JPH053399A - Automatic mounting machine for electronic component - Google Patents

Abstract

PURPOSE:To make it perform part mounting according to the regular mounting order even if the suction error of a chip part occurs. CONSTITUTION:In case that the suction error of a chip part 4 is detected with a part existence detector 18, CPU rotates a rotary disc 10 reversely and makes the suction nozzle 11, which has caused the suction error, perform the suction of the chip part 4 again.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped electronic component which is supplied from a component supply device by a take-out nozzle provided at a take-out head portion arranged on a lower surface of a circumferential surface of a turntable which can be rotated in normal and reverse directions. The present invention relates to an electronic component automatic mounting device for taking out and mounting on a printed circuit board.

[0002]

2. Description of the Related Art Generally, a chip-shaped electronic component is taken out from a component supplying device by a desired take-out nozzle, and is sequentially mounted at a predetermined position on a printed circuit board based on NC data of a mounting step showing a mounting position and a corresponding component. Then, after the mounting work based on the mounting step of the printed circuit board is completed, only the steps that could not be mounted due to an ejection error by the ejection nozzle were re-mounted.

Therefore, when attempting to retrofit a short component that could not be mounted due to the above-mentioned take-out mistake near the tall pre-mounted component, the tall pre-mounted component interferes and the ejection nozzle descends by a predetermined amount. There was a problem that I couldn't wear it.

There is also a system in which, when an ejection error occurs, the components of the mounting step are re-removed and the re-mounting operation is carried out. However, a so-called rotary mounting in which a plurality of ejection nozzles are arranged on the lower surface of the circumference of the rotating disk is adopted. In the device, the parts take-out position and the take-out error detection position are different, so when a take-out error is detected, the parts in the next step have already been taken out, so if you take out the miss-taken parts again, the order will be different. However, it has the same disadvantage that parts of the next step are attached first and cannot be attached later.

[0005]

Therefore, according to the present invention, when an ejection error occurs, the component of the next step is not mounted until the component of the mounting step is mounted, thereby eliminating the above-mentioned drawbacks of the prior art. The purpose is to

[0006]

In view of the above, the present invention provides a chip supplied from a component supply device by a take-out nozzle provided in a take-out head portion arranged in plural numbers on the lower circumferential surface of a turntable that can be rotated in the normal and reverse directions. In an automatic electronic component mounting apparatus for picking up electronic components and mounting them on a printed circuit board, whether or not a component is taken out by the take-out nozzle, which is arranged between the component taking-out position and the component taking-out position, Detecting means for detecting whether or not the component is taken out in the posture, and when the detecting means detects a component taking-out error, the turntable is rotated in the reverse direction to take out the component again by the take-out nozzle where the taking-out error occurs. And a control device for controlling so as to do so.

[0007]

With the above construction, when the detection means detects a mistake in taking out a component, the control device controls the turntable to rotate in the reverse direction so that the take-out nozzle in which the take-out error has occurred performs the operation for taking out the component again. ..

[0008]

Embodiments of the present invention will now be described in detail with reference to the drawings.

(1) is an XY table which is moved in the X and Y directions by driving the X-axis servo motor (2) and the Y-axis servo motor (3). A printed circuit board (5) on which a printed circuit board (5) is mounted is placed.

Reference numeral (6) is a component supply table on which a large number of component supply devices (7) are installed, and the guide rod (9) is rotated by the rotation of the ball screw (8A) driven by the component supply section servomotor (8). It is guided and moved in the X direction (left and right direction in FIG. 2).

Rotation (10) is provided with a large number of suction head portions (12) provided with a plurality of suction nozzles (11) for picking up and conveying the chip component (4) from the component supply device (7) on the lower surface. On the board, turntable servo motor (13)
Is rotated intermittently by the rotation of.

A fitting groove (11A) into which a nozzle rotating fitting portion (30) described later is fitted is provided on the suction nozzle (11).

Reference numeral (100) is an acrylic diffuser plate which is mounted over all the suction nozzles (11).

Reference numeral () is a suction station for taking out the chip component (4) from the component supply device (7).

Reference numeral () is a component presence / absence detection station for detecting whether or not the chip component (4) is suction-held by the suction nozzle (11) by the component presence / absence detection device (18).

Reference numeral () is a recognition station for recognizing the state of the chip component (4) sucked by the suction nozzle (11) by the recognition device (14).

Reference numeral () is a nozzle rotation correction station for correcting the rotation of the chip component (4) by the nozzle rotation positioning device (22) based on the recognition result by the recognition device (14).

Reference numeral () is a mounting station for mounting the chip component (4) on the printed circuit board (5) after the work at the nozzle rotation correction station () is completed.

Reference numeral () is a discharge station for discharging the chip components (4) which should not be mounted, for example, as a result of recognition by the recognition device (14), for example, the attracted chip components (4) are different.

Reference numeral () denotes a suction nozzle (11) corresponding to the chip component (4) sucked at the suction station ().
In the nozzle selection station for selecting, a drive (not shown) provided on the outer diameter portion of the suction head portion (12) is moved by a drive system (not shown), meshed with the gear, and then rotated. A drive gear (1) as nozzle selection means by rotation of a gear servomotor (15) (see FIG. 1)
A desired suction nozzle (11) is selected by rotating 6).

The turntable (10) will be described below with reference to FIG.

Reference numeral (50) is a hollow cylindrical shape which is suspended and fixed to the mount (52A) of the index unit (52) so as to surround the upper portion of the cylindrical portion (51) formed on the upper portion of the turntable (10). It is a cylindrical cam member for guiding the rotating disk. A cam (53) is formed on the circumferential side of the lower end of the cam member (50) over substantially the entire circumference, and an upper end of each suction head part (12) is formed on the upper surface of the cam (53) by a spring (54). A roller (55) as a sliding portion provided on the roller rotates while being pressed, and each suction head portion (12) rotates up and down together with the turntable (10) according to the shape of the cam (53). That is, a pair of guide rods (56) is erected on each suction head portion (12) so as to vertically pass through the turntable (10), and a roller (55) is provided at an upper end of the rod (56). The mounting member (57) rotatably provided is fixed. Therefore, each suction head part (12) is supported by the turntable (10) so as to be vertically movable. In addition, the suction head unit (1
When the chip station (4) is sucked by the suction station () due to the downward movement of (2) and the chip station (4) is mounted on the printed circuit board (5) at the mounting station (), a plurality of desired components are provided. The main body base (8) of the electronic component automatic mounting device should be installed so that only the suction nozzle (11) is lowered.
It is regulated by the lowering stopper (81) provided in (0).

Reference numeral (58) is a hose as a connecting body which communicates with a vacuum pump (not shown). The other end of each hose (58) is connected to a connecting hose (59) that is embedded through the rotary disk (10), and the connecting hose (59) is a switching valve (60) and a horizontally long intake passage (61). , Vacuum communication via the central intake passage (62).

Reference numeral (63) is a suction type suction clutch solenoid for restricting the lowering of the suction head portion (12) at the suction station () and stopping the suction operation when necessary, which drives the cam mechanism (64). So that the suction head vertical movement lever (65) is not lowered by the lever.
It has an abutment lever (66) that abuts against. That is, when the clutch solenoid (63) is demagnetized, the contact lever (66) is brought into contact with the vertical movement lever (65),
The vertical movement lever (65) is prevented from being lowered.
Incidentally, the same structure is also provided in the mounting station ().

Next, the component presence / absence detection device (18) provided in the component presence / absence detection station () will be described with reference to FIG.

The component presence / absence detection device (18) detects whether or not the light emitted from the light emitting element (19) is received by the light receiving element (20). That is, the light emitted from the light emitting element (19) is blocked by the chip component (4) and the light receiving element (2
If the light is not received at 0), it means "parts exist", and if the light is received, "no parts".

Next, the recognition device (14) provided in the recognition station () will be described with reference to FIG.

Reference numeral (71) is a CCD camera for recognizing the state where the chip component (4) is sucked by the suction nozzle (11).
It is obtained by using the reflection of two mirrors (73) and (74) mounted in a box (72) waiting below the chip part (4) conveyed to the upper side of the recognition device (14). The image is recognized through the lens (75). That is, light from a light source (not shown) is applied to the chip component (4) through the diffuser plate (100), and the silhouette image is transferred to the CCD.
The camera (71) takes an image and the recognition device (14) recognizes it.

Next, the nozzle rotation correction station ()
The nozzle rotation positioning device (22) will be described with reference to FIGS. 6 and 7.

Reference numeral (22A) is a nozzle rotation motor as a drive source for rotating the suction nozzle (11) by θ, and the nozzle is fitted into the bearing body (27) through the coupling (26) on the output shaft (25). A nozzle rotating rod (29) described later is attached to the rotating body (28) so as to be vertically movable.

The numeral (29) is the nozzle rotating body (28).
Is a nozzle rotation rod having a nozzle rotation fitting portion (30) at the lower end, and a pin (32) protruding outward from a vertically elongated hole (31) provided in the nozzle rotation body (28). It is provided. The nozzle rotation fitting portion (30) is formed so as to become narrower toward the lower end so as to fit into the fitting groove (11A). Further, the nozzle rotating rod (29) is provided with an engaging portion (34) for engaging a spring (33) as a cushion means with the bottom surface of the nozzle rotating body (28), and the engaging portion (34). ), A swing lever (37) attached via a rod end (36) to a vertical movement lever (35) that is vertically moved by a cam as a drive source (not shown) is locked, As the swing lever (37) swings up and down in accordance with the vertical movement of the nozzle (35), the nozzle rotating rod (29) is vertically moved while being biased by the spring (33).

Reference numeral (38) in FIG. 1 denotes an interface, which is the XY table (1), the parts supply table (6), and the turntable (1).
0), the drive gear (16) and the nozzle rotation positioning device (22) are connected, while the respective control elements are programmed by a CPU (39) as a control device.

Reference numeral (40) is a RAM as a storage device, which is the rotation center position data of each of the suction nozzles (11), the recognition position data of the chip component (4) by the recognition device (14), and as shown in FIG. NC data (X direction, Y direction, θ direction) indicating the mounting position of each chip component (4) on the printed circuit board (5) and the like are stored in each predetermined area. Further, (41) is a ROM as a storage device for storing the operation program.

Since the set position of the rotation center of the suction nozzle (11) may be displaced due to temperature change, aging change, etc., the chip part (4) is removed after a certain set temperature is exceeded or a certain time passes. The recognition device (14) may recognize each suction nozzle (11) in a non-sucking state, calculate the shift amount of the rotation center of the suction nozzle (11), and store the shift amount in the RAM (40) again. However, the deviation amount may be added to the rotation center position data of the suction nozzle (11).

A drive circuit (42) is connected to the CPU (39), and the drive circuit (42) is connected to the X-axis servomotor (2), the Y-axis servomotor (3) and the component supply section servo. Motor (8), rotary disk servo motor (1
3), the drive gear servomotor (15), and the nozzle rotation motor (22A) are connected.

The operation will be described below.

First, the recognition device (1
In 4), the rotation center position of each suction nozzle (11) (based on a reference point such as the image center of the CCD camera (71) as a reference) is recognized, and the rotation center position data is RA.
It is stored in M (40).

Here, the mounting operation is performed based on the NC data of the mounting step shown in FIG. First, based on step number “1”, the component supply table (6) is moved to the suction station () by the drive of the component supply unit servomotor (8), and the chip component (4) of the component data “R ₁ ” is moved to the component removal position. ) Is stored in the component supply device (7). Then, the suction nozzle (11) is moved above the chip component (4) housed in the standby component supply device (7) and sucks the chip component (4) as shown in FIGS. 5 and 6. The lower end of the nozzle (11) is suction-held. In the station (), the lower end of the suction nozzle (11) of the suction head unit (12) must be lowered to the position of the chip component (4) housed in the component supply device (7), which is the cam member (50). The roller (55) at the upper end of the head portion (12) is placed on a vertically movable vertical rail (not shown) arranged at a discontinuous portion of the cam (53) of the above, and the vertical rail is lowered. Performed by.

Next, the operation of detecting the presence / absence of the chip component (4) in the component presence / absence detection station () will be described.

The suction nozzle (11) sucking the chip component (4) by the rotation of the turntable (10) passes between the light emitting element (19) and the light receiving element (20) of the component presence / absence detecting device (18). .. At this time, if the chip component (4) is sucked by the suction nozzle (11), the light emitted from the light emitting element (19) is blocked by the chip component (4) and is received by the light receiving element (20). Therefore, the device (18) sends a signal "part present" to the CPU (39), and if not adsorbed, the light emitted from the light emitting element (19) is received by the light receiving element (20). The device (18) sends a signal "no parts" to the CPU (39).

Here, the subsequent operation in the case of "parts exist" will be described.

At this time, the suction operation of the chip component (4) of the component data "R ₂ " is being performed in the suction station ().

The recognition operation of the attitude of the chip part (4) at the next recognition station () will be described.

Here, the position of the chip part (4) is determined on the basis of two mutually perpendicular lines passing through the image centers of the CCD cameras (71) that are adsorbed by the adsorption nozzle (11) by the recognition device (14). Recognize the recognition data (X1, Y
1, θ1) are stored in the RAM (40).

At this time, the suction operation of the chip component (4) of the component data "R ₃ " is being performed in the suction station ().

The rotation correction operation in the θ direction of the chip part (4) at the next nozzle rotation correction station () will be described.

The recognition angle data (θ1) is, for example, one of two lines passing through the image center and the chip component (4).
It is the angle formed by the line of intersection that is formed by extending the end face with a certain reference.

A comparison device (not shown) compares the mounting angle data (θ ₁ ) of the NC data indicating the mounting position and the like stored in the RAM (40) with the recognition angle data (θ ₁ ) and finds a deviation amount. In such a case, the deviation amount (θ ₁ −θ ₁ ) is calculated by a calculation device (not shown) and stored in the RAM (40) and the rotation is corrected. That is, the vertical movement lever (35) is lowered by driving the cam, and the swing lever (3) is moved.
7) is swung downward, and the nozzle rotation fitting portion (30) is biased by the spring (33) while the suction head portion (1) is
2) The nozzle rotation motor (22A) is rotated by the deviation amount (θ ₁ −θ ₁ ) after coming into contact with the taper portion of the fitted groove (11A) provided on the upper portion of the suction nozzle (11). ) Is rotated and the chip component (4) is aligned.

At this time, the suction operation of the chip component (4) of the component data "R ₄ " is being performed in the suction station ().

Then, at the mounting station (), XY
The printed board (5) is moved XY by the table (1), and the chip component (4) is mounted at a predetermined position.

At this time, in the suction station (), the suction operation of the chip component (4) of the component data "R ₅ " is being performed.

The chip component (4) judged not to be mounted by the recognition device (14) is the rotating disc (1).
If (0) is continuously rotated and moved to the discharge station (), it is discharged here. For example, when the attracted chip component (4) is different, it is discharged without performing the mounting work at the mounting station ().

The suction nozzle (11) used next in the next nozzle selection station () is the drive gear (1).
6) is selected by rotating the suction head portion (12) as the suction head portion (12) is rotated after being meshed with a gear provided on the suction head portion (12).

Thereafter, the mounting work is sequentially performed in the same manner.

Further, the subsequent operation in the case of "no component" will be described with reference to FIG.

Here, the suction operation of the chip component (4) of the component data “R ₆ ” of the step number “6” was performed at the suction station (), but the chip component (4) was detected at the component presence / absence detection station (). ) Is not adsorbed, the adsorption head part (12) having the adsorption nozzle (11) returned to the adsorption station () by the reverse rotation of the turntable (10) by the CPU (39). Then, the desired chip component (4) is sucked again. At this time, the suction station () performed in parallel with the presence / absence detection work in the component presence / absence detection station (),
The operations at the recognition station (), the nozzle rotation correction station (), and the nozzle selection station () do not need to be repeated again, so a flag is set and stored in the RAM (40). As a result, the suction nozzle (11) re-sucks the chip component (4) of the component data “R6” and then moved to the next component presence / absence detection station () by rotating the turntable (10) to detect the presence or absence of the component. Detection is performed (at this time, since the chip component (4) of the component data "R7" has already been sucked before the reverse rotation, the suction operation is not performed in the suction station ().). However, as described above, the suction nozzle (11) that has been moved to each position of the suction station (), the recognition station (), the nozzle rotation correction station (), and the nozzle selection station () has a work in each station. Does not work because is finished.
Then, when "no component" is not recognized in the component presence / absence detection station (), the mounting work is sequentially performed by the forward rotation of the rotating disk (10). When "no component" is detected, the turntable (10) is rotated in the reverse direction again to repeat the suction operation. Since it is possible that suction errors continue, a limit number of re-sucking operations may be set.

Further, in the above-mentioned embodiment, when a chip component (4) is picked up by mistake, it is re-adsorbed and the chip component (4) in the next step is not mounted until the chip component (4) is mounted. However, the chip components (4) to be mounted may be divided into groups such as component thicknesses, and the mounting order may be changed within the group, and the mounting order is not changed when the groups are spread over the groups. You may do it.

In the component presence / absence detection station (), not only the presence / absence detection of the chip component (4) but also the suction abnormality (for example, the chip component (4) is attracted by the suction nozzle (11)). May be detected. in this case,
Thickness data of various chip parts (4) is stored in the RAM (40), and a line sensor is used instead of the part presence / absence detection device (18), and the chip parts sucked at the lower end of the suction nozzle (11). By detecting the thickness of (4), the presence or absence of the chip component (4), another chip component (4), and the fact that the chip component (4) is standing and adsorbed are detected. Further, the light emitting element (19) and the light receiving element (20)
The line sensor does not have to be used if they are linked up and down. Further, the detection of the standing chip component (4) may be performed in a place other than the component presence / absence detection station ().

[0059]

As described above, according to the present invention, when a pick-up error occurs, the turntable is rotated in the reverse direction so that the pick-up nozzle having the pick-up error can pick up the part again. Since the components are mounted according to the mounting order without prior attachment, the components cannot be mounted.

[Brief description of drawings]

FIG. 1 is a configuration circuit diagram of a device of the present invention.

FIG. 2 is a plan view of the device of the present invention.

FIG. 3 is a cross-sectional view of a main part of a turntable.

FIG. 4 is a side view of the component presence / absence detection device.

FIG. 5 is a principle diagram of a recognition device.

FIG. 6 is a side view of the nozzle rotation positioning device.

FIG. 7 is a perspective view of the same.

FIG. 8 is a diagram showing NC data.

FIG. 9 is a flowchart showing a component mounting operation.

Claims (1)

Claim: What is claimed is: 1. A chip-shaped electronic component that is supplied from a component supply device by a take-out nozzle provided in a take-out head unit arranged in plural numbers on the lower circumferential surface of a rotating disk that can rotate in the forward and reverse directions. In an electronic component automatic mounting device that picks up and mounts it on a printed circuit board, it is arranged between the parts picking position and the parts mounting position, and whether the parts are picked up by the picking nozzle or not Detection means for detecting whether or not the component is taken out, and when a detection error of the component is detected by the detection means, the rotary disk is rotated in the reverse direction so that the removal nozzle of the component causing the removal error causes the component to be taken out again. An electronic component automatic mounting device, which is provided with a control device for controlling.