JP2006086379A - Component collating method, component number verifying method, component arrangement data creating method, component library creating method, manufacturing state managing method, and component tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component collating method for a component mounting machine capable of collating a component in less time and effort. <P>SOLUTION: This component collating method is for the component mounting machine which takes out the component according to component tape on which the component is stored and mounts the component on a substrate, and collates the component using a computer. The identification information about the component is stored on the component tape, and an IC tag having a communication function is attached to it. This component collating method comprises an identification information reading step (S13) for reading the identification information about the component in a non-contact manner from the IC tag of the component tape mounted on the component mounting machine, and a collating step (S14) for collating the acquired identification information about the component against the identification information about the component used in the mounting registered beforehand. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component verification method for mounting an electronic component by a component mounter, and more particularly to a component verification method using an IC (Integrated Circuit) tag.

  In a component mounter that mounts electronic components on a substrate such as a printed circuit board, it is necessary to check whether or not the component mounted on the component cassette is correct before mounting. In a conventional component mounting machine, it is disclosed that barcodes are provided at predetermined intervals in the longitudinal direction of a component tape or at each component storage position (see, for example, Patent Documents 1 to 3).

  The bar code is attached to a reel around which a component tape is wound. Prior to the collation of the parts, the barcode information is read by the barcode reader and then written into the memory. The memory is provided in a component cassette to which a reel is mounted. As described above, the barcode information is transferred to the memory prior to the collation of the components because the barcode provided on the component tape as described above does not exist at a fixed position. This is because automatic reading is not possible. For this reason, the component information is temporarily transferred to a memory provided in the component cassette. As a result, the memory exists at a fixed position, and the component information can be automatically read by the memory reader at all times. In this way, when the component mounting is started, the memory of the component cassette is scanned with the memory reader, so that the component verification can be automatically performed and a component cassette setting error can be found.

  Here, the “component tape” is a plurality of components of the same component type arranged on a tape (carrier tape), and is supplied in a state of being wound around a reel (supply reel) or the like. It is mainly used to supply a relatively small size component called a chip component to a component mounter.

A part supplied by the part tape is called a taping part.
Japanese Patent Laid-Open No. 5-21995 Japanese Patent Laid-Open No. 5-198968 JP-A-7-76364

  However, in the conventional component mounting machine, it is necessary to transfer the barcode information to the memory of the component cassette for each tape of the component type to be used prior to component verification, which is troublesome. There's a problem. Generally, since there are 20 to 50 types of component tapes used in one component mounting machine, and more than 100 types in many cases, the operator transfers all the component tapes to the memory of the component cassette. I have to work.

  The present invention has been made to solve the above-described problem, and is a component mounter that can automatically perform component verification by a component mounter without writing information on a component tape into a component cassette. An object of the present invention is to provide a method for collating parts.

  A component verification method according to an aspect of the present invention is a component verification method that targets a component mounter that takes out a component from a component tape in which the component is stored and mounts the component on a board, and compares the component using a computer. The component tape is provided with storage means for storing component identification information at a position where the stored content can be read at any time, and from the storage means of the component tape mounted on a component mounter. An identification information reading step for reading the identification information of the component; and a verification step for comparing the read identification information of the component with the identification information of the component used for mounting registered in advance.

  A storage means is attached to the component tape at a position where the stored contents can be read at all times. By reading the component identification information from the storage means of the component tape, it is possible to collate with a pre-registered mounted component. Is doing. For this reason, it is possible to automatically perform component verification by the component mounter without writing the information on the component tape into the component cassette.

  Preferably, the component mounter includes a reading unit that reads the storage content of the storage unit at a position where the storage content of the storage unit can be read for each position where a component tape is mounted. The component verification method further includes a mounting position specifying step of specifying a mounting position of the component tape based on an installation position of the reading unit that has read the storage content of the storage means, and is acquired in the verification step. In addition, the component identification information and the mounting position of the component tape are collated with the registered identification information of the component used for mounting and the mounting position of the component tape.

  According to this configuration, the position of the component is specified from the storage means attached to the component tape, the component identification information is acquired, and the component is collated. For this reason, it is not necessary to transfer the barcode information to the memory of the component cassette prior to component verification as in the prior art, so that the components can be verified with little effort. Further, it is not necessary to move the component cassette with the head for reading information, and operation loss during component mounting can be reduced. Further, since the mounting position of the component tape is specified based on the installation position of the reading unit that has read the storage content of the storage means, the mounting position can be collated. For this reason, it is not necessary to move the component cassette in order to specify the position, and the operation loss at the time of component mounting can be reduced.

  Preferably, the component verification method further includes a step of detecting a joint of the component tape, and the identification information reading step further includes a component tape newly connected when the joint of the component tape is detected. The component identification information is read from the storage means, and in the collating step, collation is further performed when a seam of the component tape is detected.

  Even when a new component tape is connected, it is verified whether or not the component of the component tape is correct. For this reason, it is possible to prevent an error in joining the component tapes.

  The component number confirmation method according to another aspect of the present invention is directed to a component mounter that takes out a component from a component tape in which the component is stored and mounts it on a board, and confirms the number of components using a computer. In this method, the component tape is provided with storage means for storing component identification information and the number of components at a position where the stored contents can be read at all times, and is attached to the component mounter. In addition, the identification information reading step of reading the identification information of the component from the storage unit of the component tape, the collation for comparing the read identification information of the component and the identification information of the component used for mounting registered in advance A step, a step of reading the number of the components from the storage means of the component tape mounted on a component mounting machine, and each time a component is mounted on the board A step of 1 decrements the number of members in parts corresponding to the parts, Number of the component and a step for issuing a warning if it becomes less than a predetermined threshold value.

  The remaining number of parts can be confirmed based on the number of parts stored in the storage means. For this reason, the parts can be replaced before the parts are exhausted, and the operation loss at the time of mounting the parts can be reduced.

  A component arrangement data creation method according to still another aspect of the present invention is directed to a component mounter that takes out a component from a component tape in which the component is stored, and mounts the component on a board, and creates component arrangement data using a computer. In the component arrangement data creation method, the component tape is provided with a storage unit storing component identification information at a position where the stored content can be read at all times, and is mounted on the mounting machine. The step of reading the identification information of the component from the storage means of the component tape, the mounting position specifying step of specifying the mounting position of the component tape, the identification information of the component and the mounting position of the component tape are associated with each other, Creating as part arrangement data. Preferably, the component mounter is provided with a reading unit that reads the storage content of the storage unit at a position where the storage content of the storage unit can be read for each position where a component tape is mounted. In the mounting position specifying step, the mounting position of the component tape is specified based on the installation position of the reading unit that has read the stored contents of the storage means.

  Based on the installation position of the reading unit that reads the storage content of the storage means, the mounting position of the component tape is specified, and the component arrangement data is created. For this reason, it is not necessary to move the component cassette in order to specify the position, and component arrangement data can be created at high speed.

  A component library creating method according to still another aspect of the present invention is a component library for creating a component library using a computer for a component mounter that takes out components from a component tape in which components are stored and mounts them on a board. In the production method, the component tape is provided with a storage means at a position where the stored content can be always read, and the storage means includes at least component identification information, size information, and color information. Library information including any one of the component information and the shape information is stored, and the library includes any of the component identification information, size information, color information, and shape information from the storage unit of the component tape mounted on the component mounter A step of reading information, and extracting predetermined information from the library information to obtain a component label necessary for the target component mounter. And a step to create a library.

  The library information of the parts stored in the storage means is read and a parts library is automatically created. For this reason, a parts library can be created without taking time and effort.

  A manufacturing status management method according to still another aspect of the present invention is directed to a component mounter that takes out a component from a component tape in which the component is stored and mounts the component on a substrate, and manages the manufacturing status of the substrate using a computer. In the manufacturing status management method, the component tape is provided with a storage means at a position where the stored contents can be read at all times, and the storage means includes at least component information including identification information of the component. The step of reading the component information from the storage unit of the component tape stored and mounted on the component mounting machine, and the storage unit provided on the substrate with the component information regarding the component used when mounting the component on the substrate And writing to.

  The component information of the component used at the time of component mounting is written in the storage means provided on the substrate to be mounted. For this reason, information on what components have been used can be stored in the substrate, which can be used for investigating the cause when a problem occurs in the product.

  A component tape according to still another aspect of the present invention is a component tape used in a component mounter for mounting a substrate, the tape, a plurality of components of the same type arranged on the tape, and the tape A reel for winding the tape, a position on the reel, and a position where the stored content can be read at all times, and component information including identification information of the plurality of components is stored and has a communication function Storage means.

  Since the component information is written in the storage means, the component information can be read. For this reason, it is not necessary to transfer the barcode information to the memory of the component cassette prior to the component verification as in the prior art, and the components can be verified with little effort. Further, it is not necessary to move the component cassette for reading information, and the operation loss during component mounting can be reduced.

  The present invention can be realized not only as various methods as described above, but also as various devices using steps included in such a method, or as a program for causing a computer to execute each step. You can also It goes without saying that such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc-Read Only Memory) or a transmission medium such as the Internet.

As described above, according to the present invention, parts can be collated with little effort.
In addition, it is possible to reduce operation loss during component mounting.

  Furthermore, even when a new component tape is connected, it is possible to prevent a component tape connection error.

  Furthermore, since the component arrangement can be automatically created simply by setting the component cassette in the component mounter, the component arrangement data can be created at high speed.

In addition, a parts library can be created without taking time and effort.
Furthermore, the cause can be investigated when a problem occurs in the product.

(Embodiment 1)
Hereinafter, a component mounting system according to an embodiment of the present invention will be described with reference to the drawings.
(Component mounting system)
FIG. 1 is an external view showing the overall configuration of a component mounting system 10 according to the present invention. The component mounting system 10 includes a plurality of component mounters 100 and 200 constituting a production line for mounting electronic components while sending the circuit board 20 from upstream to downstream, and various databases for starting production. A component collating apparatus 300 that optimizes the mounting order of necessary electronic components based on this and downloads the obtained NC (Numeric Control) data to the component mounters 100 and 200 for setting and control.

  The component mounter 100 includes two sub facilities (a front sub facility 110 and a rear sub facility 120) that perform component mounting simultaneously and independently or in cooperation with each other (or in an alternate operation). Each sub-equipment 110 (120) is an orthogonal robot type mounting stage, and includes two component supply units 115a and 115b composed of an array of a maximum of 48 component cassettes 114 for storing component tapes, and a maximum of 10 from these component cassettes 114. A multi mounting head 112 (10 nozzle head) having 10 suction nozzles (hereinafter also simply referred to as “nozzles”) capable of sucking and mounting individual components on the substrate 20, and moving the multi mounting head 112 An XY robot 113, a component recognition camera 116 for two-dimensionally or three-dimensionally inspecting the suction state of the components sucked by the multi-mounting head 112, a tray supply unit 117 for supplying tray components, and the like. Each sub-equipment performs component mounting on the board independently of (in parallel with) the other sub-equipment.

  The “component tape” is actually a plurality of components of the same component type arranged on a tape (carrier tape) and supplied in a state of being wound around a reel (supply reel) or the like. . It is mainly used to supply a relatively small size component called a chip component to a component mounter. The “component type” indicates the type of electronic component such as a resistor or a capacitor.

A part supplied by the part tape is called a taping part.
Specifically, the component mounter 100 is a mounter having the functions of both a component mounter called a high-speed mounter and a component mounter called a multi-function mounter. A high-speed mounting machine is a facility characterized by high productivity that mainly mounts electronic parts of □ 10 mm or less at a speed of about 0.1 seconds per point. A multi-function mounting machine is a large model of □ 10 mm or more. It is equipment for mounting electronic parts, odd-shaped parts such as switches and connectors, and IC parts such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

  In other words, the component mounting machine 100 is designed to mount almost all kinds of electronic components (from 0.6 mm × 0.3 mm chip resistance to 200 mm connector as components to be mounted) A production line can be configured by arranging a required number of the component mounting machines 100.

(Component mounter configuration)
FIG. 2 is a plan view showing a main configuration of the component mounter 100 according to the present invention.
The shuttle conveyor 118 is a moving table (component conveyor) for loading the components taken out from the tray supply unit 117 and transporting them to a predetermined position where the multi-mounting head 112 can suck them. The nozzle station 119 is a table on which replacement nozzles for accommodating various types of component types are placed.

  The two component supply units 115a and 115b constituting each sub-equipment 110 (or 120) are respectively arranged on the left and right with the component recognition camera 116 interposed therebetween. Therefore, the multi-mounting head 112 that has picked up the components in the component supply unit 115a or 115b moves to the mounting point of the board 20 after passing through the component recognition camera 116, and performs an operation of sequentially mounting all of the sucked components. repeat. “Mounting point” refers to a coordinate point on a board on which a component is to be mounted, and components of the same component type may be mounted at different mounting points. The total number of components (mounting points) arranged on the component tape relating to the same component type matches the number of components of that component type (total number of components to be mounted).

  Here, a single operation (suction / moving / mounting) in a repetition of a series of operations of picking / moving / mounting components by the multi-mounting head 112, or a group of components mounted by such a single operation is described as “ This is called “task”. For example, according to the 10 nozzle head 112, the maximum number of components mounted by one task is 10. Here, “suction” includes all suction operations from when the head starts to pick up components until it moves. For example, 10 suction operations (up and down operation of the multi mounting head 112). This includes not only the case of picking up these parts, but also the case of picking up 10 parts by a plurality of picking operations.

  FIG. 3 is a schematic diagram showing the positional relationship between the multi-mounting head 112 and the component cassette 114. The multi-mounting head 112 is a working head called “gang pickup system”, and can mount a maximum of ten suction nozzles 112a to 112b. At this time, a component from each of a maximum of ten component cassettes 114 can be mounted. Can be adsorbed simultaneously (by a single up-and-down motion).

  Note that only one component tape is loaded into the component cassette 114 called “single cassette”, and two component tapes are loaded into the component cassette 114 called “double cassette”. The position of the component cassette 114 (or component tape) in the component supply units 115a and 115b is referred to as “value on the Z axis” or “position on the Z axis”, and the leftmost end of the component supply unit 115a is “1”. A serial number or the like is used. Accordingly, as an important procedure for determining the mounting order for taping components, the arrangement (position on the Z-axis) of the component type (or component tape or component cassette 114 storing the component tape) is determined. . The “Z-axis” refers to a coordinate axis (or a coordinate value thereof) that specifies an arrangement position of a component cassette mounted for each component mounter (or a sub-equipment when a sub-equipment is provided).

  As shown in FIG. 4A, each component supply unit 115a, 115b, 215a, 215b can mount a maximum of 48 component tapes (the positions are Z1 to Z48, Z49 to Z96, Z97 to Z144, Z145 to Z192). Specifically, as shown in FIG. 4B, a maximum of 48 types can be provided for each component supply unit (A block to D block) by using a double cassette containing two component tapes having a tape width of 8 mm. Can be mounted. The larger the tape width (component cassette), the smaller the number of cassettes that can be mounted in one block.

  It should be noted that the left-side component supply units 115a and 215a (A block, C block) toward each sub-equipment are “left block”, and the right-side component supply units 115b and 215b (B block and D block) toward each sub-equipment. Is also called “right block”.

  FIG. 5A and FIG. 5B are a diagram and a table showing examples of the position (Z axis) of the component supply unit that can be picked up by the 10 nozzle head. In addition, H1-H10 in a figure points out the nozzle (position) mounted in the 10 nozzle head.

  Here, the interval between the nozzles of the 10-nozzle head corresponds to the width (21.5 mm) of one double cassette, so the Z numbers of parts picked up by one up-and-down movement are every other number (only odd numbers) (Or even number only). Furthermore, due to the movement restriction of the 10 nozzle head in the Z-axis direction, as shown in FIG. 5B, the nozzle that cannot adsorb to the component (Z-axis) constituting one end of each component supply unit ("-" In the figure) exists.

Next, the detailed structure of the component cassette 114 will be described with reference to FIGS.
Various chip-type electronic components 423a to 423d as shown in FIGS. 6 (a) to 6 (d) are stored in a storage recess 424a continuously formed at a constant interval on the carrier tape 424 shown in FIG. Cover tape 425 is pasted and packaged, and the tape is supplied to the user in a taping form (component tape) in which a predetermined quantity is wound around supply reel 426. However, the shape of the part in which the electronic component is stored is not limited to the concave shape.

  As shown in FIG. 7, a slide member 509 made of, for example, a resin molded product is slidably attached to the component tape. The IC tag 426b is attached to the slide member 509.

  The IC tag 426b attached in this way can always stay at a fixed position with respect to the component mounting machines 100 and 200 even when the component tapes are sequentially pulled out for component mounting. . For example, the slide member 509 is locked to a predetermined part of the component mounting machines 100 and 200, so that the slide member 509 stays at a fixed position while sliding with respect to the component tapes sequentially pulled out.

  As a result, the IC tag reader / writer 111 of the component mounters 100 and 200 can read component information from the IC tag 426b on the component tape even during component mounting.

  The component mounters 100 and 200 can write the remaining number of electronic components 423d included in the component tape into the IC tag 426b using the IC tag reader / writer 111. Thereby, even if the component tape in use is removed from the component mounters 100 and 200 together with the supply reel 426, the slide member 509 is attached to the component tape, and the component tape is attached to the slide member 509. The remaining number of electronic components 423d is written in the IC tag 426b. As a result, the user can surely manage the electronic component 423d without recounting the remaining number of electronic components 423d included in the component tape removed midway.

  In the IC tag 426b, the part name of the taping part, the part number, the number, the manufacturer name, the manufacturing factory name, the manufacturing date and time, the lot name, the serial number and other manufacturing information, the part dimensions, and the width of the part cassette 114 to which the carrier tape 424 is attached , Information such as the pitch interval of the storage recess 424a, freshness information such as the date of manufacture of the taping component, the start date of use written when the taping component is opened, and heat resistant temperature information in the solder melting process in the reflow furnace are stored. ing. In addition to the carrier tape 424 shown in FIG. 7, there are an adhesive tape in which components are adhesively fixed to the tape, a paper tape, and the like.

  Such a taping electronic component 423d is used by being mounted on a component cassette 114 as shown in FIG. 8, and in FIG. 8, a supply reel 426 is rotatable on a reel side plate 428 coupled to a main body frame 427. It is attached. The carrier tape 424 pulled out from the supply reel 426 is guided by a feed roller 429, and is provided in the apparatus in conjunction with an operation of an electronic component automatic mounting device (not shown) on which the electronic component supply device is mounted. The feed lever 430 of the electronic component supply device is moved in the direction of arrow Y1 in the drawing by a feed lever (also not shown), and the ratchet 432 is rotated by a constant angle via a link 431 attached to the feed lever 430. Then, the feed roller 429 interlocked with the ratchet 432 is moved by a constant pitch (for example, a feed pitch of 2 mm or 4 mm). The carrier tape 424 may be sent out by motor driving or cylinder driving.

  Further, the carrier tape 424 is peeled off from the cover tape 425 by the cover tape peeling portion 433 in front of the feed roller 429 (supply reel 426 side), and the peeled cover tape 425 is wound around the cover tape take-up reel 434. The carrier tape 424 from which the cover tape 425 has been peeled off is conveyed to an electronic component take-out unit 435, and from the electronic component take-out unit 435 that opens in conjunction with the ratchet 432 simultaneously with the feeding roller 429 carrying the carrier tape 424. The chip-type electronic component 423d stored in the storage recess 424a is sucked and taken out by a vacuum suction head (not shown). Thereafter, the feed lever 430 is released from the pushing force by the feed lever and returns to the Y2 direction, that is, to the original position by the urging force of the tension spring 436.

  When the above series of operations is repeated, the used carrier tape 424 is configured to be discharged to the outside of the electronic component supply device.

  FIG. 9 is a diagram showing the positional relationship between the IC tag reader / writer provided in the component cassette and the IC tag on the slide member. A part of the component cassette 114 is covered with a cover 510, and the carrier tape 424 wound around the supply reel 426 enters the cover 510 while being pulled out from the supply reel 426. The IC tag reader / writer 111 is provided near the entrance of the cover 510. The height of the entrance of the cover 510 is designed to be lower than the height of the slide member 509. For this reason, when the carrier tape 424 enters the inside of the cover 510, the slide member 509 always stays near the entrance of the cover 510. Therefore, the IC tag reader / writer 111 can stably read information stored in the IC tag 426b attached to the slide member 509 or write information into the IC tag 426b.

  FIG. 10 is a diagram for explaining a path until the electronic component 423d accommodated in the carrier tape 424 wound around the supply reel 426 is attracted by the multi-mounting head 112. FIG.

  The carrier tape 424 wound around the supply reel 426 moves to the left in the drawing as the supply reel 426 rotates. At this time, the cover tape 425 is peeled from the carrier tape 424 when the top tape take-up reel 484 rotates. After the cover tape 425 is peeled off from the carrier tape 424, the multi mounting head 112 sucks the electronic component 423d from the carrier embossed tape 483 and mounts it on the substrate 20.

  An IC tag reader / writer 111 is provided for each component cassette 114. The control unit 480 controls reading and writing of the IC tag reader / writer 111 provided for each component cassette 114. That is, the control unit 480 operates one of the IC tag reader / writers 111 to read / write information between the IC tag reader / writer 111 and the IC tag 426b of the component tape corresponding to the IC tag reader / writer 111. To do. For this reason, the position of the IC tag is easily specified by the operation of the control unit 480.

  FIG. 11 is a diagram showing a circuit configuration of the IC tag reader / writer 111 and a circuit configuration of the IC tag.

  The IC tag reader / writer 111 includes a modulation / demodulation unit 462 connected to an AC power source 461, a control unit 463, an interface unit 464, and an antenna 465.

  The modulation / demodulation unit 462 is a circuit that communicates with the IC tag 426b via the antenna 465. The modulation / demodulation unit 462 transmits power carrier waves to the IC tag 426b and receives information on components transmitted from the IC tag 426b. . That is, while the modulation / demodulation unit 462 receives the control code output from the control unit 463, the modulation / demodulation unit 462 generates a power carrier signal of a radio frequency (RF: Radio Frequency, for example, 13.56 MHz), and converts the signal into power It is converted into a carrier wave and transmitted from the antenna 465. In addition, the modulation / demodulation unit 462 transmits information on a component to be written to the IC tag 426b from the antenna 465.

  The control unit 463 controls transmission of the power carrier radio wave by the modulation / demodulation unit 462 and stop of the transmission, and outputs the component information received by the modulation / demodulation unit 462 to the outside via the interface unit 464.

  The IC tag 426b includes an antenna 471, a modulation / demodulation unit 472, a power generation unit 473, and a logic memory 474. The logic memory 474 stores component information.

  The power generation unit 473 receives the power carrier radio wave transmitted from the IC tag reader / writer 111 via the antenna 471 by the electromagnetic induction method or the electromagnetic coupling method, and generates high-frequency induced power. The power generation unit 473 further rectifies the induced power, smoothes the voltage of the rectified induced power to a constant value, accumulates DC power, and the antenna 471 receives the power carrier radio wave. Meanwhile, the generated DC power is continuously supplied to the modulation / demodulation unit 472 and the logic memory 474.

  The modulation / demodulation unit 472 converts the component information stored in the logic memory 474 into a radio wave and outputs it to the outside via the antenna 471. As long as the modulation scheme matches the demodulation scheme in the modulation demodulator 462 of the IC tag reader / writer 111, an arbitrary scheme such as ASK (Amplitude Shift Keying) or FSK (Frequency-Shift Keying) can be used. it can. The modulation / demodulation unit 472 also demodulates the component information transmitted from the IC tag reader / writer 111 and writes it into the logic memory 474.

The operational characteristics of the component mounter 100 are summarized as follows.
(1) Nozzle replacement When the nozzle required for the next mounting operation is not in the multi mounting head 112, the multi mounting head 112 moves to the nozzle station 119 and performs nozzle replacement. As types of nozzles, there are, for example, types S, M, and L, depending on the size of the parts that can be picked up.
(2) Component adsorption The multi-mounting head 112 moves to the component supply units 115a and 115b and adsorbs electronic components. When 10 parts cannot be picked up at the same time, a maximum of 10 parts can be picked up by moving the picking position up and down several times.
(3) Recognition Scan The multi mounting head 112 moves on the component recognition camera 116 at a constant speed, captures images of all electronic components sucked by the multi mounting head 112, and accurately detects the suction position of the components.
(4) Component mounting Electronic components are sequentially mounted on the substrate 20.

By repeating the operations (1) to (4), all electronic components are mounted on the substrate 20. The operations (2) to (4) are basic operations in mounting a component by the component mounter 100, and correspond to “tasks”. That is, a maximum of 10 electronic components can be mounted on the board in one task.
(Multi mounting head)
The multi mounting head 112 includes 10 mounting heads that perform independent suction and mounting operations in a row, and a maximum of 10 suction nozzles can be attached and detached. Up to 10 parts can be picked up at the same time by one pick up and down action.

  In addition, when referring to “individual working heads (working heads that pick up one component)” constituting the multi-mounting head, they are simply referred to as “mounting heads (or“ heads ”)”.

  Due to the structure in which the ten mounting heads constituting the multi mounting head 112 are arranged in a straight line, there are restrictions on the movable range of the multi mounting head 112 during component adsorption and component mounting. Specifically, as shown in FIG. 5B, when the electronic component is adsorbed at both ends of the component supply unit (near the left end of the left block 115a and the right end of the right block 115b), there is an accessible mounting head. Limited.

  Also, when the electronic component is mounted on the substrate, the movable range of the multi mounting head 112 is limited.

(Part recognition camera)
The component mounter 100 includes a 2D camera that captures a two-dimensional image and a 3D camera that can also detect height information as the component recognition camera 116. 2D cameras include 2DS cameras and 2DL cameras depending on the size of the field of view that can be captured. The 2DS camera has a small field of view but can perform high-speed imaging, and the 2DS camera is characterized by a large field of view up to 60 × 220 mm. The 3D camera is used to three-dimensionally check whether all leads of the IC component are bent.

  The recognition scanning speed when imaging an electronic component varies depending on the camera. If a part using a 2DS camera and a part using a 3D camera exist in the same task, the recognition scan needs to be performed twice at each speed.

(Parts supply department)
There are two types of electronic component packages: a method called taping for storing electronic components in a tape shape, and a method called a tray for storing them in a plate with partitions according to the size of the components.

  Supply of components by taping is performed by the component supply units 115a and 115b, and supply by a tray is performed by the tray supply unit 117.

  Taping of electronic parts is standardized, and taping standards from 8 mm to 72 mm exist depending on the size of the parts. By setting such a tape-shaped component (component tape) in a component cassette (tape feeder unit) corresponding to the tape width, it is possible to continuously take out the electronic components in a stable state.

  The component supply unit for setting the component cassette is designed so that component tapes up to a width of 12 mm can be mounted at a 21.5 mm pitch without any gap. When the tape width is 16 mm or more, the gap is set by a necessary amount according to the tape width. In order to pick up a plurality of electronic components simultaneously (by one up-and-down movement), the pitches in the arrangement of the mounting head and the component cassette need only match. For parts with a tape width of up to 12 mm, simultaneous suction of 10 points is possible.

  Note that a maximum of 48 component tapes up to a width of 12 mm can be mounted on each of the two component supply units (the left block 115a and the right block 115b) constituting the component supply unit.

(Parts cassette)
The component cassette includes a single cassette that can store only one component tape and a double cassette that can store a maximum of two component tapes. The two component tapes stored in the double cassette are limited to component tapes having the same feed pitch (2 mm or 4 mm).

(Parts verification device)
The component verification device 300 is a device for verifying whether the component cassette 114 containing component tapes is correctly set in the component supply units 115a and 115b.

(Hardware configuration of parts verification device)
The component verification apparatus 300 is realized by a general-purpose computer system such as a personal computer executing the component verification program according to the present invention.

  FIG. 12 is a block diagram showing a hardware configuration of the component verification apparatus 300 shown in FIG. The component verification device 300 is a computer device for verifying whether the placement position of the component tape in each facility constituting the production line is correct. The calculation control unit 301, the display unit 302, the input unit 303, the memory unit 304, the component verification It comprises a program storage unit 305, a communication I / F (interface) unit 306, a database unit 307, a component arrangement data storage unit 308, and the like.

  The arithmetic control unit 301 is a CPU (Central Processing Unit), a numerical processor, or the like, and loads and executes a necessary program from the component collation program storage unit 305 to the memory unit 304 in accordance with an instruction from the user, and the execution result. The components 302 to 307 are controlled in accordance with the above. The arithmetic control unit 301 obtains information about the component cassette 114 from the component mounting machine 100 (200), creates a component library and component arrangement data from the information, and stores them in the database unit 307 and the component arrangement data storage unit 308, respectively. Store. The creation process of the component library and the component arrangement data will be described later.

  The display unit 302 is a CRT (Cathode-Ray Tube), LCD (Liquid Crystal Display), or the like, and the input unit 303 is a keyboard, a mouse, or the like. 300 is used for dialogue between the operator and the operator. A specific user interface is as described in a screen display example described later.

  The communication I / F unit 306 is a LAN (Local Area Network) adapter or the like, and is used for communication between the component verification apparatus 300 and the component mounters 100 and 200.

  The memory unit 304 is a RAM (Random Access Memory) or the like that provides a work area for the arithmetic control unit 301. The component verification program storage unit 305 is a hard disk or the like that stores various component verification programs that implement the functions of the component verification device 300.

  The database unit 307 stores input data (mounting point data 307a, component library 307b, and mounting device information 307c) used for component matching processing by the component matching device 300, mounting point data generated by optimization, and the like. It is.

  The component arrangement data storage unit 308 is a hard disk or the like that stores component arrangement data indicating the position of the component tape on the Z axis.

  13 to 15 show examples of the mounting point data 307a, the component library 307b, and the mounting apparatus information 307c, respectively.

  The mounting point data 307a is a collection of information indicating mounting points of all components to be mounted. As shown in FIG. 13, one mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, and control data φi. Here, “component type” corresponds to a component name in the component library 307b shown in FIG. 14, and “X coordinate” and “Y coordinate” are coordinates of a mounting point (coordinates indicating a specific position on the board). The “control data” is restriction information related to the mounting of the component (type of suction nozzle that can be used, maximum moving speed of the multi mounting head 112, etc.). The NC data to be finally obtained is an arrangement of mounting points that minimizes the line tact.

  The component library 307b is a library in which unique information about all the component types that can be handled by the component mounters 100 and 200 is collected. As illustrated in FIG. 14, the component size and tact ( And other constraint information (a type of suction nozzle that can be used, a recognition method by the component recognition camera 116, a maximum speed ratio of the multi-mounting head 112, and the like). In the drawing, the external appearance of the components of each component type is also shown for reference. In addition, the component library may include information such as component colors and component shapes.

  The mounting apparatus information 307c is information indicating the apparatus configuration for each of the sub-equipment constituting the production line and the above-described restrictions. As shown in FIG. 15, the unit ID indicating the equipment number, the type of the multi mounting head, Head information relating to the above, nozzle information relating to types of suction nozzles that can be mounted on the multi-mounting head, cassette information relating to the maximum number of component cassettes 114, tray information relating to the number of trays stored in the tray supply unit 117, etc. Become.

  These pieces of information are data called as follows. That is, equipment option data (for each sub-equipment), resource data (number of cassettes and nozzles available for each equipment), nozzle station arrangement data (for each sub-equipment with nozzle station), initial nozzle pattern data (for each sub-equipment) Z-axis arrangement data (for each sub-equipment). Regarding the resources, the number of nozzles of each type such as SX, SA, S, etc. is 10 or more.

  FIG. 16 is a diagram illustrating an example of component arrangement data stored in the component arrangement data storage unit 308. The part arrangement data is data indicating the position on the Z-axis where the taping parts are to be arranged. The part name of the taping part, the equipment number (unit ID) in which the part cassette 114 is set, the part cassette 114 On the Z-axis (Z number). The parts cassette 114 must be arranged according to the parts arrangement data.

(Identification of Z number and joint detection)
FIG. 17 is a diagram for explaining the component supply units 115a and 115b in more detail. In the component supply units 115a and 115b, a switch 450 and a joint detection sensor 452 are provided for each Z number. The output of the switch 450 is connected to the control unit 480 described above.

  The switch 450 is a switch that is electrically turned on when the component cassette 114 is mounted on the component supply unit 115a (115b). Based on the output from the switch 450, the component verification device 300 can know the Z number of the component supply unit 115a (115b) in which the component cassette 114 is mounted.

The joint detection sensor 452 is a sensor that optically detects the joint of the carrier tape 424. FIG. 18 is a diagram illustrating a seam of the carrier tape. At the time of component mounting, the end of the carrier tape 441 is connected to the start of another carrier tape 442 before the end of the carrier tape 441 is removed. Such connection enables component replenishment without stopping the component mounter 100 (200). At this time, a notch 446 is generated at the joint 445 between the carrier tape 441 and the carrier tape 442. The joint detection sensor 452 optically detects the cut 446. Any sensor other than the optical detection method may be used as long as it can detect the joint. When the carrier tape 441 is joined to the carrier tape 441, the carrier tape 442 may be joined after removing the slide member 509 attached to the carrier tape 441. By doing in this way, it can prevent that two slide members 509 are attached with respect to a series of component tapes, and two component information is obtained.
(Part verification process)
FIG. 19 is a flowchart of the component matching process.

  Based on the output of the switch 450, the component verification device 300 checks whether or not the component cassette 114 containing the component tape is set in the component supply units 115a and 115b (S11A). When the component cassette 114 is newly set in the component supply units 115a and 115b (YES in S11A), the Z number of the component cassette 114 set is specified from the output of the switch 450 (S12A). Thereafter, the control unit 480 operates the IC tag reader / writer 111 corresponding to the component cassette 114 for which the Z number is specified, so that the IC tag reader / writer 111 receives the IC of the component tape that has arrived at the component cassette 114. Component information is acquired from the tag 426b (S13).

  The component verification device 300 checks whether the set component tape is correct (S14). That is, when the part name, unit ID, and Z number of the set part tape match those registered in the part arrangement data, it is determined to be correct. Even if the part names of the set part tapes do not match, it is determined that the part tape of a part that can be substituted for the part registered in the part arrangement data is correct. It is assumed that information regarding a replaceable part is written in advance in the IC tag 426b. Moreover, it is good also as what is previously registered into component collation data or a component library.

  If the correct component tape is not set (NO in S14), a warning is issued (S15), and then the process returns to the process of checking whether the component cassette is set (S1). If the correct component cassette is set (YES in S14), the component verification process is terminated.

  As described above, when the component cassette is set in the component supply unit before the component mounting is started, it can be checked whether or not the correct component is mounted on the component supply units 115a and 115b, and incorrect components are mounted. Can be prevented.

(Parts verification processing when connecting part tapes)
FIG. 20 is a flowchart of the component verification process when connecting component tapes. When the remaining component tape is low, the end of the component tape is connected to the start of a new component tape, and at this time, this program is executed so that no erroneous component is connected. This program is started after the component mounting process (S16) is started, and is executed in parallel with the component mounting process program.

  Wait until the seam detection sensor 452 detects the seam of the carrier tape 424 (S21). When the seam is detected (YES in S21), the Z number of the parts cassette in which the newly connected parts tape is stored is specified. (S22). The identification of the Z number is performed based on the output of the joint detection sensor 452. Thereafter, the control unit 480 operates the IC tag reader / writer 111 corresponding to the component cassette 114 for which the Z number is specified, so that the IC tag reader / writer 111 receives the IC of the component tape that has arrived at the component cassette 114. Component information is acquired from the tag 426b (S23).

  The component verification device 300 checks whether or not the component tape newly connected from the component information is correct (S24). The determination as to whether or not it is correct is the same as the part collating process (S14) in FIG. If the correct component tape is connected (YES in S24), no processing is performed. If an incorrect component tape is connected (NO in S24), a warning is issued (S25), and then the component mounting process is performed. Is stopped (S26).

  In this way, even if an incorrect component tape is connected, the component mounting process can be stopped before the component mounting, so that the product yield can be improved.

(Manufacturing information writing process)
FIG. 21 is a flowchart of the manufacturing information writing process.
The manufacturing information writing process is a process of writing manufacturing information to an IC tag provided on a board when a component is mounted. This processing program is executed in parallel with the component mounting processing program. Each time a component is mounted on the board (YES in S31), the component verification apparatus 300 decrements the remaining number of mounted components by one (S32). The component verification apparatus 300 performs processing by setting the number of components registered in the IC tag 426b when the component tape is mounted as the remaining number of components.

  Next, the component verification apparatus 300 writes the information of the mounted component on the IC tag provided on the board (S33). In addition, information regarding the component mounter 100 (200) used at the time of manufacture may be written. For example, component information related to components used when components are mounted on a board, and production information such as production management information, error information, nozzle information, and camera information. Information is written using an IC tag reader / writer 111.

  Thereafter, it is checked whether the remaining number of parts is less than a predetermined threshold value (S34). If it is less than the threshold value (YES in S34), the remaining number of parts tape is small, so the part verification The device 300 issues a warning (S35). After the warning, it is checked whether or not the number of remaining parts is 0 (S36). If the number of remaining parts becomes 0 (YES in S36), the mounting of the parts is stopped (S37).

  In this way, information on the manufacturing apparatus, parts, and the like can be tracked by writing information on the IC tag 426b provided on the substrate.

  As described above, according to the present embodiment, component information is obtained in a non-contact manner from an IC tag attached to a component tape, and components are collated. For this reason, parts can be collated with little effort.

  Further, it is not necessary to move the component cassette for reading the component information, and the operation loss at the time of component mounting can be reduced.

  Further, when a seam of the carrier tape is detected, component information is acquired from the IC tag of the newly connected component tape, and component verification is performed. For this reason, it is possible to prevent an error in joining the component tapes.

  In addition, information on the mounted components is written on an IC tag provided on the board. For this reason, it can be used for investigating the cause when the product has a problem.

(Embodiment 2)
Next, a component mounting system according to Embodiment 2 of the present invention will be described. The configuration of the component mounting system according to the present embodiment is the same as that shown in the first embodiment. However, the component mounting system according to the present embodiment can perform the following component arrangement data creation processing and component library creation processing prior to component mounting.

(Part array data creation process)
FIG. 22 is a flowchart of the component arrangement data creation process.
Prior to component mounting, component array data creation processing as shown in FIG. 22 is performed. The component verification device 300 checks the Z number of the set component cassette 114 based on the information from the switch 450 of the component supply units 115a and 115b shown in FIG. 17 (S1A). Next, the control unit 480 operates the IC tag reader / writer 111 corresponding to the component cassette 114 for which the Z number is specified, so that the IC tag reader / writer 111 receives the component tape that has arrived at the component cassette 114. Information (part name, etc.) is acquired from the IC tag 426b (S2A).

  Based on the information acquired from the IC tag 426b, the component verification apparatus 300 creates component array data including a component name, a unit ID, and a Z number, and stores the component array data in the component array data storage unit 308 (S3).

  As described above, by simply setting the necessary parts in the parts supply units 115a and 115b, it is possible to know where and what parts have been set, and the array data can be automatically generated without creating array data in advance by the user's hand. The component mounting can be performed. In particular, in the case of high-mix low-volume production, since the number of production boards of one type is small, there is no point in optimizing the arrangement of parts. There is an advantage that parts arrangement data can be created in the same order.

(Part library creation process)
FIG. 23 is a flowchart of the parts library creation process.
Prior to component mounting, component library creation processing as shown in FIG. 23 is performed. The component verification apparatus 300 checks the Z number of the set component cassette 114 based on the information from the switch 450 of the component supply units 115a and 115b shown in FIG. 17 (S16). Next, the component verification apparatus 300 reads and acquires information (such as a component name) stored in the IC tag 426b by the IC tag reader / writer 111 provided at a position corresponding to each component cassette 114 (S17).

  The component collation apparatus 300 creates a component library as shown in FIG. 14 from the component information acquired from the IC tag 426b (S18).

  As described above, since the component library is automatically created, it is possible to reduce the time required for the user to create the component library.

  As described above, according to the present embodiment, in addition to the functions and effects described in the first embodiment, component arrangement data can be created at high speed.

  Also, the library information of the parts stored in the IC tag is read, and the parts library is automatically created. For this reason, a parts library can be created without taking time and effort.

(Modification of the embodiment)
In the first and second embodiments, the component mounter 100 using the component cassette 114 has been described. However, there is a type of component mounter in which the component tape is not stored in the component cassette 114. Such a component mounting machine is provided with a mechanism for feeding a tape to the component supply unit, and by setting the component tape in the tape feeding mechanism, the component tape can be intermittently fed to supply the component.

  In the above-described embodiment, the IC tag reader / writer 111 is provided for each component cassette 114, and the Z position of the component cassette 114 is specified based on the output from the switch 450. It is not necessary to specify the Z position based on the output, and it may be determined that the component cassette 114 has been set in the component supply units 115a and 115b when the information is received by the IC tag reader / writer 111. Thereby, the Z position where the component cassette 114 is set is specified.

  Further, the Z position of the component cassette 114 may be specified by one IC tag reader / writer 111. FIG. 24 is an explanatory diagram for explaining how one IC tag reader / writer 111 specifies the Z position of the component cassette 114.

  For example, the component mounter 100 is arranged from one IC tag reader / writer 111 and the IC tag reader / writer 111 to the vicinity of the IC tag 426B for tape of each component cassette 114 in the component supply unit 115a (115b). And an antenna 111a.

  As described above, since the antenna 111a is located close to each tape IC tag 426B, the IC tag reader / writer 111 can reliably receive the radio wave of the tape IC tag 426B. That is, the IC tag reader / writer 111 can accurately identify the position of each tape IC tag 426B based on the radio wave intensity and reception direction of each tape IC tag 426B, which is the reception result. Further, the IC tag reader / writer 111 can accurately specify the Z position of the component cassette 114 from the position.

  Further, the antenna 111a extending to the vicinity of each tape IC tag 426B may be installed so as to be switchable for each tape IC tag 426B. In this case, since each antenna 111a corresponds to each Z position (Z = 1, 2,...), The IC tag reader / writer 111 switches by acquiring the output of each antenna 111a by switching. The Z position of the tape IC tag 426B (component cassette 114) corresponding to the antenna 111a is specified, and the component data 105 is acquired from the tape IC tag 426B.

  That is, each antenna 111a is provided with a switch. When the switch is turned on, an output from the antenna 111a corresponding to the switch is acquired by the IC tag reader / writer 111. The IC tag reader / writer 111 turns on only the switch of the antenna 111a corresponding to Z = 1 among the switches corresponding to each antenna 111a, and then turns on only the switch of the antenna 111a corresponding to Z = 2. In addition, by sequentially turning on each switch, the output of each antenna 111a is switched and acquired.

  Note that when the switch 450 provided in the component supply unit 115a (115b) is turned on, the switch of the antenna 111a corresponding to the Z position may be turned on.

  Furthermore, one IC tag reader / writer 111 may be provided for each component mounter 100, and the IC tag reader / writer 111 may move in the Z-axis direction of the component supply unit 115a (115b). Thus, when the component cassette 114 is set in the component supply unit 115a (115b), the information stored in the IC tag 426b of the set component cassette 114 is read, and the Z position of the component cassette 114 is determined. It may be specified.

  In the method shown in FIG. 20, when the joint of the carrier tape 424 is detected by the joint detection sensor 452, the IC tag reader / writer 111 corresponding to the component cassette 114 to which the carrier tape 424 is joined is operated. Thus, the component information stored in the IC tag 426b is acquired. On the other hand, in the case where there is only one IC tag reader / writer 111 as shown in FIG. 24, the carrier tape is turned on by turning on the switch of the antenna 111a provided at the position corresponding to the component cassette 114. The component information may be read from the IC tag 426b provided in the component cassette 114 to which 424 is connected. When the IC tag reader / writer 111 is configured to move in the Z-axis direction of the component supply unit 115a (115b), the IC tag reader / writer 111 is moved to the position of the component cassette 114 to which the carrier tape 424 is connected. The component information may be read from the IC tag 426b of the component cassette 114.

  Further, although the IC tag 426b is used as a storage medium attached to the slide member 509, the IC tag 426b is not limited to the IC tag 426b, and any memory, bar code, 2 It may be a dimensional barcode.

  The present invention can be applied to a component mounting system or the like that can perform a plurality of types of component mounting at a time.

1 is an external view showing a configuration of an entire component mounting system according to the present invention. It is a top view which shows the main structures of the component mounting machine in the component mounting system. It is a schematic diagram which shows the positional relationship of the working head and component cassette of the component mounting machine. (A) shows a configuration example of a total of four component supply units included in each of the two mounting units provided in the component mounting machine, and (b) shows the number of various component cassettes mounted in the configuration and the position on the Z axis. It is a table | surface which shows. It is a figure and table | surface which show the example of the position (Z-axis) of the component supply part which 10 nozzle head can adsorb | suck. It is a figure which shows the example of the various chip-type electronic components used as mounting object. It is a figure which shows the example of the carrier tape which accommodated components, and its supply reel. It is a figure which shows the example of the components cassette with which the taping electronic component was mounted | worn. It is a figure which shows the positional relationship of the IC tag reader / writer provided in the component cassette, and the IC tag on a slide member. It is a figure for demonstrating the path | route until the electronic component accommodated in the carrier tape wound around the supply reel is adsorb | sucked by the multi mounting head. It is a figure which shows the circuit structure of an IC tag reader / writer and an IC tag. It is a block diagram which shows the hardware constitutions of a components collation apparatus. It is a figure which shows the example of the content of the mounting point data shown by FIG. It is a figure which shows the example of the content of the components library shown by FIG. It is a figure which shows the example of the content of the mounting apparatus information shown by FIG. It is a figure which shows an example of the components arrangement | sequence data stored in the components arrangement | sequence data storage part of FIG. It is a figure for demonstrating in detail the structure of a components supply part. It is a figure which shows the joint line of a carrier tape. It is a flowchart of a component collation process. It is a flowchart of the component collation process at the time of component tape connection. It is a flowchart of manufacturing information writing processing. It is a flowchart of component arrangement data creation processing. It is a flowchart of a part library creation process. It is a figure for demonstrating a mode that one IC tag reader / writer 111 specifies Z position of a component cassette.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Component mounting system 20 Circuit board 100 Component mounting machine 110 Front sub-equipment 111 IC tag reader / writer 112 Multi mounting head 112a-112b Adsorption nozzle 113 XY robot 114 Component cassette 115a, 115b Component supply part 116 Component recognition camera 117 Tray supply part 118 Shuttle conveyor 119 Nozzle station 120 Sub-equipment 300 Component verification device 301 Calculation control unit 302 Display unit 303 Input unit 304 Memory unit 305 Component verification program storage unit 306 Communication I / F unit 307 Database unit 307a Mounting point data 307b Component library 307c Mounting Device information 308 Component arrangement data storage unit 423d Taping electronic component 424, 441, 442 Carrier tape 424a Storage recess 425 Cover tape 426 Supply reel 426b IC tag 427 Main body frame 428 Reel side plate 429 Feed roller 430 Feed lever 431 Link 432 Ratchet 433 Cover tape stripping part 434 Cover tape take-up reel 435 Electronic component take-out part 436 Tension spring 445 Seam 450 Switch 452 Joint detection sensor 509 Slide member

Claims (42)

A component verification method for extracting a component from a component tape in which the component is stored and mounting the component on a board, and verifying the component using a computer,
The component tape is provided with a storage means in which identification information of the component is stored at a position where the stored content can be read at all times.
An identification information reading step of reading identification information of the component from the storage means of the component tape mounted on a component mounter;
A component collation method comprising: a collation step of collating the read identification information of the component and the identification information of the component used for mounting registered in advance. The component mounter is provided with a reading unit that reads the storage content of the storage unit at a position where the storage content of the storage unit can be read for each position where a component tape is mounted,
And a mounting position specifying step of specifying a mounting position of the component tape based on an installation position of the reading unit that has read the storage content of the storage means,
In the verification step, the acquired identification information of the component and the mounting position of the component tape are compared with the identification information of the component used for mounting and the mounting position of the component tape registered in advance. The part collating method according to claim 1. The component mounter is provided with a reading unit that reads the storage content of the storage unit while moving a position where the storage content of the storage unit can be read.
And a mounting position specifying step of specifying a mounting position of the component tape based on a reading position of the reading unit that has read the storage content of the storage means,
In the verification step, the acquired identification information of the component and the mounting position of the component tape are compared with the identification information of the component used for mounting and the mounting position of the component tape registered in advance. The part collating method according to claim 1. The component mounter is provided with a reading unit that reads the storage content of the storage unit, and an antenna that extends from the reading unit to a position where the storage content of the storage unit can be read,
And a mounting position specifying step of specifying a mounting position of the component tape based on an installation position of the antenna used when reading the storage content of the storage means,
In the verification step, the acquired identification information of the component and the mounting position of the component tape are compared with the identification information of the component used for mounting and the mounting position of the component tape registered in advance. The part collating method according to claim 1. And further comprising detecting a seam of the component tape,
In the identification information reading step, the component identification information is further read from the storage unit of the newly connected component tape when a seam of the component tape is detected,
The component verification method according to claim 1, wherein in the verification step, verification is further performed when a seam of the component tape is detected. The storage means stores alternative information for determining whether there is an alternative relationship with a regular part,
Further, an alternative information reading step of reading the alternative information from the storage means of the component tape mounted on the component mounter;
Based on the replacement information, whether the component tape component mounted on the component mounter is the same as the component used for pre-registered mounting or whether it is a replacement product. The component collating method according to claim 1, further comprising: an alternative product collating step for collating. The substitute information is at least one of a substitute part name, a part shape, and a part characteristic value;
The substitute product collating step checks whether or not the substitute information matches at least one of a part name, a part shape, and a characteristic value used for pre-registered mounting, and performs collation. The part collating method according to claim 6. Furthermore, based on the collation result in the said collation step, when the said incorrect component tape is mounted | worn with the said component mounting machine, the step which issues a warning is included, The one of the Claims 1-7 characterized by the above-mentioned. The part collation method described in the item. A component verification method for extracting a component from a component tape in which the component is stored and mounting the component on a board, and verifying the component using a computer,
The component tape is provided with a storage means in which identification information of the component is stored at a position where the stored content can be read at all times.
The mounting position of the component tape of the component mounter is provided with a detecting means for detecting that the component tape is mounted,
Based on the detection result of the detection means, a mounting position specifying step for specifying the mounting position of the component tape,
An identification information reading step of reading identification information of the component from the storage means of the component tape mounted on a component mounter;
A collation step of collating the acquired identification information of the component and the mounting position of the component tape with the identification information of the component used for mounting and the mounting position of the component tape registered in advance. Parts verification method. The component verification method according to claim 1, wherein the storage unit is provided at a leading position of the component tape. A member that is slidable on the component tape is attached to the component tape,
The component verification method according to claim 1, wherein the storage unit is attached to the member. The component verification method according to claim 1, wherein the storage unit is an IC (Integrated Circuit) tag. A method for confirming the number of parts by using a computer to check the number of parts for a component mounting machine that takes out parts from a part tape that contains parts and mounts them on a board,
The component tape is provided with a storage means in which the identification information of the component and the number of components are stored at a position where the stored content can always be read.
An identification information reading step of reading identification information of the component from the storage means of the component tape mounted on a component mounter;
A collation step of collating the read identification information of the component with the identification information of the component used for mounting registered in advance;
Reading the number of components from the storage means of the component tape mounted on a component mounter;
Each time a component is mounted on the board, decrementing the number of the component corresponding to the component by one;
And a step of issuing a warning when the number of parts falls below a predetermined threshold value. The component mounter is provided with a reading unit that reads the storage content of the storage unit at a position where the storage content of the storage unit can be read for each position where a component tape is mounted,
And a mounting position specifying step of specifying a mounting position of the component tape based on an installation position of the reading unit that has read the storage content of the storage means,
In the verification step, the acquired identification information of the component and the mounting position of the component tape are compared with the identification information of the component used for mounting and the mounting position of the component tape registered in advance. The number-of-parts confirmation method according to claim 13. The component mounter is provided with a reading unit that reads the storage content of the storage unit while moving a position where the storage content of the storage unit can be read.
And a mounting position specifying step of specifying a mounting position of the component tape based on a reading position of the reading unit that has read the storage content of the storage means,
In the verification step, the acquired identification information of the component and the mounting position of the component tape are compared with the identification information of the component used for mounting and the mounting position of the component tape registered in advance. The number-of-parts confirmation method according to claim 13. The component mounter is provided with a reading unit that reads the storage content of the storage unit, and an antenna that extends from the reading unit to a position where the storage content of the storage unit can be read,
And a mounting position specifying step of specifying a mounting position of the component tape based on an installation position of the antenna used when reading the storage content of the storage means,
In the verification step, the acquired identification information of the component and the mounting position of the component tape are compared with the identification information of the component used for mounting and the mounting position of the component tape registered in advance. The number-of-parts confirmation method according to claim 13. The method for confirming the number of parts according to any one of claims 13 to 16, further comprising a step of stopping mounting of the parts when the number of parts becomes zero. The component number confirmation method according to any one of claims 13 to 17, wherein the storage means is an IC (Integrated Circuit) tag. A component arrangement data creation method for creating a component arrangement data using a computer, targeting a component mounting machine that takes out a component from a component tape that contains the component and mounts the component on a board,
The component tape is provided with a storage means in which identification information of the component is stored at a position where the stored content can be read at all times.
Reading the identification information of the component from the storage means of the component tape mounted on the mounting machine;
A mounting position specifying step for specifying a mounting position of the component tape;
A component array data creating method comprising: associating the component identification information with the mounting position of the component tape and creating the component array data. A component arrangement data creation method for creating a component arrangement data using a computer, targeting a component mounting machine that takes out a component from a component tape that contains the component and mounts the component on a board,
The component tape is provided with a storage means in which identification information of the component is stored at a position where the stored content can be read at all times.
In the mounting position of the previous part tape of the component mounting machine, a detecting means for detecting that the component tape is mounted is provided,
Reading the identification information of the component from the storage means of the component tape mounted on the mounting machine;
Identifying the mounting position of the component tape based on the detection result of the detection means;
A component array data creating method comprising: associating the component identification information with the mounting position of the component tape and creating the component array data. The component storage data creation method according to claim 19 or 20, wherein the storage means is an IC tag. A component library creation method for creating a component library by using a computer for a component mounter that takes a component from a component tape that contains components and mounts the component on a board,
The component tape is provided with a storage means at a position where the stored contents can be read at all times, and the storage means includes at least one of component identification information, size information, color information, and shape information. Library information including
Reading library information including any one of identification information, size information, color information and shape information of the component from the storage unit of the component tape mounted on the component mounter;
Extracting a predetermined information from the library information and creating a component library necessary for the component mounter to be a target. The method of creating a parts library according to claim 22, wherein the storage means is an IC tag. A manufacturing status management method for managing a manufacturing status of a board using a computer for a component mounting machine that takes out a component from a component tape in which the component is stored and mounts the component on a substrate,
The component tape has a storage means at a position where the stored content can be read at all times, and the storage means stores at least component information including identification information of the component,
Reading the component information from the storage means of the component tape mounted on the component mounter;
And a step of writing the component information relating to the component used at the time of mounting the component on the substrate into a storage means provided on the substrate. The manufacturing status management method according to claim 24, wherein the storage means is an IC tag.   The program for making a computer perform the step of the method of any one of Claims 1-25.   A computer-readable recording medium on which the program according to claim 26 is recorded. A component collation device that retrieves a component from a component tape that contains a component and collates the component for a component mounter that is mounted on a board,
The component tape is provided with a storage means in which identification information of the component is stored at a position where the stored content can be read at all times.
Identification information storage means for storing identification information of components used for mounting;
Identification information reading means for reading identification information of the component from the storage means of the component tape mounted on a component mounter;
A component collation apparatus comprising: collation means for collating the component identification information acquired by the identification information reading unit with the component identification information stored in the identification information storage unit. Furthermore, a means for detecting a seam of the component tape is provided,
The identification information reading unit further reads the component identification information from the storage unit of the newly connected component tape when a seam of the component tape is detected,
The component verification device according to claim 28, wherein the verification unit further performs verification when a seam of the component tape is detected. A component number confirmation device that takes out a component from a component tape in which the component is stored and mounts it on a board, and confirms the number of components.
The component tape is provided with a storage means in which the identification information of the component and the number of components are stored at a position where the stored content can always be read.
Identification information storage means for storing identification information of components used for mounting;
Identification information reading means for reading identification information of the component from the storage means of the component tape mounted on a component mounter;
Collation means for collating the identification information of the part acquired by the identification information reading means with the identification information of the part stored in the identification information storage means;
Means for reading the number of components from the storage means of the component tape mounted on a component mounter;
Means for decrementing the number of parts corresponding to the component by one each time the component is mounted on the board;
And a means for issuing a warning when the number of parts falls below a predetermined threshold value. A component arrangement data creation device that creates a component arrangement data for a component mounter that takes out a component from a component tape that contains the component and mounts the component on a board,
The component tape is provided with a storage means in which identification information of the component is stored at a position where the stored content can be read at all times.
Identification information reading means for reading identification information of the component from the storage means of the component tape mounted on the mounting machine;
Mounting position specifying means for specifying the mounting position of the component tape;
And means for associating the component identification information acquired by the identification information reading unit with the mounting position of the component tape specified by the mounting position specifying unit, and storing the same as component arrangement data. Parts arrangement data creation device. A component library creation device that creates a component library using a computer for a component mounter that takes a component from a component tape that contains components and mounts the component on a board.
The component tape is provided with a storage means at a position where the stored content can be read at all times, and the storage means has at least one of identification information, size information, color information and shape information of the component. Including library information,
Means for reading library information including any of identification information, size information, color information, and shape information of the component from the storage means of the component tape mounted on the component mounter;
A component library creating apparatus comprising: means for extracting predetermined information from the library information and creating a component library necessary for the target component mounter. A manufacturing status management device that takes a component from a component tape that contains components and mounts it on a substrate, and manages the manufacturing status of the substrate using a computer.
The component tape has a storage means at a position where the stored content can be read at all times, and the storage means stores at least component information including identification information of the component,
Means for reading the component information from the storage means of the component tape mounted on the component mounter;
A manufacturing status management apparatus comprising: means for writing the component information relating to a component used when mounting the component on the substrate into a storage unit provided on the substrate. A component tape used in a component mounting machine for mounting a board,
With tape,
A plurality of parts of the same type arranged on the tape;
A reel for winding the tape;
And a storage means that is attached at a position on the reel and capable of reading the stored contents at all times, stores component information including identification information of the plurality of components, and has a communication function. Features part tape. A component tape used in a component mounting machine for mounting a board,
With tape,
A plurality of parts of the same type arranged on the tape;
A reel for winding the tape;
It is attached to a position where the stored contents can be read at all times, the identification information of the plurality of parts is stored, has a communication function, and has a storage means capable of specifying its own position. Parts tape. 36. The component tape according to claim 34 or 35, wherein the storage means further stores the number of the plurality of components. 37. The component tape according to any one of claims 34 to 36, wherein the storage unit further stores size information of the plurality of components. The component tape according to any one of claims 34 to 36, wherein the storage unit stores manufacturing information including at least one of a manufacturing time, a manufacturing factory, a lot, and a component specification. . The component tape according to any one of claims 34 to 38, wherein the storage means is an IC tag. A member attached to a component tape that holds a plurality of components arranged in a row,
An accessory member attached to the component tape, movably along the longitudinal direction of the component tape,
And a storage unit that is attached to the attachment member and stores in advance component information relating to the plurality of components. The member according to claim 40, wherein the attachment member is attached to the component tape so as to sandwich both end portions in the width direction of the component tape. The member according to claim 40 or 41, wherein the storage means is an IC tag.

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