JP3823719B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting electronic components on a substrate.
[0002]
[Prior art]
In an electronic component mounting apparatus that mounts an electronic component on a substrate, the electronic component stored in the supply unit is picked up by a transfer head, transferred onto the substrate, and mounted at a predetermined mounting point. As a method for picking up electronic components, a method of vacuum suction using a suction nozzle is widely used. The suction nozzle generally has a different type and size depending on the electronic component to be sucked, and is exchanged according to the electronic component to be sucked.
[0003]
By the way, when mounting an electronic component on a substrate, it is necessary to press the electronic component against the substrate with a predetermined pressing load (mounting load). Since the mounting load varies depending on the electronic component, generally, the transfer head is often in a floating state by elastically supporting the suction nozzle with a spring or the like instead of being fixedly supported. The elastic force is changed by adjusting the amount by which the transfer head is pushed down to adjust the mounting load at which the suction nozzle presses the electronic component.
[0004]
[Problems to be solved by the invention]
However, with the progress of miniaturization of electronic components and the appearance of light mounting load components with a small mounting load, it is impossible to adjust the mounting load by the above method. That is, in the transfer head having the above-described structure, a load obtained by applying an elastic force to the weight of the floating portion acts as a pressing load on the electronic component. Therefore, a mounting load smaller than the weight of the floating portion cannot be realized. For this reason, in the case of light load parts, it is necessary to use a mounting device having a dedicated transfer head instead of the transfer head having the conventional structure, and there is a problem that the equipment cannot be shared. It was.
[0005]
Accordingly, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of mounting an electronic component with a light mounting load.
[0006]
[Means for Solving the Problems]
The electronic component mounting apparatus according to claim 1, wherein the electronic component is vacuum-sucked and picked up by a suction nozzle that is detachably mounted on the mounting portion of the transfer head from the electronic component supply unit and mounted on the substrate. The type of the suction nozzle includes a light load nozzle for a light mounting load component having a small mounting load. The light load nozzle is disposed inside the hollow portion and the hollow portion. A suction part that can slide in the vertical direction between the upper limit position and the lower limit position inside the hollow part, and a suction hole that is attached to the lower end surface of the suction part and contacts the electronic component and is provided on the contact surface. A nozzle tip that sucks an electronic component by vacuum suction, a biasing means that is provided in the holding portion and presses the suction portion downward with a biasing force corresponding to the mounting load, and a suction hole of the nozzle tip Suck And a communicating means for communicating the suction holes connected to a vacuum suction source provided in the mounting head via a suction passage provided through the part, the lower limit position of the suction portion and the bottom surface of the holding portion It is a position where it abuts, and in a normal state, it is pressed against this bottom surface .
[0007]
The electronic component mounting apparatus according to claim 2 is the electronic component mounting apparatus according to claim 1, wherein a height regulating portion that regulates upward displacement of the suction portion at a predetermined position, and a height position of the suction portion. And a height position detecting means for detecting the height position of the suction nozzle in a state where the nozzle is regulated at a predetermined position.
[0010]
According to the present invention, a light-load nozzle for a light mounting load component with a small mounting load is provided with an adsorbing portion that comes into contact with and adsorbs an electronic component, and a holding portion that holds the adsorbing portion while allowing upward displacement. Providing a biasing means that is provided in the holding portion and presses the suction portion downward with a biasing force corresponding to the mounting load, lowers the transfer head and presses the electronic component against the biasing force, By disposing the suction portion upward and applying a predetermined mounting load to the electronic component, it is possible to mount an electronic component having a mounting load smaller than the weight of the suction nozzle.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an electronic circuit according to an embodiment of the present invention. 4 is a front view of the transfer head of the component mounting apparatus, FIG. 4 is a sectional view of the suction nozzle of the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 5 is an operation of the electronic component mounting apparatus according to the embodiment of the present invention. It is explanatory drawing.
[0012]
First, an electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a transport path 2 is arranged in the X direction at the center of a base 1. The conveyance path 2 is a positioning unit that conveys and positions the substrate 3. Component supply units 4 that supply electronic components are disposed on both sides of the conveyance path 2, and a large number of tape feeders 5 are arranged in parallel in each component supply unit 4. The tape feeder 5 stores electronic components held on the tape, and supplies the electronic components to the pickup position 5a by pitch-feeding the tape.
[0013]
A transfer head 7 is mounted on the X-axis table 6. The transfer head 7 includes a unit transfer head that can be moved up and down individually. The X-axis table 6 is constructed with two ends supported by two Y-axis tables 8A and 8B arranged in parallel. By driving the X-axis table 6 and the Y-axis tables 8A and 8B, the transfer head 7 moves horizontally. At this time, by attaching a suction nozzle for sucking an electronic component to each lower end portion of the unit transfer head, the transfer head 7 vacuum-sucks and picks up the electronic component from the pickup position 5a of the tape feeder 5, and the substrate is picked up. 3 is transferred.
[0014]
A nozzle holding unit 9, a recognition unit 10, and a paste supply unit 11 are disposed on the moving path of the transfer head between the conveyance path 2 and the component supply unit 4. The nozzle holding unit 9 stocks suction nozzles that are attached to the transfer head 7 and are used for suction holding electronic components. Here, depending on the size of the target electronic component and the load (mounting load) that presses the electronic component against the board during mounting, there are a number of heavy mounting load nozzles and light mounting load nozzles. The suction nozzle is held. Then, by allowing the transfer head 7 to access the nozzle holding unit 9, the suction nozzle mounted on each unit transfer head can be exchanged.
[0015]
The recognition unit 10 includes a line camera, and when the transfer head 7 picking up the electronic component from the component supply unit 4 passes upward, the electronic component held by the suction nozzle by the line camera is imaged from below. To do. Then, the recognition result of the imaging result is used to identify the electronic component and detect the position. The paste supply unit 11 stores a flux used for soldering electronic components, a paste for bonding electronic components, and the like in a rotary table-like container and supplies the paste coating film with a predetermined film pressure. By lowering the electronic component held by the transfer head 7 onto the paste coating film, the paste is applied to the lower surface of the electronic component.
[0016]
Next, the transfer head 7 will be described with reference to FIG. FIG. 3 shows a transfer head 7 A as a unit constituting the transfer head 7. The transfer head 7A is provided with a suction nozzle 20 that moves up and down by a Z-axis drive mechanism (not shown) and sucks an electronic component at the lower end. The transfer head 7 </ b> A has a configuration in which a mounting block 15 is coupled to the lower surface of the main body portion 12 via a shaft portion 13. In the mounting hole 15a provided in the mounting block 15, the suction nozzle 20 is detachably mounted by a holding mechanism using a holding force of an elastic body such as a spring.
[0017]
A spring 14 in the compression direction is mounted on the shaft portion 13, and when an upward load is applied to the suction nozzle 20, the mounting block 15 is displaced upward against the spring 14. An optical sensor 17 is attached to the bracket 16 extending laterally from the main body 12, and a detection dog 18 is attached to the attachment block 15 corresponding to the position of the optical sensor 17.
[0018]
When the mounting block 15 is displaced upward, the detection dog 18 is also moved upward and detected by the optical sensor 17 at a predetermined position. At this detection timing, the mounting block 15 at that timing is read by reading the detection value of the Z position detection means 19 that detects the vertical position based on the pulse of the encoder provided in the Z axis motor of the Z axis drive mechanism. It is possible to detect the position of the suction nozzle 20 attached to the height direction.
[0019]
Next, the suction nozzle 20 will be described with reference to FIG. The suction nozzle 20 is a light load nozzle for a light mounting load component with a small mounting load. When the target component is switched to the component, other types of suction nozzles such as a nozzle for a heavy mounting load component are used. And is mounted on the mounting block 15. In FIG. 4, the suction nozzle 20 has a structure in which a sliding portion 22 is slidably disposed in a vertical direction in a hollow holding portion 21 and a nozzle tip 24 is attached to a lower end portion of the sliding portion 22. Yes.
[0020]
The upper portion of the holding portion 21 is a tapered portion 21a that fits into a mounting hole 15a (FIG. 3) provided in the mounting block 15, and a suction path 21c is provided in the tapered portion 21a so as to penetrate vertically. . Below the taper portion 21a is a flange portion 21b protruding in a disk shape, and the lower surface of the flange portion 21b functions as a reflection surface that reflects illumination light from below when an electronic component is recognized.
[0021]
A sliding portion 22 is fitted in a hollow portion 21f provided inside the holding portion 21, and protrusions 22a and 22c are provided above and below the sliding portion 22, respectively. A hole 21d into which the protrusion 22a can be fitted is provided on the ceiling surface of the hollow part 21f, and the bottom part 21g of the hollow part 21f has an opening at the center, and the lower end of the sliding part 22 extends from this opening. Protrudes downward.
[0022]
The sliding body 22 slides in the vertical direction between the upper limit position where the upper surface of the protrusion 22a contacts the upper surface 21e of the hole 21d and the lower limit position where the sliding body 22 contacts the bottom surface 21g. It is possible. A spring 23 in the compression direction is attached to the protrusion 22a, and the spring 23 biases the sliding body 22 downward. Thereby, the sliding body 22 is in a state of being pressed against the bottom surface 21g in a normal state.
[0023]
A nozzle tip 24 provided with a suction hole 24 a is attached to the protrusion 22 c on the lower surface of the sliding portion 22. The suction hole 24a communicates with the suction passage 21c through a suction passage 22b provided vertically through the center of the sliding portion 22. Therefore, in a state where the suction nozzle 20 is attached to the unit transfer head 7A, the suction hole 24a communicates with a suction hole provided in the unit transfer head 7A. The suction hole is connected to a vacuum suction source (not shown), and vacuum suction is performed from the suction hole 24a by driving the vacuum suction source, so that the electronic component contacting the lower surface of the nozzle tip 24 is sucked and held.
[0024]
In other words, in the above configuration, the sliding portion 22 to which the nozzle tip 24 is attached constitutes a suction portion that contacts and holds the electronic component. The holding unit 21 holds the suction unit in a state where displacement in the vertical direction is allowed. When the electronic component is mounted, when the electronic component held on the lower surface of the nozzle tip 24 is pressed against the substrate, the spring 23 presses the sliding portion 22 downward with an urging force corresponding to the mounting load. Therefore, the spring 23 is a biasing means. The suction path 21c of the holding part 21 and the suction path 22b of the sliding part 22 serve as communication means for communicating the suction hole 24a with a suction hole provided in the unit transfer head 7A.
[0025]
Further, the projecting portion 22a and the hole portion 21d of the sliding portion 22 serve as a height regulating portion that regulates the upward displacement of the suction portion at a predetermined position corresponding to the upper limit position, and the optical sensor shown in FIG. 17, the detection dog 18 and the Z position detecting means 19 are height position detecting means for detecting the height position of the suction nozzle 20 in a state where the height position of the suction portion is regulated to a predetermined position.
[0026]
This electronic component mounting apparatus is configured as described above, and the operation will be described below. In the process of continuing the mounting operation in which a variety of electronic components are picked up by the transfer head 7 and mounted on the substrate 3 from the component supply unit 4, the transfer is performed when a light mounting load component with a small mounting load is targeted. The head 7 accesses the nozzle holding unit 9 and performs a tool change for exchanging the already mounted nozzle with the light load suction nozzle 20.
[0027]
Thereafter, the transfer head 7 moves to the component supply unit 4 and picks up an electronic component from the tape feeder 5. This pickup operation will be described with reference to FIG. 5A, the transfer head 7 is moved to the component supply unit 4, and one unit transfer head 7A is moved to the pickup position 5a of the tape feeder 5, that is, above the electronic component P held by the tape feeder 5. FIG. The aligned state is shown. At this time, the sliding portion 22 shown in FIG. 4 is urged downward by the spring 23, and the upper surface of the protrusion 22a and the upper surface of the hole 21d are in a state of maintaining a predetermined gap c.
[0028]
Next, when the unit transfer head 7A is lowered, the nozzle tip 24 comes into contact with the upper surface of the electronic component P as shown in FIG. When the unit transfer head 7A is further lowered in this state, the spring 23 (FIG. 4) is first compressed, and the protrusion 22a is gradually fitted into the hole 21d. When the unit transfer head 7A is further lowered from the state where the gap c shown in FIG. 5A becomes zero, the spring 14 is compressed. As a result, the optical sensor 17 starts to approach the detection dog 18 relatively.
[0029]
And as shown in FIG.5 (c), the lower surface of the nozzle tip 24 of the suction nozzle 20 is read by reading the detection value of the Z position detection means 19 (FIG. 3) in the timing when the optical sensor 17 detected the detection dog 18. FIG. , That is, the height position of the upper surface of the electronic component P is detected as a distance H from a specific height reference line provided in the mounting apparatus.
[0030]
Thereafter, the electronic component P is vacuum-sucked by the suction nozzle 20 by vacuum suction from the suction hole 24a. Next, the transfer head 7 holding the electronic component P sequentially moves to the recognition unit 10 and the paste supply unit 11 to recognize the electronic component P and apply the paste to the lower surface of the electronic component P. Thereafter, the transfer head 7 moves onto the substrate 3 and descends with respect to the substrate 3 to mount the electronic component P held by the suction nozzle 20 on the substrate 3.
[0031]
In this mounting operation, the unit transfer head 7A is lowered until the spring 23 built in the suction nozzle 20 is compressed by a predetermined compression amount, and the urging force of the spring 23 is moved inside the suction nozzle 20 by the sliding portion 22. Displace upwards against Thereby, a pressing force (mounting load) corresponding to the compression amount acts on the electronic component P.
[0032]
Thus, even when it is necessary to set a mounting load smaller than the weight of the suction nozzle 20 as a whole, a wide range of mounting loads can be set by appropriately selecting the spring 23. Therefore, by using the transfer head 7 having the same configuration and simply performing a tool change of the suction nozzle 20, it is possible to mount various types of electronic components with greatly different mounting loads.
[0033]
【The invention's effect】
According to the present invention, a light-load nozzle for a light mounting load component with a small mounting load is provided with an adsorbing portion that comes into contact with and adsorbs an electronic component, and a holding portion that holds the adsorbing portion while allowing upward displacement. Providing a biasing means that is provided in the holding portion and presses the suction portion downward with a biasing force corresponding to the mounting load, lowers the transfer head and presses the electronic component against the biasing force, Since the suction portion is displaced upward and a predetermined mounting load is applied to the electronic component, an electronic component having a mounting load smaller than the weight of the suction nozzle can be targeted.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is a front view of a transfer head of an electronic component mounting apparatus. FIG. 4 is a cross-sectional view of a suction nozzle of an electronic component mounting apparatus according to an embodiment of the present invention. Operation explanation diagram [Explanation of symbols]
3 Substrate 4 Component supply unit 7 Transfer head 17 Optical sensor 19 Z position detection means 20 Suction nozzle 21 Holding unit 22 Sliding unit 23 Spring 24a Suction hole

Claims (2)

An electronic component mounting apparatus that vacuum-sucks and picks up an electronic component by a suction nozzle that is detachably mounted on the mounting portion of the transfer head from the electronic component supply unit, and mounts it on a substrate. A light load nozzle for light mounting load components with a small mounting load is included.The light load nozzle is disposed inside the hollow portion and has an upper limit position and a lower limit position inside the hollow portion. A suction part that is slidable in the vertical direction, and a nozzle that is attached to the lower end surface of the suction part, contacts the electronic component, and sucks the electronic component by vacuum suction from the suction hole provided in the contact surface A tip, a biasing means provided in the holding portion and pressing the suction portion downward with a biasing force corresponding to the mounting load, and a suction path provided in the suction hole of the nozzle tip through the suction portion Through Te and a communicating means for communicating the suction holes connected to a vacuum suction source provided in the transfer head, the lower limit position of the suction unit is a position that abuts the bottom surface of the holding portion, in the normal state on this bottom An electronic component mounting apparatus, wherein the electronic component mounting apparatus is in a pressed state . A height restricting portion for restricting the upward displacement of the suction portion at a predetermined position; and a height position detecting means for detecting a height position of the suction nozzle in a state where the height position of the suction portion is restricted to the predetermined position; The electronic component mounting apparatus according to claim 1, further comprising:

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