JPH04239200A - Electronic part automatic mount device - Google Patents

Abstract

PURPOSE:To surely attract even a chip part which can not be attracted completely by one attraction nozzle. CONSTITUTION:A large part (4) of chip parts (4) is attracted by two or more attraction nozzles (11) of a plurality of attraction nozzles (11) which are provided to an attraction head part (12) provided to a lower surface on the circumference of a revolving disc in accordance with the kind of parts.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention takes chip-shaped electronic components from a component supply device using a plurality of suction nozzles provided in a suction head provided on the lower circumferential surface of a rotary disk, and then transfers the components onto a printed circuit board. The present invention relates to an automatic mounting device for electronic components.

0002

[Prior art] This kind of conventional technology is disclosed in Japanese Patent Application Laid-open No. 1983-
There is one disclosed in Japanese Patent No. 174394.

[0003] In this method, a plurality of suction nozzles are selectively provided on a plurality of suction heads that are disposed vertically movably around the periphery of a rotary disk that rotates intermittently, and a selected one of the plurality of suction nozzles is activated. It picks up parts and attaches them to a printed circuit board.

However, in recent years, parts of various sizes have come to be handled. For example, when picking up large parts,
The single suction nozzle selected above has a weak suction force and may not be able to fully suction the parts, or the parts may fall during transportation.

[0005]

SUMMARY OF THE INVENTION An object of the present invention is to make it possible to suction even large parts and to prevent them from falling during transportation.

[0006]

[Means for Solving the Problems] Therefore, the present invention takes out chip-shaped electronic components from a component supply device using a plurality of suction nozzles, which are provided in a suction head section provided on the lower circumferential surface of a rotary disk, depending on the type of component. After that, in an electronic component automatic mounting device that mounts the component on a printed circuit board, two or more of the plurality of suction nozzles are used to suction a large component among the components. This is what I did.

[0007]

[Operation] With the above structure, large parts are suctioned by two or more suction nozzles among the plurality of suction nozzles provided in the suction head section provided on the circumferential lower surface of the rotary disk.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

(1) shown in FIG. 2 is an X-axis servo motor (2
) and a printed circuit board (5) on which a chip-shaped electronic component (4) (hereinafter referred to as chip component (4)) is mounted. ) is placed.

Reference numeral (6) denotes a component supply stand on which a large number of component supply devices (7) are arranged in parallel, and a guide rod (
9) and is moved in the X direction (horizontal direction in FIG. 2).

(10) is a rotary motor in which a large number of suction heads (12) each having a plurality of suction nozzles (11) for picking up and conveying the chip components (4) from the component supply device (7) are installed on the lower surface. The disc is intermittently rotated by rotation of a rotary disc servo motor (13) shown in FIG.

(110) is a first diffusion plate made of acrylic provided on the circumference of each suction nozzle (11);
Reference numeral 111) denotes a second diffusion plate that is similarly attached to span all the suction nozzles (11). In addition, since the first diffusion plate (110) has a suction nozzle (11) that moves up and down, a gap must be provided in the second diffusion plate (111) as shown in FIG. This also serves to prevent the small chip components (4) from being exposed to light.

Further, a fitting groove (12A) (see FIG. 3) is provided in the upper part of the suction head (12), into which a nozzle rotation fitting part (30) to be described later is fitted. Furthermore,
The suction nozzle (11) is slidably fitted into the suction head (12), and is urged downward by a spring (not shown). Therefore, the spring causes the chip component (4
) It copes with changes in the adsorption level and attachment level due to differences in the thickness of the parts, etc., and provides an appropriate pressing force.

(■) is a suction station that takes out chip components (4) from the component supply device (7).

(■) The recognition device (14) recognizes the state of the chip component (4) sucked by the suction nozzle (11), and the rotation of the chip component (4) is corrected based on the recognition result. This is a nozzle rotation correction station.

(■) is a mounting station for mounting the chip component (4) onto the printed circuit board (5) after the work at the nozzle rotation correction station (■) is completed.

(■) As a result of recognition by the recognition device (14), for example, the chip component (4) is stuck upright or the chip component (4) being sucked is wrong, so it should not be mounted. This is a discharge station for discharging chip parts (4).

(■) is a suction nozzle (11) corresponding to the chip component (4) to be suctioned at the suction station (■).
At the nozzle selection station, select the suction head (
12) A drive gear servo motor (15) (see FIG. 5) that is moved by a drive system (not shown) to a gear (not shown) provided on the outer diameter part and rotates after meshing with the gear. Drive gear (16
), a desired suction nozzle (11) is selected.

The rotary disk (10) will be explained below based on FIG. 6. (50) is a hollow cylindrical rotary disk guide that is suspended and fixed to the mounting base (52A) of the index unit (52) so as to surround the upper part of the cylindrical part (51) formed on the upper part of the rotary disk (10). It is a cylindrical cam member for. A cam (53) is formed on the lower end circumferential side of the cam member (50) over almost the entire circumference, and a spring (54) is attached to the upper surface of the cam (53) so that the upper end of each suction head part (12) A roller (55) as a sliding part provided on the suction head rotates while being pressed, and each suction head part (12) rotates together with the rotary disk (10) while moving up and down according to the shape of the cam (53). That is, in each suction head section (12), a pair of guide rods (56) are installed vertically movably through the rotary disk (10), and a roller (55) is installed at the upper end of the rod (56).
A mounting member (57) rotatably provided is fixed. Therefore, each suction head section (12) is supported by the rotary disk (10) so as to be movable up and down. In addition, the suction head part (
By the downward movement of 12), the suction station (■) suctions the chip component (4), and the mounting station (■) attaches the chip component (4) to the printed circuit board (5).
A downward movement stopper (80) provided corresponding to each suction nozzle (11) prevents any suction nozzle (11) other than the plurality of desired suction nozzles (11) from being lowered. The lower movement stopper (80) is biased by a spring (not shown) so that its upper end rotates toward the center of the suction head (12) with respect to the paper surface of FIG. When the nozzle (11) is lifted upward, it goes under the nozzle upper end (11A) and the suction nozzle (11)
to be regulated in that position. In addition, the lower movement stopper (80)
When a contact rod (not shown) contacts the other end (80A), its upper end is rotated to the outside of the suction head (12) against the biasing force of the spring. This allows the suction nozzle (
11) restrictions will be lifted.

[0020] (58) is a hose as a connecting body communicating with a vacuum pump (not shown). The other end of each hose (58) is connected to a connecting hose (59) buried through the rotary disk (10), and the connecting hose (59) is connected to the switching valve (60), the horizontally long intake path (61) , communicates with the vacuum pump via a central air intake passage (62).

(63) is a suction type suction clutch solenoid that stops the suction operation by regulating the descent of the suction head (12) at the suction station (■) when necessary, and the solenoid of the cam mechanism (64) To prevent the suction head vertical movement lever (65) from being lowered by driving, the lever (65) is
It has a contact lever (66) that comes into contact with. That is, when the clutch solenoid (63) is demagnetized, the abutment lever (66) abuts the vertical movement lever (65),
The vertical movement lever (65) is prevented from being lowered. Note that a similar structure is also provided at the mounting station (■).

Next, the nozzle rotation correction station (■)
The recognition device (14) provided in the will be explained based on FIG. 3.

(17) is a CCD camera that recognizes the state in which the chip component (4) is sucked into the suction nozzle (11);
The chip parts (
4) An image obtained using the reflections of two mirrors (19) and (20) installed in a box (18) waiting below is recognized through a lens (21). That is, light from a light source (not shown) is transmitted through the diffuser plate to the chip component (4).
), a silhouette image is captured by a CCD camera (17), and recognized by a recognition device (14).

Next, the nozzle rotation correction station (■)
The nozzle rotation positioning device (22) will be explained using FIGS. 3 and 4.

(22A) is a nozzle rotation motor as a drive source for rotating the suction nozzle (11) by θ, and the nozzle is fitted into the bearing body (27) via the output shaft (25) via the coupling (26). A nozzle rotating rod (29), which will be described later, is attached to the rotating body (28) so as to be movable up and down. Incidentally, a ball spline may be used to move it up and down.

The above (29) is the nozzle rotating body (28)
It is a nozzle rotation rod that is fitted into the nozzle rotation body and has a nozzle rotation fitting part (30) at the lower end, and has a pin (32) that projects outward from a vertically long hole (31) provided in the nozzle rotation body (28). It is provided. The nozzle rotation fitting portion (30) is formed to become narrower toward the lower end so as to fit into the fitting groove (12A). Further, the nozzle rotating rod (29) is provided with a locking portion (34) that locks a spring (33) serving as a cushioning means between the nozzle rotating body (28) and the bottom surface of the nozzle rotating body (28). ) is locked with a swing lever (37) attached via a rod end (36) to a vertical lever (35) that is moved up and down by a cam as a drive source (not shown). As the swing lever (37) is moved up and down in accordance with the up and down movement of the nozzle rotating rod (29), the nozzle rotating rod (29) is moved up and down while being biased by the spring (33).

(38) in FIG. 5 is an interface, which connects the XY table (1), the parts supply table (6), and the rotary disk (1).
0), drive gear (16) and nozzle rotation positioning device (
22) are connected, and each of these control elements is program-controlled by a CPU (39) as a control device.

(40) is a RAM as a storage device, which stores rotation center position data of each suction nozzle (11), recognition position data of the chip component (4) by the recognition device (14), and each chip component (4). Mounting position data (X direction, Y direction, θ direction) on the printed circuit board (5), etc. are stored in each predetermined area.

[0029] Since the set position of the rotation center of the suction nozzle (11) may shift due to temperature changes, changes over time, etc., the chip component (4) should be The recognition device (14) may recognize each suction nozzle (11) that is not suctioning, calculate the deviation of the rotation center of the suction nozzle (11), and store the deviation amount in the RAM (40) again. However, the amount of deviation may be added to the rotation center position data of the suction nozzle (11).

[0030] The CPU (39) also includes a drive circuit (
41) is connected to the drive circuit (41), the X-axis servo motor (2), the Y-axis servo motor (3), the component supply section servo motor (8), the rotary disk servo motor (13),
A drive gear servo motor (15) and a nozzle rotation motor (22A) are connected.

The operation will be explained below. First, before performing the mounting operation, each suction nozzle (1
1) The rotation center position (based on a reference point such as the image center of the CCD camera (17)) is recognized, and the rotation center position data is stored in the RAM (40).

The component supply table (6) is moved to the suction station (■) by the drive of the component supply section servo motor (8), and a desired component supply device (7) is placed on standby at the component take-out position. Then, the suction nozzle (11) is moved above the chip component (4) stored in the waiting component supply device (7) and adsorbs the chip component (4) as shown in FIGS. 3 and 7. It is held by suction at the lower end of the nozzle (11). In the station (■), the lower end of the suction nozzle (11) of the suction head (12) must be lowered to the position of the chip component (4) stored in the component supply device (7), and it is necessary to ) The roller (55) at the upper end of the head portion (12) is placed on a vertically movable vertical rail (not shown) provided at the interrupted part of the cam (53), and the vertical rail is lowered. This is done by

Next, the nozzle rotation correction station (■)
The rotation correction operation in the θ direction of the chip component (4) will be explained.

Here, the recognition device (14) detects the suction nozzle (
11), the position of the chip component (4) from the image center of the CCD camera (17) is recognized, and the recognition data (X1, Y1, θ1) is stored in the RAM (40). Of these, the correction operation for the angle data (θ) will be explained.

The recognition angle data (θ1) is, for example, the angle formed by the intersection line formed by extending one side of the image center and a reference end face of the chip component (4).

The mounting angle data (θ direction) of the mounting position data stored in the RAM (40) and the recognition angle data (θ1) are compared by a comparison device (not shown), and if there is a deviation, The calculation device calculates the amount of deviation (θ direction - θ1
) is calculated and stored in the RAM (40), and the rotation is corrected. That is, the vertical movement lever (
35) is lowered, the rocking lever (37) is rocked downward, and the nozzle rotation fitting part (30) is moved to the spring (33).
After the nozzle rotation motor (22A) comes into contact with the tapered part of the fitting groove (12A) provided on the upper part of the suction head part (12) while being biased by As a result, the suction nozzle (11) is rotated and the chip component (4) is aligned.

[0037] Then, at the mounting station (■)
The printed circuit board (5) is moved in XY by the table (1), and the chip component (4) is mounted in a predetermined position.

[0038] Also, the chip parts (4) that have been judged by the recognition device (14) as not to be mounted are placed on the rotary disk (10).
) continues to rotate and is moved to the discharge station (■), where it is discharged. For example, chip parts (4)
When a chip component (4) is being sucked while standing on the suction nozzle (11), or when a different chip component (4) is being sucked, the chip component (4) is discharged without being mounted at the mounting station (■).

The suction nozzle (11) to be used next at the next nozzle selection station (■) is connected to the drive gear (16).
) is rotated after meshing with a gear (not shown) provided on the suction head (12), the suction head (12) is rotated.
12) is selected by rotating.

Furthermore, when handling a large chip component (4) whose size cannot be absorbed by a single suction nozzle (11), multiple suction nozzles are used as shown in FIGS. 1, 8, and 9. (11) may be used to adsorb it. in this case,
For example, group each chip component (4) according to size,
A correspondence table indicating which chip component (4) in the group and which suction nozzle (11) should adsorb the chip component (4) may be stored in the RAM (40). This allows the large chip component (4) to be reliably sucked, and
The chip component (4) can always be kept within the range of the second diffusion plate (111), and the recognition accuracy by the recognition device (14) can be improved.

At this time, when the two suction nozzles (11) are used to suction the chip component (4) as shown in FIGS. 1 and 8, the suction head section (12) is attached to the suction station (
), the lower end of the two suction nozzles (11) (one not shown) other than the other suction nozzle (11) is pushed up, and the lower movement stopper (80) is pushed up. The upper end is rotated toward the center of the suction head (12) by the biasing force of the spring and enters under the nozzle upper end (11A). After this,
When the push-up by the base is released, the suction nozzle (11) is slightly lowered by the biasing force of the spring and supported by the stopper (80), and the subsequent lowering is regulated by the downward movement stopper (80).

Similarly, when a chip component (4) is suctioned by three suction nozzles (11) as shown in FIG. ) should be regulated to the upper position.

[0043] In order to release the restriction by the downward movement stopper (80), the suction nozzle (11) is
While pushing up, move the contact rod to the downward movement stopper (80
) in contact with the other end (80A) of the lower movement stopper (
80) against the biasing force of the spring and attach the suction head part (1
2) When the suction nozzle (11) is rotated outward to release the push-up by the base, the suction nozzle (11) is lowered by the urging force of the spring. If all restrictions by the downward movement stopper (80) have been lifted, the four suction nozzles (11) will pick up the chip parts (
4) can be adsorbed.

[0044]

[Effects of the Invention] As described above, according to the present invention, even large parts can be suctioned.

[Brief explanation of the drawing]

FIG. 1 is a front view of a chip component being sucked by two suction nozzles.

FIG. 2 is a plan view of the electronic component automatic mounting device.

FIG. 3 is a side view of the nozzle rotation correction station.

FIG. 4 is a perspective view of the nozzle rotation positioning device.

FIG. 5 is a configuration circuit diagram of an electronic component automatic mounting device.

FIG. 6 is a partial side sectional view of the rotary disk.

FIG. 7 is a diagram showing a state in which a chip component is sucked by one suction nozzle.

FIG. 8 is a diagram showing a state in which a chip component is sucked by two suction nozzles.

FIG. 9 is a diagram showing a state in which a chip component is sucked by three suction nozzles.

[Explanation of symbols]

(4) Chip parts (10) Turntable (11) Suction nozzle (12) Suction head part (80) Lower movement stopper

Claims (1)

[Claims] Claim 1: A plurality of suction nozzles are provided in a suction head section provided on the circumferential lower surface of a rotary disk, depending on the component type, to take out a chip-shaped electronic component from a component supply device and then mount the component on a printed circuit board. In the electronic component automatic mounting apparatus, the electronic component automatic mounting device is characterized in that a large component among the components is suctioned by two or more suction nozzles among the plurality of suction nozzles. Mounting device.