JP5385010B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that performs mounting by checking a holding state of an electronic component sucked by a nozzle.

The electronic component mounting apparatus receives an electronic component from an electronic component feeder and mounts a mounting head having a suction nozzle that transports the electronic component to a mounting position on a board and a base frame, and holds the electronic component held by the suction nozzle from below. An image recognition device that captures the image, and a mounting head that holds the electronic component during each mounting is passed through the camera to perform imaging, thereby performing positional displacement of the electronic component with respect to the nozzle center by image processing of the captured image. And an angle (inclination) around the nozzle center line is obtained, and the position and inclination are corrected based on these angles, and then mounted.
However, such an electronic component mounting apparatus has a problem that the cycle time becomes long due to the detour of the head because the electronic component mounting apparatus always passes the head over the image recognition apparatus every time it is mounted.
Therefore, in another conventional electronic component mounting apparatus, as shown in FIG. 16, an image recognition apparatus 201 directed downward is mounted on a head 202, and a base frame (not shown) has a long V-shaped cross section. The mirror 203 is provided over the entire width of the movable area of the head 202, and the image recognition device 201 captures the state in which the nozzle 204 is viewed from directly below using the reflection of the V-shaped mirror 203 while moving from the feeder to the substrate. It is possible to do. In other words, since the V-shaped mirror 203 is formed over the entire width, even if the head 202 is moved straight from the feeder to the substrate, the V-shaped mirror 203 always passes above the V-shaped mirror 203 and sucks the electronic component T. It is possible to pick up an image of the nozzle 204 that has just been formed (for example, Patent Document 1).

JP-A-5-167295

However, the above-described conventional electronic component mounting apparatus can shorten the length of the V-shaped mirror by excluding some paths and feeders, but in principle, the entire width of the movable area of the mounting head Therefore, there is a problem that the recognition result of the position of the mounted component becomes incorrect if the V-shaped angle of the mirror fluctuates depending on each position in the full length direction due to bending or twisting. . In particular, since the V-shaped mirror is imaged by the image recognition means by two-time reflection, there is a problem that the influence on the recognition result of the position of the mounted component due to such an angle deviation becomes larger. In addition, when two flat mirrors are used in combination, the angles of the respective mirrors must be accurately adjusted and there is a problem that the manufacturing efficiency of the apparatus is lowered.
Further, in the case of the V-shaped mirror, the width W in the direction perpendicular to the longitudinal direction needs to be larger than the distance between the image recognition means and the nozzle, and the mirror width cannot be increased. was there. Such an increase in the width of the mirror makes it difficult to manufacture a mirror that requires a high degree of smoothness on each reflecting surface, and increases the distance between them by placing it between the feeder and the substrate. This hinders the reduction of cycle time.

  An object of the present invention is to make it possible to recognize a holding state of an electronic component more accurately and stably.

According to the first aspect of the present invention, there is provided a substrate holding unit that holds a substrate on which electronic components are mounted, a component supply unit that supplies electronic components to be mounted, and an elevating mechanism that can adsorb the electronic components mounted on the substrate. An electronic device comprising: a head provided with a nozzle; and a head moving mechanism for arbitrarily moving and positioning the head over a region along the X-axis direction and the Y-axis direction perpendicular to each other between the component supply unit and the substrate holding unit. In the component mounting apparatus, an image pickup unit that is mounted on the head in a state in which a line of sight is directed obliquely downward and capable of taking a planar image and picks up an electronic component adsorbed by the nozzle, and the electronic component mounting provided with the component supply unit in the base frame of the apparatus between the substrate holder, a direction causing movement when the from the component feeding unit to the substrate holder head moves Y An imaging mirror with only one reflective surface extending along the parallel direction of substrate conveyance in the X-axis direction orthogonal thereto in the case of the direction, the adsorbed from the electronic component of the captured image that is reflected on the imaging mirror An image processing device for determining a position and an angle of the electronic component with respect to the nozzle, and the reflecting surface of the imaging mirror is inclined with a bisector between the center line of the nozzle and the line of sight of the imaging means as a perpendicular line Mendea is, in order to determine the position of the head to determine the position and angle of the electronic component, be those which occur always at a fixed arrangement with respect to the imaging mirror or the imaging mirror around the image Indices that can be recognized in
The image processing apparatus passes each of a plurality of determination positions where the index is shifted by a predetermined amount in the Y-axis direction within an imaging range of the imaging means when the head moves from the component supply unit to the substrate holding unit. When the image is captured, the position of the electronic component is compared after correcting the positional deviation of the captured image at another determination position with reference to the determination position where the center line of the nozzle and the line of sight of the imaging unit match. The position and angle of the electronic component are determined .

The invention described in claim 2 has the same configuration as that of the invention described in claim 1 , and the imaging means is mounted on the head so that the nozzle tip portion directly enters the field of view. To do.

The invention described in claim 3 has the same configuration as that of the invention described in claim 2 ,
The imaging means is arranged such that the tip of the nozzle directly enters the field of view at the nozzle height at the time of component suction from the component supply unit or the nozzle height at the time of component mounting on the substrate of the substrate holding unit. It is mounted on the head.

The invention described in claim 4 has the same configuration as that of the invention described in claim 2 or 3 , and the image pickup means includes a focus adjustment mechanism that adjusts a focal length by an actuator, and the image processing apparatus adjusts timing. The actuator of the focus adjustment mechanism is controlled so that the focal length corresponding to the nozzle tip directly imaged and the focal length corresponding to the nozzle tip imaged via the imaging mirror are respectively different. It is characterized by doing.

The invention described in claim 5 has the same configuration as that of the invention described in claim 2 or 3 , and the imaging means includes a main optical system provided in the camera and a sub optical system for adjusting the focal length, and the main optical system. The system has a focal length corresponding to the tip of the nozzle that is directly imaged, and the sub optical system sets the focal length in cooperation with the main optical system in a region including the nozzle tip that is imaged through the imaging mirror. It is characterized by matching.

According to a sixth aspect of the present invention, the image processing apparatus includes the same configuration as that of the first aspect of the present invention, and the image processing device includes the imaging mirror at the nozzle of the head at a known position. The characteristic of the error in the longitudinal direction is acquired by imaging at a plurality of locations along the longitudinal direction of the imaging mirror, and correction is performed based on the characteristic when determining the position and angle of the electronic component It is characterized by that.

The invention described in claim 7 has the same configuration as that of the invention described in any one of claims 1 to 6 , and image storage means for storing still image or moving image data of the image captured by the imaging means. It is characterized by providing.

The invention described in claim 8 has the same configuration as that of the invention described in any one of claims 1 to 7 , and further includes a transparent protection means for protecting the reflecting surface of the imaging mirror. .

The invention described in claim 9 has the same configuration as that of the invention described in claim 8, and further includes a cleaning means for cleaning the surface of the protection means.

According to the first aspect of the present invention, it is possible to pick up an image of an electronic component that is sucked in a state in which the nozzle of the head is viewed from vertically below by the inclined arrangement of the imaging mirror.
Furthermore, unlike conventional V-shaped mirrors, the imaging mirror has a unique reflecting surface, so it can also be flat, easy to process, and extended along a predetermined longitudinal direction. However, it is possible to suppress the occurrence of bending and distortion. Furthermore, unlike conventional V-shaped mirrors, the imaging mirror has a single reflecting surface and enables imaging with a single reflection, so there is no angular error between the two reflecting surfaces. It is possible to suppress errors. Similarly, the mirror can be easily attached, and the manufacturing efficiency of the apparatus can be improved.
In addition, the width of the imaging mirror in the direction orthogonal to the longitudinal direction need not be greater than the distance between the nozzle and the imaging means, and the width should be reduced within a range in which the image of the electronic component imaged by reflection is not lost. Is possible. Therefore, even if the imaging mirror is arranged in a direction perpendicular to the Y-axis direction between the component supply unit and the substrate holding unit, the extension of the distance from the component supply unit to the substrate holding unit due to the presence of the mirror should be minimized. It is possible to shorten the mounting cycle time.

Further, according to the first aspect of the present invention, an index for determining the position and angle of the electronic component is provided around the imaging mirror itself or around the imaging mirror, and imaging when the index reaches a predetermined position within the imaging range. The position and angle of the electronic component are determined based on the image. The “predetermined position” indicates a predetermined position in the direction from the component supply unit to the substrate holding unit (or vice versa), and is any position in the orthogonal direction (longitudinal direction of the mirror). Also good.
When the head moves in the direction from the component supply unit to the substrate holding unit, the line of sight of the imaging means reflects to the imaging mirror and there is only one point that matches the center line of the nozzle in the movement direction, and the point is recognized. Since the index for doing so is provided, the position and angle of the electronic component can be obtained with high accuracy.
The index is not limited to a single point such as a mark but may be a linear one. In addition, the index is not limited to a dedicated mark for indicating a position, but is always present in a fixed arrangement with respect to the imaging mirror and can be recognized by an image (for example, an edge portion of the imaging mirror). If it is.

According to the second and third aspects of the present invention, since the imaging means is mounted so that the nozzle tip portion is directly placed in the field of view, not only an image from a vertically lower side of the nozzle but also an image from an oblique side is obtained. Can do. For example, by recording such an oblique image, for example, investigation of the cause of an electronic component suction error or mounting error, analysis of the behavior of the suction operation or mounting operation, etc. It can be used for various applications.

The invention according to claim 4 focuses on the focal length of the nozzle tip portion directly imaged at different timings and the focal length of the nozzle tip portion imaged through the imaging mirror. It is possible to acquire an image captured at an appropriate focal length for each of the image and the nozzle image that is reflected and captured, and it is possible to improve the accuracy for each application of the image.

The invention according to claim 5 can always acquire what was imaged at an appropriate focal length for each of the nozzle image captured directly and the nozzle image reflected and imaged by the main optical system and the sub optical system, Therefore, it is possible to improve the accuracy of the image application.

In the sixth aspect of the invention, the image processing apparatus acquires the characteristic of the error in the longitudinal direction of the imaging mirror, and corrects the position and angle of the electronic component based on the error characteristic. Even if an error has occurred in each position in the longitudinal direction due to distortion, it can be corrected appropriately, so that the position and angle of the electronic component can be detected with higher accuracy.

The invention according to claim 7 stores still image data or moving image data of an image captured by the imaging means, so that it is possible to appropriately detect the position and angle of the electronic component or perform other processing using these data. It becomes.

Since the invention according to claim 8 is provided with a transparent protective means for protecting the reflecting surface of the imaging mirror, the protection can be achieved even if high-quality optical glass is used for the reflecting surface of the imaging mirror. In addition, the position and angle of the electronic component can be detected. Even if scratches or cloudiness occur, it is only necessary to replace the protection means, and the maintenance cost can be reduced.

According to the ninth aspect of the present invention, since the cleaning means for cleaning the surface of the protection means is provided, it is possible to prevent deterioration of the picked-up image due to adhesion of dirt, etc., and to detect the position and angle of the electronic component with higher accuracy. It becomes possible .

It is a perspective view which shows the whole electronic component mounting apparatus which concerns on this Embodiment. It is a side view of a head periphery. It is explanatory drawing which shows the captured image of a CCD camera. 4A is a cross-sectional view of protection means for protecting the imaging mirror with a protective layer, and FIG. 4B is a cross-sectional view of protection means for protecting with the top plate. FIG. 5A is a perspective view of the cleaning means by the air blow mechanism, and FIG. 5B is a perspective view of the cleaning means by the wiper mechanism. It is a block diagram which shows the control system of an electronic component mounting apparatus. It is explanatory drawing for demonstrating the concept of the error table which shows an error characteristic. FIG. 8A is an example of a reflected image using each position in the longitudinal direction of the imaging mirror, FIG. 8A is an example of an ideal image where there is no deflection, and FIG. 8B is due to deflection. It is an example which has produced the position error and the angle fluctuation. It is a flowchart which shows the mounting control of an electronic component. It is explanatory drawing which shows two types of focal distances from a CCD camera to an electronic component. It is an example of an imaging of the edge part of an imaging mirror as a parameter | index which shows the acquisition position arrival of a reflected image. It is explanatory drawing which showed the sub-optical system. It is explanatory drawing which showed the case where a recognition mirror has components fallen and dirt when there are multiple recognition positions. It is explanatory drawing for calculating the quantity which a nozzle center and a camera visual field center shift | offset when there exists a shift | offset | difference of a Y direction in the vicinity of the state where the nozzle center and the camera visual field center corresponded. FIG. 15A shows a captured image at the head position based on each index of FIG. 13, FIG. 15A shows a captured image at P1, FIG. 15B shows a captured image at P1, and FIG. 15C shows an image taken at P1. It is an image. It is a side view which shows the example of the conventional electronic component mounting apparatus.

(Overall configuration of the embodiment)
An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of an electronic component mounting apparatus 100 according to the present embodiment. Hereinafter, as shown in the drawing, two directions orthogonal to each other in the horizontal plane are respectively referred to as an X-axis direction (substrate transport direction) and a Y-axis direction (a direction orthogonal to the substrate transport direction), and a vertical direction orthogonal to these is referred to as a Z-axis direction. Shall.
The electronic component mounting apparatus 100 mounts various electronic components on a board. As shown in FIG. 1, the electronic component mounting apparatus 100 includes a plurality of electronic component feeders 101 and a plurality of electronic component feeders 101 that supply electronic components to be mounted. Electronic component mounting on a substrate provided in the middle of a substrate transfer path by the substrate transfer means 103, and a substrate transfer means 103 for transferring a substrate in the X-axis direction, and a pair of component supply sections composed of feeder banks 102 held side by side A substrate holding unit 104 for performing work, a head 106 that holds a plurality (three in this example) of suction nozzles 105 so as to be movable up and down, and two sets of component supply units for the head 106 And an XY gantry 107 as a head moving mechanism for driving and transporting to an arbitrary position in a work area including the substrate holding unit 104 and the head 106. A plurality of (three in this example) CCD camera 108 that captures an image of the electronic component sucked by the suction nozzle 105 and an image from the vertically lower side of the electronic component T held by the suction nozzle 105 are displayed. An imaging mirror 20 that can be imaged by the CCD camera 108, a base frame 114 that mounts and supports each of the above components, and an operation control means 10 that controls the operation of each of the above components are provided.

  The operation control means 10 of the electronic component mounting apparatus 100 performs image processing from captured image data obtained by imaging the electronic components sucked by the suction nozzles 105 by the respective CCD cameras 108 and performs electronic processing on the nozzle tip. The component position and the angle (orientation) about the center line of the nozzle are obtained, the positioning of the suction nozzle 105 relative to the substrate is corrected, and the angle of the electronic component is corrected by rotating the suction nozzle 105 to control the mounting of the electronic component. I do.

The substrate transport unit 103 includes a transport belt (not shown), and transports the substrate along the X-axis direction by the transport belt.
As described above, the substrate holding unit 104 for fixing and holding the substrate at the work position when the electronic component is mounted on the substrate is provided in the middle of the substrate transfer path by the substrate transfer means 103. The substrate transport unit 103 transports the substrate to the substrate holding unit 104 and stops and holds the substrate by a holding mechanism (not shown). That is, a stable electronic component mounting operation is performed while the substrate is held by the holding mechanism.

Each feeder bank 102 is provided in a state along the X-axis direction at each of both ends of the base frame 114 in the Y-axis direction. Each feeder bank 102 includes a flat portion along the XY plane, and a plurality of electronic component feeders 101 are arranged and mounted on the upper surface of the flat portion along the X-axis direction.
Each feeder bank 102 is provided with a latch mechanism (not shown) for holding each electronic component feeder 101, and each electronic component feeder 101 can be mounted or separated as necessary.

The electronic component feeder 101 described above holds a tape reel wound with a tape in which an infinite number of electronic components are encapsulated at uniform intervals on the rear end side, and in the vicinity of the front end portion, as described above, to the head 106. The electronic component delivery unit 101a is provided. And in the state attached to the feeder bank 102, the delivery part 101a of an electronic component becomes a fixed position about a Y-axis direction and a Z-axis direction. In addition, in the X-axis direction, the position of the electronic component delivery unit 101a is determined depending on which position in the X-axis direction on the feeder bank 102 is attached.
When the mounting operation is performed, the tape is transported to the electronic component delivery unit 101a, and the electronic component is supplied to the head 106 positioned in the delivery unit 101a.

The XY gantry 107 includes an X-axis guide rail 107a that guides the movement of the head 106 in the X-axis direction, and two Y-axis guide rails 107b that guide the head 106 in the Y-axis direction together with the X-axis guide rail 107a. , An X-axis motor 109 that is a drive source that moves the head 106 along the X-axis direction, and a Y-axis motor 110 that is a drive source that moves the head 106 in the Y-axis direction via the X-axis guide rail 107a. ing. By driving the motors 109 and 110, the head 106 can be transported to almost the entire region between the two Y-axis guide rails 107b.
The motors 109 and 110 have their rotation amounts recognized by the operation control means 10 and are controlled so as to have a desired rotation amount, whereby the suction nozzle 105 and the CCD camera are connected via the head 106. 108 is positioned.
In addition, the two feeder banks 102 and the board holding unit 104 are both disposed within the transportable area of the head 106 by the XY gantry 107 in view of the necessity of mounting electronic components.

FIG. 2 is a side view around the head 106. As shown in the figure, the head 106 has three suction nozzles 105 that hold the electronic component T by air suction at the tip, and a Z-axis motor 111 (a drive source that drives the suction nozzle 105 in the Z-axis direction). 6) and a rotation motor 112 (see FIG. 6), which is a rotational drive source for rotating the electronic component held via the suction nozzle 105 around the Z-axis direction. The Z-axis motor 111 and the rotary motor 112 are individually provided for each suction nozzle 105, but only one is shown in FIG.
Each suction nozzle 105 is supported by the head 106 in a state along the Z-axis direction, the inside of the nozzle is connected to a negative pressure generation source, and suction suction is performed at the tip (lower end) of the suction nozzle 105. Thus, the electronic component T is sucked and held.
That is, due to these structures, during the mounting operation, the head 106 is moved to the electronic component delivery portion 101a of the electronic component feeder 101 to be mounted, the suction nozzle 105 is lowered by driving the Z-axis motor 111, and the electronic portion is moved at the tip portion. The electronic component is sucked from the component feeder 101, the head 106 is moved to the mounting position of the substrate, and the suction nozzle 105 is lowered to execute the mounting operation.
Also, the position of the electronic component held at the tip of the suction nozzle 105 (position displacement from the center of the nozzle) until the head 106 moves from the electronic component delivery portion 101a of the electronic component feeder 101 to the mounting position of the substrate. ) And angle (angle deviation around the center of the nozzle) and angle correction by the rotary motor 112 and head 106 positioning correction are performed.

Each CCD camera 108 is arranged adjacent to the corresponding suction nozzle 105 in the Y-axis direction, and the line of sight 108a (the optical axis of the imaging optical system of the camera) moves toward the suction nozzle 105 as it goes downward. It is inclined in the direction close to. The line of sight 108a of each CCD camera 108 is not inclined in the X-axis direction and is parallel to the YZ plane.
When the center line 105a intersects the intermediate point 20a in the Y-axis direction of the image pickup mirror 20 vertically below each suction nozzle 105 due to the movement of the head 106 in the Y-axis direction (state of FIG. 2), the CCD camera 108. The CCD camera 108 is fixedly supported so that the line of sight 108a also intersects the center line 105a of the suction nozzle 105 at the position of the intermediate point 20a.

On the other hand, each of the two imaging mirrors 20 has an elongated flat plate shape, and each is between the substrate holding unit 104 and one feeder bank 102 and between the substrate holding unit 104 and the other feeder bank 102. Are arranged along a direction perpendicular to the Y-axis direction in which the head moves. That is, one imaging mirror 20 is provided for imaging with the CCD camera 108 while the electronic component T is received from one feeder bank 102 and conveyed to the substrate, and the other imaging mirror 20 is provided with the other feeder. It is provided for taking an image with the CCD camera 108 while receiving the electronic component T from the bank 102 and transporting it to the substrate.
Each imaging mirror 20 is set to have substantially the same length as the X-axis direction width of the feeder bank 102 or the movable range of the head 106 in the X-axis direction, and the electronic component feeder 101 set in any of the feeder banks 102 supplies the electronic Even when the component T is received and conveyed, imaging is possible.

Further, the reflecting surfaces (upper surfaces) of the imaging mirrors 20 are all parallel to the X-axis direction, but are inclined with respect to the Y-axis direction. That is, the reflecting surfaces of the imaging mirrors 20 are all bisectors D (the suction nozzle 105 and the CCD camera 108) between the center line 105a of the suction nozzle 105 mounted on the head 106 and the line of sight 108a of the CCD camera 108. It is inclined so as to be perpendicular to the bisector that passes between the two.
By setting the inclination angle of each imaging mirror 20 as described above, when the imaging mirror 20 is positioned directly below the suction nozzle 105 (the state of FIG. 2), the line of sight 108a of the CCD camera 108 is The reflection just overlaps the center line 105a of the suction nozzle 105, and it is possible to capture an image of the electronic component T sucked by the suction nozzle 105 as viewed from vertically below.

FIG. 3 shows a captured image of the CCD camera 108. The imaging range 108 s of the CCD camera 108 is adjusted so that the tip part of the suction nozzle 105 or the electronic component T sucked to the tip part can be directly picked up without using the imaging mirror 20. That is, an image is taken so that the imaging mirror 20 lies at the center of the imaging range 108 s, and a reflection image of the lower surface of the electronic component T attracted by the suction nozzle 105 is taken at the center. Further, a direct image of the tip of the suction nozzle 105 that has been directly imaged and the electronic component T that has been picked up is captured in the vicinity of the side edge of the imaging range 108s.
The suction nozzle 105 is disposed at the suction height when the electronic component is sucked from the electronic component feeder 101, the transport height when the head 105 is transported and lowered from the suction height, and is lowered from the transport height to the substrate. On the other hand, a mounting height for mounting and a target height of approximately three levels are set, but the CCD is arranged so that the electronic component sucked by the suction nozzle 105 is within the imaging range at any height. The imaging range of the camera 108 is set. In addition, when the direct imaging of the electronic component T by the CCD camera 108 is for the purpose of recording the state or the state observation at the time of suction and mounting, the case where the suction nozzle 105 is at the suction height and the case of the mounting height. Is within the imaging range 108s, it is not necessary to be within the imaging range when it is at the conveyance height.

  Each CCD camera 108 includes a focus adjustment mechanism (not shown) that adjusts the focal length of the imaging optical system by a focus adjustment motor 115 (see FIG. 6) that is an actuator. Such a focus adjustment mechanism is for adjusting the focal length by moving the photographing lens back and forth along the optical axis, and the focus adjustment motor 115 is controlled by the operation control means 10. Details of the control will be described later.

  Each CCD camera 108 is provided with an illumination lamp 113 made up of light emitting elements such as a plurality of LEDs that illuminate the front in the imaging direction. The illumination lamp 113 is not essential when the periphery of the suction nozzle 105 is bright enough to cause no problem with imaging. The illumination lamp 113 may be controlled to be turned on only when necessary (for example, when the electronic component T is picked up, mounted, or passed through the imaging mirror 20). A brightness sensor may be provided, and control may be performed so that irradiation is performed only when the brightness around the suction nozzle 105 is less than a certain value. Further, the illumination lamp 113 may be provided not on the head 106 side but on the base frame 114 side so as to perform irradiation at a place where the above-described photographing is performed when necessary.

The imaging mirror 20 described above has a protection means for the reflection surface. FIG. 4 shows an example of the protection means.
As a protection means, as shown in the sectional view of FIG. 4A, a protective layer 23 made of a transparent protective material is used on the upper surface of the imaging mirror 20 in which the optical glass 22 is attached to the upper surface of the reflective material 21. Also good.
As another example of the protection means, a transparent top plate 24 supported above the imaging mirror 20 may be used as shown in the cross-sectional view of FIG.

Furthermore, the imaging mirror 20 is provided with a cleaning means. FIG. 5 shows an example of the cleaning means.
As a cleaning means, as shown in the perspective view of FIG. 5A, an air nozzle 25 that blows air onto the upper surface side of the imaging mirror 20, an intake / exhaust mechanism (not shown) that supplies air to the nozzle 25, and air supply An air blow mechanism including a cleaning electromagnetic valve 26 (see FIG. 6) that can be switched on and off may be used.
As another example of the cleaning means, as shown in the perspective view of FIG. 5B, the wiper 27 made of an elastic material that slides on the plane to be cleaned, and the wiper 27 in the longitudinal direction of the imaging mirror 20 A wiper mechanism that includes a support shaft 28 that is guided along and a cleaning motor that is a drive source that imparts a moving operation to the wiper 27 may be used.
Note that the air blow mechanism is not limited to the example of FIG. 4A, but may be applied to the example of FIG. 4B. In that case, air blow is performed on the upper surface of the top plate 24.
Similarly, the wiper mechanism may be applied not only to the example of FIG. 4B but also to the example of FIG. In that case, the wiper 27 slides on the upper surface of the protective layer 23.

  The cleaning means is controlled by the operation control means 10. Then, the cleaning operation is executed when the electronic component mounting operation is not executed, or at the timing during which the reflection image acquisition timing by the imaging mirror 20 is removed during mounting.

(Operation control means)
FIG. 6 is a block diagram showing a control system of the electronic component mounting apparatus 100. As shown in this figure, the operation control means 10 mainly includes an X-axis motor 109, a Y-axis motor 110 of the XY gantry 107, a Z-axis motor 111 that raises and lowers the suction nozzle 105 in the head 106, and a suction nozzle 105. A CPU 30 that controls the operation of the rotary motor 112, the CCD camera 108, the illumination lamp 113, the focus adjustment motor 115, and the cleaning electromagnetic valve 26, and executes various processes and controls according to a predetermined control program. A system ROM 12 storing programs for executing processing and control, a RAM 13 serving as a work area for various processes by storing various data, and an I / F (connection to connect the CPU 30 and various devices) Interface) 14, a list of electronic components to be mounted on the board, mounting positions of each electronic component, and receiving of the electronic components Non-volatile storage device 17 for storing mounting data required for mounting operation control such as mounting position, operation panel 15 for inputting data required for various settings and operations, and details and necessity of various settings And a display monitor 18 for displaying information, displaying captured images, and the like. Each of the motors 109 to 112 and 115 described above is a servo motor including an encoder, and is connected to the I / F 14 via a servo driver (not shown).
Here, a case where an air blow mechanism is used as the cleaning means is illustrated.
Hereinafter, characteristic processing or control performed by the CPU 30 of the operation control unit 10 will be described.

(Imaging mirror characteristic detection processing)
Since the imaging mirror 20 described above is long along the X-axis direction, it may bend. For this reason, the imaging mirror 20 may cause a position error of the captured image of the electronic component T reflected at each position in the X-axis direction.
Therefore, the operation control unit 10 creates an error table indicating error characteristics in the longitudinal direction of the imaging mirror 20 during the mounting work.
That is, assuming that the installation position of the imaging mirror 20 is known, as shown in the perspective view of FIG. 7, the CPU 30 determines the center line 105a of any of the suction nozzles 105 and the Y-axis direction of the imaging mirror 20. After the head 106 is positioned by the Y-axis motor 110 so as to coincide with the intermediate position, the X-axis motor 109 is driven to sequentially move and position the head 106 at uniform intervals in the X-axis direction. The image is taken by.
FIG. 8A shows an example of a captured image in an ideal case where there is no occurrence of bending, and FIG. 8B shows an example in which position error and angle fluctuation are caused by bending. In addition, illustration of a direct captured image is abbreviate | omitted.
Then, image processing is performed on the captured image data at each position in the X-axis direction, and the electronic component center position and angle within the imaging range are detected by a known method such as pattern matching. Further, the CPU 30 calculates a positional deviation between the center position of the electronic component and the center of the imaging range at each detected position as a position error, and calculates an angle change at each position as an angle error. Further, the longitudinal direction of the imaging mirror 20 is divided into a plurality of sections X1, X2, X3,... Centering on each imaging position in the X-axis direction, and the position error and angle error obtained for each section are registered. Then, this is stored in the storage device 17 as an error table indicating error characteristics in the longitudinal direction of the imaging mirror 20.
When the electronic component is mounted, the electronic component is picked up by the component supply unit, and is picked up when the position and angle of the electronic component T are detected by the reflected image of the imaging mirror 20 while being transported to the mounting position of the substrate. From the X coordinate when the nozzle 105 passes over the imaging mirror 20, it is determined which of the error table belongs to the sections X1, X2, X3,..., The error data of the corresponding section is read, and the electronic component T The error is corrected for the position and angle.

(Electronic component mounting control)
The electronic component mounting control by the operation control means 10 will be described with reference to the flowchart of FIG. Here, the mounting operation of one electronic component is illustrated.
First, the CPU 30 reads out the receiving position of the electronic component T (position coordinates of the delivery unit 101a of the target electronic component feeder 101) and the position coordinates of the mounting position of the board from the mounting data in the storage device 17 (step S1). .
Next, the X and Y axis motors 109 and 110 are driven to move the head 106 to the receiving position of the electronic component T (step S2).

Then, the focus adjustment motor 115 described above is driven to perform focus adjustment so as to directly reach the image focal length (step S3).
That is, as shown in FIG. 10, the focus adjustment motor 115 is set so that the focal length of the CCD camera 108 becomes a direct image focal length F2 that is a linear distance from the CCD camera 108 to the tip of the suction nozzle 105 at the suction height. Control. Thereby, the picked-up image of the suction state of the electronic component T viewed from obliquely above is clearly picked up. When the mounting operation of the electronic component T is executed, the CCD camera 108 continuously captures images until the end of the mounting operation, and the moving image data is recorded in the recording device 17.

Next, the CPU 30 drives the Z-axis motor 111 to lower the suction nozzle 105 to the suction height, and sucks the electronic component T (step S4).
Then, the suction nozzle 105 is raised to the conveyance height, and the focus adjustment motor 115 is driven to adjust the focus so that the reflected image focal length is obtained (step S5). That is, as shown in FIG. 10, the focal length of the CCD camera 108 is the indirect image focal length which is the distance of the path length from the CCD camera 108 to the tip of the suction nozzle 105 at the suction height through the imaging mirror 20. The focus adjustment motor 115 is controlled so as to be F1. Thereby, when the suction nozzle 105 passes above the imaging mirror 20, a captured image of the suction state of the electronic component T viewed from the vertically lower side is clearly captured.

Next, driving of the X and Y axis motors 109 and 110 is started to start transporting the head 106 to the mounting position of the electronic component T (step S6).
Then, during conveyance, the arrival of the reflection image acquisition position of the electronic component T is monitored (step S7).
Here, the monitoring process for reaching the acquisition position of the reflection image of the electronic component T will be described. As described above, when the intermediate position of the imaging mirror 20 in the Y-axis direction and the center line of the suction nozzle 105 match in the Y-axis direction, the image from the vertically lower side of the electronic component T is reflected on the imaging mirror 20. The image is captured. The operation control means 10 monitors whether or not the head 105 reaches this position. When the movement is detected, the still image data of the captured image at that time is recorded in the RAM 13, and the position and angle of the electronic component T are recorded from the image. Perform detection.
Then, as shown in FIG. 11, detection of the arrival position of the reflected image is detected based on whether or not the edge 20T along the X-axis direction of the imaging mirror 20 has reached the determination position M within the imaging range. That is, in the captured image of the CCD camera 108, when the head 106 approaches the imaging mirror 20, the edge 20T of the imaging mirror 20 moves in a certain direction within the imaging range. Then, when the edge portion of the imaging mirror 20 is positioned at the determination position M, the determination position is set in advance so that the intermediate position of the imaging mirror 20 in the Y-axis direction and the center line of the suction nozzle 105 coincide in the Y-axis direction. By setting M, it is possible to detect the arrival of the reflected image of the electronic component T by monitoring the captured image of the CCD camera 108.
Note that the edge 20T of the imaging mirror 20 is provided with a color on the background side of the imaging mirror 20 such that the contrast difference is larger than that of the imaging mirror 20, so that in the captured image of the CCD camera 20, Since there is a difference in the detection intensity of each pixel before and after the edge of the imaging mirror 20, it is possible to recognize the edge 20T of the imaging mirror 20 by detecting this difference in detection intensity.
When the CPU 30 detects the arrival of the reflection image acquisition position of the electronic component T by performing such processing, the image captured by the CCD camera 108 is stored in the RAM 13 as still image data as described above (step S8). .

Then, based on the still image data, the CPU 30 specifies the angle over which the electronic component T is positioned within the imaging range using a known image processing method (for example, pattern matching) (step S9).
At this time, referring to the error table of the storage device 17, the sections X1, X2, X3,... Are specified based on the position of the suction nozzle 105 in the X-axis direction when the reflected image of the electronic component T is reached. Correct the position and angle.
Thereby, the rotation motor 112 is driven, and the electronic component T is rotated and adjusted to an appropriate angle (step S10).
Then, the focus adjustment motor 115 described above is driven again, and the focus adjustment is performed so that the direct image focal length is obtained (step S11).

Then, the head 106 is positioned at the mounting position using the position of the electronic component T relative to the suction nozzle 105 obtained in step S9 as a correction value (step S12), and the CPU 30 drives the Z-axis motor 111 to mount the suction nozzle 105. The electronic component T is lowered to the height, and the electronic component T is mounted (step S13), and the control is finished.
The above mounting control is repeated for all the electronic components T set in the mounting data.

(Effect of embodiment)
As described above, the electronic component mounting apparatus 100 can capture an image of the electronic component T that is sucked by the inclined arrangement of the imaging mirror 20 with the suction nozzle 105 of the head 106 viewed from vertically below. Since the imaging mirror 20 has a flat plate shape, there is only one reflection surface, and it is possible to acquire an image from below the electronic component T by reflection once during imaging.
Such a flat imaging mirror 20 is easy to process unlike a conventional V-shaped mirror, and therefore, it is possible to suppress the occurrence of bending and distortion in the longitudinal direction. In addition, since the imaging mirror 20 has a flat plate shape, unlike the V-shaped mirror that performs twice reflection, the influence of the deflection error due to twice reflection does not occur. It is possible to improve the accuracy of detection.
Further, since the imaging mirror 20 has one reflecting surface, the angle adjustment is only required once when the mirror is mounted, and the mirror can be easily mounted, and the manufacturing efficiency of the apparatus can be improved.
Further, unlike the case of the V-shaped mirror, the width in the Y-axis direction of the imaging mirror 20 does not need to match the distance between the suction nozzle 105 and the CCD camera 108 and can be reduced. Even if the imaging mirror 20 is arranged between the substrate holding unit 104 and the substrate holding unit 104, the distance from the component supply unit to the substrate holding unit 104 due to the presence of the mirror does not occur, so that the mounting cycle time can be shortened. Become.

Further, the operation control means 10 uses the edge 20T of the imaging mirror 20 as an index for determining the position of the head 106 for determining the position and angle of the electronic component, and when the index reaches the determination position M within the imaging range. The position and angle of the electronic component are determined based on the captured image.
Thereby, when the head 106 moves in the direction from the component supply unit to the substrate holding unit 104, a point where the line of sight of the CCD camera 108 is reflected by the imaging mirror 20 and coincides with the center line 105a of the suction nozzle 105 is easily detected. Thus, the position and angle of the electronic component can be obtained with high accuracy.

Further, since the CCD camera 108 is mounted so that the tip of the suction nozzle 105 is directly placed in the field of view, the lower surface image (bottom surface) of the electronic component sucked by the suction nozzle 105 reflected by the imaging mirror 20 from below. As shown in FIG. 4, not only horizontal displacement of the electronic component can be detected by well-known image processing, but also an image from an oblique side can be acquired. By recording such an image on the oblique side, for example, an actual image obtained by photographing the electronic component sucked by the suction nozzle from the oblique side and a three-dimensional (vertical and horizontal height direction) direction stored in advance in the storage means. The suction nozzle is arranged by comparing the reference image obtained by photographing the part arranged at three-dimensional inclination zero (that is, zero rotation, zero inclination) from the oblique side by arranging the vertical and horizontal height directions of the parts along The three-dimensional inclination data can be obtained by detecting the three-dimensional (vertical and horizontal height direction) inclination of the electronic component adsorbed on the surface. Furthermore, by reading out the component data such as the shape of the electronic component and the size data of the vertical and horizontal height stored in the storage means in advance, the electronic component tilted by the suction is based on the component data and the three-dimensional tilt data. Images developed in a front view, a side view, and a plan view can be created. In addition to the front view and the side view, well-known image processing by a computer based on the image data of at least one of the plan view and the bottom view, and the horizontal displacement data based on the bottom image of the component By performing the above, it is possible to synthesize the electronic component in the state of being sucked by the tip of the suction nozzle 105 into a three-dimensional three-dimensional still image, and record and display it in the storage means.
Further, a plurality of three-dimensional still images are generated and stored indicating the suction state from when the electronic component is started to be sucked by the suction nozzle 105 to when the electronic component is lifted and the electronic component is lifted to cause positional deviation or inclination. By doing so, a three-dimensional still image at an arbitrary timing can be selected and displayed.
Furthermore, by displaying the plurality of three-dimensional still images sequentially and sequentially over time, the process in which the electronic component is displaced or tilted with respect to the suction nozzle can be continuously and arbitrarily selected as a three-dimensional moving image. Can be displayed at an angle, magnification, and display speed.
As described above, the image from the vertically lower side, the image from the oblique side, the horizontal position shift data, the three-dimensional tilt data, and the three-dimensional still image or the three-dimensional moving image can be obtained from before the electronic parts are sucked. By displaying on the display screen until after the suction rises, it can be used for various purposes other than the detection of the position and angle of electronic parts, such as investigation of the cause when suction error or mounting error occurs, analysis of behavior of suction operation or mounting operation, etc. It becomes possible. Furthermore, since a three-dimensional still image and a three-dimensional moving image of an electronic component can be created with one camera, the component mounting head and the component mounting head are compared with the case where a three-dimensional image is recorded using two cameras. The XY moving mechanism that moves the vehicle can be reduced in size, reduced in power consumption, reduced in cost, and shortened tact time and increased in speed.

  Further, the operation control means 10 uses the electronic component T sucked to the tip of the suction nozzle 105 that is directly imaged at different timings as the focal length, and the nozzle tip that is imaged through the imaging mirror 20. Since the focus is adjusted to the focal length of the electronic component T, the nozzle image captured directly and the nozzle image reflected by the imaging mirror 20 can be acquired with appropriate focal lengths. It is possible to improve the accuracy for the purpose of the image.

  Further, the operation control unit 10 acquires an error table indicating the characteristics of errors in the longitudinal direction of the imaging mirror 20, and corrects the position and angle of the electronic component based on the error characteristics. Even if an error occurs at each position in the longitudinal direction due to or distortion, this can be corrected appropriately, so that the position and angle of the electronic component can be detected with higher accuracy.

  In addition, since the operation control means 10 stores still image data or moving image data of an image captured by the CCD camera 108, it is possible to appropriately detect the position and angle of the electronic component or perform other processing using these data. It becomes possible.

Since the protective means such as the transparent protective layer 23 and the top plate 24 for protecting the reflective surface of the imaging mirror 20 is provided, protection can be achieved even if high-quality optical glass is used for the reflective surface of the imaging mirror 20, It becomes possible to detect the position and angle of the electronic component with higher accuracy. Even if scratches or cloudiness occur, it is only necessary to replace the protection means, and the maintenance cost can be reduced.
Furthermore, since the imaging mirror 20 is provided with cleaning means such as an air blow mechanism or a wiper mechanism for cleaning the surface of the protection means, it is possible to prevent deterioration of the captured image due to adhesion of dirt, etc. Position and angle detection can be performed.
In addition, since the cleaning means performs the cleaning operation while avoiding the non-mounting operation or when the head 106 is in the position for determining the position and angle of the electronic component, the influence of the captured image by the cleaning means can be eliminated, and the accuracy can be increased. It is possible to detect the position and angle of the electronic component.

(Other)
Although the focus adjustment mechanism for changing the focal length of the CCD camera 108 is provided, the present invention is not limited to this, and as shown in FIG. 12, a main optical system having a focal length suitable for direct imaging of electronic components, and imaging You may comprise from the sub optical system 116 for focal distance adjustment suitable for the imaging of the indirect image of an electronic component via the mirror 20. FIG.
The main optical system is inside the CCD camera 108, and the entire visual field is set to a uniform focal length (a linear distance from the CCD camera 108 to the tip of the suction nozzle 105).
The sub optical system 116 is disposed between the CCD camera 108 and the imaging mirror 20, and is disposed so as not to interfere with a straight line from the CCD camera 108 to the tip of the suction nozzle 105. The sub optical system 116, in cooperation with the main optical system, sets the focal length to the distance from the CCD camera 108 to the tip of the suction nozzle 105 via the imaging mirror 20.
It is possible to perform imaging at two focal lengths with such a static configuration.

  Further, by providing the CCD camera 108 with an optical system having a deep depth of field, both the direct distance of the electronic component T and the distance passing through the imaging mirror 20 are in focus so that each distance is focused. Adjustment may not be necessary.

In the above embodiment, the center line of the suction nozzle 105 reflected on the mirror 20 and the line of sight of the CCD camera 108 are used as an index for determining the position of the head 106 for determining the position and angle of the electronic component using the edge 20T of the imaging mirror 20. The position in the Y-axis direction of the head 106 that matches is obtained .
As shown in FIG. 13, as shown in FIG. 13, determination positions M within the imaging range are determined at a plurality of points (here, three points) in the Y-axis direction of the head, and the head 106 moves from the electronic component delivery unit 101 a of the electronic component feeder 101 to the substrate. The position and angle of the electronic component based on the captured images at the head positions P1, P2, and P3 when the edge 20T of the captured mirror 20 passes through each determination position M when moving to the K mounting position H. And may be compared for each.

In this case, as shown in FIG. 14, in the case of the suction nozzle 105X at another head position shifted by ΔY in the Y-axis direction, the mirror reflection position differs in the height direction, so the CCD camera 108X at that time Is shifted by ΔC with respect to the line of sight 108a in the Y-axis direction.
For example, assuming that the center line of the suction nozzle 105 reflected by the head position P2 and the line of sight of the CCD camera 108 coincide with each other in the Y axis direction of the head 106 (FIG. 15B), the suction nozzle to be imaged. The position of the electronic component attracted by 105 is shifted as shown in FIG. 15A at the head position P1 and as shown in FIG. 15C at the head position P3.
If the inclination angle of the mirror 20 is θ, the crossing angle between the center line of the suction nozzle 105 and the line of sight of the CCD camera 108 is θ / 2, and the positional deviation ΔC of the electronic component to be imaged relative to the deviation of the head position (of the suction nozzle 105 The deviation of the center line position can be obtained by the following equation (1).
ΔC = ΔY · tanθ · cosθ (1)

Therefore, when imaging is performed at the three points P1, P2, and P3, the comparison may be performed after correcting the position with the shift amount ΔC calculated by the above equation for P1 and P3. Note that when comparing the angles of the electronic components, the influence on the head position is small, and the comparison can be made as it is.
Then, as described above, when imaging is performed at three or more points, the values are compared with each other, and the remaining values excluding component positions and angles that show a difference larger than a predetermined threshold are recognized normally. As a result, it is used for loading operation. How to use the remaining values, such as selecting a combination that minimizes the average value, median value, and variation of the remaining values, is arbitrary without departing from the scope of the present invention. In the vicinity of the position where the reflection image of the electronic component T is acquired, the Y-direction distance Y1 uses the reading of the encoder used for Y-axis driving.

For example, in the example of FIG. 13, the dirt Q is attached near the position P2, and the position and angle of the electronic component may not be correctly obtained from the captured image. As a result, when the position or angle of the electronic component at P2 differs greatly from the other position or angle beyond the threshold, the position or angle of the point P2 is not considered, and the position or angle from the other two points P1 and P3 Calculate the angle. For the magnitude of the difference, for example, the difference is obtained using an average value of three points as a reference value.
When the difference in position or angle at the three points P1, P2, and P3 is smaller than the threshold value, the position or angle is calculated without performing the above-described exclusion.
Also, the position or angle is compared at the two points P1 and P3 excluding the point P2, and if the difference between them still exceeds the threshold value, the fact of the device stop, warning, or judgment failure is recorded as it is. It is desirable to execute error handling such as continuing the mounting operation. If the difference exceeds the threshold, it is estimated that the mirror 20 needs to be cleaned, such as dirt on the recognition mirror 20 or dropping of components for mounting. Therefore, when the cleaning unit of FIG. 5 is provided, the cleaning unit may be controlled to perform cleaning at a timing that does not interfere with the mounting operation together with the error processing. Note that the error processing and cleaning described above may be executed in combination.

Further, the head position for imaging may be three or more points, or two points.
When imaging at two points, the mounting operation is continued when the difference in the position or angle of the electronic components between the two is smaller than a predetermined threshold, and when the difference is larger, the above-described exclusion is not performed. This is performed by any one or a combination of operations such as stopping of the apparatus, recording of recognition failure, and mirror cleaning.

  The index for determining the head position for imaging is not limited to the edge portion of the mirror, but may be image recognition of the edge of the mirror, or a separate index for recognition may be provided.

10 Operation control means (image processing apparatus)
13 RAM (image storage means)
17 Storage device (image storage means)
20 imaging mirror 20T edge part (index)
23 Protective layer (protective means)
24 Top plate (protection means)
25 Air nozzle (cleaning means)
27 Wiper (cleaning means)
100 Electronic Component Mounting Device 101 Electronic Component Feeder (Component Supply Unit)
102 Feeder bank (parts supply unit)
104 Substrate holder 105 Suction nozzle (nozzle)
106 head 107 XY gantry (head moving mechanism)
108 CCD camera (imaging means)
115 Focus adjustment motor (actuator)
116 Sub-optical system T Electronic component

Claims (9)

A board holding unit for holding a board on which electronic components are mounted;
A component supply unit for supplying electronic components to be mounted;
A head provided with a vertically movable nozzle that adsorbs electronic components mounted on the substrate;
In an electronic component mounting apparatus comprising: a head moving mechanism that arbitrarily moves and positions the head over a region along the X-axis direction and the Y-axis direction orthogonal to each other between the component supply unit and the substrate holding unit;
Mounted on the head in a state where the line of sight is directed obliquely downward, an imaging unit capable of capturing a planar image and capturing an electronic component adsorbed by the nozzle;
The Y-axis direction is a direction that is provided between the component supply unit and the substrate holding unit in the base frame of the electronic component mounting apparatus, and causes the movement when the head moves from the component supply unit to the substrate holding unit. an imaging mirror with only one reflective surface extending along the parallel direction of substrate conveyance in the X-axis direction orthogonal thereto in the case of a,
An image processing device that determines a position and an angle of the sucked electronic component with respect to the nozzle from a captured image of the electronic component reflected by the imaging mirror;
The reflecting surface of the imaging mirror, Ri inclined surfaces der that the perpendicular bisector of the line of sight of the centerline and the imaging means of the nozzle,
In order to determine the position of the head for determining the position and angle of the electronic component, the imaging mirror or its surroundings must be present in a fixed arrangement with respect to the imaging mirror and can be recognized by an image. Set an indicator,
The image processing apparatus passes each of a plurality of determination positions where the index is shifted by a predetermined amount in the Y-axis direction within an imaging range of the imaging means when the head moves from the component supply unit to the substrate holding unit. When the image is captured, the position of the electronic component is compared after correcting the positional deviation of the captured image at another determination position with reference to the determination position where the center line of the nozzle and the line of sight of the imaging unit match. An electronic component mounting apparatus for determining a position and an angle of the electronic component. The electronic component mounting apparatus according to claim 1 , wherein the imaging unit is mounted on the head so that the nozzle tip directly enters the field of view. The imaging means is arranged such that the tip of the nozzle directly enters the field of view at the nozzle height at the time of component suction from the component supply unit or the nozzle height at the time of component mounting on the substrate of the substrate holding unit. The electronic component mounting apparatus according to claim 2 , wherein the electronic component mounting apparatus is mounted on a head. The imaging means includes a focus adjustment mechanism that adjusts a focal length by an actuator,
The image processing device has different timings so that a focal length corresponding to the nozzle tip directly picked up and a focal length corresponding to the nozzle tip picked up via the imaging mirror are set. 4. The electronic component mounting apparatus according to claim 2, wherein an actuator of the focus adjustment mechanism is controlled. The imaging means includes a main optical system included in a camera and a sub optical system for adjusting a focal length, the main optical system has a focal length corresponding to the nozzle tip portion to be directly imaged, and the sub optical system is the imaging 4. The electronic component mounting apparatus according to claim 2 , wherein a focal length is adjusted in cooperation with the main optical system for a region including the nozzle tip portion imaged through a mirror. The image processing apparatus acquires the characteristics of the error in the longitudinal direction by imaging the nozzle of the head at a known position at a plurality of locations along the longitudinal direction of the imaging mirror via the imaging mirror, The electronic component mounting apparatus according to any one of claims 1 to 5 , wherein when the position and angle of the electronic component are determined, correction is performed based on the characteristic. The electronic component mounting apparatus according to claim 1, further comprising an image storage unit that stores still image data or moving image data of an image captured by the imaging unit. The electronic component mounting apparatus according to claim 1, further comprising a transparent protection unit that protects a reflection surface of the imaging mirror. 9. The electronic component mounting apparatus according to claim 8, further comprising cleaning means for cleaning the surface of the protection means.

Images