JPH02189000A - Method and apparatus for supply of electronic component - Google Patents

Abstract

PURPOSE:To suppress the loss time of a mounting time to a minimum by detecting the leads of an electronic component on the way of feeding to supply the electronic component and positioning it. CONSTITUTION:A tray 9 containing a flat pack type electronic component 10 is fixed to a tray plate 6, and contained in a magazine 8. The plurality of magazines 8 are placed on a lifter 11, vertically moved up and down, and the tray to be selected is pulled by a tray plate drawer. Here, a moving unit having an electronic component suction nozzle 13a sucks the electronic component and transfers it to a centering table 14. When it is moved to a mounting machine side with the table 14, the electronic component is positioned on the way, and leads are simultaneously detected. An optical component is mounted on the table 14, a light emitted from a semiconductor laser 15 is bent at a sealer 16, and converted to a parallel beam by a spherical lens 17, then emitted to the lead of the electronic component, and its shade is photographed by a CCD camera 19. Here, the electronic component which is judged as a satisfactory component is fed to a mounting machine body, and an improper component is returned to the original tray.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component supply method and apparatus for supplying electronic components stored in a tray to an electronic component mounting machine.

2. Description of the Related Art Conventionally, the mounting process in which a flat pack type electronic component is taken out from a tray and mounted on a printed circuit board has been as shown in FIG.

That is, the nozzle 101 transfers the electronic component 102 to the tray 1.
Camera 104a taken out from 03 and placed in a predetermined position
, 104b, with the electronic component 102 being sucked,
Moving cameras 104a and 104b are used to judge the height of the lead tips of electronic components from the lateral direction to determine whether the electronic components are good or bad, and only those that are judged to be good are removed from the printed circuit board 105.
It is to be installed on. FIG. 8 shows the camera 104
a.

104b is a side view of the state in which the electronic component 102 is captured. FIG.

Furthermore, in the conventional device for supplying electronic components stored in a tray, as shown in FIG. The nozzle 107 of the head 106 attracts the electronic component 108 and attaches it to a predetermined position on the printed circuit board 109.

Problems to be Solved by the Invention However, with the above structure, when determining the quality of electronic components, the nozzle moves to the camera position while adsorbing the electronic component and stops there, resulting in a large loss of time. In addition, because the image is taken using the reflection from the tip, the measured value may be unstable depending on the lighting, and because the electronic components are not positioned, it is difficult to measure unless the lead end of the electronic component and the camera are parallel. Sing.

On the other hand, as a parts supply method, it takes a lot of time when changing models when the tray dimensions and thickness are changed, and
There is also a limit to the number of tray types.

Additionally, because the trays are stacked, electronic components determined to be defective cannot be returned to their original trays.

The present invention solves the above problems and detects leads of electronic components without loss time. On the other hand, it is an object to provide an electronic component feeding method and device that has excellent model changeability, can handle a wide variety of trays, and is capable of returning defective electronic components to their original trays.

Means for Solving the Problems In order to solve the above problem, that is, to stably detect the leads of electronic components without loss time, the electronic component supply method is to This method has a configuration that allows lead detection and positioning.

The electronic component supply device is a centering device that is capable of transporting electronic components from a predetermined position in the supply device to a predetermined position in the mounter, has a drive that allows positioning of electronic components, and has a function that allows detection of electronic component leads during transfer. This is a device that has a table part.

On the other hand, as an electronic component supply device that can switch between models and handle a wide variety of trays, there is a tray plate section that has a part of a tray fixing lever that biases the tray in one direction so that the tray can be attached and detached. It has a magazine section that can accommodate a plurality of tray plate sections, and has a structure that allows the plurality of magazine sections to be attached to and detached from the lifter section.

Function: Due to the method and device having the above configuration, lead detection of electronic components is performed during the transfer of electronic components from the electronic component supply device to the mounting machine, so loss time is minimized, and lead detection is also performed by shining light on the leads. Detection is also stable because the shadow of the lead is detected in the transmitted light rather than the reflected light.

On the other hand, by having a part of the tray fixing lever in the tray plate part, it is possible to handle a wide variety of trays, and even if the tray dimensions and thickness change, the time for changing models is kept to a minimum, and electronic parts can be refilled. can also be done in a short period of time. Since the magazine section that stores the tray plate section is removable, multiple trays can be exchanged at the same time.In addition, since there is a lifter section and you can freely select the tray, it is possible to remove the tray that is determined to be defective. Electronic components can also be stored in the original tray.

EXAMPLE Below, an electronic component supply apparatus will be described as an example of the present invention.

FIG. 1 is a perspective view of an electronic component supply device and an electronic component mounting machine. 1 is a head section, 2 is a vertically movable and rotatable nozzle, 3 is a recognition section for recognizing electronic components, 4 is a printed circuit board, and 5 is an electronic component supply device. In FIG. 2, 6 is a tray plate part, 7 is a part of a tray fixing lever, 8 is a magazine, 9 is a tray, and 10 is an electronic component. In FIG. 3, 11 is a lifter part that moves the magazine 8 up and down;
Reference numeral 2 denotes a tray plate drawer part that pulls out the tray plate part 6 in a predetermined position, 13 a transfer part that transfers the electronic components in the tray, and 14 a transfer part that transfers the transferred electronic components to the mounting machine main body side, and in the middle of the process. This is the centering table section that detects leads of electronic components. In FIG. 4a, 15 is a semiconductor laser as an illumination light source, 16 is a Schiller laser 17
is a spherical lens, 18 is a cylindrical lens, 19 is C
It's a CD camera. Four systems of this configuration are installed as shown in FIG. 4 to detect the leads of the electronic component 10.

Next, the operation of this configuration will be explained. First, the tray 9 containing the flat pack type electronic component 10 is fixed to the tray plate 6. At this time, the operator only has to move the tray fixing lever 7 in the direction of the arrow, place the tray, and return the lever to its original position. Then, the tray plate 6 containing the tray 9 is placed into the magazine 8. A plurality of magazines 8 containing trays are mounted and fixed on the lifter part 11. The lifter section 11 moves up and down to stop the selected tray at a predetermined height where the tray plate pull-out section is installed. The tray plate drawer pulls out a predetermined tray and positions it.

A transfer section 13a having an electronic component easy suction nozzle moves to above the electronic component, and the suction nozzle 13a descends to suction the electronic component and transfer it to the centering table 14. The centering table 14 containing the electronic components is then moved to the mounting machine.
Electronic components are positioned along the way and leads are detected at the same time. Inside the centering table 14, optical components are installed as shown in FIG. After that, the shadow of the lead portion is photographed by the CCD camera 19. The photographed image is shown in FIG.

A in FIG. 5 is an upper limit value at which a defect will occur if the lead is further away from the mounting surface of the printed circuit board, and B is the distance from the mounting surface of the lead in the shadow actually photographed. In FIG. 5a, the electronic component is determined to be good by BAA, and in FIG. 5A, it is determined that the electronic component is defective since A<B.

Next, the electronic components determined to be good are transferred by the centering table 14 to a predetermined position as shown in FIG. The device picks up the electronic component, uses the recognition unit 3 to recognize the posture of the picked-up electronic component, and mounts it on the printed circuit board 4.

Furthermore, if the centering table 14 detects a lead during transfer and determines that the tray is defective as shown in FIG. 12
The tray is positioned at a height of becomes.

Effects of the Invention According to the present invention, it is possible to detect in advance whether or not the adhesion between the lead of the electronic component and the mounting surface of the printed circuit board is good or not during the transportation time for supplying the electronic component, thereby reducing the loss of mounting time. It became possible to keep it to a minimum. Additionally, since the shadow of the lead is photographed through the transmission of light, stable inspections can now be performed without being affected by lighting.

Furthermore, the configuration of the tray plate section, magazine section, and lifter section greatly improves model changeability, supports a wide variety of tray types, and makes it possible to return defective parts to the original tray after lead detection.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an electronic component supply device and an electronic component mounting machine according to an embodiment of the present invention, and FIG. 2 is a perspective view of a tray containing electronic components in the electronic component supply device according to an embodiment of the present invention. Schematic diagram showing the procedure for storing in the magazine section, No. 3
The figure is a perspective view of an electronic component supply device according to an embodiment of the present invention, FIGS. 4a and 4b are optical system layout diagrams of an embodiment for detecting electronic component leads, and FIGS. A diagram showing the image captured by the CCD camera when lead detection was performed,
FIG. 6 is a sectional view showing the structure of an embodiment that positions electronic components before detecting electronic component leads, FIG. 7 is a simplified perspective view of a conventional electronic component mounting device, and FIG. 8 is a conventional electronic component mounting device. FIG. 9 is a front view showing a method of detecting an electronic component lead in the conventional electronic component mounting apparatus, and FIG. 9 is a perspective view showing an electronic component supply section of the conventional electronic component mounting apparatus. 5...Electronic component supply device, 6...Tray plate section, 7...Part of tray fixing lever, 8
... ; ... Magazine, 9 ... Tray, 10.
...Electronic parts, 11...Lifter part, 1
2... Tray plate drawer section, 13...
... Transfer section, 14... Centering table section. Name of agent: Patent attorney Shigetaka Awano and 1 other person (aI) Ha〈6 eRai 20υ-4 Gensei 2b, tfb --- Ri Do 22-・1) Prayer item! 5-JJ3 nozzle 24-・-Lee ￥′ Extrusion ↓ 2E-L bar'-A 28-・・・Lever-C 2'1---7y4 Floor χ floor 3tJ---'s 7° lick 0 No. Figure diagram

Claims (8)

[Claims] (1) A method in which a flat-pack type electronic component is taken out and supplied to a predetermined position in which leads are attached to a printed circuit board, and while the electronic component is being supplied and moved to a predetermined position, the leads of the electronic component and the printed circuit board are An electronic component supply method that detects leads so that it is possible to detect in advance whether the adhesion to the mounting surface is good or bad. (2) The electronic component supply method according to claim 1, characterized in that the electronic component is positioned while the electronic component is being moved to a predetermined position, and the lead is detected at the same time. (3) A component storage section that stores a plurality of flat pack type electronic components whose leads are attached to a printed circuit board, a component transfer section that takes out a predetermined electronic component from this component storage section, and a component transfer section that takes out a specified electronic component from the component storage section; a component supply unit that is capable of transporting the electronic component to a predetermined position, and that is capable of detecting the lead during the transportation so as to previously detect whether or not the adhesion between the lead of the electronic component and the mounting surface of the printed circuit board is good or bad; An electronic component supply device comprising: (4) The electronic component supply device according to claim 3, wherein the component supply section is provided to be capable of positioning the electronic component and detecting the lead. (5) a tray plate portion capable of fixing a tray storing electronic components; a lipter portion capable of storing a plurality of tray plate portions each having the tray fixed thereon and movable in the vertical direction;
A tray plate drawer section that takes out the tray plate section at a predetermined position from the lipter section, and a tray plate drawer section that sucks and holds electronic components from the tray and positions the electronic components while transferring them from the first position to the second position, and leads and prints the electronic components. An electronic component supply device characterized by comprising a centering table section provided to be able to detect leads so as to detect in advance whether the adhesion between the board and the mounting surface is good or bad. (6) The electronic component supply device according to claim 5, wherein the electronic component supply device is configured to return defective electronic components detected by the centering table portion to the original tray in which they were housed. (7) The electronic component supply according to claim 5, characterized in that a magazine section capable of storing a plurality of tray plate sections storing trays is provided, and a plurality of the magazine sections can be attached to and detached from a lifter section. Device. (8) The electronic component supply device according to claim 5, wherein the tray plate section has a tray fixing lever section that biases the tray in one direction so that the tray can be attached and detached.