JP2793033B2 - Component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Industrial application field The present invention recognizes a component by a suction nozzle and recognizes a displacement of the component with respect to the suction nozzle by a recognition unit.
Based on the recognition result, the displacement is corrected, and the relative movement driving unit changes the relative positional relationship between the suction nozzle and the table on which the printed circuit board is mounted in the planar direction,
The present invention relates to a component mounting apparatus for mounting the component at a position where the substrate is to be mounted.

(B) Conventional technology This kind of component mounting apparatus is disclosed in Japanese Patent Application Laid-Open No. 1-298800. According to this conventional technique, when mounting a component on a printed circuit board, there is a possibility that a suction nozzle for sucking the component may hit and interfere with an adjacent mounted component.
When the components are rotated by 0 degrees and no longer interfere with each other, they are mounted by rotating them by 180 degrees, or the suction nozzle descends at a reduced speed to reduce the impact when the components hit the components.

(C) Problems to be Solved by the Invention However, according to the above-described conventional technology, if the attracted component has polarity, it cannot be rotated 180 degrees, and if rotated 180 degrees, it will interfere with other mounted components. In this case, there is a disadvantage that the component cannot be mounted. In addition, it is difficult to eliminate the effect on the mounted components even if the suction nozzle descends at a slower speed. In particular, if the thickness of the suctioned component is smaller than the thickness of the mounted component, interference will always occur. The mounted components may be displaced, or if the components are fragile, they may be broken by impact, resulting in a defective board.

Therefore, an object of the present invention is to prevent a defective substrate from being generated even in the case described above.

(D) Means for Solving the Problems For this reason, the present invention suctions a component by a suction nozzle, recognizes a position shift of the component with respect to the suction nozzle by a recognition unit, and corrects the position shift based on the recognition result. In a component mounting apparatus that changes the relative positional relationship in the planar direction between the suction nozzle and the table on which the printed board is mounted by the relative movement driving means and mounts the component at a position where the board is to be mounted, A determination means for determining whether or not the suction nozzle interferes with the mounted component when performing the determination; and determining that the suction nozzle interferes with the component. A control means for controlling the relative movement driving means so as to mount the component is provided.

(E) Working When mounting the component, if the determination means determines that there is interference between the suction nozzle and the mounted component, the control means controls the relative movement driving means to place the suction nozzle and the printed circuit board. The relative position of the component to the table in the horizontal direction is changed, and the component is mounted at a position shifted within an allowable range from the position to be mounted.

(F) Example Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

(1) XY moved in the X and Y directions by driving the X axis servo motor (2) and the Y axis servo motor (3)
A printed circuit board (5) on which a chip-shaped electronic component (4) (hereinafter referred to as a chip component (4)) is mounted is placed on the table.

Reference numeral (6) denotes a component supply table on which a large number of component supply devices (7) are arranged in parallel. The component supply unit is guided by a guide (10) by rotation of a ball screw (9) driven by a servomotor (8) of the component supply unit. (The left-right direction in FIG. 1).

(11) Rotation in which a plurality of suction heads (13) on the lower surface of which are provided a plurality of suction nozzles (12) for taking out and transporting the chip component (4) from the component supply device (7) are provided. The index unit (2) to be described later is rotated by the rotation of the turntable servomotor (14) shown in FIG.
It is intermittently rotated via 1). The suction head (13) is provided corresponding to the intermittent rotation pitch.

(I) is a suction station for taking out the chip component (4) from the component supply device (7).

(II) is a recognition station for recognizing the state of the chip component (4) sucked by the suction nozzle (12) by the recognition device (16).

(III) is a nozzle rotation correction station for performing rotation correction on the chip component (4), and the recognition device (16)
The nozzle (12) is rotated by correcting the angle of the component (4) to be the mounting angle based on the recognition result of (1).

(IV) is to replace the chip component (4) after the work in the nozzle rotation correction station (III) with the printed circuit board (5).
A mounting station to be mounted on.

(V) is a result of recognition by the recognition device (16). As a result, for example, a chip component (4) that is standing and is adsorbed or a chip component (4) that is adsorbed is different is not allowed to be mounted. This is a discharge station for discharging 4).

(VI) is a nozzle selection station for selecting a suction nozzle (12) corresponding to the chip component (4) to be suctioned by the suction station (I), and a gear () provided on an outer diameter portion of the suction head (13). The drive gear (18) is rotated by the drive gear servo motor (17) (see FIG. 5) which is moved by a drive system (not shown) and meshed with the gear and rotated. Select the desired suction nozzle (12).

Hereinafter, the turntable (11) will be described with reference to FIG.

(19) is the cylindrical part (2
Rotate the motor (14) so as to surround the upper part of the turntable (1).
1) Index unit that converts to intermittent rotation (21)
Is a hollow cylindrical cylindrical cam member for guiding the rotating disk suspended and fixed to the mounting base (22). A cam (23) is formed over substantially the entire circumference at the lower peripheral portion of the cam member (19), and the upper end of each suction head (13) is formed on the upper surface of the cam (24) by a spring (25). The suction head (13) rotates together with the rotary plate (11) while moving up and down according to the shape of the cam (24). That is, a pair of guide rods (27) are erected on each suction head portion (13) so as to vertically move through the rotary disk (11), and a roller (26) is provided at the upper end of the rod (27). The fixing member (28) provided so as to be rotatable is fixed. Therefore, each suction head section (13) is supported by the rotating disk (11) so as to be vertically movable. The chip part (4) is sucked in the suction station (I) by the downward movement of the suction head (13), and the chip part (4) is mounted on the printed circuit board (5) in the mounting station (IV). Is restricted by a stopper plate (31) provided on a main body base (30) of the electronic component automatic mounting apparatus so that only one of a plurality of suction nozzles (12) provided is not lowered. .

(32) is a hose as a connecting body communicating with a vacuum pump (not shown). The other end of each hose (33) is connected to a connecting hose (33) embedded through the turntable (11), and the connecting hose (33) is connected to a switching valve (34) and a horizontally long intake path (35). , And communicates with the vacuum pump via a central intake passage (36).

(37) is the suction station (I) when it is necessary
A suction type suction clutch solenoid for regulating the lowering of the suction head section (13) and stopping the suction operation, and preventing the suction head section vertical movement lever (39) from being lowered by driving the cam mechanism (38). It has a contact lever (40) that contacts the (39). That is, when the clutch solenoid (37) is demagnetized, the contact lever (40) comes into contact with the vertical movement lever (39), so that the vertical movement lever (39) is not lowered. Note that a moving structure is also provided in the mounting station (IV).

Next, the nozzle positioning device (43) of the suction station (I) will be described with reference to FIG.

(44) is vertically movably fitted to a nozzle positioning body (47) attached to a holder (46) fixed to a mounting plate (45) suspended and fixed from the mounting base (22), and A nozzle positioning rod having a nozzle positioning fitting portion (48), and a pin (50) projecting outward from a vertically long hole (49) provided in the nozzle positioning body (47). The fitting portion (48) is formed so as to be narrower toward the lower end so as to be fitted with the fitted groove (15). The positioning rod (44) is provided with a locking portion (52) for locking a spring (51) between the positioning rod (44) and the bottom surface of the nozzle positioning body (47). The locking portion (52) has a cam mechanism. (Five
The swing lever (56) attached via the rod end (55) is locked to the up and down movement lever (54) that is moved up and down by 3), and swings according to the up and down movement of the up and down movement lever (54). When the lever (56) is swung, the nozzle positioning rod (44) is moved up and down while being urged by the spring (51).

(57) is a positioning clutch solenoid for restricting the downward movement of the nozzle positioning device (43) due to the lowering of the vertical movement lever (54), and is provided with a contact lever (58).

Next, the nozzle rotation positioning device (60) of the nozzle rotation correction station (III) will be described with reference to FIG.

Reference numeral (61) denotes a nozzle rotation motor as a drive source for rotating the suction nozzle (12) by θ, and the nozzle rotation body (64) fitted into the bearing body (64) via the coupling (63) on the output shaft (62). A nozzle rotation rod (66) described later is attached to 65) so as to be vertically movable. In addition, you may move up and down using a ball spline.

The nozzle (66) is a nozzle rotating rod fitted in the nozzle rotating body (65) and having a nozzle rotating fitting part (67) at a lower end thereof, and is a vertically long hole (68) provided in the nozzle rotating body (65). A pin (69) projecting outward is provided. The nozzle rotation fitting portion (67) is formed so as to be narrower toward the lower end so as to fit into the fitting groove (15). The nozzle rotating rod (66) is provided with a locking portion (71) for locking a spring (70) between the nozzle rotating body (65) and the bottom surface. Vertical movement lever (72) moved up and down by a cam as a drive source
The swing lever (74) attached via the rod end (73) is locked, and the swing lever (74) is swung up and down according to the up and down movement of the up and down movement lever (72). The nozzle rotating rod (66) is moved up and down while being urged by the spring (70).

In FIG. 5, reference numeral (80) denotes an interface connected to the CPU (81), to which the recognition device (16) is connected.
(82) is a RAM as a storage device, and each of the suction nozzles (1
2) center position data, NC data, parts library data, nozzle library data, and the like are stored. A ROM (83) stores a program related to the mounting operation of the chip component (4).

The respective data stored in the RAM (82) will be described.

As shown in FIG. 6, the NC data includes a mounting position (X coordinate data, Y coordinate data) on the printed circuit board (5) and a mounting angle indicating the mounting direction for each step indicating the mounting order of the component (4). Data and a part type (hereinafter, referred to as “type”) are stored. The control command "E" indicates the end of the step.

The part library data is as shown in FIG.
Component thickness data indicating the thickness of the component (4) for each component type,
External dimensions (X direction, Y direction), nozzle type, and tolerance areas (X direction, Y direction) indicating areas where the component (4) can be mounted by shifting in the X direction and Y direction. Data is stored.

The nozzle library data is as shown in FIG.
The data such as the nozzle outer diameter (diameter) is stored for each nozzle type. The center position data of each suction nozzle (12) is stored in the RAM (82) for each suction nozzle (12) attached to each suction head (13) provided on the rotating disk (11). It is remembered.

Further, the RAM (82) is provided with a step memory for storing the step numbers of the NC data applied to the component (4) to be mounted.

In addition, in a predetermined area of the RAM (82), the NC of the substrate (5) is provided.
The part (4) to be mounted is placed on the foot pattern (85) of the board (5) (see FIGS. 15 and 16) and the electrode (86) (part No. 15 and 16), the suction nozzle (12) can escape from the adjacent component (4) by shifting the position within an allowable range in consideration of the strength of soldering or the like. And a discrimination flag for determining whether or not it is possible to mount the component (4) on the foot pattern, and the X of the displacement of the component (4) with respect to the mounting position. An X allowable range memory for storing the allowable range in the direction and a Y allowable range memory for storing the allowable range in the Y direction are provided.

Hereinafter, when the contents of the step memory are represented, for example, storing the step “n” is referred to as “step = n”.
As for the distinction flag, “fg = 0” indicates a case where an allowable positional shift is not caused, and “fg = 1” indicates a case where an allowable position shift is performed. X tolerance memory and Y
"Ax = 2tXi" when expressing the contents of the allowable range memory
"Ay = 2tYi" and so on.

The operation of the above configuration will be described below.

First, when the printed circuit board (5) is placed on the XY table (1), the component supply unit (6) is moved by driving the component supply unit servo motor (8), and the type of the step "1" of the NC data is obtained. The component supply device (7) for supplying “R” is on standby at the suction station (I). Due to the rotation of the turntable (11), the nozzle (12) which subsequently moves to the component pick-up position of the suction station (I) was driven by the drive gear servomotor (17) at the nozzle selection station (VI). those suction head by the rotation of the driving gear (18) (13) of the nozzle type corresponding to the varieties is rotated "R _1" is selected. For the above nozzle type, CPU (81) is RAM (82)
Is determined based on the part library data of the type “R ₁ ” stored in the storage device.

The vertical lever (59) is lowered by the driving of the cam mechanism (53), the rocking lever (56) is rocked downward, and the nozzle positioning fitting part (48) is moved by the spring (51).
While being urged against the suction nozzle (12), it comes into contact with the tapered portion of the fitted groove (15) provided in the upper part of the suction nozzle (12). Then, the lower end of the suction nozzle (12) is lowered to the position of the component (4) housed in the component supply device (7) while the fitting portion (74) is fitted in the fitted groove (15), whereby Part (4) is connected to the nozzle (12) which communicates with the vacuum pump via a hose (32), a connecting hose (33), a switching valve (34), a horizontally long suction path (35) and a central suction path (36). Adsorbed by vacuum suction.

Next, the suction nozzle (12) sucking the component (4) moves to the recognition station (II) by the rotation of the turntable (11). The recognition station (II) stores the step number "1" of the component (4) to be recognized in the step memory as shown in the flowchart of FIG. 9 (step = 1).
The recognition of the component (4) sucked by the nozzle (12) is performed by the recognition device (16).

First, whether the picked-up part (4) is picked up on a surface other than the surface to be picked up, that is, in a so-called standing state, or whether the wrong part (4) is picked up, etc.
The quality of the part (4) is determined. If the CPU (81) determines that the product is defective based on the recognition result of the recognition device (16),
The part (4) is discharged at the discharge station (V) without being mounted at the mounting station (IV).
If the CPU (81) is determined to be a non-defective product, the CPU (81) shifts the position of the suction nozzle (12) stored in advance for each nozzle (12) in the X direction from the recognized center of the component center ΔX,
The position deviation ΔY in the Y direction and the angle deviation Δθ of the component (4) with respect to the suction nozzle (12) are calculated.

Next, the rotary disk (11) rotates intermittently, and the suction nozzle (12) stopped at the recognition station (II) rotates. The variety "R _1" suction nozzle sucking the component (4) (12) stops the rotation correction station via the next stop position (III).

Then, the vertical movement lever (72) is lowered by the driving of the cam (not shown), the swing lever (74) is swung downward, and the nozzle rotation fitting portion (67) is urged by the spring (70). After fitting into the fitting groove (15) provided on the upper part of the suction nozzle (12), the nozzle rotation motor (61) is rotated, and the suction nozzle (12) is rotated by an angle (θ ₁ −Δθ). Is rotated to position the component (4).

Next, the rotary disc (11) is intermittently rotated, varieties suction nozzle (12) with adsorbed components of "R _1" (4) moves to the mounting station (IV). At the mounting station (IV), the XY table (1) is turned by the rotation of the X-axis servomotor (2) and the Y-axis servomotor (3), and the NC data of the printed circuit board (5) on the table (1) is changed. The displacement amounts ΔX and Δ are set so that the positions of the X coordinate “X ₁ ” and the Y coordinate “Y ₁ ” shown in step “1” are the mounting positions of the component (4).
It moves after being corrected by Y.

When the then adsorbing nozzle (12) is lowered to the same suction station (I), component (4) coordinates of the printed board (5) (X _1, Y ₁₎ mounting angle to position "theta ₁ ". Next, the suction nozzle (12) having finished mounting the component (4) moves to the discharge station (V) and the nozzle selection station (VI).

Next, when the nozzle (12) sucking the component (4) in step "1" stops at the recognition station (II), the next nozzle (12) stops at the suction station (I). Then, the part (4) of the type “R ₂ ” indicated in the step “2” of the NC data is sucked in the same manner as in the case of the step “1”.

Then, it is moved to the recognition station (II) in the same manner as described above. Then, according to the flowchart of FIG. 9, “ax = 0”, “ay = 0”, “fg = 0”, and “step = 4”. Then, the component (4) is recognized by the recognition device (16), and when it is determined that the component (4) is non-defective, the positional deviations ΔX and ΔY between the component center and the center position of the nozzle that is sucking the component (4) and the component The angle shift Δθ of (4) is calculated.

Next, the CPU (81) recognizes the component thickness of the mounted component (4) of step "1" and the component (4) of step "2".
Compare with the part thickness.

That is, the part thickness data “t ₂ ” obtained from the part library data of FIG. 7 of the part type “R ₂ ” of the step “2” of the step memory and the part type “R ₁ ” of the mounted step “1” Compare with the part thickness data obtained from the part library data. If the component thickness of the component (4) in step “1” is smaller than the component thickness “t ₂ ”, the type “R ₂ ”
Since the nozzle (12) for mounting the component (4) does not hit the mounted component (4) and does not interfere with it, it is determined by the CPU to mount the component (4) on the printed circuit board (5) as it is.
This is achieved by (81).

Thereafter, rotation is performed in the rotation correction station (III) by adding a correction of “Δθ” to the mounting angle of “θ ₂ ”, and “ΔX”, “Δ” is performed in the mounting station (IV).
The part (4) is mounted at the position of the coordinates (X ₂ , Y ₂ ) after the correction of “Y”.

Next, similarly, the suction nozzle (12) for sucking the component (4) in step "3" is connected to the recognition station (I) by the nozzle (12) for sucking the component (4) in step "2".
After moving from I) to the recognition station (II).

Then, similarly to the case of step “2”, “ax = 0”, “ay = 0”, “fg =
0 ”and“ step = 3 ”, and if it is determined to be non-defective, ΔX,
ΔY and Δθ are calculated. Thereafter, the CPU (81) recognizes the thickness of the component (4) of the mounted steps "1" and "2" as described above, and recognizes the component (4) of the step "3".
Compare with the thickness of.

As a result, if there is a part thickness of the mounted part (4) which is equal to or more than the part thickness "t ₃ " obtained from the part library data of FIG. It is determined in the XY plane whether or not the suction nozzle (12) for sucking the component (4) and the component (4) in step "3" protrudes from and hits the component (4).

 This determination will be described in detail.

This determination is based on the interference determination function f (Δx, Δy, Δθ, d, mXi, mY
i, Xi, Yi, θi, X, Y, θ, ax, ay). In this function, d is the nozzle outer diameter obtained from the nozzle library data, and mXi and mYi are the mountings obtained from the part library data. Xi, Yi, and θi are the mounting position data and mounting angle data of the same component obtained from the NC data, and X, Y, and θ are the mounting position data and mounting angle of the suction component obtained from the NC data. Data, ax and ay are the allowable displacement values stored in the X allowable range memory and the Y allowable range memory, respectively, and Δx, Δy and Δθ are the parts for the center of the suction nozzle (12) based on the recognition result of the recognition device (16). The center position deviation amount and the component (4) angle deviation amount of (4).

That is, for example step "2" varieties "R _2" of the part (4) of the part thickness "t _2" is "t _3" greater than, the step parts thickness of the part (4) of "1" is "t ₃ "
It is checked as to whether or not only the component (4) of step “2” hits the suction nozzle (12) that suctions the component (4) of step “3” as follows.

First, the center position of the suction nozzle (12) when mounted in the step "3" position to the component (4) is mounted in the (X _3, Y ₃₎ mounting angle to be attached to the "theta _3" The data “X ₃ ”, “Y ₃ ”, “θ ₃ ” from the NC data and the data “ΔX”, “ΔY”,
Calculated from "Δθ", variety "3" radius D _3/2 of the given in parts library data and FIG. 11 of the nozzle outer diameter D ₃ obtained from a nozzle library data shown in FIG. 10 around the here The existence range of the circular nozzle (12) is obtained.

Next, the existence range of the component (4) in step “2” which has been mounted is determined by using data “X ₂ ”, “Y ₂ ”,
“Θ ₂ ” and the external dimension data “m” obtained from the part library data shown in FIG. 7 of the part (4)
X ₂ ”and“ mY ₂ ”. If there is a part that overlaps the existing range of the nozzle (12), it is determined that the nozzle (12) and the part (4) hit. If there is no overlapping part, it is determined that it does not hit. I do. In this case, since ax = 0 and ay = 0, the positional deviation from the foot pattern is not considered. If it is determined that no hit occurs, the component (4) in step "3" is mounted on the printed circuit board (5) in the same manner as described above.

Next, the component (4) in step "4" is sucked by the next suction nozzle (12) and moves to the recognition station (II). Then, the component thickness is compared with the mounted component (4) in the same manner as described above. For example, the component thickness “t ₄ ” is determined in step “2” from the part library data of FIG. 12 of the type “R ₄ ”.
When the component thickness of the component (4) is smaller than the component thickness “t ₂ ”, but is thicker than the other mounted components (4), the collision is determined by the interference determination function. Here, when it is determined as shown in FIG. 15, the polarity of the component (4) is checked, but the component (4) has no polarity (4).
When the component (4) is rotated by 180 degrees in a plane and is mounted at the mounting position, the suction nozzle (12) and the component (4) of step "2" are used by the interference determination function in the same manner as described above.
Is checked in the positional relationship in the plane.

In this case, the suction nozzle is rotated 180 degrees (12) is not hit the part of the step "2" (4) The component parts thickness is greater than "t _4" (4) only the component (4) because there in addition to whether parts should determine hits (4) there is no, step "4", "theta _4" component (4) a nozzle (12) which are adsorbed by the rotation correction station (III) and of " The component (4) is mounted in the same manner as described above after rotating by 180 degrees to Δθ ”.

Next, at the recognition station (II) for the component (4) in step "5", the mounted component (4) and the component (4) are sucked in the same manner as described above based on the recognition result of the recognition device (16). Although the determination of whether the nozzle (12) and will hit the is performed, step "5" component thickness than parts library data of FIG. 13 parts (4) of the variety "R _5" and "t _5" The component thicknesses “t ₂ ” and “t ₄ ” are larger than those, and it was determined by the interference determination function whether or not the component (4) of step “2” and step “4” hit the suction nozzle (12). As a result, it is determined that the part (4) of step “2” does not hit but the part (4) of step “4” hits, and if it is rotated by 180 °, it hits the part (4) of step “2”. If it is determined, perform the following checks.

If the component (4) in step "5" is a polar component (4), it cannot be rotated by 180 degrees, so if the first judgment by the interference determination function is successful, the following check is immediately performed.

Parts (4) is not mounted, look the step of mounting the same type part (4) and "R _5" from the NC data. That is, in the NC data of FIG. 6, steps “8” and “10” are the same type and no component mounting steps.
U (81) first sets “step = 8”, and since fg = 0, the interference discrimination function again determines whether the suction nozzle (12) hits the mounted component (4) at the mounting position of step “8”. Is determined, and if so, a determination is made that the component (4) has been rotated 180 degrees.

As a result, if it is determined that the part does not hit, the component (4) is mounted on the printed board (5) at the mounting position in step "8" in the same manner as described above. Then, in the RAM (82), it is stored that step “5” is not mounted and step “8” is mounted.

As a result, when it is determined that the hit is made, "step = 1
The same check as in the case of "step = 8" is performed as "0".

Next, in step "6", it is determined whether or not the nozzle (12) for sucking the component (4) hits the mounted component (4) in the same manner as described above. In this case, the 14th of the variety “R ₆ ”
The part thickness “t ₆ ” from the part library data in the figure is larger than the part thickness of the type “R ₁ ” and “R ₃ ”, but the part thickness of the type “R ₂ ”, “R ₄ ” and “R ₅ ” Smaller than Then, it is determined whether or not the nozzle (12) for sucking the component (4) of step "6" and the component (4) of the mounted steps "2", "4" and "8" are hit by the interference determination function. Thus, any part (4) and the part (4) of step “6” are determined to be hit even if they are rotated by 180 degrees, and since the same type is in step “11”, “step =
As "11", it is determined that a hit is made even if the discrimination by the interference discrimination function including the 180-degree rotation is performed, and if there is no other step of the same type, "fg = 0" is checked according to the flowchart of FIG. You. Since “fg = 0”, the suction nozzle (12) is determined based on the allowable displacement between the mounting position of the board (5) and the component (4) to be mounted.
Then, it is determined whether or not the mounted component (4) hits.

That is, first, the tolerance of positional displacement obtained by doubling the tolerance area of the part library data of the type “R ₆ ” is “ax = 2t
X ₆ ”and“ ay = 2tY ₆ ”are set, and“ fg = 1 ”is set. The first step to be mounted is set in the step memory, and“ step = 6 ”.

Then, similarly to the above, it is determined whether or not the suction nozzle (12) hits the mounted component (4) by the interference determination function and whether or not the component (4) to be mounted hits the mounted component (4). Is determined. In this determination, the determination of the suction nozzle (12) by the interference determination function is performed on the already determined mounted component (4) having a large component thickness, and it is determined whether the mounted component (4) is hit. The determination is made for all mounted components (4) regardless of the component thickness.

In this case, when the component (4) is attached to the position specified by the NC data, the nozzle (12) for sucking the component (4) to be attached at the center in FIG. ), But “ax = 2t” from the parts library data in FIG.
X ₆ "" component in the tolerance given by ay = 2TY ₆ "(4)
Whether the position of the suction nozzle (12) and the position of the adjacent component (4) do not overlap due to the shift of the center position of the suction nozzle (12) due to the shift of the mounting position (that is, the component center position) Is checked to determine if it is a hit. As a result, it is determined that the suction nozzle (12) will not hit the adjacent mounted component (4) and will not hit the adjacent mounted component (4) if the components are shifted within the allowable range. In this case, the XY table (1) is moved with the correction of ΔX, ΔY, and Δθ so as to mount the component (4) at a position shifted by the determined shift amount. The component (4) is mounted as described above. That is, in FIG. 16, the component (4) to be mounted at the center moves its component center (O _{1 in} FIG. 16) in the X direction from the mounting position (O _{0 in} FIG. 16) specified in the NC data. Δl
It is mounted as a shifted position. Then, the coordinates of the actually mounted position (O _{1 in} FIG. 16) are stored in the RAM (82) together with the step number.

In this case, if it is determined that even if the component (4) is shifted within the allowable range, the mounted component (4) is hit, the component (4) is rotated by 180 degrees within the same allowable range. It is determined whether or not the part (4) is hit by shifting, and if it is determined that the hit still occurs, the same check is performed for step "11" which is an unmounted step of another same type, and still hits If it is determined that there is no other step of mounting a component (4) of the same type and "fg = 1", the discharge is performed at the discharge station (V) without mounting on the printed circuit board (5). become.

 Hereinafter, the mounting of the component (4) is performed in the same manner.

The mounted component (4) is the recognition station (I
The component including the component (4) sucked by the nozzle (12) immediately before the component (4) recognized in I), and the component that has not yet been mounted when it is determined whether or not it hits Even in the case of (4), the judgment is made assuming that it is attached. Alternatively, the determination as to whether or not to interfere may be made after the component (4) to which the immediately preceding nozzle (12) is sucked is attached.

Further, as described above, if it is determined that the part (4) is not recognized in the determination as to whether or not the part (4) is recognized, the step stored in the step memory at that time is regarded as a mounted step and another step in the RAM (82) is performed. Although the data is stored in the area, it is also possible to store the data indicating that the NC data is stored in each step of the NC data stored in the RAM (82).

Further, in the case where the component (4) to be mounted is mounted at a position shifted within the allowable range of the positional deviation so that the suction nozzle (12) hits the mounted component (4), in this embodiment, Although the position was shifted by the parallel movement in the X and Y directions by the XY table (1), only the data of “ax” and “ay” or the position shift allowable angle in the θ direction was set, and the suction nozzle ( 12) Rotation correction station (II)
It is also possible to make the angle shift within an allowable range by the rotation in I) so that the part (4) does not hit the nozzle (12).

Furthermore, in the present embodiment, the center position of the suction nozzle (12) and the rotation center position are assumed to be coincident with each other. The shift amounts “Δx” and “Δy” with respect to the suction nozzle (12) are defined as the position shift amounts from the rotation center of the nozzle (12), and the recognized shift amount in the XY direction from the center of the nozzle (12) is “ ΔX _0, ΔY _0, and the position of the rotation center is obtained from the mounting position data “X”, “Y”, the mounting angle data “θ”, and “ΔX”, “ΔY”, “Δθ”. , “ΔX ₀ ”, “ΔY ₀ ”, the mounting angle data “θ”, the center position of the suction nozzle (12) at the time of mounting is calculated from the mounting angle data “Δθ”, and the existence range of the nozzle (12) is calculated from the nozzle outer diameter data. be able to.

Further, in the present embodiment, when it is determined whether or not the nozzle (12) sucking the component (4) to be mounted hits the mounted component (4), the component thickness is compared to determine whether the component thickness is to be mounted. Although the determination by the interference determination function was made only for the mounted part (4) thicker than the part (4) to be mounted, the interference determination function first determines whether or not all the mounted parts (4) are hit. After that, the component thickness may be compared for the component (4) determined to be hit.

Further, in the present embodiment, in determining whether or not the nozzle (12) and the mounted component (4) hit by comparing the component thickness, in the present embodiment, the suctioned component (4) and the mounted component (4) are used.
Is determined to be the hit if the same component thickness or the mounted component thickness is greater, but even if the mounted component (4) is slightly thinner, it may hit, It is also conceivable to compare the component thickness of the mounted component (4) with a value obtained by subtracting a predetermined thickness from the component thickness of the component (4).

Furthermore, when the component thickness of the component (4) that is being sucked and the component (4) that has been mounted are substantially the same (the difference between the two is within a predetermined range), a nozzle for mounting the component (4) is used. It is also conceivable that the descending speed of (12) is reduced to prevent the mounted component (4) from being displaced.

Furthermore, in this embodiment, the mounting station (IV)
The XY table (1) on which the suction nozzle (12) is fixed and the printed circuit board (5) is mounted moves in the XY direction to determine the mounting position, but the suction nozzle (12) is mounted in the XY direction. Can be controlled as shown in the flowchart of FIG.

Further, in the present embodiment, in determining whether or not there is interference with an adjacent component, whether or not all of the mounted components interfere with any of the conditions of the component thickness or the positional relationship in the plane based on the NC data is determined. Is checked, but when there is a place where components are densely located in the printed circuit board, and when there is a place where it is not, the determination may be made only for the step where the components are densely located. For this reason, only the step number for which the NC data should be determined may be set and stored in the RAM. Alternatively, data indicating whether or not to check at each step of the NC data may be set.

(G) Effects of the Invention As described above, according to the present invention, if it is determined that the suction nozzle interferes with the mounted component, it is determined that the suction nozzle is displaced within a permissible range from the mounting position. , The occurrence of defective substrates can be prevented.

[Brief description of the drawings]

FIG. 1 is a plan view of a component mounting apparatus to which the present invention is applied, and FIG.
FIG. 3 is a side view of the suction station, FIG. 3 is a side view of the nozzle rotation correction station, FIG.
FIG. 5 is a control block diagram of the present invention, FIG. 6 is a diagram showing NC data, FIGS. 7, 10, 12 and 14 are diagrams showing part library data, FIGS. 8 and 11 FIG. 9 is a diagram showing nozzle library data, FIG. 9 is a diagram showing a flowchart, and FIGS. 15 and 16 are plan views showing the positional relationship between a suction nozzle and an adjacent part. (1) ... XY table (table), (2) ... X-axis servo motor (relative movement drive means), (3) ... Y-axis servo motor (relative movement drive means), (4) ... chip shape Electronic parts (parts), (5) Printed circuit board, (12)
Suction nozzle, (16) ... Recognition device (recognition means).

Claims (1)

(57) [Claims] A suction nozzle for picking up a component and recognizing a displacement of the component with respect to the suction nozzle by a recognition means;
The positional displacement is corrected based on the recognition result, and the relative positional relationship between the suction nozzle and the table on which the printed circuit board is mounted is changed by the relative movement driving means in the plane direction. In a component mounting apparatus to be mounted on a component, a determining unit that determines whether the suction nozzle interferes with the mounted component when mounting the component, and mounts when the determining unit determines that there is interference with the component. Control means for controlling the relative movement driving means so as to mount the component at a position shifted within an allowable range from the position.