JP2007214212A - Method, program and device for packaging state determination and packaging method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To determine, for example, whether components have been placed appropriately without generating cycle time losses. <P>SOLUTION: The packaging state determination method applied to a component packaging apparatus for packaging components on a substrate includes: an imaging step for placing the components on the substrate (S501-S504), and then imaging the packaging state of the components (S506) until a nozzle for holding the components starts to rise (S505) and reaches the upper limit; and a packaging determination step for determining whether the packaging state is appropriate, based on an image obtained in the imaging step (S508). <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a mounting state determination method applied to a component mounter that mounts a component on a board, and more particularly, to a method capable of confirming the mounting state of a component in real time.

  Conventionally, in order to inspect and confirm the mounting state such as the positional accuracy of parts mounted on a board by a component mounting machine and the presence or absence of missing parts, an inspection device arranged downstream of the component mounting machine in a mounting line has been used. ing. In this case, the component mounter mounts the components on the board carried into the mounting line, the board on which all the components are mounted is carried into the inspection device located downstream, and the inspection of the mounting state is performed in the inspection device. Is called.

  In such a conventional method, in order to grasp the permanent occurrence of a shortage or misalignment, a large number of substrates must be applied to the inspection device and processed statistically, and measures against shortage and misalignment can be taken. By the time of taking, many defective substrates are generated, and the yield deteriorates.

  Furthermore, in recent years, the number of high-mix, low-volume production mounting sites has increased from the mass production mounting sites, and this has further progressed, and small lot production has been carried out to produce different types of substrates one after another. . In this case, when it is determined that the mounting state is defective in the inspection apparatus as described above, the upstream component mounter has already finished the production of the corresponding lot, and the next different board has been produced. In order to re-produce the substrate on which the defect has occurred, it is necessary to wait for the production of the currently produced lot to be completed, and to re-produce after implementing the setup change of the mounting machine.

Therefore, in order to inspect and confirm the mounting state of the component mounted on the board as soon as possible, the camera is attached to the mounting head for mounting the component on the board, the component is mounted on the board, and then the mounting head is moved In other words, there is disclosed a technique for capturing an image of a mounted part and confirming a mounting deviation of the part (for example, Patent Document 1).
JP 2005-166769 A

  However, in the technique disclosed in Patent Document 1, in a state where the mounting head is moved to the mounting position and positioned, the component mounted by the camera cannot be confirmed. In order to confirm the component mounted on the board, the mounting head must be moved from the mounting position to a position where the camera matches above the component. Therefore, if it is attempted to check misalignment of all the parts to be mounted, the mounting head must be moved to a position where the parts mounted with the camera can be imaged each time the parts are mounted. It takes a great deal of time to obtain a clean substrate. Also, after mounting all electronic components, if the mounting head is moved and imaging is performed for each mounted component, the mounting head can be moved efficiently until the mounting of all the components is completed. In addition, since a time for imaging is required, and during that time, mounting work cannot be performed by the component mounter, the time for producing a completed board becomes longer.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a mounting state determination method capable of confirming the mounting state of a component while suppressing an increase in time required for production of a mounting board.

  In order to achieve the above object, a mounting state determination method according to the present invention is a mounting state determination method applied to a component mounter that mounts a component on a board. An imaging step for imaging the mounting state of the component until the nozzle that has been held starts to rise and reaches an upper limit, and a mounting determination step for determining pass / fail of the mounting state based on an image obtained by the imaging step It is characterized by including.

  According to this method, after mounting the component on the board, the time until the nozzle reaches the upper limit, that is, the mounting state of the component using the so-called idle time of the component mounting machine not directly involved in mounting the component, or the nozzle Since the tip of the board can be imaged and the quality of the mounting state can be determined based on this image, it is possible to determine the mounting state for each mounting point while suppressing the lengthening of the time to produce the mounting board It becomes.

  In the present specification and claims, the “mounting state” is described as a concept including the state of the mounted component, the state where there is no component to be mounted, and the state of the nozzle tip. .

  In addition, “part mounting state” or simply “mounting state” refers to a state in which a component is correctly mounted, a component misalignment, or a mounting state different from a predetermined mounting state (so-called standing mounting, lead floating, etc. ) And the concept including a state where no parts are mounted.

  Preferably, in the imaging step, the mounting state is imaged in synchronism with the rise of the nozzle, or the mounting state of the component and the tip of the nozzle are imaged simultaneously.

  According to these methods, since the image of the mounting state of the component and the image of the tip of the nozzle can be obtained, the causal relationship between the mounting state of the component and the state of the tip of the nozzle can be grasped. It is possible to contribute effectively to improvement.

  In the mounting determination step, whether the mounting state is good or not may be determined before the nozzle reaches the upper limit.

  According to this method, since it is possible to determine the mounting state using the time when the nozzle of the component mounting machine rises, information for immediately responding to the occurrence of a defect while suppressing an increase in production time It is possible to contribute effectively to provision.

  Further, in the imaging step, a plurality of images are captured in different imaging directions, and a position specifying step for specifying a mounting position of a component based on the plurality of images, and a mounting specifying step are specified in the position specifying step. And a deviation amount detecting step for detecting a deviation amount between a predetermined mounting position and a predetermined mounting position of the component.

  According to this method, not only the occurrence of deviation but also the deviation amount can be detected, so that accurate information for feedback can be provided.

  It should be noted that a mounting state determination program characterized by causing a computer to execute the steps described above can achieve the above-described object with the same operational effects as described above.

  In order to achieve the above object, a mounting state determination device according to the present invention is a mounting state determination device applied to a component mounting machine that mounts a component on a board. An imaging control means for imaging the mounting state of the component before the nozzle holding the component starts to rise and reaches the upper limit, and a mounting determination for determining whether the mounting state is good or not based on the image obtained by the imaging step Means.

  Even with such an apparatus, the same effects as described above can be achieved.

  By confirming the mounting state by using the time during which the nozzle for mounting the component on the board rises, it is possible to improve the yield while suppressing an increase in the production time.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an external perspective view showing a component mounting machine 100 according to an embodiment of the present invention with a part cut away.

  A component mounting machine 100 shown in the figure is an apparatus that can be incorporated into a mounting line. The electronic component is mounted on a substrate received from upstream, and the mounting substrate, which is a substrate on which a predetermined number of electronic components are mounted, is disposed downstream. It is a sending device. The component mounting machine 100 includes a suction nozzle that holds an electronic component by vacuum suction, a multi-mounting head 110 that includes a plurality of mounting heads that can transport and mount the sucked and held electronic component, and the multi-mounting head. An XY robot 113 that moves 110 in a horizontal plane direction and a component supply unit 115 that can sequentially supply a large amount of electronic components are provided.

  Specifically, the component mounting machine 100 is a micro component, a connector, a large electronic component of 10 mm square or more, a deformed component such as a switch / connector, an IC component such as a QFP (Quad Flat Package) or BGA (Ball Grid Array). This is a high-speed multi-function machine capable of mounting various electronic components such as the above onto the substrate 120 at high speed. This embodiment shows an embodiment of the present invention, and the term “high-speed multi-function device” described here also indicates an example of “component mounter” described in the claims. This is only what is specifically described. That is, the term “component mounter” should be interpreted widely, and at least a device (machine) that mounts components on a board is included in “component mounter”.

FIG. 2 is a plan view showing the main configuration of the component mounter 100.
The component mounting machine 100 further includes a nozzle station 119 that stores a replacement suction nozzle that can be interchangeably attached to the multi-mounting head 110 (see FIG. 3) in order to support various types of component types, and the conveyance of the substrate 120. If the rail 121 that constitutes the track for use, the mounting table 122 on which the transported substrate 120 is placed and the electronic component is mounted, and the electronic component before mounting that is sucked and held by the suction nozzle are defective, the component And a recognition device 124 that captures an electronic component held by the suction nozzle before mounting and provides an image for image analysis.

  The recognizing device 124 captures an image of the electronic component before being attached and held by the suction nozzle, and shifts in the X, Y, and θ directions of the electronic component with respect to the suction nozzle from the position of the suction nozzle and the captured image of the electronic component. It is a device that acquires. The component mounter 100 according to the present embodiment, as the recognition device 124, irradiates the electronic component with a CCD camera-type recognition device 124a that captures an electronic component and obtains an image from below the electronic component before mounting. And a line sensor type recognition device 124b that obtains a stereoscopic image from below the electronic component before being mounted from the reflected light.

  The component supply unit 115 is provided before and after the component mounting machine 100, and a component supply unit 115a in which a number of tape feeders that sequentially supply the electronic components that are arranged and held in a row on a long tape are arranged side by side. And a component supply unit 115b for supplying electronic components stored in a matrix in the plate.

FIG. 3 is a perspective view showing the multi mounting head 110.
As shown in the figure, the multi mounting head 110 includes a plurality of mounting heads, and each mounting head includes a suction nozzle 111. In addition, mounting point cameras 101 for imaging the mounting state of the mounted electronic component 300 are attached to both sides of the multi mounting head 110.

  In the section of the best mode for carrying out the invention, the term “mounting point camera” is used to distinguish it from the camera in the recognition device 124. That is, the word “mounting point” does not include the intention of limiting the present invention, and merely has a meaning as a camera for imaging the vicinity of the mounting point or directly above the mounting point.

  The suction nozzle 111 is a member that holds an electronic component by vacuum suction and can freely move up and down. In addition, the tip of the suction nozzle 111 is made of metal, and the tip surface of the suction nozzle 111 is coated with a cemented carbide or the like with a cemented carbide to prevent wear due to contact with an electronic component. Is given.

  The mounting point camera 101 is a digital camera including an imaging element such as a CCD or a CMOS and a lens, and is attached to the multi mounting head 110 via a camera holder 102.

  The camera holder 102 is provided with a drive unit including a drive source and a drive mechanism inside, so that the mounted mounting point camera 101 can be swung or rotated by control from the outside. It has become.

  4A is a side view of the multi mounting head 110, FIG. 4B is a bottom view of the multi mounting head 110, and FIGS. 4C and 4D are enlarged top views of the electronic component 300. FIG. FIG.

  The two mounting point cameras 101 attached to both sides of the multi-mounting head 110 are swung by a driving unit provided in the camera holder 102 as shown in FIG. The camera can be imaged even when the camera is attached.

  Further, as shown in FIG. 4B, the two mounting point cameras 101 are not arranged on the line L1 with respect to the suction nozzles 111 arranged on the straight line L1, and the line L1 on which the suction nozzles 111 are arranged. And a line L2 connecting the two mounting point cameras 101 are arranged so as to intersect.

  Further, in the two mounting point cameras 101, an intersection P that is an intersection of L1 and L2 exists between the two mounting point cameras 101, and exists at the suction nozzle 111 at one end and at the other end. It arrange | positions so that it may exist between the suction nozzles 111 to be.

  Thereby, the electronic component 300 can be imaged at different angles (in a horizontal plane).

  That is, for example, when the electronic component 300 is assumed to be a rectangular parallelepiped and is mounted in a state where one side of the rectangular parallelepiped is parallel to the line L1 in which the suction nozzles 111 are arranged, as shown in FIG. If two mounting point cameras 101 are arranged on the straight line with respect to the line L1 on which 111 is arranged, image information on the first surface, the third surface, and the fifth surface of the electronic component 300 can be obtained. Image information on the second surface and the fourth surface cannot be obtained or is difficult to obtain.

  On the other hand, as shown in FIG. 4D, when the electronic component 300 is imaged from different angles (in the horizontal plane) depending on the arrangement of the present embodiment, one of the two mounting point cameras 101 (left in the figure) is mounted. The point camera 101 images the first surface, the second surface, and the third surface of the electronic component 300, and the other (right in the drawing) mounting point camera 101 uses the first surface, the fourth surface, and the second surface of the electronic component 300. 5 planes can be imaged. Accordingly, since the image information of the electronic component that can be acquired at one time by the two mounting point cameras 101 increases, for example, it is possible to detect even if a defect occurs only on the second surface of the electronic component.

  However, when the electronic component 300 is a rectangular parallelepiped, when the electronic component 300 is mounted in a state in which one side of the rectangular parallelepiped is parallel to the line L2 connecting the two mounting point cameras 101, the state is similar to the state illustrated in FIG. Only the image information of the first surface, the third surface, and the fifth surface of the electronic component 300 can be acquired. However, in many cases, the electronic component 300 is generally mounted with the side of the electronic component 300 parallel or perpendicular to the line L1 on which the suction nozzles 111 are arranged. It is a preferable aspect to arrange two mounting point cameras 101.

  However, the above description does not deny that the suction nozzle 111 and the mounting point camera 101 are arranged on a straight line. When the suction nozzle 111 and the mounting point camera 101 are arranged on a straight line, it is not necessary to rotate the mounting point camera 101 in a horizontal plane, and it is only necessary to swing the mounting point camera 101 with only one axis.

FIG. 5 is a block diagram illustrating a functional configuration of the mounting state determination apparatus 200.
As shown in the figure, the mounting state determination device 200 is a computer that determines the quality of the mounting state while exchanging information with each mechanism unit 103 of the component mounting machine 100, and a camera control unit 201 as an imaging control unit. A position information acquisition unit 202, an image processing unit 203, and a determination unit 204.

  The camera control unit 201 acquires a signal indicating that the suction nozzle 111 is turned upward after the electronic component 300 is mounted on the substrate 120, and synchronizes with the signal or immediately after the acquisition of the signal, It is a processing unit that controls and performs imaging. Further, until the suction nozzle 111 reaches the upper limit, that is, until the signal indicating that the suction nozzle 111 is in the storage completion state in the multi-mounting head 110 is acquired, the mounting point camera 101 is imaged at the required angle for the required number of times. Can be made to do.

  In addition, the drive units in the two camera holders 102 attached to both sides of the multi-mounting head 110 are independently controlled, and the mounting point camera 101 is swung and rotated, so that two mounting points are provided. The camera 101 can be controlled to always face the vicinity of the mounting point. The camera control unit 201 also has a function of acquiring information about the swing angle and rotation angle of the mounting point camera 101 when the mounting state is imaged.

  The position information acquisition unit 202 is a processing unit that acquires position information in the horizontal plane of the suction nozzle 111 that is lowered from the mounting head and performs an operation for mounting the electronic component 300 on the substrate 120. The position information is acquired based on information from an encoder provided in the XY robot 113 and the position of the suction nozzle 111 in the multi-mounting head 110. The information may be information on a mounting point acquired by the component mounter 100 in advance.

  The image processing unit 203 is a processing unit that processes image information obtained from the mounting point camera 101 and distortion of the electronic component 300 imaged based on the swing angle, rotation angle, and the like of the mounting point camera 101 and combines the images. is there.

  The determination unit 204 is a processing unit that determines the quality of the mounting state based on the image processed by the image processing unit 203. Further, the determination unit 204 further has a function of analyzing the image and calculating the shift amount of the electronic component 300. A determination method and a deviation amount calculation method will be described later.

Next, an outline of a general component mounting operation in the component mounter 100 will be described.
First, the <1> multi-mounting head 110 is moved to above the component supply unit 115 and the desired electronic component 300 is sucked and held by each suction nozzle 111. Next, <2> the electronic component 300 is passed over the recognition device 124 and the holding state of the electronic component 300 is confirmed. Next, <3> the multi-mounting head 110 is sequentially moved so that each suction nozzle 111 is positioned above the mounting point, and the electronic components 300 held in order from the suction nozzle 111 positioned at the mounting point are moved down to lower the electronic component 300. Mounted on the substrate 120. <4> When the mounting of the electronic components 300 held by the multi mounting head 110 (maximum of four in this embodiment) is completed, the multi mounting head 110 heads to the component supply unit 115 to attract new electronic components 300. .

  The electronic component 300 is mounted on the substrate 120 by repeating the steps <1> to <4>. In this specification, a collection of parts transferred by the operations <1> to <4> or one operation thereof may be referred to as a “task”.

Next, a method for checking the mounting state will be described.
FIG. 6 is a flowchart showing the mounting state confirmation processing operation.

FIG. 7 is a side view showing an operation when the electronic component 300 is mounted on the board 120.
First, the multi-mounting head 110 that holds a predetermined number of electronic components 300 by the component supply unit 115 stops at a position above the mounting point on the substrate 120 while decelerating (S501, FIG. 7A).

  Next, the suction nozzle 111 starts to descend in order to mount the electronic component 300 on the substrate 120 (S502, FIG. 7B).

  Using the descending time of the suction nozzle 111, the field of view of each of the mounting point cameras 101 on both sides of the multi mounting head 110 is adjusted (S503). Specifically, in the state shown in FIG. 7B, the suction nozzle 111 located at the leftmost position of the multi-mounting head 110 is lowered to mount the electronic component 300 on the board 120. The camera control unit 201 controls the swing angle and rotation angle of the mounting point camera 101 so as to face (mounting point).

  Next, after the electronic component 300 comes into contact with the substrate 120, the suction nozzle 111 is raised while making the inside of the suction nozzle 111 positive (so-called blow) (S505, FIG. 7C).

  In synchronization with the rising timing, imaging is performed by the two mounting point cameras 101 (S506, FIG. 7C). Since the image obtained by the imaging is obtained in synchronization with the rising timing, the image of the electronic component 300 and the tip of the suction nozzle 111 is simultaneously captured. When the electronic component 300 is dropped while the multi-mounting head 110 is moving (S501), an image of the electronic component 300 may not be obtained.

  Next, using the time until the suction nozzle 111 reaches the upper limit, the image processing unit 203 combines the two images obtained by the mounting point camera 101 (S507), and mounts based on the image after the processing. Whether the state is good or bad is determined (S508). Details of the synthesis process and the determination process will be described later.

  As a result of the determination, if the mounting state is good (S508: G), the multi mounting head 110 moves for the next mounting or for the suction of a new electronic component 300.

  As a result of the determination, if the mounting state is bad (S508: NG), recovery processing is performed. Details of the recovery process will be described later.

Next, image composition processing performed by the image processing unit 203 will be described.
FIG. 8 is a diagram conceptually and schematically showing the image composition processing.

  For example, when a rectangular parallelepiped electronic component 300 is imaged by the mounting point camera 101, as shown in FIGS. 8A and 8B, distortion is caused by a difference in distance and angle between the mounting point camera 101 and the electronic component 300. Two images with different states are obtained.

  The image processing unit 203 detects the distance between the mounting point camera 101 and the electronic component 300 from the camera control unit 201 and the like, the swing angle and rotation angle of the mounting point camera 101 when the electronic component 300 is imaged, and the multi mounting head 110. The information of the positional relationship between the two mounting point cameras 101 given in advance according to the mounting state of the camera is acquired, and an image (see FIG. 8A) captured by one mounting point camera 101 based on these information and the other Two images are combined with an image captured by the mounting point camera 101 (see FIG. 8B). Further, in the synthesis, by analyzing two images having different distortion states in the same part of the electronic component 300, accurate three-dimensional image data of the electronic component 300 can be obtained (FIG. 8 ( c)).

  In FIG. 8C, the image of the combined electronic component 300 is shown as a view from one direction, but the combined image data includes information on each surface other than the back side of the electronic component 300. It is also possible to obtain images viewed from various angles.

  In this way, by combining images obtained from a plurality of directions, it is possible to eliminate an invisible region of the electronic component 300 at the mounting point (excluding the back side of the electronic component 300). In addition, since an accurate image of the electronic component 300 with corrected distortion can be obtained, it can be used for accurate determination of misalignment.

  That is, when the two mounting point cameras 101 simultaneously acquire images related to the mounting state from a plurality of angles, the position of the electronic component 300 can be acquired with high accuracy. Further, it is possible to detect a problem that occurs only on one surface of the electronic component 300. Furthermore, since a three-dimensional image can be obtained, it is possible to accurately detect problems such as standing and mounting.

  In addition, this embodiment shows one Embodiment of this invention, The point provided with the two mounting point cameras 101 described here, and the said effect based on it do not limit this invention.

  For example, even when a single mounting point camera 101 is provided in the component mounting machine 100, it is possible to determine whether the mounting state is good or not based on whether or not an electronic component is mounted (whether a missing item has occurred). . In addition, it is possible to detect standing mounting to some extent by comparing with an image of a normal mounting state of an electronic component given in advance. In addition, if there is a defect (such as an image having a luminance equal to or higher than a threshold) in the field of view of the mounting point camera 101, this can also be detected.

  Next, a description will be given of determination as to whether or not a mounting abnormality such as a state where the electronic component 300 is not mounted on the board 120 (hereinafter referred to as “out of stock”) has occurred.

FIG. 9 is a flowchart showing the mounting abnormality determination processing operation.
First, the determination unit 204 acquires processed image information from the image processing unit 203 (S901), and determines whether there is a component image in the image information (S902).

  When the determination unit 204 determines that the electronic component 300 is not present in the image, that is, a missing item (S902: N), a recovery process for attempting remounting or the like is performed.

  On the other hand, if it is determined that the electronic component 300 is present (S902: Y), then the state of the suction nozzle 111 is confirmed (S903).

  There is a portion with high brightness in the image of the tip of the suction nozzle 111 (determined that solder is attached to the tip of the suction nozzle 111), and the shape of the tip of the suction nozzle 111 is different from the usual (suction nozzle 111). Is detected) (S903: N), the information is transmitted (S905). Since the suction nozzle 111 in which a defect has occurred becomes a cause of defective mounting in the next process, the information is used to avoid this.

  Next, the mounting state of the electronic component 300 is determined (S904). The mounting state determination apparatus 200 acquires an image of the electronic component 300 in a normal mounting state in advance, and compares the image with the captured image, and has a portion with high luminance (the lead portion is captured). If it is determined that the cage lead float is attached), or if the shape is different (determined to be standing), an abnormality is determined (S904: N), and the abnormality processing is performed. Done.

  On the other hand, when it is determined that the wearing state is normal (S904: Y), a deviation amount is calculated.

  In the present embodiment, since the determination is performed based on the image of the three-dimensional electronic component 300, for example, even if an abnormality such as a lead lift occurs only on one surface (excluding the back surface) of the cubic electronic component 300. It is possible to determine abnormality.

  Next, calculation of the amount of misalignment performed by the determination unit 204 and determination of pass / fail of the mounting state based on the amount of misalignment will be described.

  FIG. 10 is a flowchart illustrating the calculation of the positional deviation amount performed by the determination unit 204 and the operation for determining the quality of the mounting state based on the deviation amount.

FIG. 11 is a diagram illustrating the positional relationship of the electronic component 300.
First, the determination unit 204 specifies the center (center of gravity) coordinates (x, y) (see FIG. 11C) of the electronic component 300 on the horizontal plane in the image information Q from the acquired image information (S101).

Next, based on the swing angles θ ₁ and θ _{2 of} the mounting point camera 101, the rotation angles φ ₁ and φ ₂ , and the position coordinates (X _H , Y _H ) of the multi mounting head 110 (FIG. 11A ( b)), the coordinates (X, Y) of the mounting point in the horizontal plane in the image information Q (see FIG. 11C) are specified (S102). Note that the coordinates (X, Y) of the mounting point in the horizontal plane are also the coordinates of the center position of the tip surface of the suction nozzle 111.

  Next, the shift amount of the electronic component 300 is calculated from the center coordinates (x, y) of the electronic component 300 and the coordinates (X, Y) of the mounting point (S103).

  Next, the deviation amount is compared with a threshold value which is an upper limit of a predetermined deviation amount (S104), and when the deviation amount exceeds the threshold value (S104: N), warning information is transmitted (S106). .

  On the other hand, when the deviation amount is within the threshold (S104: Y), the deviation amount and information indicating that the next processing is possible are transmitted (S105). The amount of deviation is subjected to statistical processing and used for position control feedback.

  According to the above-described method, whether or not the mounting state is good can be confirmed each time the electronic component 300 is mounted, and if a mounting failure occurs, recovery processing can be performed on the currently mounted substrate 120. It is possible to improve the yield by suppressing the generation of the defective substrate 120. In addition, since the state of the suction nozzle 111, which is one of the mounting states, can also be confirmed, it is possible to detect in advance the occurrence of a malfunction caused by using the suction nozzle 111 in the next process. Moreover, since the confirmation operation is performed as the suction nozzle 111 is raised, the above-described effect can be enjoyed without sacrificing tact time.

  In addition, by mounting the plurality of mounting point cameras 101 to capture the mounting state, it is possible to quantitatively acquire the mounting deviation of the electronic component 300 with respect to the mounting point on the substrate 120, and not only the mounting state is good but also feedback control. It is also possible to provide information to be provided to.

  Note that the number of images acquired by imaging may be singular. That is, the mounting point camera 101 may be single (any one). Even if a single image is obtained, it is possible to determine the shortage of the electronic component 300 (that is, the component being dropped by the multi-mounting head 110 or the component being taken home) depending on whether or not the electronic component 300 is reflected in the image. Because it can. In addition, it is possible to determine whether or not the solder has adhered to the nozzle tip based on the brightness of the nozzle tip.

Next, the recovery process will be described.
FIG. 12 is a flowchart showing the operation of the recovery process.

  First, the contents of the preset recovery process are confirmed (S201). The contents of the recovery process are (1) compliance with the mounting order, (2) compliance with the task order, (3) task reconstruction, and (4) postponement.

  (1) Compliance with the mounting order is a recovery processing method that does not change the order in which the electronic component 300 is mounted on the board 120. That is, when the determination unit 204 determines that the product is missing, the mounting of the next component is temporarily stopped (S202), and the multi-mounting head 110 is moved to the component supply unit 115 to suck the electronic component 300 that has become a missing product. The electronic component 300 is re-sucked (S203). In this case, another electronic component 300 may be held by the multi mounting head 110.

  Next, the sucked electronic component 300 is mounted again at the same mounting point, and then mounting is continued under the mounting conditions up to now (S204).

  This recovery process is particularly effective in high-density mounting (a mounting state in which the interval between adjacent electronic components 300 is very narrow). That is, in the case of high-density mounting, if the electronic components 300a are not mounted in order from the lowest height, the mounted electronic component 300b and the end surface of the suction nozzle 111 may interfere with each other as shown in FIG. This is because it is difficult to change the order.

  (2) Task order compliance is a recovery processing method in which the order in which electronic components are mounted on the board 120 is changed within a task. That is, if the determination unit 204 determines that the product is out of stock, the task in which the product is out of stock is executed to the end (S211). Next, the electronic component 300 that has become a shortage (or a plurality if a plurality of shortage occurs in the task) is sucked from the component supply unit 115, transported, and mounted (S212). Thereafter, the mounting is continued under the current mounting conditions (S213).

  This recovery process is suitable when the height of the electronic component 300 in the task is almost the same even in the high-density mounting as described above, and it is necessary to re-optimize the mounting conditions as described later. Since there is no, it is a simple process. In particular, when multiple missing items occur in the same task, the process for the multi mounting head 110 to reciprocate between the mounting position and the suction position can be integrated into one, reducing the time required for recovery processing. Can be made.

  (3) Task reconstruction is a recovery processing method that changes the order in which electronic components are mounted on the board 120 within a task or between subsequent tasks. That is, if the determination unit 204 determines that the product is out of stock, the task in which the product is out of stock is executed to the end (S205). On the other hand, at the stage where the missing item is determined, in the task after the task in which the missing item occurs, a condition for remounting the missing electronic component 300 is added to optimize the mounting condition (S206). Next, the mounting is continued according to the optimized new mounting condition (S207).

  Although this recovery process is a high-density mounting to some extent, it is effective when it can be changed if the mounting order is within a task or between subsequent tasks, and in the time until mounting on a single board 120 is completed. It is excellent in that it has almost no effect. That is, it is not necessary to separately reciprocate the multi-mounting head 110 between the board 120 and the component supply unit 115 due to the occurrence of a shortage, and time loss in tasks is unlikely to occur.

  (3) Post-rotation is a recovery process method in which the missing electronic component 300 is mounted after all the mounting processes under the existing mounting conditions are completed. That is, when the determination unit 204 determines that the product is out of stock, the state of the out of stock such as the type or mounting point of the missing electronic component 300 is stored (S208), and the mounting process is continued according to the existing mounting conditions ( S209) After the processing based on the mounting conditions is completed, the missing electronic component 300 is mounted (S210).

  This recovery process is an effective process for the board 120 that allows a significant change in the mounting order, and is a simple recovery processing method because there is no need to perform optimization during the mounting process.

  The plurality of recovery processes are selected according to the preset settings, but are not limited thereto. For example, it is determined whether or not the mounting order of the missing electronic component 300 can be changed. If the electronic component 300 or the mounting point cannot be changed, (1) adopt a mounting order compliant recovery processing method, If it is an electronic component 300 or a mounting point that should follow the task order, (2) Adhere to the task order or (3) Use a recovery method for task reconfiguration, otherwise (4) Adopt a later recovery process It doesn't matter. Further, these determination times are preferably immediately after the occurrence of a malfunction in the mounting state, and information indicating what processing is to be performed if a malfunction occurs may be added to the mounting conditions.

  Next, a modified example of the mounting point camera 101 will be described.

<Modification 1>
FIG. 14 is a side view showing a modified example of the mounting point camera 101.

  As shown in FIG. 5A, in the case of this modification, a plurality of mounting point cameras 101 are arranged beside the suction nozzle 111, and the mounting point cameras 101 image the vicinity of the mounting points.

  In the case of such a mounting point camera 101, the relative positional relationship and angle between the mounting point on which the electronic component 300 is mounted and the mounting point camera 101 are constant. Accordingly, since the positional relationship parameters used for removing distortion and synthesizing images captured by these mounting point cameras 101 are constant, computation by a computer is facilitated.

  Further, such a mounting point camera 101 is fixed to the multi-mounting head 110 that moves at a high speed and repeats rapid acceleration and deceleration. However, since there is no moving part, the mounting point camera 101 has high mounting stability. The reliability of the image obtained from the mounting point camera 101 is also high.

  In addition, if each mounting point camera 101 has a wide viewing angle and many cameras can capture one mounting point, a plurality of images can be obtained at the same time, and the accuracy of synthesis and the like can be improved. It becomes.

  Further, as shown in FIG. 5B, the mounting point camera 101 may be allowed to appear and disappear. In this case, in addition to the operations and effects described above, it is possible to clearly image the vicinity of the mounting point at a close distance.

<Modification 2>
FIGS. 15A and 15B are a rear view (a) and a side view (b) showing another modified example of the mounting point camera 101. FIG.

  As shown in the figure, in the case of this modification, the multi mounting head 110 includes eight suction nozzles 111, a first mounting point camera 101a, a second mounting point camera 101b, and a third mounting point. A camera 101c. The first mounting point camera 101a, the second mounting point camera 101b, and the third mounting point camera 101c are each slidable independently of the multi-mounting head 110. The first mounting point camera 101a, the second mounting point camera 101b, and the third mounting point camera 101c are each given a driving force by a driving device (not shown), and are independently slid positions. Can be controlled.

  The multi mounting head 110 includes a long hole R1 that serves as a guide for sliding the first mounting point camera 101a, a long hole R2 that serves as a guide for sliding the second mounting point camera 101b, and a third mounting point camera. A long hole R3 is provided as a guide for sliding the 101c.

  In the multi-mounting head 110, the long hole R1 that is the sliding range of the first mounting point camera 101a, the long hole R2 that is the sliding range of the second mounting point camera 101b, and the third mounting point camera 101c. The long hole R3 that is a sliding range extends along the longitudinal direction of the multi-mounting head 110, and is arranged at equal intervals and in parallel to each other.

  On the other hand, four of the suction nozzles 111 are arranged in a straight line along the longitudinal direction of the multi-mounting head 110 at equal intervals at intermediate positions between the long hole R1 and the long hole R2, respectively. The other four are arranged in a straight line along the longitudinal direction of the multi-mounting head 110 at equal intervals at intermediate positions between the long hole R2 and the long hole R3.

  When the mounting point camera 101a, the mounting point camera 101b, and the mounting point camera 101c are provided, the mounting point camera 101a, the mounting point camera 101b, and the mounting point camera 101c are independently slid, according to the component type. In addition, the mounting point camera 101a, the mounting point camera 101b, and the mounting point camera 101c can be arranged at optimum positions, and images can be taken in different imaging directions. In addition, while sliding the mounting point camera 101a, the mounting point camera 101b, and the mounting point camera 101c, the same mounting state can be captured a plurality of times in different imaging directions, thereby improving the accuracy of the obtained image and the total amount of information. It becomes possible.

  In the second modification, the multi mounting head 110 includes eight suction nozzles 111, a first mounting point camera 101a, a second mounting point camera 101b, and a third mounting point camera 101c. The first mounting point camera 101a, the second mounting point camera 101b, and the third mounting point camera 101c are slidable with respect to the multi-mounting head 110 independently of the first mounting point camera 101a. Is also merely an embodiment of the present invention. Accordingly, a single mounting point camera 101 provided in the multi-mounting head 110 may be provided, or four or more mounting point cameras 101 that slide may be provided.

<Modification 3>
FIG. 16 is a perspective view showing a main part of the rotary type component mounting machine 100.

  The rotary type component mounting machine 100 shown in the figure rotates a plurality of mounting heads 112 around a fixed shaft, and sucks the electronic component 300 from the component supply unit 115 at a predetermined position around the fixed shaft. This is a device for mounting the electronic component 300 on the substrate 120 at a position (position 180 degrees from the suction position in the figure). Therefore, the mounting position is constant, and the electronic component 300 is mounted while the substrate 120 moves in the horizontal plane.

  The mounting point camera attached to the rotary type component mounting machine 100 is attached to the tip of a camera holder 102 that extends in an inverted L shape from the main body of the component mounting machine 100 (not shown).

  Further, two mounting point cameras are provided with the suction nozzle 111 moving up and down to mount the electronic component 300, that is, with the mounting position interposed therebetween. The mounting point camera provided in the camera holder 102 can follow the up and down of the suction nozzle 111 or can move the viewpoint independently.

  When the mounting position is fixed as in the rotary type component mounting machine 100, the mounting point camera can also be fixed, and imaging can be performed in a stable state.

  If the apparatus configuration and method as described above are employed, the state of the electronic component 300 immediately after being mounted on the substrate 120 (including the state where the electronic component 300 is not present) affects the production time of the substrate 120. It is possible to monitor and judge directly from an image. Therefore, it is possible to directly perform a recovery process on the substrate 120 in which a shortage occurs, thereby reducing the number of substrates 120 on which mounting defects occur and improving the yield.

  In addition, in the said embodiment and its modification, although the mounting point camera 101 attached to the multi mounting head 110 and the mounting point camera 101 attached to the component mounting machine 100 main body were illustrated, this invention is these mounting points. It is not limited only to imaging with the camera 101. For example, the mounting point camera 101 may be attached to a device that follows the multi mounting head 110 without being directly attached to the multi mounting head 110. In other words, the mounting state of the component is imaged before the nozzle holding the component starts to rise and reaches the upper limit. For example, the component mounted on the mounting point while the suction nozzle 111 is raised can be imaged. If it is such, it will not specifically limit.

  The present invention is applicable to a component mounter, particularly a component mounter that mounts an electronic component on a circuit board.

1 is an external perspective view showing a component mounting machine according to an embodiment of the present invention with a part cut away. It is a top view which shows the main structures of a component mounting machine. It is a perspective view which shows a multi mounting head. (A) is a side view of the multi mounting head, (b) is a bottom view of the multi mounting head, and (c) and (b) are top views showing the electronic component 300 in an enlarged manner. It is a block diagram which shows the function structure of a mounting state determination apparatus. It is a flowchart which shows the confirmation processing operation of a mounting state. It is a side view which shows the operation | movement at the time of mounting an electronic component on a board | substrate. It is the figure which showed the composition process of the image notionally and typically. It is a flowchart which shows the determination processing operation | movement of mounting abnormality. It is a flowchart which shows the calculation operation of the positional deviation amount performed by the determination part, and the determination operation | movement of the mounting state based on the said deviation amount. It is a figure which shows the positional relationship of an electronic component. It is a flowchart which shows operation | movement of a recovery process. It is a figure which shows the interference state of an electronic component and a suction nozzle. It is a side view which shows the modification of a mounting point camera. (A) is a back view which shows the other modification of a mounting point camera, (b) is a side view. It is a perspective view which shows the principal part of a rotary type component mounting machine.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Component mounting machine 101 Mounting point camera 102 Camera holder 103 Mechanism part 110 Multi mounting head 111 Suction nozzle 113 XY robot 115 Component supply part 119 Nozzle station 120 Board | substrate 121 Rail 122 Mounting table 123 Component collection | recovery apparatus 124 Recognition apparatus 200 Mounting state determination Device 201 Camera control unit 202 Position information acquisition unit 203 Image processing unit 204 Determination unit 300 Electronic component

Claims (14)

A mounting state determination method applied to a component mounter for mounting a component on a board,
After mounting the component on the board, the imaging step of imaging the mounting state of the component until the nozzle holding the component starts to rise and reaches the upper limit;
And a mounting determination step of determining whether the mounting state is good or not based on an image obtained by the imaging step.   The mounting state determination method according to claim 1, wherein in the imaging step, the mounting state is imaged in synchronization with the rise of the nozzle.   The mounting confirmation method according to claim 1, wherein in the imaging step, the mounting state of the component and the tip of the nozzle are imaged simultaneously.   The mounting state determination method according to claim 1, wherein in the mounting determination step, whether the mounting state is good or not is determined before the nozzle reaches an upper limit. The mounting state determination method further includes:
A position specifying step for specifying a mounting position of the component based on the captured image;
2. The mounting state determination according to claim 1, wherein the mounting determination step includes a shift amount detection step of detecting a shift amount between the mounting position specified in the position specifying step and a predetermined component mounting position. Method.   The mounting state determination method according to claim 1, wherein in the mounting determination step, it is determined that the mounting state is NO when there is no component image in the image obtained in the imaging step.   The mounting state determination method according to claim 1, wherein in the mounting determination step, it is determined that the mounting state is negative when an image obtained by the imaging step includes an image of a nozzle and a component in a state of being sucked by the nozzle.   The mounting state determination method according to claim 1, wherein in the mounting determination step, it is determined that the mounting state is negative when the image obtained in the imaging step includes an image of a nozzle tip having a luminance of a predetermined value or more.   The mounting state determination method according to claim 1, wherein in the mounting determination step, the mounting state is determined to be negative when there is an image of a component different from an image given in advance as a component corresponding to the image obtained in the imaging step. .   The mounting state determination method according to claim 1, wherein in the mounting determination step, the mounting state is determined to be negative when there is an image of a component having a luminance of a predetermined value or more in the image obtained in the imaging step. A mounting state determination program applied to a component mounter for mounting a component on a board,
After mounting the component on the board, the imaging step of imaging the mounting state until the nozzle holding the component starts to rise and reaches the upper limit;
A mounting state determination program that causes a computer to execute a mounting determination step of determining whether a mounting state is good or not based on an image obtained by the imaging step. A mounting state determination device applied to a component mounting machine for mounting a component on a board,
After mounting the component on the board, until the nozzle holding the component starts to rise and reaches the upper limit, the imaging control means for imaging the mounting state of the component;
A mounting state determination apparatus comprising: mounting determination means for determining whether or not the mounting state is good based on an image obtained by the imaging step. A mounting method applied to a component mounter for mounting a component on a board,
After mounting the component on the board, until the nozzle holding the component starts to rise and reaches the upper limit, an imaging step of imaging the mounting state of the component;
A mounting determination step for determining that the image obtained by the imaging step is a missing item when there is no image of a component;
If the mounting determination step determines that the product is missing, the mounting of the component that falls in the next mounting order of the component that became the missing product is interrupted, and after mounting the missing component, the recovery is performed to mount the next component. A mounting method comprising: steps. A mounting method applied to a component mounter for mounting a component on a board,
After mounting the component on the board, until the nozzle holding the component starts to rise and reaches the upper limit, an imaging step of imaging the mounting state of the component;
A mounting determination step for determining that the image obtained by the imaging step is a missing item when there is no image of a component;
A storage step for storing a component that has become a shortage and a mounting point when it is determined as a shortage in the mounting determination step;
A mounting method comprising: a recovery step of mounting a missing part after completing a mounting process other than the missing part.

Images