JP2004031987A - Electronic part automatic mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the productivity by providing two or more nozzles of the same kind in one head for using another nozzle of the same kind in place of a certain nozzle. <P>SOLUTION: When there are suction nozzles 14 of the same kind in a mounting head 15, a CPU 20 controls so that the nozzle 14 is used on a priority basis according to the priority data for use of the nozzles 14 stored in a ROM 21. When the CPU 20 judges that the nozzle 14 in question is not used, another nozzle 14 having the second highest priority is used among the nozzles 14 of the same kind. <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to an electronic component automatic mounting apparatus that selects an arbitrary nozzle in a mounting head provided with a plurality of suction nozzles, sucks an electronic component, and mounts the electronic component on a printed circuit board.

Conventionally, as this kind of electronic component automatic mounting apparatus, there is one disclosed in the specification attached to Japanese Patent Application No. 4-201218 previously filed by the present applicant. In Japanese Patent Application Laid-Open No. 3-160794, the state of the suction nozzle is detected, and if it is determined that the nozzle is not suitable for the suction operation, the nozzle is not used in the subsequent operation.
Japanese Patent Application No. 4-201218 JP-A-3-160794

However, in the related art, since a different type of nozzle is attached to each mounting head one by one, for example, a certain nozzle is used more frequently than other nozzles, and the nozzle becomes clogged or the like, which makes the nozzle unsuitable for the suction operation. In such a case, a desired nozzle cannot be used in a certain head, and the productivity may be reduced.

The present invention has an object to provide a plurality of nozzles of the same type in one head, and to be able to use another nozzle of the same type in place of a certain nozzle.

Therefore, the first invention uses the suction nozzle in an electronic component automatic mounting apparatus that selects an arbitrary nozzle in a mounting head provided with a plurality of suction nozzles, suctions an electronic component, and mounts the electronic component on a printed circuit board. A determination device for determining whether or not, when the mounting head has a plurality of suction nozzles of the same type, a storage device for storing data relating to the priority of the nozzles used among the plurality of suction nozzles of the same type, Based on the data stored in the storage device, the nozzles with the highest priority are used first, and when the determination device determines that the nozzle is not used, the next nozzle following the nozzle whose priority is determined not to be used in the subsequent suction operation is used. And a control device for controlling to use the nozzles of the order.

A second invention uses the suction nozzle in an electronic component automatic mounting apparatus that selects an arbitrary nozzle in a mounting head provided with a plurality of suction nozzles, suctions an electronic component, and mounts the electronic component on a printed circuit board. A determination device for determining whether or not the nozzle is not used when the mounting device has a plurality of suction nozzles of the same type in the mounting head and the determination device determines that the nozzle is not used. In addition, a control device is provided which specifies a nozzle of the same type as the nozzle determined not to be used from the searched nozzles and controls the specified nozzle to be used during the suction operation.

According to the electronic component automatic mounting apparatus of the first invention, a plurality of nozzles of the same type are provided in one head, and another nozzle of the same type can be used in place of a certain nozzle based on the priority order. This makes it possible to reduce the number of heads that cannot perform the suction operation during the automatic operation, thereby improving the productivity. Further, maintenance time such as nozzle cleaning can be lengthened by the switching operation to the spare nozzle.

According to the electronic component automatic mounting device of the second invention, when the mounting device has a plurality of suction nozzles of the same type in the mounting head, the control device does not use the nozzle when the determining device determines that the nozzle is not used. Nozzles other than the determined nozzles are searched, and the same type of nozzle as the one determined not to be used is specified from the searched nozzles. The specified nozzle is used during the suction operation, so the head that cannot perform the suction operation during automatic operation And the productivity is improved. Further, maintenance time such as nozzle cleaning can be extended by using the designated nozzle.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 2 and 3, reference numeral 1 denotes an X table that moves in the X direction by rotation of the X-axis motor 2, and 3 denotes a result obtained by moving in the Y direction on the X table 1 by rotation of the Y-axis motor 4. An XY table that moves in the X and Y directions, on which a printed circuit board 6 on which a chip-shaped electronic component 5 (hereinafter, referred to as a chip component or a component) is mounted is fixedly mounted on fixing means (not shown).

Reference numeral 7 denotes a supply table on which a number of component supply devices 8 for supplying the chip components 5 are provided. Reference numeral 9 denotes a supply table drive motor, which rotates the ball screw 10 so that the supply table 7 is guided by the linear guide 12 through a nut 11 fitted with the ball screw 10 and fixed to the supply table 7, and X Move in the direction. Reference numeral 13 denotes a rotary table which rotates intermittently, and mounting heads 15 having six suction nozzles 14 as take-out nozzles are arranged at equal intervals on the outer edge of the table 13 in accordance with the intermittent pitch (FIG. 8). reference). As shown in FIG. 8, around the nozzle position identification section 31 below the rotating body 30 which is rotated by the head rotating device 17 described later, six angular sections having equal angular intervals are arranged in accordance with the arrangement position of the suction nozzles 14. A nozzle position identification code part 33 indicating the mounting position of the nozzle 14 is provided by not providing the notch 32 at the location, and the presence or absence of the notch is identified by an identification device (not shown) to identify the position of the nozzle 14. I do.

The suction nozzle 14 attached to the mounting head 15 is locked by the head 15 in accordance with the thickness of a component handled by a height adjustment mechanism (not shown) according to height designation data (not shown) stored in a RAM 22 described later. The height position to be set can be changed. For example, two-stage height positions can be set. Then, it is detected by a detection device (not shown) whether or not it is located at the appropriate height position.

The stop position of the mounting head 15 where the suction nozzle 14 sucks and picks up the component 5 from the supply device 8 is a suction station, and the suction nozzle 14 sucks the component 5 at the suction station. Reference numeral 16 denotes a component recognizing device for recognizing a positional shift of the component 5 to be sucked by the suction nozzle 14 by using a camera to image the lower surface of the component 5 in a predetermined visual field range and recognizing and processing the image screen. The station where the mounting head 15 moves and stops on the device 16 is the recognition station. Further, it is also recognized that the component 5 is not sucked by the nozzle 14 and the like. A station for detecting the presence or absence of the component 5 may be provided at least between the suction station and the recognition station. In this case, for example, a light projector and a light receiver are provided so as to sandwich the nozzle 14, and light is emitted from the light projector. If the light is blocked by the component 5 and is not received by the light receiver, the presence of the component may be detected, or a reflection type detector may be provided to detect the absence of the component by reflecting the light and not returning. The positions of these detectors can be moved according to the thickness of the component 5 to be detected.

The position at which the mounting head 15 next to the recognition station stops is the angle correction station, and the NC for mounting shown in FIG. The first head rotation device 17 rotates the mounting head 15 in the θ direction by an angle amount added to the angle amount indicated in the data.

The next stop position after the angle correction station is the mounting station, and the component 5 to be suctioned by the suction nozzle 14 of the station is mounted on the substrate 6. Further, a station may be provided between the angle correction station and the mounting station for detecting the posture of the component 5 by a component posture detecting device. In this case, the nozzle 14 If the component 5 is adsorbed in a normal manner, the light emitted from the light emitter is provided to the light receiver without being interrupted by the component 5, and the light from the light emitter is interrupted by the component 5. When the light is not received by the light receiver, it is sufficient to detect that the component is standing (the component 5 stands and is sucked by the nozzle 14), thereby detecting that the component is in a bad suction posture in which the component is not standing. The positions of these detectors can be moved according to the thickness of the component 5 to be detected.

The position where the mounting head 15 stops after the mounting station is the component discharge station, and the components determined not to be mounted on the board 6 as a result of recognition at the recognition station are not mounted at the mounting station. It is discharged here. The position at which the mounting head 15 stops after the discharge station is the origin position adjusting stage for returning the original position by rotating the head 15 for the angle correction of the component 5 attracted to the nozzle 14 at the angle correction station. The head 15 is rotated by a second head rotation device 18 similar to the head rotation device 17, and the origin position is adjusted.

The position at which the mounting head 15 stops next to the home position positioning station is a nozzle selection station, in which the nozzle 15 is rotated by the nozzle selection device 19 and any of the nozzles 14 is selected. 14 is selected. Hereinafter, a mechanism for rotating the rotating body 30 of the mounting head 15 will be described. Since the first and second head rotating devices 17 and 18 and the nozzle selecting device 19 have the same structure, the nozzle selecting device 19 will be described with reference to FIG.

9 is formed at the lower end of an elevating member 68 which moves up and down through a guide portion 67 attached to an attachment plate 65 attached to the support base 28 (see FIG. 3) for supporting the rotary table 13. Is a bit that extends in the depth direction and passes on the rotation axis of the elevating member 68 and can be fitted into the fitted groove 52 on the head 15 side. The gear 71 formed at the upper end of the elevating member 68 meshes with a gear 70 that rotates by the rotation of a nozzle selection motor 69 that is a pulse motor provided on the guide portion 67 so that the elevating member 68 can move up and down. The bit 66 that has been rotated in the θ direction and fitted into the fitted groove 52 rotates the rotating body 30.

に は A disk 92 is attached to the rotating shaft 91 to which the gear 70 of the motor 69 is attached, on the opposite side of the motor 69. Six slits (not shown) are cut out at equal intervals on the outer edge of the disk 92, and the slits can be detected by a transmitted light type sensor 96 composed of a light emitter and a light receiver.

Reference numeral 72 denotes a swinging lever which is rotatable around a support shaft 73. As shown in FIG. 9, a roller 74 provided at the right end thereof fits into a concave portion 75 provided around the elevating member 68, By swinging, the elevating member 68 is moved up and down. Reference numeral 76 denotes a spring provided between the elevating member 68 and the guide part 67, and urges the elevating member 68 to lower. A rod 77 is rotatably supported at the left end of the swing lever 72, and is connected to a vertical movement mechanism (not shown) at the upper portion thereof, whereby the bit 66 is raised and lowered, and the bit 66 is fitted at the lowered position. The fitting groove 52 fits.

The gears 70 and 71 are configured so that the rotating body 30 to which the bit 66 is fitted rotates by 360 degrees by the rotation of the motor 69 by 360 degrees (that is, the rotation of the disk 92 by 360 degrees). When the motor 69 stops at the detection position, the suction nozzle 14 corresponding to the slit stops at a position for sucking the component 5.

In the nozzle selection station, a nozzle position composed of three reflection type optical sensors (not shown) facing the nozzle position identification code section 33 corresponding to the suction nozzle 14 stopped at the position for suction. An identification sensor is provided, and each reflection type optical sensor detects the presence or absence of the notch 32 at a position facing the reflection sensor, and outputs “1” when there is the notch 32 and “0” when there is no notch 32. Is output, the position of the nozzle 14 is identified.

Reference numeral 94 shown in FIG. 9 denotes a proximity sensor, which outputs “ON” when the upper wall surface 95 of the concave portion 75 formed in the elevating member 68 faces the sensor 94, and the concave portion 75 faces If it is, "OFF" is output. When the lever 72 swings counterclockwise in FIG. 9 and the elevating member 68 is raised, the sensor 94 is opposed to the concave portion 75, and the elevating member 68 is lowered and the bit 66 is fitted. When the sensor 94 is fitted in the groove 52, the sensor 94 faces the wall surface 95. If the bit 66 cannot be fitted into the fitted groove 52 and cannot be fully lowered even when the elevating member 68 is lowered, the bit 66 faces the recess 75 and the sensor 94 outputs “OFF”. Therefore, it is possible to detect whether the elevating member 68 has descended when it should descend.

# 20 is a CPU as a control device, which controls the mounting operation in accordance with various data stored in the RAM 22 as a storage device based on a program relating to the mounting operation stored in a ROM 21 as a storage device. An interface 23 is connected to the component recognition device 16, an operation unit 24 having various operation keys, a drive circuit 25, and the like. The drive circuit 25 is connected to the X-axis motor 2, the Y-axis motor 4, and the supply table drive motor. 9 etc. are connected.

Hereinafter, various data stored in the RAM 22 will be described. FIG. 4 shows NC data relating to mounting. The supply device 8 (in this embodiment, the reel number is from the left of the supply table 7 shown in FIG. 2) from which the component 5 is taken out in each mounting order (hereinafter referred to as mounting step or step number). In other words, in step number 001, the part 5 is taken out from the supply device 8 mounted on the 50th (reel number 050) from the left in the step number 001) and on the board 6 on which the taken out part 5 is mounted. (Step number 001 (X1, Y1) in step number 001) and mounting angle data (also θ1).

FIG. 5 shows part data in which data relating to the component type of the component 5 stored in the supply device 8 mounted at the reel number position is set. For example, the supply device 8 at the reel number 001 position has the component type B2. Parts 5 are stored. FIG. 6 shows part library data in which data relating to the type of nozzle to be used corresponding to the part type is set. For example, when picking up the part type B1, the nozzle 14 of the nozzle type N1 is used.

FIG. 7 shows nozzle data in which data relating to the nozzle type of the suction nozzle 14 at each position (see 1 to 6 in FIG. 8) in each mounting head 15 is set. Nozzle 14 of nozzle number 1 is a nozzle of nozzle type N1, nozzle 14 of nozzle number 2 is a nozzle of nozzle type N1, nozzle 14 of nozzle number 3 is a nozzle of nozzle type N3, and nozzle 14 of nozzle number 4 Is a nozzle of nozzle type N5, nozzle 14 of nozzle number 5 is a nozzle of nozzle type N6, and nozzle 14 of nozzle number 6 is a nozzle of nozzle type N4. Therefore, the mounting head 15 is provided with one set of nozzles 14 of the same type (nozzle type N1). In this case, in the present embodiment, the ROM 21 is set so as to use the nozzles in ascending order of nozzle numbers (in order of 1, 2, 3, 4, 5, and 6). Then, when a command not to perform a suction operation (skip) is issued by the nozzle 14 as described later, the suction operation is performed by the nozzle 14 of the nozzle number 2 at the time of the suction operation of the component 5 thereafter. Hereinafter, the same settings are made. It is to be noted that the supply device 8 corresponding to the above-described reel number is specified as to which position the mounting head 15 is the head number and how many heads, and which nozzle 14 in the head is the nozzle number and how many nozzles. Are stored in the ROM 21 and specified.

(4) The RAM 22 is further provided with a memory group and a counter group described below. That is, a nozzle skip abnormal suction count memory (which becomes a numerator of the suction rate) for storing the nozzle skip suction rate set for automatically skipping the suction nozzle 14 whose suction rate has decreased during the automatic operation, and the nozzle skip. And a nozzle skip abnormal suction counter for counting the abnormal suction count and a nozzle skip suction counter for counting the suction count are provided for each head number. It is provided for each nozzle number. The four-digit count can be set in the abnormal skip count memory for nozzle skip, and the set count is “n3”. The four-digit count can also be set in the nozzle skip count memory, and the set count is “m3”. If the suction nozzle 14 of the same head number and nozzle number sucks m3 times, the abnormal suction number counter for nozzle skip and the nozzle count counter for nozzle skip are cleared, and the suction number reaches “m3”. If the nozzle skipping abnormal suction counter has reached “n3” before, the suction nozzle 14 does not perform the suction operation thereafter, and if there is a nozzle 14 of the same type in the head 15, the nozzle 14 The suction of the component 5 is performed, and if there is no suction, the suction of the component 5 is not performed by the head 15 (referred to as skipping).

The above-described detection of the suction abnormality is a case where the component recognition apparatus 16 recognizes that the chip component 5 is not suctioned or cannot recognize the chip component 5 and determines that the component recognition is abnormal. In the case where the presence / absence detection is performed, if the absence of a component is detected by the component presence / absence detection device, the correction of the angle of the component 5 absorbed by the nozzle 14 at the correction station is performed, and then the component 5 is detected before the mounting station. This includes the case where the component posture detection device detects that the component is standing (the component 5 is standing and sucked on the nozzle 14). The above-mentioned counter for counting the adsorption abnormality counts in all these cases. However, when the absence of a component, the recognition error, or the standing of the component is detected, the operation at the subsequent stop station is not performed, and therefore the same suction abnormality is not counted twice or more.

Hereinafter, the operation will be described. First, based on the contents of the various data shown in FIGS. 4 to 7, the supply table 7 is moved to the suction station by driving the supply table drive motor 9, and the component supply device 8 that stores the desired component 4 at the component suction position. Waiting. Then, the suction nozzle 14 is moved above the component 5 stored in the component supply device 8 in a standby state, and suction-holds the component 5 at the lower end of the suction nozzle 14. That is, first, a desired nozzle 14 in the head 15 located at the selection station is selected according to the component 5 to be taken out from the supply device 8. If it is assumed that the head 15 currently positioned at the selected station is the head having the head number 1, the contents of the step number 001 of the NC data shown in FIG. As shown in FIG. 6, the nozzle 14 of the nozzle type N1 corresponding to the component 5 of the component type B1 is selected to suck the (component type B1). At this time, the head 15 has a plurality of nozzles 14 of the nozzle type N1 (nozzle number 1 and nozzle number 2), and the nozzle 14 with the smaller nozzle number designated by the ROM 21 is selected. After the selection operation, the head 15 is moved to the suction station position by intermittent rotation of the rotary table 13. The supply table 7 is moved so that the supply device 8 at the reel number 050 is located at the suction station.

Next, the mounting head 15 having the suction nozzle 14 moves due to the intermittent rotation of the rotary table 13, and when the mounting head 15 reaches the recognition station, the presence or absence of a component and the position of the component 5 with respect to the suction nozzle 14 are determined by the recognition device 16. When the deviation is recognized and the part reaches the next angle correction station when there is a component, the head 15 is rotated in the θ direction by the head rotation device 17 so as to reach the angular position to be mounted based on the recognition result.

Next, when the head 15 reaches the mounting station, the nozzle 14 descends onto the substrate 6 which has already been stopped at a predetermined position by the XY movement of the XY table 3 at the mounting station, and the suction force is stopped, and The component 5 is mounted by blowing air. Further, during the mounting operation of step No. 002, when the head 15 of head No. 1 is positioned at the suction station, the head 15 of head No. 2 positioned at the selected station is compared with the step No. 002 of the NC data shown in FIG. 6, the nozzle 14 of the nozzle type N3 corresponding to the component 5 of the component type B3 as shown in FIG. Selected. After the selection operation, the head 15 is moved to the suction station position by intermittent rotation of the rotary table 13. Further, the supply table 7 is moved so that the supply device 8 at the reel number 020 is located at the suction station, the component 5 is suctioned as described above, and the mounting operation is performed similarly. Hereinafter, the mounting operation is continued similarly.

When the recognition station recognizes that there is no component or recognition error, the mounting step (step number) in the NC data is stored, and the mounting operation is performed again after the final step. Note that the device may be stopped. Further, the operation related to the mounting of the step may be performed again by the head 15 positioned at the selected station by the intermittent rotation of the rotary table 13 which is recognized as having no components or the recognition error. In this case, the head 15 positioned at the selection station after the head 15 performs the suction operation again and performs the mounting operation. The nozzle 14 is selected, and suction and mounting operations are performed in the order of step numbers.

Next, a case where a component is missing or a recognition error or the like continuously occurs in a certain nozzle 14 will be described with reference to flowcharts at the time of nozzle selection shown in FIGS. For example, the operation from the nozzle selection station is performed for the head number “8”, but the step number “008” of the NC data is obtained by supplying the component 5 (component type B1) from the reel number “106”. In the same manner as described above, the suction nozzle 14 with the nozzle number “1” is selected. If the suction nozzle 14 of the nozzle number "1" of the nozzle type "N1" is clogged, for example, and the chip component 5 is not suctioned at the suction station, the component recognition device 16 performs the recognition at the recognition station. No component is detected. Then, the abnormal suction count counter for nozzle skipping and the nozzle skipping suction counter for nozzle number “1” of the head number “8” are counted “1”. With respect to the mounting head 15 of the head number "8", the operation at each station is not performed until the nozzle selection station. When the component 5 is being sucked as in the case of recognition abnormality, the discharging operation at the discharging station is performed. Also, the component 5 in the component standing state when there is a component attitude detection station is similarly discharged here.

When the operation is continued and the suction nozzle 14 having the nozzle number "1" of the head number "8" is selected, and the suction of the chip component 5 cannot be performed when the suction nozzle 14 reaches the suction station, As described above, the nozzle skip abnormal suction number counter and the nozzle skip suction number counter of the nozzle number "1" of the head number "8" are incremented by "1". Before the nozzle skip suction number counter reaches “m3” (set in the nozzle skip suction number memory), the nozzle skip abnormal suction number counter is set to “n3” (nozzle skip abnormal suction number memory). The CPU 20 determines that the suction rate of the nozzle 14 of the nozzle number “1” of the head number “8” has decreased. Cross-sectional and the automatic skip target.

However, since the head 15 has a plurality of nozzles 14 of the nozzle type "N1", when the nozzle 14 of the nozzle number "1" is designated as shown in FIG. 7, the CPU 20 arranges the nozzles 14 of the same type. The nozzle 14 with the provided nozzle number “6” is designated. That is, as shown in the flowchart, since the nozzle 14 of the nozzle number “1” is designated to be skipped, there is no other nozzle 14 of the same type (here, the nozzle number “N1”) among the other nozzles 14 in the head 15. The search is performed in ascending order of the nozzle number (2, 3, 4, 5, 6), and the nozzle 14 having the desired nozzle number (here, the nozzle number “6”) is designated. As a result, the nozzle 14 having the nozzle number “6” is selected by the nozzle selection device 18 at the selection station, and the components are sucked and mounted. In this way, for example, when the frequency of use of the nozzle 14 of the nozzle type “N1” is higher than that of the other nozzles 14 and the abnormality such as clogging is likely to occur, a plurality of nozzles 14 are arranged in one head 15. By doing so, the head 15 that cannot use the nozzle 14 cannot be formed.

If the suction nozzle 14 with the nozzle number "1" of the mounting head 15 with the head number "8" is selected and the chip component 5 is normally sucked by the suction station before the automatic skip is designated. The abnormal suction count counter for nozzle skip of nozzle number "1" of head number "8" is cleared to "0". However, the suction skip counter for the nozzle skip of the number which counts the suction count regardless of the abnormality is incremented by "1".

In addition, the suction error such as the absence of components or the recognition error caused by the suction nozzle 14 having the nozzle number “3” with the head number “8” repeatedly occurs, and the nozzle skip before the nozzle skip suction number counter becomes “m3” as described above. When the skip abnormal suction number counter reaches “n3”, the CPU 20 sets the nozzle 14 having the nozzle number “3” having the head number “8” as a target of the automatic skip. Accordingly, since the nozzles 14 using the nozzle type “N3” are skipped in the head 15, the component 5 (the component of the component type “B3” is set in FIG. When the nozzle 14 sucks the component 5 of another component type, the component 5 is also included.)

[5] Hereinafter, the component mounting operation is performed in the same manner. If a suction error such as no component or a recognition error is repeated a predetermined number of times, an automatic step is performed (for a head 15 in which a plurality of nozzles 14 of the same type are provided, the other nozzles are arranged according to the priority order. 14 may be specified).

Further, not only the nozzle 14 having a reduced suction rate is targeted for skipping, but also, for example, a nozzle whose change to a desired height position by the height adjustment mechanism is unstable, A certain nozzle for which an abnormality is found may be forcibly skipped. The method of determining the priority order of the nozzles to be used is not limited to the order of the smallest nozzle number. For example, the order of the nozzles of the same type to be used may be set in the RAM 22 as data. It is possible to use it.

FIG. 2 is a configuration circuit diagram of the electronic component automatic mounting device. It is a top view of a mounting device similarly. It is a side view of a rotary table. It is a figure showing NC data. FIG. 4 is a diagram illustrating part data. FIG. 4 is a diagram illustrating a parts library. FIG. 4 is a diagram illustrating nozzle data. It is a top view of a mounting head. It is a side view which shows a nozzle selection station. It is a figure showing a flow chart about a nozzle selection operation. It is a figure showing a flow chart about a nozzle selection operation. It is a figure showing a flow chart about a nozzle selection operation.

Explanation of reference numerals

3 XY table 5 Chip component 13 Rotary table 14 Suction nozzle 15 Mounting head 16 Component recognition device 18 Nozzle selection device 20 CPU
21 ROM

Claims (2)

A determination device for selecting whether or not to use the suction nozzle in an electronic component automatic mounting device that selects an arbitrary nozzle in a mounting head provided with a plurality of suction nozzles, suctions an electronic component, and mounts the electronic component on a printed circuit board; A storage device for storing data relating to the priority of nozzles to be used among a plurality of suction nozzles of the same type when the mounting head has a plurality of suction nozzles of the same type; and data stored in the storage device. When using the nozzle with the highest priority based on the above, and when the determination device determines that the nozzle is not used, the next priority nozzle after the nozzle whose priority is determined not to be used in the subsequent suction operation is used. An electronic component automatic mounting device, comprising: a control device for controlling. A determination device for selecting whether or not to use the suction nozzle in an electronic component automatic mounting device that selects an arbitrary nozzle in a mounting head provided with a plurality of suction nozzles, suctions an electronic component, and mounts the electronic component on a printed circuit board; When the mounting device has a plurality of suction nozzles of the same type in the mounting head, when the determination device determines that the nozzle is not used, a nozzle other than the nozzle determined not to be used is searched for, and among the searched nozzles, An electronic component automatic mounting apparatus, comprising: a control device that specifies a nozzle of the same type as a nozzle determined not to be used and controls the specified nozzle to be used during a suction operation.

Images