JP6086668B2 - Mounting machine - Google Patents

Description

  The present invention relates to a mounting machine for mounting electronic components, and more particularly to a mounting machine for a multi-sided board composed of a plurality of unit boards.

  The mounting machine is used as an apparatus for producing an electronic circuit product by mounting a large number of electronic components on a circuit board. As an electronic circuit product, a multi-sided board that is separated into a plurality of unit boards after component mounting may be a production target. Such a multi-sided board can collectively perform a solder printing process, a component mounting process, a reflow process, and an inspection process for each unit board, thereby improving the production efficiency of electronic circuit products. The multi-sided board is also called a multi-piece board or a split board.

  Here, Patent Document 1 discloses a configuration in which mounting is performed by offsetting the same mounting pattern when the electronic circuit product is a multi-sided board. According to Japanese Patent Application Laid-Open No. 2004-133826, production data is obtained from mounting coordinate data including coordinate values of electronic components mounted on a reference unit board and offset data indicating an offset amount of another unit board with respect to the reference unit board. It is configured. Therefore, the work efficiency in creating such production data can be improved.

JP 2007-109778 A

  By the way, the mounting machine stores production data used for mounting electronic components in a memory mounted in the mounting machine. For example, when a circuit board is transported to a predetermined position and positioned in a production line, the mounting machine is based on the production data. Is configured to be implemented. Therefore, if the number of components mounted on the electronic circuit product increases and the production data becomes long, there is a possibility that it will not fit in the memory of the mounting machine. This is because, even when the production data is composed of mounting coordinate data and offset data as in Patent Document 1, development coordinate data for all unit boards is generated prior to mounting of electronic components. Similarly, the memory capacity of the memory of the mounting machine may be insufficient.

  The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a mounting machine that can reduce the amount of memory mounted on a mounting machine when electronic components are mounted on a multi-sided board. And

The mounting machine according to claim 1 is a mounting machine that mounts electronic components on a multi-sided board composed of a plurality of unit boards, wherein the mounting value indicates a coordinate value and a mounting order of the electronic parts on any one of the unit boards. A storage unit for storing coordinate data; reference position data indicating a reference position of each unit board with respect to the multi-planar board; and transfer order data indicating a transfer order of mounting on the plurality of unit boards; and the transfer order. The reference position corresponding to the unit board to be mounted according to the data is acquired, the development coordinate data obtained by offsetting the mounting coordinate data with the reference position is generated and stored in the storage unit, and the development coordinate data is used. and and a control unit that performs mounting of the unit substrate, wherein, during electronic component mounting, the expansion as the previous implementation Deletes the target data from the storage unit, by storing in the storage unit and generates the expanded coordinate data are used next to the deployment coordinate data in use is stored for use in the storage unit capacity Each of the unit substrates is sequentially mounted in a state where is maintained below the threshold value.

  In the mounting machine according to claim 2, the mounting coordinate data is optimized for the mounting order of the electronic components based on a mounting time calculated based on mounting information including the type of the electronic components and the coordinate values. .

  The mounting machine according to claim 3 assumes that the mounting coordinate data is mounted using virtual development coordinate data obtained by offsetting the mounting coordinate data with respect to all the unit boards by the reference position data. The mounting order of the electronic components is optimized based on the mounting time required for the mounting.

  5. The mounting machine according to claim 4, wherein the transition order data gives priority to the unit board having a long distance from a position where the nozzle attracts the electronic component to the reference position of each unit board in the mounting machine. The migration order has been optimized.

  In the mounting machine according to a fifth aspect, the developed coordinate data includes a plurality of developed coordinate values obtained by offsetting a plurality of the coordinate values of the mounted coordinate data with the reference position.

  The mounting machine according to claim 6, wherein the development coordinate data includes a plurality of development coordinate values obtained by offsetting all the coordinate values included in the mounting coordinate data with the reference position, and the control unit After the target unit board is transferred to the currently mounted unit board, the developed coordinate data of the unit board used for the previous mounting is deleted from the storage unit, and the unit board used for the next mounting is used. Development coordinate data of the unit substrate is generated and stored in the storage unit.

  The mounting machine according to claim 7, wherein the developed coordinate data is one developed coordinate value obtained by offsetting one coordinate value included in the mounted coordinate data with the reference position, and the control unit In the implementation using the developed coordinate data, the developed coordinate data used for the previous implementation is deleted from the storage unit, and the developed coordinate data used for the next implementation is generated and stored in the storage unit. Remember me.

  According to the first aspect of the present invention, the controller generates new developed coordinate data after deleting the developed coordinate data used for mounting. In this way, by repeating the deletion and generation of the development coordinate data, the amount of development coordinate data stored in the storage unit can be suppressed, and the used capacity of the storage unit can be reduced. As a result, even if the data capacity of the development coordinate data for all the unit substrates exceeds the storage capacity of the storage unit, it is possible to produce multi-planar substrates suitably corresponding to such production data. .

  According to the second aspect, since the mounting coordinate data for the reference unit board is optimized, the mounting coordinate data obtained by offsetting the mounting coordinate data can be similarly efficiently mounted. As a result, the time required for mounting the individual unit substrates can be shortened, so that the mounting cycle time by the mounting machine can be shortened.

  According to the third aspect, the mounting coordinate data for the reference unit board is assumed to be mounted using the virtual development coordinate data offset for all the unit boards, and based on the mounting time required for the mounting. Optimized. In other words, instead of optimizing based on the mounting time of only the reference unit board, the mounting coordinate data is optimized based on the mounting time required for repeated mounting at multiple reference positions with different mounting coordinate data. To do. By using such mounting coordinate data, more efficient mounting can be performed.

  According to the fourth aspect of the present invention, the plurality of unit boards are mounted in order of increasing distance from the position where the nozzle of the mounting machine sucks the electronic component. When the electronic component is mounted on the unit substrate, the mounter needs to retract the nozzle upward so that the electronic component already mounted and the nozzle do not interfere with each other. Therefore, for example, if there is an electronic component already mounted between the mounting coordinates and the electronic component suction position, the operation of the mounting machine is increased by the amount of retraction of the nozzle, which may affect the mounting time. Therefore, as in the present invention, by optimizing the transfer order data, it is possible to reduce nozzle retraction and shorten the mounting time.

  According to the fifth aspect, the developed coordinate data is composed of a plurality of coordinate values in the mounting coordinate data, that is, a plurality of developed coordinate values obtained by offsetting a part or all of the coordinate values by the reference position. The mounting coordinate data includes all the coordinate values required to mount one unit substrate, but the developed coordinate data is developed from at least a plurality of coordinate values. Thereby, development according to the mounting state of the mounting machine is possible, and development according to the used capacity of the storage unit is possible.

  According to the sixth aspect, the development coordinate data is composed of a plurality of development coordinate values obtained by offsetting all the coordinate values of the mounting coordinate data with the reference position. In addition, after the unit board to be mounted is transferred to the currently mounted unit board, the control unit deletes the developed coordinate data used for the previous mounting, and then generates the developed coordinate data used for the next mounting. To do. Thus, the storage unit only needs to store the development coordinate data used for the current and next mounting. Therefore, the used capacity of the storage unit can be reduced.

  According to the seventh aspect, the development coordinate data is constituted by one development coordinate data in which one coordinate value included in the mounting coordinate data is offset by the reference position. Then, in the implementation using the current development coordinate data, the control unit generates the development coordinate data used for the next implementation after deleting the development coordinate data used for the previous implementation. That is, the control unit repeats deletion and generation of decompressed data for each sequence. Thereby, the used capacity of the storage unit can be reduced. Therefore, even when most of the storage capacity of the storage unit is used only with the mounting coordinate data for the reference unit substrate, it is possible to produce a multi-sided substrate suitably.

It is a block diagram which shows the component mounting machine in 1st embodiment. It is a top view of the component mounting machine in FIG. It is a top view which shows the multi-cavity board | substrate which is the mounting object of a component mounting machine. It is a figure which shows the mounting coordinate data which a component mounting machine hold | maintains. It is a figure which shows the reference position data which a component mounting machine hold | maintains. It is a figure which shows the transfer order data which a component mounting machine hold | maintains. It is a flowchart which shows the expansion | deployment process of the production data in production of a multi-cavity substrate.

<Embodiment>
(Overall configuration of component mounting machine 10)
Hereinafter, an embodiment embodying a mounting machine of the present invention will be described with reference to FIGS. 1 and 2. The component mounter 10 is used as an apparatus for producing an electronic circuit product by mounting a large number of electronic components on a circuit board in a board production line. The board production line is managed by the host computer 50. In the board production line, the circuit board is applied with solder at a mounting position of an electronic component by, for example, a cream solder printing machine (not shown), and the plurality of component mounting machines 10 are sequentially conveyed and the electronic component is mounted thereon. Then, the circuit board is soldered in a reflow furnace to produce an electronic circuit product.

  The component mounter 10 mounts electronic components on a circuit board based on production data input from the host computer 50 in the board production line. As shown in FIG. 2, the component mounter 10 includes a base 11, a conveyor 12, a pair of X slide guides 13, an X slide body 14, a mounting head 15, a plurality of slots 16, and a component feeder 17. And a nozzle 18, a nozzle station 19, a control device 20, and a camera 30.

  The base 11 is a base fixed on the floor. The conveyor 12 is a conveying device that is installed on the upper surface of the base 11 and conveys a circuit board placed on the conveyor 12 in the X direction. That is, the conveyor 12 sequentially conveys a plurality of circuit boards from the X minus direction to the X plus direction. The pair of X slide guides 13 are respectively installed on the conveyor 12 so as to extend in the X direction on both outer sides in the Y direction. The X slide body 14 is provided so as to be suspended on the pair of X slide guides 13, and is provided so as to be movable in the X direction with respect to the base 11.

  The mounting head 15 is detachably provided on the X slide body 14 so as to be movable in the Y direction with respect to the X slide body 14. That is, the mounting head 15 can move in the X direction and the Y direction with respect to the base 11. More specifically, the mounting head 15 is relatively movable between a circuit board conveyed on the conveyor 12 and a component feeder 17 described later. A nozzle 18 is mounted on the lower end side of the mounting head 15 in a replaceable manner. The mounting head 15 includes a type in which only one nozzle 18 is mounted and a type in which a plurality of nozzles 18 are mounted. This is appropriately selected according to the size of the electronic component to be mounted, the total number of electronic components, the number of types, and the like.

  The plurality of slots 16 are provided outside the conveyor 12 with respect to the X slide guide 13 in the base 11. A plurality of component feeders 17 are respectively installed in the plurality of slots 16. The component feeder 17 is a component carrier that accommodates electronic components, and in the present embodiment, a tape feeder is shown. Each component feeder 17 accommodates one type of electronic component.

  The nozzle 18 is mounted on the lower end side of the mounting head 15. The nozzle 18 corresponds to the electronic component housed in the component feeder 17 and holds the electronic component by suction or the like in order to mount a plurality of electronic components on the circuit board conveyed on the conveyor 12. . That is, by moving the mounting head 15 in the X direction and the Y direction with respect to the base 11, it is possible to mount the electronic component housed in the component feeder 17 by the nozzle 18 onto the circuit board.

  The nozzle station 19 is a storage place for a plurality of nozzles 18, and a plurality of types of nozzles 18 that are not mounted on the mounting head 15 are installed. When replacing the nozzle 18 to be mounted on the mounting head 15, the mounting head 15 is moved to the nozzle station 19, the mounted nozzle 18 is removed at the nozzle station 19, and other nozzles stored in the nozzle station 19. 18 is installed.

  The control device 20 of the component mounter 10 includes a storage unit 21 and a control unit 22. The storage unit 21 includes an optical drive device such as a hard disk device, a flash memory, or the like, and can store various data within a predetermined storage capacity. The storage unit 21 stores production data for operating the component mounter 10, image data transferred from the camera 30, and the like.

  The control unit 22 of the control device 20 controls driving of the conveyor 12 and a clamping device (not shown), imaging processing of the camera 30, and the like. In addition, the control unit 22 acquires image data by imaging with the camera 30, and performs predetermined image processing on the image data. Then, the control unit 22 uses each axis motor and each device of the component mounting machine 10 so that the electronic component is appropriately mounted on the circuit board based on the production data, information from various sensors, the result of image processing, and the like. To control.

  In the present embodiment, the camera 30 is a substrate recognition camera, and is provided on the X slide body 14 located above the conveyor 12. The camera 30 includes an image sensor such as a CCD or a CMOS, and is connected to the control device 20 so as to be communicable. Based on a control command from the control device 20, the camera 30 captures an image of the circuit board that has been transported and positioned by the clamp device, and transfers image data of the captured image to the control device 20.

(Mounting of multi-sided board 60 by component mounter 10)
With reference to FIGS. 3 to 5, a description will be given of the mounting of an electronic component using a circuit board as a multi-sided board 60 by the component mounting machine 10 having the above-described configuration. Here, as shown in FIG. 3, the “multi-sided board” is a circuit board constituted by a plurality of unit boards, and the individual unit boards separated after the component mounting are the same electronic circuit product. .

  In the present embodiment, it is assumed that the multi-planar substrate 60 is configured by six unit substrates 61 to 66, and the unit substrates 61 to 66 are denoted by reference numerals in order from the lower left to the upper right of FIG. Yes. Although a large number of electronic components are actually mounted on the unit substrates 61 to 66, the electronic components A to D are mounted here for ease of explanation.

  The component mounter 10 stores production data used for mounting electronic components for the multi-sided board 60 in the storage unit 21. This production data is control program data input from the host computer 50, and is composed of mounting coordinate data, reference position data, and transition order data. As shown in FIG. 4A, the mounting coordinate data includes a plurality of sequences corresponding to the electronic components A to D mounted on the reference unit substrate 61 (the XY coordinate value of the electronic component, the mounting angle θ, the component number). P) are arranged in the order of mounting.

  The reference position data of the production data indicates the reference positions of the unit substrates 61 to 66 with respect to the multi-planar substrate 60 as shown in FIG. Here, the coordinate value of the reference position is set for each of the unit substrates 61 to 66 with the lower left portion of each of the unit substrates 61 to 66 in FIG. 3 as the reference position. As shown in FIG. 4C, the transfer order data indicates the transfer order of mounting on the plurality of unit boards 61 to 66.

  Then, when mounting the multi-planar board 60, the control unit 22 in the control device 20 first acquires a reference position corresponding to a unit board to be mounted according to the transfer order data, and develops coordinates obtained by offsetting the mounting coordinate data with the reference position Data is generated and stored in the storage unit 21. Then, the control unit 22 performs control so that electronic components are sequentially mounted on the unit substrate using the developed coordinate data.

  Further, the mounting coordinate data and the transfer order data in the production data are optimized in advance. The mounting coordinate data is optimized as follows. First, virtual development coordinate data obtained by offsetting the mounting coordinate data with respect to all the unit substrates 61 to 66 based on the reference position data is generated. Then, assuming that mounting is performed using the virtual development coordinate data, the mounting time required for the mounting is calculated from the types of electronic components A to D and mounting information including these coordinate values. This is repeated for a plurality of patterns in which the mounting order of the electronic components A to D is exchanged, the mounting time is calculated for each of the patterns, and the one having the shortest mounting time is adopted as the efficient mounting order. . Thereby, in this embodiment, the mounting order is set in the order of electronic components A, B, C, and D.

  In addition, the transfer order data gives priority to a unit board having a long distance to the position where the nozzle 18 sucks the electronic components A to D in the component mounting machine 10, that is, the position of the component feeder 17 in which the electronic components A to D are accommodated. The migration order has been optimized. Here, the unit boards 62, 64, 66 located on the upper side in FIG. 3 are given priority because the distance to the component feeder 17 is longer than the unit boards 61, 63, 65 located on the lower side in FIG. In the present embodiment, the transfer order is set in the order of the unit substrates 62, 64, 66, 65, 63, 61.

  As shown in FIG. 5, the component mounter 10 performs the production data development process to produce the multi-sided board 60. First, the component mounting machine 10 reads the production data stored in the storage unit 21, that is, the mounting coordinate data, the reference position data, and the transfer order data (S11). Then, the control unit 22 acquires the reference positions corresponding to the head and the next unit substrates 62 and 64 based on the transfer order data, and offsets all the coordinate values included in the mounting coordinate data by each reference position. The developed coordinate data is generated and stored in the storage unit 21 (S12). The developed coordinate data is composed of developed coordinate values of all the electronic components A to D mounted on the unit substrate.

  Next, when the multi-planar board 60 is conveyed to a predetermined position by the conveyor 12 and positioned by the conveyor 12, the control unit 22 of the component mounting machine 10 starts mounting the unit board using the developed coordinate data (S13). Here, the electronic component is mounted on the unit board 62 set as the head unit board by the transfer order data. Next, the control unit 22 determines whether or not development coordinate data to be used next is generated, or whether or not the current mounting is the final unit board. Determine (S14).

  Here, since the development coordinate data used for mounting the next unit substrate 64 has already been generated in S12 (S14: Yes), the control unit 22 has finished mounting using the development coordinate data currently used. It is determined whether or not (S17). If the sequence remains in the current developed coordinate data (S17: No), the process returns to S13 and the mounting process is continued.

  In this way, S13, S14, and S17 are repeated while the implementation based on the currently used development coordinate data is continued. Thereafter, when all the sequences of the current developed coordinate data are executed (S17: Yes), it is determined whether or not the next developed coordinate data is stored in the storage unit 21 (S18). Here, since the development coordinate data used for mounting the unit substrate 64 has already been generated (S18: Yes), the process returns to S13 and shifts to a mounting process using the development coordinate data corresponding to the unit substrate 64.

  The control unit 22 determines again whether or not development coordinate data to be used next to the unit substrate 64 is generated in the storage unit 21 (S14). Here, since the development coordinate data used for mounting the next unit substrate 66 is not generated (S14: No), the control unit 22 uses the development coordinates used for the mounting up to now during the mounting of the electronic component. Data, that is, the developed coordinate data used for mounting the first unit substrate 62 is deleted from the storage unit 21 (S15). Here, “deletion” of the developed coordinate data includes a state in which the part storing the data in the storage unit 21 is reset and a state in which overwriting of the data is permitted for the part storing the data. .

  Then, after securing a predetermined free space in the storage unit 21, the control unit 22 generates unfolded coordinate data to be used next to the unfolded unfolded coordinate data stored in the storage unit 21 and stores the storage unit 21. (S16). Here, development coordinate data used for mounting the next unit substrate 66 is generated in accordance with the transfer order data. And S13, S14, and S17 are repeated again while mounting by the development coordinate data currently used is continued.

  In this way, the control unit 22 keeps the used capacity in the storage unit 21 below a preset threshold value by repeatedly deleting the development coordinate data used for mounting and generating new development coordinate data. In this state, the mounting of the unit boards 61 to 66 is sequentially performed according to the transfer order. When the current development coordinate data is final (S14: Yes), and the implementation using the final development coordinate data is completed (S17: Yes), the next development coordinate data is not generated (S14: Yes). S18: No). And the control part 22 deletes the last expansion | deployment coordinate data from the memory | storage part 21 (S19), and complete | finishes the production of the multi-sided board | substrate 60. FIG.

(Effects of the configuration of the embodiment)
According to the component mounter 10 described above, the control unit 22 deletes the developed coordinate data used for mounting (S15) and then newly generates developed coordinate data (S16). In this way, by repeating the deletion and generation of the development coordinate data, the amount of development coordinate data stored in the storage unit 21 can be suppressed, and the used capacity of the storage unit 21 can be reduced. Thereby, even if the data capacity of the developed coordinate data for all the unit substrates 61 to 66 exceeds the storage capacity of the storage unit 21, it is possible to cope with such production data, and to appropriately form the multi-sided substrate 60. Can be produced.

  In addition, the mounting coordinate data in the production data is optimized in advance. Accordingly, efficient mounting can be similarly performed on the developed coordinate data obtained by offsetting the mounting coordinate data, so that the time required for mounting the individual unit substrates 61 to 66 can be shortened. Therefore, since more efficient mounting can be performed, the cycle time of mounting by the component mounting machine 10 can be shortened.

  Here, when electronic components are mounted on the unit boards 61 to 66, the component mounter 10 needs to retract the nozzle 18 upward so that the electronic component already mounted and the nozzle 18 do not interfere with each other. For this reason, for example, if there is an electronic component already mounted between the mounting coordinates and the electronic component suction position, the operation of the component mounting machine 10 increases as the nozzle 18 is retracted, which may affect the mounting time. There is. Therefore, by optimizing the transfer order data as in the present embodiment, the retraction of the nozzle 18 can be reduced and the mounting time can be shortened.

  The developed coordinate data is composed of a plurality of developed coordinate values offset by the reference position for all coordinate values included in the mounting coordinate data corresponding to the next unit board. That is, in the present embodiment, the development coordinate data is developed for each unit substrate. Further, the control unit 22 deletes the development coordinate data used for the previous implementation, and then generates the development coordinate data used for the next implementation. Thereby, the memory | storage part 21 only needs to memorize | store the expansion | deployment coordinate data used for the present and next mounting. Therefore, the used capacity of the storage unit 21 can be reduced.

<Modification of Embodiment>
In the present embodiment, the control unit 22 generates development coordinate data for each unit substrate. On the other hand, the control unit 22 may develop each of a plurality of sequences less than the number of sequences included in the mounting coordinate data or for each sequence. Thereby, it is possible to further reduce the used capacity of the storage unit 21.

  In the production of the multi-sided board 60, the unit board may not be used for some reason. Then, a skip mark is attached to the unit board in the middle of the production line, so that subsequent mounting is not performed so as not to waste electronic components. Therefore, in the present embodiment, for example, predetermined image processing is performed on the image data acquired by the imaging of the camera 30, thereby recognizing the skip mark and reading the corresponding unit substrate in the transfer order data. It may not be possible. As a result, the development coordinate data used for mounting the unit board with the skip mark is not generated, and the influence of the board skip can be reduced.

  In the embodiment, the production data is configured by mounting coordinate data, reference position data, and transition order data. On the other hand, for example, the mounting transition order for a plurality of unit boards may be indicated by the order of description of the reference position of each unit board in the reference position data. Thereby, since it is not necessary to hold the mounting coordinate data and the reference position data separately, it is possible to reduce the data size of the production data and further reduce the use capacity of the storage unit.

10: Component mounter 11: Base, 12: Conveyor, 13: X slide guide 14: X slide body, 15: Mounting head, 16: Slot 17: Component feeder, 18: Nozzle, 19: Nozzle station 20: Controller, 21: storage unit, 22: control unit, 30: camera, 50: host computer, 60: multi-sided board, 61-66: unit board

Claims (7)

In a mounting machine that mounts electronic components on a multi-sided board composed of multiple unit boards,
Mounting coordinate data indicating the coordinate values and mounting order of the electronic components on any one of the unit substrates, reference position data indicating the reference position of each unit substrate with respect to the multi-sided substrate, and mounting on a plurality of the unit substrates A storage unit for storing the transfer order data indicating the transfer order of
Obtaining the reference position corresponding to the unit substrate to be mounted according to the transfer order data, generating development coordinate data in which the mounting coordinate data is offset by the reference position, storing the development coordinate data in the storage unit, and the development coordinates A control unit for mounting the unit board using data, and
Wherein, during electronic component mounting, as well as deleting the deployment coordinate data as the previous implementation from the storage unit, expand coordinates used next to the deployment coordinate data in use are stored A mounting machine that sequentially mounts each of the unit substrates in a state where the storage capacity in the storage unit is maintained below a threshold value by generating data and storing the data in the storage unit. In claim 1,
The mounting coordinate data is a mounting machine in which the mounting order of the electronic components is optimized based on a mounting time calculated by mounting information including the type of the electronic component and the coordinate value. In claim 2,
The mounting coordinate data is based on the mounting time required for the mounting, assuming that the mounting coordinate data is mounted using virtual development coordinate data offset for all the unit boards by the reference position data. A mounting machine in which the mounting order of the electronic components is optimized. In any one of Claims 1-3,
In the mounting order data, the mounting order in which the transition order is optimized by giving priority to the unit board having a long distance from the position where the nozzle picks up the electronic component to the reference position of each unit board in the mounting machine. Machine. In any one of Claims 1-4,
The developed coordinate data is a mounting machine configured by a plurality of developed coordinate values obtained by offsetting a plurality of the coordinate values of the mounted coordinate data with the reference position. In claim 5,
The developed coordinate data is composed of a plurality of developed coordinate values obtained by offsetting all the coordinate values included in the mounting coordinate data with the reference position,
The control unit deletes the developed coordinate data of the unit board used for the previous mounting from the storage unit after the unit board to be mounted is transferred to the unit board currently mounted, and the next time A mounting machine that generates development coordinate data of the unit substrate used for mounting and stores the data in the storage unit. In any one of Claims 1-4,
The developed coordinate data is one developed coordinate value obtained by offsetting one coordinate value included in the mounting coordinate data by the reference position,
The control unit deletes the development coordinate data used for the previous implementation from the storage unit and generates the development coordinate data used for the next implementation when the implementation is performed using the current development coordinate data. Mounting machine to be stored in the storage unit.

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