CN116322018A - Impact-resistant suction nozzle structure of chip mounter and using method - Google Patents
Impact-resistant suction nozzle structure of chip mounter and using method Download PDFInfo
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- CN116322018A CN116322018A CN202310443991.XA CN202310443991A CN116322018A CN 116322018 A CN116322018 A CN 116322018A CN 202310443991 A CN202310443991 A CN 202310443991A CN 116322018 A CN116322018 A CN 116322018A
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- suction nozzle
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- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000007789 sealing Methods 0.000 claims description 30
- 238000009434 installation Methods 0.000 claims description 6
- 238000003780 insertion Methods 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 3
- 230000035939 shock Effects 0.000 claims 2
- 230000003139 buffering effect Effects 0.000 abstract description 7
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention provides an anti-impact suction nozzle structure of a chip mounter and a use method thereof, wherein the anti-impact suction nozzle structure comprises an anti-impact assembly, a suction head, two fixing rods, a spring, a connecting sleeve, a groove, a mounting seat, a contact switch and a suction nozzle head; the buffer pad is adhered to the lower surface of the suction head, and the groove is formed in the lower surface of the suction nozzle head. When the chip mounter is used for sucking components, the buffer cushion is in contact with the components, the buffer cushion can play a role in preliminary buffering, the buffer cushion pushes the suction head, the suction head pushes the connecting sleeve to slide in the groove and squeeze the spring, the spring can play a role in secondary buffering through deformation of the spring and displacement of the connecting sleeve, meanwhile, the fixed rod triggers the contact switch, the contact switch sends signals to the control system of the chip mounter, and at the moment, the suction nozzle head stops moving downwards and sucks the components, so that the components and the PCB are prevented from being damaged due to impact.
Description
Technical Field
The invention relates to a suction nozzle structure and a use method thereof, in particular to an anti-impact suction nozzle structure of a chip mounter and a use method thereof, and belongs to the technical field of suction nozzles of chip mounters.
Background
The surface mount machine is also called a "mounting machine", and in a production line, the surface mount machine is arranged behind a dispensing machine or a screen printer, and is a device for accurately placing surface mount components on a PCB (printed circuit board) bonding pad by moving a mounting head. The suction nozzle of the chip mounter is used for sucking and placing workpieces of SMT components as the name implies, and the suction nozzle of the chip mounter in the market is various in variety and material. In the existing surface mounting process, the chip mounter sucks various components from a component tray belt or tray through a suction nozzle at the tail end of a mounting head and brings the components to the correct position of a printed circuit board to be mounted.
The current chip mounter suction nozzle is in the in-process of using, absorb the components and parts through the mode of negative pressure, therefore the chip mounter need be close to and with the components and parts contact through drive mechanism control suction nozzle, nevertheless current chip mounter suction nozzle can receive certain impact when contacting and absorbing components and parts, in the in-process of mounting, when the chip mounter suction nozzle is carried the component on the PCB board, also can receive certain impact, and then can lead to the chip mounter suction nozzle to damage easily, can cause the component to collide the PCB board simultaneously, cause components and PCB board to damage, and current chip mounter suction nozzle is more troublesome when changing moreover, can waste more time when installing the suction nozzle of different specifications, influence production efficiency, for this reason, a chip mounter suction nozzle structure and a method of use of anti-impact are provided.
Disclosure of Invention
In view of the above, the present invention provides an anti-impact suction nozzle structure of a chip mounter and a use method thereof, so as to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial choice.
The technical scheme of the embodiment of the invention is realized as follows: the suction nozzle structure of the impact-resistant chip mounter comprises an impact-resistant component, wherein the impact-resistant component comprises a buffer pad, a suction head, two fixing rods, a spring, a connecting sleeve, a groove, a mounting seat, a contact switch and a suction nozzle head;
the buffer pad is adhered to the lower surface of the suction head, the groove is formed in the lower surface of the suction head, the connecting sleeve is fixedly connected to the upper surface of the suction head, the spring is positioned in the groove, the contact switch is fixedly connected to the outer side wall of the suction head through the mounting seat, and the two fixing rods are symmetrically and fixedly connected to the outer side wall of the suction head;
the mounting assembly is mounted on the outer side wall of the suction nozzle head and comprises two fixing blocks, an inserting block, a tension spring, an inserting rod, two inserting grooves, a mounting sleeve and an inserting hole;
the two fixing blocks are symmetrically and fixedly connected to the outer side wall of the suction nozzle head, the tension springs are sleeved on the outer side wall of the inserting rod, the two inserting grooves are symmetrically formed in the lower surface of the mounting sleeve, and the inserting holes are formed in the inserting blocks.
Further preferably, the insert block is fixedly connected to the upper surface of the fixing block, the suction nozzle head is slidably connected to the inner side wall of the mounting sleeve, and the connecting sleeve is slidably connected to the inner side wall of the groove.
Further preferably, the fixing rod corresponds to the contact switch in position, the top end of the spring is fixedly connected to the inner top wall of the groove, and the bottom end of the spring is fixedly connected to the upper surface of the connecting sleeve.
Further preferably, the upper surface of the fixing block is attached to the lower surface of the mounting sleeve, the insert block is slidably connected to the inner side wall of the slot, the insert rod is slidably connected to the inner side wall of the jack, and one side, away from the suction nozzle head, of the top of the insert block is an inclined plane.
Further preferably, one end of the inserting rod far away from the jack is located outside the installation sleeve and is in sliding connection with the installation sleeve, and one end of the inserting rod far away from the jack is fixedly connected with a pull block.
Further preferably, one end of the tension spring is fixedly connected to the outer side wall of the mounting sleeve, and the other end of the tension spring is fixedly connected to one side, close to the inserted link, of the pull block.
Further preferably, a sealing component is arranged on the outer side wall of the suction nozzle head, and the sealing component comprises a sealing ring, a connecting flange and a sealing groove;
the sealing rings are embedded in the outer side wall of the suction nozzle head at equal intervals, and the sealing grooves are arranged in the inner side wall of the mounting sleeve at equal intervals.
Further preferably, the sealing ring is attached to the inner side wall of the sealing groove, and the connecting flange is fixedly connected to the upper surface of the mounting sleeve.
In addition, the invention also provides a using method of the anti-impact suction nozzle structure of the chip mounter, which comprises the following steps:
step one: the mounting sleeve is fixedly connected with a power mechanism of the chip mounter through a connecting flange, and is communicated with a negative pressure mechanism of the chip mounter;
step two: aligning the suction nozzle head with the mounting sleeve, aligning the plug block with the slot, and pressing the suction nozzle head into the mounting sleeve;
step three: pushing the inserting block to enable the inserting rod to move in a direction away from the suction nozzle head, and when the inserting hole moves to correspond to the position of the inserting rod, the inserting rod is pulled by the tension spring to be inserted into the inserting hole;
step four: when the inserted link is inserted into the jack, the sealing ring moves into the sealing groove;
step five: when the patch is started, negative pressure is formed in the suction nozzle head, the suction nozzle head is driven by the power structure of the patch to be close to the component, and the suction nozzle head is contacted with the component through the buffer pad;
step six: when the buffer cushion contacts with the components, the suction head pushes the connecting sleeve to slide upwards in the groove, and the spring is stressed and compressed at the moment;
step seven: the suction head drives the fixed rod to move upwards to contact with the contact switch, the contact switch sends a signal to the chip mounter control system, and the chip mounter controls the suction head to stop moving downwards;
step eight: the suction head adsorbs components and parts, and the power mechanism of the surface mount device controls the suction head to move and mount the components and parts.
Further preferably, in the seventh step, a signal output end of the contact switch is communicated with a control system of the chip mounter.
By adopting the technical scheme, the embodiment of the invention has the following advantages:
1. when the suction nozzle head is used for sucking components, the suction nozzle head moves downwards, the buffer cushion is contacted with the components, the buffer cushion can play a role in preliminary buffering, the buffer cushion pushes the suction head, the suction head pushes the connecting sleeve to slide in the groove and squeeze the spring, the buffer is played again through deformation of the spring and displacement of the connecting sleeve, meanwhile, the fixed rod triggers the contact switch, the contact switch sends signals to the control system of the chip mounter, and at the moment, the suction nozzle head stops moving downwards and sucks the components, so that the components and the PCB are prevented from being damaged due to impact;
2. when the suction nozzle head is installed, the suction nozzle head drives the fixed block and the insert block, so that the insert block is inserted into the slot, the inclined surface of the insert block pushes the insert rod to be far away from the suction nozzle head, when the insert hole moves to correspond to the position of the insert rod, the insert rod is inserted into the insert hole under the pulling of the tension spring, the position of the insert block can be limited through the insert rod, the position of the suction nozzle head can be limited through the insert block, the suction nozzle head is installed in a clamping mode, and the installation is convenient and quick, and the production efficiency is improved.
The foregoing summary is for the purpose of the specification only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become apparent by reference to the drawings and the following detailed description.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a block diagram of the present invention;
FIG. 2 is a block diagram of a nozzle head according to the present invention;
FIG. 3 is a schematic view of a mounting sleeve according to the present invention;
FIG. 4 is a schematic diagram showing the connection of the connecting sleeve and the nozzle head of the present invention;
FIG. 5 is a schematic view showing the connection of the connecting sleeve and the suction head.
Reference numerals: 101. an impact assembly; 11. a cushion pad; 12. a suction head; 13. a fixed rod; 14. a spring; 15. connecting sleeves; 16. a groove; 17. a mounting base; 18. a contact switch; 19. a suction nozzle head; 301. a mounting assembly; 31. a fixed block; 32. inserting blocks; 33. a tension spring; 34. a rod; 35. a slot; 36. a mounting sleeve; 37. a jack; 38. pulling blocks; 401. a seal assembly; 41. a seal ring; 42. a connecting flange; 43. and (5) sealing the groove.
Detailed Description
Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1-5, the embodiment of the invention provides an anti-impact suction nozzle structure of a chip mounter, which comprises an anti-impact component 101, wherein the anti-impact component 101 comprises a buffer pad 11, a suction head 12, two fixing rods 13, a spring 14, a connecting sleeve 15, a groove 16, a mounting seat 17, a contact switch 18 and a suction nozzle head 19;
the buffer pad 11 is adhered to the lower surface of the suction head 12, the groove 16 is formed in the lower surface of the suction nozzle head 19, the connecting sleeve 15 is fixedly connected to the upper surface of the suction head 12, the spring 14 is positioned in the groove 16, the contact switch 18 is fixedly connected to the outer side wall of the suction nozzle head 19 through the mounting seat 17, and the two fixing rods 13 are symmetrically and fixedly connected to the outer side wall of the suction head 12;
the mounting assembly 301 is mounted on the outer side wall of the suction nozzle head 19, and the mounting assembly 301 comprises two fixing blocks 31, an inserting block 32, a tension spring 33, an inserting rod 34, two inserting grooves 35, a mounting sleeve 36 and an inserting hole 37;
the two fixing blocks 31 are symmetrically and fixedly connected to the outer side wall of the suction nozzle head 19, the tension springs 33 are sleeved on the outer side wall of the inserting rod 34, the two inserting grooves 35 are symmetrically formed in the lower surface of the mounting sleeve 36, and the inserting holes 37 are formed in the inserting blocks 32.
In one embodiment, the insert block 32 is fixedly connected to the upper surface of the fixed block 31, the suction nozzle head 19 is slidably connected to the inner side wall of the mounting sleeve 36, the connecting sleeve 15 is slidably connected to the inner side wall of the groove 16, the fixed rod 13 corresponds to the contact switch 18 in position, the top end of the spring 14 is fixedly connected to the inner top wall of the groove 16, the bottom end of the spring 14 is fixedly connected to the upper surface of the connecting sleeve 15, when the suction nozzle head 19 sucks a component, the suction nozzle head 19 moves downwards, the buffer pad 11 contacts the component, the buffer pad 11 can play a role of primary buffering, along with the downward movement of the suction nozzle head 19, the buffer pad 11 pushes the suction nozzle 12 to push the connecting sleeve 15 to slide in the groove 16 and squeeze the spring 14, the deformation of the spring 14 and the displacement of the connecting sleeve 15 can play a role of secondary buffering, meanwhile, the fixed rod 13 triggers the contact switch 18, and the contact switch 18 sends a signal to the control system of the chip mounter, and at the moment, the suction nozzle head 19 stops moving downwards and sucking the component.
In one embodiment, the upper surface of the fixed block 31 is attached to the lower surface of the mounting sleeve 36, the insert block 32 is slidably connected to the inner side wall of the slot 35, the insert rod 34 is slidably connected to the inner side wall of the jack 37, one side of the top of the insert block 32 away from the suction nozzle head 19 is an inclined plane, one end of the insert rod 34 away from the jack 37 is located outside the mounting sleeve 36 and slidably connected with the mounting sleeve 36, one end of the insert rod 34 away from the jack 37 is fixedly connected with the pull block 38, one end of the tension spring 33 is fixedly connected to the outer side wall of the mounting sleeve 36, the other end of the tension spring 33 is fixedly connected to one side of the pull block 38 close to the insert rod 34, when the suction nozzle head 19 is mounted, the suction nozzle head 19 drives the fixed block 31 and the insert block 32, the insert block 32 is inserted into the slot 35, the inclined plane of the insert block 32 pushes the insert rod 34 away from the suction nozzle head 19, when the jack 37 moves to correspond to the position of the insert rod 34, and when the suction nozzle head 19 is pulled by the tension spring 33, the position of the insert rod 34 can be limited at this time, and the position of the suction nozzle head 19 is convenient to mount the head 19.
In one embodiment, the outer sidewall of the nozzle head 19 is mounted with a seal assembly 401, the seal assembly 401 comprising a seal ring 41, a connecting flange 42 and a seal groove 43;
the sealing ring 41 is embedded in the outer side wall of the suction nozzle head 19 at equal intervals, the sealing groove 43 is arranged in the inner side wall of the mounting sleeve 36 at equal intervals, the sealing ring 41 is attached to the inner side wall of the sealing groove 43, the connecting flange 42 is fixedly connected to the upper surface of the mounting sleeve 36, and then the sealing effect can be achieved under the cooperation of the sealing ring 41 and the sealing groove 43, so that the air tightness of the suction nozzle head 19 is ensured.
In addition, the invention also provides a using method of the anti-impact suction nozzle structure of the chip mounter, which comprises the following steps:
step one: the mounting sleeve 36 is fixedly connected with a power mechanism of the chip mounter through a connecting flange 42, and meanwhile, the mounting sleeve 36 is communicated with a negative pressure mechanism of the chip mounter;
step two: aligning the nozzle head 19 with the mounting sleeve 36, aligning the insert block 32 with the slot 35, and pressing the nozzle head 19 into the mounting sleeve 36;
step three: pushing of the insert block 32 moves the insert rod 34 away from the nozzle head 19, and when the insertion hole 37 moves to correspond to the position of the insert rod 34, the tension spring 33 pulls the insert rod 34 to be inserted into the insertion hole 37;
step four: when the insert rod 34 is inserted into the insertion hole 37, the seal ring 41 moves into the seal groove 43;
step five: when the patch is started, negative pressure is formed in the suction nozzle head 19, the suction nozzle head 19 is driven by the power structure of the patch to be close to the component, and the suction nozzle head 19 is contacted with the component through the buffer pad 11;
step six: when the buffer cushion 11 is contacted with the components, the suction head 12 pushes the connecting sleeve 15 to slide upwards in the groove 16, and the spring 14 is compressed under the stress;
step seven: the suction head 12 drives the fixed rod 13 to move upwards to contact with the contact switch 18, the contact switch 18 sends a signal to a chip mounter control system, and the chip mounter controls the suction nozzle head 19 to stop moving downwards;
step eight: the suction head 12 adsorbs the components, and the power mechanism of the chip mounter controls the suction head 19 to move and mount the components.
In one embodiment, in step seven, the signal output of the contact switch 18 communicates with the control system of the placement machine.
The invention works when in work: the mounting sleeve 36 is fixedly connected with a power mechanism of the chip mounter through the connecting flange 42, the mounting sleeve 36 is communicated with a negative pressure mechanism of the chip mounter, the suction nozzle head 19 is aligned with the mounting sleeve 36, the inserting block 32 is aligned with the inserting groove 35, the suction nozzle head 19 is pressed into the mounting sleeve 36, the inserting rod 34 is pushed by the inserting block 32 to move away from the suction nozzle head 19, when the inserting hole 37 moves to correspond to the inserting rod 34, the inserting rod 34 is pulled by the tension spring 33 to be inserted into the inserting hole 37, meanwhile, the sealing ring 41 moves into the sealing groove 43, negative pressure is formed in the suction nozzle head 19 when the chip mounter starts, the power structure of the chip mounter drives the suction nozzle head 19 to be close to a component, the suction nozzle head 19 is contacted with the component through the buffer pad 11, then the buffer pad 11 can play a role of preliminary buffering, the suction nozzle head 15 is pushed to slide upwards in the groove 16 when the buffer pad 11 is contacted with the component, the suction nozzle 12 is stressed and compressed by the spring 14, the deformation of the spring 14 and the displacement of the connecting sleeve 15 play a role of buffering again, the suction nozzle 12 drives the fixing rod 13 to move upwards and contact with the contact switch 18, and the contact switch 18 sends a signal to a control system of the chip mounter control system, the chip mounter stops the power mechanism to move the suction nozzle head 19 downwards, and the chip mounter power is controlled by the chip mounter to move towards the component 19.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that various changes and substitutions are possible within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a chip mounter suction nozzle structure of protection against shock, includes protection against shock subassembly (101), its characterized in that: the anti-impact assembly (101) comprises a buffer pad (11), a suction head (12), two fixing rods (13), a spring (14), a connecting sleeve (15), a groove (16), a mounting seat (17), a contact switch (18) and a suction nozzle head (19);
the buffer pad (11) is adhered to the lower surface of the suction head (12), the groove (16) is formed in the lower surface of the suction head (19), the connecting sleeve (15) is fixedly connected to the upper surface of the suction head (12), the spring (14) is positioned in the groove (16), the contact switch (18) is fixedly connected to the outer side wall of the suction head (19) through the mounting seat (17), and the two fixing rods (13) are symmetrically and fixedly connected to the outer side wall of the suction head (12);
the mounting assembly (301) is mounted on the outer side wall of the suction nozzle head (19), and the mounting assembly (301) comprises two fixed blocks (31), an inserting block (32), a tension spring (33), an inserting rod (34), two inserting grooves (35), a mounting sleeve (36) and an inserting hole (37);
the two fixing blocks (31) are symmetrically and fixedly connected to the outer side wall of the suction nozzle head (19), the tension springs (33) are sleeved on the outer side wall of the inserting rod (34), the two inserting grooves (35) are symmetrically formed in the lower surface of the mounting sleeve (36), and the inserting holes (37) are formed in the inserting blocks (32).
2. The impact-resistant suction nozzle structure of a chip mounter according to claim 1, wherein: the insert block (32) is fixedly connected to the upper surface of the fixed block (31), the suction nozzle head (19) is slidably connected to the inner side wall of the mounting sleeve (36), and the connecting sleeve (15) is slidably connected to the inner side wall of the groove (16).
3. The impact-resistant suction nozzle structure of a chip mounter according to claim 1, wherein: the fixed rod (13) corresponds to the contact switch (18), the top end of the spring (14) is fixedly connected to the inner top wall of the groove (16), and the bottom end of the spring (14) is fixedly connected to the upper surface of the connecting sleeve (15).
4. The impact-resistant suction nozzle structure of a chip mounter according to claim 2, wherein: the upper surface of fixed block (31) laminate in the lower surface of installation cover (36), insert block (32) sliding connection in the inside wall of slot (35), insert rod (34) sliding connection in the inside wall of jack (37), insert block (32) top keep away from one side of suction nozzle head (19) is the inclined plane.
5. The impact-resistant suction nozzle structure of a chip mounter according to claim 4, wherein: the one end that inserted bar (34) kept away from jack (37) is located the outside of installation cover (36) and with installation cover (36) sliding connection, inserted bar (34) keep away from the one end fixedly connected with pull block (38) of jack (37).
6. The impact-resistant suction nozzle structure of a chip mounter according to claim 5, wherein: one end of the tension spring (33) is fixedly connected to the outer side wall of the mounting sleeve (36), and the other end of the tension spring (33) is fixedly connected to one side, close to the inserted link (34), of the pull block (38).
7. The impact-resistant suction nozzle structure of a chip mounter according to claim 4, wherein: a sealing assembly (401) is arranged on the outer side wall of the suction nozzle head (19), and the sealing assembly (401) comprises a sealing ring (41), a connecting flange (42) and a sealing groove (43);
the sealing rings (41) are embedded in the outer side wall of the suction nozzle head (19) at equal intervals, and the sealing grooves (43) are arranged in the inner side wall of the mounting sleeve (36) at equal intervals.
8. The impact-resistant suction nozzle structure of a chip mounter according to claim 7, wherein: the sealing ring (41) is attached to the inner side wall of the sealing groove (43), and the connecting flange (42) is fixedly connected to the upper surface of the mounting sleeve (36).
9. The method of using a suction nozzle structure of a chip mounter for preventing impact according to any one of claims 1 to 8, comprising the steps of:
step one: the mounting sleeve (36) is fixedly connected with a power mechanism of the chip mounter through a connecting flange (42), and meanwhile, the mounting sleeve (36) is communicated with a negative pressure mechanism of the chip mounter;
step two: aligning the nozzle head (19) with the mounting sleeve (36), aligning the insert block (32) with the slot (35), and pressing the nozzle head (19) into the mounting sleeve (36);
step three: pushing of the insert block (32) enables the insert rod (34) to move in a direction away from the suction nozzle head (19), and when the insertion hole (37) moves to correspond to the position of the insert rod (34), the insert rod (34) is pulled by the tension spring (33) to be inserted into the insertion hole (37);
step four: when the inserting rod (34) is inserted into the inserting hole (37), the sealing ring (41) moves into the sealing groove (43);
step five: when the patch is started, negative pressure is formed in the suction nozzle head (19), the suction nozzle head (19) is driven by the power structure of the patch to be close to the component, and the suction nozzle head (19) is contacted with the component through the buffer pad (11);
step six: when the buffer cushion (11) is contacted with the components, the suction head (12) pushes the connecting sleeve (15) to slide upwards in the groove (16), and the spring (14) is stressed and compressed at the moment;
step seven: the suction head (12) drives the fixed rod (13) to move upwards to be in contact with the contact switch (18), the contact switch (18) sends a signal to a chip mounter control system, and the chip mounter controls the suction head (19) to stop moving downwards;
step eight: the suction head (12) adsorbs the components and parts, and the power mechanism of the chip mounter controls the suction head (19) to move and mount the components and parts.
10. The method for using the impact-resistant suction nozzle structure of the chip mounter according to claim 9, wherein the method comprises the following steps: in the seventh step, a signal output end of the contact switch (18) is communicated with a control system of the chip mounter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310443991.XA CN116322018A (en) | 2023-04-24 | 2023-04-24 | Impact-resistant suction nozzle structure of chip mounter and using method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310443991.XA CN116322018A (en) | 2023-04-24 | 2023-04-24 | Impact-resistant suction nozzle structure of chip mounter and using method |
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| CN116322018A true CN116322018A (en) | 2023-06-23 |
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| CN202310443991.XA Pending CN116322018A (en) | 2023-04-24 | 2023-04-24 | Impact-resistant suction nozzle structure of chip mounter and using method |
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| JPH10117095A (en) * | 1996-10-15 | 1998-05-06 | Matsushita Electric Ind Co Ltd | Vacuum nozzle |
| JP2002151893A (en) * | 2000-11-08 | 2002-05-24 | Matsushita Electric Ind Co Ltd | Electronic component mounting system and electronic component mounting method |
| KR20060097317A (en) * | 2005-03-05 | 2006-09-14 | 삼성테크윈 주식회사 | Nozzle assembly for chip mounter |
| CN102843872A (en) * | 2012-08-22 | 2012-12-26 | 广东益翔自动化科技有限公司 | Mounting head structure of multifunctional special chip mounter |
| CN207586133U (en) * | 2017-11-28 | 2018-07-06 | 广州市第三建筑装修有限公司 | A kind of smoke detector |
| JP2019162672A (en) * | 2018-03-19 | 2019-09-26 | パナソニックＩｐマネジメント株式会社 | Part holding suction nozzle |
| CN208572717U (en) * | 2018-08-14 | 2019-03-01 | 珠海市吉世鑫智能科技有限公司 | A kind of improvement suction nozzle of SMT equipment |
| CN212750813U (en) * | 2020-07-02 | 2021-03-19 | 自贡华声科技有限公司 | Novel die bonder |
| CN213522966U (en) * | 2020-12-11 | 2021-06-22 | 深圳市长宝田科技有限公司 | Novel suction nozzle of SMT chip mounter |
| CN218388145U (en) * | 2022-08-16 | 2023-01-24 | 中山市盈利佳电子有限公司 | Novel paster mouth of chip mounter |
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Application publication date: 20230623 |
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