JP2853136B2 - Electronic component mounting method, electronic component mounting device, and electronic component supply device - Google Patents
Electronic component mounting method, electronic component mounting device, and electronic component supply deviceInfo
- Publication number
- JP2853136B2 JP2853136B2 JP1008214A JP821489A JP2853136B2 JP 2853136 B2 JP2853136 B2 JP 2853136B2 JP 1008214 A JP1008214 A JP 1008214A JP 821489 A JP821489 A JP 821489A JP 2853136 B2 JP2853136 B2 JP 2853136B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- tray
- component supply
- predetermined
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、トレイに収納された電子部品を取り出して
プリント基板の所定位置に実装する電子部品実装方法及
び電子部品実装装置及び電子部品供給装置に関するもの
である。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method, an electronic component mounting device, and an electronic component supply device for taking out electronic components stored in a tray and mounting them at predetermined positions on a printed circuit board. It is.
従来の技術 従来、電子部品をトレイより取り出してプリント基板
に装着する装着は、第６図のようになっていた。2. Description of the Related Art Conventionally, mounting of electronic components taken out of a tray and mounted on a printed circuit board has been performed as shown in FIG.
すなわち、ノズル101で電子部品102を、トレイ103よ
り取り出し、所定位置におかれたカメラ104a,104bの間
に、電子部品102を吸着した状態で、移動しカメラ104a,
104bによって横方向から電子部品のリードの先端の高さ
を判断して、電子部品の良否を決め、良と判断されたも
ののみプリント基板105に装着するというものである。
第７図は、カメラ104a,104bにより電子部品102をとらえ
た際の状態の側面図である。That is, the electronic component 102 is taken out of the tray 103 by the nozzle 101, and is moved while the electronic component 102 is being sucked between the cameras 104a and 104b placed at predetermined positions.
The height of the tip of the lead of the electronic component is determined from the lateral direction by 104b, and the quality of the electronic component is determined, and only the component determined to be good is mounted on the printed circuit board 105.
FIG. 7 is a side view of a state where the electronic components 102 are captured by the cameras 104a and 104b.
また、トレイに収納された電子部品を供給する従来の
装置は、第８図に示すように、トレイ103は、105の位置
に縦づみされており、下から一枚ずつ装着機側に引きだ
され、ヘッド106が有するノズル107で、電子部品108を
吸着し、プリント基板109の所定位置に装着するという
ものである。In a conventional device for supplying electronic components stored in a tray, as shown in FIG. 8, the tray 103 is vertically arranged at the position of 105, and is pulled out one by one from the bottom toward the mounting machine. Then, the electronic component 108 is sucked by the nozzle 107 of the head 106 and is mounted on a predetermined position of the printed circuit board 109.
発明が解決しようとする課題 しかしながら上記のような構造では、電子部品の良否
を判断するのに、ノズルが電子部品を吸着したままでカ
メラの位置まで移動しそこで停止するという大きなロス
タイムを生じる。また、光の反射で撮影するため照明の
当て方により計測値も不安定であったり、電子部品の位
置決めがなされていない為、電子部品のリード端面とカ
メラの平行がでないと計測が困難になったりする。However, in the above-described structure, a large loss time occurs in which the nozzle moves to the position of the camera and stops there while the electronic component is being sucked, in order to determine the quality of the electronic component. In addition, the measurement value is unstable depending on how the illumination is applied because the image is captured by reflection of light, and the positioning of the electronic component is not performed. Therefore, the measurement becomes difficult unless the lead end face of the electronic component is parallel to the camera. Or
一方、部品供給方法としても、トレイの寸法や厚みが
切り換わる場合の機種切替時に多くの時間を要し、ま
た、トレイの品種数にも制限がある。またトレイを段積
みしているため、不良と判断された電子部品がもとのト
レイに戻せない。On the other hand, the component supply method also requires a lot of time when switching models when the dimensions and thickness of the tray are switched, and the number of types of trays is limited. Further, since the trays are stacked, electronic components determined to be defective cannot be returned to the original tray.
本発明は、上記問題点を解決するもので、電子部品の
リードの検出をロスタイムなしで行う。一方、機種切替
性にもすぐれ、トレイの多品種にも対応し不良電子部品
はもとのトレイに戻すことが可能な電子部品供給方法及
び装置を提供するものである。The present invention solves the above-mentioned problem, and detects a lead of an electronic component without a loss time. On the other hand, an object of the present invention is to provide a method and an apparatus for supplying electronic components, which are excellent in model switchability, can cope with various types of trays, and can return defective electronic components to the original tray.
課題を解決するための手段 上記問題点すなわち、電子部品のリードの検出をロス
タイムなしでかつ安定して行うために、電子部品実装方
法としては、リードを有する電子部品が複数個収納され
た電子部品貯蔵部より所定の電子部品を取り出し、この
電子部品のリード状態を検出後、プリント基板の所定位
置にヘッド部により実装する電子部品実装方法におい
て、前記電子部品貯蔵部より所定の電子部品を移載部に
て取り出し、第１位置より第２位置へ移動可能な電子部
品供給部に移載する第１工程と、前記第１工程終了後、
前記電子部品供給部を第２位置へ移動させるとともに、
その移動中に前記電子部品のリード状態を検出する第２
工程と、前記第２位置にある前記電子部品供給部よりヘ
ッド部にて前記電子部品を吸着し、プリント基板の所定
位置に実装する第３工程を有する電子部品実装方法であ
る。Means for Solving the Problems In order to stably detect a lead of an electronic component without a loss time, an electronic component mounting method includes the following: In the electronic component mounting method of taking out a predetermined electronic component from the storage unit, detecting the lead state of the electronic component, and mounting the electronic component at a predetermined position on the printed board by the head unit, transferring the predetermined electronic component from the electronic component storage unit A first step of taking out at the unit and transferring it to the electronic component supply unit movable from the first position to the second position; and after the first step,
While moving the electronic component supply unit to the second position,
A second step of detecting a lead state of the electronic component during the movement;
An electronic component mounting method comprising: a process; and a third process of adsorbing the electronic component at a head portion from the electronic component supply unit at the second position and mounting the electronic component at a predetermined position on a printed board.
そして、電子部品供給装置としては、リードを有する
電子部品が複数個収納された電子部品貯蔵部と、前記電
子部品貯蔵部より所定の電子部品を取り出す移載部と、
前記移載部により取り出された電子部品を第１位置で受
け取り第２位置へ移送可能で、かつこの移送途中に、こ
の電子部品のリード状態を検出可能な電子部品供給部
と、前記電子部品供給部より前記第２位置に移送された
電子部品を吸着し、プリント基板の所定位置に実装可能
なヘッド部を有するものである。And as the electronic component supply device, an electronic component storage unit in which a plurality of electronic components having leads are stored, a transfer unit that takes out a predetermined electronic component from the electronic component storage unit,
An electronic component supply unit capable of receiving the electronic component taken out by the transfer unit at a first position and transferring the electronic component to a second position, and detecting a lead state of the electronic component during the transfer; And a head unit that adsorbs the electronic component transferred from the unit to the second position and can be mounted at a predetermined position on a printed circuit board.
また一方、機種切替性，トレイの多品種対応可能な電
子部品供給装置としては、トレイの着脱が可能なように
トレイを一方向に付勢したトレイ固定レバー部を有した
トレイプレート部とそのトレイプレート部を複数個収納
可能なマガジン部を有し、リフター部にそのマガジン部
が複数個着脱可能な構成をもつものである。On the other hand, as an electronic component supply device capable of switching between models and supporting various types of trays, a tray plate portion having a tray fixing lever portion for urging the tray in one direction so that the tray can be attached and detached, and the tray. It has a magazine portion capable of storing a plurality of plate portions, and has a configuration in which a plurality of magazine portions can be attached to and detached from the lifter portion.
作用 上記構成をもつ方法及び装置の為、電子部品供給装置
から実装機に電子部品を移送する途中で電子部品のリー
ド検出を行うのでロスタイムは最小となり、またリード
検出もリードに光を当てて反射光で検出するのでなく透
過する光の中でのリードの影を検出するので検出も安定
する。Function Because of the method and apparatus having the above configuration, the lead time of the electronic component is detected during the transfer of the electronic component from the electronic component supply device to the mounting machine, so that the loss time is minimized. Since the shadow of the lead is detected in the transmitted light instead of the light, the detection is stable.
また一方、トレイプレート部にトレイ固定レバー部を
有している事により、多品種のトレイに対応可能でかつ
トレイの寸法や厚さがかわっても機種切替時間は最小と
なり、電子部品の補充も短時間で可能となる。そしてそ
のトレイプレート部を収納するマガジン部が複数個着脱
可能により、一括で多くのトレイと交換可能である。ま
た、リフター部があり自由にトレイを選択できるので、
不良と判断された電子部品は、元のトレイに収納する事
も可能である。On the other hand, by having a tray fixing lever on the tray plate, it is possible to handle a wide variety of trays, and even if the dimensions and thickness of the trays are changed, model switching time is minimized, and replenishment of electronic components is also possible. It is possible in a short time. Since a plurality of magazines for accommodating the tray plate are detachable, it can be exchanged for many trays at once. In addition, since there is a lifter part and you can select the tray freely,
The electronic component determined to be defective can be stored in the original tray.
実施例 以下に本発明の一実施例について、電子部品供給装置
を説明する。Embodiment Hereinafter, an electronic component supply device according to an embodiment of the present invention will be described.
第１図は、電子部品供給装置と電子部品実装機の斜視
図である。１はヘッド部、２は上下動及び回転可能なノ
ズル、３は電子部品を認識する認識部、４はプリント基
板、５は電子部品供給装置である。第２図において、６
はトレイプレート部、７はトレイ固定レバー部、８はマ
ガジン、９はトレイ、10は電子部品である。第３図にお
いて、11はマガジン８を上下動させるリフター部、12は
所定位置にあるトレイプレート部６を引き出すトレイプ
レート引き出し部である。ここで、トレイプレート部
６、トレイ固定レバー部７、マガジン８、トレイ９、リ
フター部11およびトレイプレート引き出し部12より電子
部品貯蔵部を構成する。13はトレイ内の電子部品を移載
する移載部、14は移載された電子部品を実装機本体側に
移送しその途中で電子部品のリード検出を行う電子部品
供給部であるセンタリングテーブル部である。第４図ａ
において、15は照明光源の半導体レーザーであり、16は
シラー、17は球面レンズ、18はシリンドリカルレンズ、
19はCCDカメラである。この構成のものが第４図ｂのよ
うな４系統が設置され、電子部品10のリードの検出を行
う。FIG. 1 is a perspective view of an electronic component supply device and an electronic component mounter. 1 is a head unit, 2 is a vertically movable and rotatable nozzle, 3 is a recognition unit for recognizing electronic components, 4 is a printed board, and 5 is an electronic component supply device. In FIG. 2, 6
Denotes a tray plate portion, 7 denotes a tray fixing lever portion, 8 denotes a magazine, 9 denotes a tray, and 10 denotes an electronic component. In FIG. 3, reference numeral 11 denotes a lifter for moving the magazine 8 up and down, and reference numeral 12 denotes a tray plate drawer for pulling out the tray plate 6 at a predetermined position. Here, an electronic component storage unit is configured by the tray plate unit 6, the tray fixing lever unit 7, the magazine 8, the tray 9, the lifter unit 11, and the tray plate drawer unit 12. Reference numeral 13 denotes a transfer unit that transfers electronic components in the tray, and 14 denotes a centering table unit that is an electronic component supply unit that transfers the transferred electronic components to the mounting machine main body side and detects lead of the electronic components on the way. It is. FIG. 4a
, 15 is a semiconductor laser as an illumination light source, 16 is a Schiller, 17 is a spherical lens, 18 is a cylindrical lens,
19 is a CCD camera. In this configuration, four systems as shown in FIG. 4B are installed, and the lead of the electronic component 10 is detected.
次にこの構成における作用を説明する。先ず、電子部
品10を収納したトレイ９をトレイプレート６に固定す
る。その際、作業者はトレイ固定レバー７を矢印の方向
に動かしトレイを置いてレバーを元に戻すという作業の
みでよい。そしてトレイ９を収納したトレイプレート６
をマガジン８に入れる。トレイを収納したマガジン８
は、複数個リフター部11に搭載され固定する。リフター
部11は上下動して、選択するトレイをトレイプレート引
き出し部の設置された所定の高さに停止する。そしてト
レイプレート引き出し部は所定のトレイを引き出し位置
決めを行う。13aという電子部品吸着ノズルを有した移
載部が電子部品の上まで移動して吸着ノズル13aが下降
して電子部品を吸着して、センタリングテーブル14まで
記載を行う（この位置を“第１位置”と呼ぶ）。そして
電子部品を収納したセンタリングテーブル14は、実装機
側に移動を行うのであるが、その際、途中で電子部品を
位置決めして、リードの検出を同時に行うのである。セ
ンタリングテーブル14の中には、第４図ｂに示すように
光学部品を設置してあり、半導体レーザ15から出た光は
シラー16で曲げられ、球面レンズ17で平行光とした後、
電子部品のリード部分を照射してその後、CCDカメラ19
によりそのリード部分の影を撮影する。その撮影した像
は第５図に示してある。第５図にあるＡとは、リードが
プリント基板の装着面からこれ以上離れると不良を発生
するという上限値であり、Ｂは実際に撮影した影でのリ
ードの装着面からの距離である。第５図ａではＢ＜Ａに
より電子部品は良品であると判断し、第５図ｂではＡ＜
Ｂより電子部品は不良と判断できる。Next, the operation in this configuration will be described. First, the tray 9 containing the electronic components 10 is fixed to the tray plate 6. At this time, the operator only needs to move the tray fixing lever 7 in the direction of the arrow, place the tray, and return the lever to its original position. And tray plate 6 containing tray 9
Into magazine 8. Magazine 8 containing trays
Are mounted on and fixed to a plurality of lifter units 11. The lifter unit 11 moves up and down to stop the selected tray at a predetermined height where the tray plate drawer is installed. The tray plate drawer draws out a predetermined tray and performs positioning. The transfer unit having the electronic component suction nozzle 13a is moved to above the electronic component, the suction nozzle 13a is lowered to suck the electronic component, and the description is made up to the centering table 14 (this position is referred to as the “first position”). "). Then, the centering table 14 containing the electronic components moves to the mounting machine side. At this time, the electronic components are positioned on the way and the leads are simultaneously detected. In the centering table 14, optical components are installed as shown in FIG. 4b, and the light emitted from the semiconductor laser 15 is bent by the shiller 16 and turned into parallel light by the spherical lens 17,
After irradiating the lead part of the electronic component, the CCD camera 19
Captures the shadow of the lead. The photographed image is shown in FIG. A in FIG. 5 is an upper limit value at which a defect occurs when the lead is further away from the mounting surface of the printed circuit board, and B is a distance from the mounting surface of the lead in an actually photographed shadow. In FIG. 5a, it is determined that the electronic component is non-defective according to B <A, and in FIG. 5b, A <
B indicates that the electronic component is defective.
次に良品と判断された電子部品は、第１図のように所
定位置までセンタリングテーブル14が移送を行い実装機
本体のノズル２を有したヘッド部１が供給された電子部
品の上に移動して電子部品を吸着し（この位置を“第２
位置”と呼ぶ）、吸着されている姿勢を認識部３により
認識してプリント基板４に実装を行うのである。Next, the electronic component determined to be non-defective is moved by the centering table 14 to a predetermined position as shown in FIG. 1 and is moved onto the supplied electronic component by the head unit 1 having the nozzle 2 of the mounting machine body. To pick up the electronic component (this position is
The position is referred to as “position”), and the adsorbed posture is recognized by the recognition unit 3 and mounted on the printed circuit board 4.
またセンタリングテーブル14で移送中にリード検出の
結果、第５図ｂのように不良と判断された場合、センタ
リングテーブル14は、供給装置側に戻り、リフター部11
は戻すべきトレイをトレイプレート引き出し部12の高さ
に位置決めし、そのトレイをトレイプレート引き出し部
12が引き出し、移載部13がセンタリングテーブル14から
元のトレイに移載を行い、結局、不良部品は、元のトレ
イに戻すことが可能となる。When the lead is detected during the transfer by the centering table 14 as shown in FIG. 5b, the centering table 14 returns to the supply device side and the lifter 11
Position the tray to be returned at the height of the tray plate drawer 12, and place that tray in the tray plate drawer.
12 is pulled out, the transfer unit 13 transfers the original from the centering table 14 to the original tray, and eventually, the defective component can be returned to the original tray.
発明の効果 以上本発明により、電子部品を供給するために移送時
間内に、電子部品のリードとプリント基板の装着面との
密着性の良否を予め検知することが可能となり、実装時
間のロスタイムを最小に押さえることが可能となった。
また光の透過によりリードの影を撮影しているので、照
明へ影響などを受けにくく安定した検査ができるように
なった。Effect of the Invention According to the present invention described above, it is possible to detect in advance whether or not the adhesion between the lead of the electronic component and the mounting surface of the printed circuit board is good in the transfer time for supplying the electronic component, and to reduce the loss time of the mounting time. It has become possible to minimize it.
In addition, since the shadow of the lead is photographed by transmitting light, it is possible to perform a stable inspection without being affected by illumination.
そして、トレイプレート部、マガジン部、リフター部
の構成により機種切替性の大幅向上、トレイ多品種への
対応、リード検出後の不良部品を元のトレイに戻す事が
可能となった。The configuration of the tray plate, the magazine, and the lifter makes it possible to greatly improve the switchability of the model, to cope with various types of trays, and to return defective components after lead detection to the original tray.
第１図は、本発明の一実施例における電子部品供給装置
と電子部品装着機の斜視図、第２図は、本発明の一実施
例における電子部品供給装置のうち電子部品を収納した
トレイをマガジン部に収納する手順を示した略図、第３
図は本発明の一実施例における電子部品供給装置の斜視
図、第４図a,bは電子部品のリード検出を行う一実施例
の光学系配置図、第５図a,bは電子部品のリード検出を
行った際のCCDカメラのとらえた像を示した図、第６図
は従来の電子部品装着装置の簡略斜視図、第７図は従来
の電子部品装着装置の電子部品リード検出の方式を示し
た正面図、第８図は従来の電子部品装着装置の電子部品
供給部を示した斜視図である。 ５……電子部品供給装置、６……トレイプレート部、７
……トレイ固定レバー部、８……マガジン、９……トレ
イ、10……電子部品、11……リフター部、12……トレイ
プレート引き出し部、13……移載部、14……センタリン
グテーブル部。FIG. 1 is a perspective view of an electronic component supply device and an electronic component mounting machine according to one embodiment of the present invention, and FIG. 2 is a diagram illustrating a tray containing electronic components of the electronic component supply device according to one embodiment of the present invention. Schematic diagram showing the procedure for storing in the magazine, third
FIG. 4 is a perspective view of an electronic component supply device according to an embodiment of the present invention, FIGS. 4a and 4b are optical system layout diagrams of an embodiment for detecting lead of the electronic component, and FIGS. FIG. 6 is a diagram showing an image captured by a CCD camera when lead detection is performed, FIG. 6 is a simplified perspective view of a conventional electronic component mounting apparatus, and FIG. 7 is an electronic component lead detection method of the conventional electronic component mounting apparatus. FIG. 8 is a perspective view showing an electronic component supply unit of a conventional electronic component mounting apparatus. 5 ... electronic component supply device, 6 ... tray plate section, 7
...... Tray fixing lever part, 8 ... Magazine, 9 ... Tray, 10 ... Electronic parts, 11 ... Lifter part, 12 ... Tray plate drawer part, 13 ... Transfer part, 14 ... Centering table part .
───────────────────────────────────────────────────── フロントページの続き (72)発明者 平井 弥 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平１−297541（ＪＰ，Ａ) 特開 平２−34996（ＪＰ，Ａ) 実開 平２−15285（ＪＰ，Ｕ) 実開 昭62−23477（ＪＰ，Ｕ) 特公 昭62−13152（ＪＰ，Ｂ２) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 13/02,13/08────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasushi Hirai 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-1-297541 (JP, A) JP-A-2- 34996 (JP, A) Japanese Utility Model Hei 2-15285 (JP, U) Japanese Utility Model Sho 62-23477 (JP, U) Japanese Patent Publication No. Sho 62-13152 (JP, B2) (58) Field surveyed (Int. 6 , DB name) H05K 13 / 02,13 / 08
Claims (6)
た電子部品貯蔵部より所定の電子部品を取り出し、この
電子部品のリード状態を検出後、プリント基板の所定位
置にヘッド部により実装する電子部品実装方法におい
て、 前記電子部品貯蔵部より所定の電子部品を移載部にて取
り出し、第１位置より第２位置へ移動可能な電子部品供
給部に移載する第１工程と、前記第１工程終了後、前記
電子部品供給部を第２位置へ移動させるとともに、その
移動中に前記電子部品のリード状態を検出する第２工程
と、前記第２位置にある前記電子部品供給部よりヘッド
部にて前記電子部品を吸着し、プリント基板の所定位置
に実装する第３工程とからなることを特徴とする電子部
品実装方法。An electronic component mounted in a predetermined position on a printed circuit board after a predetermined electronic component is taken out from an electronic component storage section in which a plurality of electronic components having leads are stored, and the lead state of the electronic component is detected. In the component mounting method, a first step of taking out a predetermined electronic component from the electronic component storage unit by a transfer unit and transferring the electronic component to an electronic component supply unit movable from a first position to a second position; After the step, the electronic component supply unit is moved to the second position, and a lead state of the electronic component is detected during the movement, and a head unit is moved from the electronic component supply unit at the second position. A third step of adsorbing the electronic component and mounting the electronic component at a predetermined position on a printed circuit board.
た電子部品貯蔵部と、前記電子部品貯蔵部より所定の電
子部品を取り出す移載部と、前記移載部により取り出さ
れた電子部品を第１位置で受け取り第２位置へ移送可能
で、かつこの移送中に、この電子部品のリード状態を検
出可能な電子部品供給部と、前記電子部品供給部より前
記第２位置に移送された電子部品を吸着し、プリント基
板の所定位置に実装可能なヘッド部とからなることを特
徴とする電子部品実装装置。2. An electronic component storage section in which a plurality of electronic components each having a lead are stored, a transfer section for extracting a predetermined electronic component from the electronic component storage section, and an electronic component extracted by the transfer section. An electronic component supply unit capable of receiving the first position and transferring the electronic component to the second position, and detecting a lead state of the electronic component during the transfer; and an electronic component transferred from the electronic component supply unit to the second position. An electronic component mounting apparatus, comprising: a head portion that sucks a component and can be mounted at a predetermined position on a printed circuit board.
レイプレート部と、前記トレイを固定したトレイプレー
ト部を複数収納して鉛直方向に移動可能なリフター部
と、所定の位置にあるトレイプレート部をリフター部よ
り取り出すトレイプレート引き出し部と、前記トレイプ
レート引き出し部により取り出されたトレイから所定の
電子部品を取り出す移載部と、前記移載部により取り出
された電子部品を受け取り第１位置から第２位置へ移送
しながら電子部品のリード状態を検出可能に設けられた
電子部品供給部とからなることを特徴とする電子部品供
給装置。3. A tray plate portion capable of fixing a tray containing electronic components, a lifter portion containing a plurality of tray plate portions fixing said tray and movable vertically, and a tray plate at a predetermined position. A tray plate drawer for taking out a part from the lifter part, a transfer part for taking out a predetermined electronic component from the tray taken out by the tray plate drawer, and an electronic component taken out by the transfer part for receiving from the first position. An electronic component supply unit provided to detect a lead state of the electronic component while being transferred to the second position.
子部品を収納されていた元のトレイに戻すよう構成され
たことを特徴とする特許請求の範囲第３項記載の電子部
品供給装置。4. The electronic component supply device according to claim 3, wherein the defective electronic component detected by the electronic component supply section is returned to the original tray in which the defective electronic component was stored.
ジン部を設け、そのマガジン部をリフター部に複数個着
脱可能に構成したことを特徴とする特許請求の範囲第３
項記載の電子部品供給装置。5. The system according to claim 3, wherein a magazine portion capable of accommodating a plurality of tray plate portions is provided, and the plurality of magazine portions are configured to be detachable from the lifter portion.
Electronic component supply device according to the item.
なようトレイを一方向に付勢したトレイ固定レバー部を
有することを特徴とする特許請求の範囲第３項記載の電
子部品供給装置。6. The electronic component supply device according to claim 3, wherein the tray plate has a tray fixing lever that urges the tray in one direction so that the tray can be attached and detached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1008214A JP2853136B2 (en) | 1989-01-17 | 1989-01-17 | Electronic component mounting method, electronic component mounting device, and electronic component supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1008214A JP2853136B2 (en) | 1989-01-17 | 1989-01-17 | Electronic component mounting method, electronic component mounting device, and electronic component supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02189000A JPH02189000A (en) | 1990-07-25 |
| JP2853136B2 true JP2853136B2 (en) | 1999-02-03 |
Family
ID=11686978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1008214A Expired - Fee Related JP2853136B2 (en) | 1989-01-17 | 1989-01-17 | Electronic component mounting method, electronic component mounting device, and electronic component supply device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2853136B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2858084B2 (en) * | 1994-09-29 | 1999-02-17 | 鹿島建設株式会社 | Greening equipment for temporary enclosures, etc. |
| JPH10293158A (en) | 1997-04-18 | 1998-11-04 | Advantest Corp | Ic testing device |
| KR100562409B1 (en) * | 1998-12-31 | 2006-06-21 | 삼성테크윈 주식회사 | Method and apparatus for testing lead state of surface mounted device |
| KR100437967B1 (en) * | 2001-06-22 | 2004-06-26 | 미래산업 주식회사 | Stacker for Tray Feeder |
| KR100395549B1 (en) * | 2001-06-22 | 2003-08-25 | 미래산업 주식회사 | Switching System for Tray Feeder |
| US20090088888A1 (en) * | 2005-08-22 | 2009-04-02 | Takeyuki Kawase | Component mounting method |
| CN104609169A (en) * | 2015-02-04 | 2015-05-13 | 吴中经济技术开发区越溪斯特拉机械厂 | Feeding and discharging mechanism of ignition needle production equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0718544Y2 (en) * | 1988-07-05 | 1995-05-01 | 日本電気株式会社 | Suction device for positioning system |
-
1989
- 1989-01-17 JP JP1008214A patent/JP2853136B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02189000A (en) | 1990-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7089656B2 (en) | Electric parts mounting apparatus | |
| TW503686B (en) | Apparatus and method for correcting holding position of component | |
| JP6309830B2 (en) | Component mounting device | |
| JP2824378B2 (en) | Electronic component mounting device | |
| JP6666915B2 (en) | Component mounting machine | |
| JPH07105637B2 (en) | Parts mounting device | |
| JP2015090925A (en) | Electronic component mounting device | |
| JP2853136B2 (en) | Electronic component mounting method, electronic component mounting device, and electronic component supply device | |
| JPH05198994A (en) | Method and device for mounting part | |
| JP3774906B2 (en) | Electronic component mounting machine and electronic component mounting method | |
| JP3823719B2 (en) | Electronic component mounting apparatus and electronic component mounting method | |
| JPH11330799A (en) | Component mounting unit | |
| JP7168788B2 (en) | Suction nozzle inspection device and suction nozzle inspection method | |
| JP3064781B2 (en) | Electronic component holding device | |
| JPH11285925A (en) | Part mounting device | |
| JP2000097670A (en) | Visual inspection system for printed board | |
| JP2003092495A (en) | Electronic component mounting device and method therefor | |
| JPH09326591A (en) | Electronic part mounting device and method | |
| JP2005127836A (en) | Part recognition method, part recognizing device, surface mounting machine, part testing device, and substrate inspecting device | |
| JP2792193B2 (en) | Electronic component recognition method | |
| JP6857767B2 (en) | How to replace the picking device for scattered parts and the part holder | |
| JP2951182B2 (en) | Electronic component moving device | |
| JPH03293800A (en) | Method and device for mounting electronic part | |
| JP7295966B2 (en) | Holder management device and display method | |
| KR100262895B1 (en) | Method and apparatus for exchanging nozzle for surface mounter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071120 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081120 Year of fee payment: 10 |
|
| LAPS | Cancellation because of no payment of annual fees |