JP2011124493A - Component-mounting apparatus and method of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component-mounting apparatus and a component mounting method for suitably mounting electronic components on a circuit board, in a size larger than the rotatable range of a mounting head. <P>SOLUTION: The component-mounting apparatus 1 stops the movement of a circuit board 5, that is longer in a direction X than the movable range of a head, by clamping the circuit board at a two locations that deviate in the direction X and mounts an electronic component 20 on the circuit board, each time it stops the movement. Here, the component that is moutable only at the one stopping location is mounted at this stopping location; while the component that may be mounted at both the stopping locations is mounted at a first stopping location, when mounting priority is high (short components or components to be mounted at the lower part) or at a second stopping location, when the mounting priority is low (tall components or components to be mounted at the upper part). <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting a component supplied from a component supply device on a substrate.

As a conventional component mounting apparatus, for example, there is a technique described in Patent Document 1. In this technique, a circuit board is clamped at a plurality of stop positions shifted in the conveyance direction of the circuit board, and an electronic component is mounted at each stop position. As a result, even when the size of the circuit board is larger than the movable range of the mounting head (area where components can be mounted), electronic components can be mounted on the entire circuit board.
In addition, as described above, in which electronic components are mounted at a plurality of stop positions, the component mounting area of the circuit board is equally divided into a plurality of partial areas, and the electronic components are mounted according to a predetermined mounting order for each of the partial areas. (For example, refer to Patent Document 2).

JP 2001-31494 A JP 2004-103828 A

By the way, on the circuit board, a tall electronic component and a short electronic component are mounted adjacent to each other, or a large electronic component is mounted on a small electronic component so as to cover a large electronic component. Sometimes small electronic components are mounted on the top surface.
However, in the conventional component mounting apparatus, since these points are not taken into consideration, there is a possibility that the mounting position shift or breakage of the electronic component, the missing item, or the erroneous mounting may occur.

  That is, as shown in FIG. 13, when a tall electronic component 102a and a short electronic component 102b are mounted adjacent to each other, they are mounted at the mounting point at the first stop position and at the second stop position. The boundary with the mounting point may be set between the electronic component 102a and the electronic component 102b. In this case, after mounting the tall electronic component 102a on the circuit board 101 at the first stop position, the short electronic component 102b is mounted at the second stop position. Therefore, when the electronic component 102b is mounted, the tall electronic component 102a and the suction nozzle 103 may interfere with each other, and the position of the electronic component 102a may be shifted or damaged.

  Further, as shown in FIG. 14, when the small electronic component 102d-1 to 102d-3 is mounted so as to cover the large electronic component 102c, the electronic component 102c to be mounted thereon is mounted at the first stop position. However, the mounting point may be divided so that the electronic component 102d-3 to be mounted below is mounted at the second stop position. In this case, since the electronic component 102c is mounted on the circuit board 101 at the first stop position, the electronic component 102d-3 cannot be mounted at the correct position.

Furthermore, as shown in FIG. 15, when mounting the small electronic components 102e-1 and 102e-2 on the upper surface of the large electronic component 102f, the electronic component 102e-1 to be mounted thereon is mounted at the first stop position, The mounting point may be divided so that the electronic component 102f to be mounted below is mounted at the second stop position. In this case, the electronic component 102e-1 is directly mounted on the circuit board 101 at the first stop position.
As described above, there is a possibility that a shortage or erroneous mounting of electronic components may occur.
Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method capable of appropriately mounting an electronic component on a circuit board having a size larger than the movable range of the mounting head.

  In order to solve the above-described problem, a component mounting apparatus according to claim 1 is a component mounting apparatus that mounts a component at a predetermined position on a substrate by a suction nozzle, and includes a transport unit that transports the substrate in one direction A transport control means for controlling the transport means to stop the board at a plurality of stop positions; a mounting part setting means for setting a list of parts to be mounted on the board at each stop position; and the mounting part setting. Component mounting means for mounting a component on the substrate at each stop position based on the list set by the means, and the transfer control means can mount components by the suction nozzle at least at adjacent stop positions The plurality of stop positions are set so that a part of the region on the substrate corresponding to the range overlaps, and the mounting component setting unit is configured to determine the height of the component and the component in the overlapping region. Based on the mounting priority parts corresponding to the mounting position of the goods it is characterized by setting the list.

  In this way, the circuit board is stopped at a plurality of stop positions, and component mounting processing is performed at each stop position. At this time, the components to be mounted on the circuit board at each stop position are determined according to the height of the components and the arrangement of the components. Therefore, the components with high priority (the components with the short height or the components to be placed below) are selected first. After that, it is possible to mount a low-priority component (a tall component or a component placed on top). As a result, the components to be mounted on the circuit board can be properly mounted without causing a mounting position shift or a missing part.

Further, in the component mounting apparatus according to claim 2, in the invention according to claim 1, the mounting component setting means is configured such that the component that can be mounted on the substrate at only one stop position among the plurality of stop positions is: A component that can be mounted on the substrate at the one stop position and can be mounted on the substrate at two or more stop positions is located upstream of the two or more stop positions in the transport direction of the substrate as the mounting priority is higher. The list is set so as to be mounted at the stop position.
Thereby, the higher the priority, the faster the component can be mounted on the substrate.

Furthermore, the component mounting apparatus according to claim 3 is characterized in that, in the invention according to claim 2, the mounting component setting means sets the mounting priority higher as the height of the component is lower.
Thereby, a short component can be first mounted on the substrate, and then a tall component can be mounted on the substrate. Therefore, when mounting a short component, it is possible to prevent a mounting position shift or breakage of the component due to interference between the mounted tall component and the suction head.

According to a fourth aspect of the present invention, in the component mounting apparatus according to the second or third aspect, the mounting component setting means has a higher mounting priority as it is positioned lower among the components arranged in the vertical direction. It is characterized by setting.
As a result, it is possible to mount a component to be placed below first and then to place a component to be placed above. For this reason, it is possible to prevent a change in order or missing parts when mounting components stacked one above the other, such as when mounting a large component over a small component or mounting a small component on the top of a large component. be able to.

Furthermore, the component mounting method according to claim 5 is a component mounting method for mounting a component at a predetermined position on the substrate by the suction nozzle, and stops at a plurality of stop positions while transporting the substrate in one direction. When mounting a component on the substrate at each stop position, the plurality of regions on the substrate corresponding to the component mountable range by the suction nozzle overlap at least at adjacent stop positions. A list of components to be mounted on the board at each stop position is set based on the component mounting priority according to the height of the component and the mounting position of the component in the overlapping region. It is characterized by setting.
Thereby, it is possible to provide a component mounting method in which components to be mounted on the circuit board can be properly mounted without causing a mounting position shift or a missing part.

  According to the present invention, the component to be mounted on the circuit board at each stop position is determined based on the mounting priority in accordance with the height of the component and the vertical arrangement of the component. Components can be correctly mounted on a circuit board having a large size.

It is a top view which shows the component mounting apparatus in this invention. It is a figure explaining the stop position of a circuit board. It is a figure which shows the structure of a mounting head. It is a block diagram which shows the structure of a control system. It is a flowchart which shows the process sequence performed with a controller. It is a figure which shows the range in which components can be mounted in each stop position. It is a figure explaining operation | movement when mounting an electronic component adjacently. It is a figure explaining operation | movement when mounting an electronic component adjacently. It is a figure explaining operation | movement when mounting a large electronic component on a small electronic component. It is a figure explaining operation | movement when mounting a large electronic component on a small electronic component. It is a figure explaining operation | movement when mounting a small electronic component on the upper surface of a large electronic component. It is a figure explaining operation | movement when mounting a small electronic component on the upper surface of a large electronic component. It is a figure explaining the conventional subject when mounting an electronic component adjacent. It is a figure explaining the conventional subject when mounting a big electronic component on a small electronic component. It is a figure explaining the conventional subject when mounting a small electronic component on the upper surface of a large electronic component.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
(Constitution)
FIG. 1 is a plan view showing a component mounting apparatus according to the present invention.
In the figure, reference numeral 1 denotes a component mounting apparatus. The component mounting apparatus 1 includes a pair of transport rails 11 extending in the X direction on the upper surface of the base 10. The transport rail 11 supports both sides of the circuit board 5 and is driven by a transport motor (not shown) to transport the circuit board 5 in the X direction.

Further, the component mounting apparatus 1 includes a mounting head 12. The mounting head 12 includes a plurality of suction nozzles that suck electronic components at the bottom, and is configured to be horizontally movable on the base 10 in the XY directions by the X-axis gantry 13 and the Y-axis gantry 14.
In this component mounting apparatus 1, component supply devices 15 that supply electronic components by a tape feeder or the like are mounted on both sides of the transport rail 11 in the Y direction. The electronic component supplied from the component supply device 15 is vacuum-sucked by the suction nozzle of the mounting head 12 and mounted on the circuit board 5.

  The circuit board 5 is clamped at two positions shifted in the X direction on the transport rail 11 and stops, and components are mounted at each stop position. That is, first, as shown in FIG. 2A, the circuit board 5 is positioned at the first stop position where a part of the front side in the transport direction of the circuit board 5 enters the component mounting range (head movable range) of the suction nozzle. Is stopped and component mounting processing is performed. Next, the circuit board 5 is transported, and as shown in FIG. 2B, the circuit board 5 is stopped at the second stop position where a part on the rear side in the transport direction of the circuit board 5 enters the head movable range. The component mounting process is performed. Thus, in this embodiment, an electronic component is mounted on the circuit board 5 that is longer in the X direction than the head movable range. It should be noted that the area on the circuit board 5 (mounted area) corresponding to the component mounting range of the suction head at the first stop position overlapped with the mounted area on the circuit board 5 at the second stop position. It shall have a region.

In addition, a recognition camera 21 including a CCD camera is disposed between the component supply device 15 and the circuit board 5. The recognition camera 21 detects the electronic component suction position deviation (deviation between the center position of the suction nozzle and the center position of the suctioned component) and the suction angle deviation (tilt) of the electronic component. Is taken.
Furthermore, the component mounting apparatus 1 is provided with a nozzle changer 16 for exchanging the suction nozzle according to the size and shape of the part to be sucked. A plurality of types of nozzles are stored and managed in the nozzle changer 16.

Next, the configuration of the mounting head 12 will be described with reference to FIG.
The mounting head 12 is movable in the X direction by attaching the base 12a to the X-axis gantry 13 shown in FIG.
The mounting head 12 includes a plurality of suction nozzles 12b that suck and hold the electronic component 20. Each suction nozzle 12b can be rotated around a nozzle axis (suction axis) by a θ-axis rotation mechanism 12c, and can be moved up and down in the Z direction (height direction) by a Z-axis drive mechanism 12d.

Further, a distance sensor 22 is attached to the mounting head 12 via a support member 12e. The distance sensor 22 measures the distance (height) in the Z direction between the suction nozzle 12b and the circuit board 5 using sensor light.
FIG. 4 is a block diagram showing the configuration of the control system of the component mounting apparatus 1.
The component mounting apparatus 1 includes a controller 30 including a microcomputer including a CPU, a RAM, and a ROM that control the entire apparatus. The controller 30 is connected with the following components 31 to 41 to control each of them.

The vacuum mechanism 31 generates a vacuum and generates a negative vacuum pressure on each suction nozzle 12b via a vacuum switch (not shown).
The X-axis motor 32 is a drive source for moving the mounting head 12 in the X-axis direction along the X-axis gantry 13, and the Y-axis motor 33 is the Y-axis gantry 13 along the Y-axis gantry 14. It is a drive source for moving in the direction. With such a configuration, the mounting head 12 can move in the XY directions.

The Z-axis motor 34 is a drive source for the Z-axis drive mechanism 12d that raises and lowers the suction nozzle 12b in the Z direction. The θ-axis motor 35 is a drive source for the θ-axis rotation mechanism 12c that rotates the suction nozzle 12b around the nozzle center axis (suction axis).
In FIG. 4, only one Z-axis motor 34 and one θ-axis motor 35 are shown, but in actuality, the same number of suction nozzles 12 b are provided.

The distance measuring mechanism 36 detects the distance to the object from the reflected light of the sensor light irradiated by the distance sensor 22.
The recognition device 38 performs image recognition of the electronic component 20 sucked by each of the suction nozzles 12b, and includes an A / D converter 38a, a memory 38b, and a CPU 38c. The A / D converter 38a converts the analog image signal output from the recognition camera 21 into a digital signal (image data), and stores it in the memory 38b. Based on the image data, the CPU 38c calculates a suction position deviation amount and a suction angle deviation amount of the electronic component 20 sucked by the suction nozzle 12b.

The keyboard 39 and the mouse 40 are used for an operator to input data such as component data. The storage device 37 is configured by a flash memory or the like, and stores component data input by the keyboard 39 and the mouse 40 or component data supplied from a host computer (not shown).
The monitor 41 displays component data, calculation data, an image of the electronic component 20 captured by the recognition camera 21, and the like.

Further, the controller 30 executes a component list creation process shown in FIG. 5 to create a list of components to be mounted on the circuit board 5 at each stop position. Here, of the two stop positions, the electronic component 20 that can be mounted only at one of the stop positions is mounted at the stop position, and the electronic component 20 that can be mounted at either stop position is the mounting priority. A parts list is created so that the electronic component 20 with high priority (hereinafter simply referred to as priority) is mounted at the first stop position and the electronic component 20 with low priority is mounted at the second stop position.
That is, as shown in FIG. 5, first, in step S1, a list of all electronic components 20 mounted on the circuit board 5 is created. Here, information such as the type and size of each electronic component 20 input by the operator and the mounting position on the board is set in the list.

Next, in step S2, component information is read from the list created in step S1, and it is determined whether or not the component cannot be mounted at the first stop position. Specifically, it is determined whether or not the component is a component to be mounted in a region C (region that can be mounted only at the second stop position) shown in FIG.
If it is determined that mounting cannot be performed at the first stop position, the process proceeds to step S3, the mounting at the second stop position is set in the list, and the process proceeds to step S9 described later.

On the other hand, if it is determined in step S2 that the component can be mounted at the first stop position, the process proceeds to step S4 to determine whether or not the component cannot be mounted at the second stop position. Specifically, it is determined whether or not the component is to be mounted in the area A (area that can be mounted only at the first stop position) shown in FIG.
If it is determined that mounting cannot be performed at the second stop position, the process proceeds to step S5, and mounting at the first stop position is set in a list, and the process proceeds to step S9 described later.

On the other hand, if it is determined in step S4 that the component can be mounted at the second stop position, that is, the component is mounted in the area B shown in FIG. 6 (area that can be mounted at either stop position), the process proceeds to step S6. Then, it is determined whether the priority of the component is high. In this embodiment, an electronic component placed under a short electronic component or another electronic component is an electronic component with a high priority, and conversely, an electronic placed over a tall electronic component or another electronic component. The component is an electronic component with a low priority.
Then, if it is determined that the priority is high, the process proceeds to step S7, and mounting in the first stop position is set in the list, and the process proceeds to step S9. On the other hand, if it is determined that the priority is low, the process proceeds to step S8, the mounting at the second stop position is set in the list, and the process proceeds to step S9.

In step S9, it is determined whether or not it has been set at which stop position all the electronic components stored in the list created in step S1 are mounted. Then, when the setting of all electronic components is not completed, the process proceeds to step S2, and when the setting of all electronic components is completed, the process proceeds to step S10.
In step S10, processing for optimizing the mounting order is performed for each component mounted at the first stop position. Here, of the parts to be mounted at the first stop position, the parts with higher priority (the shorter parts, the parts to be placed below) are installed first, and the parts with lower priority (the tall parts, the upper part) The order of mounting is determined so that the components to be mounted on the device will be mounted later.

Next, in step S11, processing for optimizing the mounting order is performed for each component mounted at the second stop position in the same manner as in step S10.
In step S12, the results optimized in steps S10 and S11 are combined and stored in the storage device 37, and then the parts list creation process is terminated.
Note that the transport rail 11 corresponds to the transport means, the distance sensor 22 and the transport motor correspond to the transport control means, the processing in FIG. 5 corresponds to the mounting component setting means, the mounting head 12, the X-axis motor 32, Y The shaft motor 33 and the Z-axis motor 34 correspond to the component mounting means.

(Operation)
Next, the operation of this embodiment will be described.
First, the conveyance motor is driven, and the circuit board 5 whose length in the X direction is longer than the head movable range is moved along the conveyance rail 11. Then, the circuit board 5 is stopped at the first stop position shown in FIG. Here, when the mounting head 12 is moved to a preset first stop reference position and the distance sensor 22 installed on the mounting head 12 detects the circuit board 5 that has moved on the transport rail 11, the transport head is used. The movement of the circuit board 5 is stopped by stopping the motor.
Here, the first stop reference position is, for example, at the first stop position shown in FIG. 2A when the carry-in side of the circuit board 5 by the transport rail 11 is the upstream side and the carry-out side is the downstream side. It is set at the position of the downstream end of the circuit board 5 (downstream end of the head movable range).

  Then, at this first stop position, electronic component mounting processing is performed with reference to the component list stored in the storage device 37. That is, the controller 30 drives and controls the X-axis motor 32 and the Y-axis motor 33 to move the mounting head 12 to a predetermined component supply position, and then drives and controls the vacuum mechanism 31 from the component supply device 15 to the electronic component 20. Is vacuum-adsorbed. At this time, the recognition camera 21 confirms the suction position shift of the electronic component 20 or the like. Then, the controller 30 drives and controls the X-axis motor 32 and the Y-axis motor 33 again to move the mounting head 12 to a predetermined component mounting position on the circuit board 5, and drives and controls the Z-axis motor 34 to suck the suction nozzle 12b. Is lowered, and the electronic component 20 is mounted on the circuit board 5.

When the component mounting at the first stop position is completed, the circuit board 5 is moved downstream by the transport rail 11 and stopped at the second stop position shown in FIG. Here, when the mounting head 12 is moved to the preset second stop reference position and the distance sensor 22 installed on the mounting head 12 is in a state where the circuit board 5 on the transport rail 11 is not detected, the transport is performed. The motor is stopped and the movement of the circuit board 5 is stopped.
Here, the second stop reference position is set, for example, at the position of the upstream end of the circuit board 5 (upstream end of the head movable range) at the second stop position shown in FIG. .

At the second stop position, the electronic component mounting process is performed with reference to the component list stored in the storage device 37 in the same manner. When the component mounting at the second stop position is completed, the circuit board 5 is moved to the downstream side by the transport rail 11 and is carried out of the component mounting apparatus 1.
In this way, first, at the first stop position located upstream in the transport direction, the electronic components are mounted in the regions A and B shown in FIG. 6, and then the second stop position located downstream in the transport direction. In FIG. 6, electronic components are mounted in the regions B and C shown in FIG.

  At this time, as shown in FIG. 7, when the tall electronic component 20a and the short electronic component 20b are disposed adjacent to each other across the boundary α between the region A and the region B, the controller 30 may Is determined to be mountable at the first stop position (No in step S2 of FIG. 5) and not mountable at the second stop position (Yes in step S4). Therefore, the electronic component 20a is set in the list as a component to be mounted at the first stop position (step S5).

On the other hand, it is determined that the electronic component 20b can be mounted at the first stop position (No in Step S2) and can be mounted at the second stop position (No in Step S4). Further, since the electronic component 20b is a short component, it is determined that the priority is high (Yes in step S6). Therefore, the electronic component 20b is also set in the list as a component to be mounted at the first stop position (step S7).
Accordingly, both the electronic component 20a and the electronic component 20b are mounted at the first stop position. However, since the electronic component 20b is a component shorter than the electronic component 20a, the mounting order comes before the electronic component 20a (step S10). That is, after mounting the electronic component 20b at the first stop position, the electronic component 20a is mounted.

  In addition, as shown in FIG. 8, when the tall electronic component 20a and the short electronic component 20b are disposed adjacent to each other across the boundary β between the region B and the region C, the controller 30 includes the electronic component 20a. Is determined to be mountable at the first stop position (No in step S2) and mountable at the second stop position (No in step S4). Further, since the electronic component 20a is a tall component, it is determined that the priority is low (No in step S6). Therefore, the electronic component 20a is set in the list as a component to be mounted at the second stop position (step S8).

On the other hand, it is determined that the electronic component 20b cannot be mounted at the first stop position (Yes in step S2). Therefore, the electronic component 20b is also set in the list as a component to be mounted at the second stop position (step S3).
Accordingly, both the electronic component 20a and the electronic component 20b are mounted at the second stop position. However, since the electronic component 20b is a component shorter than the electronic component 20a, the mounting order comes before the electronic component 20a (step S11). That is, after mounting the electronic component 20b at the second stop position, the electronic component 20a is mounted.

When the tall electronic component 20a and the short electronic component 20b are mounted adjacent to each other across the boundary α and the boundary β as shown in FIGS. 7 and 8, the priority (the height of the component) is set. In a general method not considered, the mounting order is set so that the tall electronic component 20a is mounted at the first stop position and then the short electronic component 20b is mounted at the second stop position. There is. In this case, when the electronic component 20b is mounted, the mounted tall electronic component 20a and the suction nozzle 12b that sucks the electronic component 20b may interfere with each other.
On the other hand, in the present embodiment, the component to be mounted at each stop position is determined in consideration of the priority (the height of the component), so that the tall electronic component is mounted after the short electronic component is mounted. It can be mounted and interference of the suction nozzle as described above can be prevented. As a result, it is possible to prevent components from being displaced or damaged due to interference of the suction nozzle.

Next, the case where it mounts so that a large electronic component may be covered on several small electronic components is demonstrated.
As illustrated in FIG. 9, when the large electronic component 20 c is mounted on the small electronic components 20 d-1 to 20 d-3 so that the boundary α is between the electronic component 20 d-2 and the electronic component 20 d-3. It shall be located in In this case, the controller 30 can mount the electronic components 20c, 20d-1 and 20d-2 at the first stop position (No in Step S2), and cannot mount them at the second stop position (Yes in Step S4). It is determined that Therefore, the electronic components 20c, 20d-1, and 20d-2 are set in the list as components to be mounted at the first stop position (step S5).

  On the other hand, it is determined that the electronic component 20d-3 can be mounted at the first stop position (No in Step S2) and can be mounted at the second stop position (No in Step S4). Moreover, since the electronic component 20d-3 is a component mounted under other components, it determines with a high priority (it is Yes at step S6). Therefore, the electronic component 20d-3 is also set in the list as a component to be mounted at the first stop position (step S7).

  Therefore, all of these electronic components are mounted at the first stop position. However, since the electronic components 20d-1 to 20d-3 are components mounted under the electronic component 20c, the mounting order comes before the electronic component 20c (step S10). That is, after mounting the electronic components 20d-1 to 20d-3 at the first stop position, the electronic component 20c is mounted.

Also, as shown in FIG. 10, when the boundary β is located between the electronic component 20d-2 and the electronic component 20d-3, the controller 30 determines the electronic components 20c, 20d-1, and 20d-2. It is determined that mounting is possible at the first stop position (No in Step S2), and mounting is possible at the second stop position (No in Step S4).
At this time, since the electronic components 20d-1 and 20d-2 are components mounted under other components, the electronic components 20d-1 and 20d-2 are determined to have high priority (Yes in step S6) and are mounted at the first stop position. As a list (step S7). However, since the electronic component 20c is a component mounted on another component, it is determined that the priority is low (No in step S6) and set in the list as a component mounted at the second stop position (step S6). S8).

On the other hand, it is determined that the electronic component 20d-3 cannot be mounted at the first stop position (Yes in step S2). Therefore, the electronic component 20d-3 is set in the list as a component to be mounted at the second stop position (step S3).
Therefore, in this case, after mounting the electronic component 20d-1 and the electronic component 20d-2 at the first stop position, the electronic component 20d-3 and the electronic component 20c are mounted at the second stop position. Become. Here, since the electronic component 20d-3 is a component to be mounted under the electronic component 20c, the mounting order comes before the electronic component 20c (step S11). That is, after mounting the electronic component 20d-3 at the second stop position, the electronic component 20c is mounted.

Next, a case where a plurality of small electronic components are mounted on a large electronic component will be described.
As shown in FIG. 11, when the small electronic components 20e-1 and 20e-2 are mounted on the large electronic component 20f, the boundary α is located between the electronic component 20e-1 and the electronic component 20e-2. Shall. In this case, the controller 30 determines that the electronic component 20e-1 can be mounted at the first stop position (No in Step S2) and cannot be mounted at the second stop position (Yes in Step S4). Therefore, the electronic component 20e-1 is set in the list as a component to be mounted at the first stop position (step S5).

  On the other hand, it is determined that the electronic components 20e-2 and 20f can be mounted at the first stop position (No in Step S2) and can be mounted at the second stop position (No in Step S4). At this time, since the electronic component 20f is a component mounted under another component, it is determined that the priority is high (Yes in step S6) and set in the list as a component mounted at the first stop position ( Step S7). However, since the electronic component 20e-2 is a component mounted on another component, it is determined that the priority is low (No in step S6) and set in the list as a component mounted at the second stop position. (Step S8).

  Therefore, in this case, after mounting the electronic component 20f and the electronic component 20e-1 at the first stop position, the electronic component 20e-2 is mounted at the second stop position. Here, since the electronic component 20f is a component to be mounted under the electronic component 20e-1, the mounting order comes before the electronic component 20e-1 (step S10). That is, after mounting the electronic component 20f at the first stop position, the electronic component 20e-1 is mounted.

Also, as shown in FIG. 12, when the boundary β is located between the electronic component 20e-1 and the electronic component 20e-2, the controller 30 sets the first stop position for the electronic component 20e-1. It is determined that it can be mounted (No in step S2) and can be mounted at the second stop position (No in step S4).
At this time, since the electronic component 20e-1 is a component to be mounted on top, it is determined that the priority is low (No in step S6), and is set in the list as a component to be mounted at the second stop position (step S8). .

On the other hand, it is determined that the electronic components 20e-2 and 20f cannot be mounted at the first stop position (Yes in step S2). Therefore, the electronic components 20e-2 and 20f are set in the list as components to be mounted at the second stop position (step S3).
Accordingly, all of these electronic components are mounted at the second stop position. However, since the electronic component 20f is a component mounted under the electronic components 20e-1 and 20e-2, the mounting order comes before the electronic components 20e-1 and 20e-2 (step S11). That is, after mounting the electronic component 20f at the second stop position, the electronic components 20e-1 and 20e-2 are mounted.

  As shown in FIGS. 9 and 10, when mounting the large electronic component 20 c that covers the small electronic components 20 d-1 to 20 d-3 across the boundary α and the boundary β, the priority (arrangement of the components above and below) is set. In a general method not considered, the electronic component 20c to be mounted on the top is mounted at the first stop position, and the electronic component 20d-3 to be mounted below is set to be mounted at the second stop position. It may end up.

Further, as shown in FIGS. 11 and 12, when the large electronic component 20f disposed below the small electronic components 20e-1 and 20e-2 across the boundary α and the boundary β is mounted, priority (up and down of the components) In a general method that does not consider the arrangement of the electronic component 20e-1, the electronic component 20e-1 to be mounted on the upper side is mounted at the first stop position, and the electronic component 20f to be mounted on the lower side is mounted at the second stop position. It may be set to.
On the other hand, in this embodiment, the components to be mounted at each stop position are determined in consideration of the priority (arrangement of the components above and below), so the electronic components to be mounted below are mounted and then mounted on top. Electronic components to be mounted can be mounted. As a result, it is possible to prevent parts from being missing or erroneously mounted.

A case where the tall electronic component 20a and the short electronic component 20b are adjacently disposed in the overlapping region B will be described. It is determined that the electronic component 20a can be mounted at the first stop position (No in Step S2) and can be mounted at the second stop position (No in Step S4). Since the electronic component 20a is a tall component, it is determined that the priority is low (No in step S6). Therefore, the electronic component 20a is set in the list as a component to be mounted at the second stop position (step S8).
It is determined that the electronic component 20b can be mounted at the first stop position (No in Step S2) and can be mounted at the second stop position (No in Step S4). Since the electronic component 20b is a short component, it is determined that the priority is high (Yes in step S6). Therefore, the electronic component 20a is set in the list as a component to be mounted at the first stop position (step S7).

When the tall electronic component 20a and the short electronic component 20b are arranged adjacent to each other in the overlapping region B in this way, the tall electronic component 20a is mounted for the second time, and the short electronic component 20b for the first time. To be installed. Therefore, when another short electronic component 20b is also arranged in the region A, the short electronic component 20b is simultaneously sucked by a head having a plurality of nozzles, and a plurality of tall electronic components 20b are disposed in the region A and the region B. Therefore, work efficiency is high.
Similarly, in the case where another tall electronic component 20a is also arranged in the region C, the tall electronic component 20a is sucked at the same time with a head having a plurality of nozzles, and a plurality of the electronic components 20a are disposed in the region B and the region C. Since the tall component 20a can be mounted at a time, work efficiency is high.

  Next, a case where the large electronic component 20c is mounted so as to cover the small electronic components 20d-1 to 20d-3 in the overlapping region B will be described. Each of the electronic components 20d-1 to 20d-3 and the electronic component 20c is determined to be mountable at the first stop position (No in Step S2) and mountable at the second stop position (No in Step S4). The Since the electronic components 20d-1 to 20d-3 are components mounted under other components and have high priority, they are set in the list as components mounted at the first stop position (step S7). . On the other hand, since the electronic component 20c is a component mounted on another component and has a low priority, it is set in the list as a component mounted at the second stop position (step S8).

  Further, in the overlapping region B, when the small electronic components 20e-1 and 20e-2 are mounted on the large electronic component 20f, the large electronic component 20f and the small electronic components 20e-1 and 20e-2 are each 1 It is determined that mounting is possible at the second stop position (No in step S2), and mounting is possible at the second stop position (No in step S4). Since the large electronic component 20f is a component that is mounted below other components and has a high priority, it is set in the list as a component that is mounted at the first stop position (step S7). On the other hand, since the small electronic components 20e-1 and 20e-2 are components mounted on other components and have low priority, they are set in the list as components mounted at the second stop position (step S8). ).

(effect)
As described above, in the above embodiment, the circuit board having a size larger than the component mounting range of the mounting head is clamped and stopped at two positions shifted in the circuit board transport direction, and the electronic component is mounted at each stop position. I do. At this time, the electronic component to be mounted on the circuit board at each stop position is determined according to the priority according to the height of the electronic component or the vertical arrangement of the electronic component. As a result, high-priority electronic components (short electronic components and electronic components placed below) are mounted first, and then low-priority electronic components (high electronic components and electronic components placed above) ) Can be installed.

Therefore, when a tall electronic component and a short electronic component are arranged adjacent to each other, the mounted tall electronic component and the suction head interfere when mounting the short electronic component. It is possible to prevent displacement and breakage of the electronic components to be mounted. Furthermore, when electronic components are stacked one above the other, it is possible to prevent the electronic components from being mounted in the order of mounting or missing.
In this way, electronic components can be correctly mounted on the circuit board.

(Application examples)
In the above-described embodiment, the case where the circuit board 5 is clamped twice has been described, but it may be three or more times.
Moreover, in the said embodiment, although the case where the circuit board 5 was stopped in each stop position using the distance sensor 22 installed in the mounting head 12 was demonstrated, the 1st and 2nd stop reference | standard is carried out by another detection sensor. The presence or absence of the circuit board 5 at the position may be detected, and the circuit board 5 may be stopped at each stop position.

  Furthermore, although the case where the first stop reference position is the downstream end of the head movable range and the second stop reference position is the upstream end of the head movable range has been described, FIGS. For example, the second stop reference position is set at the downstream end of the circuit board 5 at the second stop position shown in FIG. The movement of the circuit board 5 may be stopped when 22 detects the circuit board 5 that has moved on the transport rail 11.

  DESCRIPTION OF SYMBOLS 1 ... Component mounting apparatus, 5 ... Circuit board, 11 ... Conveying rail, 12 ... Mounting head, 12b ... Adsorption nozzle, 12c ... θ-axis drive mechanism, 12d ... Z-axis drive mechanism, 13 ... X-axis gantry, 14 ... Y-axis Gantry, 15 ... part supply device, 16 ... nozzle changer, 20 ... electronic component, 21 ... recognition camera, 22 ... distance sensor, 30 ... controller

Claims (5)

A component mounting apparatus for mounting a component at a predetermined position on a substrate by a suction nozzle,
Transport means for transporting the substrate in one direction;
A transport control means for controlling the transport means to stop the substrate at a plurality of stop positions;
Mounting component setting means for setting a list of components to be mounted on the substrate at each stop position;
Based on the list set by the mounting component setting means, the component mounting means for mounting a component on the board at each stop position, and
The transport control means sets the plurality of stop positions so that a part of the region on the substrate corresponding to the component mountable range by the suction nozzle overlaps at least at adjacent stop positions;
The mounting component setting unit sets the list in the overlapping region based on a mounting priority of components according to a height of the component and a mounting position of the component.   The mounting component setting means mounts a component that can be mounted on the substrate at only one stop position among the plurality of stop positions, and mounts on the substrate at two or more stop positions. The list is set so that possible parts are mounted at the stop position located upstream of the two or more stop positions in the transport direction of the substrate, as the mounting priority is higher. The component mounting apparatus according to claim 1.   The component mounting apparatus according to claim 2, wherein the mounting component setting unit sets the mounting priority higher as the height of the component is lower.   4. The component mounting apparatus according to claim 2, wherein the mounting component setting unit sets the mounting priority higher as it is positioned lower among components arranged in the vertical direction. 5. A component mounting method for mounting a component at a predetermined position on a substrate by a suction nozzle,
When the substrate is transported in one direction and stopped at a plurality of stop positions, and components are mounted on the substrate at each stop position, at least the adjacent stop positions correspond to the component mounting range by the suction nozzle. The plurality of stop positions are set so that a part of the area on the board overlaps, and a list of parts to be mounted on the board at each stop position is displayed in the overlapping area. And a component mounting method, wherein the component mounting priority is set based on the mounting priority of the component according to the mounting position of the component.

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