JP6554800B2 - Electronic component mounting system and mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting system and mounting method, and more particularly to an electronic component mounting system and mounting method for mounting two or more electronic components on a substrate.

  For example, as shown in Patent Document 1 and Patent Document 2, various electronic component mounting systems and mounting methods for mounting electronic components on a substrate are known.

  However, with the conventional mounting system and mounting method, it has been difficult to mount a plurality of electronic components in a common mounting state on each planned mounting position such as a recess formed on the substrate. Conventionally, it has been sufficient to mount electronic components in alignment with each planned mounting position. However, depending on recent electronic devices, there are some products that cannot function as electronic devices unless the electronic components are mounted more uniformly.

JP 2002-233983 A JP 2010-283218 A

  The present invention has been made in view of such a situation, and an object of the present invention is to provide an electronic component mounting system and a mounting capable of mounting a plurality of electronic components in a more uniform mounting state at respective mounting positions. Is to provide a method.

In order to achieve the above object, an electronic component mounting system according to the present invention according to the present invention includes:
A measuring device having first measuring means for measuring an actual mounting position and / or mounting inclination of the first electronic component with respect to a first mounting planned position where the first electronic component is to be mounted;
Based on the actual mounting position data and / or the actual mounting inclination data of the first electronic component measured based on the measuring device, a second for mounting the second electronic component at the second mounting planned position of the substrate. A mounting apparatus.

The electronic component mounting method of the present invention includes:
A first measurement step of measuring an actual mounting position and / or mounting inclination of the first electronic component with respect to a first mounting planned position where the first electronic component is to be mounted;
The second electronic component is mounted at the second mounting planned position of the substrate based on the actual mounting position data and / or the actual mounting tilt data of the first electronic component measured based on the first measuring step. A mounting process.

  In the electronic component mounting system and mounting method according to the present invention, the second electronic component is placed at the second mounting planned position on the board based on the measured actual mounting position data and / or actual mounting tilt data of the first electronic component. Implement. For this reason, a plurality of electronic components can be mounted in a more uniform mounting state at each mounting position.

  The mounting system of the present invention may further include a first mounting device for mounting the first electronic component at the first mounting planned position on the substrate.

  The first mounting planned position and the second mounting planned position are not particularly limited. For example, the first scheduled mounting position may be a first recess formed on the surface of the substrate, and the second scheduled mounting position is formed on the surface of the substrate at a predetermined distance from the first recess. The second concave portion may be used.

  The measurement apparatus may include a second measurement unit that measures actual planned position data of the second planned mounting position. The mounting method of the present invention may further include a second measurement step of measuring actual planned position data of the second mounting planned position.

  Further, in the second mounting apparatus and the second mounting step, the second mounting schedule of the board is based on the actual mounting position data and / or the actual mounting tilt data of the first electronic component and the actual planned position data. The second electronic component may be mounted at a position.

  The mounting system of the present invention may further include a transport device for transporting the carrier on which the plurality of substrates are placed from the measuring device to the second mounting device.

  In the measuring device, the measuring instrument main body to which the first measuring means is attached and the transport device may be arranged so as to be relatively close to and away from each other along the direction perpendicular to the transport direction of the transport device. Preferably, the transfer device is arranged so as to move and be able to approach and leave the measuring device main body. Since measuring means is attached to the measuring instrument main body, it is possible to improve measurement accuracy if it is fixed without being moved.

  Preferably, the second mounting apparatus is configured to control the suction head that detachably holds the second electronic component based on actual mounting position data and / or actual mounting tilt data of the first electronic component and / or A control mechanism for controlling the control inclination;

  Preferably, in the second mounting step, based on the actual mounting position data and / or the actual mounting tilt data of the first electronic component, the control position of the suction head holding the second electronic component in a detachable manner and / or Control the control tilt.

FIG. 1 is a schematic configuration diagram of a mounting system according to an embodiment of the present invention. FIG. 2 is a schematic plan view showing a carrier flow in the measuring apparatus shown in FIG. FIG. 3A is a side view of the measuring apparatus shown in FIG. FIG. 3B is a side view of the measuring apparatus shown in FIG. 1 and shows a state in which the transport apparatus has moved relative to the measuring instrument main body from the state shown in FIG. 3A. FIG. 4 is a plan view showing an example of the carrier shown in FIG. FIGS. 5A to 5C are cross-sectional views taken along the line VV of the carrier shown in FIG. 4, and are diagrams showing the positional relationship between the carrier and the measuring means. FIG. 6 is an enlarged cross-sectional view of the substrate shown in FIGS. 5 (A) to 5 (C). FIG. 7 is a plan view of the substrate shown in FIG. FIG. 8 is a schematic view showing a method of measuring the position of the first electronic component by the lower camera shown in FIG. FIG. 9 is a schematic view of a suction head used in the second mounting apparatus shown in FIG. FIG. 10 is a schematic view showing a modification of the suction head shown in FIG.

Hereinafter, the present invention will be described based on embodiments shown in the drawings.
As shown in FIG. 1, an electronic component mounting system 2 according to an embodiment of the present invention includes a first mounting device 4, a measuring device 6, and a second mounting device 8. The first mounting device 4, the measuring device 6, and the second mounting device 8 are connected in this order along the X-axis direction, and the carrier 20 shown in FIG. 2 is transported along the X-axis direction. It is possible.

  In the drawing, the X axis, the Y axis, and the Z axis are perpendicular to each other, the X axis coincides with the main transport direction of the carrier 20 shown in FIG. 2, and the Z axis coincides with the height direction.

  As shown in FIG. 2, the measuring device 6 includes a transport device 10 and a measuring device main body 12. The transport apparatus 10 can transport the carrier 20 in the arrow X1 direction along the X-axis direction. The transport device 10 of the measuring device 6 is connected to the transport device (not shown) of the first mounting device 4 and the transport device (not shown) of the second mounting device 8 shown in FIG. The carrier 20 received from can be delivered to the second mounting device 8.

  Inside the measuring device 6, the measuring device main body 12 is arranged next to the transport device 10 in the Y-axis direction, and as shown in FIGS. 3A and 3B, at the lower end of the measuring device main body 12 in the Z-axis direction. The stage driving means 14 is mounted. The stage drive means 14 moves the drive shaft 14a in the Y-axis direction, for example, so that the stage 10a of the transport device 10 connected to the drive shaft 14 is relatively moved in the Y-axis direction with respect to the measuring instrument main body 12. It is configured to be able to approach and separate.

  As shown in FIG. 3B, the measuring device main body 12 includes an autocollimator 15 and a lower camera 16 so as to be opposite to each other in the Z-axis direction with the carrier 20 interposed therebetween. Further, as shown in FIGS. 5A to 5C, the measuring device body 12 is provided with an upper camera 17 that is separated from the autocollimator 15 by a predetermined distance in the X-axis direction. 3A and 3B, the upper camera 17 is not shown.

  As shown in FIG. 3B, when the stage 10 a of the transport device 10 is relatively approached in the Y-axis direction with respect to the measuring instrument main body 12, it is arranged on the stage 10 a in the measuring region 12 a of the measuring instrument main body 12. The carrier 20 is located. The measurement described later is performed on the carrier 20 located in the measurement region 12a.

  As shown in FIG. 4, a plurality of substrates 30 are arranged in a matrix, for example, on the upper surface in the Z-axis direction of the carrier 20. In this embodiment, four and three substrates 30 are alternately arranged in the Y-axis direction along the X-axis direction, but this arrangement method is not particularly limited. In any case, in the carrier 20 transported from the first mounting apparatus 4 shown in FIG. 1 to the transport position P1 shown in FIG. 2, only the first electronic component 40a is mounted on each substrate 30, and FIG. The second electronic component 40b shown in FIG.

  The substrate 30 is not particularly limited, and examples thereof include a glass ceramic substrate, a resin substrate, and a flexible substrate on which wiring is performed.

  As shown in FIGS. 5A and 6, at least the first recess 32a and the second recess 32b are formed on each substrate 30, but other recesses may be formed. On the carrier 20 sent to the measuring device 6 shown in FIG. 2, the first electronic component 40a is already mounted in each first recess 32a in the first mounting device 4 shown in FIG. No electronic component is mounted on each second recess 32b. The second electronic component 40b shown in FIG. 9 is mounted on each second recess 32b by the second mounting device 8 shown in FIG.

  Examples of the first electronic component 40a and the second electronic component 40b include an image sensor (CMOS, CCD), a SAW filter, a crystal oscillator, and an LED. In the present embodiment, the effect is particularly great when the first electronic component 40a and the second electronic component 40b are the same type of electronic component. This is because there is a demand for mounting a plurality of electronic components of the same type on a substrate in a uniform mounting state.

  As shown in FIGS. 6 and 7, the substrate 30 is formed with a first substrate through hole 34a and a second substrate through hole 34b. As shown in FIG. 5A, the first substrate through hole 34a and the second substrate through hole 34b can communicate with the first carrier through hole 22a and the second carrier through hole 22b, respectively.

  A plurality of substrates 30 are installed on the carrier 20, and the first substrate through hole 34a and the second substrate through hole 34b communicate with the first carrier through hole 22a and the second carrier through hole 22b, respectively. ing.

  As shown in FIGS. 3B and 8, the lower camera 16 can be disposed directly or together with an optical member 16 a such as a prism or a reflecting mirror below the carrier 20 in the Z-axis direction, and the through holes 22 a and 34 a. Thus, the relative position of the first electronic component 40a with respect to the first recess 32a can be measured. In the present embodiment, the relative position of the second electronic component 40b with respect to the second recess 32b is not measured through the through holes 22b and 34b shown in FIG. However, in the second mounting apparatus 8 shown in FIG. 1, similarly, after the second electronic component 40b is mounted in the second recess 32b, the relative position of the second electronic component 40b with respect to the second recess 32b can be measured. is there.

  In the drawings, the through holes 22a, 22b, 34a, 34b are drawn relatively small, but the size is not particularly limited. Further, in order to measure the relative position (X, Y coordinate) of the first electronic component 40a with respect to the first recess 32a through the through holes 22a and 34a, the through hole 34a is formed on the lower surface in the Z-axis direction of the first electronic component 40a. An electronic functional surface such as a positioning mark or a sensor surface that can be observed through is formed.

  The through hole 34a is previously positioned with respect to the recess 32a. Therefore, the actual mounting position (X, Y coordinates) of the first electronic component 40a with respect to the first recess 32a is measured by imaging the lower surface in the Z-axis direction of the first electronic component 40a with the lower camera 16 through the through hole 34a. can do. Data relating to the actual mounting position (X, Y coordinates) of the first electronic component 40a with respect to the first recess 32a measured by the lower camera 16 is sent to the control device of the second mounting device 8 shown in FIG.

  Further, as shown in FIGS. 3B and 5A, the actual mounting inclinations θxy, θxz, and θyz of the first electronic component 40a with respect to the first recess 32a are measured by the autocollimator 15 of the measuring device main body 12. The mounting inclination θxy is an inclination in the XY axis plane of the first electronic component 40a with respect to the first recess 32a, and the mounting inclination θxz is in the XZ axis plane of the first electronic component 40a with respect to the first recess 32a. The mounting inclination θyz is an inclination in the YZ axis plane of the first electronic component 40a with respect to the first recess 32a. Data on the actual mounting inclinations θxy, θxz, and θyz of the first electronic component 40a with respect to the first recess 32a measured by the autocollimator 15 is sent to the control device of the second mounting device 8 shown in FIG.

  As shown in FIGS. 5A to 5C, the upper camera 17 is attached to the measuring device main body 12 at a predetermined distance from the autocollimator 15 in the X-axis direction. In the present embodiment, the lower camera 16 is arranged between the autocollimator 15 and the upper camera 17, but the arrangement relationship is not particularly limited.

  In the upper camera 17, as shown in FIG. 5C, the XY coordinate position of the second recess 32b or the XY coordinate position of the second substrate through hole 34b is measured. Data relating to the second mounting scheduled position relating to the XY coordinate position of the second recess 32b or the XY coordinate position of the second substrate through hole 34b is sent to the control device of the second mounting device 8 shown in FIG.

  As shown in FIG. 2, inside the measuring device 6, the carrier 20 is transported inside the measuring device in the order of transport positions P 1 → P 2 → P 3. At the transport position P1, the carrier 20 transported from the first mounting device 4 shown in FIG. 1 to the inside of the measuring device 6 is first positioned. Here, the carrier 20 is identified by the 2D reader 11. Each carrier 20 is assigned an identification code, and the 2D reader 11 reads the identification code to identify the carrier to be measured.

  In addition, it is preferable to cool the carrier 20 at the transport position P1. For example, the substrate 30 shown in FIG. 4 is cooled by cooling the carrier 20 with a cooling table installed on the stage 10 a of the transport apparatus 10. The carrier 20 (the transfer position P1 shown in FIG. 2) that is transferred in a heated state in the first mounting apparatus 4 shown in FIG. 1 is heated.

  Therefore, when the movement to the measuring instrument main body 12 and natural cooling proceed in the measuring instrument main body 12, the measurement accuracy is affected by thermal deformation of components (such as the carrier 20, the substrate 30 and the first electronic component 40a shown in FIG. 4). There is a fear. Therefore, by cooling in advance in the measurement introduction process at the transfer position P1 shown in FIG. 2, it is possible to suppress the movement to the measurement process and the thermal deformation of the parts in the measurement process, and ensure high measurement accuracy. Is possible.

  At the measurement position P2, as shown in FIGS. 3A to 3B, the stage driving unit 14 is driven, and the stage 10a of the transport apparatus 10 approaches the measuring instrument body 12 relatively in the Y-axis direction. Therefore, the carrier 20 arranged on the stage 10a is located in the measurement region 12a of the measuring instrument main body 12.

  The carrier 20 can move in the X-axis and Y-axis directions with respect to the measuring device main body 12. For example, at the transport position P21 shown in FIG. 2, as shown in FIG. 5A, the mounting inclination of the first electronic component 40a mounted on the first recess 32a of the specific substrate 30 on the carrier 20 is changed to an autocollimator. 15 is measured. As described above, the data related to the actual mounting inclinations θxy, θxz, and θyz of the first electronic component 40a with respect to the first recess 32a measured by the autocollimator 15 is sent to the control device of the second mounting device 8 shown in FIG. It is done.

  Next, at the transport position P22 shown in FIG. 2, as shown in FIG. 5B, the carrier 20 is moved in the X-axis direction with respect to the measuring instrument body 12, and measurement is performed in the process shown in FIG. The mounting collimation of the first electronic component 40a mounted in the first recess 32a is measured by the autocollimator 15 on the substrate 30 adjacent to the substrate 30 in the X-axis direction. Data on the measured actual mounting inclinations θxy, θxz, and θyz is sent to the control device of the second mounting device 8 shown in FIG.

  Next, at the transport position P23 shown in FIG. 2, as shown in FIG. 5C, the carrier 20 is further moved in the X-axis direction with respect to the measuring instrument main body 12, and the process shown in FIG. With respect to the same substrate 30 as the measured substrate 30, the upper camera 17 is used to measure the XY coordinate position of the second recess 32b or the XY coordinate position of the second substrate through hole 34b. Data relating to the second mounting scheduled position relating to the XY coordinate position of the second recess 32b or the XY coordinate position of the second substrate through hole 34b is sent to the control device of the second mounting device 8 shown in FIG.

  After the measurements shown in FIGS. 5A to 5C are performed on all the substrates 30 on the carrier 20 shown in FIG. 4, the stage driving unit 14 is moved as shown in FIGS. 3B to 3A. The stage 10a is pulled away from the measuring instrument main body 12 in the Y-axis direction. If it demonstrates in FIG. 2, the carrier 20 will return the conveyance position P2 from the conveyance position P22. Thereafter, the carrier 20 is transported along the X-axis direction by the transport device 10 and moved to the transport position P3. The carrier 20 in the measuring device 6 is moved from the transport position P3 to the second mounting device 8 shown in FIG.

  The above-mentioned data for each board may be stored in the memory for each carrier 20, and the data may be sent to the control device of the second mounting apparatus 8 shown in FIG. 1 for each carrier. Alternatively, the above-described data for each substrate is stored in the storage device in a lump for each carrier, and the control device of the second mounting device 8 stores the second electronic component when mounting on the specific substrate 30. Data for each board may be taken out from the apparatus, and the second electronic component 40b may be mounted in the second recess 32b of the board 30 according to the data.

  As shown in FIG. 9, the second mounting apparatus 8 has a suction head 80. A suction portion 82 is attached to the lower end of the suction head 80 in the Z-axis direction, and the second electronic component 40b can be detachably held therein. In the second mounting apparatus 8, a tilt stage 84 is mounted on the upper part of the suction head 80.

  The tilt stage 84 can adjust the inclination θxz in the XZ plane and the inclination θyz in the YZ plane of the second electronic component 40b held by the suction unit 82. In addition, an XY plane rotation mechanism is mounted in the middle of the suction head 80 or at a connection portion between the suction head 80 and the tilt stage 84, and the XY plane of the second electronic component 40b held by the suction portion 82 is attached. Can be adjusted.

  In the present embodiment, the XY coordinate position of the second electronic component 40b held in the suction portion 82, based on the data for each substrate 30 for each carrier 20 sent from the measuring device 6 to the second mounting device 8, The inclinations θxz, θyz, and θxy of each coordinate plane of the second electronic component 40b with respect to the second recess 32b or the second substrate through hole 34b are controlled.

  More specifically, on the same substrate 30, the mounting state of the first electronic component 40a mounted in the first recess 32a (the relative position and inclination of the first electronic component 40a in the first recess 32a), and Using the suction head 80, the mounting state of the second electronic component 40b mounted in the second recess 32b (relative position and inclination of the second electronic component 40b in the second recess 32b) is equalized. The second electronic component 40b is mounted inside the second recess 32b.

  The suction head 80 shown in FIG. 9 is mounted on the substrate 30 so that the second electronic component 40b is mounted on the second recesses 32b of all the substrates 30 held on the carrier 20 shown in FIG. Can be moved relative to the carrier 20 holding the X axis along the three axes of the X, Y, and Z axes.

  In the electronic component mounting system 2 and the mounting method of the present embodiment, based on the measured actual mounting position data (for example, XY coordinates) and / or actual mounting inclination data θxy, θxz, θyz of the first electronic component 40a, The second electronic component 40 b is mounted in the second recess 32 b of the substrate 30. For this reason, it becomes possible to mount the plurality of electronic components 40a, 40b in the recesses 32a, 32b in a more uniform mounting state.

  Moreover, in this embodiment, as shown to FIG. 3A and 3B, the conveying apparatus 10 moves and it has arrange | positioned so that the measurement instrument main body 12 can approach and leave | separate. Since measuring means such as an autocollimator 15, a lower camera 16, and an upper camera 17 are attached to the measuring instrument main body 12, the measurement accuracy can be improved if the measuring instrument body 12 is fixed without being moved.

  The second mounting apparatus 8 controls the control position and / or control tilt of the suction unit 82 of the suction head 80 based on the actual mounting position data and / or actual mounting tilt data of the first electronic component 40a. As a result, in the same mounting state as the first electronic component 40a mounted in the first recess 32a of the same substrate 30, the second electronic component 40b held in the suction portion 82 is moved into the second recess 32b. Can be implemented.

  The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.

  For example, as shown in FIG. 10, the tilt stage 84 a connected to the suction head 80 of the second mounting apparatus 8 may be disposed at an oblique position, not directly above the suction head 80 in the Z-axis direction. Arranging at an oblique position contributes to a compact device. The function of the stage 84a is the same as that of the tilt stage 84 shown in FIG.

  Further, the first mounting planned position and the second mounting planned position are not particularly limited. For example, the first mounting planned position may be a flat surface or a convex portion formed on the surface of the substrate 30, or The second mounting planned position may also be a flat surface or a convex portion formed on the surface of the substrate 30.

  Further, the actual mounting inclinations θxy, θxz, and θyz of the first electronic component 40a with respect to the first recess 32a may be measured by a sensor other than the autocollimator 15. The sensor may be a device capable of measuring the actual mounting relative position of the first electronic component 40a with respect to the first recess 32a in addition to the inclination. In that case, the lower camera 16 may be omitted.

  Furthermore, the upper camera 17 shown in FIGS. 5A to 5C is disposed near the X-axis direction of the autocollimator 15, and the inclination of the first electronic component 40 a is set to the autocollimator 15 with respect to the same substrate 30. Simultaneously with the measurement, the upper camera 17 may be photographed to measure the position of the second recess 32b. Further, photographing with the lower camera 16 may be performed simultaneously. Further, it is not always necessary to perform the measurement in the order shown in FIGS. 5A to 5C, and the order may be changed as appropriate.

  Further, the upper camera 17 may not directly measure the coordinate position of the second recess 32b or the second substrate through hole 34b. For example, as shown in FIG. 7, the position detection mark 36 formed around the second recess 32b on the surface of the substrate 30 is imaged by the upper camera 17, and the second recess 32b in which the second electronic component 40b is to be mounted. Alternatively, the coordinate position of the second substrate through hole 34b may be measured.

  Furthermore, the electronic component mounting method performed inside the first mounting device 4 and the second mounting device 8 is not particularly limited, and examples thereof include wire bonding and flip chip bonding, and preferably flip chip bonding. . Moreover, it is preferable that the mounting method of the electronic component performed inside the 1st mounting apparatus 4 and the 2nd mounting apparatus 8 is the same mounting method. The mounting state of the first electronic component 40a with respect to the first recess 32a of the substrate 30 performed inside the first mounting device 4 and the second electronic component with respect to the second recess 32b of the substrate 30 performed inside the second mounting device 8 This is because it is easy to make the mounting state of 40b the same.

2 ... Electronic component mounting system 4 ... First mounting device 6 ... Measuring device 8 ... Second mounting device 10 ... Conveying device 10a ... Stage 12 ... Measuring instrument body 12
12a ... Measurement area 14 ... Stage drive means 14a ... Drive shaft 15 ... Autocollimator (first measurement means)
16 ... Lower camera (first measuring means)
17 ... Upper camera (second measuring means)
20 ... Carrier 22a ... First carrier through hole 22b ... Second carrier through hole 30 ... Substrate 32a ... First recess (first mounting planned position)
32b ... 2nd recessed part (2nd mounting plan position)
34a ... first substrate through hole 34b ... second substrate through hole 36 ... position detection mark 40a ... first electronic component 40b ... second electronic component 80 ... suction head 82 ... suction part 84, 84a ... tilt stage

Claims (16)

A measuring device having first measuring means for measuring at least an actual mounting inclination of the first electronic component with respect to a first mounting planned position of a substrate on which the first electronic component is to be mounted;
An electronic component comprising: a second mounting device for mounting the second electronic component at a second mounting planned position of the substrate based on actual mounting inclination data of the first electronic component measured based on the measuring device; Implementation system. The electronic component mounting system according to claim 1, further comprising a first mounting device for mounting the first electronic component at a first mounting planned position of the substrate. The first mounting planned position is a first recess formed on the surface of the substrate,
3. The electronic component mounting system according to claim 1, wherein the second mounting scheduled position is a second recess formed on the surface of the substrate at a predetermined distance from the first recess. The first measuring means further measures an actual mounting position of the first electronic component with respect to the first mounting planned position,
4. The electronic component mounting system according to claim 1, wherein the measuring device includes a second measuring unit that measures actual planned position data of the second planned mounting position. 5.   In the second mounting apparatus, the second electronic component is placed at the second planned mounting position of the substrate based on the actual mounting position data and actual mounting tilt data of the first electronic component and the actual planned position data. The electronic component mounting system according to claim 4 to be mounted.   The electronic component mounting system according to claim 1, further comprising a transport device for transporting a carrier on which a plurality of substrates are held from the measurement device to the second mounting device.   In the measuring apparatus, the measuring instrument main body to which the first measuring means is attached and the transport apparatus are disposed so as to be relatively close to and away from each other along a direction perpendicular to the transport direction of the transport apparatus. The electronic component mounting system according to claim 6.   The second mounting device controls a control position and a control tilt of a suction head that detachably holds the second electronic component based on actual mounting position data and actual mounting tilt data of the first electronic component. The electronic component mounting system according to claim 4, further comprising a control mechanism configured to perform the control. A first measurement step of measuring at least an actual mounting inclination of the first electronic component with respect to a first mounting planned position of a substrate on which the first electronic component is to be mounted;
An electronic component having a second mounting step of mounting the second electronic component at a second mounting planned position of the substrate based on actual mounting inclination data of the first electronic component measured based on the first measuring step How to implement In the first measurement step, an actual mounting position of the first electronic component with respect to the first mounting planned position is further measured,
The electronic component mounting method according to claim 9, further comprising a second measurement step of measuring actual planned position data of the second planned mounting position.   In the second mounting step, based on the actual mounting position data and actual mounting tilt data of the first electronic component, and the actual planned position data, the second electronic component is placed at the second planned mounting position of the substrate. The electronic component mounting method according to claim 10, wherein the electronic component is mounted.   In the second mounting step, the control position and control tilt of the suction head that detachably holds the second electronic component is controlled based on the actual mounting position data and actual mounting tilt data of the first electronic component. The electronic component mounting method according to claim 10 or 11. First measurement means for measuring the actual mounting position and / or mounting inclination of the first electronic component with respect to the first mounting planned position of the substrate on which the first electronic component is to be mounted, and the second electronic component are mounted. A second measuring means for measuring actual planned position data of the planned second mounting planned position;
Based on the actual mounting position data and / or actual mounting tilt data of the first electronic component measured based on the measuring device, and the actual planned position data, the second electrons are placed at the second planned mounting position of the board. A second mounting device for mounting the component,
The first mounting planned position is a first recess formed on the surface of the substrate,
The second planned mounting position is a second recess formed on the surface of the substrate,
Based on the measured data relating to the actual mounting position and / or the actual mounting inclination of the first electronic component mounted in the first recess with respect to the first recess, and the actual planned position data, the first electronic component is mounted on the first recess. An electronic component mounting system for mounting the second electronic component on the second recess in the two mounting apparatus.   The substrate has a through hole positioned with respect to the first recess, and the first measuring means passes through the through hole and the actual mounting position of the first electronic component with respect to the first recess. The electronic component mounting system according to claim 13, wherein the electronic component mounting system is measured. A first measurement step of measuring an actual mounting position and / or mounting inclination of the first electronic component with respect to a first mounting planned position of a substrate on which the first electronic component is to be mounted;
A second measurement step of measuring actual planned position data of the second mounting planned position of the board on which the second electronic component is to be mounted;
Based on the actual mounting position data and / or actual mounting inclination data of the first electronic component measured based on the first measurement step, and the actual planned position data measured based on the second measurement step, A second mounting step of mounting a second electronic component at a second mounting planned position of the substrate,
The first mounting planned position is a first recess formed on the surface of the substrate,
The second planned mounting position is a second recess formed on the surface of the substrate,
Based on the measured data related to the actual mounting position and / or the actual mounting inclination of the first electronic component mounted in the first recess with respect to the first recess, the second recess in the second mounting step. A mounting method of an electronic component for mounting the second electronic component on the device.   The substrate is formed with a through hole positioned with respect to the first recess, and the first measurement step is performed through the through hole to actually mount the first electronic component with respect to the first recess. The electronic component mounting method according to claim 15, wherein the electronic component is measured.

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