CN111954457A - Electronic component mounting device and electronic component mounting method - Google Patents

Electronic component mounting device and electronic component mounting method Download PDF

Info

Publication number
CN111954457A
CN111954457A CN202010412931.8A CN202010412931A CN111954457A CN 111954457 A CN111954457 A CN 111954457A CN 202010412931 A CN202010412931 A CN 202010412931A CN 111954457 A CN111954457 A CN 111954457A
Authority
CN
China
Prior art keywords
electronic component
identification code
nozzle
nozzles
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010412931.8A
Other languages
Chinese (zh)
Other versions
CN111954457B (en
Inventor
奥田忠雅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juki Corp filed Critical Juki Corp
Publication of CN111954457A publication Critical patent/CN111954457A/en
Application granted granted Critical
Publication of CN111954457B publication Critical patent/CN111954457B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/041Incorporating a pick-up tool having multiple pick-up tools
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/085Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/087Equipment tracking or labelling, e.g. tracking of nozzles, feeders or mounting heads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention provides an electronic component mounting device and an electronic component mounting method, which can smoothly implement suction nozzle management or traceability management under the condition that a suction nozzle provided with an identification code and a suction nozzle not provided with the identification code exist in a mixed way. The electronic component mounting device is provided with: a mounting head having a plurality of suction nozzles for holding electronic components and mounting the electronic components on a substrate; a detection device that detects whether an identification code is set in each of the plurality of suction nozzles; and a priority instruction unit that outputs a priority instruction for preferentially using the nozzle with the identification code as compared with a nozzle without the identification code.

Description

Electronic component mounting device and electronic component mounting method
Technical Field
The invention relates to an electronic component mounting apparatus and an electronic component mounting method.
Background
An electronic component mounting apparatus is used in a manufacturing process of an electronic device. The electronic component mounting device includes a mounting head for mounting an electronic component on a substrate. The mounting head has a plurality of suction nozzles that hold electronic components. Sometimes an identification code is provided at the mouthpiece. Nozzle management or traceability management is performed based on the identification code. Patent document 1 discloses a technique in which an identification code tag is attached to an adsorption nozzle.
Patent document 1: japanese patent No. 5637770
[ SUMMARY OF THE INVENTION ]
In the electronic component mounting apparatus, there are cases where a nozzle provided with an identification code and a nozzle not provided with an identification code are mixed. If nozzles that are not provided with identification codes are used, it may be difficult to implement nozzle management or traceability management.
Disclosure of Invention
An object of an embodiment of the present invention is to smoothly perform nozzle management or traceability management when a nozzle provided with an identification code and a nozzle not provided with an identification code are present in a mixed manner.
According to the 1 st aspect of the present invention, there is provided an electronic component mounting apparatus comprising: a mounting head having a plurality of suction nozzles for holding electronic components, the mounting head mounting the electronic components on a substrate; a detection device that detects whether an identification code is provided to each of the plurality of suction nozzles; and a priority instruction unit that outputs a priority instruction for preferentially using the nozzle provided with the identification code over the nozzle not provided with the identification code.
According to the 2 nd aspect of the present invention, there is provided an electronic component mounting method including: detecting whether an identification code is set for each of a plurality of suction nozzles of a mounting head for mounting an electronic component on a substrate; and preferentially using the suction nozzle provided with the identification code as compared with the suction nozzle not provided with the identification code.
According to the aspect of the present invention, nozzle management or traceability management can be smoothly performed when a nozzle provided with an identification code and a nozzle not provided with an identification code are mixedly present.
Drawings
Fig. 1 is a side view schematically showing an electronic component mounting apparatus according to an embodiment.
Fig. 2 is a plan view schematically showing the electronic component mounting apparatus according to the embodiment.
Fig. 3 is a side view showing the suction nozzle according to the embodiment.
Fig. 4 is a side view showing the suction nozzle according to the embodiment.
Fig. 5 is a functional block diagram illustrating a control device according to an embodiment.
Fig. 6 is a flowchart illustrating an electronic component mounting method according to an embodiment.
Fig. 7 is a side view schematically showing the storage device according to the embodiment.
Fig. 8 is a diagram for explaining a detection process performed by the detection device according to the embodiment.
Fig. 9 is a diagram illustrating a notification device according to an embodiment.
Fig. 10 is a diagram illustrating a notification device according to an embodiment.
Fig. 11 is a diagram schematically showing the mounting head when outputting the priority command according to the embodiment.
Fig. 12 is a diagram schematically showing the mounting head according to the embodiment when the priority command is not output.
Fig. 13 is a block diagram showing a computer system according to an embodiment.
Description of reference numerals:
1: an electronic component mounting device; 2: an electronic component supply device; 3: a substrate supporting device; 4: a suction nozzle; 4A: a 1 st suction nozzle; 4B: a 2 nd suction nozzle; 5: a mounting head; 5S: a shaft; 6: a suction nozzle moving device; 7: a head moving device; 7X: an X-axis moving device; 7Y: a Y-axis moving device; 8: a detection device; 9: a storage device; 10: an input device; 11: a notification device; 12: a control device; 13: an identification code; 14: a slot; 14A: a 1 st slot; 14B: a 2 nd slot; 14C: a 3 rd slot; 14D: a 4 th slot; 14E: a 5 th slot; 14F: a 6 th slot; 14G: a 7 th slot; 14H: the 8 th slot; 21: a detection data acquisition unit; 22: an input data acquisition unit; 23: a determination unit; 24: a priority command unit; 25: an operation instruction unit; 26: a required time calculation unit; 27: a notification control unit; 28: an identification data storage unit; 29: a production program storage unit; 41: a connecting portion; 42: 1 st main body part; 42A: a recess; 43: a flange portion; 44: a 2 nd main body part; 45A: a holding section; 45 Aa: a straight portion; 45 Ab: a tapered portion; 45B: a holding section; 45 Ba: a straight portion; 45 Bb: a large diameter portion; 1000: a computer system; 1001: a processor; 1002: a main memory; 1003: a memory; 1004: an interface; c: an electronic component; MP: mounting position; p: a substrate; SP: a supply position.
Detailed Description
Embodiments according to the present invention will be described below with reference to the drawings, but the present invention is not limited to the embodiments described herein. The constituent elements of the embodiments described below can be combined as appropriate. In addition, some of the components may not be used.
In the embodiment, an XYZ rectangular coordinate system is set, and the positional relationship of each part will be described with reference to the XYZ rectangular coordinate system. The direction parallel to the X axis in the predetermined plane is defined as the X axis direction. A direction parallel to a Y axis in a predetermined plane orthogonal to the X axis is defined as a Y axis direction. The Z-axis direction is a direction parallel to a Z-axis orthogonal to the X-axis and the Y-axis. The rotation or inclination direction about the X axis is defined as the θ X direction. The rotation or inclination direction about the Y axis is defined as the θ Y direction. The rotation or tilt direction about the Z axis is defined as the θ Z direction. The predetermined plane is a plane parallel to the horizontal plane. The Z-axis direction is a vertical direction. The predetermined surface may be inclined with respect to the horizontal plane. In the following description, the predetermined plane is referred to as an XY plane as appropriate.
[ electronic component mounting apparatus ]
Fig. 1 is a side view schematically showing an electronic component mounting apparatus 1 according to an embodiment. Fig. 2 is a plan view schematically showing the electronic component mounting apparatus 1 according to the embodiment. The electronic component mounting apparatus 1 mounts the electronic component C on the substrate P printed with the cream solder.
The electronic component mounting apparatus 1 includes: an electronic component supply device 2 for supplying an electronic component C; a substrate support device 3 for supporting the substrate P; a mounting head 5 having a plurality of suction nozzles 4 holding electronic components C and mounting the electronic components C on a substrate P; a suction nozzle moving device 6 for moving the suction nozzle 4; a head moving device 7 that moves the mounting head 5; a detection device 8 for detecting whether or not the plurality of suction nozzles 4 are provided with the identification codes; a storage device 9 that stores a plurality of suction nozzles 4; an input device 10 that generates input data by being operated by an operator; a notification device 11 that outputs notification data; and a control device 12 comprising a computer system.
The electronic component supply device 2 supplies the electronic component C to the supply position SP. The electronic component supply device 2 includes, for example, a plurality of tape feeders. The tape feeder has: a reel around which a tape holding the electronic component C is wound; and a drive device that feeds out the tape wound on the reel. The driving device discharges the tape so that the electronic component C held on the tape is moved to the supply position SP. The electronic component supply device 2 may include a tray for holding the electronic components C.
The substrate supporting device 3 supports the substrate P at the mounting position MP. The substrate supporting apparatus 3 includes: a substrate transfer device for transferring the substrate P to the mounting position MP; and a substrate supporting member supporting the substrate P conveyed to the mounting position MP. The substrate conveying device comprises: a conveyor that conveys the substrate P in the X-axis direction; and a guide member for guiding the substrate P in the X-axis direction.
The suction nozzle 4 detachably holds the electronic component C. The suction nozzle 4 is a suction nozzle that sucks the electronic component C. An opening is provided at the front end of the suction nozzle 4. The opening of the suction nozzle 4 is connected to a vacuum system. The electronic component C is sucked and held at the tip of the nozzle 4 by performing a suction operation of sucking from the opening of the nozzle 4 in a state where the tip of the nozzle 4 is in contact with the electronic component C. The suction operation from the opening of the suction nozzle 4 is released, whereby the electronic component C is released from the suction nozzle 4. The suction nozzle 4 may be a grip nozzle that grips the electronic component C.
The mounting head 5 supports a plurality of suction nozzles 4. The mounting head 5 mounts the electronic component C held by the suction nozzle 4 on the substrate P. The mounting head 5 can move from one of the supply position SP and the mounting position MP to the other. The supply position SP and the mounting position MP are defined at different positions in the XY plane. The mounting head 5 moves to the supply position SP, holds the electronic component C supplied from the electronic component supply device 2 by the suction nozzle 4, and then moves to the mounting position MP to mount the electronic component C on the substrate P supported by the substrate support device 3.
The mounting head 5 has a shaft 5S on which the suction nozzle 4 is mounted. The suction nozzle 4 is detachably attached to the shaft 5S. The suction nozzle 4 is fitted to the lower end portion of the shaft 5S.
The nozzle moving device 6 moves the nozzle 4 in the Z-axis direction and the θ Z direction, respectively. The suction nozzle moving device 6 includes an actuator provided to the mounting head 5. The suction nozzle moving devices 6 are respectively provided to the plurality of suction nozzles 4. The nozzle moving device 6 moves the nozzle 4 in the Z-axis direction and the θ Z direction by moving the shaft 5S in the Z-axis direction and the θ Z direction.
The head moving device 7 moves the mounting head 5 in the X-axis direction and the Y-axis direction, respectively. The head moving device 7 includes: an X-axis moving device 7X that moves the mounting head 5 in the X-axis direction; the Y-axis moving device 7Y moves the mounting head 5 in the Y-axis direction. The X-axis moving device 7X and the Y-axis moving device 7Y each include an actuator. The X-axis moving device 7X is connected to the mounting head 5. The mounting head 5 is moved in the X-axis direction by the drive of the X-axis moving device 7X. The Y-axis moving device 7Y is connected to the mounting head 5 via the X-axis moving device 7X. The Y-axis moving device 7Y is driven, and the X-axis moving device 7X moves in the Y-axis direction. The mounting head 5 is moved in the Y-axis direction by the X-axis moving device 7X moving in the Y-axis direction.
The suction nozzle 4 is movable in 4 directions of an X-axis direction, a Y-axis direction, a Z-axis direction, and a θ Z direction by the suction nozzle moving device 6 and the head moving device 7. By the movement of the suction nozzle 4, the electronic component C held by the suction nozzle 4 can also be moved in 4 directions of the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ Z direction.
The detection device 8 detects whether or not an identification code 13 is provided to each of the plurality of suction nozzles 4. In the embodiment, the detection device 8 is disposed between the supply device SP and the mounting position MP. The detection data of the detection device 8 is output to the control device 12.
The storage device 9 stores a plurality of suction nozzles 4. As described above, the suction nozzle 4 is detachably attached to the shaft 5S. That is, the suction nozzle 4 is a replaceable part that can be replaced. The nozzles 4 used for mounting the electronic component C are selected from the plurality of nozzles 4 accommodated in the accommodating device 9. The selected suction nozzle 4 is fitted to the shaft 5S. The suction nozzles 4 not used for mounting the electronic components C are stored in the storage device 9. In the embodiment, the storage device 9 is disposed between the supply position SP and the mounting position MP.
As shown in fig. 2, the storage device 9 has a plurality of slots 14 in which the suction nozzles 4 are arranged. In an embodiment, the receiving means 9 has 8 slots 14. The slots 14 include a 1 st slot 14A, a 2 nd slot 14B, a 3 rd slot 14C, a 4 th slot 14D, a 5 th slot 14E, a 6 th slot 14F, a 7 th slot 14G, and an 8 th slot 14H.
In addition, the number of the slots 14 may be other than 8. The number of the slots 14 may be 7 or less, or 9 or more.
The input device 10 is operated by an operator to generate input data. The input device 10 is exemplified by a keyboard for a computer, a mouse, and a touch panel. The input data generated by the input device 10 is output to the control device 12.
The notification device 11 outputs notification data and provides the notification data to the worker. The notification data includes display data, audio data, and print data. Examples of the notification device 11 include a display device that outputs display data, an audio output device that outputs audio data, and a printing device that outputs print data. Examples of the Display device include a flat panel Display such as a Liquid Crystal Display (LCD) or an Organic EL Display (OELD). The notification device 11 operates based on the notification data output from the control device 12.
The control device 12 includes a computer system that outputs an action instruction for controlling the mounting head 5. The control device 12 stores a production program indicating a step of mounting the electronic component C on the substrate P. The control device 12 outputs an action instruction for controlling the mounting head 5 based on the production program.
[ suction nozzle ]
Fig. 3 and 4 are side views each showing the suction nozzle 4 according to the embodiment. In the electronic component mounting apparatus 1, a plurality of kinds of suction nozzles 4 are used for mounting the electronic component C. The nozzle 4 used in the mounting of the electronic component C is selected based on the kind of the electronic component C. As an example, the suction nozzle 4 shown in fig. 3 is the 1 st suction nozzle 4A used in mounting of the small electronic component C. The suction nozzle 4 shown in fig. 4 is a 2 nd suction nozzle 4B used in mounting of a large electronic component C. The nozzles 4 are not limited to the 2 types of nozzles 4(4A, 4B). More than 3 kinds of suction nozzles 4 can be used in mounting of the electronic component C. The 1-kind suction nozzle 4 can also be used in mounting of the electronic component C. In the embodiment, 2 kinds of the suction nozzles 4(4A, 4B) are used in mounting the electronic component C.
As shown in fig. 3, the 1 st suction nozzle 4A includes a coupling portion 41 coupled to the shaft 5S, a 1 st body portion 42 coupled to the coupling portion 41, a 2 nd body portion 44 coupled to the 1 st body portion 42 via a flange portion 43, and a holding portion 45A for holding the electronic component C.
The lower end portion of the shaft 5S is tubular. The coupling portion 41 is columnar. The coupling portion 41 is inserted into the shaft 5S. The 1 st body 42 is connected to a lower portion of the connection portion 41. A recess 42A is provided in a side surface of the 1 st body portion 42. The flange 43 is connected to the lower portion of the 1 st body 42. The 2 nd body portion 44 is connected to a lower portion of the flange portion 43. The flange 43 is provided at the boundary between the 1 st and 2 nd main bodies 42 and 44. The holding portion 45A has: a straight portion 45Aa connected to a lower portion of the 2 nd body portion 44; and a tapered portion 45Ab that is connected to a lower portion of the straight portion 45Aa and has an outer diameter that decreases as it goes downward. An opening connected to a vacuum system is provided at the lower end of the tapered portion 45 Ab.
As shown in fig. 4, the 2 nd suction nozzle 4B includes a coupling portion 41 coupled to the shaft 5S, a 1 st body portion 42 coupled to the coupling portion 41, a 2 nd body portion 44 coupled to the 1 st body portion 42 via a flange portion 43, and a holding portion 45B for holding the electronic component C.
The configurations of the coupling portion 41, the 1 st body portion 42, the flange portion 43, and the 2 nd body portion 44 of the 2 nd nozzle 4B are the same as those of the coupling portion 41, the 1 st body portion 42, the flange portion 43, and the 2 nd body portion 44 of the 1 st nozzle 4A.
The holding portion 45B has: a straight portion 45Ba connected to a lower portion of the 2 nd body portion 44; the large diameter portion 45Bb is connected to a lower portion of the straight portion 45Ba, and has a larger diameter than the straight portion 45 Ba. An opening connected to a vacuum system is provided at the lower end of the large diameter portion 45 Bb.
The nozzles 4(4A, 4B) are provided with identification codes 13. The identification code 13 includes identification data for identifying the suction nozzle 4. The identification code 13 is attached to the 1 st body portion 42. In the embodiment, the identification code 13 is disposed inside the recess 42A. The identification code 13 is disposed inside the recessed portion 42A so that the outer surface of the identification code 13 does not protrude from the outer surface of the 1 st body portion 42. As the identification code 13, an rfid (radio Frequency identifier) tag is exemplified. The identification code 13 is detected by the detection means 8. The detection device 8 detects whether or not the plurality of suction nozzles 4 are provided with the identification codes 13. As the detection device 8, an RFID reader is exemplified.
[ control device ]
Fig. 5 is a functional block diagram illustrating the control device 12 according to the embodiment. As shown in fig. 5, the control device 12 is connected to the mounting head 5 including the nozzle transfer device 6 and the head transfer device 7, the detection device 8, the input device 10, and the notification device 11, respectively.
The control device 12 includes a detection data acquisition unit 21, an input data acquisition unit 22, a determination unit 23, a priority command unit 24, an operation command unit 25, a required time calculation unit 26, a notification control unit 27, an identification data storage unit 28, and a production program storage unit 29.
The detection data acquisition unit 21 acquires detection data of the detection device 8. When detecting the identification code 13, the detection device 8 outputs detection data indicating that the identification code 13 is provided on the suction nozzle 4 to the control device 12. When the identification code 13 is not detected, the detection device 8 outputs detection data indicating that the identification code 13 is not set in the suction nozzle 4 to the control device 12. As described above, the identification code 13 includes identification data for identifying the suction nozzle 4. In case the suction nozzle 4 is provided with an identification code 13, the detection data of the detection device 8 comprise identification data of the suction nozzle 4.
The input data acquisition unit 22 acquires input data generated by the input device 10. The input device 10 generates input data by being operated by an operator and outputs the input data to the control device 12.
The determination unit 23 determines whether or not the identification code 13 is provided to the nozzle 4 based on the detection data acquired by the detection data acquisition unit 21. When determining that the identification code 13 is provided to the nozzle 4, the determination unit 23 associates the identification data of the nozzle 4 included in the identification code 13 with the slot 14 in which the nozzle 4 provided with the identification code 13 is stored in the identification data storage unit 28. When determining that the identification code 13 is not provided to the nozzle 4, the determination unit 23 stores the slot 14, which accommodates the nozzle 4 not provided with the identification code 13, in the identification data storage unit 28.
The priority command unit 24 outputs a priority command for preferentially using the nozzle 4 provided with the identification code 13 over the nozzle 4 not provided with the identification code 13. In the embodiment, the priority instruction unit 24 outputs a priority instruction for preferentially using the nozzle 4 provided with the identification code 13 over the nozzle 4 not provided with the identification code 13 among the plurality of nozzles 4 accommodated in the accommodation device 9.
The action command part 25 outputs an action command for controlling the mounting head 5 based on the production program. The production program is a computer program showing a step of mounting the electronic component C on the substrate P. The production program storage unit 29 stores a production program in advance. The action command part 25 outputs an action command for controlling the mounting head 5 based on the production program stored in the production program storage part 29.
When the priority command is not output from the priority command section 24, the operation command section 25 outputs an operation command to the mounting head 5 based on the production program. When the priority command is output from the priority command unit 24, the operation command unit 25 outputs an operation command to the mounting head 5 based on the priority command and the production program.
The required time calculation section 26 calculates the required time required to mount the electronic component C on the substrate P using only the suction nozzle 4 provided with the identification code 13. That is, the required time calculation unit 26 estimates the required time required to mount the electronic component C on the substrate P, assuming that the electronic component C is mounted on the substrate P only by the nozzle 4 provided with the identification code 13. The required time calculation section 26 can estimate the required time based on the number and kind of the suction nozzles 4 provided with the identification codes 13 and the production program.
The notification control unit 27 causes the notification device 11 to notify the nozzles 4 provided with the identification codes 13 and the nozzles 4 not provided with the identification codes 13 based on the determination data of the determination unit 23. The notification control unit 27 also causes the notification device 11 to notify the required time calculated by the required time calculation unit 26.
In the embodiment, after confirming the notification data output from the notification device 11, the operator determines whether or not to use the nozzle 4 provided with the identification code 13 preferentially over the nozzle 4 not provided with the identification code 13, and operates the input device 10. The notification data output from the notification device 11 includes: notification data indicating the suction nozzle 4 provided with the identification code 13 and the suction nozzle 4 not provided with the identification code 13; and notification data indicating a required time required to mount the electronic component C on the substrate P using only the suction nozzle 4 provided with the identification code 13. Is operated through the input device 10, thereby generating input data. The input data acquisition unit 22 acquires input data generated by the input device 10. The priority command unit 24 outputs a priority command based on the input data acquired by the input data acquisition unit 22.
[ mounting method of electronic Components ]
Fig. 6 is a flowchart illustrating an electronic component mounting method according to an embodiment. The detection device 8 detects whether or not the identification code 13 is provided for each of the plurality of nozzles 4 housed in the housing device 9 (step S1).
Fig. 7 is a side view schematically showing the storage device 9 according to the embodiment. The storage device 9 stores a plurality of suction nozzles 4. The storage device 9 has a plurality of slots 14 in which the suction nozzles 4 are arranged. In an embodiment, the receiving means 9 has 8 slots 14. The slots 14 include a 1 st slot 14A, a 2 nd slot 14B, a 3 rd slot 14C, a 4 th slot 14D, a 5 th slot 14E, a 6 th slot 14F, a 7 th slot 14G, and an 8 th slot 14H.
In the embodiment, the 1 st nozzle 4A is accommodated in the 1 st slot 14A, the 2 nd slot 14B, the 3 rd slot 14C, the 4 th slot 14D, the 5 th slot 14E, and the 6 th slot 14F, respectively. The 2 nd nozzle 4B is accommodated in the 7 th slot 14G and the 8 th slot 14H, respectively.
The number of the 1 st nozzles 4A accommodated in the accommodating device 9 and the slot 14 accommodating the 1 st nozzle 4A are examples. Similarly, the number of the 2 nd nozzles 4B accommodated in the accommodating device 9 and the slot 14 accommodating the 2 nd nozzle 4B are also examples. In the embodiment, the number of the slots 14 is 8, but the number of the slots 14 may be 7 or less, or may be 9 or more.
As shown in fig. 7, there are cases where the nozzles 4 provided with the identification codes 13 and the nozzles 4 not provided with the identification codes 13 are stored in the storage device 9 in a mixed state. For example, during the transition from the state of using only the nozzles 4 not provided with the identification codes 13 to the state of using the nozzles 4 provided with the identification codes 13, there is a possibility that the nozzles 4 provided with the identification codes 13 and the nozzles 4 not provided with the identification codes 13 are mixed in the storage device 9. In addition, when the worker installs the suction nozzle 4 in the storage device 9, both the suction nozzle 4 provided with the identification code 13 and the suction nozzle 4 not provided with the identification code 13 may be stored in the storage device 9. The detection device 8 detects whether or not the identification code 13 is provided for each of the plurality of suction nozzles 4 accommodated in the accommodation device 9.
Fig. 8 is a diagram for explaining the detection process performed by the detection device 8 according to the embodiment. The detection device 8 detects whether the identification code 13 is provided on the suction nozzle 4. The identification code 13 contains identification data of the suction nozzle 4. In case the suction nozzle 4 is provided with an identification code 13, the detection means 8 detect the identification data of the suction nozzle 4.
When detecting whether or not the identification code 13 is provided to the suction nozzle 4, the suction nozzle 4 stored in the storage device 9 is attached to the shaft 5S. After the suction nozzles 4 are attached to the shaft 5S, the nozzle transfer device 6 and the head transfer device 7 are driven so that the 1 st body portions 42 of the suction nozzles 4 face the detection device 8 with a gap therebetween.
After the 1 st body 42 of the suction nozzle 4 and the detection device 8 face each other with a gap therebetween, the suction nozzle moving device 6 rotates the suction nozzle 4 in the θ Z direction. When the identification code 13 is disposed in the recess 42A of the 1 st body 42, the identification code 13 faces the detection device 8 during rotation of the suction nozzle 4. The detection device 8 can detect the identification code 13 by the identification code 13 facing the detection device 8. When the identification code 13 is not arranged in the recess 42A of the 1 st body 42, the detection device 8 does not detect the identification code 13. Thereby, the detection device 8 can detect whether the identification code 13 is provided on the suction nozzle 4.
The detection device 8 sequentially detects the plurality of suction nozzles 4 stored in the storage device 9. When detecting whether the identification code 13 is set in the 1 st nozzle 4A stored in the 1 st slot 14A, the 1 st nozzle 4A stored in the 1 st slot 14A is attached to the shaft 5S. The detection device 8 detects whether the 1 st nozzle 4A accommodated in the 1 st slot 14A is provided with the identification code 13. The 1 st nozzle 4A having finished the detection process by the detection device 8 returns to the 1 st slot 14A. The detection data of the detection device 8 is acquired by the detection data acquiring unit 21. The determination unit 23 determines whether or not the identification code 13 is provided to the 1 st nozzle 4A based on the detection data acquired by the detection data acquisition unit 21 (step S2).
When it is determined in step S2 that the identification code 13 is provided to the 1 st nozzle 4A (yes in step S2), the determination unit 23 associates the identification data of the 1 st nozzle 4A included in the identification code 13 with the 1 st slot 14A in which the 1 st nozzle 4A provided with the identification code 13 is stored in the identification data storage unit 28 (step S3).
If it is determined in step S2 that the identification code 13 is not provided to the 1 st nozzle 4A (no in step S2), the determination unit 23 stores the 1 st slot 14A, which accommodates the 1 st nozzle 4A to which the identification code 13 is not provided, in the identification data storage unit 28 (step S4).
In the embodiment, the identification code 13 is provided on the suction nozzle 4 accommodated in the 1 st slot 14A. Therefore, the determination unit 23 associates the identification data of the 1 st nozzle 4A with the 1 st slot 14A accommodating the 1 st nozzle 4A and stores the identification data in the identification data storage unit 28.
The processing of the above-described steps S1, S2, S3 and S4 is executed for the nozzles 4 respectively accommodated in the 2 nd slot 14B, the 3 rd slot 14C, the 4 th slot 14D, the 5 th slot 14E, the 6 th slot 14F, the 7 th slot 14G and the 8 th slot 14H.
As shown in fig. 7, in the embodiment, the identification code 13 is provided to the suction nozzle 4 accommodated in the 1 st slot 14A, the 2 nd slot 14B, the 4 th slot 14D, the 6 th slot 14F, and the 7 th slot 14G, respectively. Therefore, the determination unit 23 associates the identification data of the nozzle 4 provided with the identification code 13 with the 1 st slot 14A, the 2 nd slot 14B, the 4 th slot 14D, the 6 th slot 14F, and the 7 th slot 14G in which the nozzle 4 provided with the identification code 13 is accommodated, respectively, and stores the data in the identification data storage unit 28.
As shown in fig. 7, in the embodiment, the identification code 13 is not provided in the nozzle 4 accommodated in the 3 rd slot 14C, the 5 th slot 14E, and the 8 th slot 14H, respectively. Therefore, the determination unit 23 stores the 3 rd slot 14C, the 5 th slot 14E, and the 8 th slot 14H, which store the nozzle 4 not provided with the identification code 13, in the identification data storage unit 28.
The required time calculation unit 26 calculates the required time required to mount the electronic component C on the substrate P using only the nozzle 4 provided with the identification code 13, based on the determination data of the determination unit 23 and the production program stored in the production program storage unit 29. The required time calculation unit 26 calculates the required time required for mounting the electronic component C on the substrate P using both the nozzle 4 provided with the identification code 13 and the nozzle 4 not provided with the identification code 13, based on the determination data of the determination unit 23 and the production program stored in the production program storage unit 29 (step S5).
As shown in fig. 7, in the embodiment, the number of the suction nozzles 4 provided with the identification codes 13 is 5. The total number of the suction nozzles 4 provided with the identification codes 13 and the suction nozzles 4 not provided with the identification codes 13 is 8. The required time calculation section 26 calculates the required time required for mounting the electronic component C on the substrate P using the 5 nozzles 4 provided with the identification codes 13 and the required time required for mounting the electronic component C on the substrate P using the 8 nozzles 4.
In general, the time required in the case of using 8 suction nozzles 4 is shorter than the time required in the case of using 5 suction nozzles 4. That is, the productivity (throughput) of the electronic apparatus in the case of using 8 nozzles 4 is higher than the productivity (throughput) of the electronic apparatus in the case of using 5 nozzles 4.
The notification control section 27 causes the notification device 11 to notify the nozzles 4 provided with the identification codes 13 and the nozzles 4 not provided with the identification codes 13. The notification control unit 27 also causes the notification device 11 to notify the required time calculated by the required time calculation unit 26 (step S6).
Fig. 9 and 10 are diagrams each illustrating the notification device 11 according to the embodiment. In the examples shown in fig. 9 and 10, the notification device 11 is a display device.
As shown in fig. 9, the notification control unit 27 associates the identification data of the nozzle 4 provided with the identification code 13 with the slot 14 in which the nozzle 4 provided with the identification code 13 is housed, and displays the data on the notification device 11. The notification control unit 27 causes the notification device 11 to display the slot 14 that accommodates the nozzle 4 not provided with the identification code 13. In addition, the notification control unit 27 causes the notification device 11 to display the type of the suction nozzle 4. The operator can confirm the number of the nozzles 4 provided with the identification codes 13, the types of the nozzles 4 provided with the identification codes 13, and the slots 14 in which the nozzles 4 provided with the identification codes 13 are accommodated by confirming the notification data output from the notification device 11.
As shown in fig. 10, the notification control unit 27 causes the notification device 11 to display the required time required for mounting the electronic component C on the substrate P using the 5 nozzles 4 provided with the identification codes 13 and the required time required for mounting the electronic component C on the substrate P using the 8 nozzles 4. The operator can compare and study the productivity when using 5 nozzles 4 provided with the identification codes 13 and the productivity when using 8 nozzles 4 by checking the notification data output from the notification device 11.
The operator determines whether or not to use the nozzle 4 provided with the identification code 13 in preference to the nozzle 4 not provided with the identification code 13 based on the notification data output from the notification device 11. That is, the operator examines the number of the nozzles 4 provided with the identification codes 13, the type of the nozzles 4 provided with the identification codes 13, and the required time, and determines whether or not to use the nozzles 4 provided with the identification codes 13 preferentially over the nozzles 4 not provided with the identification codes 13.
The operator determines whether to mount the electronic component C using only the nozzle 4 provided with the identification code 13 or to mount the electronic component C using both the nozzle 4 provided with the identification code 13 and the nozzle 4 not provided with the identification code 13, in consideration of nozzle management, traceability management, and productivity of the electronic device. The operator determines the suction nozzle 4 to be used for mounting the electronic component C, and then operates the input device 10.
When the electronic component C is mounted only using the suction nozzle 4 provided with the identification code 13, the operator operates the input device 10 in the 1 st operation mode. When the electronic component C is mounted using both the suction nozzle 4 provided with the identification code 13 and the suction nozzle 4 not provided with the identification code 13, the operator operates the input device 10 in the 2 nd operation mode.
By operating the input device 10 in the 1 st operation mode, 1 st input data is generated. By operating the input device 10 in the 2 nd operation mode, the 2 nd input data is generated. The 1 st input data is input data indicating that the electronic component C is mounted using only the suction nozzle 4 provided with the identification code 13. The 2 nd input data is input data indicating that the electronic component C is mounted using both the nozzle 4 provided with the identification code 13 and the nozzle 4 not provided with the identification code 13.
The input data acquisition unit 22 acquires the input data generated by the input device 10 (step S7).
The priority command unit 24 determines whether or not to preferentially use only the nozzle 4 provided with the identification code 13 based on the input data acquired by the input data acquisition unit 22. That is, the priority instructing unit 24 determines whether the input data acquired by the input data acquiring unit 22 is the 1 st input data or the 2 nd input data (step S8).
If it is determined in step S8 that only the nozzle 4 provided with the identification code 13 is to be used preferentially (yes in step S8), the priority command unit 24 outputs a priority command for preferentially using the nozzle 4 provided with the identification code 13 over the nozzles 4 not provided with the identification code 13 (step S9).
When the priority command is output from the priority command section 24, the operation command section 25 outputs an operation command for controlling the mounting head 5 based on the priority command and the production program stored in the production program storage section 29 (step S10).
In step S8, if it is determined that not only the nozzle 4 provided with the identification code 13 is to be used with priority (no in step S8), the priority command unit 24 does not output the priority command. The action commanding part 25 outputs an action command for controlling the mounting head 5 based on the production program stored in the production program storage part 29 (step S11).
Fig. 11 is a diagram schematically showing the mounting head 5 when outputting the priority command according to the embodiment. Fig. 12 is a diagram schematically showing the mounting head 5 when the priority command is not output according to the embodiment.
As shown in fig. 11, in the case where the priority instruction is output, only the suction nozzles 4 provided with the identification codes 13 are mounted on the mounting head 5. The mounting head 5 mounts the electronic component C on the substrate P using 5 suction nozzles 4 provided with the identification codes 13.
As shown in fig. 12, when the priority command is output, both the suction nozzles 4 provided with the identification codes 13 and the suction nozzles 4 not provided with the identification codes 13 are mounted on the mounting head 5. The mounting head 5 mounts the electronic component C on the substrate P using 8 suction nozzles 4.
[ computer System ]
Fig. 13 is a block diagram illustrating a computer system 1000 according to an embodiment. The control device 12 includes a computer system 1000. The computer system 1000 includes a processor 1001 such as a cpu (central Processing unit), a main memory 1002 including a nonvolatile memory such as a rom (read Only memory) and a volatile memory such as a ram (random Access memory), a memory 1003, and an interface 1004 including an input/output circuit. The functions of the control device 12 are stored in the memory 1003 as a computer program. The processor 1001 reads the computer program from the memory 1003, expands the computer program in the main memory 1002, and executes the above-described processing in accordance with the computer program. In addition, the computer program may be transmitted to the computer system 1000 via a network.
According to the above-described embodiment, the computer program can cause the computer system 1000 to execute: whether or not an identification code 13 is provided for each of a plurality of nozzles 4 included in a mounting head 5 for mounting an electronic component C on a board P is detected, and the nozzle 4 provided with the identification code 13 is used in preference to the nozzle 4 not provided with the identification code 13.
[ Effect ]
As described above, according to the embodiment, the priority command unit 24 is provided, and the priority command unit 24 outputs a priority command for using the nozzle 4 provided with the identification code 13 in preference to the nozzle 4 not provided with the identification code 13 based on the detection data of the detection device 8. In the electronic component mounting device 1, in the case where the nozzles 4 provided with the identification codes 13 and the nozzles 4 not provided with the identification codes 13 are mixedly present, if the nozzles 4 not provided with the identification codes 13 are used, it may be difficult to implement nozzle management or traceability management. According to the embodiment, in the case where the nozzles 4 provided with the identification codes 13 and the nozzles 4 not provided with the identification codes 13 are mixedly present, the nozzles 4 provided with the identification codes 13 are preferentially used, and therefore, nozzle management or traceability management can be performed in the field.
The nozzle management is to manage the number of times the nozzle 4 is used (the number of times suction is performed). The deterioration state of each of the plurality of nozzles 4 is managed by nozzle management. Traceability management is to manage the suction nozzles 4 used in the production of electronic devices. By traceability management, the suction nozzle 4 used in the production of the electronic device is determined. By mounting the electronic component C only by the nozzle 4 provided with the identification code 13, nozzle management or traceability management is smoothly performed.
The priority command unit 24 outputs a priority command based on input data generated by the input device 10. For example, there may be a case where nozzle management or traceability management is important, and a case where improvement in yield of electronic equipment is important. When nozzle management or traceability management is important, the operator input device 10 operates to output a priority command. Thus, since the electronic component C is mounted on the board P using only the nozzle 4 provided with the identification code 13, nozzle management or traceability management can be performed on site. In a case where improvement in productivity of the electronic device is important, the operator operates the input device 10 without outputting the priority command. Accordingly, the electronic component C is mounted on the substrate P using both the nozzle 4 provided with the identification code 13 and the nozzle 4 not provided with the identification code 13, and therefore, productivity of the electronic apparatus is improved.
The nozzles 4 provided with the identification codes 13 and the nozzles 4 not provided with the identification codes 13 are notified by the notification means 11. The notification device 11 notifies the time required for mounting the electronic component C on the substrate P using only the nozzle 4 provided with the identification code 13 and the time required for mounting the electronic component C on the substrate P using both the nozzle 4 provided with the identification code 13 and the nozzle 4 not provided with the identification code 13. Thus, the operator is provided with a criterion for judging whether to output the priority command. The operator can appropriately determine whether or not to output the priority command based on the notification data output from the notification device 11, and operate the input device 10.
[ other embodiments ]
In the above-described embodiment, when the priority command is output, the electronic component C is mounted by the 5 nozzles 4 provided with the identification codes 13, and when the priority command is not output, the electronic component C is mounted by the 5 nozzles 4 provided with the identification codes 13 and the 3 nozzles 4 not provided with the identification codes 13. The priority instructions may include a 1 st priority instruction using only the suction nozzles 4 provided with the identification codes 13, and a 2 nd priority instruction using a specific number of the suction nozzles 4 provided with the identification codes 13 and the suction nozzles 4 not provided with the identification codes 13. For example, when the 2 nd priority command is output, the electronic component C is mounted by the 5 nozzles 4 provided with the identification code 13 and the 1 st nozzle 4 not provided with the identification code 13.
In the above-described embodiment, the priority command section 24 outputs the priority command based on the input data generated in the input device 10. The priority command unit 24 may be configured to: a priority instruction for preferentially using only the suction nozzle 4 provided with the identification code 13 is output based not on the input data of the input device 10 but on the detection data of the detection device 8.
In the above-described embodiment, the identification code 13 includes an RFID tag. The identification code 13 may comprise a two-dimensional bar code. The detection means 8 may also comprise a bar code reader.

Claims (7)

1. An electronic component mounting apparatus, comprising:
a mounting head having a plurality of suction nozzles holding electronic components, the electronic components being mounted on a substrate;
a detection device that detects whether an identification code is provided to each of the plurality of suction nozzles; and
and a priority instruction unit that outputs a priority instruction for preferentially using the nozzle provided with the identification code over the nozzle not provided with the identification code.
2. The electronic component mounting apparatus according to claim 1,
comprises an input device for generating input data,
the priority instruction section outputs the priority instruction based on the input data.
3. The electronic component mounting apparatus according to claim 1 or 2, wherein,
the electronic component mounting device includes:
a notification device; and
and a notification control unit that causes the notification device to notify the nozzles to which the identification codes are set and the nozzles to which the identification codes are not set.
4. The electronic component mounting apparatus according to claim 3,
a required time calculation unit for calculating a required time required for mounting the electronic component on the substrate using only the suction nozzle provided with the identification code,
the notification control unit causes the notification device to notify the required time.
5. The electronic component mounting apparatus according to claim 1 or 2, wherein,
a storage device for storing a plurality of the suction nozzles,
the priority instruction section outputs the priority instruction so that the nozzle provided with the identification code is preferentially used over the nozzle not provided with the identification code among the plurality of nozzles housed in the housing device.
6. The electronic component mounting apparatus according to claim 1 or 2, wherein,
the electronic component mounting device includes:
a production program storage unit that stores a production program indicating a step of mounting the electronic component on the substrate; and
an action instruction part for outputting an action instruction for controlling the mounting head,
the operation command unit outputs the operation command based on the production program when the priority command is not output from the priority command unit, and outputs the operation command based on the priority command and the production program when the priority command is output from the priority command unit.
7. An electronic component mounting method, comprising:
detecting whether an identification code is set for each of a plurality of suction nozzles of a mounting head for mounting an electronic component on a substrate; and
the suction nozzle provided with the identification code is preferentially used compared to the suction nozzle not provided with the identification code.
CN202010412931.8A 2019-05-17 2020-05-15 Electronic component mounting apparatus and electronic component mounting method Active CN111954457B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019093416A JP7262300B2 (en) 2019-05-17 2019-05-17 Electronic component mounting apparatus and electronic component mounting method
JP2019-093416 2019-05-17

Publications (2)

Publication Number Publication Date
CN111954457A true CN111954457A (en) 2020-11-17
CN111954457B CN111954457B (en) 2023-07-11

Family

ID=73222480

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010412931.8A Active CN111954457B (en) 2019-05-17 2020-05-15 Electronic component mounting apparatus and electronic component mounting method

Country Status (2)

Country Link
JP (1) JP7262300B2 (en)
CN (1) CN111954457B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06216578A (en) * 1993-01-20 1994-08-05 Sanyo Electric Co Ltd Component mounter
US20020042987A1 (en) * 2000-09-26 2002-04-18 Kazuyoshi Oyama Electric component mounting apparatus
JP2004031987A (en) * 2003-10-15 2004-01-29 Hitachi High-Tech Instruments Co Ltd Electronic part automatic mounting device
JP2009170531A (en) * 2008-01-11 2009-07-30 Yamaha Motor Co Ltd Component mounting device
JP2012043862A (en) * 2010-08-16 2012-03-01 Fuji Mach Mfg Co Ltd Electronic component mounting system
CN104259050A (en) * 2014-09-03 2015-01-07 北京嘉华汇诚科技有限公司 Automatic identification manufacture tool and method for identifying identification manufactured by tool
CN106063400A (en) * 2014-03-05 2016-10-26 富士机械制造株式会社 Traceability information management system and traceability information management method for component mounting line

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5001956B2 (en) * 2002-09-18 2012-08-15 富士機械製造株式会社 Electronic circuit component mounting machine
JP2004363634A (en) * 2004-09-27 2004-12-24 Hitachi High-Tech Instruments Co Ltd Electronic component mounting device
JP6086668B2 (en) * 2012-07-31 2017-03-01 富士機械製造株式会社 Mounting machine
CN105265036B (en) * 2013-06-03 2018-07-24 富士机械制造株式会社 Suction nozzle manages system
EP3373719B1 (en) * 2015-11-06 2021-05-05 Fuji Corporation Mounting device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06216578A (en) * 1993-01-20 1994-08-05 Sanyo Electric Co Ltd Component mounter
US20020042987A1 (en) * 2000-09-26 2002-04-18 Kazuyoshi Oyama Electric component mounting apparatus
JP2004031987A (en) * 2003-10-15 2004-01-29 Hitachi High-Tech Instruments Co Ltd Electronic part automatic mounting device
JP2009170531A (en) * 2008-01-11 2009-07-30 Yamaha Motor Co Ltd Component mounting device
JP2012043862A (en) * 2010-08-16 2012-03-01 Fuji Mach Mfg Co Ltd Electronic component mounting system
CN106063400A (en) * 2014-03-05 2016-10-26 富士机械制造株式会社 Traceability information management system and traceability information management method for component mounting line
CN104259050A (en) * 2014-09-03 2015-01-07 北京嘉华汇诚科技有限公司 Automatic identification manufacture tool and method for identifying identification manufactured by tool

Also Published As

Publication number Publication date
CN111954457B (en) 2023-07-11
JP7262300B2 (en) 2023-04-21
JP2020188217A (en) 2020-11-19

Similar Documents

Publication Publication Date Title
US11215976B2 (en) Component mounting system and progress display system of set-up work
CN106686967B (en) Component supply device and component supply method
US11864324B2 (en) Moving work management device, moving work device, mounting system, and moving work management method
JP4887234B2 (en) Electronic component mounting device
JP5027101B2 (en) Electronic component mounting method and electronic component mounting apparatus
JP2012212799A (en) Part mounting device, information processing device, information processing method, and substrate manufacturing method
JP2005236097A (en) Component feeder
US20180077830A1 (en) Component mounting system, component sorting method, and component mounter
JP7221299B2 (en) Equipment management system for board-to-board work machines
US10015920B2 (en) Component mounting method in component mounting system
JP2012134303A (en) Electronic component attachment device, and electronic component attachment method
US10793388B2 (en) Feeder arrangement support system and method for supporting feeder arrangement
JP2010062343A (en) Component mounting method
JP6120880B2 (en) Component mounting line construction equipment
EP2953439B1 (en) Electronic component mounting system and electronic component mounting method
CN111954457B (en) Electronic component mounting apparatus and electronic component mounting method
JP2008159855A (en) Apparatus for mounting electronic component
JP2013004703A (en) Electronic component mounting device
CN111108823B (en) Mounting accuracy measuring system and mounting accuracy measuring method for component mounting line
CN114830848B (en) Component mounting line
CN110050523B (en) Working machine
CN116062461A (en) Component mounting apparatus and method for determining placement of feeders
KR20120134065A (en) Electronic component mounting method and mounting apparatus
JP2012119511A (en) Electronic component mounting device, electronic component mounting system, and electronic component mounting method
WO2021166033A1 (en) Component-mounting machine

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant