JP2000107956A - Chip mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a foreign matter from being dropped or stuck to the upper surface of a circuit board by arranging a foreign matter falling preventing board between the circuit board and a part mounting means. SOLUTION: In this chip mounter A, a foreign matter falling preventing board B is horizontally laid between a circuit board 1 placed on an X-Y table and the mounting head of a part mounting means. The foreign matter falling preventing board B has an opening part formed in the position just above a part mounting position, so that a sucking nozzle 12 having an electronic part 14 sucked to the lower end can be vertically moved through the opening part to mount the electronic part 14 on the circuit board 1. The preventing board B prevents a foreign matter 18 such as the electronic part 14 dropped from a part feeder, a cut chip 17 of packing material, the electronic part 14 fallen from the sucking nozzle 12 moving from a part sucking position to the part mounting position, and the electronic part 14 sprung out from a waste part box 15 from being dropped onto the circuit board 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a chip mounter.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 8, a component mounting means e having a parts feeder b, a suction nozzle c, a waste component box d, etc., above a circuit board a arranged substantially horizontally.
And a chip mounter g configured to automatically mount the electronic component f on the circuit board a.

[0003]

However, foreign matter such as the electronic component f dropped from the parts feeder b, the suction nozzle c, the waste component box d, and the like, and the cut debris h of the packaging material are formed on the upper surface of the circuit board a. Dropping and adhering not only hinders the operation, but also causes a defective substrate.

[0004]

Therefore, according to the present invention, there is provided a chip mounter in which component mounting means is provided on a circuit board to mount electronic components on the circuit board from above. It is another object of the present invention to provide a chip mounter characterized in that a foreign matter drop prevention board is arranged between a component mounting means and a foreign matter is prevented from falling onto a circuit board.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention are as follows.

[0006] An X-
A Y table is arranged, a component mounting means including a parts feeder, a suction nozzle, a waste component box, etc. is arranged above the conveyor, and a foreign matter drop prevention board is arranged between the XY table and the component mounting means. The foreign matter drop prevention board is provided with an opening for inserting the electronic component to be mounted and the suction nozzle only above the position on the circuit board where the electronic component is mounted.

[0007] Then, while the circuit board conveyed by the conveyer is placed on the XY table and the position of the circuit board is adjusted, the electronic components supplied from the parts feeder by the suction nozzle are moved to the opening of the foreign matter drop prevention board. The electronic component is mounted at a predetermined position on the circuit board through the section, and unnecessary electronic components are discarded in a waste component box.

In particular, the parts feeder, suction nozzle,
Foreign matter such as electronic parts and cut debris dropped from a waste parts box or the like is prevented from falling onto the circuit board by a foreign matter drop prevention board, thereby preventing troubles in work and occurrence of defective products.

[0009]

Embodiments of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 conceptually show a chip mounter A according to the present invention.
XY disposed on the side of the conveyor for transporting the circuit board 1
It is composed of a table and component mounting means 4 arranged above the XY table.

The component mounting means 4 comprises a mounting head 5 disposed directly above the XY table and a parts feeder 6 disposed on the side of the XY table.

In the parts feeder 6, a rail 7 is laid in parallel with the conveyor, a reel base 8 is slidably mounted on the rail 7, and a large number of electronic components 14 are mounted on the reel base 8 respectively. Reel 9 wound with tape 10 wrapped by type
Is mounted, and from each reel 9, a suction nozzle described later is provided.
Numerals 12 are respectively extended to a component suction position P1 where the electronic component 14 is sucked.

The mounting head 5 is provided with a plurality of rotating heads 13 rotating around the periphery of a revolving substantially disk-shaped rotating head 11, and the suction nozzles 12 are vertically mounted on the rotating head 13 so as to be vertically movable. The suction nozzle 12 is moved to the component suction position P1 of the circuit board 1 by the sliding operation of the XY table in two orthogonal directions and the rotation of the revolving head 11 and the rotation head 13, and a discarded component box 15 described later. And can be moved across the part exhaust position P3 set above.

The suction nozzle 12 is adapted to suck or release the electronic component 14 at the lower end of the suction nozzle 12 by applying or releasing a vacuum pressure.

Then, the electronic component 14 fed from the parts feeder 6 to the component suction position P1 is suctioned to the lower end of the suction nozzle 12, and the rotation of the revolving head 11 and the rotation head 13 and the XY motion. Suction nozzle by table sliding
The electronic component 14 sucked to the lower end of the suction nozzle 12 is transported to the component mounting position P2 of the circuit board 1, and the electronic component 14 at the lower end of the suction nozzle 12 is moved to the component mounting position by moving the suction nozzle 12 up and down and releasing the vacuum pressure. It is designed to be attached to P2.

A waste component box 15 is disposed on the opposite side of the parts feeder 6 with respect to the XY table so that unnecessary electronic components are supplied from the suction nozzle 12.

In this chip mounter A, in this embodiment, a foreign matter drop prevention board B is stretched substantially horizontally between the circuit board 1 mounted on the XY table and the mounting head 5 of the component mounting means 4. Has been established.

An opening 16 is formed in the foreign matter drop prevention board B immediately above the component mounting position P2, and an electronic component 14 is sucked at the lower end through the opening 16 through the opening 16.
The electronic component 14 can be mounted on the circuit board 1 by moving the electronic component 14 up and down, and the electronic component 14 and the cutting waste 17 of the packaging material dropped from the parts feeder 6 and the component mounting position P2 from the component suction position P1. The foreign components 18 such as the electronic components 14 dropped from the suction nozzle 12 and the electronic components 14 jumping out of the waste component box 15 are prevented from falling onto the circuit board 1.

As described above, since the foreign matter 18 is prevented from dropping on the circuit board 1, it is possible to carry out the electronic component mounting work without any trouble and to prevent the occurrence of defective products.

FIG. 3 shows another embodiment in which a cutout portion 20 is formed at the side edge of the foreign matter drop prevention board B to avoid interference with other members of the parts feeder 6.

In FIG. 4, an adhesive material 21 is applied to the upper surface of the foreign matter drop prevention board B so as to prevent the electronic components 14 and the foreign matter 18 dropped from the suction nozzle 12 onto the upper surface of the foreign matter fall prevention board B from rebounding. Another embodiment is shown.

FIGS. 5 to 7 show that the electronic components 14 and foreign substances 18 which have fallen on the foreign substance drop prevention board B are removed so that they are prevented from dropping onto the circuit board 1 from the opening 16. Another embodiment is shown.

In FIG. 5, a foreign matter fall prevention wall 22 is provided around the outer peripheral edge of the foreign matter fall prevention board B, and the foreign matter fall prevention board B is connected to a suction nozzle 23 communicating with a vacuum device (not shown).
Electronic components 14 and foreign objects 18 that have swept down the top surface and fall on the top surface
Is to be removed.

In FIG. 6, the upper surface of the foreign matter fall prevention board B is swept by the rotating brush 24 to remove the electronic components 14 and the foreign matter 18 that have fallen on the upper surface.

In FIG. 7, the upper surface of the foreign matter drop prevention board B is swept by the blowing nozzle 25 communicating with the blower (not shown) to remove the electronic components 14 and foreign matter 18 that have fallen on the upper surface. .

[0026]

According to the present invention, the following effects can be obtained.

According to the first aspect of the present invention, there is provided a chip mounter in which component mounting means is provided on a circuit board to mount electronic components on the circuit board from above. In the meantime, a foreign substance drop prevention board is arranged to prevent foreign substances from dropping onto the circuit board, so that foreign substances that have conventionally occurred during electronic component mounting work can be eliminated, and the above work can be performed without trouble. And the occurrence of defective products can be prevented.

[Brief description of the drawings]

FIG. 1 is a conceptual explanatory view of a chip mounter according to the present invention.

FIG. 2 is an explanatory side view of the same.

FIG. 3 is a plan view of a foreign matter fall prevention board according to another embodiment.

FIG. 4 is a side view showing another embodiment for preventing a foreign object from falling from a foreign object drop prevention board.

FIG. 5 is a side view showing another embodiment for removing foreign matter on the foreign matter drop prevention board.

FIG. 6 is a side view showing another embodiment for removing foreign matter on the foreign matter drop prevention board.

FIG. 7 is a side view showing another embodiment for removing foreign matter on the foreign matter drop prevention board.

FIG. 8 is an explanatory side view of a conventional chip mounter.

[Explanation of symbols]

 A chip mounter B foreign matter drop prevention board 1 circuit board 4 component mounting means 14 electronic component 18 foreign matter

Claims (1)

[Claims] Claims: 1. A component mounting means is provided on a circuit board.
In a chip mounter configured to mount an electronic component on the circuit board from above, a foreign matter drop prevention board is arranged between the circuit board and the component mounting means to prevent foreign matter from falling onto the circuit board. A chip mounter characterized in that: