JP4763430B2 - Surface mounter and mounting method - Google Patents

Description

The present invention relates to a surface mounting machine Contact and mounting method for mounting an electronic component on a substrate.

  Conventionally, an electronic component such as an IC is sucked from an electronic component supply unit by a movable head unit having a suction head, and transferred to a fixed printed board that is carried to a predetermined stop position by a conveyor or the like. A surface mounter (hereinafter referred to as “mounter”) that is mounted at a predetermined position on a printed circuit board is known. Some mounting machines of this type have a plurality of board stop positions (hereinafter referred to as “stop positions”) on one conveyor (see, for example, Patent Documents 1 to 3). In such a mounting machine having a plurality of stop positions, the board can be stopped at each stop position, and an electronic component can be mounted at each stop position. Thereby, for example, even with a large substrate exceeding the operable range of the head unit, electronic components can be mounted.

JP 2001-31494 A JP 2003-188599 A JP 2004-103828 A

  However, depending on the size of the substrate and the arrangement of electronic components to be mounted on the substrate in the electronic component supply unit, it is possible to mount on a large substrate only by mounting electronic components at a plurality of predetermined stop positions. It was not always possible to shorten the tact time. For this reason, production efficiency could not be improved.

Accordingly, the present invention has been made to solve the above problems, and an object thereof is to provide a surface mounting machine Contact and mounting method can improve the production efficiency.

In order to solve the above-described problems, a surface mounting machine according to the present invention includes a transport unit that transports a substrate, and a transport control unit that controls the transport unit to stop the substrate being transported at a predetermined stop position. A component supply unit that supplies a component to be transferred to the substrate, a suction head that absorbs the component, a head unit that transfers the component from the component supply unit onto the substrate carried to the stop position, and the head unit If the size of the board exceeds the area where the head unit can move, and the transfer control unit that determines the parts to be transferred on the board, the area on the board is divided and the electronic components to be transferred to this area are set A transfer control unit that stops a substrate having a size exceeding the area in which the head unit is movable at a plurality of stop positions, and the transfer control unit moves the substrate on the substrate stopped at each stop position. This part Determined according to the time required for the transfer at each stop position, a plurality of transfer possible components on the substrate in only one stop position of the stop position, it is transferred in one stop position, a plurality of stop positions The component that can be transferred onto the substrate is transferred at the stop position where the time required for transfer is the shortest, and the arithmetic unit can move the head unit when the substrate is stopped at the first stop position. The area on the substrate that protrudes from the area is the first area, and the area in which the head unit is movable when the substrate is stopped at the second stop position that is included in the area in which the first area is movable. The area on the substrate that protrudes from the substrate is set as the second area, and the area on the substrate excluding the first area and the second area is set as the third area. Set a group for each part, and in the first area The group including the electronic components to be loaded is set to be transferred when the substrate is stopped at the second stop position, and the group including the electronic components to be transferred to the second area is set to the substrate at the first stop position. Is set to be transferred when it is stopped, and a group consisting of only electronic components to be transferred to the third area is transferred to the stop position where the time required for transferring the electronic components is shorter. It is characterized by being set when it is listed.

  The transport unit includes a first fixing unit that fixes the substrate on the upstream side in the transport direction of the substrate with reference to the upstream end of the substrate, and a downstream end of the substrate on the downstream side in the transport direction. And a second fixing means for fixing the substrate. In addition, the transport unit includes a first fixing unit that fixes the substrate on the downstream side in the substrate transport direction with reference to the downstream end of the substrate, and a downstream of the first fixing unit in the transport direction. You may make it provide the 2nd fixing means which fixes a board | substrate on the side with respect to the edge part of the downstream of a board | substrate. The transport unit includes a table that moves in the transport direction of the substrate, and a fixing unit that is provided on the table and fixes the substrate on the table on the downstream side of the transport direction of the substrate with reference to the downstream end of the substrate. You may make it provide.

In addition, the mounting method according to the present invention includes a transport unit that transports a substrate, a component supply unit that supplies a component to be transferred to the substrate, and a suction head that sucks the component, and the substrate that is carried into a predetermined stop position. A mounting method for a surface mounter having a head unit for transferring a component from a component supply unit on the board. If the size of the board exceeds the area where the head unit can move, the area on the board is divided. A calculation step for setting electronic components to be transferred to this area, a stop step for stopping a substrate having a size exceeding the area where the head unit can move at a plurality of stop positions, and a substrate stopped at each stop position. And determining a part to be transferred in accordance with the time required to transfer the part at each stop position. The determination step transfers the part onto the substrate at only one stop position among the plurality of stop positions. Possible The parts are transferred at one stop position, the parts that can be transferred onto the substrate at a plurality of stop positions are transferred at the stop position with the shortest time required for transfer, and the calculation step is the first stop. When the substrate is stopped at the position, the area on the substrate that protrudes from the movable area of the head unit is the first area, and the second stop position is included in the movable area of the head unit. When the substrate is stopped, the region on the substrate that protrudes from the movable region of the head unit is set as the second region, and the region on the substrate excluding the first region and the second region is set as the third region. Then, a group is set for each electronic component that is picked up at a time by the head unit and transferred to the substrate, and the group including the electronic component to be transferred to the first region is stopped at the second stop position. Sometimes set to transfer, the second area A group including electronic components to be transferred is set to be transferred when the substrate is stopped at the first stop position, and a group consisting only of electronic components to be transferred to the third region is transferred to the electronic component. It is characterized in that it is set to transfer when it is stopped at the stop position with the shorter mounting time.

  According to the present invention, when a large substrate is carried in, the large substrate is stopped at a plurality of stop positions, and a component transferred to the large substrate at each stop position is changed according to the time required for the transfer of the component. By determining, the time required to transfer the parts can be shortened, so that the production efficiency can be improved.

  Further, according to the present invention, when a large substrate is carried in, the large substrate is stopped at a stop position different from that of other surface mounters, and a component transferred to the large substrate by each surface mounter is replaced with this component. By determining according to the time required for the transfer of the parts, the time required for the transfer of the parts can be shortened, so that the production efficiency can be improved.

[First Embodiment]
Hereinafter, a first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view of a surface mounter according to the present embodiment, FIG. 2 is a side view of the surface mounter of FIG. 1, and FIG. 3 is a block diagram showing the configuration of a control device 8 and a data creation device 9. is there.

  The surface mounter shown in FIGS. 1 to 3 is disposed on the base 1 along the longitudinal direction (X-axis direction) of the base 1 having a substantially rectangular shape in plan view, and conveys the printed circuit board P. Conveyor 2, a component supply unit 3 provided on the base 1 on both sides of the conveyor 2 and supplying electronic components, and an electronic component of the component supply unit 3 provided above the base 1 by the head unit 41. Is mounted on the substrate P, and is provided on the head unit 41. The substrate camera 5 that images the substrate P. The electronic component that is provided on the base 1 and images the electronic component carried by the head unit 41. A camera 6, a control device 7 for controlling the operation of the surface mounter disposed in the base 1 or at a position away from the base 1, a display unit 8 for performing various displays relating to the operation of the surface mounter, a LAN (Local Area Network), WAN (Wide Area Network), etc. It is connected to the control device 7 via a known communication line 10, and a data creation unit 9 that creates the operation program for controlling the operation of the surface mounting machine.

  The conveyor 2 is composed of a known conveyor that conveys the substrate in the X-axis direction, and a stopper F for stopping and fixing the substrate at a predetermined stop position at a predetermined position on the substrate conveyance path. A substrate sensor S for detecting the presence or absence of the substrate is embedded. In the present embodiment, two stoppers F and two substrate sensors S are provided. In the following description, the substrate carry-in side by the conveyor 2 is called the upstream side, and the substrate carry-out side is called the downstream side.

  The stoppers F1 and F2 are composed of, for example, air cylinders, solenoids, and the like, can protrude onto the conveyance path, and cooperate with fixing means (not shown) such as push-up pins, respectively. Positioning and fixing of the substrate to each stop position are performed. As shown in FIG. 4A, the stopper F1 is provided in the vicinity of the operable range D that is a predetermined distance away from the operable range D of the head unit 41 on the downstream side of the transport path of the conveyor 2. It is done. The substrate sensor S1 is spaced from the stopper F1 on the upstream side of the transport path, and is provided at a position near the stopper F1 in the operable range D. On the other hand, the stopper F2 is provided in the vicinity of the operable range D that is separated from the operable range D by a predetermined distance on the upstream side on the transport path of the conveyor 2. The substrate sensor S2 is spaced from the stopper F2 on the downstream side of the transport path, and is provided at a position near the stopper F2 in the operable range D.

  Such a conveyor 2 includes a carry-in operation for carrying a board into the mounting machine from the upstream side of a printing apparatus or the like provided continuously or continuously, a fixing action for fixing the carried printed board at a predetermined work position, an electronic An unloading operation for unloading the printed circuit board on which the component is mounted to another mounting machine, a reflow furnace, or the outside of the surface mounting machine is performed.

  The component supply unit 3 includes a mounting seat 31 disposed in parallel with the conveyor 2 and a plurality of tape feeders 32 disposed in parallel while being positioned on each mounting seat 31. The tape feeder 32 is configured such that small electronic components such as ICs, transistors and capacitors are stored at predetermined intervals, and the held tape is led out from the reel, and a feeding mechanism is provided at the tape feeding end. The tape is intermittently sent out as the electronic component is picked up by the head unit 41. In addition to the tape feeder as described above, relatively large electronic components such as PLCC (Plastic Leaded Chip Carrier) and QFP (Quad Flat Package) are supplied to the component supply unit 3 in a state of being placed on the tray. A tray feeder or the like may also be provided.

  The head mechanism 4 includes a head unit 41 disposed above the base 1 so as to be movable in the X-axis direction (direction of the conveyor 2) and the Y-axis direction (direction orthogonal to the X-axis in the horizontal plane). The head unit 41 is mounted with a suction head 42 for sucking electronic components. In this embodiment, for example, a plurality of suction heads 42 are arranged in the X-axis direction. Each suction head 42 is provided with a nozzle 43 for sucking electronic components at the tip, and this nozzle is connected to a negative pressure supply means (not shown) via an electromagnetic valve, so that the nozzle 43 can be used during mounting operation. A negative pressure is supplied to the tip, and the electronic component is adsorbed by the suction force.

  The substrate camera 5 is composed of a known digital camera or the like using a solid-state imaging device such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), and is mounted on the head unit 41. Such a substrate camera 5 images a fiducial mark, that is, a mark indicating a reference position on the printed circuit board from above the substrate P held at the work position as the head unit 41 moves.

  The electronic component camera 6 includes a known area camera using a solid-state image sensor such as a CCD or CMOS, a line sensor, and the like, and is embedded on the base 1. Such an electronic component camera 6 images the electronic component sucked by the head unit 41.

  As shown in FIG. 3, the control device 7 includes a motor control unit 71, a conveyor control unit 72, an external input / output unit 73, an image processing unit 74, a storage unit 75, and a main control unit 76. The Such a control device 7 includes an arithmetic device such as a CPU, a storage device such as a memory and an HDD (Hard Disc Drive), and an input that detects input of information from the outside such as a keyboard, a mouse, a pointing device, a button, and a touch panel. I / F device that transmits and receives various information via communication lines such as the Internet, LAN, and WAN, and displays such as CRT (Cathode Ray Tube), LCD (Liquid Crystal Display), or FED (Field Emission Display) It is comprised from the computer provided with the apparatus and the program installed in this computer.

  The motor control unit 71 drives the motors 44 such as an X-axis motor, a Y-axis motor, a Z-axis motor, and an R-axis motor included in the head unit 41 based on an instruction from the main control unit 76 to drive the head unit 41. An arithmetic processing unit that controls the operation. Thereby, adsorption | suction of an electronic component, a transfer, and mounting are implement | achieved.

  The conveyor control unit 72 is an arithmetic processing unit that calculates the operation amount of each motor of the conveyor 2 based on an instruction from the main control unit 76 and controls the operation of the conveyor 2 based on the calculation result. Thereby, carrying in, fixing, and carrying out of the substrate P is realized.

  The external input / output unit 73 is connected to various devices and board sensors provided in the mounting machine such as stoppers F1 and F2, fixing means (not shown), and board sensors S1 and S2 based on an instruction from the main controller 76. And an interface unit that transmits and receives various types of information to and from each other.

  The image processing unit 74 is an arithmetic processing unit that causes the board camera 5 or the electronic component camera 6 to perform imaging based on an instruction from the main control unit 76 and performs image processing on these captured images. The processing result is sent to the main control unit 76.

  The storage unit 75 is a database that stores various types of information related to the operation of the mounting machine. Such a storage unit 75 stores at least a mounting program 75a that is a program that controls a series of mounting operations of the mounting machine, and an optimization program 75b that will be described later.

  The main control unit 76 is an arithmetic processing unit that performs various operations based on the mounting program 75a and the optimization program 75b of the storage unit 75 to control various operations of the surface mounter in an integrated manner.

  The display unit 8 is a display processing unit that displays various types of information based on instructions from the main control unit 76 of the control device 7 and outputs various types of information as sound.

  The data creation device 9 includes a storage unit 91, a simulator 92, and a main calculation unit 93. Such a data creation device 9 includes an arithmetic device such as a CPU, a storage device such as a memory and an HDD, an input device that detects input of information from the outside such as a keyboard, a mouse, a pointing device, a button, and a touch panel, and the Internet. It consists of an I / F device that transmits and receives various types of information via a communication line such as a LAN or WAN, a computer having a display device such as a CRT, LCD, or FED, and a program installed in the computer . Note that the data creation device 9 may not be a computer connected via a communication line such as the Internet, LAN, and WAN. That is, the main control unit 76 and the storage unit 75 of the mounting machine may function.

  The storage unit 91 includes a data creation program 91a that is a program for managing a series of optimization program creation operations of the data creation device 9, a mounting program 91b that is a program for managing a series of mounting operations of the mounting machine, and a mounting machine. This is a database for storing mounting machine data 91c relating to the configuration of the mounting machine such as the shape, operating speed, arrangement of each component, and board data 91d relating to the configuration of each printed board. The mounting program 91 b stored in the storage unit 91 is equivalent to the mounting program 75 a stored in the storage unit 75 of the control device 7. Further, each program and each data stored in the storage unit 91 are stored in the storage unit 91 of the data creation device 9 in a state of being recorded on a recording medium such as a flexible disk, a CD-ROM, a DVD-ROM, or a memory card. You may do it.

  In accordance with the mounting program 91b stored in the storage unit 91, the simulator 92 transfers the electronic components transferred at each stop position so that the time required for mounting is minimized based on the mounting machine data 91c and the board data 91d. An arithmetic processing unit that calculates procedures and the like.

  The main calculation unit 93 is a calculation processing unit that performs overall calculation based on the data generation program 91a in the storage unit 91 to control the operation of the data generation device 9 in an integrated manner. Such a main calculation unit 93 transmits the calculation result by the simulator 92 to the control device 7 of the mounting machine as an optimization program 75b. The optimization program 75b is for designating the electronic components to be transferred, the order of transfer, and the like for each board type at each stop position of the conveyor 2, and is stored in the storage unit 75 of the control device 7. The The optimization program 75b may be provided to the control device 7 in a state of being recorded on a recording medium such as a flexible disk, a CD-ROM, a DVD-ROM, or a memory card.

(Mounting operation)
Next, the operation of the mounting machine according to the present embodiment will be described with reference to FIG. In the present embodiment, an electronic component is mounted on one board P by one mounting machine, and the size of the board P is larger than the operable range D of the head unit 41. Explained as an example.

  First, the main control unit 76 of the control device 7 detects the type of substrate P to be carried in (step S501). For example, the detection may be performed based on the received information received from the printing apparatus in the previous process. Alternatively, the substrate camera 5 may be caused to pick up an image of the substrate fixed at the upstream temporary position, and the image processing unit 74 may perform image processing on the imaged data, and may be performed based on the processing result.

  When detecting the type of the board, the main control unit 76 reads the optimization program 75b corresponding to the board from the storage unit 75 (step S502). The storage unit 75 stores an optimization program 75b for each board type. A method for generating the optimization program 75b will be described later.

  When the optimization program 75b corresponding to the board to be loaded is read, the main control unit 76 causes the external input / output unit 73 to project the stopper F1 (step S503), causes the conveyor control unit 72 to drive the conveyor 2, and the board from the outside. P is carried into the mounting machine and conveyed downstream (step S504). When the substrate sensor S1 detects the substrate P (step S505: YES), the main control unit 76 causes the conveyor control unit 72 to stop the conveyor 2 and causes the external input / output unit 73 to cooperate the stopper F1 and the fixing means. The substrate P is fixed (step S506). Thereby, the board | substrate P is fixed to the predetermined stop position (henceforth "stop position A") on the conveyance path | route of the conveyor 2, as shown in FIG.4 (b).

  In the present embodiment, the positions at which the stoppers F1 and F2 are disposed may be arbitrarily determined as long as the area where the electronic components of the board P can be mounted is located within the operable range D when the board P is fixed. Can be set to For example, the edge of the printed circuit board is used for mounting an apparatus that accommodates the printed circuit board, and electronic components cannot be mounted. Therefore, the distance between the stopper F1 and the operable range D is set to the above mounting value. You may make it do. In this way, when the substrate P is fixed by the stopper F1, the above-mentioned mounting margin of the substrate P is located outside the operable range D, and the area where the electronic components of the substrate P can be mounted is just within the operable range D. It becomes. In addition, for example, by setting the distance to be longer, even when the position of the substrate P is slightly shifted when the substrate P is fixed, an area in which the electronic component of the substrate P can be mounted is an operable range D. It can be stored inside.

  When the substrate P is fixed at the stop position A, the main control unit 76 drives the head unit 41 by the motor control unit 71 according to the optimization program 75b, and the electronic component supplied from the component supply unit 3 is applied to the substrate P. It is mounted (step S507). At this time, the head unit 41 transfers the electronic component to an area on the substrate P included in the operable range D of the head unit 41. The transfer of the electronic component is performed based on the optimum program 75b set so that the time required for the transfer is the shortest for each stop position. Therefore, the tact time is shortened, and the production efficiency is improved. Note that the electronic component is not transferred to the region A on the upstream side of the substrate P that protrudes from the operable range D.

  When the mounting of the electronic component on the board P at the stop position A is completed, the main control unit 76 releases the fixation of the board P by the stopper F1 and the fixing means by the external input / output unit 73 and embeds the stopper F1 (step S508). . Further, the conveyor 2 is driven by the conveyor control unit 72, and the substrate P is transported to the downstream side (step S509). When the substrate sensor S1 detects the substrate P and the substrate sensor S2 does not detect the substrate P (step S510: YES), the main control unit 76 causes the external input / output unit 73 to project the stopper F2 (step S510). S511), the conveyor 2 is driven in the reverse direction by the conveyor control unit 72, and the substrate P is transported upstream (step S512).

  When the sensor S2 detects the substrate P (step S513: YES), the main control unit 76 causes the conveyor control unit 72 to stop the conveyor 2 and causes the external input / output unit 73 to cooperate the stopper F2 and the fixing means. The substrate P is fixed (step S514). As a result, as shown in FIG. 4C, the substrate P is fixed at a predetermined stop position (hereinafter referred to as “stop position B”) on the downstream side of the transport path of the conveyor 2.

  At this time, as in the case of the stopper F1, when the distance between the stopper F2 and the operable range D is set to the value of the above-described attachment margin of the substrate P, when the substrate P is fixed by the stopper F2, the above-mentioned of the substrate P The mounting margin is located outside the operable range D, and the area where the electronic components of the board P can be mounted is just within the operable range D.

  When the substrate P is fixed at the stop position B, the main control unit 76 drives the head unit 41 by the motor control unit 71 in accordance with the optimization program 75b, and the electronic component supplied from the component supply unit 3 is applied to the substrate P. It is mounted (step S515). At this time, the head unit 41 transfers the electronic component to an area on the substrate P included in the operable range D of the head unit 41. The transfer of the electronic component is performed based on the optimum program 75b set so that the time required for the transfer is the shortest for each stop position. Therefore, the tact time is shortened, and the production efficiency is improved. Note that the electronic component is not transferred to the region B on the downstream side of the substrate P that protrudes from the operable range D.

  When the mounting of the electronic components on the board P at the stop position B is completed, the main control unit 76 releases the fixation of the board P by the stopper F2 and the fixing means by the external input / output unit 73 and embeds the stopper F2 (step S516). . In addition, the conveyor 2 is driven by the conveyor control unit 72 to transport the substrate P to the downstream side, and is carried out of the mounting machine (step S509). Thereby, the mounting operation on the substrate P is completed.

  In the present embodiment, stoppers F1 and F2 are provided on the upstream side and the downstream side of the transport path, and the substrate P is positioned with reference to the upstream end of the substrate P or the downstream end of the substrate P. Thereby, the both ends of the conveyance direction of the board | substrate P and by extension, the upstream and downstream area | region of the board | substrate P can be positioned more correctly.

  In the present embodiment, as described above, the electronic component can be mounted on a large substrate by fixing the substrate P at the two stop positions A and B. For example, as shown in FIG. 4, when the length in the transport direction (X direction) of the operable range D is Lx and the length in the X direction of the region A or the region B is L2, the electronic component of the substrate P can be mounted. The length L1 in the X direction of each region can be expressed by the sum of Lx and L2, that is, L1 = Lx + L2. Here, since the substrate P is fixed at two stop positions, L2 can be set up to the maximum Lx, so the above equation can be rewritten as L1 = 2Lx. Therefore, in the present embodiment, electronic components can be mounted up to 2Lx, that is, the substrate P having a length twice the operable range D.

(Optimization program generation operation)
Next, the generation operation of the optimization program 75b by the data creation device 9 will be described with reference to FIG. First, the main calculation unit 93 of the data creation device 9 determines that the size of the board P for generating the optimization program 75b is larger than the operable range D of the head unit 41 based on the mounting machine data 91c and the board data 91d in the storage unit 91. Is also larger (step S601).

  When the size of the board P is smaller than the operable range D (step S601: YES), the main calculation unit 93 transfers the electronic to the board P in the component supply unit 3 based on the mounting machine data 91c and the board data 91d. The arrangement of parts is set (step S602). Note that the arrangement of the electronic components in the component supply unit 3 may be set to an actual arrangement in the past or currently operating mounting machine.

  When the arrangement of the electronic components is set, the simulator 92 generates a predetermined board that generates an optimization program 75b at each stop position of the mounting machine in the virtual space based on the mounting machine data 91c and the board data 91d. Are mounted on the board according to the mounting program 91b, and the suction sequence and the stop position at which the mounting time is shortest are calculated (step S603). This calculation result is output as an optimization program 75b for the substrate P having a smaller size than the operable range D.

  On the other hand, when the size of the board P is larger than the operable range D (step S601: NO), the main calculation unit 93 divides the area on the board P based on the mounting machine data 91c and the board data 91d (step S601). S602). Specifically, when the area of the substrate P shown in FIG. 7A is divided, first, the main calculation unit 93 fixes the substrate P at the stop position A as shown in FIG. A region on the substrate P that protrudes from the operable range D is set as a region A. Further, as shown in FIG. 7C, an area on the substrate P that protrudes from the operable range D when the substrate P is fixed at the stop position B is set as an area B. Finally, as shown in FIG. 7D, an area on the substrate P excluding the areas A and B is set as an area C. Thereby, the area | region on the board | substrate P is divided | segmented into area | region AC.

  As described above, when the length of the substrate P in the X direction is 2Lx, the region on the substrate P is divided into two regions A and B.

  When the area on the board P is divided, the main calculation unit 93 sets the arrangement of the electronic components in the component supply unit 3 based on the mounting machine data 91c and the board data 91d (step S605). Note that the arrangement of the electronic components in the component supply unit 3 may be set to an actual arrangement in the past or currently operating mounting machine.

  When the arrangement of the electronic components is set, the simulator 92 sucks all the electronic components transferred to the substrate P at a time by the head unit 41 based on the mounting machine data 91c and the substrate data 91d. A group of electronic components (hereinafter referred to as “sequence”) to be transferred to the substrate P is set (step S606). At this time, each sequence is created so that electronic components to be mounted in the region A and electronic components to be mounted in the region B are not mixed. This is because the area A and the area B do not exist in the operable range D at the same time, and thus the electronic components to be mounted in each area cannot be mounted at the same time. Such a sequence is set by placing the mounting machine in the virtual space and the board P at each stop position of the mounting machine, and moving the electronic components according to the configuration of the board P and the arrangement of the electronic parts in the component supply unit 3. It is performed by calculating so that the time required for loading is minimized.

When all the sequences are set, the simulator 92 sets at which stop position each sequence is transferred (step S607). Specifically, the sequence including the electronic components to be mounted in the region A is set to be transferred when the substrate P is fixed at the stop position B. The sequence including the electronic components mounted in the region B is set to be transferred when the substrate P is fixed at the stop position A. The sequence including only the electronic component mounted in the area C is set to be transferred when the time required for transferring the electronic component is shorter among the stop positions A and B. For such setting, the mounting machine and the board P are arranged at each stop position of the mounting machine in the virtual space, the time required for the transfer is calculated by transferring the board P according to the mounting program 91b, This is done by comparing the transfer times.

  When it is set at which stop position each sequence is transferred, the simulator 92 sets the sequence transfer sequence at each stop position (step S608). In this setting, the mounting machine and the board P are arranged in the virtual space at each stop position, and the board P is transferred according to the mounting program 91b. This is done by calculating. This calculation result is output as an optimization program 75b for the substrate P having a size larger than the operable range D.

  Thus, according to the present embodiment, when a large substrate P is loaded, the substrate P is stopped at a plurality of stop positions based on the optimization program 75b, and transferred to the substrate P at each stop position. By determining the electronic component to be performed according to the time required to transfer the electronic component, the time required to transfer the electronic component can be shortened, so that the production efficiency can be improved.

[Second Embodiment]
Next, a second embodiment of the present invention will be described. The present embodiment is different from the first embodiment described above in the arrangement of the stopper F and the substrate sensor S, and the rest is the same as the first embodiment. Therefore, in the present embodiment, the same names and symbols are assigned to the same components as those in the first embodiment, and the description thereof is omitted as appropriate.

  In the present embodiment, two stoppers F and two substrate sensors S are provided. As shown in FIG. 8A, the stopper F1 can be operated downstream of the operable range D on the transport path of the conveyor 2 and separated from the operable range D of the head unit 41 by a predetermined distance. Provided in the vicinity of the range D. The stopper F2 is provided at a position separated from the stopper F1 on the downstream side on the conveyance path. The substrate sensor S1 is spaced from the stopper F1 on the upstream side of the transport path, and is provided at a position near the stopper F1 in the operable range D. Further, the substrate sensor S2 is spaced from the stopper F2 upstream of the transport path, and is provided at a position spaced further downstream of the transport path than the stopper F1.

(Mounting operation)
Next, with reference to FIG. 9, the operation of the mounting machine according to the present embodiment will be described. In the present embodiment, an electronic component is mounted on one board P by one mounting machine, and the size of the board P is larger than the operable range D of the head unit 41. Explained as an example.

  First, the main control unit 76 of the control device 7 detects the type of substrate P to be carried in (step S901). When the type of the board is detected, the main control unit 76 reads the optimization program 75b corresponding to the board from the storage unit 75 (step S902). Here, the optimization program 75b read from the storage unit 75 is generated by the data creation device 9 described with reference to FIG. 6 in the first embodiment.

  When the optimization program 75b corresponding to the board to be loaded is read, the main control unit 76 causes the external input / output unit 73 to project the stopper F1 (step S903), the conveyor control unit 72 drives the conveyor 2, and the board from the outside. P is carried into the mounting machine and conveyed downstream (step S904). When the substrate sensor S1 detects the substrate P (step S905: YES), the main control unit 76 stops the driving of the conveyor 2 by the conveyor control unit 72 and cooperates with the stopper F1 and the fixing means by the external input / output unit 73. Then, the substrate P is fixed (step S906). Thereby, as shown in FIG. 8B, the substrate P is fixed at the stop position A on the upstream side.

  When the substrate P is fixed at the stop position A, the main control unit 76 drives the head unit 41 by the motor control unit 71 according to the optimization program 75b, and the electronic component supplied from the component supply unit 3 is applied to the substrate P. Transfer (step S907). At this time, the head unit 41 transfers the electronic component to an area on the substrate P included in the operable range D of the head unit 41. The transfer of the electronic component is performed based on the optimum program 75b set so that the time required for the transfer is the shortest for each stop position. Therefore, the tact time is shortened, and the production efficiency is improved. It should be noted that electronic components are not mounted on the region A on the upstream side of the substrate P that protrudes from the operable range D.

  When the transfer of the electronic component to the substrate P at the stop position A is completed, the main control unit 76 releases the fixation of the substrate P by the stopper F1 and the fixing means by the external input / output unit 73 and embeds the stopper F1 (step S908). ). Further, the main control unit 76 causes the external input / output unit 73 to project the stopper F2 (step S909), causes the conveyor control unit 72 to drive the conveyor 2, and transports the substrate P downstream (step S910).

  When the sensor S2 detects the substrate P (step S911: YES), the main controller 76 causes the conveyor controller 72 to stop the conveyor 2 and causes the external input / output unit 73 to cooperate the stopper F2 and the fixing means. The substrate P is fixed (step S912). Thereby, the board | substrate P is fixed to the downstream stop position B, as shown in FIG.8 (c).

  When the substrate P is fixed at the stop position B, the main control unit 76 drives the head unit 41 by the motor control unit 71 in accordance with the optimization program 75b, and the electronic component supplied from the component supply unit 3 is applied to the substrate P. Transfer (step S913). At this time, the head unit 41 transfers the electronic component to an area on the substrate P included in the operable range D of the head unit 41. The transfer of the electronic component is performed based on the optimum program 75b set so that the time required for the transfer is the shortest for each stop position. Therefore, the tact time is shortened, and the production efficiency is improved. It should be noted that electronic components are not mounted in the region B on the downstream side of the substrate P that protrudes from the operable range D.

  When the mounting of the electronic components on the substrate P at the stop position B is completed, the main control unit 76 releases the fixation of the substrate P by the stopper F2 and the fixing means by the external input / output unit 73 and embeds the stopper F2 (step S914). . Further, the conveyor 2 is driven by the conveyor control unit 72, the substrate P is transported downstream, and is carried out of the mounting machine (step S915). Thereby, the mounting operation on the substrate P is completed.

  Even in a mounting machine that operates as described above, production efficiency can be improved by performing a mounting operation using the optimization program 75b.

  In the present embodiment as well, as in the first embodiment, the positions where the stoppers F1 and F2 are disposed can operate the area where the electronic components of the board P can be mounted when the board P is fixed. If it is located within the range D, it can be set freely as appropriate. Accordingly, the distance between the stopper F1 and the operable range D may be set to a value for attaching the substrate P, or may be set to be longer than this value.

  Also in this embodiment, if the length of the operable range D in the transport direction (X direction) is Lx and the length of the region A or region B in the X direction is L2, the electronic components on the substrate P can be mounted. The length L1 in the X direction of this region is represented by Lx + L2, and electronic components can be mounted up to 2Lx, that is, twice the operable range D.

[Third Embodiment]
Next, a third embodiment of the present invention will be described. Note that the present embodiment is different from the first embodiment described above in the configuration of the conveyor 2, and the others are the same as in the first embodiment. Therefore, in the present embodiment, the same names and symbols are assigned to the same components as those in the first embodiment, and the description thereof is omitted as appropriate.

  As shown in FIG. 10A, the conveyor 2 includes an upstream conveyor 2 </ b> A fixed on the upstream side on the base 1, a downstream conveyor 2 </ b> B fixed on the downstream side on the base 1, and a base 1 and a table 2T provided between the upstream conveyor 2A and the downstream conveyor 2B.

The upstream conveyor 2A is composed of a known conveyor, and carries the substrate P onto the table 2T from the upstream side of a printing apparatus or the like provided outside or continuously.
The downstream conveyor 2B is composed of a known conveyor, and carries the substrate P on the table 2T to another downstream side such as another mounting machine, a reflow furnace, or the surface mounting machine.

The table 2T has a substantially rectangular plate shape in plan view, and is arranged on the base 1 so as to be movable in the transport direction of the substrate P. A stopper F for stopping and fixing the substrate at a predetermined stop position and a substrate sensor S for detecting the presence / absence of the substrate are embedded at a predetermined location on the table 2T.
As shown in FIG. 10B, when the table 2T moves upstream to carry the substrate P from the upstream conveyor 2A, the stopper F operates on the downstream side of the table 2T and the operation of the head unit 41. It is provided in the vicinity of the operable range D that is separated from the possible range D by a predetermined distance outside.
The substrate sensor S is provided at a position spaced from the stopper F1 upstream of the table 2T. At this time, as shown in FIG. 10B, when the table 2T is moved to the upstream conveyor 2A side to carry in the substrate P, the substrate sensor S is disposed in the vicinity of the stopper F1 inside the operable range D. The

(Mounting operation)
Next, the operation of the mounting machine according to the present embodiment will be described with reference to FIG. In the present embodiment, an electronic component is mounted on one board P by one mounting machine, and the size of the board P is larger than the operable range D of the head unit 41. Explained as an example.

  First, the main control unit 76 of the control device 7 detects the type of substrate P to be carried in (step S1101). When the type of the board is detected, the main control unit 76 reads the optimization program 75b corresponding to the board from the storage unit 75 (step S1102). Here, the optimization program 75b read from the storage unit 75 is generated by the data creation device 9 described with reference to FIG. 6 in the first embodiment.

  When the optimization program 75b corresponding to the substrate to be loaded is read, the main control unit 76 causes the conveyor control unit 72 to bring the table 2T to the loading position of the substrate P in the vicinity of the upstream conveyor 2A, as shown in FIG. The stopper F is protruded by the external input / output unit 73 (step S1104). Further, the upstream conveyor 2A is driven by the conveyor controller 72, and the substrate P is carried from the outside onto the table 2T inside the mounting machine (step S1105). At this time, the upstream conveyor 2A is in contact with or adjacent to the upstream end of the table 2T, the table 2T is moved below the end of the table 2T, or from a slit provided in the table 2T. The substrate P is transferred to the upstream side by being exposed on the table 2T.

  When the substrate sensor S detects the substrate P (step S1106: YES), the main control unit 76 stops the driving of the upstream conveyor 2A by the conveyor control unit 72, and the stopper I and the fixing means by the external input / output unit 73. To fix the substrate P (step S1107). Thus, as shown in FIG. 10B, the substrate P is fixed at the stop position A on the upstream side.

  When the substrate P is fixed at the stop position A, the main control unit 76 drives the head unit 41 by the motor control unit 71 according to the optimization program 75b, and the electronic component supplied from the component supply unit 3 is applied to the substrate P. It is mounted (step S1108). At this time, the head unit 41 transfers the electronic component to an area on the substrate P included in the operable range D of the head unit 41. The transfer of the electronic component is performed based on the optimum program 75b set so that the time required for the transfer is the shortest for each stop position. Therefore, the tact time is shortened, and the production efficiency is improved. Note that the electronic component is not transferred to the region A on the upstream side of the substrate P that protrudes from the operable range D.

  When the mounting of the electronic components on the substrate P at the stop position A is completed, the main control unit 76 moves the table 2T to the carry-out position of the substrate P near the downstream conveyor 2B by the conveyor control unit 72 with the substrate P fixed. (Step S1109). Then, as shown in FIG. 10C, the substrate P has a position where the downstream edge of the substrate P protrudes from the operable range D, and the upstream edge of the substrate P falls within the operable range D. That is, it is fixed at the stop position B.

  When the table 2T moves to the unloading position of the substrate P, the main control unit 76 drives the head unit 41 by the motor control unit 71 in accordance with the optimization program 75b, and the electronic component supplied from the component supply unit 3 is applied to the substrate P. It is mounted (step S1110). At this time, the head unit 41 transfers the electronic component to an area on the substrate P included in the operable range D of the head unit 41. The transfer of the electronic component is performed based on the optimum program 75b set so that the time required for the transfer is the shortest for each stop position. Therefore, the tact time is shortened, and the production efficiency is improved. Note that the electronic component is not transferred to the region B on the downstream side of the substrate P that protrudes from the operable range D.

  When the mounting of the electronic components on the substrate P at the stop position B is completed, the main control unit 76 releases the fixation of the substrate P by the stopper F and the fixing means by the external input / output unit 73 and embeds the stopper F (step S1111). . Further, the conveyor control unit 72 drives the downstream conveyor 2B, transports the substrate P downstream, and carries it out of the mounting machine (step S1112). At this time, the downstream conveyor 2B comes into contact with the substrate P arranged at the downstream end of the table 2T, is inserted between the table 2T and the substrate P, or from the slit provided in the table 2T to the table. The substrate P is transported to the downstream side in contact with the substrate P by being exposed on 2T. Thereby, the mounting operation on the substrate P is completed.

  Even in a mounting machine that operates as described above, it is possible to improve production efficiency by mounting using the optimization program 75b.

  In the present embodiment as well, as in the first embodiment, the position where the stopper F is disposed is such that when the substrate P is fixed, an area in which the electronic components of the substrate P can be mounted is an operable range D. If it is located inside, it can be set freely as appropriate. Therefore, the distance between the stopper F and the operable range D may be set to a value for attaching the substrate P, or may be set to be longer than this value.

  Also in this embodiment, if the length of the operable range D in the transport direction (X direction) is Lx and the length of the region A or region B in the X direction is L2, the electronic components on the substrate P can be mounted. The length L1 in the X direction of this region is represented by Lx + L2, and electronic components can be mounted up to 2Lx, that is, twice the operable range D. At this time, the length in the X direction of the table 2T is preferably longer than 2Lx. Further, it is desirable that the amount of movement of the table 2T in the X direction is larger than Lx.

[First Reference Example ]
Next, a first reference example of the present invention will be described. This reference example relates to a mounting system having two mounting machines described in the first embodiment. Therefore, the same components and components as those in the first embodiment are denoted by the same names and reference numerals, and the description thereof is omitted as appropriate.

As shown in FIG. 12, the mounting system according to the present reference example includes a first mounting machine 11 that mounts electronic components on a substrate P that is carried in from the upstream side of a printing apparatus or the like that is provided externally or continuously, A second mounting machine 12 that mounts electronic components on the board P carried in from the first mounting machine 11 and carries the board P downstream to another mounting machine, a reflow furnace, or the outside of the surface mounting machine. And have.

  In the first mounting machine 11 and the second mounting machine 12, the stopper F <b> 1 is on the downstream side on the transport path of the conveyor 2 and from the operable ranges D <b> 1 and D <b> 2 of the head unit 41 as shown in FIG. 12. It is provided in the vicinity of the operable ranges D1 and D2 that are separated from each other by a predetermined distance. The stopper F2 is provided on the upstream side of the operable range D1 and D2 outside the transport path of the conveyor 2 and in the vicinity of the operable range D1 and D2 spaced apart from the operable range D1 and D2 by a predetermined distance. It is done. The substrate sensor S1 is spaced from the stopper F1 on the upstream side of the transport path, and is provided at a position near the stopper F1 in the operable ranges D1 and D2. The substrate sensor S2 is separated from the stopper F2 on the downstream side of the transport path, and is provided at a position near the stopper F2 in the operable ranges D1 and D2.

(Mounting operation)
Next, with reference to FIG. 13, the mounting operation in each mounting machine of the mounting system according to this reference example will be described. In this reference example , electronic components are mounted on one board P by two mounting machines, and the size of the board P is larger than the operable ranges D1 and D2 of the head unit 41. Will be described as an example. Here, it is assumed that the first mounting machine 11 mounts electronic components on the substrate P at the stop position A, and the second mounting machine 12 mounts electronic components on the substrate P at the stop position B.

  First, the main control unit 76 of the control device 7 of the first mounting machine 11 and the second mounting machine 12 detects the type of board P to be carried in (step S1301). When the type of the board P is detected, the main control unit 76 of each mounting machine reads the optimization program 75b corresponding to the board from the storage unit 75 (step S1302).

  When the optimization program 75b is read, the main control unit 76 of each mounting machine confirms the stop position of the board P to be loaded (step S1303). The stop position of the board P in each mounting machine is stored in advance in the optimization program 75b, and the main control unit 76 of each mounting machine checks the fixed position of the board P based on the optimization program 75b.

  In the case of the first mounting machine 11, since the board P is fixed to the stop position A that is the upstream stop position (step S1303: YES), the main control unit 76 of the first mounting machine 11 is an external input / output unit. The stopper F1 is projected by 73 (step S1304), the conveyor 2 is driven by the conveyor control unit 72, the board P is carried into the mounting machine from the outside, and is conveyed downstream (step S1305). When the substrate sensor S1 detects the substrate P (step S1306: YES), the main control unit 76 causes the conveyor control unit 72 to stop the conveyor 2 and causes the external input / output unit 73 to cooperate the stopper F1 and the fixing means. The substrate P is fixed (step S1307). Thereby, the board | substrate P carried in to the 1st mounting machine 11 is fixed to the stop position A of an upstream, as shown in FIG.

  On the other hand, in the case of the second mounting machine 12, since the substrate P is fixed at the stop position B that is the downstream stop position (step S1303: NO), the main control unit 76 of the second mounting machine 12 performs conveyor control. The conveyor 2 is driven by the part 72, and the board | substrate P carried in from the 1st mounting machine 11 is conveyed downstream (step S1311). When the substrate sensor S1 detects the substrate P and the substrate sensor S2 does not detect the substrate P (step S1312: YES), the main controller 76 causes the external input / output unit 73 to project the stopper F2 (step S1312). S1313), the conveyor 2 is driven in the reverse direction by the conveyor control unit 72, and the substrate P is transported upstream (step S1314). When the sensor S2 detects the substrate P (step S1315: YES), the main controller 76 causes the conveyor controller 72 to stop the conveyor 2 and causes the external input / output unit 73 to cooperate the stopper F2 and the fixing means. The substrate P is fixed (step S1307). Thereby, the board | substrate P carried out from the 1st mounting machine 11 and carried in into the 2nd mounting machine is fixed to the stop position B of a downstream, as shown in FIG.

  When the substrate P is fixed, the main control unit 76 of each mounting machine drives the head unit 41 by the motor control unit 71 according to the optimization program 75b, and the electronic component supplied from the component supply unit 3 is applied to the substrate P. It is mounted (step S1308).

  At this time, the head unit 41 of the first mounting machine 11 transfers the electronic component to an area on the substrate P included in the operable range D1 of the head unit 41. The transfer of the electronic component is performed based on the optimum program 75b set so that the time required for the transfer is the shortest for each stop position. Therefore, the tact time is shortened, and the production efficiency is improved. In the first mounting machine 11, the electronic component is not transferred to the area A on the upstream side of the substrate P that protrudes from the operable range D <b> 1.

  Similarly, the head unit 41 of the second mounting machine 12 transfers electronic components to an area on the substrate P included in the operable range D2 of the head unit 41. The transfer of the electronic component is performed based on the optimum program 75b set so that the time required for the transfer is the shortest for each stop position. Therefore, the tact time is shortened, and the production efficiency is improved. In the second mounting machine 12, no electronic component is transferred to the region B on the upstream side of the substrate P that protrudes from the operable range D2.

  When the mounting of the electronic components on the board P is finished, the main control unit 76 of each mounting machine releases the fixing of the board P by the stopper and the fixing means protruding from the external input / output unit 73 and embeds the stopper (step). S1309). In addition, the conveyor 2 is driven by the conveyor control unit 72 to convey the substrate P to the downstream side, and the first mounting machine 11 is transferred to the second mounting machine 12 and the second mounting machine 12 is transferred to the downstream side. Is carried out (step S1310). Thereby, the mounting operation with respect to the board | substrate P in each mounting machine is completed.

(Optimization program generation operation)
Next, the generation operation of the optimization program 75b of the mounting system having a plurality of mounting machines by the data creation device 9 will be described with reference to FIG. First, the main calculation unit 93 of the data creating device 9 determines the size of the board P for generating the optimization program 75b based on the mounting machine data 91c and the board data 91d in the storage unit 91 and the operation of the head unit 41 of each mounting machine. It is confirmed whether it is larger than the possible range D (step S1401).

  When the size of the board P is smaller than the operable range D (step S1401: YES), the main calculation unit 93 selects electronic components to be mounted on the board P by each mounting machine based on the mounting machine data 91c and the board data 91d. Distribute (step S1402). This distribution of the electronic components is performed based on the type and quantity of the electronic components mounted on the board P.

  On the other hand, when the size of the board P is larger than the operable range D (step S1401: NO), the main calculation unit 93 divides the area on the board P based on the mounting machine data 91c and the board data 91d (step S1401). S1407). The division of the area of the substrate P is performed by the same method as described with reference to FIG. 7 in the first embodiment.

  When the area on the board P is divided, the main calculation unit 93 sorts electronic components that cannot be mounted by one mounting machine based on the board data 91d (step S1408). Specifically, as illustrated in FIG. 7D, the main calculation unit 93 separates electronic components to be mounted on the region A and the region B from all the electronic components to be mounted on the substrate P.

When the electronic components are separated, the main calculation unit 93 sets a stop position for fixing the board P by each mounting machine based on the mounting machine data 91c and the board data 91d (step S1409). This setting can be freely set as appropriate based on the characteristics of the mounting machine, the line configuration of the mounting system, and the like. In this reference example , the first mounting machine 11 is fixed to the stop position A, and the second mounting machine 12 is fixed to the stop position B.

  When the stop position is set, the main calculation unit 93 distributes the sorted electronic components to each mounting machine (step S1409). Specifically, as shown in FIG. 12, the electronic component mounted on the region A of the substrate P is a second component that fixes the substrate P at a stop position B where the electronic component can be transferred to the region A. Distribute to the mounting machine 12. On the other hand, as shown in FIG. 12, the electronic component mounted on the region B of the substrate P is a first mounting machine 11 that fixes the substrate P at a stop position A where the electronic component can be transferred to the region B. To distribute.

  When the sorted electronic components are distributed, the main calculation unit 93 distributes the remaining electronic components to be mounted on the board P to each mounting machine (step S1411). Here, the remaining electronic components are electronic components to be mounted in the region C of the substrate P as shown in FIG. The main arithmetic unit 93 distributes electronic components mounted at positions close to the region A in the distance to the second mounting machine 12, and mounts electronic components mounted close to the region B in the first distance. Distribute to machine 11.

  When the electronic component is distributed to each mounting machine, the main arithmetic unit 93 selects a mounting machine that optimizes the order of mounting the distributed electronic components (step S1403). This selection may be made in order starting from the upstream mounting machine, or in order starting from the downstream mounting machine.

  When the mounter to be optimized is selected, the main calculation unit 93 arranges electronic components to be mounted on the board P in the component supply unit 3 of the selected mounter based on the mounter data 91c and the board data 91d. Is set (step S1404). Note that the arrangement of the electronic components in the component supply unit 3 may be set to an actual arrangement in the past or currently operating mounting machine.

  When the arrangement of the electronic components is set, the simulator 92 sets the order in which the distributed electronic components are transferred to the board P based on the mounting machine data 91c and the board data 91d (step S1405). In this setting, the mounting machine selected in the virtual space and the board P are arranged at the stop position set in the mounting machine, and each electronic component distributed to the board P is transferred according to the mounting program 91b. The calculation is performed so that the time required for the transfer is minimized. This calculation result is output as an optimization program 75b for the board P having a size larger than the operable range D in the selected mounting machine.

  When the order of transferring the electronic components is set, the main calculation unit 93 checks whether or not the setting of the order of transferring the electronic components has been performed for all the mounting machines (step S1406). When there is a mounting machine in which the transfer order of electronic components has not been set (step S1406: NO), the main calculation unit 93 returns to the process of step S1403. On the other hand, when the setting of the transfer order of the electronic components is completed for all the mounting machines (step S1406), the main operation unit 93 ends the generation operation of the optimization program 75b.

  As described above, when the large board P is carried in, the electronic component which stops the board P at a stop position different from other mounting machines based on the optimization program 75b and is transferred to the board P by each mounting machine. Is determined according to the time required to transfer the electronic component, so that the time required to transfer the electronic component can be shortened, so that the production efficiency can be improved.

[ Second Reference Example ]
Next, a second reference example of the present invention will be described. The reference example is different from the first reference example described above in the configuration of the mounting machine. That is, the mounting machine described in the second embodiment is replaced with 2 mounting machines described in the first embodiment. The present invention relates to a mounting system having a stand. Accordingly, components equivalent to those in the second embodiment and the first reference example are denoted by the same names and reference numerals, and description thereof is omitted as appropriate.

As shown in FIG. 15, the mounting system according to the present reference example includes a first mounting machine 11 that mounts electronic components on a board P carried from the upstream side of an externally or continuously provided printing apparatus or the like, A second mounting machine 12 that mounts electronic components on the board P carried in from the first mounting machine 11 and carries the board P downstream to another mounting machine, a reflow furnace, or the outside of the surface mounting machine. And have.

  In the first mounting machine 11 and the second mounting machine 12, the stopper F1 is located upstream of the operable ranges D1 and D2 on the transport path of the conveyor 2 as shown in FIG. It is provided in the vicinity of the operable ranges D1 and D2 that are spaced apart from D1 and D2 by a predetermined distance. The stopper F2 is provided at a position separated from the stopper F1 on the downstream side on the conveyance path. The substrate sensor S1 is spaced from the stopper F1 on the upstream side of the transport path, and is provided at a position near the stopper F1 in the operable ranges D1 and D2. Further, the substrate sensor S2 is spaced from the stopper F2 upstream of the transport path, and is provided at a position spaced further downstream of the transport path than the stopper F1.

(Mounting operation)
Next, with reference to FIG. 16, the mounting operation in each mounting machine of the mounting system according to this reference example will be described. In this reference example , electronic components are mounted on one board P by two mounting machines, and the size of the board P is larger than the operable ranges D1 and D2 of the head unit 41. Will be described as an example. Here, it is assumed that the first mounting machine 11 transfers an electronic component onto the substrate P at the stop position A, and the second mounting machine 12 transfers the electronic component onto the substrate P at the stop position B.

First, the main control unit 76 of the control device 7 of the first mounting machine 11 and the second mounting machine 12 detects the type of board P to be carried in (step S1601). When the type of the board P is detected, the main control unit 76 of each mounting machine reads the optimization program 75b corresponding to the board from the storage unit 75 (step S1602). Here, the optimum program 75b read from the storage unit 75 is created by the data creation device 9 described with reference to FIG. 14 in the first reference example .

  When the optimization program 75b is read, the main control unit 76 of each mounting machine confirms the stop position of the board P to be carried in (step S1603). The main controller 76 of each mounting machine confirms the fixed position of the board P based on the optimization program 75b.

  In the case of the first mounting machine 11, since the board P is fixed at the stop position A that is the upstream stop position (step S1603: YES), the main control unit 76 of the first mounting machine 11 is an external input / output unit. The stopper F1 is protruded by 73 (step S1604), the conveyor 2 is driven by the conveyor control unit 72, the board P is carried from the outside into the mounting machine, and is conveyed downstream (step S1605). When the substrate sensor S1 detects the substrate P (step S1606: YES), the main control unit 76 causes the conveyor control unit 72 to stop the conveyor 2 and causes the external input / output unit 73 to cooperate the stopper F1 and the fixing means. Then, the substrate P is fixed (step S1607). Thereby, the board | substrate P carried in to the 1st mounting machine 11 is fixed to the stop position A of an upstream, as shown in FIG.

  In the case of the second mounting machine 12, since the substrate P is fixed at the stop position B, which is a downstream stop position (step S1603: NO), the main control unit 76 of the second mounting machine 12 is an external input / output unit. The stopper F2 is protruded by 73 (step S1611), the conveyor 2 is driven by the conveyor control unit 72, and the board P carried from the first mounting machine 11 is conveyed downstream (step S1612). When the substrate sensor S2 detects the substrate P (step S1613: YES), the main control unit 76 causes the conveyor control unit 72 to stop the conveyor 2 and causes the external input / output unit 73 to cooperate the stopper F2 and the fixing means. Then, the substrate P is fixed (step S1607). Thereby, the board | substrate P carried in to the 2nd mounting machine 12 is fixed to the stop position B of a downstream, as shown in FIG.

  When the board P is fixed, the main control unit 76 of each mounting machine drives the head unit 41 by the motor control unit 71 according to the optimization program 75 b generated by the data creation device 9 and supplies the head unit 41 from the component supply unit 3. The electronic component to be transferred is transferred onto the substrate P (step S1608).

  At this time, the head unit 41 of the first mounting machine 11 transfers the electronic component to an area on the substrate P included in the operable range D1 of the head unit 41. The transfer of the electronic component is performed based on the optimum program 75b set so that the time required for the transfer is the shortest for each stop position. Therefore, the tact time is shortened, and the production efficiency is improved. In the first mounting machine 11, the electronic component is not transferred to the area A on the upstream side of the substrate P that protrudes from the operable range D <b> 1.

  Similarly, the head unit 41 of the second mounting machine 12 transfers the electronic component to an area on the substrate P included in the operable range D2 of the head unit 41. The transfer of the electronic component is performed based on the optimum program 75b set so that the time required for transfer at each stop position is the shortest. Therefore, the tact time is shortened, and the production efficiency is improved. In the second mounting machine 12, no electronic component is transferred to the region B on the upstream side of the substrate P that protrudes from the operable range D2.

  When the mounting of the electronic components on the board P is finished, the main control unit 76 of each mounting machine releases the fixing of the board P by the stopper and the fixing means protruding from the external input / output unit 73 and embeds the stopper (step). S1609). In addition, the conveyor 2 is driven by the conveyor control unit 72 to convey the substrate P to the downstream side, and the first mounting machine 11 is transferred to the second mounting machine 12 and the second mounting machine 12 is transferred to the downstream side. Is carried out (step S1610). Thereby, the mounting operation with respect to the board | substrate P in each mounting machine is completed.

  Even in a mounting system that operates in this way, production efficiency can be improved by performing a mounting operation using the optimization program 75b.

[ Third Reference Example ]
Next, a third reference example of the present invention will be described. Note that this reference example differs from the first reference example described above in the configuration of the mounting machine, that is, the mounting machine described in the third embodiment is replaced with 2 mounting machines described in the first embodiment. The present invention relates to a mounting system having a stand. Therefore, components equivalent to those in the third embodiment and the first reference example are denoted by the same names and reference numerals, and description thereof is omitted as appropriate.

As shown in FIG. 17, the mounting system according to the present reference example includes a first mounting machine 11 that mounts electronic components on a board P that is carried in from the upstream side of an externally or continuously provided printing apparatus or the like, A second mounting machine 12 that mounts electronic components on the board P carried in from the first mounting machine 11 and carries the board P downstream to another mounting machine, a reflow furnace, or the outside of the surface mounting machine. And have.

  In the first mounting machine 11 and the second mounting machine 12, the conveyor 2 includes an upstream conveyor 2 </ b> A fixed on the upstream side on the base 1 and a downstream conveyor fixed on the downstream side on the base 1. 2B and a table 2T provided between the upstream conveyor 2A and the downstream conveyor 2B on the base 1. A stopper F for stopping and fixing the substrate at a predetermined stop position and a substrate sensor S for detecting the presence / absence of the substrate are embedded at predetermined locations on the table 2T. As shown in FIG. 17, when the table 2T moves upstream to carry in the substrate P, the stopper F is provided on the downstream side of the table 2T and outside the operable range D of the head unit 41 outside the table 2T. It is provided in the vicinity of the operable range D separated by a distance. The substrate sensor S is provided at a position separated from the stopper F1 on the upstream side of the transport path.

Next, with reference to FIG. 18, the mounting operation in each mounting machine of the mounting system according to this reference example will be described. In this reference example , electronic components are mounted on one board P by two mounting machines, and the size of the board P is larger than the operable ranges D1 and D2 of the head unit 41. Will be described as an example. Here, it is assumed that the first mounting machine 11 transfers an electronic component onto the substrate P at the stop position A, and the second mounting machine 12 transfers the electronic component onto the substrate P at the stop position B.

First, the main control unit 76 of the control device 7 of the first mounting machine 11 and the second mounting machine 12 detects the type of board P to be carried in (step S1801). When the type of the board P is detected, the main control unit 76 of each mounting machine reads the optimization program 75b corresponding to the board from the storage unit 75 (step S1802). Here, the optimum program 75b read from the storage unit 75 is created by the data creation device 9 described with reference to FIG. 14 in the first reference example .

  When the optimization program 75b corresponding to the board to be loaded is read, the main control unit 76 of each mounting machine moves the table 2T to the board P loading position by the conveyor control unit 72 (step S1803) and the external input / output unit 73. Thus, the stopper F is protruded (step S1804). Further, the conveyor control unit 72 drives the upstream conveyor 2A to carry the substrate P into the mounting machine from the outside and transport it onto the table 2T (step S1805).

  When the substrate sensor S detects the substrate P (step S1806: YES), the main control unit 76 of each mounting machine stops the driving of the upstream conveyor 2A by the conveyor control unit 72 and stops the stopper F by the external input / output unit 73. And the fixing means cooperate to fix the substrate P (step S1807).

  When the substrate P is fixed, the main control unit 76 of each mounting machine confirms the stop position of the fixed substrate P based on the optimization program 75b (step S1808). The stop position of the board P in each mounting machine is stored in advance in the optimization program 75b, and the main control unit 76 of each mounting machine checks the fixed position of the board P based on the optimization program 75b.

  In the case of the first mounting machine 11, the electronic component is transferred to the board P at the board P loading position, that is, the stop position A that is the upstream stop position (step S1808: YES). Accordingly, as shown in FIG. 17, the main control unit 76 drives the head unit 41 by the motor control unit 71 according to the optimization program 75b in a state where the table 2T is fixed at the position where the substrate P is loaded, and the component The electronic component supplied from the supply unit 3 is mounted on the substrate P (step S1809). At this time, the head unit 41 of the first mounting machine 11 transfers the electronic component to an area on the substrate P included in the operable range D of the head unit 41. The transfer of the electronic component is performed based on the optimum program 75b set so that the time required for transfer at each stop position is the shortest. Therefore, the tact time is shortened, and the production efficiency is improved. It should be noted that electronic components are not mounted on the region A on the upstream side of the substrate P that protrudes from the operable range D.

  On the other hand, in the case of the second mounting machine 12, the electronic component is transferred onto the board P at the board P unloading position, that is, at the stop position B which is a downstream stop position (step S1808: NO). Therefore, the main control unit 76 moves the table 2T to the carry-out position of the substrate P by the conveyor control unit 72 while the substrate P is fixed (step S1813). Then, as shown in FIG. 17, the downstream edge of the substrate P protrudes from the operable range D, and the upstream edge of the substrate P is located within the operable range D, that is, the stop position. B is fixed. When the table 2T moves to the unloading position of the substrate P, the main control unit 76 drives the head unit 41 by the motor control unit 71 in accordance with the optimization program 75b, and the electronic component supplied from the component supply unit 3 is applied to the substrate P. It is mounted (step S1814). At this time, the head unit 41 of the second mounting machine 12 transfers the electronic component to an area on the substrate P included in the operable range D of the head unit 41. The transfer of the electronic component is performed based on the optimum program 75b set so that the time required for transfer at each stop position is the shortest. Therefore, the tact time is shortened, and the production efficiency is improved. Note that the electronic component is not transferred to the region B on the downstream side of the substrate P that protrudes from the operable range D.

  When the mounting of the electronic component on the board P at each stop position is completed, the main control unit 76 of each mounting machine releases the fixing of the board P by the stopper F and the fixing means by the external input / output unit 73 and embeds the stopper F. (Step S1811). Further, the conveyor control unit 72 drives the table 2T and the downstream conveyor 2B to convey the substrate P to the downstream side. The first mounting machine 11 is transferred to the second mounting machine 12, and the second mounting machine 12 is moved downstream. Each substrate P is carried out to the side (step S1812). Thereby, the mounting operation on the substrate P is completed.

  Even in a mounting system that operates in this way, production efficiency can be improved by performing a mounting operation using the optimization program 75b.

In the first to third reference examples , the first mounting machine 11 transfers the electronic component to the board P at the stop position A, and the second mounting machine 12 transfers the electronic component to the board P at the stop position 12. However, the first mounting machine 11 may transfer the electronic component to the board P at the stop position B and the second mounting machine 12 at the stop position A, respectively.

In each of the first to third embodiments and the first to third reference examples , each mounting machine fixes the substrate P by a fixing means such as a push-up pin. The means for fixing the substrate P is not limited to the above-mentioned fixing means, and can be freely set as appropriate. For example, as in a known printing machine, a substrate support table that can move along the Z-axis and the X-axis may be provided and fixed at a predetermined stop position by the substrate support table.

In the first to third embodiments and the first to third reference examples , the substrate P is stopped using the stopper F. However, if the substrate P can be stopped at a predetermined position. The stopper F may not be used. In this case, it can be realized by controlling the stop speed of the conveyor 2 to stop the substrate P at a predetermined stop position or by providing means for clamping the substrate P.

Further, the mounting machine and the mounting system described in the first to third embodiments and the first to third reference examples include , in addition to each mounting machine, a board supplying machine that supplies a printed circuit board to the line, and this board supplying machine. A printing machine that prints solder at a predetermined position on the board carried in by the reflow furnace, a reflow furnace that heats the board on which the electronic component is mounted by the mounting machine, and a board that stores the board to which the solder is joined by the reflow furnace The present invention can be applied to a mounting system having a storage machine. By applying the mounting machine or mounting system according to the first to third embodiments and the first to third reference examples to such a mounting system, the production efficiency can be improved.

  The present invention can be applied to a surface mounting machine or a mounting system having a plurality of surface mounting machines.

It is a top view of the surface mounting machine of the present invention. It is a side view of the surface mounting machine of this invention. 3 is a block diagram showing the configuration of a control device 8 and a data creation device 9. FIG. It is a top view which shows typically the structure of the surface mounter concerning the 1st Embodiment of this invention. It is a flowchart which shows mounting operation | movement of the surface mounting machine concerning the 1st Embodiment of this invention. It is a flowchart which shows the production | generation operation | movement of the optimization program 75b by the data preparation apparatus 9. FIG. It is a figure explaining the operation | movement which divides | segments the area | region of the board | substrate P. FIG. It is a top view which shows typically the structure of the surface mounter concerning the 2nd Embodiment of this invention. It is a flowchart which shows mounting operation | movement of the surface mounting machine concerning the 2nd Embodiment of this invention. It is a top view which shows typically the structure of the surface mounter concerning the 3rd Embodiment of this invention. It is a flowchart which shows mounting operation | movement of the surface mounting machine concerning the 3rd Embodiment of this invention. It is a top view which shows typically the structure of the mounting system concerning the 4th Embodiment of this invention. It is a flowchart which shows mounting operation | movement of the mounting system concerning the 4th Embodiment of this invention. It is a flowchart which shows the production | generation operation | movement of the optimization program 75b by the data preparation apparatus 9 in the 4th-6th embodiment of this invention. It is a top view which shows typically the structure of the mounting system concerning the 5th Embodiment of this invention. It is a flowchart which shows mounting operation | movement of the mounting system concerning the 5th Embodiment of this invention. It is a top view which shows typically the structure of the mounting system concerning the 6th Embodiment of this invention. It is a flowchart which shows mounting operation | movement of the mounting system concerning the 6th Embodiment of this invention.

Explanation of symbols

It is a top view of the surface mounting machine of the present invention. It is a side view of the surface mounting machine of this invention. 3 is a block diagram showing the configuration of a control device 8 and a data creation device 9. FIG. It is a top view which shows typically the structure of the surface mounter concerning the 1st Embodiment of this invention. It is a flowchart which shows mounting operation | movement of the surface mounting machine concerning the 1st Embodiment of this invention. It is a flowchart which shows the production | generation operation | movement of the optimization program 75b by the data preparation apparatus 9. FIG. It is a figure explaining the operation | movement which divides | segments the area | region of the board | substrate P. FIG. It is a top view which shows typically the structure of the surface mounter concerning the 2nd Embodiment of this invention. It is a flowchart which shows mounting operation | movement of the surface mounting machine concerning the 2nd Embodiment of this invention. It is a top view which shows typically the structure of the surface mounter concerning the 3rd Embodiment of this invention. It is a flowchart which shows mounting operation | movement of the surface mounting machine concerning the 3rd Embodiment of this invention. It is a top view which shows typically the structure of the mounting system concerning the 1st reference example of this invention. It is a flowchart which shows mounting operation | movement of the mounting system concerning the 1st reference example of this invention. It is a flowchart which shows the production | generation operation | movement of the optimization program 75b by the data preparation apparatus 9 in the 1st-3rd reference example of this invention. It is a top view which shows typically the structure of the mounting system concerning the 2nd reference example of this invention. It is a flowchart which shows mounting operation | movement of the mounting system concerning the 2nd reference example of this invention. It is a top view which shows typically the structure of the mounting system concerning the 3rd reference example of this invention. It is a flowchart which shows mounting operation | movement of the mounting system concerning the 3rd reference example of this invention.

Claims (5)

A transport unit for transporting the substrate;
A transport control unit for controlling the transport unit to stop the substrate being transported at a predetermined stop position;
A component supply unit for supplying components to be transferred to the substrate;
A head unit including a suction head for sucking a component, and transferring the component from the component supply unit onto the substrate carried into the stop position;
A transfer control unit for determining a component to be transferred onto the substrate by the head unit ;
When the size of the substrate exceeds an area where the head unit can move, the area on the substrate is divided, and an arithmetic unit for setting electronic components to be transferred to this area is provided.
The transport control unit stops a substrate having a size exceeding a region where the head unit is movable at a plurality of stop positions,
The transfer controller is
The parts to be transferred on the substrate stopped at each stop position are determined according to the time required for transfer at each stop position of this part ,
A component that can be transferred onto the substrate at only one stop position among a plurality of stop positions is transferred at the one stop position, and a component that can be transferred onto the substrate at a plurality of stop positions is transferred. Transfer at the stop position where the time required for loading is the shortest,
The computing unit is
When the substrate is stopped at the first stop position, the region on the substrate that protrudes from the movable region of the head unit is a first region, and the first region is a movable region of the head unit. When the substrate is stopped at the second stop position included in the area, the region on the substrate that protrudes from the movable region of the head unit is the second region, the first region, and the second region. The area on the substrate excluding is set as a third area,
A group is set for each electronic component that is picked up by the head unit and transferred onto the substrate,
The group including electronic components to be transferred to the first region is set to be transferred when the substrate is stopped at the second stop position;
Setting the group including electronic components to be transferred to the second region to be transferred when the substrate is stopped at the first stop position;
The surface that is set to be transferred when the group consisting of only the electronic components to be transferred to the third region is stopped at a stop position with a shorter time required for transferring the electronic components. Mounting machine. The transport unit includes a first fixing unit that fixes the substrate on the upstream side in the transport direction of the substrate with reference to an end on the upstream side of the substrate, and a downstream side of the substrate in the transport direction. surface mounting machine according to claim 1 Symbol mounting, characterized in that it comprises a second fixing means for fixing the substrate to the end as a reference. The transport unit includes a first fixing unit that fixes the substrate on the downstream side in the transport direction of the substrate with reference to the downstream end of the substrate, and a downstream side in the transport direction from the first fixing unit. in a surface mounting apparatus of claim 1 Symbol mounting, characterized in that it comprises a second fixing means for fixing the substrate relative to the downstream end of the substrate. The transport unit is a table that moves in the transport direction of the substrate, and is provided on the table, and the substrate is fixed on the table on the downstream side of the transport direction of the substrate with reference to the downstream end of the substrate. surface mounting machine according to claim 1 Symbol mounting, characterized in that it comprises a fixing means for. A transport unit for transporting the substrate;
A component supply unit for supplying components to be transferred to the substrate;
A mounting method of a surface mounter comprising: a suction head that sucks a component; and a head unit that transfers the component from the component supply unit onto the substrate carried into a predetermined stop position,
When the size of the substrate exceeds the area where the head unit can move, the calculation step of dividing the area on the substrate and setting electronic components to be transferred to this area;
A stop step of stopping the substrate having a size exceeding the area in which the head unit is movable at a plurality of stop positions;
Determining a part to be transferred on the substrate stopped at each stop position according to a time required for transfer of the part at each stop position; and
In the determining step, a part that can be transferred onto the substrate at only one stop position among a plurality of stop positions can be transferred at the one stop position and transferred onto the substrate at a plurality of stop positions. A new part at the stop position where the time required for transfer is the shortest,
The calculation step includes:
When the substrate is stopped at the first stop position, the region on the substrate that protrudes from the movable region of the head unit is a first region, and the first region is a movable region of the head unit. When the substrate is stopped at the second stop position included in the area, the region on the substrate that protrudes from the movable region of the head unit is the second region, the first region, and the second region. The area on the substrate excluding is set as a third area,
A group is set for each electronic component that is picked up by the head unit and transferred onto the substrate,
The group including electronic components to be transferred to the first region is set to be transferred when the substrate is stopped at the second stop position;
Setting the group including electronic components to be transferred to the second region to be transferred when the substrate is stopped at the first stop position;
Mounting the group consisting of only electronic components to be transferred to the third area when the group is stopped at a stop position where the time required to transfer the electronic components is shorter Method.

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