WO2019097675A1

WO2019097675A1 - Component mounter, component inspection method, component inspection program, and recording medium

Info

Publication number: WO2019097675A1
Application number: PCT/JP2017/041470
Authority: WO
Inventors: 幸治横田
Original assignee: ヤマハ発動機株式会社
Priority date: 2017-11-17
Filing date: 2017-11-17
Publication date: 2019-05-23
Also published as: JP6855148B2; JPWO2019097675A1

Abstract

In the present invention, a captured image Ia is obtained by imaging the front surface Sa of a component Wp that has not yet been mounted on a substrate 1, and on the basis of the captured image Ia, a displacement amount β of a pattern position indicating the position of a bump pattern P with respect to the contour of the front surface Sa is determined. A captured image Im is obtained by imaging the rear surface Sb of the component Wp that has been mounted on the substrate 1, and on the basis of the captured image Im, a mounted component rear surface center Cbm indicating the position of the rear surface Sb of the component Wp is determined. The positional displacement of the bump pattern P on the component Wp mounted on the substrate 1 is inspected on the basis of the displacement amount β of the pattern position and the mounted component rear surface center Cbm. As a result, it is possible to accurately inspect the positional displacement of the bump pattern P on the component Wp on the basis of the captured image Im obtained by imaging the component Wp mounted on the substrate 1, independently of variations in the position of the bump pattern P with respect to the contour of the component Wp.

Description

Component mounting machine, component inspection method, component inspection program, recording medium

The present invention relates to a technology for mounting a component provided with a pattern on a substrate, and more particularly to a technology for inspecting the position of the pattern of the component based on an image obtained by imaging the mounted component.

In component mounting technology for mounting components on a substrate, as disclosed in Patent Documents 1 to 3, components having a bump pattern formed on the surface are generally used. When such a component is used, it is necessary to mount the component with the bump pattern aligned with, for example, the wiring pattern of the substrate while the surface of the component is directed to the substrate side. However, in practice, the components may be mounted on the substrate in a state where the positions of the bump patterns are shifted.

JP, 2013-30657, A JP, 2014-45109, A JP 2001-345348 A

Therefore, it is conceivable to calculate the mounting position of the component based on the image obtained by imaging the component mounted on the substrate, and to inspect the displacement of the position of the pattern based on the result. However, as shown in Patent Document 1 etc., the position of the pattern with respect to the outer shape of the part varies among the individual parts. On the other hand, the pattern of the component mounted on the substrate can not be directly imaged, and only the back surface opposite to the surface on which the pattern is formed can be imaged. Therefore, it has been difficult to accurately inspect the positional deviation of the pattern.

The present invention has been made in view of the above problems, and it is possible to accurately inspect the misalignment of the pattern of the component based on the image obtained by imaging the component mounted on the substrate regardless of the variation in the position of the pattern with respect to the outer shape of the component. To provide technology that makes it possible.

A component mounter according to the present invention comprises a component supply unit for supplying a component having a first surface provided with a pattern and a second surface opposite to the first surface, a substrate holding unit for holding a substrate, and a component supply A component mounting unit for picking up a component supplied by the unit and mounting the first surface on the substrate with the first surface facing the substrate side, an imaging unit for imaging the component, and the first surface of the component before mounting on the substrate The imaging unit captures an image to obtain a first image, and the imaging unit captures an image of a second surface of the component mounted on the substrate using the imaging unit to obtain a second image, and based on the first image and the second image, the component A control unit that executes an inspection process for performing an inspection, and in the inspection process, the control unit determines pattern position information indicating the position of the pattern with respect to the outline of the first surface from the first image, and a component mounted on the substrate Indicates the position of the second side of the The part position information obtained from the second image, checking the positional deviation of the part of the pattern mounted on the substrate based on the pattern position information and the part position information.

In the component inspection method according to the present invention, of the first surface and the second surface opposite to the first surface of the component before being mounted on the substrate, the first surface on which the pattern is provided is imaged to obtain the first image. Step of acquiring, step of imaging the second surface of the component mounted on the substrate with the first surface facing the substrate to acquire a second image, and pattern position indicating the position of the pattern with respect to the outline of the first surface A process of obtaining information from the first image, a process of obtaining component position information indicating the position of the second surface of the component mounted on the substrate from the second image, and mounting on the substrate based on the pattern position information and the component position information Inspecting the misalignment of the part pattern.

The component inspection program according to the present invention images a first surface on which a pattern is provided among the first surface and the second surface opposite to the first surface of the component before being mounted on a substrate, and generates a first image. Step of acquiring, step of imaging the second surface of the component mounted on the substrate with the first surface facing the substrate to acquire a second image, and pattern position indicating the position of the pattern with respect to the outline of the first surface A process of obtaining information from the first image, a process of obtaining component position information indicating the position of the second surface of the component mounted on the substrate from the second image, and mounting on the substrate based on the pattern position information and the component position information And (d) checking the misalignment of the part pattern.

A storage medium according to the present invention stores the above-described part inspection program in a readable manner by a computer.

According to the present invention (component mounter, component inspection method, component inspection program, storage medium) configured as described above, the first surface (surface provided with the pattern) of the component before mounting on the substrate is imaged A first image is acquired, and based on the first image, pattern position information indicating the position of the pattern with respect to the outline of the first surface is obtained. In addition, the second surface (surface opposite to the first surface) of the component after being mounted on the substrate is imaged to obtain a second image, and the position of the second surface of the component is indicated based on the second image. Part position information is obtained. Then, based on the pattern position information and the component position information, the misalignment of the pattern of the component mounted on the substrate is inspected. Thus, the misalignment of the pattern is inspected not only based on the position of the second surface of the mounted part but also on the position of the pattern with respect to the outline of the first surface of the part. As a result, regardless of the variation in the position of the pattern with respect to the outer shape of the component, it is possible to accurately inspect the positional deviation of the pattern of the component based on the image obtained by imaging the component mounted on the substrate.

By the way, there are cases where the position of the first surface of the part and the position of the second surface are deviated in the in-plane direction due to the precision of the manufacturing process of the part, and the like. Therefore, the control unit obtains positional relationship information indicating the positional relationship between the first surface and the second surface based on the image obtained by causing the imaging unit to capture the component, and based on the pattern position information, the positional relationship information, and the component position information. The component mounter may be configured to inspect misalignment of the pattern of the component mounted on the substrate. In this configuration, the positional deviation of the pattern is inspected based also on positional relationship information indicating the positional relationship between the first surface and the second surface. As a result, regardless of the positional deviation between the first surface and the second surface of the part, it is possible to accurately inspect the positional deviation of the pattern of the part based on the image obtained by imaging the part mounted on the substrate. .

Specifically, the component supply unit supplies the component with the second surface directed upward, and in the inspection process, the control unit supplies the component before the component supply unit supplies it and is picked up by the component mounting unit. The component mounter may be configured to capture the second surface of the image by the imaging unit to obtain a third image, and obtain positional relationship information based on the first image and the third image.

Further, the control unit picks up the first surface of the component before being picked up from the component supply unit by the component mounting unit and mounted on the substrate by the imaging unit to acquire a first image and execute inspection processing. The component mounter may be configured to adjust the position at which the component is mounted on the substrate based on the result of recognizing the position of the pattern based on the first image. In such a configuration, pattern recognition processing and inspection processing for adjusting the mounting position of the component are executed based on the common first image, and efficient control is realized.

Further, the control unit may configure the component mounter so that the inspection process can be performed at one execution interval selected from the plurality of execution intervals. In such a configuration, the inspection process can be performed at an appropriate execution interval in consideration of the necessity of inspection of pattern misalignment and the efficiency of component mounting.

Specifically, the component is a die of a diced wafer, and a plurality of execution intervals is a first execution interval to execute an inspection process each time one die is mounted on a substrate, and one wafer portion So as to include at least one of a second execution interval for performing the inspection process each time the die is mounted on the substrate and a third execution interval for performing the inspection process each time the die for one lot of wafers is mounted on the substrate; A component mounter may be configured.

In addition, the control unit may configure the component mounter so as to select one execution interval from among a plurality of execution intervals based on the positional deviation of the pattern of the component inspected in the inspection process. In such a configuration, it is possible to make appropriate the execution interval of the inspection process after the executed inspection process based on the positional deviation of the pattern inspected in the executed inspection process.

Further, the control unit may configure the component mounting machine to adjust the position at which the component mounting unit mounts the component on the substrate based on the positional deviation of the pattern of the component inspected in the executed inspection process. . By this, it is possible to mount the component on the substrate while suppressing the positional deviation of the pattern.

According to the present invention, it becomes possible to accurately inspect the positional deviation of the pattern of the component based on the image obtained by imaging the component mounted on the substrate, regardless of the variation in the position of the pattern with respect to the outer shape of the component.

BRIEF DESCRIPTION OF THE DRAWINGS The top view which shows typically an example of the component mounting machine which concerns on this invention. FIG. 2 is a block diagram showing an electrical configuration of the component mounter of FIG. 1; The figure which shows typically an example of the components used as the object of mounting by the component mounting machine of FIG. The flowchart which shows an example of the component mounting which the component mounting machine of FIG. 1 performs. 5 is a flowchart showing an example of part back surface recognition in the flowchart of FIG. 4; 5 is a flowchart showing an example of component surface recognition in the flowchart of FIG. 4; The flowchart which shows an example of the components inspection of the flowchart of FIG.

FIG. 1 is a plan view schematically showing an example of a component mounter according to the present invention. FIG. 2 is a block diagram showing an electrical configuration of the mounter of FIG. As shown in FIG. 1, in the present specification, XYZ orthogonal coordinate axes configured of a transport direction X, a width direction Y, and a vertical direction Z are appropriately used. The transport direction X and the width direction Y are parallel to the horizontal direction and orthogonal to each other, and the vertical direction Z is orthogonal to the transport direction X and the width direction Y.

The component mounting machine 10 mounts the component Wp on the substrate 1 carried in from the upstream side in the transport direction X and carries it out to the downstream side in the transport direction X. A plurality of mounting target points 1a are provided on the upper surface of the substrate 1, and the control unit 100 provided in the component mounting machine 10 controls the respective components of the component mounting machine 10 to provide components at each mounting target point 1a. Implement Wp.

As shown in FIG. 2, the control unit 100 includes an operation unit 110 which is a processor having an arithmetic function for controlling the entire component mounter 10, and an image processing unit 120 which performs image processing based on an instruction of the operation unit 110. And a drive control unit 130 that controls a drive mechanism such as a motor based on a command from the calculation unit 110. Furthermore, the control unit 100 includes a storage unit 140 configured of an HDD (Hard Disk Drive) or the like. The storage unit 140 stores a component inspection program 150 for causing the calculation unit 110 to execute a component inspection to be described later. The component inspection program 150 is stored and provided in a recording medium 160 such as a DVD (Digital Versatile Disc) or USB (Universal Serial Bus), for example, and the computing unit 110 stores the component inspection program 150 read from the recording medium 160 Save to 140 The provision form of the component inspection program 150 is not limited to this, and the component inspection program 150 may be provided, for example, in the form of downloading from an Internet server.

The component mounter 10 includes a transport unit 2 that transports the substrate 1 in the transport direction X. The transport unit 2 has two mounting work positions 21 aligned in the transport direction X, and carries the substrate 1 to each mounting work position 21 from the upstream side in the transport direction X. Further, the transport unit 2 unloads the substrate 1 on which the component Wp is mounted at each mounting work position 21 from the mounting work position 21 to the downstream side in the transport direction X.

The component mounter 10 further includes a component supply mechanism 3 for supplying the component Wp. The parts Wp supplied by the parts supply mechanism 3 are dies (bare chips) of the diced wafer W. That is, the component supply mechanism 3 has a wafer storage unit 31 capable of storing a plurality of wafers W, and a wafer extraction unit 33 for extracting the wafer W from the wafer storage unit 31 to the component supply position 32. The wafer storage unit 31 arranges a plurality of wafer holders Wh for holding the wafers W in the vertical direction Z and raises and lowers a rack for storing the wafers W at a height at which the wafer lead-out unit 33 can receive the wafers W. One wafer holder Wh can be positioned and the wafer holder Wh can be pushed out to the wafer lead-out portion 33.

The wafer lead-out portion 33 includes a wafer support table 331 supporting the wafer holder Wh, a fixed rail 332 supporting the wafer support table 331 movably in the width direction Y, and is provided in the width direction Y and attached to the wafer support table 331 And a Y-axis motor 334 for driving the ball screw 333. Therefore, the wafer support table 331 can be moved in the width direction Y along the fixed rail 332 by rotating the ball screw 333 by the Y-axis motor 334. As shown in FIG. 1, the wafer storage unit 31 and the component supply position 32 are disposed so as to sandwich the transport unit 2 in the width direction Y, and the wafer support table 331 passes below the transport unit 2. The wafer support table 331 receives the wafer holder Wh from the wafer storage unit 31 at the reception position adjacent to the wafer storage unit 31 and moves from the reception position to the component supply position 32 to move the wafer W to the component supply position 32. Pull out.

Further, the component supply mechanism 3 has a component extraction unit 35 for extracting the component Wp from the component supply position 32. The component pick-up unit 35 has a pick-up head 36 for picking the component Wp from the component supply position 32, and the pick-up head 36 is movable in the X and Y directions. That is, the component extraction unit 35 includes a support member 351 for supporting the extraction head 36 so as to be movable in the conveyance direction X, and an X-axis motor 352 for driving the ball screw provided in the conveyance direction X and attached to the extraction head 36. Have. Therefore, the drive control unit 130 can move the takeout head 36 in the transport direction X by rotating the X-axis motor 352. The component pick-up portion 35 also drives a fixed rail 353 for supporting the support member 351 so as to be movable in the width direction Y, a ball screw 354 provided in the width direction Y and attached to the fixed rail 353, and Y for driving the ball screw 354. And an axial motor 355. Therefore, the drive control unit 130 can move the takeout head 36 together with the support member 351 in the width direction Y by rotating the Y-axis motor 355.

The take-out head 36 has a bracket 361 extending in the transport direction X, and two nozzles 362 rotatably supported by the bracket 361. Each nozzle 362 is positioned at either the suction position facing downward or the delivery position facing upward (position in FIG. 1) by rotating around a rotation axis parallel to the transport direction X. In addition, the bracket 361 can move up and down with each nozzle 362.

Further, the component pick-up unit 35 has a moving camera 356 that picks up an image of the component Wp at the component supply position 32 from above with an image sensor, and the moving camera 356 is movable in the X and Y directions. That is, in the component pickup portion 35, the movable camera 356 is supported movably in the transport direction X by the support member 351. In addition, the component extraction unit 35 has an X-axis motor 357 which is provided in the transport direction X and drives a ball screw attached to the moving camera 356. Therefore, the drive control unit 130 can move the moving camera 356 in the transport direction X by rotating the X-axis motor 357, and the width of the moving camera 356 together with the support member 351 by rotating the Y-axis motor 355. It can be moved in the direction Y.

The component supply mechanism 3 supplies components Wp as follows. That is, the drive control unit 130 moves the moving camera 356 above the component Wp to be supplied among the plurality of components Wp of the component supply position 32. Subsequently, the moving camera 356 captures an image of the part Wp, transfers the captured image to the image processing unit 120, and the image processing unit 120 recognizes the position of the part Wp from the captured image. Then, the drive control unit 130 drives the nozzle 362 based on the recognition result by the image processing unit 120 to make the nozzle 362 located at the suction position face the component Wp from above, lower the nozzle 362 to move the component Wp. Contact Furthermore, the drive control unit 130 picks up the component Wp from the component supply position 32 by raising the nozzle 362 while applying a negative pressure to the nozzle 362. Then, the drive control unit 130 supplies the component Wp by positioning the nozzle 362 at the delivery position.

The component mounter 10 includes two mounting units 4 for mounting the component Wp thus supplied by the component supply mechanism 3 on the substrate 1. The two mounting units 4 are provided in a one-to-one correspondence relationship with the two mounting work positions 21. Each mounting unit 4 includes a support member 41 movable along a fixed rail provided on the ceiling of the component mounter 10 in the width direction Y, and a mounting head 42 supported movably in the transport direction X by the support member 41. And. Furthermore, an X-axis motor 43 for driving a ball screw provided in the transport direction X and attached to the mounting head 42 and a Y-axis motor 44 provided in the width direction Y and attached to the support member 41 are provided. Therefore, the drive control unit 130 can move the mounting head 42 in the transport direction X by rotating the X-axis motor 43, and the mounting head 42 along with the support member 41 by rotating the Y-axis motor 44. Can be moved in the width direction Y.

When picking up the component Wp, the mounting head 42 of each of the mounting

portions

4A and 4B moves to the upper side of the takeout head 36, and the nozzle 421 is placed from above the component Wp held by the nozzle 362 located at the delivery position. When facing each other, the nozzle 421 is lowered to contact the part Wp. Subsequently, the component supply mechanism 3 releases the negative pressure of the nozzle 362, and the mounting

parts

4A and 4B apply a negative pressure to the nozzle 421, cause the nozzle 421 to adsorb the component Wp, raise the nozzle 421 while applying a negative pressure. Let Thus, the mounting head 42 picks up the component Wp by the nozzle 421.

The component supply mechanism 3 has two nozzles 362, and these nozzles 362 can simultaneously supply two components Wp. On the other hand, the mounting head 42 has two nozzles 421 corresponding to the two nozzles 362 of the component supply mechanism 3, and the two components Wp supplied by the component supply mechanism 3 are two nozzles It can be picked up at the same time by 421. However, it is not essential to simultaneously supply and pick up the two parts Wp.

Furthermore, each mounting unit 4 has a moving camera 45 provided facing downward. The moving camera 45 images the component Wp supplied by the component supply mechanism 3 and the component Wp mounted on the substrate 1 from above by the image sensor. The moving camera 45 is attached to the mounting head 42, and the drive control unit 130 moves the moving camera 45 in the XY direction like the mounting head 42 by rotating the X-axis motor 43 and the Y-axis motor 44. Can.

The component mounter 10 further includes a fixed camera 5 provided for each mounting unit 4. The fixed camera 5 faces upward and is fixed to a base, and captures an image of the component Wp located above, as described later, from below by an image sensor. Thus, in the component mounter 10, an imaging unit IU including the moving camera 45, the fixed camera 5 and the moving camera 356 is configured.

FIG. 3 is a view schematically showing an example of a component to be mounted by the component mounting machine of FIG. In the figure, the part Wp in a state of being supplied to the part supply position 32 is illustrated. The surface Sa and the back surface Sb (surface opposite to the surface Sa) of the component Wp are both formed in a rectangular shape. A plurality of bumps B (electrodes) are provided side by side in a matrix on the surface Sa of the component Wp, and a bump pattern P is formed by these bumps B. Further, in the example of the figure, the part Wp is cut obliquely to the surface Sa (or the back surface Sb) due to the cutting accuracy in dicing, so the surface Sa and the back surface Sb are in the in-plane direction They are mutually offset (in the lateral direction of FIG. 3).

In the component supply position 32 of the component mounting machine 10 of FIG. 1, each component Wp is disposed with its surface Sa facing upward, and the takeout head 36 is moved by the nozzle 362 located at the suction position. By suctioning the surface Sa, the component Wp is picked up. Then, the take-out head 36 supplies the component Wp by rotating the nozzle 362 from the suction position to the delivery position. Since the part Wp is reversed as the nozzle 362 rotates, the part Wp is supplied with its back surface Sb directed upward. Therefore, the mounting head 42 picks up the component Wp by adsorbing the back surface Sb of the component Wp with the nozzle 421.

4 is a flowchart showing an example of component mounting performed by the component mounting machine of FIG. 1, FIG. 5 is a flowchart showing an example of component back surface recognition performed in the flowchart of FIG. 4, and FIG. FIG. 7 is a flowchart showing an example of component surface recognition performed in the flowchart, and FIG. 7 is a flowchart showing an example of component inspection performed in the flowchart of FIG. 4. The flowcharts of FIGS. 4 to 7 are executed by the arithmetic unit 110 controlling each part of the component mounter 10 according to the component inspection program 150. Moreover, since the operation of the two mounting units 4 is common, the following description will be made without particular distinction.

When the mounting process of FIG. 4 is started, component back surface recognition is executed in step S101. As shown in FIG. 5, in the component back surface recognition, the moving camera 45 moves above the component Wp supplied by the component supply mechanism 3 and faces the back surface Sb of the component Wp from above (step S201). In step S202, the moving camera 45 captures an image of the back surface Sb of the part Wp, and transmits the captured image Ib to the image processing unit 120. Then, the image processing unit 120 recognizes the outer shape of the back surface Sb of the part Wp based on the captured image Ib of the back surface Sb of the part Wp (step S203), and returns to the flowchart of FIG.

In step S102, the mounting head 42 sucks the component Wp, which is the imaging target of the moving camera 45 in step S101, by the nozzle 421 (step S102). As described above, the mounting head 42 sucks the back surface Sb of the component Wp from above, and the component Wp is picked up by the mounting head 42 with the surface Sa directed downward. Thus, when the mounting head 42 picks up the component Wp, component surface recognition in step S103 is performed.

As shown in FIG. 6, in the component surface recognition, the mounting head 42 moves the picked up component Wp above the fixed camera 5 (step S301). In step S302, the fixed camera 5 images the surface Sa of the part Wp from below, and transmits the captured image Ia of the surface Sa of the part Wp to the image processing unit 120. Then, the image processing unit 120 calculates the difference between the center positions of the front surface Sa and the rear surface Sb of the component Wp (step S303). Specifically, based on the outline of the back surface Sb of the component Wp recognized by the component back surface recognition in step S101, the geometric center of this outline is calculated as the back surface center Cb (FIG. 5). Further, the outline of the surface Sa of the part Wp is recognized based on the captured image Ia in step S302, and the geometric center of the outline of the surface Sa is calculated as the surface center Ca (FIG. 5). Then, the difference between the back surface center Cb and the surface center Ca is calculated as the front / back position displacement amount α (= Cb−Ca) and stored in the storage unit 140. The surface center Ca and the back surface center Cb are XY coordinates, and the front and back positional deviation amount α is a vector amount.

In step S304, the image processing unit 120 calculates the geometric center of the bump pattern P as the pattern center Cp (FIG. 5) based on the captured image Ia. Then, in step S305, the image processing unit 120 calculates the difference between the surface center Ca of the part Wp and the pattern center Cp as the pattern positional deviation amount β (= Ca−Cp) and stores it in the storage unit 140, as shown in FIG. Return to the flowchart of. The pattern center Cp is XY coordinates as in the case of the surface center Ca, and the pattern positional deviation amount β is a vector amount.

In step S104, the mounting head 42 mounts the component Wp to be adsorbed to the nozzle 421 on the mounting target point 1a with the surface Sa facing the substrate 1 side. At this time, in the position where the component Wp is mounted, the pattern center Cp calculated in step S304 matches the predetermined mounting reference position (for example, the geometric center of the mounting target point 1a) representative of the mounting target point 1a. Adjusted. As a result, the component Wp is mounted on the mounting target point 1a with the surface Sa facing the substrate 1 (in other words, with the back surface Sb facing upward). Thus, when the mounting of the part Wp is completed, the part inspection in step S105 is performed.

As shown in FIG. 7, in the component inspection, the mobile camera 45 moves above the component Wp mounted on the mounting target point 1a in step S104 (hereinafter, referred to as "mounted component Wp" as appropriate) (step S401). In step S402, the moving camera 45 captures an image of the back surface Sb of the mounted component Wp from above, and transmits the captured image Im to the image processing unit 120 (step S402). Then, the image processing unit 120 calculates the geometric center of the back surface Sb of the mounted component Wp as the mounting component back surface center Cbm based on the captured image Im of the back surface Sb of the mounted component Wp (step 403). In step S404, the image processing unit 120 calculates the center (mounting center Cpm) of the bump pattern P of the mounted component Wp based on the mounting component back surface center Cbm, the front / back positional deviation amount α, and the pattern positional displacement amount β. Then, when the image processing unit 120 calculates the difference between the mounting center Cpm and the mounting reference position as the mounting positional deviation amount γ and stores the calculated amount in the storage unit 140 (step S405), the process returns to the flowchart of FIG. The mounting component back surface center Cbm, the mounting center Cpm, and the mounting reference position are XY coordinates, and the mounting positional deviation amount γ is a vector amount.

In step S106, it is determined whether the mounting of the component Wp on all mounting target points 1a of the substrate 1 is completed. If the mounting is not completed (in the case of "NO" in step S106), steps S101 to S105 are repeated. In the subsequent component mounting in step S104, the mounting position of the component Wp is adjusted so as to cancel the mounting position shift amount γ obtained in step S405. Then, when the mounting of the component Wp on all the mounting target points 1a is completed (“YES” in step S106), the component mounting of FIG. 4 ends.

As described above, according to the present embodiment, the captured image Ia (first image) is obtained by imaging the surface Sa (surface on which the bump pattern P is provided) of the component Wp before being mounted on the substrate 1. Based on the captured image Ia, a pattern displacement amount β (pattern position information) indicating the position of the bump pattern P with respect to the outer shape of the surface Sa is obtained (step S305). Further, the back surface Sb of the component Wp after being mounted on the substrate 1 is imaged to obtain a captured image Im (second image) (step S402), and the position of the back surface Sb of the component Wp is determined based on the captured image Im. The mounted component back surface center Cbm (component position information) shown is determined (step S403). Then, the positional deviation of the bump pattern P of the component Wp mounted on the substrate 1 is inspected based on the pattern positional deviation amount β and the mounting component back surface center Cbm (step S405). Thus, based on not only the position of the back surface Sb of the mounted component Wp, but also the position (pattern displacement amount β) of the bump pattern P with respect to the outer shape of the surface Sa of the component Wp The mounting positional deviation amount γ) is inspected. As a result, regardless of the variation in the position of the bump pattern P with respect to the outer shape of the component Wp, the positional deviation of the bump pattern P of the component Wp is accurately inspected based on the captured image Im obtained by imaging the component Wp mounted on the substrate 1 Is possible.

In particular, as described above, when the component Wp is a die of a diced wafer W, an error may occur in the position to be cut by dicing. Therefore, positional deviation of the bump pattern P with respect to the outer shape of the component Wp is likely to occur. On the other hand, since the present embodiment is configured as described above, the bump pattern of the component Wp based on the captured image Im obtained by imaging the component Wp mounted on the substrate 1 regardless of the cutting position error in dicing. It is possible to inspect the positional deviation of P accurately.

By the way, as exemplified in the column of “side view” in FIG. 3, the position of the front surface Sa and the back surface Sb of the component Wp due to the precision of the manufacturing process of the component Wp, specifically the inclination of the cutting surface in dicing. There is a case where the position of is shifted in the in-plane direction. In the example of FIG. 3, the position of the front surface Sa and the position of the back surface Sb are shifted in the transport direction X by the front / back position shift amount α (note that the size and direction of the front / back position shift amount α are limited to the example of FIG. 3). Not). On the other hand, based on the captured image Ib (third image) and the captured image Ia obtained by causing the moving camera 45 and the fixed camera 5 (the imaging unit IU) to capture the component Wp, the control unit 100 Front and back positional deviation amount α (positional relationship information) indicating the positional relationship with the back surface Sb is determined (step S303). Then, the positional deviation of the bump pattern P of the component Wp mounted on the substrate 1 is inspected based on the pattern positional deviation amount β, the front and back positional deviation amount α, and the mounting component back surface center Cbm (step S405). In such a configuration, the positional deviation of the bump pattern P is inspected based on the front / rear positional deviation amount α indicating the positional relationship between the front surface Sa and the back surface Sb. As a result, regardless of the positional deviation between the front surface Sa and the back surface Sb of the component Wp, the positional deviation of the bump pattern P of the component Wp is accurately inspected based on the captured image Im obtained by imaging the component Wp mounted on the substrate 1 Is possible.

Further, the control unit 100 picks up the surface Sa of the component Wp before being picked up from the component supply mechanism 3 by the mounting head 42 and mounted on the substrate 1 by the fixed camera 5 to obtain a picked up image Ia (step S302) ), Perform inspection of the part Wp. Further, in step S304, the position at which the component Wp is mounted on the substrate 1 is adjusted based on the result of recognizing the position of the bump pattern P based on the captured image Ia. In this configuration, recognition processing of the bump pattern P for adjusting the mounting position of the component Wp and calculation of the pattern center Cp of the bump pattern P for inspection of the component Wp are performed based on the common captured image Ia. Efficient control is realized.

Further, the control unit 100 adjusts the position at which the mounting head 42 mounts the component Wp on the substrate 1 based on the positional deviation (mounting positional deviation amount γ) of the bump pattern P of the component Wp inspected at step S405. (Step S104). As a result, it is possible to mount the component Wp on the substrate 1 while suppressing the displacement of the bump pattern P.

As described above, in the present embodiment, the component mounter 10 corresponds to an example of the “component mounter” of the present invention, the component supply mechanism 3 corresponds to an example of the “component supply unit” of the present invention, and the transport unit 2 The mounting

units

4A and 4B correspond to an example of the "component mounting unit" of the present invention, and the imaging unit IU corresponds to an example of the "imaging unit" of the present invention. The control unit 100 corresponds to an example of the “control unit” of the present invention, the component Wp corresponds to an example of the “component” of the present invention, and the surface Sa corresponds to an example of the “first surface” of the present invention The back surface Sb corresponds to an example of the “second surface” of the present invention, the bump pattern P corresponds to an example of the “pattern” of the present invention, and the captured image Ia corresponds to an example of the “first image” of the present invention The captured image Im corresponds to an example of the “second image” in the present invention, and the captured image Ib corresponds to the “third image” in the present invention. Corresponds to an example, the pattern positional deviation amount β corresponds to an example of “pattern position information” in the present invention, the mounting component back surface center Cbm corresponds to an example of “component position information” in the present invention, and steps S101 to S103 and S105 corresponds to an example of the “inspection process” of the present invention, front and back positional deviation amount α corresponds to an example of the “positional relationship information” of the present invention, and the parts inspection program 150 is an example of the “parts inspection program” of the present invention The recording medium 160 corresponds to an example of the "recording medium" in the present invention.

The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the scope of the invention. For example, in the above embodiment, every time one component Wp is mounted on the substrate 1, inspection processing (steps S101 to S103 and S105) is performed. However, the execution interval of the inspection process is not limited to this.

Further, the control unit 100 may execute the inspection process (steps S101 to S103 and S105) at one execution interval selected from a plurality of different execution intervals. This makes it possible to execute inspection processing at an appropriate execution interval in consideration of the necessity of inspection of the mounting position deviation amount γ of the bump pattern P and the efficiency of component mounting.

Specifically, the plurality of execution intervals are a first execution interval at which an inspection process is performed each time one component Wp (die) is mounted on the substrate 1, and the components Wp of one wafer W are substrate 1 The second execution interval for executing the inspection process each time mounted on the board, and at least one of the third execution interval for executing the inspection process each time the parts Wp of one lot of wafers W are mounted on the substrate The control unit 100 can be configured to include the interval. In particular, when the plurality of execution intervals include the first to third execution intervals, the inspection process is executed at the first execution interval when the cutting position accuracy in dicing is low, and the cutting position accuracy is higher than this. In the second embodiment, the inspection process is executed at the second execution interval, and if the cutting position accuracy is higher than that, the inspection process is executed at the third execution interval. That is, the inspection process can be performed at a longer execution interval as the cutting position accuracy by dicing is higher, and at an appropriate execution interval taking into consideration the necessity of inspection of the mounting position shift amount γ of the bump pattern P and the efficiency of component mounting. Can perform inspection processing.

At this time, various criteria for selecting one execution interval out of a plurality of execution intervals can be considered. For example, the control unit 100 may select one execution interval according to the user's input. Alternatively, the control unit 100 may select one execution interval from a plurality of execution intervals based on the mounting position shift amount γ position of the bump pattern P of the part Wp inspected in the inspection process. In this configuration, based on the positional deviation of the bump pattern P inspected in the executed inspection process, the execution interval of the inspection process after the executed inspection process can be made appropriate.

Specifically, when the mounting positional deviation amount γ (absolute value) in the current inspection processing is increased by a predetermined value or more as compared to the mounting positional deviation amount γ (absolute value) in the previous inspection processing, the inspection processing The execution interval of the inspection process may be shortened, and conversely, the execution interval of the inspection process may be lengthened when it decreases by the predetermined value or more.

Alternatively, the execution interval of the inspection process may be changed based on the result of comparing the moving average of the mounting positional deviation amount γ in two or more executed inspection processes with a predetermined threshold. That is, when the moving average exceeds the threshold, the execution interval of the inspection process is lengthened, and when the moving average becomes equal to or less than the threshold, the execution interval of the inspection process is shortened.

In the above embodiment, the front / back positional deviation amount α indicating the positional relationship between the front surface Sa and the back surface Sb of the component Wp is obtained based on component back surface recognition (step S101) for recognizing the back surface Sb of the component Wp from the captured image Ib. (Step S303). At this time, the specific method for obtaining the front and back positional deviation amount α is not limited to this. That is, the front and back positional deviation amount α can be obtained by imaging the part Wp from the side and imaging an image as shown in “side view” in FIG. 3.

In the above embodiment, the positional deviation of the bump pattern P of the component Wp mounted on the substrate 1 is inspected based on the front and back positional deviation amount α, the pattern positional deviation amount β, and the mounting component back surface center Cbm (step S405). . However, when the cutting accuracy in dicing is good and the positional deviation between the front surface Sa and the rear surface Sb is minimal, such control is unnecessary.

That is, steps S101 and S303 may be omitted, and the positional deviation of the bump pattern P of the component Wp mounted on the substrate 1 may be inspected based on the pattern positional deviation amount β and the mounting component back surface center Cbm (step S405). . Also in this case, based on not only the position of the back surface Sb of the mounted component Wp, but also the position (pattern displacement amount β) of the bump pattern P with respect to the outer shape of the surface Sa of the component Wp (Mounting positional deviation amount γ) is inspected. As a result, regardless of the variation in the position of the bump pattern P with respect to the outer shape of the component Wp, the positional deviation of the bump pattern P of the component Wp is accurately inspected based on the captured image Im obtained by imaging the component Wp mounted on the substrate 1 Is possible.

Further, in the above embodiment, the surface Sa of the component Wp is imaged by the fixed camera 5 to acquire the imaged image Ia. However, the captured image Ia of the surface Sa of the part Wp may be acquired by capturing the part Wp of the part supply position 32 with the moving camera 356.

Further, the inspection of the displacement of the bump pattern P is performed based on the center position such as the surface center Ca, the pattern center Cp, the mounted component back surface center Cbm or the back surface center Cb. However, the reference for inspection of misalignment is not limited to these center positions, and is provided in advance at a value that can represent the position of the surface Sa, back surface Sb or bump pattern P of the component Wp, for example, at predetermined positions. It is sufficient if the position of the mark is present.

Various changes can also be made to the part Wp. Therefore, the number and arrangement of the bumps B in the bump pattern P may be changed. Also. The type of the component Wp is not limited to the die (bare chip).

Further, the “pattern” is not limited to the bump pattern P in the above example, but also includes a wiring pattern and the like.

DESCRIPTION OF SYMBOLS 10 ... Component mounting machine 100 ... Control part 150 ... Component test | inspection program 160 ... Recording medium 2 ... Transportation part (board holding part)
3 ... Component supply mechanism (component supply unit)
4A, 4B: mounting unit IU: imaging unit Wp: parts Sa: surface (first surface)
Sb: back surface (second surface)
P: Bump pattern (pattern)
Ia: Captured image (first image)
Im: Captured image (second image)
S101 to S103, S105 ... inspection processing

Claims

A component supply unit for supplying a component having a first surface provided with a pattern and a second surface opposite to the first surface;
A substrate holding unit for holding a substrate;
A component mounting unit for picking up the component supplied by the component supply unit and mounting the component on the substrate with the first surface facing the substrate side;
An imaging unit for imaging the part;
The first surface of the component before being mounted on the substrate is imaged by the imaging unit to obtain a first image, and the second surface of the component after being mounted on the substrate is acquired by the imaging unit A control unit configured to perform an inspection process of performing an inspection on the part based on the first image and the second image by capturing a second image and acquiring the second image;
In the inspection process, the control unit obtains pattern position information indicating the position of the pattern with respect to the outer shape of the first surface from the first image, and the position of the second surface of the component mounted on the substrate A component mounter for obtaining component position information indicating the second image from the second image, and inspecting a positional deviation of the pattern of the component mounted on the substrate based on the pattern position information and the component position information.
The control unit obtains positional relationship information indicating a positional relationship between the first surface and the second surface based on an image obtained by causing the imaging unit to capture the component, and the pattern positional information, the positional relationship information, and The component mounter according to claim 1, wherein misalignment of the pattern of the component mounted on the substrate is inspected based on the component position information.
The component supply unit supplies the component with the second surface facing upward,
In the inspection process, the control unit captures the second surface of the component supplied by the component supply unit and picked up by the component mounting unit by the imaging unit to acquire a third image. The component mounting machine according to claim 2, wherein the positional relationship information is obtained based on the first image and the third image.
The control unit is configured to pick up the first surface of the component before it is picked up from the component supply unit by the component mounting unit and mounted on the substrate by the imaging unit to obtain the first image and to obtain the first image. The component mounting according to any one of claims 1 to 3, wherein the inspection processing is performed, and the position at which the component is mounted on the substrate is adjusted based on the result of recognizing the position of the pattern based on the first image. Machine.
The component mounter according to any one of claims 1 to 4, wherein the control unit can execute the inspection process at one execution interval selected from a plurality of execution intervals.
The part is a diced wafer die,
The plurality of execution intervals is a first execution interval to execute the inspection process each time one die is mounted on the substrate, and the inspection process is executed each time a die of one wafer is mounted on the substrate The component mounter according to claim 5, further comprising at least one of a second execution interval and a third execution interval for executing the inspection process each time a die of one lot of wafers is mounted on the substrate.
The component mounting machine according to claim 5 or 6, wherein the control unit selects the one execution interval from the plurality of execution intervals based on the positional deviation of the pattern of the component inspected in the inspection process. .
The control unit adjusts the position at which the component mounting unit mounts the component on the substrate based on the positional deviation of the pattern of the component inspected in the inspection process that has already been performed. The component mounting machine according to any one of the items.
Imaging the first surface on which the pattern is provided among the first surface of the component before being mounted on the substrate and the second surface opposite to the first surface to obtain a first image;
Imaging the second surface of the component mounted on the substrate with the first surface facing the substrate to obtain a second image;
Obtaining pattern position information indicating the position of the pattern with respect to the outer shape of the first surface from the first image;
Obtaining component position information indicating a position of the second surface of the component mounted on the substrate from the second image;
And inspecting the positional deviation of the pattern of the component mounted on the substrate based on the pattern position information and the component position information.
Imaging the first surface on which the pattern is provided among the first surface of the component before being mounted on the substrate and the second surface opposite to the first surface to obtain a first image;
Imaging the second surface of the component mounted on the substrate with the first surface facing the substrate to obtain a second image;
Obtaining pattern position information indicating the position of the pattern with respect to the outer shape of the first surface from the first image;
Obtaining component position information indicating a position of the second surface of the component mounted on the substrate from the second image;
A component inspection program which causes a computer to execute a step of inspecting a positional deviation of the pattern of the component mounted on the substrate based on the pattern position information and the component position information.
A storage medium for storing the part inspection program according to claim 10 so as to be readable by a computer.