffer module 300, a coating and developing module 400, a second buffer module 500 An exposure pre- and post-processing module 600, and an interface module 700. The load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, and the interface module 700, Are sequentially arranged in one direction in a single direction.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the coating and developing module 400, the second buffer module 500, the pre-exposure processing module 600, 700 are referred to as a first direction 12 and a direction perpendicular to the first direction 12 as viewed from above is referred to as a second direction 14 and a direction in which the first direction 12 and the second And a direction perpendicular to the direction 14 is referred to as a third direction 16.

The substrate W is moved in a state accommodated in the cassette 20. At this time, the cassette 20 has a structure that can be sealed from the outside. For example, as the cassette 20, a front open unified pod (FOUP) having a door at the front can be used.

Hereinafter, the load port 100, the index module 200, the first buffer module 300, the application and development module 400, the second buffer module 500, the pre-exposure processing module 600, 700 will be described in detail.

The load port 100 has a mounting table 120 on which the cassette 20 accommodating the substrates W is placed. A plurality of mounts 120 are provided, and the mounts 200 are arranged in a line along the second direction 14. [ In Fig. 2, four placement tables 120 are provided.

The index module 200 transfers the substrate W between the cassette 20 placed on the table 120 of the load port 100 and the first buffer module 300. The index module 200 has a frame 210, an index robot 220, and a guide rail 230. The frame 210 is provided generally in the shape of an inner rectangular parallelepiped and is disposed between the load port 100 and the first buffer module 300. The frame 210 of the index module 200 may be provided at a lower height than the frame 310 of the first buffer module 300 described later. The index robot 220 and the guide rail 230 are disposed within the frame 210. The index robot 220 is moved in the first direction 12, the second direction 14 and the third direction 16 so that the hand 221 that directly handles the substrate W can be moved and rotated in the first direction 12, the second direction 14, . The index robot 220 has a hand 221, an arm 222, a support 223, and a pedestal 224. The hand 221 is fixed to the arm 222. The arm 222 is provided with a stretchable structure and a rotatable structure. The support base 223 is disposed along the third direction 16 in the longitudinal direction. The arm 222 is coupled to the support 223 to be movable along the support 223. The support 223 is fixedly coupled to the pedestal 224. The guide rails 230 are provided so that their longitudinal direction is arranged along the second direction 14. The pedestal 224 is coupled to the guide rail 230 so as to be linearly movable along the guide rail 230. Further, although not shown, the frame 210 is further provided with a door opener for opening and closing the door of the cassette 20.

The first buffer module 300 has a frame 310, a first buffer 320, a second buffer 330, a cooling chamber 350, and a first buffer robot 360. The frame 310 is provided in the shape of an inner rectangular parallelepiped and is disposed between the index module 200 and the application and development module 400. The first buffer 320, the second buffer 330, the cooling chamber 350, and the first buffer robot 360 are located within the frame 310. The cooling chamber 350, the second buffer 330, and the first buffer 320 are sequentially disposed in the third direction 16 from below. The second buffer 330 and the cooling chamber 350 are located at a height corresponding to the coating module 401 of the coating and developing module 400 described later and the coating and developing module 400 at a height corresponding to the developing module 402. [ The first buffer robot 360 is spaced apart from the second buffer 330, the cooling chamber 350 and the first buffer 320 by a predetermined distance in the second direction 14.

The first buffer 320 and the second buffer 330 temporarily store a plurality of substrates W, respectively. The second buffer 330 has a housing 331 and a plurality of supports 332. The supports 332 are disposed within the housing 331 and are provided spaced apart from each other in the third direction 16. One substrate W is placed on each support 332. The housing 331 is constructed so that the index robot 220, the first buffer robot 360 and the developing robot 482 of the developing module 402 described later mount the substrate W on the support 332 in the housing 331 (Not shown) in the direction in which the index robot 220 is provided, in the direction in which the first buffer robot 360 is provided, and in the direction in which the developing robot 482 is provided, so that the developing robot 482 can carry it in or out. The first buffer 320 has a structure substantially similar to that of the second buffer 330. The housing 321 of the first buffer 320 has an opening in a direction in which the first buffer robot 360 is provided and in a direction in which the application unit robot 432 located in the application module 401 described later is provided. The number of supports 322 provided in the first buffer 320 and the number of supports 332 provided in the second buffer 330 may be the same or different. According to one example, the number of supports 332 provided in the second buffer 330 may be greater than the number of supports 322 provided in the first buffer 320.

The first buffer robot 360 transfers the substrate W between the first buffer 320 and the second buffer 330. The first buffer robot 360 has a hand 361, an arm 362, and a support base 363. The hand 361 is fixed to the arm 362. The arm 362 is provided in a stretchable configuration so that the hand 361 is movable along the second direction 14. The arm 362 is coupled to the support 363 so as to be linearly movable along the support 363 in the third direction 16. The support base 363 has a length extending from a position corresponding to the second buffer 330 to a position corresponding to the first buffer 320. The support member 363 may be provided longer in the upward or downward direction. The first buffer robot 360 may be provided so that the hand 361 is simply driven in two directions along the second direction 14 and the third direction 16.

The cooling chamber 350 cools the substrate W, respectively. The cooling chamber 350 has a housing 351 and a cooling plate 352. The cooling plate 352 has an upper surface on which the substrate W is placed and a cooling means 353 for cooling the substrate W. [ As the cooling means 353, various methods such as cooling with cooling water and cooling using a thermoelectric element can be used. In addition, the cooling chamber 350 may be provided with a lift pin assembly (not shown) for positioning the substrate W on the cooling plate 352. The housing 351 is provided with an index robot 220 so that the developing robot 482 provided in the index robot 220 and a developing module 402 to be described later can carry the substrate W into or out of the cooling plate 352 (Not shown) in the direction provided and the direction in which the developing robot 482 is provided. Further, the cooling chamber 350 may be provided with doors (not shown) for opening and closing the above-described opening.

The application and development module 400 performs a process of applying a photoresist on the substrate W before the exposure process and a process of developing the substrate W after the exposure process. The application and development module 400 has a generally rectangular parallelepiped shape. The coating and developing module 400 has a coating module 401 and a developing module 402. The application module 401 and the development module 402 are arranged so as to be partitioned into layers with respect to each other. According to one example, the application module 401 is located on top of the development module 402.

The application module 401 includes a process of applying a photosensitive liquid such as a photoresist to the substrate W and a heat treatment process such as heating and cooling for the substrate W before and after the resist application process. The application module 401 has a resist application chamber 410, a bake chamber 420, and a transfer chamber 430. The resist application chamber 410, the bake chamber 420, and the transfer chamber 430 are sequentially disposed along the second direction 14. [ The resist application chamber 410 and the bake chamber 420 are positioned apart from each other in the second direction 14 with the transfer chamber 430 interposed therebetween. A plurality of resist coating chambers 410 are provided, and a plurality of resist coating chambers 410 are provided in the first direction 12 and the third direction 16, respectively. In the figure, six resist coating chambers 410 are provided. A plurality of bake chambers 420 are provided in the first direction 12 and the third direction 16, respectively. In the drawing, six bake chambers 420 are provided. Alternatively, however, the bake chamber 420 may be provided in a greater number.

The transfer chamber 430 is positioned in parallel with the first buffer 320 of the first buffer module 300 in the first direction 12. In the transfer chamber 430, a dispenser robot 432 and a guide rail 433 are positioned. The transfer chamber 430 has a generally rectangular shape. The applicator robot 432 is connected to the bake chambers 420, the resist application chambers 400, the first buffer 320 of the first buffer module 300, and the first buffer module 500 of the second buffer module 500 And transfers the substrate W between the cooling chambers 520. The guide rails 433 are arranged so that their longitudinal directions are parallel to the first direction 12. The guide rails 433 guide the applying robot 432 to move linearly in the first direction 12.

Hereinafter, the application unit robot 432 will be described with reference to Figs. 1 to 5. Fig.

The application part robot 432 is transferred into the application chamber 410 through the opening 415. The applicator robot 432 has a hand 434, an arm 435, a support 436, and a pedestal 437. The hand 434 is fixed to the arm 435. The substrate is seated in the hand 434. The arm 435 is provided in a stretchable configuration so that the hand 434 is movable in the horizontal direction. The support 436 is provided so that its longitudinal direction is disposed along the third direction 16. The arm 435 is coupled to the support 436 so as to be linearly movable in the third direction 16 along the support 436. The support 436 is fixedly coupled to the pedestal 437 and the pedestal 437 is coupled to the guide rail 433 so as to be movable along the guide rail 433.

On the other hand, the application unit robot 432 may be provided as a robot 932 of the substrate processing apparatus 800 according to an example of the present invention, as described later.

The resist coating chamber 410 applies a photoresist on the substrate W. [ The resist coating chambers 410 all have the same structure. However, the types of the photoresist used in each of the resist coating chambers 410 may be different from each other. As an example, a chemical amplification resist may be used as the photoresist.

 The resist coating chamber 410 may be provided in the housing 810 of the substrate processing apparatus 800 according to an exemplary embodiment of the present invention.

Hereinafter, a substrate processing apparatus 800 according to the present invention will be described with reference to FIGS. 1 to 8. FIG.

In the substrate processing apparatus 800, a teaching process and a liquid coating process can be performed. The substrate processing apparatus 800 includes a housing 810, an airflow providing unit 820, a substrate supporting unit 830, a liquid supply unit 840, a processing vessel 850, a lift unit 890, a robot 932, A detector 938, and a controller 940.

Referring to Fig. 6, the housing 810 is provided in a rectangular tubular shape having a space 812 therein. An opening 815 is formed at one side of the housing 810. The opening 815 functions as an inlet through which the substrate W is carried in and out by the robot 932. A door 817 is provided in the opening 815, and the door 817 opens and closes the opening 815. The door 817 blocks the opening 815 and seals the inner space 812 of the housing 810 when the substrate processing process is performed. An inner exhaust port 814 and an outer exhaust port 816 are formed on the lower surface of the housing 810. The airflow formed in the housing 810 is exhausted to the outside through the inner exhaust port 814 and the outer exhaust port 816. According to one example, the airflow provided in the processing vessel 850 is exhausted through the inner exhaust port 814, and the airflow provided outside the processing vessel 850 can be exhausted through the outer exhaust port 816.

The airflow providing unit 820 forms a downward flow in the inner space of the housing 810. The airflow providing unit 820 includes an airflow supply line 822, a fan 824, and a filter 826. The airflow supply line 822 is connected to the housing 810. The air supply line 822 supplies external air to the housing 810. The filter 826 links the air provided from the airflow supply line 822 to the filter 826. The filter 826 removes impurities contained in the air. The fan 824 is mounted on the upper surface of the housing 810. The fan 824 is located in a central region in the upper surface of the housing 810. The fan 824 forms a downward flow in the inner space of the housing 810. When air is supplied to the fan 824 from the airflow supply line 822, the fan 824 supplies air in a downward direction.

The substrate support unit 830 supports the substrate W in the inner space of the housing 810. The substrate support unit 830 rotates the substrate W. The substrate support unit 830 includes a support plate 832, an alignment member 833, a rotation axis 834, and a driver 836. The support plate 832 is provided to have a circular plate shape. The substrate W is brought into contact with the upper surface of the support plate 832. According to one example, the support plate 832 may vacuum-suck the substrate W to chuck the substrate W. Alternatively, the support plate 832 may be provided with an electrostatic chuck for chucking the substrate W using static electricity. The support plate 832 can also chuck the substrate W with a physical force.

The alignment member 833 is provided on the support plate 832. The alignment member 833 aligns the substrate positioned on the support plate 832 with the center of the support plate 832. The substrate is correctly seated in the support plate 832 by the alignment member 833. For example, referring to FIG. 7, the alignment member 833 may have a downwardly sloping surface from the outside to the inside of the support plate 832. When the substrate is unloaded by the hand 934, the substrate slides along the downward inclined surface and contacts the center of the support plate 832 while the one side of the substrate and the alignment member 833 are in contact with each other. A plurality of alignment members 833 may be provided. For example, four alignment members 833 may be provided.

The rotating shaft 834 supports the supporting plate 832 below the supporting plate 832. The rotary shaft 834 is provided such that its longitudinal direction is directed up and down. The rotation shaft 834 is provided so as to be rotatable about its central axis. The driver 836 provides a driving force such that the rotation shaft 834 is rotated. For example, the driver 836 may be a motor.

The liquid supply unit 840 supplies the treatment liquid onto the substrate W. The treatment liquid may be a sensitizing solution. The liquid supply unit 840 includes a photosensitive liquid nozzle 842. The photosensitive liquid nozzle 842 supplies a photosensitive liquid onto the substrate W. The sensitizing solution may be a sensitizing solution such as a resist. The photosensitive liquid nozzle 842 supplies the photosensitive liquid at the central position. Here, the center position is a position at which the nozzle 844 is opposed to the central region of the substrate W.

The processing vessel 850 is located in the interior space 812 of the housing 810. The processing vessel 850 provides a processing space therein. The processing vessel is provided so that the upper portion thereof has an open cup shape. The processing vessel 850 includes an inner cup 852 and an outer cup 862.

The inner cup 852 is provided in the shape of a circular plate surrounding the rotation shaft 834. The inner cup 852 is positioned to overlap the inner vent 814 when viewed from above.

The outer cup 862 is provided to have a cup shape that encloses the substrate support unit 830 and the inner cup 852. The outer cup 862 has a bottom wall 864, a side wall 866, and a top wall 870. The bottom wall 864 is provided to have a circular plate shape having a hollow. A collection line 865 is formed in the bottom wall 864. The recovery line 865 recovers the treatment liquid supplied on the substrate W. [ The treatment liquid recovered by the recovery line 865 can be reused by an external liquid recovery system. The side wall 866 is provided to have a circular tubular shape surrounding the substrate supporting unit 830. The side wall 866 extends in a vertical direction from the side edge of the bottom wall 864. The side wall 866 extends upwardly from the bottom wall 864.

The top wall 870 extends from the top of the side wall 866 inward of the outer cup 862. [ The upper wall 870 is provided so as to be close to the substrate supporting unit 830. The upper wall 870 is provided to have a ring shape. The upper end of the upper wall 870 is positioned higher than the substrate W supported on the substrate supporting unit 830. [

The elevating unit 890 lifts the inner cup 852 and the outer cup 862, respectively. The elevating unit 890 includes an inside moving member 892 and an outside moving member 894. The inner moving member 892 lifts the inner cup 852 and the outer moving member 894 moves the outer cup 862 up and down.

The robot 932 carries the substrate to place the substrate on the support plate 832 through the opening 815. [ The robot 932 may be provided in the same or similar manner as the applicator robot 432 described above. Referring to FIG. 8, the robot 932 may include a first hand 935 and a second hand 936. For example, the first hand 935 and the second hand 936 may be provided in a vertical direction.

The detector 938 detects the center or center deflection value of the substrate from the substrate placed on the hand 934 of the robot 932. The detector 938 may be a sensor or a camera. For example, referring to FIG. 5, a detector 938 may be provided to the hand 934. However, the detector 938 is not necessarily provided to the hand 934. It may be installed anywhere as long as the center or center deflection value of the substrate placed on the hand 934 can be measured. The center deflection value is a difference value between the center of the hand 934 and the center of the actually located substrate on the hand 934. In the robot 932 before the accurate teaching value is set, the teaching value is set first, the corrected teaching value is corrected in consideration of the central deviation value of the substrate placed on the actual hand 934, do.

The controller 940 controls the robot 932 and the detector 938. The controller 940 controls the robot 932 and the detector 938 to detect the center or center deflection value of the substrate placed on the hand 934 in accordance with the driving of the robot 932 when setting the position of the robot.

9 to 22, a teaching process and a substrate processing process for setting the position of the robot 932 for transferring or conveying a substrate will be described below. After the teaching operation for setting the position of the robot 932 is performed, a subsequent substrate processing process such as applying a liquid to the substrate is performed.

The robot 932 moves the substrate into and out of the housing 810 through the opening 815 (see FIG. 6), and loads and places the substrate on the supporting plate 832. The substrate may be a teaching zig. The center or center deflection value of the substrate can be detected by a detector 938 such as a sensor or a camera.

9 to 14 are flowcharts and drawings showing the teaching process according to the first and second embodiments of the present invention. FIG. 9 is a flowchart showing the teaching process according to the first embodiment, and FIG. 10 is a flowchart showing a teaching process according to the second embodiment.

The first embodiment and the second embodiment will be described with reference to Figs. 11 to 14. Fig.

According to the first embodiment of the present invention, the center of the substrate placed on the hand 934 is firstly detected, and the substrate is loaded on the supporting plate 832. [ When the substrate is aligned by the alignment member 833, the aligned substrate is unloaded from the support plate 832 and placed on the hand 934. [ The center of the substrate placed on the hand 934 is secondarily detected. A difference value between the center of the first detected substrate and the center of the second detected substrate is calculated and the position of the robot is set based on the difference value.

According to the second embodiment of the present invention, the step of first detecting the center of the substrate in the hand 934 is omitted, unlike the first embodiment. When the substrate placed on the hand 934 is loaded on the support plate 832 and the substrate is aligned by the alignment member 833, the aligned substrate is again placed on the hand 934, As shown in FIG. The position of the robot 932 is set through the correction by applying the center misalignment value to the set teaching value as an offset.

FIGS. 15 to 20 are flowcharts and drawings showing the teaching process according to the third embodiment and the fourth embodiment of the present invention. FIG. 15 is a flowchart showing the teaching process according to the third embodiment, and FIG. 16 is a flowchart showing a teaching process according to the fourth embodiment.

Unlike the first and second embodiments, the robot includes a first hand 935 and a second hand 936 in the third and fourth embodiments. At this time, it is possible to control the position to be set for each hand. For example, the first hand 935 and the second hand 936 can be positioned in the same manner as in the first embodiment or the second embodiment described above. Alternatively, the positions of the first hand 935 and the second hand 936 can be set using the relationship between the first hand 935 and the second hand 936.

The third embodiment and the fourth embodiment will be described with reference to Figs. 17 to 20. Fig.

According to the third embodiment of the present invention, the center of the substrate placed on the first hand 935 is firstly detected and the substrate is placed on the support plate 832. When the substrate is aligned by the alignment member 833, the aligned substrate is unloaded from the support plate 832 and placed on the first hand 935. The center of the substrate located on the first hand 935 is secondarily detected. Thereafter, the substrate is loaded onto the support plate 832 from the first hand 935. At this time, the substrate is accurately seated in the center of the support plate 832. And the second hand 936 unloads the substrate. The center of the unloaded substrate is the teaching value to be set. Since the second hand 936 is before the correct teaching value is set, the center of the substrate located on the second hand 936 at this time is off center of the second hand 936. And detects the center deflection value of the substrate on the second hand 936.

The difference between the center of the first detected substrate and the center of the second detected substrate can be calculated and the position of the first hand 935 can be set based on the difference value. Since the second hand 936 has the set teaching value, the position of the second hand 936 is set by using the centering value for the set teaching value.

According to the fourth embodiment of the present invention, the process of first detecting the center of the substrate on the first hand 935 can be omitted. The position of each hand can be set using the teaching values set in the first hand 935 and the second hand 936, respectively. Place the substrate from the first hand 935 onto the support plate 832. When the substrate is aligned on the support plate 832 by the alignment member 833, the substrate is unloaded to the first hand 935 and the center deflection value of the substrate is detected. Thereafter, the substrate is placed on the support plate 832 from the first hand 935. The substrate is correctly seated in the center of the support plate 832. The substrate placed on the support plate 832 is unloaded to the second hand 936. [ And detects the center deflection value of the substrate on the second hand 936. The position of each of the first hand 935 and the second hand 936 can be set by correcting the set teaching value using the center deflection value detected by the first hand 935 and the second hand 936 have.

FIG. 21 shows a method of setting the position of the robot from the center of the first detected and second detected substrates according to the embodiment of the present invention. Fig. 21 can be applied to the teaching of the hand 934 of the first embodiment of the present invention and the teaching of the first hand 935 of the third embodiment. Referring to FIG. 21, the difference is corrected by applying a difference value as an offset in consideration of the difference between the center C1 of the first detected substrate and the center C2 of the second detected substrate. In this way, the position of the robot can be set.

FIG. 22 shows a method of setting the position of the robot based on the detected teaching value and the central deviation value of the detected substrate according to the embodiment of the present invention. FIG. 22 is applicable to the teaching of the hand 934 of the second embodiment of the present invention and the first hand 935 and the second hand 936 of the fourth embodiment. The difference is corrected by applying the difference as an offset in consideration of the difference between the set teaching value T and the center deviation P of the detected substrate. In this way, the position of the robot can be set.

The method of teaching the robot 932 is not limited to the application part robot 432 and can be applied to both the substrate transfer robot for transferring the substrate to the process chamber and the substrate processing equipment .

In the above description, the present invention is applied to a substrate processing apparatus having a structure in which a plurality of chambers are stacked. Alternatively, the present invention may be applied to a substrate processing apparatus composed of one chamber.

After the teaching of the robot is completed as described above, the substrate is transported onto the support plate 832 by using the robot 932. [ Although not shown, when the substrate is placed on the support plate 832, a process of processing the substrate is performed. The substrate treating step can be carried out by a liquid applying step. The liquid application step is a step of applying the sensitizing solution on the entire upper surface area of the substrate W. The photosensitive liquid is supplied to the central region of the substrate W by the photosensitive liquid nozzle 842 and is applied to the entire area of the upper surface of the substrate W. [

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and explain the preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The embodiments described herein are intended to illustrate the best mode for implementing the technical idea of the present invention and various modifications required for specific applications and uses of the present invention are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. It is also to be understood that the appended claims are intended to cover such other embodiments.

1: substrate processing equipment 100: load port
400: application and development module 432: application part robot
410: dispensing chamber 800: substrate processing apparatus
810: Housing 832:
833: alignment member 932: robot
934: Hand 935: First Hand
936: second hand 938: detector
940:

Claims (17)

A teaching method for setting a position of a robot for carrying a substrate on a supporting plate for supporting the substrate,
The hand of the robot includes a first hand and a second hand provided in a vertical direction
Wherein the positioning of the robot is performed for each of the first hand and the second hand,
First detecting a center of the substrate placed on the first hand, positioning the substrate on the support plate, aligning the position of the substrate on the support plate, unloading the substrate placed on the support plate with the first hand Secondly detecting the center of the substrate on the hand,
Thereafter, loading the substrate from the first hand onto the support plate, positioning the substrate again on the second hand to detect the center deflection value of the substrate on the second hand,
Calculating a difference value between the center of the first detected substrate and the center of the second detected substrate in the first hand, setting a position of the first hand based on the difference,
And setting the position of the second hand based on the center misalignment value detected on the second hand.
delete delete A teaching method for setting a position of a robot for carrying a substrate on a supporting plate for supporting the substrate,
The hand of the robot includes a first hand and a second hand provided in a vertical direction
Wherein the positioning of the robot is performed for each of the first hand and the second hand,
Positioning the substrate on the support plate from the first hand, aligning the position of the substrate on the support plate, unloading the substrate placed on the support plate with the hand to determine a center deflection value of the substrate on the first hand Respectively,
Thereafter, the substrate is placed on the support plate from the first hand, unloading the substrate placed on the support plate with the second hand, detecting the center deflection value of the substrate on the second hand,
And setting a position of each of the first hand and the second hand based on respective center misalignment values detected on the first hand and the second hand.
delete delete The method according to claim 1 or 4,
Wherein the detection is performed using a sensor provided to the robot.
The method according to claim 1 or 4,
Wherein said detection is performed using a camera.
A support plate for supporting the substrate;
An alignment member provided on the support plate to align the substrate;
A robot for carrying the substrate on the support plate with a hand on which the substrate is placed;
A detector for detecting the center of the substrate on the hand; And
A controller for controlling the robot and the detector;
Wherein the hand includes a first hand and a second hand provided in a vertical direction,
The controller comprising:
Wherein the first position detecting means detects the center of the substrate placed on the first hand when the position of the robot is set, positions the substrate on the support plate, aligns the position of the substrate on the support plate, Secondly detecting the center of the substrate on the hand by unloading the substrate with the first hand and then loading the substrate from the first hand onto the support plate and again positioning the substrate on the second hand, Controlling the robot and the detector to detect a center deflection value of the substrate on a two-hand,
Calculating a difference value between the center of the first detected substrate and the center of the second detected substrate in the first hand, setting a position of the first hand based on the difference,
And sets the position of the second hand based on a center deflection value of the second hand.
delete delete A support plate for supporting the substrate;
An alignment member provided on the support plate;
A robot for carrying the substrate on the support plate with a hand on which the substrate is placed;
A detector for detecting the center of the substrate; And
A controller for controlling the robot and the detector;
Wherein the hand includes a first hand and a second hand provided in a vertical direction,
The controller comprising:
Positioning the substrate from the first hand on the support plate, aligning the position of the substrate on the support plate, unloading the substrate placed on the support plate with the first hand, detecting a center deflection value of the substrate And then to position the substrate on the support plate from the first hand and to unload the substrate placed on the support plate with the second hand to detect a center deflection value of the substrate on the second hand, Controls the detector,
And sets the position of each of the first hand and the second hand based on respective center misalignment values detected on the first hand and the second hand. delete delete The method according to claim 9 or 12,
Wherein the alignment member has an inclined surface inclined downward from the outside of the support plate toward the inside.
The method according to claim 9 or 12,
Wherein the detector is a sensor provided in the robot.
The method according to claim 9 or 12,
Wherein the detector is a camera.
KR1020150083362A 2015-06-12 2015-06-12 Teaching method and substrate treating apparatus using the same KR101697500B1 (en)

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