JP6827192B2 - Part thickness calculation method - Google Patents

Description

The present invention relates to a method for calculating a component thickness by a component mounting device that picks up a component by a suction nozzle and mounts the component on a substrate.

Conventionally, there is known a component mounting device that picks up a component from a component supply unit by a suction nozzle provided in the mounting head and mounts the component at a predetermined mounting position on a substrate. In the component mounting device, when picking up a component, the suction nozzle may suck the component in an inclined posture or may not be able to suck the component.

Therefore, a side image of the parts sucked by the suction nozzle is acquired by a parts recognition camera integrally provided on the mounting head, and the quality and thickness of the sucked parts are judged by recognizing the image. Has been done (eg, Patent Document 1). Further, the presence or absence of a component in the suction nozzle is also determined from the side image (for example, Patent Document 2). In the recognition of these side images, the image data captured by the component recognition camera is sent to the control unit for image recognition, where the image is processed, and based on the result, the presence or absence of the component and the quality of the posture are judged. It has been

Japanese Patent No. 4331054 International Publication No. 2014/147806

By the way, when the parts are not sucked when picking up the parts, the suction nozzle is in a state of vacuum leakage, and it is not preferable that this state is prolonged. In particular, when one vacuum source is shared by a plurality of suction nozzles, if the number of suction nozzles leaking vacuum increases, the suction force of the suction nozzles sucking the parts decreases, and the parts Problems such as dropping may occur. Therefore, in order to calculate the thickness of the component sucked by the suction nozzle of this phenomenon in anti surgeons can take appropriate measures such as stopping the vacuum leakage by determining the presence or absence of components in the suction nozzle at high speed You will need it.

Therefore, an object of the present invention is to provide a component thickness calculation method capable of appropriately calculating the component thickness of the suction nozzle.

The component thickness calculation method of the present invention is a component thickness calculation method using a component mounting device having a rotary type mounting head in which a plurality of nozzle shafts equipped with suction nozzles for adsorbing components are arranged, and is obtained by an imaging camera. After starting the determination of the presence or absence of the component sucked by the suction nozzle based on the tip of the suction nozzle or the image including the component, the thickness of the component sucked by the suction nozzle is calculated and the presence or absence of the component is calculated. In parallel with the determination of the above, the suction nozzle different from the suction nozzle sucks the component different from the component .

According to the present invention, the thickness of the component in the suction nozzle can be appropriately calculated .

Perspective view of the component mounting apparatus according to the embodiment of the present invention. Configuration diagram of the mounting head included in the component mounting device according to the embodiment of the present invention. Cross-sectional view of a mounting head included in the component mounting device according to the embodiment of the present invention. Partial sectional view of the mounting head included in the component mounting device according to the embodiment of the present invention along the horizontal plane. A block diagram showing a configuration of a control system of a component mounting device according to an embodiment of the present invention. (A) (b) The figure explaining the determination of the presence or absence of a component based on the average luminance value in the component mounting apparatus of one embodiment of the present invention. (A) (b) The figure explaining the determination of presence / absence of a component based on the contrast value in the component mounting apparatus of one embodiment of the present invention. The figure explaining the thickness of the component calculated in the component mounting apparatus of one Embodiment of this invention. (A) (b) The figure explaining the judgment range used in the component adsorption process in the component mounting apparatus of one Embodiment of this invention. Flow chart of the component mounting method in the component mounting device according to the embodiment of the present invention. The flow chart of the component adsorption process in the component mounting apparatus according to the embodiment of the present invention. Schematic diagram of a nozzle shaft holder for explaining a component mounting method in the component mounting device according to the embodiment of the present invention. A process explanatory view of a component mounting method in the component mounting device according to the embodiment of the present invention.

An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, and the like described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting device. In the following, the corresponding elements are designated by the same reference numerals in all the drawings, and duplicate description will be omitted. In FIG. 1 and a part described later, as biaxial directions orthogonal to each other in the horizontal plane, the X direction of the substrate transport direction (the direction perpendicular to the paper surface in FIG. 2) and the Y direction orthogonal to the substrate transport direction (in FIG. 2). Left and right direction) is shown. In FIG. 1 and a part described later, the Z direction (vertical direction in FIG. 2) is shown as a height direction orthogonal to the horizontal plane, and the θ direction is shown as a direction in the horizontal plane that rotates about the Z direction. The Z direction is a vertical direction or an orthogonal direction when the component mounting device is installed on a horizontal plane.

First, the structure of the component mounting device 1 will be described with reference to FIG. The component mounting device 1 has a function of mounting components on a substrate. At the center of the base 1a, a substrate transfer mechanism 2 provided with a pair of transfer conveyors extending in the X direction is arranged. The board transport mechanism 2 receives and transports the board 3 to be mounted on the component from the upstream device, and positions and holds the board 3 at the mounting work position by the component mounting mechanism described below.

Parts supply units 4 are arranged on both sides of the substrate transfer mechanism 2. The component supply unit 4 is configured by arranging a plurality of tape feeders 5 in parallel on the feeder table 4a. The tape feeder 5 supplies the component P to the take-out position by the mounting head 8 of the component mounting mechanism by pitch-feeding the carrier tape containing the component P (see FIG. 2) mounted on the substrate 3.

Next, the component mounting mechanism will be described. At the end of the base 1a in the X direction, a Y-axis beam 6 provided with a linear drive mechanism is arranged along the Y direction. An X-axis beam 7 having a linear drive mechanism is mounted on the Y-axis beam 6 so as to be movable in the Y direction. The X-axis beam 7 is arranged along the X direction. A plate member 9 is mounted on the X-axis beam 7 so as to be movable in the X direction, and a mounting head 8 is mounted on the plate member 9 via a holding frame 10.

The mounting head 8 has a function of picking up and holding the component P mounted on the board 3 from the component supply unit 4. The mounting head 8 horizontally moves in the X and Y directions by driving the Y-axis beam 6 and the X-axis beam 7, and mounts the component P to be held on the substrate 3 positioned and held by the substrate transport mechanism 2. Configure the mechanism. The Y-axis beam 6 and the X-axis beam 7 form a head moving mechanism 11 that moves the mounting head 8 in a horizontal plane.

Next, the structure of the mounting head 8 will be described with reference to FIGS. 2 to 4. In FIG. 2, the mounting head 8 has a structure in which the side surface and the upper surface are covered by the holding frame 10 and the cover 8a fixed to the holding frame 10. A rotor holding portion 12 is provided at the lower part of the holding frame 10 so as to extend in the horizontal direction. A cylindrical nozzle shaft holder 13 which is a rotor is rotatably held in the rotor holding portion 12 via a bearing 12a with the rotation axis CL in the Z direction as the axis (see FIG. 3). A holding body driven gear 14 centered on the rotating shaft CL is fixed to the upper surface of the nozzle shaft holding body 13.

An index drive motor 15 is arranged above the rotor holding portion 12. The index drive motor 15 is equipped with an index drive gear 15a that meshes with the holding body driven gear 14. The holding body driven gear 14 is index-rotated via the index drive gear 15a by driving the index drive motor 15 (arrow a). As a result, the nozzle shaft holder 13 also undergoes index rotation together with the holder driven gear 14.

FIG. 4 schematically shows a cross section of the nozzle shaft holder 13 along the horizontal plane. In FIGS. 3 and 4, a plurality of (12 in this case) through holes 16 that vertically penetrate the nozzle shaft holder 13 are provided at positions on the circumference of the nozzle shaft holder 13 about the rotation axis CL. Has been done. A cylindrical nozzle shaft 17 is inserted into each through hole 16 so as to be vertically movable with respect to the nozzle shaft holder 13.

In FIG. 3, bearings 18 for guiding the nozzle shaft 17 in the vertical direction are arranged at two locations above and below the inner peripheral surface 16a of the through hole 16. A nozzle holder 19 is provided below each nozzle shaft 17, and a suction nozzle 20 is detachably attached to the nozzle holder 19. That is, the mounting head 8 has a plurality of (12 in this case) suction nozzles 20. A substantially L-shaped attachment 21a is rotatably attached to the upper end of the nozzle shaft 17 in the θ direction. A cam follower 21 is attached to the attachment 21a with the rotation axis about the horizontal direction facing outward.

In FIG. 2, a cam holding portion 22 for fixing the cylindrical cam 23 is provided on the upper portion of the holding frame 10 so as to extend in the horizontal direction. A groove 23a is provided on the outer peripheral surface of the cylindrical cam 23. The groove 23a is provided so as to be high on the side opposite to the holding frame 10 and gradually lowered as it approaches the holding frame 10. The cam follower 21 attached to each nozzle shaft 17 is attached to the cylindrical cam 23 so as to be able to move along the groove 23a.

Each nozzle shaft 17 is urged upward by an elastic body 24 such as a spring provided above the nozzle shaft holder 13. When the nozzle shaft holder 13 rotates by index, the nozzle shaft 17 moves up and down along the groove 23a of the cylindrical cam 23 while rotating in the horizontal direction in accordance with the index rotation. A part of the cylindrical cam 23 is cut at the position where the groove 23a is the lowest, and the groove 23a is interrupted at the cut part.

A component suction nozzle elevating mechanism 25 is arranged between the holding frame 10 and the cylindrical cam 23. The component suction nozzle elevating mechanism 25 includes a screw shaft 25a extending in the Z direction, an elevating motor 25b for rotationally driving the screw shaft 25a, and a nut 25c screwed into the screw shaft 25a. The nut 25c is provided with a cam follower holder 25d that can move up and down along the cut portion of the cylindrical cam 23. The cam follower holder 25d moves up and down together with the nut 25c by driving the lifting motor 25b. The cam follower holder 25d has a shape that complements the groove 23a that is interrupted at the excision site. Therefore, the cam follower 21 moving along the groove 23a can smoothly transfer to the cam follower holder 25d.

The cam follower 21 that has moved along the groove 23a is separated from the groove 23a at this position, and is transferred to and held by the cam follower holder 25d that stands by at the same height position as the groove 23a. When the elevating motor 25b is driven in this state, the nozzle shaft 17 and the suction nozzle 20 move up and down together with the cam follower 21 with respect to the nozzle shaft holder 13 (arrow b). The component suction nozzle elevating mechanism 25 is not limited to the above structure, and may be a structure using a linear motor or a structure using an air cylinder as long as the nozzle shaft 17 is moved up and down.

As described above, the position of the nozzle shaft 17 in which the cam follower holder 25d holds the cam follower 21 is the first station S1 in which the nozzle shaft 17 moves up and down. In FIG. 4, 12 positions where the nozzle shaft holder 13 rotates by index rotation (rotation by 30 degrees in this case) and stops are set in order from the first station S1 in the clockwise direction of the nth station Sn (n = 1, 2, 2, ..., 12). That is, the 12 suction nozzles 20 mounted on the lower part of the nozzle shaft 17 inserted into the nozzle shaft holder 13 have n + 1 stations adjacent to the nth station Sn each time the nozzle shaft holder 13 rotates by index. It moves to Sn + 1 and returns to the first station S1 after the twelfth station S12.

In FIG. 3, a mounting hole 13a centered on the rotation axis CL of the nozzle shaft holder 13 is provided on the upper surface of the nozzle shaft holder 13. The cylindrical rotating body 26 that vertically penetrates the cylindrical cam 23 is rotatably arranged with respect to the nozzle shaft holder 13 by fitting the tip portion 26a into the mounting hole 13a via the bearing 26b. ..

A θ-rotation driven gear 27 centered on the rotation shaft CL is fixed near the upper end of the rotating body 26. Above the cylindrical cam 23, a θ rotation motor 28 equipped with a θ rotation drive gear 28a that meshes with the θ rotation driven gear 27 is arranged. The θ-rotation driven gear 27 is driven by the θ-rotation motor 28 and rotates in the θ direction via the θ-rotation drive gear 28a. As a result, the rotating body 26 rotates in the θ direction together with the θ rotation driven gear 27 (arrow c).

A nozzle drive gear 29 extending in the vertical direction corresponding to the elevating stroke of the nozzle shaft 17 is fixed between the nozzle shaft holder 13 and the cylindrical cam 23 of the rotating body 26. A nozzle rotation gear 30 is fixed to each nozzle shaft 17 at a position where it meshes with the nozzle drive gear 29. Each nozzle shaft 17 is driven by the nozzle drive gear 29 and simultaneously rotates in the θ direction via the nozzle rotation gear 30 (arrow d).

In FIG. 2, the rotor holding portion 12 is provided with a side image pickup camera 31 that takes an image from the side surface of the rotor holding portion 12 including the tip 20a of the suction nozzle 20 that is index-rotated and stopped at the third station S3. When the component P is attracted to the tip 20a of the suction nozzle 20, the side image pickup camera 31 simultaneously images the periphery of the tip 20a of the suction nozzle 20 and the sucked component P from the side surface. The side imaging camera 31 sequentially images the tip 20a of the suction nozzle 20 that moves relatively and stops at the third station S3 each time the nozzle shaft holder 13 rotates by index.

That is, the side image pickup camera 31 is provided integrally with the mounting head 8 and moves relative to the plurality of suction nozzles 20 to sequentially image the periphery of each tip 20a of the plurality of suction nozzles 20 from the side surface. To do. The side image pickup camera 31 includes a camera 31a that captures the suction nozzle 20 and a mirror 31b that guides the image of the suction nozzle 20 to the camera 31a. When mounting the component on the substrate 3, the mounting height that corrects the lowering position (mounting height of the component P) of the nozzle shaft 17 in consideration of the recognition result of the component P sucked by the suction nozzle 20 by the side image pickup camera 31. The correction is made.

Next, the air flow path of the mounting head 8 will be described with reference to FIGS. 3 and 4. In FIG. 3, inside the nozzle shaft holder 13, a common flow path 13b is provided in the vertical direction along the rotation axis CL by opening on the upper surface of the mounting hole 13a provided in the center of the upper part of the nozzle shaft holder 13. ing. The common flow path 13b communicates with the rotating body hole 26c provided inside the rotating body 26 that fits into the mounting hole 13a. The hole 26c in the rotating body leads to a negative pressure generation source (not shown) via a pipe 32 connected to the upper end portion of the rotating body 26 (arrow e).

In FIG. 4, valve units 33 (12 in this case) are arranged between the common flow path 13b and each through hole 16 inside the nozzle shaft holder 13. Each valve unit 33 communicates with the common flow path 13b via a holder lateral hole 13c formed inside the nozzle shaft holder 13. Further, each valve unit 33 has a connection hole 13d formed inside the nozzle shaft holder 13, a communication gap 16b of each through hole 16, an opening 17c that opens through the outer peripheral surface 17a of the nozzle shaft 17, and a nozzle. It communicates with the tip 20a of the suction nozzle 20 through a shaft inner hole 17b inside the shaft 17 and a nozzle inner hole provided inside the suction nozzle 20.

Further, each valve unit 33 is connected to the bottom surface of the nozzle shaft holder 13 via the upper connecting pipe 13e, the lower connecting pipe 13f, and the positive pressure connecting pipe 13g formed inside the nozzle shaft holding body 13, respectively. It communicates with the upper connection port 34a, the lower connection port 34b, and the positive pressure connection port 34c formed in. Air supply units 35A and 35B are arranged below the nozzle shaft holders 13 of the first station S1 and the fourth station S4, respectively. When the nozzle shaft holder 13 rotates by index and stops at the first station S1, the upper connection port 34a, the lower connection port 34b, and the positive pressure connection port 34c of the nozzle shaft 17 become the upper supply path 35Aa of the air supply unit 35A. It is connected to the lower supply path 35Ab and the positive pressure supply path 35Ac via the pad 36, respectively.

The upper connection port 34a, lower connection port 34b, and positive pressure connection port 34c of the nozzle shaft 17 stopped at the fourth station S4 are the upper supply path 35Ba, the lower supply path 35Bb, and the positive pressure supply path 35Bc of the air supply unit 35B. Are connected to each other via the pad 36. The upper supply paths 35Aa and 35Ba and the lower supply paths 35Ab and 35Bb are connected to a positive pressure source (not shown) via an on-off valve V (see FIG. 5), respectively. By controlling the on-off valve V, positive pressure is individually supplied to the upper supply paths 35Aa and 35Ba and the lower supply paths 35Ab and 35Bb at predetermined timings. Atmospheric pressure is constantly supplied to the positive pressure supply paths 35Ac and 35Bc.

In FIG. 4, each valve unit 33 switches the internal path by the positive pressure supplied from the upper connection port 34a and the lower connection port 34b, and supplies the negative pressure supplied from the common flow path 13b to the connection hole 13d. It has a function of switching to a "negative pressure supply state" or a "atmospheric pressure supply state" in which the atmospheric pressure supplied from the positive pressure supply passages 35Ac and 35Bc is supplied to the connection hole 13d. In the "negative pressure supply state", the negative pressure is supplied to the tip 20a of the suction nozzle 20, and the component P can be sucked to the tip 20a. That is, the valve unit 33 is a vacuum valve that opens and closes the supply of vacuum to the tip 20a of the suction nozzle 20.

In the "atmospheric pressure supply state", the atmospheric pressure is supplied to the tip 20a of the suction nozzle 20. Further, in the "atmospheric pressure supply state", since the path between the common flow path 13b and the connection hole 13d is blocked, the atmosphere does not flow into the common flow path 13b from the tip 20a of the suction nozzle 20 (vacuum leak). Further, the valve unit 33 is adapted to maintain a "negative pressure supply state" or an "atmospheric pressure supply state" when the positive pressure supply to the lower port 33b or the upper port 33a is stopped.

For example, in the nozzle shaft 17 in which the valve unit 33 is set to the “negative pressure supply state” in the first station S1 and the suction nozzle 20 sucks the component P, the nozzle shaft holder 13 rotates the index and the nozzle shaft holder 13 rotates from the first station S1. Even if it comes off, the component P can be continuously held. Further, for example, the nozzle shaft 17 in which the valve unit 33 is set to the “atmospheric pressure supply state” in the fourth station S4 is a negative pressure generation source even if the nozzle shaft holder 13 is index-rotated and deviates from the fourth station S4. The route leading to is maintained in a blocked state.

Next, the configuration of the control system of the component mounting device 1 will be described with reference to FIG. The control device 40 included in the component mounting device 1 is an arithmetic processing device having a CPU function. The control device 40 includes a mechanism control unit 41, a device storage unit 42, a camera indicator unit 43, a thickness calculation unit 44, a processing range setting unit 45, a component adsorption processing unit 46, a component mounting processing unit 47, and a display processing unit 48. There is. The device storage unit 42 stores the determination result data 42a, the secondary image data 42b, the thickness data 42c, and the like, in addition to the mounting work parameters required for the control of each unit by the mechanism control unit 41. The mechanism control unit 41 controls the operation of the substrate transport mechanism 2 to transport the substrate 3 so that it is positioned and held at the mounting work position, and controls the operation of the tape feeder 5 to supply the component P to the component take-out position.

Further, the mechanism control unit 41 controls the operation of the head moving mechanism 11 to move the mounting head 8 in the horizontal plane. Further, the mechanism control unit 41 controls the operation of the index drive motor 15, the elevating motor 25b, and the θ rotation motor 28, rotates the nozzle shaft holder 13 by index, and elevates and elevates the nozzle shaft 17 located at the first station S1. , Each nozzle shaft 17 is rotated by θ all at once. Further, the mechanism control unit 41 controls the operation of the on-off valve V to set the valve units 33 located at the first station S1 and the fourth station S4 to the "negative pressure supply state" or the "atmospheric pressure supply state".

In FIG. 5, the camera instruction unit 43 instructs the side image pickup camera 31 of various processes. The side image pickup camera 31 includes a camera operation control unit 50, a camera storage unit 51, and a component presence / absence determination unit 52, in addition to the camera 31a that captures an image. The camera operation control unit 50 receives an instruction from the camera instruction unit 43 and captures an image of the tip 20a of the suction nozzle 20 located at the third station S3 by the camera 31a. The camera storage unit 51 stores the processing range data 51a and the primary image data 51b.

The image captured by the camera 31a is temporarily stored in the camera storage unit 51 as primary image data 51b, then transmitted to the control device 40, linked to the imaged suction nozzle 20, and secondarily stored in the device storage unit 42. It is stored as image data 42b. The component presence / absence determination unit 52 executes a component presence / absence determination process for determining the presence / absence of the component P adsorbed on the tip 20a of the suction nozzle 20 based on the image data captured by the camera 31a. The determination result is transmitted to the control device 40, associated with the determined suction nozzle 20, and stored in the device storage unit 42 as the determination result data 42a. That is, the component presence / absence determination unit 52 is a determination unit that determines the presence / absence of the component P adsorbed on the tip 20a of the suction nozzle 20 based on the image data obtained by the side image pickup camera 31.

The component presence / absence determination unit 52 is provided on the side image pickup camera 31 or the mounting head 8. That is, the component presence / absence determination unit 52 (determination unit) is a control unit provided on the mounting head 8 or the side image pickup camera 31. Then, the component presence / absence determination unit 52 determines the presence / absence of the component P based on the image data while the camera 31a is capturing the image to be the primary image data 51b. That is, since the presence / absence determination of the component P by the component presence / absence determination unit 52 is completed before the acquired primary image data 51b is transmitted to the control device 40, the same determination is performed in the control device 40. Can be judged at high speed.

Here, the component presence / absence determination process will be described with reference to FIGS. 6 and 7. The component presence / absence determination process includes a determination based on the average brightness value of the image and a determination based on the contrast value. First, with reference to FIG. 7, the component presence / absence determination process based on the average luminance value will be described. FIG. 6A shows an image of the imaging field of view VF in which the suction nozzle 20 with the component sucking the component P is captured by the side imaging camera 31. FIG. 6B shows an image of the imaging field of view VF in which the suction nozzle 20 without a component that does not suck the component P is captured by the side imaging camera 31. A rectangular processing range R shown by a dotted line is set in the image of the imaging field of view VF. The processing range R is stored in the processing range data 51a as, for example, the coordinates of the four vertices of the rectangle in the imaging field of view VF.

In the image of the side image pickup camera 31, the region where the component P is located has high brightness due to the light reflected by the component P. Therefore, when there is a component shown in FIG. 6A, the average luminance value of the processing range R becomes high (bright). On the other hand, in the case of no component shown in FIG. 6B, the average luminance value of the processing range R is low (dark). The component presence / absence determination unit 52 calculates the average luminance value in the processing range R when all the image data in the processing range R is obtained while the camera 31a is capturing the image to be the primary image data 51b. If it is higher (bright) than the predetermined value, it is judged that there is a part, and if it is lower than the predetermined value (dark), it is judged that there is no part. In this way, the component presence / absence determination unit 52 (determination unit) determines the presence / absence of the component P based on the average luminance value within the preset processing range R in the image data.

The above description was given in the case of recognition by the reflection method, but in the case of recognition by the transmission method illumination, the average luminance value of the processing range R becomes low (dark) when there are parts, and when there are no parts. The average luminance value of the processing range R becomes high (bright). Also in this case, the component presence / absence determination unit 52 (determination unit) determines the presence / absence of the component P based on the average luminance value within the preset processing range R in the image data.

Next, with reference to FIG. 7, the component presence / absence determination process based on the contrast value will be described. FIG. 7A shows an image of the imaging field of view VF imaged by the side imaging camera 31 of the suction nozzle 20 when the component is present and FIG. 7B is the case without the component. Similar to FIG. 7, a rectangular processing range R shown by a dotted line is set in the image of the imaging field of view VF. The camera 31a scans the uppermost stage from left to right, and scans from left to right while descending one step at a time in order to take an image. The pixel IE of the processing range R has high brightness (bright) in the place where the component P is present, and low brightness (dark) in the place where the component P is not present.

When there is a component shown in FIG. 7A, a predetermined number of pixels IE having high brightness appear continuously on the component P. In the case of no component shown in FIG. 7B, high-luminance pixels IE do not appear continuously. That is, when the component P is present, a brightness difference (contrast) is generated on the scanning line SL, and when the component P is not present, the brightness difference is not generated. The component presence / absence determination unit 52 measures the brightness of the pixel IE on the scanning line SL in the processing range R while the camera 31a is capturing the image to be the primary image data 51b, and the contrast (contrast above a predetermined value) ( If a difference in brightness occurs, it is determined that there are parts, and if contrast above a predetermined value does not occur, it is determined that there are no parts. In this way, the component presence / absence determination unit 52 (determination unit) determines the presence / absence of the component P based on the contrast value within the preset processing range R in the image data.

As described above, when recognized by the transmission type illumination, the brightness value becomes low (dark) when there are parts, and the brightness value becomes high (bright) when there are no parts. Also in this case, the component presence / absence determination unit 52 (determination unit) determines the presence / absence of the component P based on the contrast value within the preset processing range R in the image data.

In FIG. 5, the thickness calculation unit 44 image-processes the secondary image data 42b to which the primary image data 51b is transferred and stored in the device storage unit 42, and the component P sucked by the tip 20a of the suction nozzle 20. The thickness calculation process for calculating the thickness T of is executed. That is, the thickness calculation unit 44 is a calculation unit that calculates the thickness T of the component P adsorbed on the tip 20a of the adsorption nozzle 20 based on the secondary image data 42b (image data) obtained by the side image pickup camera 31. .. Here, the thickness T of the component will be described with reference to the secondary image data 42b shown in FIG. The thickness calculation unit 44 recognizes the position of the tip 20a of the suction nozzle 20 and the position of the lower surface Pa of the suctioned component P by image processing, and calculates the difference between the two positions to obtain the thickness T of the component P.

The calculated thickness T of the component P is associated with the imaged suction nozzle 20 and stored in the device storage unit 42 as thickness data 42c. As described above, the thickness calculation unit 44 (calculation unit) is a control unit provided in the main body of the component mounting device 1, and the component presence / absence determination unit 52 (determination unit) determines the presence / absence of the component P and the thickness calculation unit 44. The calculation of the thickness T of the component P in the (calculation unit) is performed based on the same image data (primary image data 51b, secondary image data 42b).

The processing range setting unit 45 executes a processing range setting process for determining the processing range R used in the component presence / absence determination process for each of the plurality of (12 in this case) suction nozzles 20 of the mounting head 8. The processing range setting unit 45 rotates the nozzle shaft holder 13 by index to position the suction nozzles 20 that do not suck the component P at the third station S3 in order, and the side image pickup camera 31 moves the tip 20a of the suction nozzle 20 to the third station S3. Take an image that includes. 9 (a) and 9 (b) show examples of captured image data. The processing range setting unit 45 performs image processing on the obtained image data to recognize the position of the tip 20a of the suction nozzle 20, and sets a predetermined range including the recognized tip 20a of the suction nozzle 20 as the processing range R. ..

As shown in FIGS. 9A and 9B, the position of the tip 20a of the suction nozzle 20 depends on various factors caused by a manufacturing error of the suction nozzle 20 itself, a mounting error of the suction nozzle 20 on the nozzle holder 19, and the like. , It is different for each suction nozzle 20. FIG. 9A shows an example in which the tip 20a of the suction nozzle 20 is located at a higher position in the imaging field of view VF, and FIG. 9B shows an example in which the tip 20a of the suction nozzle 20 is located at a lower position in the imaging field of view VF. An example is shown. The processing range setting unit 45 sets the processing range R for all the suction nozzles 20 mounted on the mounting head 8, and stores the processing range data 51a associated with the suction nozzle 20 in the camera storage unit 51. That is, the preset processing range R in the image data is set for each of the plurality of suction nozzles 20 based on the image data in the state where the suction nozzle 20 does not have the component P.

In FIG. 5, the component suction processing unit 46 controls the tape feeder 5, the head moving mechanism 11, the index drive motor 15, the elevating motor 25b, the θ rotation motor 28, and the on-off valve V to supply the tape feeder 5 to the take-out position. The component suction process of picking up the machined parts P by the suction nozzle 20 located at the first station S1 in order is controlled.

The component mounting processing unit 47 controls the head moving mechanism 11, the index drive motor 15, the elevating motor 25b, and the θ rotation motor 28 to position and hold the component P sucked by the suction nozzle 20 at the component mounting work position in order. It controls the component mounting process for mounting at a predetermined mounting position on the board 3. In the component mounting process, the component mounting processing unit 47 corrects the lowering amount (mounting height of the component P) of the suction nozzle 20 based on the thickness data 42c stored in the device storage unit 42, and mounts the component P. .. The display processing unit 48 causes an image display device 49 such as a monitor connected to the control device 40 to display information necessary for the operation of the component mounting device 1, secondary image data 42b captured by the side image pickup camera 31, and the like.

Next, a component mounting method in the component mounting device 1 will be described with reference to FIGS. 10 to 13. In FIG. 10, the processing range setting unit 45 positions the suction nozzles 20 that do not suck the component P in order at the third station S3, and captures an image including the tip 20a of the suction nozzle 20 by the side image pickup camera 31. Then, the processing range setting unit 45 executes a processing range setting process for setting the processing range R for each suction nozzle 20 based on the captured image data (ST1: processing range determination step). The set processing range R is stored in the camera storage unit 51 as the processing range data 51a.

Next, the component suction processing unit 46 rotates the nozzle shaft holder 13 (rotor) by 30 degrees (ST2: first index rotation step). The state at this time is shown in FIG. In FIG. 12, the suction nozzle 20 located at the first station S1 is defined as the first suction nozzle 20 (1), and hereinafter, counterclockwise, the second suction nozzle 20 (2) to the twelfth suction nozzle 20 (12) are defined. .. The nozzle shaft holder 13 rotates clockwise by 30 degrees each time the index rotates (arrow f). Further, the state shown in FIG. 12 is defined as the rotor index I0 in FIG. 13, and for convenience, the first suction nozzle 20 (1) is represented as N1 in FIG.

In FIG. 10, the component adsorption processing unit 46 then executes the component adsorption process (ST3: component adsorption process). Next, the component adsorption process (ST13) will be described in detail with reference to FIG. In FIG. 11, first, the component suction processing unit 46 sucks the component P supplied by the tape feeder 5 to the first suction nozzle 20 (1) located at the first station S1 (ST11: component suction step). At this point, the valve unit 33 of the first suction nozzle 20 (1) is set to the “negative pressure supply state”, and a vacuum is supplied to the tip 20a of the first suction nozzle 20 (1). In FIG. 13, diagonal hatching is attached to the suction nozzle 20 in the “negative pressure supply state”.

Next, the component suction processing unit 46 rotates the nozzle shaft holder 13 by index (ST2). This is the state of the rotor index I1 shown in FIG. 13, the first suction nozzle 20 (1) moves to the second station S2, and the second suction nozzle 20 (2) is located at the first station S1. Next, the component suction processing unit 46 sucks the component P on the second suction nozzle 20 (2) (ST11). As a result, a vacuum is supplied to the tip 20a of the second suction nozzle 20 (2).

Next, the component suction processing unit 46 rotates the nozzle shaft holder 13 by index (ST2). With this, the rotor index I2 shown in FIG. 13 is reached, the first suction nozzle 20 (1) moves to the third station S3, the second suction nozzle 20 (2) moves to the second station S2, and the third suction nozzle 20 (3) is located at the first station S1. Next, the component suction processing unit 46 sucks the component P on the third suction nozzle 20 (3) (ST11). As a result, a vacuum is supplied to the tip 20a of the third suction nozzle 20 (3).

In FIG. 11, in parallel with the component suction step (ST11), the component presence / absence determination unit 52 images the first suction nozzle 20 (1) with the side imaging camera 31 (ST12), and the first suction nozzle 20 (1). Executes a component presence / absence determination process for determining whether or not the component P is adsorbed (ST13: component presence / absence determination step). When it is determined that the first suction nozzle 20 (1) is sucking the component P (Yes in ST13), the thickness calculation unit 44 sucks the first suction nozzle 20 (1) based on the secondary image data 42b. A thickness calculation process for calculating the thickness T of the component P is executed (ST14: thickness calculation step).

That is, after the component mounting device 1 performs the suction operation of the component P by the first suction nozzle 20 (1) (ST11), the tip of the first suction nozzle 20 (1) is determined by the component presence / absence determination unit 52 (determination unit). When it is determined that the component P is present in 20a (Yes in ST13), the thickness calculation unit 44 (calculation unit) calculates the thickness T of the component P to be adsorbed by the first suction nozzle 20 (1) (ST14). .. As described above, the imaging by the side image pickup camera 31 (ST12), the component presence / absence determination step (ST13), and the thickness calculation step (ST14) constitute the component presence / absence determination method by the component mounting device 1.

When the primary image data 51b is acquired by the side image pickup camera 31, the component adsorption processing unit 46 can execute the next first index rotation step (ST2) even before the thickness calculation processing (ST14) is completed. If not, the first index rotation step (ST2) is executed. That is, the thickness calculation step (ST14), the first index rotation step (ST2), the component suction step (ST11), and the imaging by the side imaging camera 31 (ST12) are executed in parallel.

After that, while the component suction process is not completed in all the suction nozzles 20 (No in ST4), the first index rotation step (ST2) and the component suction process (ST3) are repeatedly executed. That is, in FIG. 13, in the rotor index I3, the component suction processing unit 46 attracts the component P to the fourth suction nozzle 20 (4) (ST11), and the component presence / absence determination unit 52 has the second suction nozzle 20 (2) as a component. It is determined whether or not P is adsorbed (ST13).

In FIG. 13, in the rotor index I4, it is determined in the component presence / absence determination process that the third suction nozzle 20 (3) is not sucking the component P (No in ST13). In that case, in the rotor index I5 in which the third suction nozzle 20 (3) moves to the fourth station S4, the component suction processing unit 46 puts the valve unit 33 of the third suction nozzle 20 (3) in the “negative pressure supply state”. To switch to "atmospheric pressure supply state". That is, the component suction processing unit 46 closes the vacuum valve (valve unit 33) that supplies vacuum to the tip 20a of the third suction nozzle 20 (3) (ST15: vacuum valve closing step).

That is, after the suction operation of the component P is performed by the third suction nozzle 20 (3) (ST11), there is no component P at the tip 20a of the third suction nozzle 20 (3) by the component presence / absence determination unit 52 (determination unit). If it is determined (No in ST13), the vacuum valve (valve unit 33) that supplies vacuum to the tip 20a of the third suction nozzle 20 (3) is closed (ST15). As a result, a vacuum leak (atmosphere flows in) from the tip 20a of the third suction nozzle 20 (3) that does not suck the component P, the pressure of the common flow path 13b rises, and the first suction nozzle 20 (3) sucks the component P. It is possible to prevent the problem that the suction nozzle 20 (1) or the like drops the component P due to the decrease in the suction force.

Further, when it is determined in the component presence / absence determination process that the third suction nozzle 20 (3) is not sucking the component P (No in ST13), the thickness calculation unit 44 calculates the thickness of the third suction nozzle 20 (3). No processing is performed. That is, after the suction operation of the component P is performed by the third suction nozzle 20 (3) (ST11), there is no component P at the tip 20a of the third suction nozzle 20 (3) by the component presence / absence determination unit 52 (determination unit). If it is determined (No in ST13), the thickness T of the component P in the third suction nozzle 20 (3) by the thickness calculation unit 44 (calculation unit) in parallel with closing the vacuum valve (valve unit 33). Calculation is stopped (thickness calculation processing is not executed).

As a result, the thickness calculation unit 44 can cancel the thickness calculation process for the third suction nozzle 20 (3) and start the thickness calculation process for the fourth suction nozzle 20 (4) in advance. In the example of FIG. 13, it is determined that the sixth suction nozzle 20 (6) and the tenth suction nozzle 20 (10) do not suck the component P (No in ST13), and the rotor index I8 and the rotor index I12, respectively. The vacuum valve (bubble unit 33) is closed (ST15). Then, the thickness calculation process for the sixth suction nozzle 20 (6) and the tenth suction nozzle 20 (10) is canceled, and the thickness calculation process for the seventh suction nozzle 20 (7) and the eleventh suction nozzle 20 (11) is performed. It is carried forward.

The suction nozzle 20 (for example, the first suction nozzle 20 (1)) determined to be sucking the component P (Yes) in the component presence / absence determination process (ST13) is a vacuum valve at the fourth station S4. The operation change of (valve unit 33) is not executed, and the "negative pressure supply state" is maintained.

In FIG. 10, when the component suction process for the 12th suction nozzle 20 (12) in the rotor index I11 completes the component suction process for all the suction nozzles 20 (No in ST4), the component mounting processing unit 47 holds the nozzle shaft. The body 13 (rotor) is index-rotated by 30 degrees (ST5: second index rotation step). As a result, the first suction nozzle 20 (1) goes around and is located at the first station S1 (rotor index I12).

Next, the component mounting processing unit 47 executes a component mounting process for mounting the component P sucked by the first suction nozzle 20 (1) at a predetermined mounting position on the substrate 3 (ST6: component mounting process). In the component mounting process, the mounting height of each suction nozzle 20 is corrected based on the thickness T (thickness data 42c) of the component P obtained in the thickness calculation step (ST14). The component presence / absence determination process (ST13) at the third station S3 and the process of closing the vacuum valve (valve unit 33) at the fourth station S4 (ST15) are all suction nozzles 20 (12th suction nozzle 20 (12)). Up to), it is executed in parallel with the component mounting process at the first station S1.

After that, while the component mounting process is not completed in all the suction nozzles 20 (No in ST7), the second index rotation step (ST5) and the component mounting process (ST6) are repeatedly executed. That is, the components P sucked by the suction nozzle 20 are sequentially mounted at predetermined mounting positions on the substrate 3. At that time, in the third suction nozzle 20 (3), the sixth suction nozzle 20 (6), and the tenth suction nozzle 20 (10) in which the component P is not sucked, the component mounting processing step (ST6) is skipped and the next step is performed. The second index rotation step (ST5) of is executed.

In FIG. 10, when the component mounting process is completed for all the suction nozzles 20 (up to the 12th suction nozzle 20 (12)) (Yes in ST7), the process returns to the first index rotation step (ST2) and the component suction process is executed. Will be done.

As described above, the component mounting device 1 of the present embodiment is provided integrally with the mounting head 8 having a plurality of suction nozzles 20, and moves relative to the plurality of suction nozzles 20 to cause the suction nozzles. A side imaging camera 31 that sequentially images the periphery of the tip 20a of the 20 from the side surface is provided. Then, the component presence / absence determination unit 52 (determination unit) determines the presence / absence of the component P adsorbed on the tip 20a of the suction nozzle 20 based on the primary image data 51b obtained by the side image pickup camera 31, and the thickness calculation unit. Based on the secondary image data 42b obtained by the side image pickup camera 31, the thickness T of the component P adsorbed on the tip 20a of the adsorption nozzle 20 is calculated by the 44.

In this way, the suction nozzle 20 is determined by executing the determination of the presence / absence of the component P by a control unit (part presence / absence determination unit 52) different from the control unit (thickness calculation unit 44) that calculates the thickness T of the component P. The presence or absence of the component P can be determined at high speed.

In the embodiment, the so-called rotary type mounting head 8 in which the suction nozzles 20 are arranged on the circumference has been described as an example, but the present invention is not limited to this, and a plurality of suction nozzles 20 are arranged linearly. The present invention may also be applied to a mounting head of the same type. In that case, for example, a side imaging camera 31 that can be moved with respect to the suction nozzles 20 arranged in a straight line may be integrally provided on the mounting head.

The component presence / absence determination process described in the embodiment is used for determining the presence / absence of the component P at the tip 20a of the suction nozzle 20 after the component P suction operation at the first station S1, that is, determining the component suction error. I use it, but I am not limited to it. For example, it may be used for determining the so-called take-out of parts, which is a phenomenon in which the suction nozzle 20 takes home the parts P without mounting them after the mounting operation of the parts P in the first station S1.

The component thickness calculation method of the present invention has an effect that the thickness of a component in a suction nozzle can be appropriately calculated , and is useful in the field of component mounting in which a component is mounted on a substrate.

1 Component mounting device 8 Mounting head
13b Common flow path
17 Nozzle shaft 20 Suction nozzle 20a Tip 31 Side imaging camera (imaging camera)
33 Valve unit (vacuum valve)
P part R processing range (range)
T thickness

Claims (9)

It is a component thickness calculation method using a component mounting device having a rotary type mounting head in which a plurality of nozzle shafts equipped with suction nozzles for sucking components are arranged.
After starting the determination of the presence or absence of the component adsorbed on the suction nozzle based on the tip of the suction nozzle or the image including the component obtained by the imaging camera, the thickness of the component adsorbed on the suction nozzle is calculated. Then, in parallel with the determination of the presence / absence of the component, a component thickness calculation method in which a component different from the component is suctioned by a suction nozzle different from the suction nozzle . Claim 1 in which the presence or absence of the component is determined based on the primary image data captured by the imaging camera, and the thickness of the component is calculated based on the secondary image data to which the primary image data is transferred and stored. The part thickness calculation method described in. 1. If it is determined that the component is not present at the tip of the suction nozzle after the component is sucked by the suction nozzle, the vacuum valve that supplies vacuum to the tip of the suction nozzle is closed. Alternatively, the component thickness calculation method according to 2. The component thickness calculation method according to any one of claims 1 to 3, wherein when it is determined that the component is not present at the tip of the suction nozzle, the calculation of the thickness of the component in the suction nozzle is stopped. The component thickness calculation method according to any one of claims 1 to 4, wherein the determination of the presence or absence of the component and the calculation of the thickness of the component are executed as independent processes. The component thickness calculation method according to any one of claims 1 to 5, wherein the presence or absence of the component is determined by the mounting head or a control unit provided in the imaging camera. The component thickness calculation method according to any one of claims 1 to 6, wherein the thickness of the component is calculated by a control unit provided in the main body of the component mounting device. The component thickness calculation method according to any one of claims 1 to 7, wherein the tips of the suction nozzles provided on the plurality of nozzle shafts communicate with a negative pressure generation source via one common flow path. The eighth aspect of the present invention, wherein the tip of the suction nozzle communicates with the one common flow path via a vacuum valve, and the vacuum valve that supplies vacuum to the tip of the suction nozzle determined to have no component is closed. Part thickness calculation method.

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