JP2840392B2 - Electronic component automatic mounting device - Google Patents

Description

The present invention relates to an electronic component automatic mounting apparatus for mounting a chip-shaped electronic component on a printed circuit board.

(B) Conventional technology Conventionally, this type of electronic component automatic mounting apparatus has been disclosed in Japanese Patent Application Laid-Open No. 63-2324.
There is a technique disclosed in Japanese Patent Publication No. 96-96. That is, a rotatable rotating frame, a plurality of elevating members arranged at equal intervals in the circumferential direction of the rotating frame, a gripping member of an electronic component mounted on each elevating member so as to be able to move up and down, and each gripping member. A rotary drive device that intermittently drives the rotary frame so as to stop at least at the electronic component supply position and the electronic component mounting position, a cam drive unit that raises and lowers the elevating member as the rotary frame rotates, and an electronic component. And a motor driven gripping member elevating means arranged at the mounting position.

However, there was an inconvenience in using this technique in an apparatus manufactured by the present applicant. That is, due to the delay of the servomotor, timing with other work is not synchronized, for example, before the gripping member rises to a predetermined height, the rotation of the rotating frame starts, and the gripping member hits the apparatus main body. This can damage the device.

(C) Problems to be Solved by the Invention Therefore, it is an object of the present invention to provide a safety mechanism so as not to break the device even if the servomotor is delayed.

(D) Means for Solving the Problems Accordingly, the present invention provides an electronic component automatic mounting apparatus for mounting a chip-shaped electronic component on a printed circuit board, comprising: a component holding unit for holding the component; A first vertical movement means for moving the component holding means up and down, and a separate driving source which is set so as to move up a little later at least when the part holding means is moved up by the first vertical movement means; And a second up-down moving means.

(E) Action From the above, the component holding means holding the component is the first type.
Up and down means.

When the second vertical movement means set to move up a little later at the time of upward movement by the first vertical movement means, if the lifting of the component holding means by the first vertical movement means is delayed, The holding means is quickly raised by the second vertically moving means.

(F) Example Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

(1) shown in FIG. 2 is an X-axis servo motor (2) and Y
A printed circuit board (5) on which a chip-shaped electronic component (4) (hereinafter referred to as a chip component (4)) is mounted on an XY table that is moved in the X and Y directions by driving the axis servomotor (3). Is placed.

(6) is a component supply table on which a number of component supply devices (7) are arranged in parallel. The component supply unit is guided by a guide rod (9) by rotation of a ball screw (8A) driven by a component supply unit servo motor (8). It is moved in the X direction (the horizontal direction in FIG. 2).

(10) a rotating disk on which a plurality of suction heads (12) provided with a plurality of suction nozzles (11) for taking out and transporting the chip component (4) from the component supply device (7) are provided on the lower surface; It is intermittently rotated by the rotation of the turntable servomotor (13) shown in FIG.

A fitting groove (11A) in which a nozzle rotation fitting portion (30) described later is fitted above the suction nozzle (11).
(See FIG. 3). Further, the suction nozzle (11) is slidably fitted to the suction head (12), and is urged downward by a spring (82). Therefore,
The spring (82) responds to changes in the suction level and the mounting level due to a difference in the thickness of the chip component (4), and provides an appropriate pressing force.

(I) is a suction station for taking out the chip component (4) from the component supply device (7).

(II) Nozzle rotation correction for recognizing the state of the chip component (4) sucked by the suction nozzle (11) by the recognition device (14) and correcting the rotation of the chip component (4) based on the recognition result. Station.

(III) is to replace the chip component (4) after the work in the nozzle rotation correction station (II) with the printed circuit board (5).
A mounting station to be mounted on.

(IV) is a result of recognition by the recognition device (14). As a result, for example, the chip component (4) that is standing and adsorbed, or the chip component (4) that is adsorbed is different, etc. This is a discharge station for discharging 4).

(V) is a nozzle selection station for selecting a suction nozzle (11) corresponding to the chip component (4) to be sucked by the suction station (I), and a gear () provided on the outer diameter of the suction head (12). A driving gear (not shown) as a nozzle selecting means is rotated by a driving gear servo motor (15) (see FIG. 5) which is moved by a driving system (not shown) and meshes with the gear, and then rotated. The desired suction nozzle (11) is selected by the rotation of (16).

Hereinafter, the turntable (10) will be described with reference to FIG.

(50) is the cylindrical part (5
This is a hollow cylindrical cylindrical cam member for guiding a turntable suspended and fixed to a mount (52A) of an index unit (52) so as to surround the upper part of (1). A cam (53) is formed substantially all around the lower peripheral portion of the cam member (50), and the upper end of each suction head portion (12) is formed on the upper surface of the cam (53) by a spring (54). The roller (55) as a sliding portion provided in the cam rotates while being pressed, and the suction heads (12) rotate with the turntable (10) while moving up and down according to the shape of the cam (53). That is, a pair of guide bars (56) are vertically movably penetrated through the turntable (10) in each suction head section (12), and a roller (5) is provided at the upper end of the bar (56).
The mounting member (57) provided so as to be able to rotate 5) is fixed. Therefore, each suction head section (12) is supported by the rotating disk (10) so as to be vertically movable. Note that the suction head (1
2) When the chip component (4) is sucked in the suction station (I) by the downward movement, and when the chip component (4) is mounted on the printed circuit board (5) in the mounting station (III),
Of the plurality of suction nozzles (11) provided, a stopper plate (80) provided on a base (81) of the electronic component automatic mounting apparatus main body is controlled so as not to be lowered except for a desired one.

(58) is a hose as a connecting body communicating with a vacuum pump (not shown). The other end of each hose (58) is connected to a connecting hose (59) embedded through the turntable (10), and the connecting hose (59) is connected to a switching valve (60) and a horizontally long intake path (61). , And communicates with the vacuum pump via a central intake passage (62).

(63) If necessary, when the suction station (I)
A suction type suction clutch solenoid for restricting the suction head section (12) from lowering and stopping the suction operation, so that the suction head section vertical movement lever (65) is not lowered by driving the cam mechanism (64). It has a contact lever (66) that contacts the (65). That is, when the clutch solenoid (63) is demagnetized, the contact lever (66) comes into contact with the vertical movement lever (65), so that the vertical movement lever (65) is not lowered. The same structure is also provided in the mounting station (III).

Next, the recognition device (14) provided in the nozzle rotation correction station (II) will be described with reference to FIG.

(17) is a CCD camera for recognizing a state in which the chip component (4) is sucked by the suction nozzle (11), and a box waiting below the chip component (4) which is conveyed to above the recognition device (14). (18) Two mirrors (1
The images obtained using the reflections of (9) and (20) are bricks (2
Recognized through 1). That is, light from a light source (not shown) is applied to the chip component (4) via the diffusion plate, and the CCD camera (17) captures a silhouette image and the recognition device (14) recognizes the silhouette image.

Next, the nozzle rotation positioning device (22) of the nozzle rotation correction station (II) will be described with reference to FIGS.

(22A) is a nozzle rotation motor as a driving source for rotating the suction nozzle (11) by θ, and is a nozzle rotating body (27) fitted into a bearing body (27) via a coupling (26) on an output shaft (25). A nozzle rotating rod (29) described later is attached to 28) so as to be vertically movable. In addition, you may move up and down using a ball spline.

The (29) is a nozzle rotating rod fitted in the nozzle rotating body (28) and having a nozzle rotating fitting part (30) at a lower end portion, and a vertically long hole (31) provided in the nozzle rotating body (28). A pin (32) projecting more outward is provided. The nozzle rotation fitting portion (30) is formed so as to be narrower toward the lower end so as to fit into the fitting groove (11A). The nozzle rotating rod (29) is provided with a locking part (34) for locking a spring (33) as a cushion means between the nozzle rotating body (28) and the bottom surface. ), A swing lever (37) attached via a rod end (36) to an up / down movement lever (35) that is moved up and down by a cam as a drive source (not shown) is locked.
Swing lever (37) according to the vertical movement of the vertical lever (35)
Is swung up and down, so that the nozzle rotating rod (29) is moved up and down while being urged by the spring (33).

The interface (38) in FIG. 5 is an interface to which the XY table (1), the component supply table (6), the rotating disk (10), the driving gear (16) and the nozzle rotation positioning device (22) are connected. , Each of these control elements serves as a control device
The program is controlled by the CPU (39).

(40) is a RAM as a storage device, which is the rotation center position data of each of the suction nozzles (11), and the recognition device (14)
And the mounting position data (X direction, Y direction, θ direction) of the chip component (4) on the printed circuit board (5) and the like are stored in each predetermined area.

Since the set position of the rotation center of the suction nozzle (11) may be shifted due to a temperature change, a change over time, or the like, a state where the chip component (4) is not suctioned after a certain set temperature or after a certain time has elapsed. The recognition device (14) recognizes each of the suction nozzles (11), calculates the shift amount of the rotation center of the suction nozzle (11), and stores the shift amount in the RAM (4).
0) may be stored again, or the shift amount may be added to the rotation center position data of the suction nozzle (11).

A drive circuit (41) is connected to the CPU (39), and the external drive circuit (41) is connected to the X-axis servomotor (2), the Y-axis servomotor (3), and the component supply unit servomotor (8). ), A rotary disk servomotor (13), a drive gear servomotor (15), and a nozzle rotation motor (22A).

 Hereinafter, the operation will be described in detail with reference to the drawings.

First, before performing the mounting operation, the recognition device (14) uses the rotation center position of each suction nozzle (11) (the CCD camera (1)).
7)), and the rotation center position data is stored in the RAM (40).

The component supply table (6) is moved to the suction station (I) by driving the component supply unit servomotor (8), and a desired component supply device (7) is on standby at the component pick-up position. Then, the suction nozzle (11) is moved above the chip component (4) stored in the component supply device (7) in a standby state, and moves the chip component (4) to the suction nozzle (4) as shown in FIG. 11) Hold by suction at the lower end. The station (I)
Then, the lower end of the suction nozzle (11) of the suction head (12) is connected to the chip component (4) stored in the component supply device (7).
Position on the upper and lower movable rails (not shown) provided at the broken portions of the cam (53) of the cam member (50). 55) is mounted and the upper and lower rails are lowered.

Next, the rotation correction operation of the chip component (4) in the θ direction at the nozzle rotation correction station (II) will be described.

Here, the position of the chip component (4) from the image center of the CCD camera (17) in a state of being sucked by the suction nozzle (11) is recognized by the recognition device (14), and the recognition data (X ₁ , Y _{1) is obtained.} ,
θ ₁ ) is stored in the RAM (40). The correction operation for the angle data (θ) will be described.

The recognition angle data (θ ₁ ) is, for example, an angle formed by an intersection formed by extending one side of the image center and a reference end surface of the chip component (4).

The mounting angle data (θ direction) of the mounting position data stored in the RAM (40) and the recognition angle data (θ ₁ )
Is compared with a comparison device (not shown), and if the amount is a deviation amount, the deviation amount (θ direction−θ ₁ ) is calculated by a calculation device and RA is calculated.
It is stored in M (40) and the rotation is corrected. That is, the vertical lever (35) is lowered by the driving of the cam, the rocking lever (37) is rocked downward, and the nozzle rotating fitting part (30) is attracted while being urged by the spring (33). After coming into contact with the tapered portion of the groove to be fitted (11A) provided at the upper part of the nozzle (11), the nozzle rotation motor (22A) is displaced (θ
By rotating by the direction -θ ₁ ), the suction nozzle (11) is rotated, and the positioning of the chip component (4) is performed.

Then, at the mounting station (III), the printed board (5) is moved XY by the XY table (1), and the chip component (4) is mounted at a predetermined position.

In addition, the chip component (4) determined not to be mounted by the recognition device (14) is discharged when the rotation of the turntable (10) is continued and moved to the discharge station (IV). For example, when the chip component (4) is standing on the suction nozzle (11) and is being sucked or the sucked chip component (4) is different, the mounting station (II)
It is discharged without mounting work in I).

The suction nozzle (11) to be used next at the next nozzle selection station (V) rotates after the drive gear (16) meshes with a gear (not shown) provided on the suction head section (12). The selection is made by rotating the suction head section (12) as the operation is performed.

Here, as described above, the spring (82) absorbs the difference in the suction level and the mounting level due to the difference in the type (thickness, etc.) of the chip component (4), but in order to improve the precision of the device. Are described below.

Reference numeral (71) in FIG. 1 denotes a servomotor of the suction head vertical movement device (70), which rotates a ball screw (73) attached via a rod (72).

A slide plate (74) meshed with the ball screw (73) is moved up and down by rotation of the ball screw (73).
One end of the slide plate (74) is a U-shaped locking portion, and the locking portion locks the upper end of the suction head vertical movement rod (75). Therefore, the suction head (12) is moved up and down via the suction head vertical movement rod (75) by the rotation of the servo motor (71).

Also, due to the delay of the servo motor (71), the timing with other operations is not synchronized. For example, before the suction head (12) is raised to a predetermined height, the rotating disc (10)
Is started, and the chip part (4) and the device itself may be broken. Therefore, if the above-mentioned cam mechanism (64) is used together and the timing of raising the suction head (12) by the servo motor (71) is delayed, the cam mechanism (64) forcibly forces the suction head. (12) to lift. That is, as shown in FIG. 7, the setting of the cam mechanism (64) is set slightly earlier than the normal vertical movement timing by the servo motor (71) when descending, and slightly delayed when ascending. Therefore, during normal operation (until the maximum vertical movement stroke timing (solid line A) of the suction head section (12)), the suction head section (12) is moved up and down by a predetermined amount by the servomotor (71). Then, when there is an abnormality (when the ascending timing by the servomotor (71) is later than the timing of the maximum vertical movement stroke), it is elevated by the cam mechanism (64) (solid line B). That is, the operating lever (64B) is swung according to the path of the cam (64A) of the cam mechanism (64), and attached to one end of the operating lever (64B) via the rod end (65A) which is a spherical bearing. The suction head vertical movement lever (65) is moved upward. Then, the suction head vertical movement rod (75) attached to the lower end of the vertical movement lever (65) via the rod end (65B) which is a spherical bearing is also moved upward. As a result, the suction head (12) is raised to a predetermined height before the next rotation of the turntable (10) (solid line C). Thereby, a serious accident is prevented beforehand, and reliability is improved. Also,
A two-dot chain line D is an example of a changing vertical movement stroke of the suction head section (12), and various settings can be made up to a maximum vertical movement stroke. FIG. 1 is a view in which the suction head vertical movement device (70) is provided in the suction station (I), but the same structure is also provided in the suction station (III).

Further, the suction type suction clutch solenoid (63) for regulating the lowering of the suction head portion (12), and the suction type mounting clutch solenoid (not shown) are operated by the suction head portion vertical movement device (70) of the present invention. In this case, the suction clutch solenoid (63) and the mounted clutch solenoid can be omitted.

Further, when the servo motor (71) is delayed, the output signal of the encoder is checked to detect the delay, and when the servo motor (71) is delayed for a predetermined time or more, it may be stopped in the next cycle.

(G) Effects of the Invention As described above, according to the present invention, it is possible to cope with the difference in the suction level and the mounting level generated for each type of chip component.
Accidents due to motor delays can be prevented.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view of a turntable of an electronic component automatic mounting apparatus to which the present invention is applied, FIG. 2 is a plan view of the electronic component automatic mounting apparatus, FIG. 3 is a side view of a nozzle rotation correction station,
FIG. 4 is a perspective view of the nozzle rotation positioning device, FIG. 5 is a circuit diagram showing the configuration of the electronic component automatic mounting device, FIG. 6 is a partial cross-sectional view of the rotary disk, and FIG. FIG. (11) Suction nozzle, (12) Suction head, (1
3) Rotary disk servo motor, (64) Cam mechanism, (6
5) Suction head vertical movement lever, (70) Suction head vertical movement device, (71) Servo motor, (75)
… Suction head vertical bar.

Claims (1)

(57) [Claims] In an electronic component automatic mounting apparatus for mounting a chip-shaped electronic component on a printed circuit board, a component holding means for holding the component, and a first means for vertically moving the component holding means.
And a second drive mechanism for moving the component holding means up and down by a separate drive source set to move up a little later at least when the component holding means is moved up by the first up and down movement means. An automatic electronic component mounting apparatus, comprising: a moving means.