JPH04105399A - Installating device for electronic component - Google Patents

Abstract

PURPOSE:To enhance the certainty of a recovery and to make it possible to improve the life of a thrusting-up pin by a method wherein the thrusting-up pin for thrusing up an electronic component from the bottom of a component tape is made to operate only at the time of resuction subsequent to an inspection of an error of suction of the component. CONSTITUTION:An electronic component 2 is sucked up by a vacuum nozzle 32 from a designated component tape 91, is transferred clockwise, the state of suction of the component 2 is inspected by a sensor 71 and when the state is OK, a centering and an orientation are performed by the following component position control device 40. When an OK is not given at the place of the sensor 71, the same electronic component as the component 2 is fed once more. At the time of resuction of this component, the component 2 is pressed to the nozzle 32, which intrudes in a pocket 92, by a thrusting-up pin 99 and the component 2 is pushed out from the pocket 92 in such a way that the component 2 is held between the pocket 92 and the nozzle 32 intact.

Description

[Detailed description of the invention] (b) Industrial application field The present invention relates to an apparatus for mounting electronic components on a board.

(b) Conventional technology To attach electronic components to a board, a vacuum nozzle is usually used.There are various ways to supply components, such as taping, stick-shaped cassettes, and trays, but when using component tape, In order to prevent the vacuum nozzle from leaving any parts behind, the idea of pushing the parts up from the bottom of the part tape with pins has been proposed. Unexamined Japanese Patent Publication 1975-1
Examples thereof include Publication No. 63900'9+ and Japanese Utility Model Application No. 57-148874.

(c) Problems to be Solved by the Invention When a component is pushed up with a pin, it is possible to take it out from the component tape reliably, but it increases the number of errors in vertical suction, where the component is suctioned vertically against the vacuum nozzle. Furthermore, the pins are subject to severe wear and tear.The present invention attempts to solve this problem.

(d) Means for Solving the Problems In the present invention, the push-up pin that pushes up the electronic component from the bottom of the component tape is operated only when picking up again after detection of a pick-up error.

(E) Function Normally, the vacuum nozzle picks up electronic components without the aid of push-up pins. The push-up pin operates only when the occurrence of a suction error is detected and re-suction is performed, ensuring that the component can be removed from the tape.

(F) Embodiment FIG. 2 schematically shows the main components of the electronic component mounting apparatus 10 whose appearance is shown in FIG. 1.

20 is a component supply device, 30 is a suction transport device, 40 is a component position adjustment device, 50 is a board positioning device, and 60 is a board transfer device. The tape feeders 22 are arranged in a horizontal line, and by moving the table 21, one of the tape feeders 22 is selected. The adsorption transport device 30 is
A plurality of vacuum nozzles 32 shown in FIG. 4 are arranged around the periphery of a rotary index table 31.

The vacuum nozzle 32 is lowered from the rotary index table 31 at the required work station.The component position adjustment device 40 pinches the electronic component sucked by the vacuum nozzle 32 between four claws 42 on the rotary disk 41, and removes the electronic component from the rotary index table 31. The board positioning device 50, which performs centering and orientation, is composed of an XY child table, and places the target part of the board 1 at the component mounting position.The board transport device 60, which is composed of a loader 61 and an unloader 62, moves the board from the loader 61 to the component mounting position. The unprocessed substrate 1 is delivered to the positioning device 50, and the substrate positioning device 5
The unloader 62 receives the processed substrate 1 discharged from the unloader 62. In FIG. 2, 71 is a sensor placed at a work station in front of the component positioning device 40, 72 is a sensor placed at a work station after the component positioning device 40, and 73 is a sensor placed after the board positioning device 50. 74 is a parts disposal box arranged at the work station after the sensor 73; 75 is a nozzle selection device arranged at the work station after the parts disposal box 74 (vacuum nozzle 32 (are grouped into several groups so that the one suitable for the part can be used), the control system of the electronic component mounting device 10 is shown in FIG. and memory 82 are the main components. Control device 80
through the input/output interface 83 and the monitor CRT 84 . It is connected to the keyboard 85.

The configuration of the main parts of the tape feeder 22 is shown in FIG.
A component tape 91 that supplies electronic components 2 one by one is made of cardboard. Pockets 92 for storing electronic components 2 are punched out at a constant pitch, and electronic components 2 for surface mounting are placed in the pockets 92. , transparent cover films 93 and 94 are attached to the top and bottom surfaces. The electronic component 2 has a rectangular parallelepiped shape, and is stored in the zero-component tape 91 with its largest area side surface touching the cover film 94 that forms the bottom surface of the pocket 92.
A perforage B"7 (not shown) is formed in parallel to the 0-component tape 1o, which is engaged with a sprocket (not shown) and advanced by l pitches. 95 and tape holding plate 96
Pass through the gap and move forward horizontally. A slit 97 perpendicular to the tape feeding direction is formed near the tip of the tape holding plate 96 from one side edge, and the cover film 93
It is folded back through the slit 97 and wound around a take-up reel (not shown). A portion of the tape presser plate 96 beyond the slit 97 serves as a component presser 98 that prevents the electronic component 2 from escaping from the pocket 92 whose upper surface is exposed. Pocket 92 with top exposed
When the parts tape 9 appears from the parts holder 98,
1 is completed, and the component tape 91 temporarily stops at that position. This position is the parts pickup position. Reference numeral 99 is a push-up pin disposed at the component pickup position, and has a sharp tip. Push-up pin 9
9 passes through the through hole 100 of the tape support plate 95, breaks through the cover film 94, and enters the pocket 92.

The operation of the above device is as follows. The vacuum nozzle 32 is
Pick up the electronic component 2 from the specified component tape 91,
This is transported clockwise in FIG. That is, the electronic component 2 is first inspected for suction state by the sensor 71, and if it is OK, centering and orientation are performed in the next component positioning device N40. Subsequently, the suction state is inspected once again by the sensor 72, and if it is OK, it is mounted on the substrate I supported by the substrate positioning device 50. If the mounting fails and the vacuum nozzle 32 reaches the next work stage with the electronic component 2 still adsorbed, the sensor 73 detects this and determines that the mounting has failed. The electronic component 2 in which an abnormality has been detected is discarded in the component disposal box 74 without being mounted on the board 1. The electronic component 2 discovered by the sensor 73 is also placed in the parts disposal box 74.
be thrown away.

Now, regarding the pickup of the electronic component 2 from the component tape 91, this is normally done without the help of the push-up pin 99. That is, as shown in FIG. Pull up the electronic component 2 as shown in the figure.

Sensor 71 has a suction error (electronic parts are absent or standing)
If not detected, this pickup method continues.

If the sensor 71 does not give an OK, supply the same electronic component again (if the nozzle following the vacuum nozzle in question is picking up a different type of component according to the mounting sequence, finish mounting that component) (from)
During this re-adsorption, the push-up pin 99 is operated as shown in FIG. The push-up pin 99 presses the electronic component 2 against the vacuum nozzle 32 that has entered the pocket 92, holds the electronic component 2 between it and the vacuum nozzle 32, and pushes out the electronic component 2 from the pocket 92. The operation flow is shown in FIG. As shown.

(G) Effects of the Invention In the present invention, the vacuum nozzle normally picks up electronic components without the aid of push-up pins.

Therefore, the push-up pin wears out less and does not need to be replaced over a long period of time.When a suction error is detected and re-adsorption occurs, the push-up pin operates to push the electronic component out of the component tape, increasing the reliability of recovery. . In this way, it was possible to strike a balance between push-up pin life and device performance.

[Brief explanation of the drawing]

The figures show one embodiment of the present invention, in which Fig. 1 is a perspective view of an electronic component mounting device, Fig. 2 is a plan view showing the arrangement of main components, Fig. 3 is a control system diagram, and Fig. 4 is a perspective view of an electronic component mounting device. 6 to 6 are sectional views of main parts of the tape feeder showing different operating states, and FIG. 7 is a flowchart of the parts feeding operation. ■...Substrate, 2...Electronic component, 91...Electronic component, 91...Component tape, 93...Cover film,
32... Vacuum nozzle, 99... Push-up pin. Figure 1

Claims (1)

[Claims] (1) While peeling off the cover film of the component tape, pick up the electronic components encapsulated in the component tape one by one with a vacuum nozzle, and push up the electronic components from the bottom of the component tape to the component pickup position for those that are mounted on a board. An electronic component mounting device characterized in that a push-up pin is arranged and the push-up pin is operated only when re-chucking after detecting a suction error.