JP2009170531A - Component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting device capable of further effectively suppressing occurrence of a failure by properly selecting a component sucking nozzle. <P>SOLUTION: This component mounting device 1 sucking a component with the component sucking nozzle 21 arranged in a movable head unit 6, and transporting and mounting the sucked component on a board P is provided with: a storage means 42b storing a predetermined priority value determined based on a suction failure rate in executing component mounting work by using a nozzle 21 within a plurality of nozzle candidates set on a component type basis; and a control means 41 determining the type of the nozzle 21 to be used based on the priority value stored in the nozzle data storage part 42b. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus that sucks a component by a component suction nozzle provided in a movable head unit, transports the sucked component, and mounts it on a substrate.

  Conventionally, as shown in Patent Document 1 below, in a component mounting method using a surface mounter that picks up a component by a movable head unit equipped with a component suction nozzle and mounts the component on a substrate, For each type, a plurality of types of nozzles capable of adsorbing that type of component are determined in advance, and the component is mounted by using the plurality of types of nozzles separately for one type of component.

More specifically, in the above-mentioned Patent Document 1, for each type of component, a plurality of types of nozzles that can adsorb that type of component are specified, and among these nozzles, the nozzle is first mounted on the substrate Nozzles that may interfere with components are excluded as nozzles with usage restrictions, and nozzles that are actually used are determined for each component.
JP 2007-142216 A

  By the way, as in the above-mentioned Patent Document 1, even when a nozzle that may interfere with a component previously mounted on a substrate is excluded from the nozzle candidates, depending on the type of nozzle, the component may be adsorbed. Since it is considered that there is a possibility that some kind of defect is likely to occur when this is mounted on a substrate, it is desirable to select the nozzle after removing such a nozzle. However, in the technique of the above-mentioned Patent Document 1, no measures are taken to meet such demands.

  The present invention has been made in view of the above circumstances, and provides a component mounting apparatus that can more effectively suppress the occurrence of defects by appropriately selecting a nozzle for component adsorption. For the purpose.

  In order to solve the above problems, the present invention provides a component mounting apparatus that sucks a component by a component suction nozzle provided in a movable head unit, transports the sucked component, and mounts it on a substrate. A memory for storing a predetermined priority value determined based on a defect occurrence rate when a component mounting operation is performed using the nozzles for a plurality of nozzle candidates set for each type of component. And a control means for determining the type of nozzle to be used based on the priority value stored in the storage means (claim 1).

  According to the present invention, the nozzle to be used is determined from the plurality of nozzle candidates based on the priority value of the nozzle determined based on the defect occurrence rate during the mounting operation. Unlike when nozzles are selected based on the presence or absence of interference, it is possible to more reliably perform operations such as component pick-up using the nozzles described above, and more effectively prevent defects during mounting operations. Can be suppressed. As a result, there is an advantage that the component mounting operation can be performed more accurately and efficiently, and the quality of the board can be improved and the tact time can be shortened effectively.

  In the present invention, the storage means stores a result priority value determined based on a result value of a defect occurrence rate that is statistically obtained from a result when a component is actually mounted using a nozzle. The control means preferably determines the type of nozzle to be used on the basis of the result priority value stored in the storage means (claim 2).

  According to this configuration, it is possible to determine the nozzle to be used based on a more reliable priority value based on the actual use of the nozzle. Therefore, it is possible to more reliably suppress the occurrence of defects and more accurately and efficiently. There is an advantage that it is possible to perform mounting work of various parts.

  The storage means further stores a design priority value determined based on a failure occurrence rate expected from various design values related to the nozzle, and the control means stores the design priority value and the actual priority. It is preferable to determine the type of nozzle to be used based on the total priority value obtained from a predetermined arithmetic expression using the value.

  According to this configuration, it is possible to more appropriately determine the nozzle to be used based on the overall priority value of the nozzle set in a well-balanced manner from the viewpoints of design and actual use, and use that nozzle. Therefore, there is an advantage that the mounting work of the components can be performed more accurately and efficiently.

  As described above, according to the component mounting apparatus of the present invention, it is possible to provide a component mounting apparatus that can more effectively suppress the occurrence of defects by appropriately selecting the component suction nozzle. it can.

  FIG. 1 is a plan view schematically showing a component mounting apparatus according to an embodiment of the present invention. The component mounting apparatus 1 shown in the figure includes a surface mounter 2 for mounting various components on a substrate P, and data creation for creating a control program (hereinafter referred to as a mount program) for the surface mounter 2 The surface mounting machine 2 and the data creation machine 3 are electrically connected via a network line 4.

  FIG. 2 is a schematic front view showing the surface mounter 2 as a single unit. As shown in FIG. 2 and FIG. 1 above, a conveyor 12 is arranged on the base 10 of the surface mounter 2, and a printed circuit board P (hereinafter simply referred to as a board P) is provided by the conveyor 12. While being transported and stopped at a predetermined mounting work position (a position indicated by a two-dot chain line in FIG. 1), the substrate P stopped at the position is positioned and held by a clamp mechanism (not shown). In the following description, the conveyance direction of the substrate P by the conveyor 12 is the X axis direction, the direction orthogonal to the X axis on the horizontal plane is the Y axis direction, and the direction orthogonal to the X axis and the Y axis is the Z axis direction. To proceed.

  At two locations on the base 10 that sandwich the conveyor 12 from both sides in the Y direction, there are provided component supply sections 5 composed of multiple rows of tape feeders 5a for supplying components. Each tape feeder 5a has a tape in which small piece parts such as an IC, a transistor, and a capacitor are stored at a predetermined interval (supply pitch), a reel for deriving the tape, etc. As the parts in the tape are picked up by the unit 6, the tape is intermittently fed out by a reel.

  A head unit 6 for component mounting is provided above the base 10. The head unit 6 is supported so as to be movable in the X-axis direction and the Y-axis direction, and is configured to be able to move freely between the substrate P positioned at the mounting work position and the component supply unit 5. Yes.

  That is, on the base 10, a pair of fixed rails 7 extending in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed to support the head unit 6. The support member 11 is supported so as to be movable in the Y-axis direction along the fixed rail 7, and a nut portion 18 provided in the support member 11 is screwed with the ball screw shaft 8. The support member 11 is provided with a guide member 14 extending in the X-axis direction and a ball screw shaft 13 that is rotationally driven by an X-axis servo motor 15, and a nut portion that is screwed with the ball screw shaft 13. The head unit 6 having (not shown) is supported so as to be movable along the guide member 14 in the X-axis direction. Then, when the Y-axis servo motor 9 is operated and the ball screw shaft 8 is rotationally driven, the support member 11 is moved integrally with the head unit 6 in the Y-axis direction, and the X-axis servo motor 15 is operated. When the ball screw shaft 13 is rotationally driven, the head unit 6 is configured to move in the X-axis direction with respect to the support member 11.

  The head unit 6 is mounted with a plurality of mounting heads 20 for picking up components and mounting them on the substrate P. In this embodiment, the three mounting heads 20 are arranged in a row in the X-axis direction. It is mounted side by side.

  These mounting heads 20 are supported so as to be able to move in the Z-axis direction and rotate around the R-axis (nozzle center axis) with respect to the main body of the head unit 6, and use a servo motor (not shown) as a drive source. The elevating drive mechanism and the rotary drive mechanism are driven in the respective directions.

  The tip 21 of each mounting head 20 is provided with a component suction nozzle 21. Each nozzle 21 is connected to a negative pressure supply means (not shown). When a part is taken out from the tape feeder 5a, the negative pressure is supplied to the tip of the nozzle 21 from the negative pressure supply means. Adsorption is performed.

  The nozzle 21 is detachably attached to the mounting head 20 and is replaced with another nozzle 21 housed in a nozzle station 16 provided on the base 10 as necessary. It is like that. That is, the nozzle station 16 stores a plurality of types of nozzles 21 having different tip shapes and sizes, and the mounting head 20 is driven up and down while the head unit 6 is disposed above the nozzle station 16. Thus, the nozzle 21 is attached to and detached from the mounting head 20.

  On the base 10, a component recognition camera 17 is further provided for recognizing an image of the suction state of the component when the nozzle 21 of each mounting head 20 picks up the component from the component supply unit 5. . For example, as shown in FIG. 1, the component recognition cameras 17 are provided at two locations located between the conveyor 12 and the component supply units 5 on both sides thereof. When the head unit 6 passes above the component recognition cameras 17. In addition, the state of the component attracted to the tip of the nozzle 21 is picked up by the component recognition camera 17 from below.

  In the surface mounter 2 configured as described above, for example, the component mounting operation proceeds as follows.

  First, the head unit 6 moves above the component supply unit 5, and components are removed from the tape feeder 5 a by each mounting head 20. Specifically, when the predetermined mounting head 20 to which the component is to be sucked moves up and down above the predetermined tape feeder 5a, the component accommodated in the tape feeder 5a becomes the nozzle 21 of the mounting head 20. It is adsorbed by and taken out.

  When the suction of the components by all the mounting heads 20 is completed, the head unit 6 moves above the component recognition camera 17, and the components sucked by the mounting heads 20 are imaged from below by the camera 17. At the same time, the suction state of each component is examined based on the imaging result. Next, the head unit 6 moves above the printed board P, and the mounting head 20 moves up and down on each mounting point set on the upper surface of the board P, so that the components adsorbed on the head 20 are moved. It is mounted on the printed circuit board P. When a position shift (suction shift) of the suction component is recognized based on the imaging result of the component recognition camera 17, the target movement amount of the mounting head 20 when mounting the component on the board P is the above-described amount. By correcting the amount of suction displacement, the component is correctly mounted even if there is a certain amount of suction displacement. On the other hand, if the amount of suction deviation of the component exceeds a predetermined limit value, it is determined that the component is a suction failure, and the component is discarded to a disposal station or the like not shown.

  Next, the control system of the surface mounter 2 will be described with reference to the block diagram of FIG. As shown in this figure, the surface mounter 2 incorporates a controller 30 that comprehensively controls its operation. The controller 30 is composed of a well-known CPU, various memories, an HDD, and the like, and its main functional elements are an arithmetic processing unit 31, a storage unit 32, a motor control unit 33, an external input / output unit 34, an image processing unit. 35 etc.

  The storage unit 32 stores a mounting program (details will be described later) created by the data creator 3 and other necessary data.

  The arithmetic processing unit 31 comprehensively controls the operation of the head unit 6 and the like to perform a predetermined mounting operation based on the mounting program stored in the storage unit 32.

  The motor control unit 33 controls motors such as the X-axis and Y-axis servo motors 15 and 9, and the external input / output unit 34 is supplied from various sensors 23 provided in the surface mounter 2. It accepts signals and the like. The image processing unit 35 processes image data input from the component recognition camera 17.

  The data creation machine 3 connected to the surface mounting machine 2 as described above through the network line 4 is for creating a mounting program or the like for defining the control operation of the surface mounting machine 2. A storage unit 42 that stores information, an input unit 43 that includes a keyboard or a mouse that receives a predetermined input operation from a user, a display unit 44 that includes a liquid crystal monitor or a CRT, and a control unit 41 that controls these units. Have.

  The storage unit 42 of the data creation machine 3 stores various data including data necessary for creating the mounting program. The functional unit includes a basic data storage unit 42a and a nozzle data storage unit 42b. is doing.

  Among these, in the basic data storage unit 42a, the design data (CAD data, etc.) of the board P input from the outside by the user, the information such as the production plan, and the position of each mounting point on the board P obtained from the information. In addition, various types of information related to the type and shape of the components mounted thereon are stored.

  On the other hand, the nozzle data storage unit 42b stores nozzle candidate data set for each type of component, and determines which nozzle 21 to use preferentially from the nozzle candidates. The reference priority value data is stored.

  FIG. 4 is a diagram for explaining the nozzle candidate data stored in the nozzle data storage unit 42b. As shown in the figure, the nozzle candidate data is composed of table data that defines a group of nozzles 21 that can adsorb the component for each component type (component type). Note that the component types are those in which all components are classified into a plurality of types based on their sizes and the like, and in the example of FIG. 4, they are classified into three types of component types A to C. The nozzle candidates are determined based on the relationship with the sizes and the like of these component types A to C. For example, as nozzles 21 used in the surface mounter 2, identification numbers N1 to N5 in FIG. In the case where there are a total of five nozzles 21 represented, a specific nozzle 21 selected from the five nozzles 21 as capable of sucking the component types A to C is used as the nozzle candidate. It has come to be chosen.

  FIG. 6 is a diagram for explaining the priority value data stored in the nozzle data storage unit 42b. As shown in the figure, the priority value data includes the result priority value and the design priority value determined for each of the nozzle identification numbers N1 to N5. Among these, the result priority value is when a component mounting operation (that is, an operation of adsorbing a component from the component supply unit 5 and mounting the component on the board P) using the nozzle 21 with a certain identification number is performed. On the other hand, the design priority value is determined on the basis of the defect occurrence rate expected from various design values related to the nozzle 21. is there.

  First, the result priority value will be described in detail. The result priority value in this embodiment is determined based on the suction failure rate of parts when each nozzle 21 is used. The suction failure rate here is represented by a ratio between the total number of parts sucked by the corresponding nozzle 21 and the number of parts that have failed to be sucked. The calculation of the suction failure rate for each nozzle 21 is performed by, for example, the control unit 41 of the data creation device 3, and the calculated suction failure rate is stored in the storage unit 42. More specifically, necessary data (for example, inspection result data of suction failure by the component recognition camera 17) is controlled by the data creation device 3 from various data stored in the storage unit 32 of the surface mounter 2. The controller 41 is periodically extracted, and based on the data, the controller 41 calculates the suction failure rate and stores it in the storage unit 42.

  Then, by comparing the suction failure rate calculated and stored as described above with a correlation graph as shown in FIG. 7, the result priority value of each nozzle 21 is calculated and stored in the storage unit 42. It has come to be remembered. Specifically, according to the graph of FIG. 7, the actual priority value is set higher as the nozzle 21 has a lower suction failure rate. That is, since the nozzle 21 with a low suction failure rate has a higher probability of correctly picking up components and should be used preferentially over the other nozzles 21, the result priority value is set high. The

  In the example of FIGS. 6 and 7, the actual priority value when the suction failure rate is a predetermined value (1.0% in this embodiment) predetermined as an average failure rate is set to zero. As a reference, the result priority value is increased as the adsorption failure rate is smaller, and is decremented as it is larger. In addition, as in the case of the identification number N5 in FIG. 6, when the actual value data of the suction failure rate is not obtained because there is no actual use, the actual result is the same as in the case of the predetermined value (1.0%). The priority value is set to zero.

  On the other hand, the design priority value is determined based on the opening area of the opening 21a (see FIG. 5) of each nozzle 21. That is, when picking up a component, it is considered that using the nozzle 21 having a large opening area as much as possible can reliably pick up the component with a larger suction force. It can be expected that the probability of occurrence is small. For this reason, as shown in FIG. 6, the design priority value is set higher as the nozzle 21 having the larger opening area should be used preferentially than the other nozzles 21.

  Next, the control unit 41 of the data creation machine 3 will be described. The control unit 41 has a function of creating a mounting program for the surface mounter 2 based on various data stored in the storage unit 42. Specifically, the control unit 41 performs an operation for determining the mounting order of the components mounted on the board P based on various data stored in the basic data storage unit 42a of the storage unit 42. Then, a calculation or the like is performed to determine the nozzles 21 used when mounting each component in the mounting order based on the priority value data stored in the nozzle data storage unit 42b. Is transmitted to the surface mounter 2 as the mounting program.

  FIG. 8 is a flowchart showing specific contents of the control operation of the control unit 41. When an instruction to create a mounting program is issued in response to an input operation to the input unit 43 by the user and the flowchart of FIG. 8 starts, the control unit 41 first reads various necessary data from the storage unit 42 ( Step S1), based on the data, a calculation process for determining the mounting order of each component mounted on the board P is executed (step S3).

  Specifically, the control unit 41 determines the position of each mounting point on the board P stored in the basic data storage unit 42a of the storage unit 42, the type / shape of the component mounted thereon, and the component. From the information such as the position of the tape feeder 5a to be supplied, the mounting order is determined by, for example, obtaining by simulation which parts can be mounted at which mounting points on the board P in which order and mounting work can be efficiently performed.

  FIG. 9 is table data showing the results obtained by the calculation in step S3 for determining the mounting order. According to this figure, the order of the mounting point numbers (Mnt1, Mnt2...) To be mounted and the order of the component numbers (Cmp1, Cmp2...) To be mounted on these mounting point numbers are as described above. Each is determined in consideration of the efficiency of the mounting work. Here, the mounting point number is a number assigned in advance corresponding to each mounting point (coordinate) on the substrate P. The part number is a number assigned in advance according to what part the part is and which tape feeder 5a in the part supply unit 5 is supplied. Therefore, there are more types of part numbers assigned in this way than the part types (types A to C) roughly classified according to the size of the parts.

  Next, the control unit 41 proceeds to step S5 of FIG. 8 and executes a process of reading the nozzle 21 candidates (nozzle candidates) to be used in each mounting order. Specifically, the nozzle candidates are read in such a manner that, for each mounting order, nozzle candidates corresponding to the type (component type) of components mounted in that order are stored in the nozzle data storage unit 42b of the storage unit 42. This is performed by reading from the nozzle candidate data (FIG. 4).

  When the reading of the nozzle candidates is completed, the control unit 41 executes a process of further narrowing the read nozzle candidates based on the presence or absence of interference of the nozzles 21 (step S7). That is, the control unit 41 determines whether or not the nozzle candidate includes a nozzle 21 that interferes with a component previously mounted on the substrate P, and when such a nozzle 21 exists, The nozzle candidates are narrowed down except for the corresponding nozzle 21. FIG. 10 shows table data obtained by associating the narrowed nozzle candidates with the component types in each mounting order.

  Next, the control unit 41 executes the processes of the following steps S9 to S15 in order to determine the nozzle 21 to be actually used from the nozzle candidates narrowed down to some extent by the process of step S7. That is, the control unit 41 first executes a process of reading the result priority value and the design priority value from the nozzle priority value data shown in FIG. 6 (steps S9 and S11), and both these priority values. Based on the above, the process for calculating the total priority value represented by the following expression (1) is executed (step S13).

(Overall priority value) = (Design priority value) + (Actual priority value) × (Weighting factor) (1)
Here, the weight coefficient is a coefficient representing the weight of the actual priority value with respect to the overall priority value, and in this embodiment, this weight coefficient is set to 0.5.

  FIG. 11 is table data showing the total priority value obtained by the calculation of the above formula (1) together with the result priority value and the design priority value. In the example of FIG. 11, the nozzle 21 with the identification number N3 has the highest overall priority value, and the overall priority values are lower in the order of the identification numbers N1, N5, N2, and N4. From this, it can be seen that the nozzle 21 has a higher use priority in the order of the identification numbers N3, N1, N5, N2, and N4.

  Next, the control unit 41 proceeds to step S15 in FIG. 8 and executes a process of determining the nozzle 21 to be used in each mounting order. That is, the nozzle identification number having the highest overall priority value shown in FIG. 11 is identified from the nozzle candidates (nozzle candidates after narrowing down by interference check) in each mounting order shown in FIG. The nozzle 21 is determined as a nozzle to be used. FIG. 12 shows table data in which the determined identification numbers of the nozzles are associated with each mounting order.

  When the used nozzle determination process is completed in this way, the control unit 41 proceeds to step S17 in FIG. 8 and determines whether the used nozzles have been determined for all the components in the mounting order. If it is determined YES in this case and it is confirmed that the determination of all the nozzles is completed, the surface mounter 2 is operated to operate the surface mounter 2 according to the data such as the mounting order shown in FIG. A mounting program that defines the operation parameters and the like of each part of 2 is created along the data of FIG. 12, and a process of transmitting this to the surface mounter 2 is executed (step 19). The surface mounter 2 performs the mounting operation based on such a mounting program, so that the nozzles 21 are used in the order of the used nozzles shown in FIG. The parts are picked up and mounted along.

  In the component mounting apparatus 1 that sucks a component by the component suction nozzle 21 provided in the movable head unit 6 as described above, transports the sucked component and mounts it on the substrate P, for each type of component. A predetermined priority value (actual priority value and design priority) determined based on the suction failure rate when a component mounting operation is performed using the nozzles 21 in the candidates for the plurality of nozzle candidates set to Nozzle data storage unit 42b as storage means for storing the degree value), and control unit as control means for determining the type of nozzle 21 to be used based on the priority value stored in the nozzle data storage unit 42b 41 is advantageous in that the component suction nozzle 21 can be properly selected and the occurrence of defects during mounting work can be more effectively suppressed. .

  That is, in the above-described embodiment, the nozzle 21 to be used is determined from the plurality of nozzle candidates based on the priority value of the nozzle 21 determined based on the component suction failure rate. Unlike the case where the nozzle 21 is selected based on the presence or absence of interference with the nozzle 21, it is possible to more reliably perform the operation such as component suction using the nozzle 21, and the occurrence of defects during mounting work can be further increased. It can be effectively suppressed. As a result, there is an advantage that the component mounting operation can be performed more accurately and efficiently, and the quality of the board P can be improved and the tact time can be shortened effectively.

  In particular, as in the above-described embodiment, the actual priority value determined based on the actual value of the suction failure rate that is statistically obtained from the result of actually mounting the component using the nozzle 21 is the nozzle. When the control unit 41 is configured to determine the type of the nozzle 21 to be used based on the result priority value stored in the data storage unit 42b and stored in the nozzle data storage unit 42b. Since it is possible to determine the nozzle 21 to be used based on a more reliable priority value based on the usage record of the nozzle 21, it is possible to more reliably suppress the occurrence of defects and more accurately and efficiently. There is an advantage that a component mounting operation can be performed.

  In the above embodiment, the design priority value determined based on the suction failure rate predicted from the design value related to the nozzle 21 (in this embodiment, the opening area of the opening 21a) is further stored in the nozzle data storage unit 42b. The control unit determines the type of nozzle to be used based on the total priority value obtained from a predetermined calculation formula (the formula (1)) using the design priority value and the actual priority value. 41 is determined so that the nozzle 21 to be used is more appropriately determined on the basis of the overall priority value of the nozzle 21 set in a well-balanced manner from the viewpoint of design and the actual use. The nozzle 21 can be used to perform component mounting work more accurately and efficiently. Further, by using the total priority value as described above, there is an advantage that the nozzle 21 that has not been used can be easily selected with the same determination index.

  In the above embodiment, the actual priority value of the nozzle 21 is determined based on the actual value of the component suction failure rate. However, the actual priority value of the nozzle 21 is determined as described above. It is possible to determine not only the defect rate but also the actual value of the occurrence rate of various defects. For example, when an inspection device for inspecting the mounting state of a component mounted on each mounting point on the substrate P is provided on the downstream side of the component mounting device 1, the nozzle is obtained from the inspection result data of this inspection device. The component mounting failure rate for each 21 may be calculated and stored, and the result priority value of the nozzle 21 may be determined based on this mounting failure rate. Also, the actual result priority value may be determined in consideration of both the mounting failure rate and the adsorption failure rate.

  Furthermore, instead of the above-mentioned configuration in which the result priority value is determined based on the defect occurrence rate at the time of mounting work such as the above-described mounting defect rate and suction failure rate, the rate of successful component suction and mounting (non-defective product rate) You may make it determine the said performance priority value on the basis. Of course, even when the non-defective product rate is used in this way, the defect occurrence rate is indirectly used, which is substantially the same as the above-described configuration for setting the result priority value based on the defect occurrence rate. is there. That is, in the present invention, the “predetermined priority value determined based on the defect occurrence rate” should be interpreted as a concept including the priority value determined based on the non-defective product rate.

  Moreover, in the said embodiment, although the said design priority value was defined based on the area of the opening part 21a of the nozzle 21, if this design priority value is a design value regarding the defect generation | occurrence | production at the time of mounting operation, There is no particular limitation on the type. The design value related to the occurrence of such a defect includes, for example, the area and shape of the entire tip of the nozzle 21 or the cross-sectional shape and position of the opening 21a in addition to the area of the opening 21a as described above. be able to.

  Moreover, although the said embodiment demonstrated the example in which the surface mounting machine 2 and the data preparation machine 3 which comprise the component mounting apparatus 1 were provided separately, the structure of this invention is the said surface mounting machine 2 and data preparation. The present invention can also be suitably applied to the component mounting apparatus 1 in which the machine 3 is integrally provided.

It is a top view which shows schematic structure of the component mounting apparatus concerning one Embodiment of this invention. It is a schematic front view of a surface mounter. It is a block diagram which shows the control system of the said component mounting apparatus. It is a figure which shows an example of nozzle candidate data. It is a figure which shows the shape according to the kind of nozzle. It is a figure which shows an example of the priority value data of a nozzle. It is a graph which shows the relationship between a track record priority value and a suction failure rate. It is a flowchart which shows the specific content of control operation of a data preparation machine. It is an example of the table data which shows the mounting order of components. It is an example of the table data which showed the nozzle candidate after narrowing down by an interference check for every mounting order. It is an example of the table data which showed the result priority value, the design priority value, and the design priority value for every kind of nozzle. It is an example of the table data which matches and shows the mounting order of components, and a use nozzle.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 6 Head unit 21 Nozzle 41 Control part (control means)
42b Nozzle data storage section (storage means)

Claims (3)

A component mounting apparatus that sucks a component by a component suction nozzle provided in a movable head unit, transports the sucked component, and mounts it on a substrate
For a plurality of nozzle candidates set for each type of component, storage means for storing a predetermined priority value determined on the basis of a defect occurrence rate when the component mounting operation is performed using the nozzle;
A component mounting apparatus comprising: control means for determining the type of nozzle to be used based on the priority value stored in the storage means. The component mounting apparatus according to claim 1,
The storage means stores a result priority value determined based on a result value of a defect occurrence rate that is statistically obtained from a result when a component is actually mounted using a nozzle.
The control unit determines a type of nozzle to be used based on the result priority value stored in the storage unit. In the component mounting apparatus according to claim 2,
The storage means further stores a design priority value determined based on a failure occurrence rate expected from various design values related to the nozzle,
The control unit determines a type of nozzle to be used based on a total priority value obtained from a predetermined arithmetic expression using the design priority value and the actual priority value. apparatus.

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