WO2019097675A1 - Dispositif de montage de composant, procédé d'inspection de composant, programme d'inspection de composant et support d'enregistrement - Google Patents

Dispositif de montage de composant, procédé d'inspection de composant, programme d'inspection de composant et support d'enregistrement Download PDF

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Publication number
WO2019097675A1
WO2019097675A1 PCT/JP2017/041470 JP2017041470W WO2019097675A1 WO 2019097675 A1 WO2019097675 A1 WO 2019097675A1 JP 2017041470 W JP2017041470 W JP 2017041470W WO 2019097675 A1 WO2019097675 A1 WO 2019097675A1
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WIPO (PCT)
Prior art keywords
component
substrate
pattern
image
mounting
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PCT/JP2017/041470
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English (en)
Japanese (ja)
Inventor
幸治 横田
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ヤマハ発動機株式会社
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Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to JP2019554146A priority Critical patent/JP6855148B2/ja
Priority to PCT/JP2017/041470 priority patent/WO2019097675A1/fr
Publication of WO2019097675A1 publication Critical patent/WO2019097675A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages

Definitions

  • the present invention relates to a technology for mounting a component provided with a pattern on a substrate, and more particularly to a technology for inspecting the position of the pattern of the component based on an image obtained by imaging the mounted component.
  • components having a bump pattern formed on the surface are generally used.
  • the components may be mounted on the substrate in a state where the positions of the bump patterns are shifted.
  • the present invention has been made in view of the above problems, and it is possible to accurately inspect the misalignment of the pattern of the component based on the image obtained by imaging the component mounted on the substrate regardless of the variation in the position of the pattern with respect to the outer shape of the component. To provide technology that makes it possible.
  • a component mounter comprises a component supply unit for supplying a component having a first surface provided with a pattern and a second surface opposite to the first surface, a substrate holding unit for holding a substrate, and a component supply A component mounting unit for picking up a component supplied by the unit and mounting the first surface on the substrate with the first surface facing the substrate side, an imaging unit for imaging the component, and the first surface of the component before mounting on the substrate
  • the imaging unit captures an image to obtain a first image
  • the imaging unit captures an image of a second surface of the component mounted on the substrate using the imaging unit to obtain a second image, and based on the first image and the second image
  • the component A control unit that executes an inspection process for performing an inspection, and in the inspection process, the control unit determines pattern position information indicating the position of the pattern with respect to the outline of the first surface from the first image, and a component mounted on the substrate Indicates the position of the second side of the The part position information obtained from the second image, checking the positional deviation of the part of
  • the first surface on which the pattern is provided is imaged to obtain the first image.
  • Step of acquiring step of imaging the second surface of the component mounted on the substrate with the first surface facing the substrate to acquire a second image, and pattern position indicating the position of the pattern with respect to the outline of the first surface
  • a process of obtaining information from the first image a process of obtaining component position information indicating the position of the second surface of the component mounted on the substrate from the second image, and mounting on the substrate based on the pattern position information and the component position information Inspecting the misalignment of the part pattern.
  • the component inspection program images a first surface on which a pattern is provided among the first surface and the second surface opposite to the first surface of the component before being mounted on a substrate, and generates a first image.
  • Step of acquiring step of imaging the second surface of the component mounted on the substrate with the first surface facing the substrate to acquire a second image, and pattern position indicating the position of the pattern with respect to the outline of the first surface
  • a process of obtaining information from the first image a process of obtaining component position information indicating the position of the second surface of the component mounted on the substrate from the second image, and mounting on the substrate based on the pattern position information and the component position information
  • a storage medium stores the above-described part inspection program in a readable manner by a computer.
  • the first surface (surface provided with the pattern) of the component before mounting on the substrate is imaged A first image is acquired, and based on the first image, pattern position information indicating the position of the pattern with respect to the outline of the first surface is obtained.
  • the second surface (surface opposite to the first surface) of the component after being mounted on the substrate is imaged to obtain a second image, and the position of the second surface of the component is indicated based on the second image. Part position information is obtained. Then, based on the pattern position information and the component position information, the misalignment of the pattern of the component mounted on the substrate is inspected.
  • the misalignment of the pattern is inspected not only based on the position of the second surface of the mounted part but also on the position of the pattern with respect to the outline of the first surface of the part.
  • the control unit obtains positional relationship information indicating the positional relationship between the first surface and the second surface based on the image obtained by causing the imaging unit to capture the component, and based on the pattern position information, the positional relationship information, and the component position information.
  • the component mounter may be configured to inspect misalignment of the pattern of the component mounted on the substrate. In this configuration, the positional deviation of the pattern is inspected based also on positional relationship information indicating the positional relationship between the first surface and the second surface.
  • the component supply unit supplies the component with the second surface directed upward, and in the inspection process, the control unit supplies the component before the component supply unit supplies it and is picked up by the component mounting unit.
  • the component mounter may be configured to capture the second surface of the image by the imaging unit to obtain a third image, and obtain positional relationship information based on the first image and the third image.
  • control unit picks up the first surface of the component before being picked up from the component supply unit by the component mounting unit and mounted on the substrate by the imaging unit to acquire a first image and execute inspection processing.
  • the component mounter may be configured to adjust the position at which the component is mounted on the substrate based on the result of recognizing the position of the pattern based on the first image. In such a configuration, pattern recognition processing and inspection processing for adjusting the mounting position of the component are executed based on the common first image, and efficient control is realized.
  • control unit may configure the component mounter so that the inspection process can be performed at one execution interval selected from the plurality of execution intervals.
  • the inspection process can be performed at an appropriate execution interval in consideration of the necessity of inspection of pattern misalignment and the efficiency of component mounting.
  • the component is a die of a diced wafer, and a plurality of execution intervals is a first execution interval to execute an inspection process each time one die is mounted on a substrate, and one wafer portion So as to include at least one of a second execution interval for performing the inspection process each time the die is mounted on the substrate and a third execution interval for performing the inspection process each time the die for one lot of wafers is mounted on the substrate;
  • a component mounter may be configured.
  • control unit may configure the component mounter so as to select one execution interval from among a plurality of execution intervals based on the positional deviation of the pattern of the component inspected in the inspection process. In such a configuration, it is possible to make appropriate the execution interval of the inspection process after the executed inspection process based on the positional deviation of the pattern inspected in the executed inspection process.
  • control unit may configure the component mounting machine to adjust the position at which the component mounting unit mounts the component on the substrate based on the positional deviation of the pattern of the component inspected in the executed inspection process. . By this, it is possible to mount the component on the substrate while suppressing the positional deviation of the pattern.
  • the present invention it becomes possible to accurately inspect the positional deviation of the pattern of the component based on the image obtained by imaging the component mounted on the substrate, regardless of the variation in the position of the pattern with respect to the outer shape of the component.
  • FIG. 2 is a block diagram showing an electrical configuration of the component mounter of FIG. 1; The figure which shows typically an example of the components used as the object of mounting by the component mounting machine of FIG.
  • 5 is a flowchart showing an example of part back surface recognition in the flowchart of FIG. 4;
  • 5 is a flowchart showing an example of component surface recognition in the flowchart of FIG. 4;
  • FIG. 1 is a plan view schematically showing an example of a component mounter according to the present invention.
  • FIG. 2 is a block diagram showing an electrical configuration of the mounter of FIG.
  • XYZ orthogonal coordinate axes configured of a transport direction X, a width direction Y, and a vertical direction Z are appropriately used.
  • the transport direction X and the width direction Y are parallel to the horizontal direction and orthogonal to each other, and the vertical direction Z is orthogonal to the transport direction X and the width direction Y.
  • the component mounting machine 10 mounts the component Wp on the substrate 1 carried in from the upstream side in the transport direction X and carries it out to the downstream side in the transport direction X.
  • a plurality of mounting target points 1a are provided on the upper surface of the substrate 1, and the control unit 100 provided in the component mounting machine 10 controls the respective components of the component mounting machine 10 to provide components at each mounting target point 1a.
  • the control unit 100 includes an operation unit 110 which is a processor having an arithmetic function for controlling the entire component mounter 10, and an image processing unit 120 which performs image processing based on an instruction of the operation unit 110. And a drive control unit 130 that controls a drive mechanism such as a motor based on a command from the calculation unit 110. Furthermore, the control unit 100 includes a storage unit 140 configured of an HDD (Hard Disk Drive) or the like. The storage unit 140 stores a component inspection program 150 for causing the calculation unit 110 to execute a component inspection to be described later.
  • HDD Hard Disk Drive
  • the component inspection program 150 is stored and provided in a recording medium 160 such as a DVD (Digital Versatile Disc) or USB (Universal Serial Bus), for example, and the computing unit 110 stores the component inspection program 150 read from the recording medium 160 Save to 140
  • a recording medium 160 such as a DVD (Digital Versatile Disc) or USB (Universal Serial Bus)
  • the computing unit 110 stores the component inspection program 150 read from the recording medium 160 Save to 140
  • the provision form of the component inspection program 150 is not limited to this, and the component inspection program 150 may be provided, for example, in the form of downloading from an Internet server.
  • the component mounter 10 includes a transport unit 2 that transports the substrate 1 in the transport direction X.
  • the transport unit 2 has two mounting work positions 21 aligned in the transport direction X, and carries the substrate 1 to each mounting work position 21 from the upstream side in the transport direction X. Further, the transport unit 2 unloads the substrate 1 on which the component Wp is mounted at each mounting work position 21 from the mounting work position 21 to the downstream side in the transport direction X.
  • the component mounter 10 further includes a component supply mechanism 3 for supplying the component Wp.
  • the parts Wp supplied by the parts supply mechanism 3 are dies (bare chips) of the diced wafer W. That is, the component supply mechanism 3 has a wafer storage unit 31 capable of storing a plurality of wafers W, and a wafer extraction unit 33 for extracting the wafer W from the wafer storage unit 31 to the component supply position 32.
  • the wafer storage unit 31 arranges a plurality of wafer holders Wh for holding the wafers W in the vertical direction Z and raises and lowers a rack for storing the wafers W at a height at which the wafer lead-out unit 33 can receive the wafers W.
  • One wafer holder Wh can be positioned and the wafer holder Wh can be pushed out to the wafer lead-out portion 33.
  • the wafer lead-out portion 33 includes a wafer support table 331 supporting the wafer holder Wh, a fixed rail 332 supporting the wafer support table 331 movably in the width direction Y, and is provided in the width direction Y and attached to the wafer support table 331 And a Y-axis motor 334 for driving the ball screw 333. Therefore, the wafer support table 331 can be moved in the width direction Y along the fixed rail 332 by rotating the ball screw 333 by the Y-axis motor 334. As shown in FIG. 1, the wafer storage unit 31 and the component supply position 32 are disposed so as to sandwich the transport unit 2 in the width direction Y, and the wafer support table 331 passes below the transport unit 2.
  • the wafer support table 331 receives the wafer holder Wh from the wafer storage unit 31 at the reception position adjacent to the wafer storage unit 31 and moves from the reception position to the component supply position 32 to move the wafer W to the component supply position 32. Pull out.
  • the component supply mechanism 3 has a component extraction unit 35 for extracting the component Wp from the component supply position 32.
  • the component pick-up unit 35 has a pick-up head 36 for picking the component Wp from the component supply position 32, and the pick-up head 36 is movable in the X and Y directions. That is, the component extraction unit 35 includes a support member 351 for supporting the extraction head 36 so as to be movable in the conveyance direction X, and an X-axis motor 352 for driving the ball screw provided in the conveyance direction X and attached to the extraction head 36. Have. Therefore, the drive control unit 130 can move the takeout head 36 in the transport direction X by rotating the X-axis motor 352.
  • the component pick-up portion 35 also drives a fixed rail 353 for supporting the support member 351 so as to be movable in the width direction Y, a ball screw 354 provided in the width direction Y and attached to the fixed rail 353, and Y for driving the ball screw 354. And an axial motor 355. Therefore, the drive control unit 130 can move the takeout head 36 together with the support member 351 in the width direction Y by rotating the Y-axis motor 355.
  • the take-out head 36 has a bracket 361 extending in the transport direction X, and two nozzles 362 rotatably supported by the bracket 361. Each nozzle 362 is positioned at either the suction position facing downward or the delivery position facing upward (position in FIG. 1) by rotating around a rotation axis parallel to the transport direction X. In addition, the bracket 361 can move up and down with each nozzle 362.
  • the component pick-up unit 35 has a moving camera 356 that picks up an image of the component Wp at the component supply position 32 from above with an image sensor, and the moving camera 356 is movable in the X and Y directions. That is, in the component pickup portion 35, the movable camera 356 is supported movably in the transport direction X by the support member 351.
  • the component extraction unit 35 has an X-axis motor 357 which is provided in the transport direction X and drives a ball screw attached to the moving camera 356.
  • the drive control unit 130 can move the moving camera 356 in the transport direction X by rotating the X-axis motor 357, and the width of the moving camera 356 together with the support member 351 by rotating the Y-axis motor 355. It can be moved in the direction Y.
  • the component supply mechanism 3 supplies components Wp as follows. That is, the drive control unit 130 moves the moving camera 356 above the component Wp to be supplied among the plurality of components Wp of the component supply position 32. Subsequently, the moving camera 356 captures an image of the part Wp, transfers the captured image to the image processing unit 120, and the image processing unit 120 recognizes the position of the part Wp from the captured image. Then, the drive control unit 130 drives the nozzle 362 based on the recognition result by the image processing unit 120 to make the nozzle 362 located at the suction position face the component Wp from above, lower the nozzle 362 to move the component Wp.
  • the drive control unit 130 picks up the component Wp from the component supply position 32 by raising the nozzle 362 while applying a negative pressure to the nozzle 362. Then, the drive control unit 130 supplies the component Wp by positioning the nozzle 362 at the delivery position.
  • the component mounter 10 includes two mounting units 4 for mounting the component Wp thus supplied by the component supply mechanism 3 on the substrate 1.
  • the two mounting units 4 are provided in a one-to-one correspondence relationship with the two mounting work positions 21.
  • Each mounting unit 4 includes a support member 41 movable along a fixed rail provided on the ceiling of the component mounter 10 in the width direction Y, and a mounting head 42 supported movably in the transport direction X by the support member 41.
  • an X-axis motor 43 for driving a ball screw provided in the transport direction X and attached to the mounting head 42 and a Y-axis motor 44 provided in the width direction Y and attached to the support member 41 are provided. Therefore, the drive control unit 130 can move the mounting head 42 in the transport direction X by rotating the X-axis motor 43, and the mounting head 42 along with the support member 41 by rotating the Y-axis motor 44. Can be moved in the width direction Y.
  • the mounting head 42 of each of the mounting portions 4A and 4B moves to the upper side of the takeout head 36, and the nozzle 421 is placed from above the component Wp held by the nozzle 362 located at the delivery position.
  • the nozzle 421 is lowered to contact the part Wp.
  • the component supply mechanism 3 releases the negative pressure of the nozzle 362, and the mounting parts 4A and 4B apply a negative pressure to the nozzle 421, cause the nozzle 421 to adsorb the component Wp, raise the nozzle 421 while applying a negative pressure.
  • the mounting head 42 picks up the component Wp by the nozzle 421.
  • the component supply mechanism 3 has two nozzles 362, and these nozzles 362 can simultaneously supply two components Wp.
  • the mounting head 42 has two nozzles 421 corresponding to the two nozzles 362 of the component supply mechanism 3, and the two components Wp supplied by the component supply mechanism 3 are two nozzles It can be picked up at the same time by 421. However, it is not essential to simultaneously supply and pick up the two parts Wp.
  • each mounting unit 4 has a moving camera 45 provided facing downward.
  • the moving camera 45 images the component Wp supplied by the component supply mechanism 3 and the component Wp mounted on the substrate 1 from above by the image sensor.
  • the moving camera 45 is attached to the mounting head 42, and the drive control unit 130 moves the moving camera 45 in the XY direction like the mounting head 42 by rotating the X-axis motor 43 and the Y-axis motor 44. Can.
  • the component mounter 10 further includes a fixed camera 5 provided for each mounting unit 4.
  • the fixed camera 5 faces upward and is fixed to a base, and captures an image of the component Wp located above, as described later, from below by an image sensor.
  • an imaging unit IU including the moving camera 45, the fixed camera 5 and the moving camera 356 is configured.
  • FIG. 3 is a view schematically showing an example of a component to be mounted by the component mounting machine of FIG.
  • the part Wp in a state of being supplied to the part supply position 32 is illustrated.
  • the surface Sa and the back surface Sb (surface opposite to the surface Sa) of the component Wp are both formed in a rectangular shape.
  • a plurality of bumps B are provided side by side in a matrix on the surface Sa of the component Wp, and a bump pattern P is formed by these bumps B.
  • the part Wp is cut obliquely to the surface Sa (or the back surface Sb) due to the cutting accuracy in dicing, so the surface Sa and the back surface Sb are in the in-plane direction They are mutually offset (in the lateral direction of FIG. 3).
  • each component Wp is disposed with its surface Sa facing upward, and the takeout head 36 is moved by the nozzle 362 located at the suction position. By suctioning the surface Sa, the component Wp is picked up. Then, the take-out head 36 supplies the component Wp by rotating the nozzle 362 from the suction position to the delivery position. Since the part Wp is reversed as the nozzle 362 rotates, the part Wp is supplied with its back surface Sb directed upward. Therefore, the mounting head 42 picks up the component Wp by adsorbing the back surface Sb of the component Wp with the nozzle 421.
  • FIG. 4 is a flowchart showing an example of component mounting performed by the component mounting machine of FIG. 1
  • FIG. 5 is a flowchart showing an example of component back surface recognition performed in the flowchart of FIG. 4
  • FIG. 7 is a flowchart showing an example of component surface recognition performed in the flowchart
  • FIG. 7 is a flowchart showing an example of component inspection performed in the flowchart of FIG. 4.
  • the flowcharts of FIGS. 4 to 7 are executed by the arithmetic unit 110 controlling each part of the component mounter 10 according to the component inspection program 150.
  • the arithmetic unit 110 controlling each part of the component mounter 10 according to the component inspection program 150.
  • step S101 component back surface recognition is executed in step S101.
  • the moving camera 45 moves above the component Wp supplied by the component supply mechanism 3 and faces the back surface Sb of the component Wp from above (step S201).
  • step S202 the moving camera 45 captures an image of the back surface Sb of the part Wp, and transmits the captured image Ib to the image processing unit 120.
  • the image processing unit 120 recognizes the outer shape of the back surface Sb of the part Wp based on the captured image Ib of the back surface Sb of the part Wp (step S203), and returns to the flowchart of FIG.
  • step S102 the mounting head 42 sucks the component Wp, which is the imaging target of the moving camera 45 in step S101, by the nozzle 421 (step S102). As described above, the mounting head 42 sucks the back surface Sb of the component Wp from above, and the component Wp is picked up by the mounting head 42 with the surface Sa directed downward. Thus, when the mounting head 42 picks up the component Wp, component surface recognition in step S103 is performed.
  • the mounting head 42 moves the picked up component Wp above the fixed camera 5 (step S301).
  • the fixed camera 5 images the surface Sa of the part Wp from below, and transmits the captured image Ia of the surface Sa of the part Wp to the image processing unit 120.
  • the image processing unit 120 calculates the difference between the center positions of the front surface Sa and the rear surface Sb of the component Wp (step S303). Specifically, based on the outline of the back surface Sb of the component Wp recognized by the component back surface recognition in step S101, the geometric center of this outline is calculated as the back surface center Cb (FIG. 5).
  • the surface center Ca and the back surface center Cb are XY coordinates, and the front and back positional deviation amount ⁇ is a vector amount.
  • the pattern center Cp is XY coordinates as in the case of the surface center Ca, and the pattern positional deviation amount ⁇ is a vector amount.
  • step S104 the mounting head 42 mounts the component Wp to be adsorbed to the nozzle 421 on the mounting target point 1a with the surface Sa facing the substrate 1 side.
  • the pattern center Cp calculated in step S304 matches the predetermined mounting reference position (for example, the geometric center of the mounting target point 1a) representative of the mounting target point 1a. Adjusted.
  • the component Wp is mounted on the mounting target point 1a with the surface Sa facing the substrate 1 (in other words, with the back surface Sb facing upward).
  • the part inspection in step S105 is performed.
  • step S401 the mobile camera 45 moves above the component Wp mounted on the mounting target point 1a in step S104 (hereinafter, referred to as "mounted component Wp" as appropriate) (step S401).
  • step S402 the moving camera 45 captures an image of the back surface Sb of the mounted component Wp from above, and transmits the captured image Im to the image processing unit 120 (step S402).
  • the image processing unit 120 calculates the geometric center of the back surface Sb of the mounted component Wp as the mounting component back surface center Cbm based on the captured image Im of the back surface Sb of the mounted component Wp (step 403).
  • step S404 the image processing unit 120 calculates the center (mounting center Cpm) of the bump pattern P of the mounted component Wp based on the mounting component back surface center Cbm, the front / back positional deviation amount ⁇ , and the pattern positional displacement amount ⁇ . Then, when the image processing unit 120 calculates the difference between the mounting center Cpm and the mounting reference position as the mounting positional deviation amount ⁇ and stores the calculated amount in the storage unit 140 (step S405), the process returns to the flowchart of FIG.
  • the mounting component back surface center Cbm, the mounting center Cpm, and the mounting reference position are XY coordinates, and the mounting positional deviation amount ⁇ is a vector amount.
  • step S106 it is determined whether the mounting of the component Wp on all mounting target points 1a of the substrate 1 is completed. If the mounting is not completed (in the case of "NO” in step S106), steps S101 to S105 are repeated. In the subsequent component mounting in step S104, the mounting position of the component Wp is adjusted so as to cancel the mounting position shift amount ⁇ obtained in step S405. Then, when the mounting of the component Wp on all the mounting target points 1a is completed (“YES” in step S106), the component mounting of FIG. 4 ends.
  • the captured image Ia (first image) is obtained by imaging the surface Sa (surface on which the bump pattern P is provided) of the component Wp before being mounted on the substrate 1. Based on the captured image Ia, a pattern displacement amount ⁇ (pattern position information) indicating the position of the bump pattern P with respect to the outer shape of the surface Sa is obtained (step S305). Further, the back surface Sb of the component Wp after being mounted on the substrate 1 is imaged to obtain a captured image Im (second image) (step S402), and the position of the back surface Sb of the component Wp is determined based on the captured image Im. The mounted component back surface center Cbm (component position information) shown is determined (step S403).
  • the positional deviation of the bump pattern P of the component Wp mounted on the substrate 1 is inspected based on the pattern positional deviation amount ⁇ and the mounting component back surface center Cbm (step S405).
  • the position (pattern displacement amount ⁇ ) of the bump pattern P with respect to the outer shape of the surface Sa of the component Wp The mounting positional deviation amount ⁇ ) is inspected.
  • the positional deviation of the bump pattern P of the component Wp is accurately inspected based on the captured image Im obtained by imaging the component Wp mounted on the substrate 1 Is possible.
  • the position of the front surface Sa and the back surface Sb of the component Wp due to the precision of the manufacturing process of the component Wp, specifically the inclination of the cutting surface in dicing.
  • the position of is shifted in the in-plane direction.
  • the position of the front surface Sa and the position of the back surface Sb are shifted in the transport direction X by the front / back position shift amount ⁇ (note that the size and direction of the front / back position shift amount ⁇ are limited to the example of FIG. 3). Not).
  • the control unit 100 Front and back positional deviation amount ⁇ (positional relationship information) indicating the positional relationship with the back surface Sb is determined (step S303). Then, the positional deviation of the bump pattern P of the component Wp mounted on the substrate 1 is inspected based on the pattern positional deviation amount ⁇ , the front and back positional deviation amount ⁇ , and the mounting component back surface center Cbm (step S405).
  • the positional deviation of the bump pattern P is inspected based on the front / rear positional deviation amount ⁇ indicating the positional relationship between the front surface Sa and the back surface Sb.
  • the positional deviation of the bump pattern P of the component Wp is accurately inspected based on the captured image Im obtained by imaging the component Wp mounted on the substrate 1 Is possible.
  • control unit 100 picks up the surface Sa of the component Wp before being picked up from the component supply mechanism 3 by the mounting head 42 and mounted on the substrate 1 by the fixed camera 5 to obtain a picked up image Ia (step S302) ), Perform inspection of the part Wp. Further, in step S304, the position at which the component Wp is mounted on the substrate 1 is adjusted based on the result of recognizing the position of the bump pattern P based on the captured image Ia. In this configuration, recognition processing of the bump pattern P for adjusting the mounting position of the component Wp and calculation of the pattern center Cp of the bump pattern P for inspection of the component Wp are performed based on the common captured image Ia. Efficient control is realized.
  • control unit 100 adjusts the position at which the mounting head 42 mounts the component Wp on the substrate 1 based on the positional deviation (mounting positional deviation amount ⁇ ) of the bump pattern P of the component Wp inspected at step S405. (Step S104). As a result, it is possible to mount the component Wp on the substrate 1 while suppressing the displacement of the bump pattern P.
  • the component mounter 10 corresponds to an example of the “component mounter” of the present invention
  • the component supply mechanism 3 corresponds to an example of the “component supply unit” of the present invention
  • the transport unit 2 The mounting units 4A and 4B correspond to an example of the "component mounting unit” of the present invention
  • the imaging unit IU corresponds to an example of the "imaging unit” of the present invention.
  • the control unit 100 corresponds to an example of the “control unit” of the present invention
  • the component Wp corresponds to an example of the “component” of the present invention
  • the surface Sa corresponds to an example of the “first surface” of the present invention
  • the back surface Sb corresponds to an example of the “second surface” of the present invention
  • the bump pattern P corresponds to an example of the “pattern” of the present invention
  • the captured image Ia corresponds to an example of the “first image” of the present invention
  • the captured image Im corresponds to an example of the “second image” in the present invention
  • the captured image Ib corresponds to the “third image” in the present invention.
  • the pattern positional deviation amount ⁇ corresponds to an example of “pattern position information” in the present invention
  • the mounting component back surface center Cbm corresponds to an example of “component position information” in the present invention
  • steps S101 to S103 and S105 corresponds to an example of the “inspection process” of the present invention
  • front and back positional deviation amount ⁇ corresponds to an example of the “positional relationship information” of the present invention
  • the parts inspection program 150 is an example of the “parts inspection program” of the present invention
  • the recording medium 160 corresponds to an example of the "recording medium” in the present invention.
  • control unit 100 may execute the inspection process (steps S101 to S103 and S105) at one execution interval selected from a plurality of different execution intervals. This makes it possible to execute inspection processing at an appropriate execution interval in consideration of the necessity of inspection of the mounting position deviation amount ⁇ of the bump pattern P and the efficiency of component mounting.
  • the plurality of execution intervals are a first execution interval at which an inspection process is performed each time one component Wp (die) is mounted on the substrate 1, and the components Wp of one wafer W are substrate 1
  • the second execution interval for executing the inspection process each time mounted on the board, and at least one of the third execution interval for executing the inspection process each time the parts Wp of one lot of wafers W are mounted on the substrate
  • the control unit 100 can be configured to include the interval.
  • the plurality of execution intervals include the first to third execution intervals, the inspection process is executed at the first execution interval when the cutting position accuracy in dicing is low, and the cutting position accuracy is higher than this.
  • the inspection process is executed at the second execution interval, and if the cutting position accuracy is higher than that, the inspection process is executed at the third execution interval. That is, the inspection process can be performed at a longer execution interval as the cutting position accuracy by dicing is higher, and at an appropriate execution interval taking into consideration the necessity of inspection of the mounting position shift amount ⁇ of the bump pattern P and the efficiency of component mounting. Can perform inspection processing.
  • control unit 100 may select one execution interval according to the user's input.
  • control unit 100 may select one execution interval from a plurality of execution intervals based on the mounting position shift amount ⁇ position of the bump pattern P of the part Wp inspected in the inspection process. In this configuration, based on the positional deviation of the bump pattern P inspected in the executed inspection process, the execution interval of the inspection process after the executed inspection process can be made appropriate.
  • the inspection processing may be shortened, and conversely, the execution interval of the inspection process may be lengthened when it decreases by the predetermined value or more.
  • the execution interval of the inspection process may be changed based on the result of comparing the moving average of the mounting positional deviation amount ⁇ in two or more executed inspection processes with a predetermined threshold. That is, when the moving average exceeds the threshold, the execution interval of the inspection process is lengthened, and when the moving average becomes equal to or less than the threshold, the execution interval of the inspection process is shortened.
  • the front / back positional deviation amount ⁇ indicating the positional relationship between the front surface Sa and the back surface Sb of the component Wp is obtained based on component back surface recognition (step S101) for recognizing the back surface Sb of the component Wp from the captured image Ib. (Step S303).
  • the specific method for obtaining the front and back positional deviation amount ⁇ is not limited to this. That is, the front and back positional deviation amount ⁇ can be obtained by imaging the part Wp from the side and imaging an image as shown in “side view” in FIG. 3.
  • the positional deviation of the bump pattern P of the component Wp mounted on the substrate 1 is inspected based on the front and back positional deviation amount ⁇ , the pattern positional deviation amount ⁇ , and the mounting component back surface center Cbm (step S405).
  • the cutting accuracy in dicing is good and the positional deviation between the front surface Sa and the rear surface Sb is minimal, such control is unnecessary.
  • steps S101 and S303 may be omitted, and the positional deviation of the bump pattern P of the component Wp mounted on the substrate 1 may be inspected based on the pattern positional deviation amount ⁇ and the mounting component back surface center Cbm (step S405). Also in this case, based on not only the position of the back surface Sb of the mounted component Wp, but also the position (pattern displacement amount ⁇ ) of the bump pattern P with respect to the outer shape of the surface Sa of the component Wp (Mounting positional deviation amount ⁇ ) is inspected.
  • the positional deviation of the bump pattern P of the component Wp is accurately inspected based on the captured image Im obtained by imaging the component Wp mounted on the substrate 1 Is possible.
  • the surface Sa of the component Wp is imaged by the fixed camera 5 to acquire the imaged image Ia.
  • the captured image Ia of the surface Sa of the part Wp may be acquired by capturing the part Wp of the part supply position 32 with the moving camera 356.
  • the inspection of the displacement of the bump pattern P is performed based on the center position such as the surface center Ca, the pattern center Cp, the mounted component back surface center Cbm or the back surface center Cb.
  • the reference for inspection of misalignment is not limited to these center positions, and is provided in advance at a value that can represent the position of the surface Sa, back surface Sb or bump pattern P of the component Wp, for example, at predetermined positions. It is sufficient if the position of the mark is present.
  • the part Wp may be changed.
  • the type of the component Wp is not limited to the die (bare chip).
  • the “pattern” is not limited to the bump pattern P in the above example, but also includes a wiring pattern and the like.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)

Abstract

Selon la présente invention, une image capturée (la) est obtenue par imagerie de la surface avant (Sa) d'un composant (Wp) qui n'a pas encore été monté sur un substrat (1), et sur la base de l'image capturée (Ia), une valeur de déplacement (β) d'une position de motif indiquant la position d'un motif bosselé (P) par rapport au contour de la surface avant (Sa) est déterminée. Une image capturée (Im) est obtenue par imagerie de la surface arrière (Sb) du composant (Wp) qui a été monté sur le substrat (1), et sur la base de l'image capturée (Im), un centre de la surface arrière du composant monté (Cbm) indiquant la position de la surface arrière (Sb) du composant (Wp) est déterminé. Le déplacement de position du motif bosselé (P) sur le composant (Wp) monté sur le substrat (1) est inspecté sur la base de la valeur de déplacement (β) de la position de motif et du centre de la surface arrière du composant monté (Cbm). Par conséquent, il est possible d'inspecter avec précision le déplacement de position du motif bosselé (P) sur le composant (Wp) sur la base de l'image capturée (Im) obtenue par imagerie du composant (Wp) monté sur le substrat (1), indépendamment des variations de la position du motif bosselé (P) par rapport au contour du composant (Wp).
PCT/JP2017/041470 2017-11-17 2017-11-17 Dispositif de montage de composant, procédé d'inspection de composant, programme d'inspection de composant et support d'enregistrement WO2019097675A1 (fr)

Priority Applications (2)

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JP2019554146A JP6855148B2 (ja) 2017-11-17 2017-11-17 部品実装機、部品検査方法、部品検査プログラム、記録媒体
PCT/JP2017/041470 WO2019097675A1 (fr) 2017-11-17 2017-11-17 Dispositif de montage de composant, procédé d'inspection de composant, programme d'inspection de composant et support d'enregistrement

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PCT/JP2017/041470 WO2019097675A1 (fr) 2017-11-17 2017-11-17 Dispositif de montage de composant, procédé d'inspection de composant, programme d'inspection de composant et support d'enregistrement

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112599445A (zh) * 2020-12-13 2021-04-02 无锡英诺赛思科技有限公司 一种半导体贴片机晶片反向防呆装置
WO2023181346A1 (fr) * 2022-03-25 2023-09-28 株式会社Fuji Dispositif d'aide à l'inspection, système de gestion de production et procédé d'aide à l'inspection

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537195A (ja) * 1991-07-30 1993-02-12 Sony Corp 実装位置決めシステム
JPH05226900A (ja) * 1992-02-18 1993-09-03 Hitachi Ltd 位置検査方法および装置
JP2011091181A (ja) * 2009-10-22 2011-05-06 Panasonic Corp 部品実装システムおよび実装状態検査方法
JP2014103191A (ja) * 2012-11-19 2014-06-05 Panasonic Corp 電子部品実装システムおよび電子部品実装方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537195A (ja) * 1991-07-30 1993-02-12 Sony Corp 実装位置決めシステム
JPH05226900A (ja) * 1992-02-18 1993-09-03 Hitachi Ltd 位置検査方法および装置
JP2011091181A (ja) * 2009-10-22 2011-05-06 Panasonic Corp 部品実装システムおよび実装状態検査方法
JP2014103191A (ja) * 2012-11-19 2014-06-05 Panasonic Corp 電子部品実装システムおよび電子部品実装方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112599445A (zh) * 2020-12-13 2021-04-02 无锡英诺赛思科技有限公司 一种半导体贴片机晶片反向防呆装置
CN112599445B (zh) * 2020-12-13 2022-05-20 无锡英诺赛思科技有限公司 一种半导体贴片机晶片反向防呆装置
WO2023181346A1 (fr) * 2022-03-25 2023-09-28 株式会社Fuji Dispositif d'aide à l'inspection, système de gestion de production et procédé d'aide à l'inspection

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