JP4999502B2 - Component transfer device and surface mounter - Google Patents

Description

  The present invention relates to a component transfer apparatus and a surface mounter that suck an electronic component by a suction nozzle and transfer the sucked electronic component to a predetermined location.

  As this type of device, for example, a surface mounter described in Patent Document 1 below is known. In this surface mounter, an electronic component sucked by a suction nozzle is imaged by a component recognition camera and a suction state is inspected. The suction state inspection is performed by comparing with a picked-up image in the normal suction state, and a suction deviation amount is calculated, and a mounting position at the time of component mounting is corrected based on the suction deviation amount.

However, the suction surface of the electronic component is not necessarily horizontal, and may have a step, and the electronic component may be sucked by the step. In such a case, it is determined by the inspection of the suction state that the “tilt failure” has occurred, and the electronic component is stopped and discarded, and a new electronic component is picked up again.
JP 2005-322802 A

However, when it is determined that the suction state of the electronic component is a tilt failure, it is necessary to suck the electronic component again, so that the tact time is increased by the time required for this re-suction. However, when an electronic component is mounted in a tilted posture, the bottom end side of the bottom surface of the electronic component in the tilted posture contacts the top surface of the substrate, and then the bottom end side where the bottom surface is in contact with the substrate is the center of rotation. As described above, the electronic component is mounted on the upper surface while drawing an arc-shaped locus, so that the mounting position of the electronic component is shifted laterally.
The present invention has been completed based on the above-described circumstances, and an object thereof is to enable accurate mounting even when electronic components are mounted on the upper surface of a substrate in an inclined posture. .

In the present invention, when a plane substantially parallel to the horizontal plane is defined as an XY plane and a direction orthogonal to the XY plane is defined as a Z direction, the plane is substantially parallel to the Z axis extending in the Z direction. comprising rotating shaft pivotally mounted about a, a suction nozzle for sucking an electronic component, and a lower camera for imaging the electronic component sucked by the suction nozzle from below, the side surface of the electronic component sucked by the suction nozzle Inclination detecting means for detecting the inclination of the electronic component with respect to the XY plane by imaging the side from a predetermined direction in the XY plane, and a substrate and a suction nozzle held so as to be substantially parallel to the horizontal plane Of the electronic component imaged by the driving device that enables the suction nozzle to move relative to the substrate in the XY plane and the lower camera by moving at least one of Reference point position acquisition means for acquiring the position of the reference point in the XY plane on the virtual surface passing through the lower surface of the electronic component or the tip of the substrate contact electrode of the electronic component based on the captured image on the surface side; An adsorption deviation calculation unit that calculates an amount of adsorption deviation with respect to the adsorption nozzle of the position, and a position on the XY plane of the reference point of the electronic component that is in an inclined state based on the inclination detected by the inclination detection unit and the upper surface of the substrate A mounting displacement calculating means for calculating a mounting displacement amount with respect to the position of the reference point of the electronic component on the XY plane, a suction displacement amount calculated by the suction displacement calculating means, and a mounting displacement calculated by the mounting displacement calculating means. Correction position calculation means for calculating a correction position by correcting the placement position of the suction nozzle with respect to the substrate in the X and Y directions from both of the shift amounts and the correction position calculation A driving device based on the calculated corrected position and a control device for controlling driving by the inclination detection means, and obtains the inclination of the electronic component prior to imaging the lateral side of the electronic component rotated 90 ° by the side camera Thereafter, the suction nozzle is rotated by 90 °, the side surface of the electronic component is imaged by a side camera to obtain the inclination of the electronic component after the 90 ° rotation, and the correction position calculating means the XY direction mounting position of the suction nozzle relative to the substrate on the basis of the inclination of the electronic component after the rotation tilt and 90 °, and the configuration you correct each for both directions of the rotated direction 90 ° before 90 ° rotation However, it has characteristics.

According to such a configuration, the position of the reference point of the electronic component in the XY plane is acquired by the reference point position acquisition unit based on the captured image of the lower surface side of the electronic component in the suction state imaged by the lower camera, and the electronic component Based on the suction displacement amount and placement displacement amount of the position of the reference point on the XY plane, a correction position is calculated by correcting the placement position of the suction nozzle with respect to the substrate in the XY direction, and the control device drives the drive device based on the correction position. Is controlled. Therefore, even if the electronic component is placed on the upper surface of the substrate while being tilted, the electronic component can be transferred with high accuracy. Further, the correction position calculation means can correct the position of the reference point of the electronic component in different directions based on the inclination of the electronic component before 90 ° rotation and the inclination of the electronic component after 90 ° rotation. It is possible to place the electronic component with higher accuracy than in the case of correcting the above.

  The tilt detection means obtains the tilt as an angle of the lower surface of the electronic component with respect to the upper surface of the substrate or an angle of the virtual surface with respect to the upper surface of the substrate. Z-direction dimension acquisition means for acquiring dimensions may be provided, and the correction position may be calculated based on the angle acquired by the tilt detection means and the Z-direction dimension. According to such a configuration, the correction position calculating means can calculate the correction position based on the angle of the lower surface of the electronic component with respect to the upper surface of the substrate or the angle of the virtual surface with respect to the upper surface of the substrate and the dimension in the Z direction. Since the substrate is supported by the substrate backup mechanism and held by the clamp mechanism so as to be as horizontal as possible, the inclination of the lower surface or virtual surface of the electronic component can be detected with the upper surface of the substrate as a reference surface. Alternatively, since the tip surface of the suction nozzle is held as horizontal as possible, the tilt of the lower surface or virtual surface of the electronic component can be detected using the tip surface of the suction nozzle as a reference surface.

  The reference point position acquisition means acquires the position using the center point in the captured image of the electronic component captured by the lower camera as the reference point, and the control device acquires the position of the center point in the captured image of the electronic component and the center of the suction nozzle If the amount of deviation from the point position exceeds a predetermined deviation reference value, the electronic component may not be transferred to the upper surface of the substrate. The shift amount may be, for example, a shift amount in the X-axis direction, the Y-axis direction, and the surrounding direction on the XY plane. If it does in this way, the quality of an electronic component can be determined based on the deviation | shift amount of the position of the center point of an electronic component, and the position of the center point of a suction nozzle.

  The present invention may be a surface mounter that includes a board transfer unit on a base and mounts electronic components on a board transferred by the board transfer unit by the component transfer apparatus.

  According to the present invention, an electronic component is attracted to the suction nozzle in a tilted state, and the electronic component can be accurately transferred to the top surface of the substrate even if the electronic component is placed on the top surface of the substrate while being tilted. .

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 and 2, the surface mounter 10 according to the present embodiment is disposed on a base 11 and is a printed circuit board (corresponding to a “board” of the present invention, hereinafter referred to as a board for short). A pair of conveyors (corresponding to the “board conveying means” of the present invention) 20 for conveying B, component supply units 30 arranged on both sides of both conveyors 20, and electronic components provided above the base 11 And a head unit 40 for mounting. The substrate B is supported by a substrate backup mechanism (not shown) and is held by a clamp mechanism so that it is as horizontal as possible (so that the angle with respect to the horizontal plane is equal to or less than a predetermined allowable angle). In the following description, the XY plane is a plane substantially parallel to the horizontal plane, and the Z-axis direction is a direction orthogonal to the XY plane.

  The component supply unit 30 is provided at a total of four locations, upstream and downstream, respectively, on the front side and the rear side with respect to the conveyor 20. A plurality of component supply devices 50 are arranged in parallel in the component supply unit 30. The component supply device 50 includes a tape feeder that holds a plurality of electronic components P, and is attached to the component supply device mounting portion 60 by sliding in a horizontal direction orthogonal to the parallel arrangement direction. .

  As shown in FIG. 3, the head unit 40 moves between the component supply unit 30 and the substrate B so that the electronic component P can be picked up from the component supply unit 30 by the suction nozzle 52 and mounted on the substrate B. Is possible. Specifically, as shown in FIG. 2, the head unit 40 is movable in the X-axis direction by a head unit support member 42 extending in the X-axis direction (a direction substantially along the substrate transport direction of the conveyor 20 in the XY plane). The head unit support member 42 is supported at both ends by a pair of guide rails 43 extending in the Y-axis direction (a direction orthogonal to the X-axis direction in the XY plane) so as to be movable in the Y-axis direction. Yes. The head unit 40 is driven in the X-axis direction via a ball screw shaft 45 and a ball nut (not shown) fixedly supported by the head unit 40 by an X-axis motor 44 fitted to the ball screw shaft 45. Is done. The head unit support member 42 is fitted to the ball screw shaft 47 by the Y axis motor 46 and a ball nut (not shown) fixedly supported by the head unit support member 42 through the Y axis. Direction driving is performed (these structures constitute the driving device of the present invention).

  In addition, a plurality of heads 41 are mounted on the head unit 40 side by side in the X-axis direction. Each head 41 is driven along a drive shaft extending in the Z-axis direction (a direction orthogonal to both the X-axis direction and the Y-axis direction) by an elevating mechanism using a Z-axis motor 48 as a drive source, and R It is driven in the rotational direction (R-axis direction) by a rotational drive mechanism using the shaft motor 49 as a drive source. Note that the drive shaft of each head 41 (suction nozzle 52) is set to be equal to or smaller than a predetermined allowable angle with respect to the Z axis.

  At the tip of each head 41, a suction nozzle 52 for sucking the electronic component P and mounting it at a predetermined mounting position on the upper surface of the substrate B is provided. A negative pressure is applied to the inside of the head 41 by an air pressure supply means (not shown) while the electronic component P is adsorbed, the electronic component P is being transported and the head 41 is lowered, and at the moment when the electronic component P is mounted, a positive pressure is applied. Supplied respectively. Thus, each suction nozzle 52 is supplied with a negative pressure from the air pressure supply means during the suction of the electronic component P, and can pick up the electronic component P by suction with the suction force of the negative pressure. Note that a plurality of types of suction nozzles 52 are stored on the base 11, and a nozzle stocker that enables the selection of suction nozzles 52 suitable for sucking the electronic components P placed on the substrate B (see FIG. Not shown) is installed.

  As shown in FIG. 2, a component recognition camera 12 (corresponding to a “lower camera” of the present invention) is installed on the front side and the rear side of the conveyor 20 in the base 11. The component recognition camera 12 can capture the picked-up posture of the electronic component P sucked by the suction nozzle 52 from below in the Z-axis direction, and obtain a picked-up image on the lower surface side of the electronic component P. Specifically, the component recognition camera 12 includes a photoelectric conversion element, and converts the obtained image into an analog image signal. This analog image signal is output to an image processing unit 100 described later, and is converted into a digital image signal by an A / D conversion unit (not shown) in the image processing unit 100. An illumination device 91 that illuminates the electronic component P sucked by the suction nozzle 52 is provided in the vicinity of the component recognition camera 12.

  On the lower surface side of the head unit support member 42, a side view camera (corresponding to a “side camera” of the present invention) 13 is installed. As shown in FIG. 3, the side view camera 13 is formed to hang downward from the center of the lower surface portion of the head unit support member 42, and the suction posture of the electronic component P sucked by the suction nozzle 52 at the lower end portion is set to X. Imaging can be performed from the back side in the axial direction, and a captured image of the side surface side of the electronic component P can be obtained. The other detailed configuration is the same as that of the component recognition camera 12. The obtained image is converted into an analog image signal, and the analog image signal is output to the image processing unit 100.

  A pair of substrate cameras 14 are attached to the outer surface of the head unit 40 integrally with both sides of the head unit 40 sandwiched therebetween. Both board cameras 14 are arranged at a predetermined interval in the X-axis direction, and are moved in the X-axis direction and the Y-axis direction together with the head unit 40. Further, either one of the two board cameras 14 is selected depending on the mounting position of the electronic component P on the upper surface of the substrate B, and the entire range of the movable region on the upper surface of the substrate B can be imaged by imaging the upper surface of the substrate B. The board camera 14 has the same configuration as the component recognition camera 12, and an image obtained by the board camera 14 is converted into an analog image signal, and the analog image signal is output to the image processing unit 100.

  Next, an electrical configuration centering on the controller 70 of the surface mounter 10 according to the present embodiment will be described with reference to FIG. The controller 70 includes an arithmetic processing unit 71, a mounting program storage unit 72, a conveyance system data storage unit 73, a motor control unit 80, an external input / output unit 110, and an image processing unit 100. The controller 70 corresponds to the “adsorption deviation calculating unit”, the “mounting deviation calculating unit”, the “correction position calculating unit”, the “Z-direction dimension obtaining unit”, and the “control device” according to the present invention. The unit 100 corresponds to the “reference point position acquisition unit” of the present invention.

  An X-axis motor 44, a Y-axis motor 46, a Z-axis motor 48, and an R-axis motor 49 are connected to the motor control unit 80. The motor control unit 80 drives each of the motors 44, 46, 48, and 49 based on the mounting program stored in the mounting program storage unit 72. Thereby, the electronic component P is conveyed freely in the X-axis, Y-axis, Z-axis, and R-axis directions. The Z-axis direction is a direction orthogonal to the XY plane along the upper surface of the substrate B.

  The component recognition camera 12, the side view camera 13, and the board camera 14 are connected to the image processing unit 100. The image processing unit 100 includes an X dimension X1 that is a dimension in the X-axis direction when the electronic component P is projected on the XY plane based on a captured image on the lower surface side of the electronic component P captured by the component recognition camera 12. The Y dimension Y1, which is the dimension in the Y-axis direction, is acquired on the image data. Then, the image processing unit 100 uses the center point C1 of the electronic component P as the reference point on the XY plane from the X dimension X1 and the Y dimension Y1 of the electronic component P (the “center in the captured image of the electronic component of the present invention”). Corresponding to “Point position”). Further, since the component recognition camera 12 images the electronic component P when the suction nozzle 52 is at a predetermined position, the position where the suction nozzle 52 will be present in the captured image is known in advance by the image processing unit 100. The image processing unit 100 has a suction deviation amount Xa in the X-axis direction of the center point coordinate of the electronic component P with respect to the center position of the suction nozzle 52, a suction deviation amount Ya in the Y-axis direction, and around the R axis on the XY plane. The adsorption deviation angle θa is calculated.

Next, an operation method for mounting the electronic component P at a predetermined mounting position on the upper surface of the substrate B by the surface mounting machine 10 of the present embodiment will be described with reference to FIG.
First, the upper limit allowable value XU of the suction displacement amount Xa in the X axis direction of the electronic component P, the upper limit allowable value YU of the suction displacement amount Ya in the Y axis direction, and the upper limit allowable angle θU of the suction displacement angle θa around the R axis are set. The upper limit allowable values XU and YU and the upper limit allowable angle θU are input by an input device (not shown) and stored in the mounting program storage means 72 or the transport system data storage means 73.

  When the substrate B transported by the conveyor 20 stops at a predetermined position, the substrate camera 14 recognizes a fiducial mark (not shown) of the substrate B so that the position of the substrate B in the X-axis direction and the Y-axis direction. Is recognized. Then, the X-axis motor 44, the Y-axis motor 46, and the Z-axis motor 48 are operated by the motor control unit 80, and the suction nozzle 52 is moved to a position where the electronic component P can be sucked. At this time, the suction nozzle 52 is controlled so that the center thereof reaches a predetermined position of the component supply unit 30. Thereafter, the head 41 is lowered and negative pressure is supplied to the suction nozzle 52 to suck the electronic component P held by the tape feeder (S101), and the head 41 is lifted to remove the electronic component P from the tape feeder. The pickup is picked up and moved in the X axis direction and the Y axis direction toward the sky above the component recognition camera 12.

  Therefore, the electronic component P is imaged from the lower side in the Z-axis direction by the component recognition camera 12, the lower surface side of the electronic component P is recognized (S102), and the captured image data on the lower surface side of the electronic component P is transferred to the image processing unit 100. Is output. When the electronic component P is imaged from the back side in the X-axis direction by the side view camera 13 in synchronization with the imaging by the component recognition camera 12, the side surface side of the electronic component P is recognized (S103), and the electronic component P The side-side captured image data is output to the image processing unit 100.

  Then, the image processing unit 100 acquires the X dimension X1 and the Y dimension Y1 of the electronic component P based on the captured image data on the lower surface side of the electronic component P. Then, the center point coordinates of the electronic component P are acquired based on the dimensions X1 and Y1 and the coordinates of the center position of the suction nozzle 52. At the same time, the X-axis suction displacement amount Xa, the Y-axis suction displacement amount Ya, and the suction displacement angle θa around the R-axis of the center point coordinates of the electronic component P with respect to the center position of the suction nozzle 52 are acquired ( S104).

  If the suction displacement amount Xa in the X-axis direction exceeds the upper limit allowable value XU (No in S105), the electronic component P is discarded (S106), and the head unit 40 is moved to a position where the electronic component P of the tape feeder can be sucked. The electronic component P is again picked up (S101). Similarly, when the suction displacement amount Ya in the Y-axis direction exceeds the upper limit allowable value YU (No in S105), the electronic component P is discarded (S106), and the electronic component P is again suctioned as described above. (S101) When the suction deviation angle θa around the R axis exceeds the upper limit allowable value θU (No in S105), the electronic component P is discarded (S106), and the electronic component P is again suctioned in the same manner as described above. Perform (S101).

  On the other hand, when the adsorption deviation amount Xa in the X-axis direction, the adsorption deviation amount Ya in the Y-axis direction, and the adsorption deviation angle θa in the R-axis direction are the upper limit allowable values XU and YU and the upper limit allowable angle θU, respectively (S105) Yes), the head 41 is rotated 90 ° in the R-axis direction (S107), and the side view camera 13 images the side surface side of the electronic component P after 90 ° rotation. Then, the side surface side of the electronic component P is recognized (S108), and the captured image data on the side surface side of the electronic component P is output to the image processing unit 100. When the imaging by the side view camera 13 is completed, the head 41 is reversely rotated in the R-axis direction to return to the state before the rotation. The image processing unit 100 determines the height dimension Z0 of the electronic component P based on the captured image data on the side surface of the electronic component P before and after 90 ° rotation, the angle θ1 of the lower surface of the electronic component P before rotation with respect to the upper surface of the substrate B, and The angle θ2 of the lower surface of the electronic component P after the 90 ° rotation with respect to the upper surface of the substrate B is acquired (S109). The angles θ1 and θ2 correspond to “the inclination of the electronic component with respect to the substrate as viewed from a predetermined direction in the XY plane” of the present invention.

  By the way, the suction surface of the electronic component P is not necessarily horizontal and may have a step, and the electronic component P may be sucked by the step. When the electronic component P is mounted on the upper surface of the substrate B in a tilted posture, the electronic component P can be used after the lower end portion P1 of the electronic component P in the tilted posture contacts the upper surface of the substrate B as shown in FIGS. Since the tips P2 (see FIG. 6) and P3 (see FIG. 7) of the electronic component P in the posture inclined with the lower end portion P1 as the rotation center move to the upper surface of the substrate B while drawing an arc-shaped locus, A mounting deviation amount ΔX in the X-axis direction and a mounting slip amount ΔY in the Y-axis direction of the component center point C2 after mounting with respect to the component center point C1 are generated. For this reason, the shift amount in the X-axis direction of the center point C2 of the electronic component P after mounting with respect to the center position of the suction nozzle 52 is Xa + ΔX, and the shift amount in the Y-axis direction is Ya + ΔY. Accordingly, when the XY-direction placement position of the suction nozzle 52 with respect to the substrate B is corrected in consideration of only the suction displacement amounts Xa and Ya as the displacement amounts, the center point C2 of the electronic component P after mounting is a predetermined point of the electronic component P. The mounting position is shifted by ΔX in the X-axis direction and ΔY in the Y-axis direction with respect to the mounting position. The mounting displacement amounts ΔX and ΔY correspond to the “mounting displacement amount” of the present invention.

  As a countermeasure against this, in this embodiment, as shown in S109 to S111 in FIG. 5, the suction nozzle 52 is placed in the XY direction in consideration of not only the suction displacement amounts Xa and Ya but also the mounting displacement amounts ΔX and ΔY. By correcting the position, the center point C2 of the electronic component P after mounting is made to coincide with a predetermined mounting position. Specifically, the value obtained by subtracting the suction displacement amounts Xa and Ya from the mounting displacement amounts ΔX and ΔY is set as a total displacement amount, and the correction position is subtracted from the total displacement amount from the placement position of the suction nozzle 52 in the XY direction. Calculated. Hereinafter, a method for calculating the mounting displacement amounts ΔX and ΔY will be described.

First, a method for calculating ΔX will be described. As shown in FIG. 6, the image processing unit 100 determines the height dimension of the electronic component P based on the captured image on the side surface of the electronic component P captured by the side view camera 13 (“dimension in the Z direction” of the present invention). Z0, X-axis direction dimension X0, and angle θ1 are obtained. For the height dimension Z0, the size information of the electronic component P stored in advance in the mounting program storage means 72 or the conveyance system data storage means 73 may be used. The angle θ1 is an angle with respect to the upper surface of the substrate B of the virtual surface (lower surface of the electronic component P) V1 where the substrate contact electrode of the electronic component P in an inclined state when viewed from the Y-axis direction is in contact with the substrate B. The center point C1 can be grasped as an intersection of the axis S5 passing through the center of the electronic component P in an inclined state and the virtual plane V1. Further, the center point C2 can be grasped as an intersection of the axis S6 passing through the center of the electronic component P mounted on the upper surface of the substrate B and the virtual plane V1. ΔX is a distance {Δ1 + (X0) / 2} in the X-axis direction from the dimension line S1 to C2, and a dimension line S1 to C1 as shown in Expression 1, where S1 is the rightmost dimension line in FIG. Can be obtained as a difference from the distance {(X1) / 2} in the X-axis direction.
<Formula 1> ΔX = {Δ1 + (X0) / 2} − {(X1) / 2}
Δ1 is calculated from the inclination θ1 in the Z-axis direction and the dimension Z0 in the Z-axis direction, as shown in Equation 2.
<Formula 2> Δ1 = Z0sin θ1
X1 is calculated from X0, θ1, and Δ1, as shown in Equation 3.
<Formula 3> X1 = X0 cos θ1 + Δ1
Therefore, substituting Equation 2 and Equation 3 into Equation 1,
ΔX = {Z0sin θ1 + (X0) / 2} − {(X0cos θ1 + Z0sin θ1) / 2}
= {Z0sinθ1-X0cosθ1 + X0} / 2
Here, if θ1 is close to 0, cos θ1 can be approximated to 1.
ΔX≈ {Z0sin θ1} / 2 = Δ1 / 2.
That is, ΔX can be calculated as a half value of Δ1.

On the other hand, for ΔY, after the suction nozzle 52 to which the electronic component P is sucked is rotated 90 ° in the R-axis direction, the side view camera 13 images the side surface side of the electronic component P, and the captured image shown in FIG. It can be calculated by acquiring. The angle θ2 is an angle with respect to the upper surface of the substrate B of a virtual surface (lower surface of the electronic component P) V1 where the substrate contact electrode of the electronic component P is in contact with the substrate B when viewed from the X-axis direction. Since the calculation method of ΔY is the same as the calculation method of ΔX, detailed description is omitted, but ΔY is calculated using the same calculation formula as above.
ΔY = {Z0sin θ2−X0cos θ2 + X0} / 2
If θ2 is close to 0, cos θ1 can be approximated to 1.
ΔY≈ {Z0sin θ2} / 2 = Δ2 / 2.
That is, ΔY can be calculated as a half value of Δ2.

  In this manner, the mounting displacement amounts ΔX and ΔY are calculated based on the height dimension Z0, the angle θ1, and the angle θ2 of the electronic component P (S110). Then, by subtracting ΔX from the adsorption deviation amount Xa in the X-axis direction and subtracting ΔY from the adsorption deviation amount Ya in the Y-axis direction, the total deviation amount considering both the adsorption deviation amount and the mounting deviation amount. Is calculated (S111). Based on the total deviation amounts (Xa−ΔX) and (Ya−ΔY), a correction position in which the XY-direction placement position of the suction nozzle 52 relative to the substrate B is corrected is calculated, and the head unit 40 is directed toward this correction position. Are moved in the X-axis direction and the Y-axis direction, and the head 41 is lowered in the Z-axis direction toward the upper surface of the substrate B.

  When the positive pressure is supplied to the suction nozzle 52 by the air pressure supply means, the electronic component P is detached from the suction nozzle 52, and the lower end portion P1 of the electronic component P in an inclined posture contacts the upper surface of the substrate B, the lower end portion of the electronic component P The tips P2 and P3 move toward the upper surface of the substrate B while drawing an arcuate locus with the rotation center P1, and the electronic component P is mounted at a predetermined mounting position on the upper surface of the substrate B (S112). When the electronic component P is mounted on the upper surface of the substrate B, the head 41 is raised and the head unit 40 is returned to the origin position. When the component mounting operation of the electronic component P is thus completed (S113), the head unit 40 moves the head unit 40 to the tape feeder of the component supply unit 30 again when there is an electronic component P to be mounted next, Next, the electronic component P to be mounted is sucked (S101).

As described above, in the present embodiment, the following effects can be achieved.
1. The electronic component P is mounted on the upper surface of the substrate B in an inclined posture by considering not only the suction displacement amounts Xa and Ya but also the mounting displacement amounts ΔX and ΔY caused by the inclination posture of the electronic component P. Even so, the electronic component P can be mounted with high accuracy.
2. Since the dimension Z0 in the Z direction of the electronic component P is calculated using the image captured by the side view camera 13, the dimension Z0 can be acquired with higher accuracy.

3. The quality of the electronic component P can be determined based on the suction displacement amounts Xa and Ya of the center point C1 of the electronic component P with respect to the center position of the suction nozzle 52 and the suction displacement angle θa.
4). Since correction can be performed for each of the X-axis direction and the Y-axis direction, the electronic component P can be mounted with higher accuracy than when correction is performed for only one of them.

< Reference example >
Next, a reference example of the present invention will be described with reference to FIGS.
The surface mounter 210 of the reference example is obtained by changing the side view camera 13 in the surface mounter 10 of the first embodiment to a 3D sensor (corresponding to “measuring means” of the present invention) 220, and other common features. About the structure to perform, while using the same code | symbol, overlapping description is abbreviate | omitted. In this reference example , a package-type mounting component P having a plurality of lead terminals T is described as an example of the electronic component P. However, an electronic component applicable to this reference example is a package-type mounting component P. It is not limited, and may be a chip part having electrodes on both sides, or a BGA (Ball Grid Array) or CSP (Chip Size Package) having electrodes exposed on the lower surface.

  A 3D sensor 220 is provided within the movable range of the head unit 40, and the lower surface side of the mounting component P sucked by the suction nozzle 52 by the 3D sensor 220 is imaged. As shown in FIG. 9, the 3D sensor 220 includes a base plate 221 that is fixed to the base 11. The upper end portion of the base plate 221 has first illumination means 230 for irradiating imaging light to the lower surface side of the mounting component P sucked by the suction nozzle 52 from obliquely below, and Z on the lower surface of the mounting component P. A second illumination unit 231 that irradiates imaging light from the lower side in the axial direction is fixed.

  The 1st and 2nd illumination means 230 and 231 are comprised using several LED232 as the light source. The LED 232 of the first illumination means 230 is a reflection in which natural light emitted toward the lower surface of the mounting component P conveyed above the substantially central position of the base plate 221 in the X-axis direction is reflected by the lower surface of the mounting component P. It is fixed to the base plate 221 so as to have an incident angle and a reflection angle of about 40 ° with respect to the YZ plane with respect to the point. Further, a refractive lens 233 is provided on the irradiation path of the natural light S of each LED 232.

  The refraction lens 233 converts the natural light S emitted from each LED 232 into parallel light or substantially parallel light that is substantially orthogonal to a predetermined plane (for example, a plane connecting the base plate 221 and the front end portions of the LED 232 side of the refraction lens 233). Refract to be. The surface of the refractive lens 233 opposite to the LED 232 is convexly formed in a semi-cylindrical shape, and as shown in FIG. 10, when parallel light or substantially parallel light is emitted from the refractive lens 233, the Y axis The light is bent while maintaining parallel or substantially parallel to the direction, and becomes planar bent light H, which is condensed at a linear condensing position SI in the Y-axis direction.

  The position of the head 41 in the Z-axis direction is adjusted so that the lower surface position of the mounting component P matches the condensing position SI. Further, as shown in FIG. 10, on the condensing position SI, high condensing portions SI1, SI2, SI3,... Corresponding to the arrangement pitch of the LEDs 232 in the Y-axis direction are formed, and relative to a bright part in the Y-axis direction. Therefore, a diffuser 234 that diffuses the planar bent light H only in the Y-axis direction is disposed between the refractive lens 233 and the mounting component P. Thus, each planar bent light H spreads in a fan shape in the Y-axis direction toward the mounting component P side, and has substantially uniform brightness in the Y-axis direction.

  That is, the refractive light 233 and the diffuser 234 are bent into the planar bending light H of the natural light S emitted from each LED 232 of the illumination unit 230, and the planar bending light H is condensed on the lower surface of the mounting component P. By diffusing in the Y-axis direction, each planar bent light H is irradiated onto the condensing position SI extending in the Y-axis direction on the lower surface of the mounting component P. Each planar bent light H irradiated from the first illumination means 230 to the condensing position SI is reflected to the left side which is symmetrical with respect to the YZ plane with respect to the condensing position SI, and this reflected light R is a mirror. 235 is reflected downward. On the other hand, the light from the second illumination means 231 is reflected downward by the lower surface of the mounting component P.

  The light reflected by the mirror 235 is received by the first camera 236, and the light of the second illumination means 231 is reflected downward by the mounting component P and then received by the second camera 237. These first and second cameras 236 and 237 use line sensors (not shown) as image sensors, and are fixed to a base plate 221 respectively. Note that the first and second cameras 236 and 237 constitute a measurement camera in the present invention. In the present embodiment, the first camera 236 is positioned below the second camera 237, but the positions of these cameras 236 and 237 may be changed as long as they do not block the optical path. Can do. The controller 70 controls the switching between turning on and off of the first and second illumination means 230 and 231 and the imaging operation of the first and second cameras 236 and 237.

Next, an electrical configuration centering on the controller 70 of the surface mounter 210 according to this reference example will be described with reference to FIG. The controller 70 includes an arithmetic processing unit 80, a mounting program storage unit 72, a transport system data storage unit 73, a motor control unit 80, an external input / output unit 110, and an image processing unit 100. The 3D sensor 220 is connected to the image processing unit 100 .

Next, an operation method for mounting the mounting component P at a predetermined mounting position on the upper surface of the substrate B by the surface mounting machine 210 of this reference example will be described with reference to FIG.
First, the upper limit allowable value XU of the adsorption deviation amount Xa in the X-axis direction of the mounting component P, the upper limit allowable value YU of the adsorption deviation amount Ya in the Y-axis direction, and the upper limit allowable value θU of the adsorption deviation inclination θa around the R axis are set. The upper limit allowable values XU and YU and the upper limit allowable angle θU are input by an input device (not shown) and stored in the mounting program storage means 72 or the transport system data storage means 73.

  When the substrate B transported by the conveyor 20 stops at a predetermined position, the substrate camera 14 recognizes a fiducial mark (not shown) of the substrate B so that the position of the substrate B in the X-axis direction and the Y-axis direction. Is recognized. Then, the X-axis motor 44, the Y-axis motor 46, and the Z-axis motor 48 are operated by the motor control unit 80, and the suction nozzle 52 is moved to a position where the mounting component P can be sucked. At this time, the suction nozzle 52 is controlled so that the center thereof reaches a predetermined position of the component supply unit 30. Thereafter, the head 41 is lowered and negative pressure is supplied to the suction nozzle 52 to suck the mounting component P held by the tray feeder (S201), and the head 41 is lifted to mount the mounting component from the tray feeder. P is picked up and moved in the X-axis direction and the Y-axis direction toward the sky above the component recognition camera 12.

  Therefore, when the mounting component P is imaged from the lower side in the Z-axis direction by the component recognition camera 12, the lower surface side of the mounting component P is recognized (S202), and the captured image data on the lower surface side of the mounting component P is obtained. The image is output to the image processing unit 100. Based on the captured image data on the lower surface side of the mounting component P, the image processing unit 100 projects the mounting component P onto the XY plane, the X dimension X1, which is the dimension in the X axis direction, and the Y axis direction. The Y dimension Y1, which is the dimension, is acquired. Then, the center point coordinates of the mounting component P are acquired based on the dimensions X1 and Y1 and the coordinates of the center position of the suction nozzle 52. At the same time, the suction deviation amount Xa in the X-axis direction, the suction deviation amount Ya in the Y-axis direction, and the suction deviation angle θa around the R-axis of the center point coordinates of the mounting component P with respect to the center position of the suction nozzle 52 are acquired. (S203).

  If the suction displacement amount Xa in the X-axis direction exceeds the upper limit allowable value XU (No in S204), the mounting component P is discarded (S205), and the head unit 40 can suck the mounting component P of the tray feeder. Then, the mounting component P is again picked up (S201). Similarly, when the amount of suction displacement Ya in the Y-axis direction exceeds the upper limit allowable value YU (No in S204), the mounting component P is discarded (S205), and the mounting operation of the mounting component P is again performed as described above. (S201), even when the suction deviation angle θa around the R axis exceeds the upper limit allowable angle θU (No in S204), the mounting component P is discarded (S205), and again the mounting component P as in the above case. (S201).

  On the other hand, when the adsorption deviation amount Xa in the X-axis direction, the adsorption deviation amount Ya in the Y-axis direction, and the adsorption deviation angle θa in the R-axis direction are the upper limit allowable values XU, YU and the upper limit allowable angle θU, respectively (S204). Yes), the part recognition by the 3D sensor 220 is performed. This component recognition is performed according to the following procedure.

  The mounting component P is moved in the Z-axis direction by the head 41 so that the lower surface position of the mounting component P coincides with the condensing position SI. Then, as shown in FIG. 11, the mounting component P is moved by the head unit 40 so that the lead terminal row a of the mounting component P passes through the condensing position SI along the direction of the arrow above the 3D sensor 220. Transport. At this time, each captured image data acquired by the first and second cameras 236 and 237 is output to the image processing unit 100. Thereby, each lead terminal T of the lead terminal row a is recognized by the image processing unit 100 (S206), and position data of the lead terminal group T is acquired.

  Next, the head 41 is rotated 90 ° in the R-axis direction (S208), and the mounting component P is conveyed so that the next lead terminal row b of the mounting component P passes through the condensing position SI. Each lead terminal T of the terminal row b is recognized by the image processing unit 100 (S209), and position data of the lead terminal group T is acquired. Then, it is confirmed whether or not the recognition has been completed for all the lead terminal rows a to d. If the recognition is not completed (No in S207), the head 41 is rotated by 90 ° (S208), thereby remaining lead terminals. The columns c and d are sequentially recognized (S209), and the position data of all the lead terminals T are acquired.

  Thereafter, the flatness of the lead terminal group T is calculated based on the position data of the lead terminal group T. When the flatness exceeds a predetermined reference value, the mounting component P is discarded. The mounting surface V2 is calculated as a virtual plane in a three-dimensional space configured by selecting the three most projecting lead terminals T from the lead terminal group T and connecting the tips of these three lead terminals T. .

  In addition to the flatness measurement, the image processing unit 100 uses the position data of the lead terminal group T calculated when the flatness of the lead terminal group T is measured, so that the tip of the lead terminal T is placed on the upper surface of the substrate B. The contacting mounting surface V2 is calculated, and angles θ3 and θ4 (corresponding to “the inclination of the mounting surface with respect to the substrate” in the present invention) of the mounting surface V2 with respect to the upper surface of the substrate B are acquired (S210). Here, the center point C1 can be grasped as an intersection of the axis S7 passing through the center of the electronic component P in an inclined state and the mounting surface V2. Further, the center point C2 can be grasped as an intersection of the axis S8 passing through the center of the electronic component P mounted on the upper surface of the substrate B and the mounting surface V2. Hereinafter, a method for calculating the angles θ3 and θ4 will be described.

  As shown in FIG. 14, the angle θ3 is calculated as a straight line L1 where the XZ plane passing through the center point C1 and the mounting surface V2 intersect, and a straight line L2 obtained by projecting the straight line L1 onto the XY plane is calculated. Calculated as the slope of the straight line L1 with respect to L2. As shown in FIG. 15, the angle θ4 is calculated in the same manner as described above by calculating a straight line L3 where the YZ plane passing through the center point C1 and the mounting surface V2 intersect and projecting the straight line L3 on the XY plane. Is calculated as the slope of the straight line L3 with respect to the straight line L4.

Incidentally, the suction posture of the mounting component P by the suction nozzle 52 is not necessarily horizontal, or the mounting surface V2 is not necessarily horizontal even if the suction posture is horizontal. In such a case, when the mounting surface V2 of the mounting component P is mounted in an inclined posture with respect to the upper surface of the substrate B, the mounting component P is in an inclined posture as shown in FIGS. After the lower end portion P1 of the mounting component P comes into contact with the upper surface of the substrate B, the tips P2 (see FIG. 14) and P3 (see FIG. 15) of the mounting component P in an inclined posture with the lower end portion P1 as the rotation center. Since it moves to the upper surface of the substrate B while drawing an arcuate locus, a mounting deviation amount ΔX in the X-axis direction and a mounting deviation amount ΔY in the Y-axis direction of the component center point C2 after mounting with respect to the component center point C1 before mounting are generated. become. For this reason, the shift amount in the X-axis direction of the center point C2 of the mounted component P after mounting with respect to the center position of the suction nozzle 52 is Xa + ΔX, and the shift amount in the Y-axis direction is Ya + ΔY. Accordingly, when the mounting position of the suction nozzle 52 with respect to the substrate B is corrected in consideration of only the suction shift amounts Xa and Ya as the shift amounts, the center point C2 of the mounting component P after mounting is the mounting component P. This is mounted at a position shifted by ΔX in the X-axis direction and ΔY in the Y-axis direction with respect to the predetermined mounting position .

As a countermeasure against this, in this reference example , as shown in S210 to S212 in FIG. 13, not only the suction displacement amounts Xa and Ya but also the mounting displacement amounts ΔX and ΔY are considered, and the suction nozzle 52 is placed in the XY direction. By correcting the position, the center point C2 of the mounting component P after mounting is made to coincide with a predetermined mounting position. Specifically, the value obtained by subtracting the suction displacement amounts Xa and Ya from the mounting displacement amounts ΔX and ΔY is set as a total displacement amount, and the correction position is subtracted from the total displacement amount from the placement position of the suction nozzle 52 in the XY direction. Calculated. Hereinafter, a method for calculating the mounting displacement amounts ΔX and ΔY will be described.

First, a method for calculating ΔX will be described. The dimension X1 in the X-axis direction of the mounting component P in the tilted posture is calculated based on the captured image of the lower surface side of the mounting component P by the component recognition camera 12 as in the first embodiment. Further, the inclination θ3 on the XZ plane is acquired by the 3D sensor 220 and the controller 70 as described above. ΔX is a distance {(X0) / 2} in the X-axis direction from the dimension line S3 to the center point C2 and an X-axis from the dimension line S3 to the center point C1, where S3 is the leftmost dimension line in FIG. It can be obtained as a difference from the distance {(X1) / 2} in the direction. ... Formula 4
<Formula 4> ΔX = {(X0) / 2} − {(X1) / 2}
= (X0-X1) / 2
On the other hand, X0 is calculated from X1 and θ3. ... Formula 5
<Formula 5> X0 = (X1) / cos θ3
Therefore, ΔX = X1 {(1 / cos θ3) −1} / 2.

On the other hand, since the calculation method of ΔY is the same as the calculation method of ΔX, detailed description is omitted.
ΔY = Y1 {(1 / cos θ4) −1} / 2.

  In this way, the mounting displacement amounts ΔX and ΔY are calculated based on the X dimension X1 and Y dimension Y1 of the mounting component P and the inclinations θ3 and θ4 in the Z-axis direction (S211). Then, by subtracting ΔX from the adsorption displacement amount Xa in the X-axis direction and subtracting ΔY from the adsorption displacement amount Ya in the Y-axis direction, a displacement amount considering both the displacement amount of the adsorption displacement amount and the mounting displacement amount is obtained. Calculate (S212). Then, based on the deviation amounts (Xa−ΔX) and (Ya−ΔY), a correction position in which the mounting position of the suction nozzle 52 relative to the substrate B is corrected is calculated, and the head unit 40 is moved toward the correction position. Moving in the X-axis direction and the Y-axis direction, the head 41 is lowered in the Z-axis direction toward the upper surface of the substrate B.

  When the positive pressure is supplied to the suction nozzle 52 by the air pressure supply means, the mounting component P is detached from the suction nozzle 52, and the lower end portion P1 of the mounting component P in an inclined posture comes into contact with the upper surface of the substrate B, the mounting component P The tips P2 and P3 move to the upper surface of the substrate B while drawing an arcuate locus with the lower end portion P1 of the rotation center as a rotation center, and the mounting component P is mounted at a predetermined mounting position on the upper surface of the substrate B (S213). When the electronic component P is mounted on the upper surface of the substrate B, the head 41 is raised and the head unit 40 is returned to the origin position. When the component mounting operation of the mounting component P is thus completed (S214), the head unit 40 moves the head unit 40 to the tray feeder of the component supply unit 30 again when there is a mounting component P to be mounted next. Then, the mounting component P to be mounted next is sucked (S201).

As described above, this reference example can achieve the following effects.
1. The upper surface of the substrate B with the mounting component P tilted by considering not only the suction displacement amounts Xa and Ya but also the mounting shift amounts ΔX and ΔY caused by the tilting posture of the mounting component P. Even if mounted, the mounting component P can be mounted with high accuracy.
2. The mounting surface V2 is calculated by using the position data of the lead terminal group T acquired at the time of measuring the flatness of the lead terminal group T, and the mounting deviation amount Δ3 from the angles θ3 and θ4 of the mounting surface V2 with respect to the upper surface of the substrate B. And Δ4 can be determined. Therefore, since the mounting deviation amounts Δ3 and Δ4 can be calculated using the existing measuring means (3D sensor 220), it is not necessary to provide new measuring means.

3. The quality of the mounting component P can be determined based on the suction displacement amounts Xa and Ya of the center point C1 of the mounting component P with respect to the center position of the suction nozzle 52 and the suction displacement angle θa.
4). Since the correction can be made for each of the X-axis direction and the Y-axis direction, the mounting component P can be mounted with higher accuracy than when only one of the corrections is made.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In this embodiment, although the coordinates of the center point C1 of the electronic component P are calculated as the coordinates of the reference point of the electronic component P on the XY plane, according to the present invention, the XY plane of the reference point of the electronic component P is calculated. The coordinates in may be other places, for example, the coordinates of a point obtained by projecting the lower end P1 in the tilted posture of the electronic component P onto the XY plane.

  (2) In the present embodiment, the position on the suction nozzle 52 side is corrected based on the suction displacement amounts Xa and Ya and the mounting displacement amounts ΔX and ΔY, but according to the present invention, the suction displacement amounts Xa and Ya and the mounting displacement amounts are corrected. The position on the substrate B side may be corrected based on the deviation amounts ΔX and ΔY.

  (3) In the first embodiment, although the mounting displacement amounts ΔX and ΔY are calculated based on the angles θ1 and θ2 and the height dimension Z0, according to the present invention, when the angles θ1 and θ2 are small, the electronic component P Alternatively, Δ1 and Δ2 may be acquired by the image processing unit 100 based on the captured image on the side surface, and the mounting displacement amounts ΔX and ΔY may be calculated as half the values of Δ1 and Δ2.

  (4) In the first embodiment, although the side view camera 13 is used as the tilt detection means, the height dimension Z0 of the electronic component P is calculated based on the captured image on the side surface of the electronic component P. According to the present invention, the height dimension Z0 of the electronic component P stored in advance in the transport system data storage unit 73 may be used.

  (5) In the first embodiment, the angles θ1 and θ2 are acquired as the angles of the virtual plane V1 with respect to the upper surface of the substrate B based on the image captured by the side view camera 13, but according to the present invention, the XY plane of the electronic component P is obtained. Any other method may be used as long as it can acquire the inclination with respect to. That is, a reference line parallel to the XY plane is incorporated in the captured image of the side view camera 13 in advance, and the angles θ1 and θ2 are acquired based on the reference line, or the tip surface of the suction nozzle 52 in the captured image. The angles [theta] 1 and [theta] 2 are acquired using the reference line (which is set to be substantially horizontal). Alternatively, a center line is obtained from the suction nozzle 52 in the captured image, a reference line parallel to the XY plane perpendicular to the center line is obtained, and the angles θ1 and θ2 are obtained based on the reference line.

(6) In the first embodiment, the angles θ1 and θ2 are acquired based on the image taken by the side view camera 13, but according to the present invention, the electronic component P is irradiated from below with the laser as the tilt detection means. The angles θ1 and θ2 may be acquired using a laser height measuring device that measures the distance from the reflected light.
Specifically, the laser height measuring machine includes a light projecting unit (not shown), a light receiving unit (not shown), and an optical position detection element (not shown), although not shown, a component recognition camera 12 is installed on the base 11 in the vicinity. The laser light emitted from the light projecting unit 14 is reflected at the tip of the substrate contact electrode of the electronic component P located immediately above the light projecting unit, and this reflected light enters the light receiving unit and is projected by the optical position detection element. A distance in the Z-axis direction from the optical part is detected. Therefore, when the electronic component P is moved in the X-axis direction and the Y-axis direction directly above the light projecting unit, the displacement amount in the Z-axis direction relative to the movement amount in the X-axis direction and the Z axis relative to the movement amount in the Y-axis direction The amount of displacement in the direction can be measured. Therefore, the angles θ1 and θ2 can be calculated based on the movement amount in the X-axis direction, the movement amount in the Y-axis direction, and the displacement amount in the Z-axis direction.

  (7) In the first embodiment, the angles θ1 and θ2 are acquired based on the image captured by the side view camera 13, but according to the present invention, the lower camera and the lower surface of the electronic component P are obliquely moved downward as the tilt detection means. The angles θ1 and θ2 may be acquired using a camera unit including an inclined camera that captures an image from Since the 3D sensor 220 according to the second embodiment is an embodiment of the camera unit, the description of the structure thereof is omitted. When the lower surface of the electronic component P is imaged using this camera unit, the shape of the electronic component P can be grasped in a three-dimensional manner. Based on this stereoscopic image, the X dimension in the X-axis direction of the lower surface of the electronic component P The Y dimension in the Y-axis direction and the Z dimension in the Z-axis direction can be calculated, and the angles θ1 and θ2 can be calculated based on these dimensions.

  (8) In the first embodiment, by rotating the head 41 by 90 °, the side surface side of the electronic component P is imaged from two different directions (X-axis direction and Y-axis direction), and correction is performed in each direction. However, according to the present invention, for example, the side surface of the electronic component P may be imaged from the Y-axis direction and only the X-axis direction may be corrected. Further, the rotation angle of the head 41 is not necessarily 90 °, and may be 60 °, for example.

(9) In Reference Example, as a measuring means, but illustrates a 3D sensor 220, obtains the height position data of the Z-axis direction using a laser height measuring device such as a meter measuring means, component recognition camera 12 Position data in the XY directions may be acquired based on the captured image by

(10) In Reference Example, but illustrates the mounting part P having a lead terminal T of QFP or the like, is also applicable to an electronic component having a lower electrode, such as B GA and CSP.

  (11) In this embodiment, the component transfer apparatus according to the present invention is applied to the surface mounters 10 and 210. However, according to the present invention, a component is used as an inspection socket for inspecting an IC component. You may apply to the component inspection apparatus called what is called an IC handler which carries sequentially.

Front view of the surface mounter of Embodiment 1 Plan view of the surface mounter Schematic showing how the electronic component is imaged from below by a component recognition camera Block diagram showing the electrical configuration of the surface mounter Flowchart showing an operation method for mounting an electronic component at a predetermined mounting position on the upper surface of the substrate by the surface mounter Schematic showing how the electronic component is mounted at a predetermined mounting position in consideration of mounting displacement in the X-axis direction Schematic showing how the electronic component is mounted at a predetermined mounting position in consideration of mounting displacement in the Y-axis direction Schematic showing how the electronic component of the reference example is imaged from below by a component recognition camera and a 3D sensor The side view which shows the state which looked at the internal structure of the 3D sensor from the side Schematic showing how the parallel light that has passed through the refractive lens is condensed at a linear condensing position The top view which showed a mode that each lead terminal row | line | column of the component for mounting was conveyed so that it might pass through a condensing position, and the position data of each lead terminal was acquired. Block diagram showing the electrical configuration of the surface mounter Flowchart showing an operation method for mounting an electronic component at a predetermined mounting position on the upper surface of the substrate by the surface mounter Schematic showing how to mount the mounting component at a predetermined mounting position in consideration of mounting displacement in the X-axis direction Schematic showing how the mounting components are mounted at a predetermined mounting position in consideration of mounting displacement in the Y-axis direction

Explanation of symbols

10, 210 ... Surface mounter (component transfer equipment)
11 ... Base 12 ... Parts recognition camera (downward camera)
13. Side view camera (side camera)
20. Conveyor (substrate transport means)
52 ... suction nozzle 70 ... controller (suction deviation calculation means, placed deviation calculating means, correction position calculating means, control equipment)
100 ... image processing unit (reference point position acquisition unit, Z dimension acquired hand stage)
B ... Printed circuit board C1 ... Center point of electronic component before mounting C2 ... Center point of electronic component after mounting P ... Electronic component (component for mounting)
V1 ... virtual surface V2 ... mounting surface X1 ... dimension in X-axis direction (predetermined dimension in XY plane)
Xa ... Suction displacement in the X-axis direction XU ... Upper limit allowable value for Xa Y1 ... Dimensions in the Y-axis direction (predetermined dimensions in the XY plane)
Ya ... Suction displacement in the Y-axis direction YU ... Upper limit allowable value of Ya Z0 ... Height of electronic parts (dimension in Z direction)
ΔX ... Mounting deviation amount in the X-axis direction ΔY ... Mounting deviation amount in the Y-axis direction θ1, θ2 ... An angle of the virtual surface (mounting surface) with respect to the upper surface of the substrate Upper limit allowable angle of θU ... θa

Claims (4)

When a plane that is substantially parallel to the horizontal plane is defined as an XY plane, and a direction that is orthogonal to the XY plane is defined as a Z direction, the rotation is approximately parallel to the Z axis extending in the Z direction. A suction nozzle that is provided so as to be rotatable about an axis and sucks an electronic component;
A lower camera that images the electronic component sucked by the suction nozzle from below;
An inclination detecting means for detecting an inclination of the electronic component with respect to the XY plane by imaging a side surface of the electronic component adsorbed by the adsorption nozzle from a predetermined direction in the XY plane by a side camera ;
By moving at least one of the substrate and the suction nozzle held so as to be substantially parallel to the horizontal plane, the suction nozzle can be moved relative to the substrate in the XY plane. A driving device;
Based on the captured image of the lower surface side of the electronic component captured by the lower camera, the position of the reference point in the XY plane on the virtual surface passing through the lower surface of the electronic component or the tip of the substrate contact electrode of the electronic component is acquired. Reference point position acquisition means for performing,
A suction deviation calculating means for calculating a suction deviation amount of the position of the reference point in the XY plane with respect to the suction nozzle;
The position of the reference point of the electronic component in an inclined state based on the inclination detected by the inclination detecting means in the XY plane and the XY of the reference point of the electronic component assumed to be placed on the upper surface of the substrate A placement deviation calculation means for calculating a placement deviation amount with respect to a position on a plane;
The XY-direction placement position of the suction nozzle with respect to the substrate is corrected based on the deviation amounts of both the suction deviation amount calculated by the suction deviation calculation unit and the placement deviation amount calculated by the placement deviation calculation unit. Correction position calculating means for calculating a correction position;
A control device that drives and controls the drive device based on the correction position calculated by the correction position calculation means ;
The tilt detection means captures the tilt of the electronic component before rotating 90 ° by capturing an image of the side surface of the electronic component with the side camera, and then rotates the suction nozzle by 90 °. Image the side of the electronic component to obtain the inclination of the electronic component after 90 ° rotation,
The correction position calculation means calculates the XY-direction placement position of the suction nozzle with respect to the substrate based on the inclination of the electronic component before 90 ° rotation and the inclination of the electronic component after 90 ° rotation before 90 ° rotation. component transfer device that be corrected each for both directions of direction and 90 ° after the rotation of the. The inclination detecting means acquires the inclination as an angle of a lower surface of the electronic component with respect to the upper surface of the substrate or an angle of the virtual surface with respect to the upper surface of the substrate, and the correction position calculating means is mounted on the upper surface of the electronic component. It comprises a Z-direction dimension acquisition means for acquiring the Z dimension in the location state, to claim 1 for calculating the corrected position based on said angle and the dimension in the Z direction obtained by the inclination detecting means The component transfer apparatus described. The reference point position acquisition means acquires the position of the center point in the captured image of the electronic component captured by the lower camera as the reference point, and the control device determines the center point in the captured image of the electronic component. If the deviation amount of the position and the position of the center point of the suction nozzle exceeds a predetermined deviation reference value, to claim 1 or claim 2 so as not to transfer the electronic component on the substrate top surface The component transfer apparatus described. 4. A surface mounter comprising a substrate transport unit on a base and mounting the electronic component on a substrate transported by the substrate transport unit by the component transfer apparatus according to any one of claims 1 to 3 .

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