KR20110068882A - Component mounting apparatus and component mounting method - Google Patents

Abstract

PURPOSE: A component mounting apparatus and component mounting method are provided to determine components, which are mounted on a circuit board, based on mounting priorities, thereby accurately mounting the components on the circuit board. CONSTITUTION: A returning rail(11) returns a circuit board(5) in X direction. A mounting head(12) comprises a plurality of suction nozzles which suction electronic components. The mounting head horizontally moves on a base(10) in XY direction by an X shaft gantry(13) and a Y shaft gantry(14). A component supply device(15) supplies electronic components to both sides of the returning rail. A recognition camera(21) is located between the component supply device and the circuit board.

Description

Component mounting device and component mounting method {COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD}

The present invention relates to a component mounting apparatus and a component mounting method for mounting a component supplied from a component supply apparatus on a substrate.

As a conventional component mounting method, for example, one disclosed in Patent Document 1 is known. In the method described in Patent Literature 1, when the mounting order is restricted due to the relationship between the external dimensions of the electronic component and the component holding means, the mounting order is changed to create a list. In such a case, even if the mounting order is different from the order indicated by the mounting program, the mounting program is divided into groups in which the mounted electronic parts and the component holding means do not interfere, and the list is rewritten in a new mounting order, and the list is rewritten. On the basis of this, after the mounting operation of all the components of the group being mounted is finished, the operation shifts to the mounting operation of the next group.

In addition, as shown in Patent Literature 2, recently, as in the example of mounting an LED component on a backlight substrate of a large liquid crystal panel, the circuit board is clamped by stopping at a plurality of positions in the conveying direction of the circuit board. By mounting an electronic component at a stationary position, a mounting apparatus has been developed that allows the electronic component to be mounted on the entire circuit board even when the size of the circuit board is larger than the movable head of the mounting head, that is, the area where the component can be mounted. .

[Patent Document 1] Japanese Patent Laid-Open No. H5-129794 [Patent Document 2] Japanese Patent Laid-Open No. 2001-313494

However, in the above prior art, as shown in Fig. 13, when the electronic component 102a having a high height dimension at the time of mounting and the electronic component 102b having a low height dimension at the time of mounting are mounted adjacent to each other, at the first stop position. The boundary between the mounting point to be mounted and the mounting point to be mounted at the second stop position may be set between the electronic component 102a and the electronic component 102b. In this case, after mounting the electronic component 102a having a high height dimension when mounted on the circuit board 101 at the first stop position, the electronic component 102b having a low height dimension when mounted at the second stop position is mounted. Done. For this reason, when mounting the electronic component 102b, the electronic component 102a with a high mounting height and the suction nozzle 103 may interfere, and the position of the electronic component 102a may shift or be damaged.

As shown in Fig. 14, when the large electronic component 102c is mounted on the small electronic components 102d-1 to 102d-3, the electronic component 102c to be mounted thereon is placed at the first stop position. The mounting point may be divided so that the electronic component 102d-3 to be mounted below is mounted at the second stop position. In this case, since the electronic component 102c is mounted on the circuit board 101 at the first stop position, the electronic component 102d-3 cannot be mounted at the correct position.

Furthermore, as shown in Fig. 15, when the small electronic components 102e-1 and 102e-2 are mounted on the upper surface of the large electronic component 102f, the electronic component 102e-1 mounted thereon is first stopped. The mounting point may be divided so as to mount at the position and mount the electronic component 102f to be mounted at the second stop position. In this case, the electronic component 102e-1 is mounted directly on the circuit board 101 at the first stop position.

As described above, there is a fear that defective parts or mounting errors of the electronic components may occur.

Accordingly, an object of the present invention is to provide a component mounting apparatus and component mounting method capable of appropriately mounting electronic components on a circuit board having a size larger than the movable range of the mounting head.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, the component mounting apparatus which concerns on Claim 1 is a component mounting apparatus which mounts a component in a predetermined position on a board | substrate by a suction nozzle, The conveying means which conveys the said board | substrate in one direction, and the said conveying means are carried out. Conveying control means for controlling and stopping the substrate at a plurality of stop positions, mounting part setting means for setting a list of parts to be mounted on the substrate at the respective stop positions, and a list set by the mounting part setting means. And a component mounting means for mounting a component on the substrate at each of the stop positions, wherein the transfer control means has at least a neighboring stop position corresponding to the component mounting range by the suction nozzle. The plurality of stop positions are set so that part of the upper region overlaps, and the mounting part setting means is configured to overlap the region. According, to the mounting of the component in accordance with the mounted position of the height and the parts of the first component based on the road, characterized by: setting the list.

In the component mounting apparatus according to claim 2, in the invention according to claim 1, the mounting part setting means includes a mounting priority of the component according to the height of the component and the mounting position of the component in the overlapping region. Based on the above, the list is reset.

In this way, the circuit board is stopped at a plurality of stop positions, and the mounting process of the parts is performed at each stop position. At this time, the parts to be mounted on the circuit board at each stop position are determined according to the height of the parts or the arrangement of the parts. Thereafter, a component having a low priority and having a high height during mounting or a component disposed thereon can be mounted. As a result, the component to be mounted on the circuit board can be appropriately mounted without occurrence of misalignment or defects in the mounting position.

In the component mounting apparatus according to claim 3 or 4, in the invention according to claim 1 or 2, the mounting part setting means is a component which can be mounted on the substrate only at one stop position of the plurality of stop positions. Silver is mounted at the one stop position, the component that can be mounted on the substrate at two or more stop positions, the higher the mounting priority is the stop position located on the upstream side of the substrate in the conveying direction of the two or more stop positions. To install in, characterized in that setting the list.

As a result, the higher the priority, the earlier the component can be mounted on the substrate.

Furthermore, the component mounting apparatus according to claim 5 or 6 is the invention according to claim 3 or 4, characterized in that the mounting part setting means sets the mounting priority higher as the height of the component is lower.

Thereby, the component with the low height dimension at the time of mounting can be mounted on a board | substrate first, and the component with high height dimension at the time of mounting can be mounted on a board | substrate after that. For this reason, when mounting a component with a low mounting height, it is possible to prevent the mounting position of the component from shifting or breaking due to the interference between the component having a high height during mounting and the suction head.

Furthermore, the component mounting apparatus according to claim 7 is the invention according to any one of claims 3 to 6, wherein the mounting part setting means is such that the mounting priority is increased as it is located below among the components placed in the vertical direction. It is characterized by the high setting.

Thereby, the component arrange | positioned below can be mounted first, and the component arrange | positioned after that can be mounted. For this reason, it is possible to prevent the change of order and shortcomings when the components are stacked up and down, such as when the large components are mounted on the small components so as to cover the large components, or when the small components are mounted on the upper surface of the large components.

Furthermore, the component mounting method according to claim 8 is a component mounting method in which a component is mounted at a predetermined position on a substrate by an adsorption nozzle, and stops at a plurality of stop positions while conveying the substrate in one direction. At the time of mounting the component on the substrate, at the neighboring stop positions, the plurality of stop positions are set at the same time so that a part of the region on the substrate corresponding to the component mounting possible range by the suction nozzle is overlapped. A list of parts to be mounted on the substrate at the stop position is set based on the mounting priority of the parts according to the height of the parts and the mounting positions of the parts in the overlapping area.

Thereby, the component mounting method which can mount suitably the components to be mounted on a circuit board can be suitably mounted, without a shift of a mounting position, a defect, or the like.

According to the present invention, since the parts to be mounted on the circuit board at each stop position are determined based on the height dimension at the time of mounting the parts and the mounting priority according to the vertical placement of the parts, the mounting heads can be mounted more than the component mounting range of the mounting head. The components can be correctly mounted on a circuit board having a large size.

1 is a plan view showing a component mounting apparatus in the present invention.
2 is a diagram for explaining a stop position of a circuit board.
3 is a diagram illustrating a configuration of a mounting head.
4 is a block diagram showing the configuration of a control system.
5 is a flowchart showing a processing procedure executed by the controller.
Fig. 6 is a view showing the parts mounting possible range at each stop position.
7 is a view for explaining an operation when mounting electronic components adjacently.
8 is a view for explaining an operation when mounting electronic components adjacently.
9 is a view for explaining an operation when mounting a large electronic component on a small electronic component.
FIG. 10 is a view for explaining an operation when mounting a large electronic component on a small electronic component.
FIG. 11 is a diagram illustrating an operation when mounting a small electronic component on the upper surface of the large electronic component.
FIG. 12 is a diagram illustrating an operation when mounting a small electronic component on the upper surface of the large electronic component.
It is a figure explaining the conventional subject at the time of mounting an electronic component adjacently.
14 is a view for explaining a conventional problem when mounting a large electronic component on a small electronic component.
FIG. 15 is a view for explaining a conventional problem when mounting a small electronic component on the upper surface of a large electronic component.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

(1st embodiment)

(Configuration)

1 is a plan view showing a component mounting apparatus in the present invention.

In the drawing, reference numeral 1 denotes a component mounting apparatus. This component mounting apparatus 1 is provided with a pair of conveyance rails 11 which exist in a continuous X direction on the upper surface of the base 10. As shown in FIG. The conveyance rail 11 supports both side portions of the circuit board 5 and is driven by a conveying motor (not shown) to convey the circuit board 5 in the X direction.

In addition, the component mounting apparatus 1 includes a mounting head 12. The mounting head 12 is provided with a plurality of adsorption nozzles for adsorbing electronic components in the lower part, and is mounted on the base 10 in the XY direction by the X-axis gantry 13 and the Y-axis gantry 14. It is configured to be movable horizontally.

The component mounting apparatus 1 is equipped with a component supply apparatus 15 for supplying electronic components by a tape feeder or the like on both sides of the conveyance rail 11 in the Y direction. The electronic component supplied from the component supply device 15 is vacuum sucked by the suction nozzle of the mounting head 12 and mounted on the circuit board 5.

The circuit board 5 is clamped at two locations deviated in the X direction on the transport rail 11 to be stopped, and parts are mounted at respective stop positions. That is, first, as shown in Fig. 2A, the circuit board 5 is stopped at the first stop position where a part of the front side in the conveying direction of the circuit board 5 falls within the component mounting range of the suction nozzle. To mount the component. Next, the circuit board 5 is transported, and as shown in FIG. 2 (b), the circuit board 5 is placed at the second stop position where a part of the back side of the circuit board 5 in the conveying direction is within the head movable range. ) To stop the component mounting process. Thus, in this embodiment, the electronic component is mounted on the circuit board 5 which is longer in the X direction than the head moving range. In addition, in the to-be-mounted area on the circuit board 5 corresponding to the component mounting possible range of the suction head at the first stop position, and in the to-be-mounted area on the circuit board 5 at the second stop position. , Make sure you have a duplicate area.

Further, a recognition camera 21 made of a CCD camera is disposed between the component supply device 15 and the circuit board 5. The recognition camera 21 is configured to detect an electronic component adsorbed with the suction nozzle in order to detect a shift in the suction position of the electronic component (deviation between the center position of the suction nozzle and the center position of the sucked component) or the deviation of the suction angle. It is imaging.

Furthermore, the component mounting apparatus 1 is provided with a nozzle exchanger 16 for replacing the suction nozzles according to the size and shape of the components to be sucked. A plurality of nozzles are stored and managed in the nozzle exchanger 16.

Next, the structure of the mounting head 12 is demonstrated based on FIG.

The mounting head 12 is movable in the X direction as the base 12a is attached to the X-axis gantry 13 shown in FIG.

In addition, the mounting head 12 includes a plurality of adsorption nozzles 12b for adsorbing and holding the electronic component 20. Each suction nozzle 12b is configured to be rotatable about the nozzle axis by the θ-axis rotation mechanism 12c and to be lifted up and down in the Z direction in the height direction by the Z-axis drive mechanism 12d.

Furthermore, the distance head 22 is attached to the mounting head 12 with the support member 12e interposed therebetween. The distance sensor 22 measures the height that is the distance in the Z direction between the suction nozzle 12b and the circuit board 5 by the sensor light.

4 is a block diagram showing a configuration of a control system of the component mounting apparatus 1.

The component mounting apparatus 1 is provided with the controller 30 which consists of a microcomputer provided with CPU, RAM, ROM, etc. which control the whole apparatus. Each of the structures 31 to 41 shown below is connected to the controller 30.

The vacuum mechanism 31 generates a vacuum and generates a negative pressure of vacuum at each suction nozzle 12b through a vacuum switch (not shown).

The X-axis motor 32 is a driving source for moving the mounting head 12 along the X-axis gantry 13 in the X-axis direction, and the Y-axis motor 33 moves the X-axis gantry 13 to the Y-axis gantry 14. ) Is a drive source for moving in the Y-axis direction. By this configuration, the mounting head 12 is movable in the XY direction.

The Z-axis motor 34 is a drive source of the Z-axis drive mechanism 12d for raising and lowering the suction nozzle 12b in the Z direction. The θ-axis motor 35 is a drive source of the θ-axis rotation mechanism 12c that rotates the suction nozzle 12b about its nozzle center axis.

In addition, in FIG. 4, only one Z-axis motor 34 and one θ-axis motor 35 are shown, but in fact, the number of suction nozzles 12b is provided.

The distance measuring mechanism 36 detects the distance from the reflected light of the sensor light irradiated by the distance sensor 22 to the object.

In addition, the recognition device 38 performs image recognition of the electronic component 20 adsorbed to each of the adsorption nozzles 12b, and performs the A / D converter 38a, the memory 38b, and the CPU 38c. Equipped. The A / D converter 38a converts the analog image signal output from the recognition camera 21 into image data obtained by digital signal conversion and stores it in the memory 38b. The CPU 38c calculates the suction position shift amount and the suction angle shift amount of the electronic component 20 sucked by the suction nozzle 12b based on the image data.

The keyboard 39 and the mouse 40 are used for the operator to input data such as part data. The storage device 37 is composed of a flash memory or the like and stores part data input by the keyboard 39 and the mouse 40 or part data supplied from a host computer (not shown).

The monitor 41 displays component data, calculation data, an image of the electronic component 20 captured by the recognition camera 21, and the like.

In addition, the controller 30 performs the parts list creation process shown in Fig. 5 to create a list of parts to be mounted on the circuit board 5 at each stop position. Here, the electronic component 20 which can be mounted only at one of the two stop positions is mounted at the stop position, and the electronic component 20 which can be mounted at any stop position has a mounting priority (hereinafter, simply ' The parts list is made so that the electronic component 20 with high priority is mounted at the first stop position, and the electronic component 20 with low priority is mounted at the second stop position.

That is, as shown in FIG. 5, first, in step S1, a list of all the electronic components 20 mounted on the circuit board 5 is created. Here, information such as the type and size of each electronic component 20 input by the operator and the mounting position on the substrate is set in the list.

Next, in step S2, part information is read from the list created in step S1, and it is determined whether or not the part cannot be mounted at the first stop position. Specifically, it is determined whether the component is a component mounted in the area C that can be mounted only at the second stop position shown in FIG.

If it is determined that it is impossible to mount at the first stop position (Yes in step S2), the process proceeds to step S3, sets the list to be mounted at the second stop position, and proceeds to step S9 described later.

On the other hand, if it is determined in the step S2 that it can be mounted at the first stop position (No in step S2), the flow advances to step S4 to determine whether or not the component is not mountable at the second stop position. Specifically, it is determined whether or not the component is mounted in the area A that can be mounted only at the first stop position shown in FIG.

If it is determined that it is impossible to mount at the second stop position (Yes in step S4), the process proceeds to step S5, sets to be loaded in the first stop position in the list, and the process proceeds to step S9 described later.

On the other hand, if it is determined in step S4 that the component can be mounted in the second stop position, that is, the component is mounted in the mountable area B in any stop position shown in Fig. 6 (No in step S4), the process goes to step S6. Then, it is determined whether or not the priority of the part is high. In this embodiment, an electronic component having a low height dimension upon mounting or an electronic component disposed below another electronic component is a high priority electronic component. The electronic component to be arranged is a low priority electronic component.

If it is determined that the priority is high (Yes in step S6), the processing proceeds to step S7, where a list to be mounted at the first stop position is set in the list, and the processing proceeds to step S9. On the other hand, if it is determined that the priority is low (No in step S6), the processing proceeds to step S8, where a list to be mounted at the second stop position is set in the list, and the processing proceeds to step S9.

In step S9, it is determined whether or not a stop position is set for all the electronic components stored in the list created in step S1. If all the electronic components have not been set (No in step S9), the process proceeds to step S2. If all the electronic components have been set (Yes in step S9), the process proceeds to step S10.

In step S10, a process of optimizing the mounting order is performed for each component to be mounted at the first stop position. Here, among the components to be mounted at the first stop position, a component having a low height during mounting, which is a high-priority component, or a component placed below is mounted first, and a component having a high height during mounting, which is a low-priority component, is mounted first. The mounting order is determined so as to mount the component or the component disposed thereon later.

Next, in step S11, processing for optimizing the mounting order is performed for each component mounted at the second stop position in the same manner as in step S10.

In step S12, the results of the optimization in the above steps S10 and S11 are combined and stored in the storage device 37, and then the parts list creation process is completed.

In addition, the conveying rail 11 corresponds to the conveying means, the distance sensor 22 and the conveying motor correspond to the conveying control means, the processing of FIG. 5 corresponds to the mounting part setting means, the mounting head 12, X-axis motor 32, Y-axis motor 33 and Z-axis motor 34 correspond to the component mounting means.

(action)

Next, operation | movement of this embodiment is demonstrated.

First, the conveying motor is driven to move the circuit board 5 with a length in the X direction longer than the head moving range along the conveying rail 11. Then, the circuit board 5 is stopped at the first stop position shown in Fig. 2A. Here, the circuit in which the mounting head 12 is moved to the first stop reference position set in advance, and the distance sensor 22 installed in the mounting head 12 has moved on the transport rail 11 from the distance detection error state. When the board | substrate 5 reaches a detectable range and it became a detectable state, the conveyance motor is stopped and the movement of the circuit board 5 is stopped.

Here, the first stop reference position is, for example, the first stop shown in Fig. 2 (a) when the carry-in side of the circuit board 5 by the transfer rail 11 is the upstream side and the carry-out side is the downstream side. The circuit board 5 at the position is set to the position at the downstream end of the head moving range.

At this first stop position, the electronic component placement process is performed with reference to the parts list stored in the storage device 37. That is, the controller 30 drives the X-axis motor 32 and the Y-axis motor 33 to drive the mounting head 12 to a predetermined component supply position, and then drives the vacuum mechanism 31 to drive the component. The electronic component 20 is vacuum-absorbed from the supply device 15. At this time, the suction position shift of the electronic component 20 is confirmed by the recognition camera 21, and the like. Then, the controller 30 drives the X-axis motor 32 and the Y-axis motor 33 again to move the mounting head 12 to a predetermined component placement position on the circuit board 5, and then the Z-axis motor ( 34. The electronic component 20 is mounted on the circuit board 5 by driving control 34 to lower the suction nozzle 12b.

When the component mounting at the first stop position is completed, the circuit board 5 is moved downstream by the conveyance rail 11 to stop at the second stop position shown in Fig. 2B. Here, the mounting head 12 is moved to a preset second stop reference position, and the distance sensor 22 provided on the mounting head 12 detects the distance to the circuit board 5 on the transport rail 11. When the error state is reached, the transfer motor is stopped to stop the movement of the circuit board 5.

Also, at the second stop position, the electronic component mounting process is performed with reference to the parts list stored in the storage device 37 in the same manner. When the component mounting at the second stop position is completed, the circuit board 5 is moved downstream by the conveyance rail 11 and carried out to the outside of the component mounting apparatus 1.

In this way, first, the electronic component is mounted in the areas A and B shown in FIG. 6 at the first stop position located on the upstream side in the conveying direction, and then the second stop position positioned on the downstream side in the conveying direction. In FIG. 6, electronic components are mounted in the regions B and C shown in FIG.

At this time, as shown in FIG. 7, the electronic component 20a having a high height dimension at the time of mounting and the electronic component 20b having a low height dimension at the time of mounting are placed across the boundary α between the area A and the area B. As shown in FIG. In the case of adjoining arrangement, the controller 30 can be mounted at the first stop position in step S2 of FIG. 5 with respect to the electronic component 20a, and can be mounted at the first stop position in step S4, and cannot be mounted in the second stop position. Determined to be. For this reason, in step S5, the electronic component 20a is set in the list as a component to be mounted at the first stop position.

On the other hand, the electronic component 20b is determined to be mountable at the first stop position at No. 1 in step S2 and to be mounted at the first stop position at No. 1 in step S4. In addition, since the electronic component 20b is a component with a low height dimension at the time of mounting, it becomes Yes in step S6, and it determines with high priority. For this reason, the electronic component 20b is also set in the list as a component to be mounted at the first stop position in step S7.

Therefore, the electronic component 20a and the electronic component 20b are both mounted at the first stop position. However, since the electronic component 20b is a component having a lower height dimension at the time of mounting than the electronic component 20a in step S10, the mounting order is earlier than the electronic component 20a. That is, the electronic component 20a is mounted after mounting the electronic component 20b at the first stop position.

In addition, as shown in FIG. 8, the electronic component 20a having a high height dimension at the time of mounting and the electronic component 20b having a low height dimension at the time of mounting are adjacent to each other across the boundary β between the area B and the area C. As shown in FIG. In the case of arrangement, since the controller 30 becomes No in step S2 with respect to the electronic component 20a, it can be mounted in the first stop position and becomes No in step S4, so that it can be mounted in the second stop position. Determine. In addition, since the electronic component 20a is a component with high mounting height dimension which becomes No in step S6, it determines with a low priority. For this reason, the electronic component 20a is set in the list as a component to be mounted at the second stop position in step S8.

On the other hand, with respect to the electronic component 20b, it becomes Yes in step S2, and it is determined that it cannot be mounted in the 1st stop position. For this reason, the electronic component 20b is also set in the list as a component to be mounted at the second stop position in step S3.

Therefore, both the electronic component 20a and the electronic component 20b are mounted in the 2nd stop position. However, since the electronic component 20b is a component having a lower height dimension when mounted than the electronic component 20a, the mounting order is earlier than the electronic component 20a in step S11. That is, the electronic component 20a is mounted after the electronic component 20b is mounted in the second stop position.

As shown in FIG. 7 and FIG. 8, when mounting the electronic component 20a having a high height dimension at the time of mounting and the electronic component 20b having a low height dimension at the time of mounting it across the boundary α or the boundary β, In the method without considering the figure, the electronic component 20a having the high height dimension when mounted at the first stop position is mounted so as to mount the electronic component 20b having the low height dimension when mounted at the second stop position. The order may be set. In this case, when the electronic component 20b is mounted, there is a possibility that the mounted electronic component 20a having a high mounted height dimension and the suction nozzle 12b which adsorbed the electronic component 20b interfere with each other.

In contrast, in the present embodiment, since the components to be mounted at each stop position are determined in consideration of the priority, the electronic components having a high height dimension at the time of mounting can be mounted after mounting the electronic components having a low height dimension at the time of mounting. It is possible to prevent the interference of the adsorption nozzle as described above. As a result, it is possible to prevent the mounting position of the component from shifting or breaking due to the interference of the suction nozzle.

Next, the case where a large electronic component is mounted on a plurality of small electronic components so as to be covered will be described.

As shown in Fig. 9, when the large electronic component 20c is mounted on the small electronic components 20d-1 to 20d-3 so as to cover the boundary α, the boundary α is the electronic component 20d-2 and the electronic component ( 20d-3). In this case, the controller 30 becomes No in step S2 for the electronic parts 20c, 20d-1, and 20d-2, and can be mounted at the first stop position, and in step S4, the controller 30 becomes Yes. It is determined that mounting is impossible at the stop position. For this reason, in step S5, the electronic components 20c, 20d-1, and 20d-2 are set in the list as components for mounting at the first stop position.

On the other hand, with respect to the electronic component 20d-3, it becomes No in step S2 and can be mounted in the first stop position, and since it becomes No in step S4, it is determined that it can be mounted in the second stop position. In addition, since the electronic component 20d-3 is a component mounted below other components, it is determined to be Yes in step S6, and it is determined that the priority is high. For this reason, the electronic component 20d-3 is also set in the list as a component to be mounted at the first stop position in step S7.

Therefore, all of these electronic components are mounted at the first stop position.

However, since the electronic parts 20d-1 to 20-d-3 are parts mounted below the electronic part 20c, the mounting order is earlier than the electronic part 20c in step S10. That is, the electronic component 20c is mounted after mounting the electronic components 20d-1 to 20d-3 at the first stop position.

In addition, as shown in FIG. 10, when the boundary β is located between the electronic component 20d-2 and the electronic component 20d-3, the controller 30 is the electronic component 20c, 20d-1. And 20d-2), it becomes No in step S2 and can be mounted in the first stop position, and since it becomes No in step S4, it is determined that it can be mounted in the second stop position.

At this time, since the electronic parts 20d-1 and 20d-2 are parts mounted below other parts, the electronic parts 20d-1 and 20d-2 are determined to be Yes at step S6, and have a high priority, and are mounted at the first stop position in step S7. It is set to a list as a part to be made. By the way, since the electronic component 20c is a component mounted on the other component, it determines with No at step S6, and has low priority, and sets it in a list as a component mounted at the 2nd stop position in step S8.

On the other hand, for the electronic component 20d-3, it is Yes in step S2, and it is determined that it cannot be mounted in the 1st stop position. For this reason, about the electronic component 20d-3, it sets in a list as a component mounted in the 2nd stop position in step S3.

Therefore, in this case, after mounting the electronic component 20d-1 and the electronic component 20d-2 at the first stop position, the electronic component 20d-3 and the electronic component 20c at the second stop position. ) Will be mounted. Here, since the electronic component 20d-3 is a component mounted below the electronic component 20c, the mounting order is earlier than the electronic component 20c in step S11. That is, the electronic component 20c is mounted after mounting the electronic component 20d-3 at the second stop position.

Next, the case where a plurality of small electronic components are mounted on the large electronic components will be described.

As shown in Fig. 11, when the small electronic components 20e-1 and 20e-2 are mounted on the large electronic component 20f, the boundary α is the electronic component 20e-1 and the electronic component 20e-2. It is assumed to be located in between. In this case, the controller 30 determines that the electronic component 20e-1 is No at step S2 and can be mounted at the first stop position, and yes at step S4, so that the controller 30 cannot be mounted at the second stop position. do. For this reason, the electronic component 20e-1 is set in the list as a component to be mounted at the first stop position in step S5.

On the other hand, with respect to the electronic parts 20e-2 and 20f, it becomes No in step S2 and can be mounted in the 1st stop position, and since it becomes No in step S4, it is determined that it can be mounted also in the 2nd stop position.

At this time, since the electronic component 20f is a component to be mounted under other components, it is determined to be Yes in step S6, and therefore, it is determined that the priority is high, and it is set in the list as the component to be mounted at the first stop position in step S7. do. By the way, since the electronic component 20e-2 is a component mounted on another component, since it becomes No in step S6, it is determined that priority is low, and it sets to a list as a component mounted in the 2nd stop position in step S8. .

Therefore, in this case, after mounting the electronic component 20f and the electronic component 20e-1 in the 1st stop position, the electronic component 20e-2 is mounted in the 2nd stop position. Here, since the electronic component 20f is a component to be mounted below the electronic component 20e-1, the mounting order is earlier than the electronic component 20e-1 in step S10. That is, the electronic component 20e-1 is mounted after mounting the electronic component 20f at the first stop position.

In addition, as shown in FIG. 12, when the boundary β is located between the electronic component 20e-1 and the electronic component 20e-2, the controller 30 includes the electronic component 20e-1. In step S2, it is determined that the device can be mounted at the first stop position, and since it becomes No at step S4, it is determined that it can be mounted at the second stop position.

At this time, since the electronic component 20e-1 is a component to be mounted thereon, the electronic component 20e-1 is determined to be No at step S6 and has a low priority, and is set in the list as the component to be mounted at the second stop position in step S8.

On the other hand, with respect to the electronic parts 20e-2 and 20f, it becomes Yes in step S2, and it determines with being impossible to mount in the 1st stop position. For this reason, the electronic parts 20e-2 and 20f are set in the list as the parts to be mounted at the second stop position in step S3.

Therefore, all of these electronic components are mounted at the second stop position.

However, since the electronic component 20f is a component mounted below the electronic components 20e-1 and 20e-2, the mounting order is earlier than the electronic components 20e-1 and 20e-2 in step S11. In other words, the electronic components 20e-1 and 20e-2 are mounted after the electronic components 20f are mounted in the second stop position.

As shown in Figs. 9 and 10, when a large electronic component 20c is mounted on the electronic component 20d-1 to 20d-3 over the boundary α or β, priority is not taken into account. In the method, the electronic component 20c to be mounted above is mounted at the first stop position, and the electronic component 20d-3 to be mounted below may be set to be mounted at the second stop position.

In addition, as shown in FIG. 11 and FIG. 12, when mounting the large electronic component 20f arrange | positioned under the small electronic components 20e-1 and 20e-2 over the boundary (alpha) or the boundary (beta), In a method not considering the drawing, the electronic component 20e-1 to be mounted above is mounted at the first stop position, and the electronic component 20f to be mounted below is set to be mounted at the second stop position. have.

In contrast, in the present embodiment, since the components to be mounted at each stop position are determined in consideration of the priority, the electronic components to be mounted above can be mounted after mounting the electronic components to be mounted below. As a result, parts shortages and mounting errors can be prevented.

In addition, the case where the electronic component 20a high in mounting height and the electronic component 20b in low mounting height is arrange | positioned adjacent to the area | region B which overlaps is demonstrated. The electronic component 20a is determined to be mounted at the first stop position at No. 1 in step S2, and to be mounted at the first stop position at No. 1 in step S4. Since the electronic component 20a is a component with a high height dimension at the time of mounting, it becomes No at step S6, and it determines with low priority. For this reason, the electronic component 20a is set in the list as a component to be mounted at the second stop position in step S8.

The electronic component 20b is determined to be mounted at the first stop position at No. 1 in step S2 and to be mounted at the first stop position at No. 1 in step S4. Since the electronic component 20b is a component with a low height dimension at the time of mounting, it becomes Yes in step S6, and it determines with high priority. For this reason, in step S7, the electronic component 20a is set in the list as a component to be mounted at the first stop position.

In this case, when the electronic component 20a having a high height dimension and the electronic component 20b having a low height dimension are disposed adjacent to each other in the overlapping area B, the electronic component 20a having a high height dimension upon mounting is placed. It mounts on the 2nd time, and mounts the electronic component 20b with low height dimension at the time of mounting. Therefore, in the case of disposing other electronic parts 20b having a low height dimension upon mounting in the area A, the head having a plurality of nozzles simultaneously absorbs the electronic parts 20b having a low height dimension upon mounting, A plurality of electronic components 20b having a low height dimension at the time of mounting in the region A and the region B can be mounted at a time, and thus work efficiency is high.

Similarly, when disposing other electronic parts 20a having a high height dimension at the time of mounting in the area C, the head having a plurality of nozzles simultaneously adsorbs the electronic parts 20a having a high height dimension at the time of mounting, A plurality of parts 20a having a high height dimension at the time of mounting in the area B and the area C can be mounted at a time, and thus work efficiency is high.

Next, a case where the large electronic component 20c is mounted on the small electronic components 20d-1 to 20d-3 in a overlapping area B will be described. The electronic parts 20d-1 to 20d-3 and the electronic part 20c can be mounted at the first stop position at No. 1 in step S2 and can be mounted at the second stop position because they are No at step S4. It is determined that. The electronic parts 20d-1 to 20d-3 are parts mounted below other parts, and therefore have high priority, and therefore, the electronic parts 20d-1 to 20d-3 are set in the list as parts to be mounted at the first stop position in step S7. On the other hand, since the electronic component 20c is a component mounted on the other component and has a low priority, it is set in the list as the component to be mounted at the second stop position in step S8.

Further, in the overlapping area B, when the small electronic components 20e-1 and 20e-2 are mounted on the large electronic component 20f, the large electronic component 20f and the small electronic components 20e-1 and 20e-2) becomes No at step S2, and can be mounted at the first stop position, respectively, and since it becomes No at step S4, it is determined that it can be mounted at the second stop position. Since the large electronic component 20f is a component that is mounted below other components and has high priority, the large electronic component 20f is set in the list as the component to be mounted at the first stop position in step S7. On the other hand, the small electronic parts 20e-1 and 20e-2 are parts mounted on the other parts, and therefore have low priority, and thus are set in the list as parts mounted at the second stop position in step S8.

(effect)

As described above, in the present embodiment, the circuit board having a size larger than the component mounting possible range of the mounting head is clamped and stopped at two places out of the conveying direction of the circuit board, and the electronic component is mounted at each stop position. At this time, the mounting order of the electronic parts mounted on the circuit board at each stop position is determined according to the priority of the height of the electronic parts or the vertical arrangement of the electronic parts. As a result, the electronic parts having a low height dimension at the time of mounting or the electronic parts disposed below are first mounted as high priority electronic parts, and then have the same priority as the electronic parts having a high height dimension at the time of mounting or electronic parts disposed thereon. Low electronic components can be mounted.

Therefore, when the electronic component having the high height dimension at the time of mounting and the electronic component having the low height dimension at the time of mounting are adjacent to each other, when the electronic component having the low height dimension at the time of mounting is mounted, As the suction head interferes, the mounting position of the electronic components can be prevented from being shifted or damaged. In addition, when the electronic components are mounted on top of each other, it is possible to prevent a change in the mounting order of the electronic components and a defective article.

In this way, the electronic component can be correctly mounted on the circuit board.

(Application example)

In the above embodiment, the case where the clamping of the circuit board 5 is performed in two circuits has been described, but it may be three or more times.

In the above embodiment, the case where the circuit board 5 is stopped at each stop position by using the distance sensor 22 provided in the mounting head 12 is described. 2 The presence or absence of the circuit board 5 at the stop reference position may be detected, and the circuit board 5 may be stopped at each stop position.

Moreover, the case where the first stop reference position is the downstream end of the head movable range and the second stop reference position is the upstream end of the head movable range has been described, but it is shown in Figs. 2 (a) and (b). The circuit board 5 can be stopped in the state. For example, the second stop reference position is set to the downstream end of the circuit board 5 at the second stop position shown in FIG. When the sensor 22 detects the height of the circuit board 5 which has moved on the conveyance rail 11, the movement of the circuit board 5 may be stopped.

1: Component mounting device
5: Circuit Board
11: return rail
12: mounting head
12b: adsorption nozzle
12c: θ axis drive mechanism
12d: Z axis drive mechanism
13: X axis gantry
14: Y axis gantry
15: parts supply device
16: nozzle changer
20: Electronic component
21: recognition camera
22: distance sensor
30: controller

Claims (8)

Conveying means for conveying the substrate in one direction,
Conveyance control means for stopping the substrate at a plurality of stop positions;
Mounting part setting means for setting a list of parts to be mounted on the substrate at the respective stop positions;
A component mounting means for mounting a component on the substrate at each stop position based on a list set by the mounting component setting means,
A component mounting apparatus for mounting a component at a predetermined position on the substrate by a suction nozzle,
The conveyance control means sets the plurality of stop positions so that a part of the region on the substrate corresponding to the component placement possible range by the suction nozzle is overlapped, at least in a neighboring stop position,
And said mounting part setting means sets the list in the overlapping area based on the height of the part and the mounting priority of the part according to the mounting position of the part. The method of claim 1,
And said mounting part setting means resets said list in said overlapping area on the basis of the mounting priority of the parts according to the height of said parts and the mounting position of said parts. The method of claim 1,
The mounting part setting means may be a component that can be mounted on the substrate only at one stop position of the plurality of stop positions, and the component that can be mounted on the substrate at two or more stop positions, And the list is set to be mounted at a stop position located upstream of the substrate in the conveyance direction among the two or more stop positions as the mounting priority is higher. The method of claim 2,
The mounting part setting means may be a component that can be mounted on the substrate only at one stop position of the plurality of stop positions, and the component that can be mounted on the substrate at two or more stop positions, And the list is set to be mounted at a stop position located upstream of the substrate in the conveyance direction among the two or more stop positions as the mounting priority is higher. The method of claim 3, wherein
And said mounting component setting means sets the mounting priority as the height of said component is lower. The method of claim 4, wherein
And said mounting component setting means sets the mounting priority as the height of said component is lower. The method according to any one of claims 3 to 6,
And said mounting component setting means sets the mounting priority higher as it is located below among the components arranged in the vertical direction. A component mounting method for mounting a component at a predetermined position on a substrate by a suction nozzle,
When the substrate is stopped at a plurality of stop positions while conveying the substrate in one direction, and the components are mounted on the substrate at each stop position, at least the adjacent stop positions correspond to the possible parts mounting range by the suction nozzle. While setting the plurality of stop positions so that a part of the region on the substrate overlaps,
A list of parts to be mounted on the substrate at the respective stop positions is set based on the mounting priority of the parts according to the height of the parts and the mounting positions of the parts in the overlapping area. How to mount.

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