JP3537510B2 - Electronic component automatic mounting device and electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic electronic component mounting apparatus and an electronic component mounting method in which an electronic component is sucked by vacuum suction of a suction nozzle, and the suction nozzle holds and conveys the component to mount it on a printed circuit board. About.

[0002]

2. Description of the Related Art An electronic component mounting apparatus of this kind is disclosed in
The electronic component is detected by a component presence / absence detection device in a state where the electronic component is held by a suction nozzle, and when the absence of the component is detected, the vacuum leak of the nozzle is eliminated. The vacuum suction is shut off.

[0003]

However, in the above-mentioned prior art, the suction nozzle actually sucks the component, but the vertical position of the suction nozzle is normal due to poor nozzle sliding or the like. In the absence of such a component, the absence of the component is detected and the vacuum is cut off, even though the component is actually sucked, so that the component falls and scatters. For this reason, depending on a place where the component recognition camera falls, for example, there is a possibility that the automatic operation of component mounting may be supported.

In order to prevent this, if the vacuum suction is not turned off after the detection of the absence of the component, if the component is not actually sucked, a vacuum leak occurs and the vacuum pressure of the entire apparatus drops. There was a problem that would. SUMMARY OF THE INVENTION It is an object of the present invention to reduce the possibility that components will fall due to erroneous detection and reduce the occurrence of vacuum leaks.

[0005]

SUMMARY OF THE INVENTION Accordingly, the present invention provides an automatic electronic component mounting apparatus in which an electronic component is sucked by vacuum suction of a suction nozzle, and the suction nozzle holds and conveys the component to mount it on a printed circuit board. A switching valve for switching between vacuum suction and shutoff of the suction nozzle, a component presence / absence detecting means for detecting the presence / absence of suction of the component of the suction nozzle during the conveyance of the component of the suction nozzle, Judging means for judging whether or not to interrupt the vacuum suction of the suction nozzle when the component presence / absence detecting means detects the absence of the component, and shuts off the vacuum suction when the judging means judges to shut off the vacuum suction. Control means for controlling the switching of the valve as described above.

Further, the present invention provides a method in which a plurality of suction nozzles provided on a peripheral edge of a rotary table suck electronic components by vacuum suction, and the suction nozzles hold and convey the components by intermittent rotation of the table so that the components are transferred to a printed circuit board. A switching valve provided for each suction nozzle for switching between vacuum suction and shutoff of the suction nozzle in the electronic component mounting apparatus to be mounted; and a component of the suction nozzle during the conveyance of the component of the suction nozzle. Component presence / absence detection means for detecting the presence / absence of suction, and determination means for determining whether or not to interrupt the vacuum suction of the suction nozzle when the component presence / absence detection means detects the absence of a component based on the type of suction nozzle; And control means for controlling switching of the valve so as to cut off the vacuum suction when the judgment means judges that the vacuum suction should be cut off.

According to the present invention, in a method of mounting an electronic component in which an electronic component is suctioned by vacuum suction of a suction nozzle and the suction nozzle holds and conveys the component and mounts the component on a printed circuit board, the suction nozzle may be in the middle of transferring the component. A component presence / absence detection step of detecting the presence / absence of suction of a component of the suction nozzle, and determining whether to interrupt vacuum suction of the suction nozzle when the absence of a component is detected in the component presence / absence detection step based on the type of the suction nozzle And a shutoff step of shutting off the vacuum suction of the nozzle when it is determined in the judgment step that the vacuum suction should be shut off.

[0008]

According to the first aspect of the present invention, the determining means determines whether or not to interrupt the vacuum suction in accordance with the type of the suction nozzle when the component presence / absence detecting means detects the absence of the component. The switching of the switching valve is controlled. According to the configuration of claim 2, when the component presence / absence detection unit detects the absence of the component, the determination unit determines whether or not to interrupt the vacuum suction according to the type of the suction nozzle, and the control unit determines whether or not the vacuum suction is to be stopped. The switching of the switching valve corresponding to the suction nozzle among the plurality of suction nozzles provided on the peripheral edge is controlled.

According to the third aspect of the present invention, when the absence of a component is detected in the component presence / absence detection step in the determination step, whether or not the vacuum suction of the suction nozzle is to be interrupted is determined based on the type of the suction nozzle. Then, the vacuum suction of the suction nozzle is shut off according to the judgment.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to the drawings. 2 and 3, reference numeral 1 denotes a Y table that moves in the Y direction by rotation of a Y-axis motor 2, and 3 denotes a movement in the X direction on the Y table 1 by rotation of an X-axis motor 4. As a result, the printed circuit board 6 on which the chip-shaped electronic components 5 (hereinafter, referred to as chip components or components) are mounted is fixedly mounted on fixing means (not shown).

Reference numeral 7 denotes a supply table on which a number of component supply devices 8 for supplying the chip components 5 are provided. Reference numeral 9 denotes a supply stand drive motor. The supply stand 7 is guided by a linear guide 12 through a nut 11 fixed to the supply stand 7 by screwing the ball screw 10 by rotating the ball screw 10. Move in the direction. Reference numeral 13 denotes a rotary table which rotates intermittently. At the outer edge of the table 13, mounting heads 15 having a plurality of suction nozzles 14 are arranged at equal intervals in accordance with an intermittent pitch.

A suction station I is a stop position of the mounting head 15 where the suction nozzle 14 sucks and picks up the component 5 from the supply device 8 due to the intermittent rotation of the rotary table 13. 5 is adsorbed. Reference numeral II denotes a component presence / absence detection station for detecting the presence / absence of suction of the component 5 by the suction nozzle 14. The presence / absence of the component 5 is detected by a component presence / absence detection sensor 24. The configuration of the sensor 24 is as shown in FIG. It comprises a light projector 25 for emitting a light beam in the horizontal direction and a light receiver 26 for receiving the light beam. The light beam of the projector 25 is the component 5
The light projector 25 is provided at a position where the light beam is blocked by the light source.
Is detected.

Reference numeral III denotes a vacuum switching station, which switches between vacuum suction of the suction nozzle 14 and opening to the atmosphere as will be described in detail later. Reference numeral 16 denotes a component recognition device for recognizing a positional shift of the component 5 to be sucked by the suction nozzle 14 by using a camera to image the lower surface of the component 5 within a predetermined field of view and recognizing and processing the captured image. It is provided in.

Next mounting head 1 of recognition station IV
The stop position of the position 5 is the angle correction station V, and the head rotation device 17 is rotated by an angle amount in which the angle amount for correcting the angular displacement of the chip component 5 based on the recognition result of the recognition device 16 is added to the predetermined angle amount. Rotates the mounting head 15 in the θ direction. Nozzle 1 extending in the vertical direction with the θ direction
4 is the direction of rotation about the axis.

The next stop position after the angle correction station V is the mounting station VI, and the component 5 to be sucked by the suction nozzle 14 of the station VI is mounted on the substrate 6 by lowering the mounting head 15. The next stop position of the mounting station VI is the component discharge station VII, and the component 5 not mounted in the mounting station VI
Of the component discharge box 2
Discarded at 8.

Numeral 20 denotes an elevating rod which moves up and down, engages with an oscillating lever 21 of the component supply device 8 and oscillates to fit a component storage tape (not shown) in which the chip components 5 are sealed at a predetermined interval in accordance with the interval. The chip component 5 is supplied to the component suction position of the suction nozzle 14 by intermittent feeding. Reference numeral 22 denotes a tape reel for winding the component storage tape (not shown). Next, a vacuum suction circuit of the suction nozzle 14 will be described with reference to FIG.

Each mounting head 15 of the rotary table 13
A switching valve 29 for supplying compressed air to each head 15 is provided at the upper part of the head. Each valve 29 communicates with a vacuum source (not shown) via a vacuum passage 30 in the rotary table 13, and a communication passage 31 for supplying a negative pressure from the valve 29 to each mounting head 15 in the rotary table 13. Is provided. A bendable tube 32 is connected to each valve 29 from the communication passage 31.
A path (not shown) for vacuum suction is formed from the tube 32 to a suction nozzle 14 protruding from each head 15 for sucking the chip component 5.

The valve 29 is provided with a vacuum chamber 33 in which the vacuum passage 30 and the communication passage 31 communicate with each other. In the vacuum chamber 33, a cylindrical switching rod 34 is inserted and provided. When the switching rod 34 is pushed to the left, that is, in the rotary table 13, the communication path 31 is open to the atmosphere and the vacuum path 30 is cut off by the rod 34 so that vacuum does not leak. That is, the switching valve 29 is switched to the atmosphere open side. On the other hand, when the switching rod 34 is pulled out to the right, the vacuum passage 3
The communication passage 31 is communicated with the pressure chamber 0 via the vacuum chamber 33, and the vacuum suction is performed from the suction nozzle 14. At this time, the communication path 31 is switched from the atmosphere to a state of being shut off. Further, in the storage position, the suction nozzle 14
The vacuum does not leak (leak does not occur).

At the vacuum switching station III, the mounting station VI, and the parts discharge station VII, the switching rod 34 is pulled out from the rotary table 13 which is in the vacuum suction state, and is pushed in to perform vacuum suction. A mechanism is provided for shutting off to open to the atmosphere. That is, as shown in FIG. 5, a rod 44 is slidably provided on a fixed base 49 fixed to the electronic component automatic mounting apparatus, and the rod 44 can be moved left and right in FIG. The lever 46 is connected to the rotary table 1
3 is driven by a drive rod 47 that moves up and down by a cam (not shown) that rotates in synchronization with the intermittent rotation.

That is, the rod 44 is slidably mounted on a fixing base 49 fixed to the electronic component mounting apparatus, and a compression is provided between the mounting base 49 and the large diameter portion at the tip of the rod 44. A spring 50 is wound around the rod 50, and the rod 44 is moved in the direction of contact with the rod 34 by the urging force of the spring 50, and is counterclockwise about a support shaft 51 provided on a fixed base 49 of the lever 46. The spring 5
The nozzle 44 moves in a direction away from the rod 34 against 0.

The driving of the drive rod 47 can be switched by a clutch mechanism as described later, and the rod 44 can be moved only when it is desired to interrupt the vacuum suction. As shown in FIG. 5, only one suction nozzle 14 used for suctioning the component 5 is protruded from the mounting head 15 and the other nozzles 14 in the same mounting head 15 are drawn into the upper storage position. Stored. Accordingly, each suction nozzle 14 is slidable within the mounting head 15 between the storage position and the use position, and slides while being guided by a guide portion (not shown). Further, it can be fixed to the head 15 at each position. The detection of the presence or absence of the component 5 by the detection sensor 24 is performed when the component 5 is fixed at the use position.

Next, a control block of the electronic component automatic mounting apparatus of this embodiment will be described with reference to FIG. Reference numeral 52 denotes a CPU serving as a determination unit and a control unit.
Based on the various data stored in the ROM 3, various operations relating to the mounting of the chip component 5 are controlled in accordance with a program including the operation program of the flowchart of FIG. A solenoid 56 for driving a clutch mechanism (not shown) which is separated from the cam so as not to drive the drive rod 47 provided at each of the stations;
57 and 58 are connected to the CPU 52 via the drive circuit 59 and the interface 60. A solenoid 56 separates the drive rod 47 of the vacuum switching station II from the cam. A solenoid 57 corresponds to the mounting station VI, and a solenoid 58 corresponds to the component discharging station VII.

The mounting data shown in FIG. 7 is stored in the RAM 53. The mounting data is created for each type of the printed circuit board 6, and the component 5 to be mounted, that is, the component type to be mounted, that is, to be suctioned for each step number which is the mounting order of the component 5.
The reel number indicating the position on the supply table 7 on which the component supply device 8 supplying the component is mounted, the X and Y data indicating the mounting position on the substrate 6, and the angular position to be positioned in the θ direction at the time of mounting. The data of θ shown is stored. E in column C indicates the end of the step number.

The component arrangement data shown in FIG. 8 is stored in the RAM 53, and forms a set with the mounting data, and indicates the type of the component 5 supplied by the component supply device 8 for each reel number. Further, the component data shown in FIG. 9 is stored in the RAM 53, and the component data stores the data of the size of the component type or the type (nozzle type) of the suction nozzle 14 to be used.

Further, the RAM 53 stores the vacuum switching nozzle data shown in FIG. 10, and when the suction error of the absence of the component 5 occurs in the component presence / absence detection sensor 24 for each nozzle type, the vacuum off operation is performed. Whether the nozzle type storing 1 in FIG. 10 performs the vacuum-off operation, and the nozzle type storing 0 does not perform the vacuum-off operation in the vacuum switching station III in FIG. Thus, the nozzle type corresponding to the small chip controlled by the CPU 52. The nozzle 14 corresponding to the small chip that does not perform vacuum-off is a nozzle 14 that sucks the small component 5, and has a small diameter of the nozzle 14 itself, and is affected by a change in the height position at the use position of the nozzle 14 due to poor sliding. Easy and parts 5
Is small (the dimension in the up-down direction in the sucked state), so that the sensor 24 can easily detect erroneously. Also, the vacuum suction force of this small nozzle 14 is small and
Even if the head is not adsorbed, the amount of vacuum leakage is small, and the effect of lowering the vacuum suction force of the nozzles 14 of the other heads 15 is small.

The operation of the above configuration will be described below. When the automatic operation of the electronic component automatic mounting apparatus is started by the operation of the operation unit (not shown), the operation is performed according to the flowchart of FIG. For example, at each step number of the mounting data shown in FIG. 7 stored in the RAM 53, the supply table 7 is moved by the rotation of the ball screw 10 so that the component supply device 8 of the reel number stops at the component removal position of the suction nozzle 14. The chip component 5 is taken out. Also,
Prior to the pick-up of the component 5, a component type corresponding to the reel number of the step number of the mounting data is determined from the component array data of FIG. The type of the nozzle 14 shown is determined, and the nozzle 14 of the nozzle type is selected and protruded to the use position.

When removing the component 5, the mounting head 15 is lowered and a lever (not shown) provided on the suction station is engaged with a flange formed on a switching rod corresponding to the head 15 so that the rotary table 13 is removed. Thus, the communication path 31 communicates with the vacuum chamber 33, and the chip component 5 is vacuum-sucked by the suction nozzle 14 to be taken out.

Next, the head 1 holding the chip component 5
Reference numeral 5 denotes a component presence / absence detection station II, and the presence / absence of suction of the component 5 (chip presence / absence detection) is detected by the component presence / absence detection sensor 2
4. That is, when the light beam is emitted from the light projector 25 toward the component 5 and the component 5 is normally sucked, the light beam is blocked by the component 5 and the component 5 is normally sucked without being received by the light receiver 26. Is detected. Since there is no suction error and the operation is normal, the CPU 52 controls the vacuum suction to continue as it is, and the solenoid 56 does not operate so that the drive rod 47 is not lowered by the rotation of a cam (not shown) so as not to cut off (turn off) the vacuum. .

Next, the head 1 holding the chip component 5
5 reaches the recognition station IV, and the recognition device 16 recognizes the position shift of the component 5. With the next intermittent rotation, the chip component 5 reaches the angle correction station V, and the head 15 is moved to the mounting angle position in FIG. 7 where the chip component 5 should be mounted in consideration of the correction based on the recognition result. Rotating device 1
7.

Next, when the head 15 moves to the next mounting station IV, the XY table 3 moves the printed circuit board 6 to a mounting position in consideration of the correction based on the recognition result described above, and the mounting head 15 descends. As a result, the chip component 5 is mounted at a predetermined position on the printed circuit board 6. At this time, the solenoid 57 of the station VI operates to operate the rod 44.
The cam for driving is also rotated in accordance with this rotation, the rod 47 is lowered by the cam, and the swing lever 46 is swung by the urging force of the compression spring 50, and the rod 44 is moved to the left in FIG. Make a move. Thus, the vacuum is turned off and the component 5 is mounted on the substrate 6.

Next, as described above, the suction nozzle 14 is selected and the nozzle 14 of the nozzle type 1 is protruded to the use position. However, it is assumed that the nozzle 14 has not been slightly lowered to the normal use position due to poor sliding. . The nozzle 14 of the nozzle type 1 is a suction nozzle 14 that suctions a thin small component 5. Next, in the same manner as described above, the mounting head 15 having the suction nozzle 14 moves to the suction station I to suck the component 5, but the suction nozzle 14 is only slightly raised. It is assumed that the suction of the component 5 is normally performed.

Next, the sensor 24 detects the presence or absence of the suction of the component 5 in the component presence / absence detection station II. 5, the light is received by the light receiver 26 without being blocked. Therefore, the CPU 52 determines that there is a suction error, and determines whether or not the nozzle type is compatible with the small chip based on the vacuum switching nozzle data in FIG. 10 according to the flowchart in FIG.

That is, since the nozzle type is 1 and 0 is stored in the vacuum-off data, the CPU 52 determines that the nozzle type is for a small chip. Next, when the mounting head 15 reaches the vacuum switching station III, the vacuum-off operation is not performed. For this reason, the part 5 reaches the next station while being sucked.

Next, the CPU 52 performs a suction abnormality process.
That is, even if the mounting head 15 of the suction nozzle 14 in which the suction error has occurred reaches the mounting station VI, the mounting operation, that is, the head 15 does not descend, and the station V
The vacuum is not turned off at I (mounting cancel processing), and the process is moved to the next component discharge station VII.

Next, in the station VII, the solenoid 58 is operated to drive the cam (not shown) and push the rod 34 by the urging force of the spring 50 to cut off the vacuum and to remove the component 5 of the suction nozzle 14 into the discharge box 28. Let it fall. In addition, as a part of the suction abnormality process, the suction operation of the component 5 of the step number in which the suction error has occurred in the head subsequent to the mounting head 15 in which the suction error is detected is performed.

Also, when the component 5 is sucked by the nozzle 14 of the nozzle type 1 and the component 5 cannot be actually sucked, the detection sensor 24 detects a suction error in the component presence / absence detection station II. In this case, the vacuum switching stage
In the operation III, the vacuum-off operation is not performed, so that a vacuum leak occurs. However, since the nozzle 14 has a small vacuum suction force, the vacuum suction of the other head 15 is not affected. Thereafter, the discharging operation of the component 5 in the discharging station VII is performed without performing the mounting operation as described above.

When the nozzle 14 of the nozzle type 1 normally sucks the component 5 and the sensor 24 detects that there is no suction error, the vacuum suction is continued in the same manner as described above, and the mounting is performed. The operation of mounting the component 5 in the station VI is performed. Even when the sensor 24 determines that there is a suction error with the nozzle 14 of the nozzle type 1, if the next recognition station IV determines that the component 5 is normally suctioned, The operation of mounting the component 5 at the mounting station VI may be performed without performing the suction abnormality process.

Further, in this embodiment, it is determined whether or not there is a nozzle type to be vacuum-off based on the vacuum switching nozzle data (FIG. 10). Data indicating whether to turn off or not may be stored.

[0039]

As described above, according to the present invention, when the absence of a component is detected, the vacuum suction is interrupted in accordance with the type of the suction nozzle, so that the component is dropped by erroneous detection while suppressing the vacuum leak. Can be reduced. In particular, when the rotary table is provided with a plurality of suction nozzles, it is not necessary to lower the vacuum suction pressure of other nozzles, and it is possible to reduce the drop of parts.

[Brief description of the drawings]

FIG. 1 is a diagram showing a flowchart when a component suction error occurs.

FIG. 2 is a plan view of an electronic component automatic mounting apparatus to which the present invention is applied.

FIG. 3 is a side view of the electronic component automatic mounting apparatus.

FIG. 4 is a side view showing a component presence / absence detection sensor.

FIG. 5 is a side view showing a vacuum path of the electronic component automatic mounting apparatus.

FIG. 6 is a control block diagram of an electronic component automatic mounting apparatus to which the present invention is applied.

FIG. 7 is a diagram showing mounting data.

FIG. 8 is a diagram showing component arrangement data.

FIG. 9 is a diagram showing component data.

FIG. 10 is a diagram showing vacuum switching nozzle data.

[Explanation of symbols]

5 Chip-shaped electronic components (electronic components) 6 Printed circuit board 13 Rotary table 14 Suction nozzle 24 Component presence / absence detection sensor (Component presence / absence detection means) 29 Switching valve 52 CPU (determination means) (control means)

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 13/04

Claims (3)

(57) [Claims] 1. An electronic component automatic mounting apparatus in which an electronic component is sucked by vacuum suction of a suction nozzle and the suction nozzle holds and conveys the component and mounts the component on a printed circuit board. A switching valve for switching, a component presence / absence detection means for detecting the presence / absence of suction of a component of the suction nozzle during the conveyance of the component of the suction nozzle, and the component presence / absence detection means detecting presence / absence of a component based on the type of the suction nozzle Determining means for determining whether or not to interrupt the vacuum suction of the suction nozzle in the case of performing, and control means for controlling switching of the valve so as to shut off the vacuum suction when the determining means determines to shut off the vacuum suction. An electronic component automatic mounting device, comprising: 2. An electronic device, wherein a plurality of suction nozzles provided on a peripheral edge of a rotary table suck electronic components by vacuum suction, and the suction nozzles hold and convey the components by intermittent rotation of the table to mount the electronic components on a printed circuit board. In the component automatic mounting device, a switching valve provided corresponding to each suction nozzle for switching between vacuum suction and cutoff of the suction nozzle,
A component presence / absence detection means for detecting the presence / absence of suction of the component of the suction nozzle during the conveyance of the component of the suction nozzle, and a vacuum for the suction nozzle when the component presence / absence detection means detects the absence of the component depending on the type of the suction nozzle. It is characterized by having a judgment means for judging whether or not to interrupt the suction, and a control means for controlling switching of the valve so as to shut off the vacuum suction when the judgment means judges to shut off the vacuum suction. Electronic parts automatic mounting equipment. 3. A method of mounting an electronic component in which an electronic component is sucked by vacuum suction of a suction nozzle and the suction nozzle holds and conveys the component and mounts the component on a printed circuit board. A component presence / absence detection step of detecting the presence / absence of suction of a component of the suction nozzle, and a determination of determining whether to shut off vacuum suction of the suction nozzle when the absence of a component is detected in the component presence / absence detection step based on the type of the suction nozzle. A method for mounting an electronic component, comprising: a step; and a shutoff step of shutting off the vacuum suction of the nozzle when it is judged in the judging step to shut off the vacuum suction.