JP7269028B2 - decision device - Google Patents

Description

TECHNICAL FIELD The present invention relates to a determination device that determines the type of component to be mounted on each of a plurality of mounting machines.

The following patent document describes a technique of mounting a component based on imaging data of the component.

Japanese Patent Application Laid-Open No. 2001-156500 JP-A-2004-342653

An object of the present invention is to appropriately perform a work using a component, such as a mounting work of the component, based on imaging data of the component.

In order to solve the above-described problems, the present specification determines the type of component to be subjected to mounting work to be performed in each of the plurality of mounting work machines for a work system having a plurality of mounting work machines. The determining apparatus, wherein each of the plurality of mounting work machines has a second imaging device and is configured to perform a component mounting operation based on imaging data obtained by the second imaging device; of the mounting work machines, at least two of the mounting work machines have different resolutions of the two or more second imaging devices, and the first imaging devices can arbitrarily change the resolution. It is determined whether or not the position or shape of the part can be recognized in each of a plurality of imaging data with different resolutions obtained by imaging the part at different resolutions, and it is determined that the position or shape of the part can be recognized. When the determined resolution of the imaging data is created as part data for each type of part, based on the part data, according to the resolution of the second imaging device of each of the plurality of mounting work machines. wherein at least one second imaging device among a plurality of second imaging devices of the plurality of mounting work machines is capable of changing resolution. , the at least one second imaging device capable of changing the resolution is determined to image the part with the resolution fixed to an arbitrary resolution in the mounting work machine having the at least one second imaging device Disclose the device .

According to the present disclosure, the position or shape of the part in each of a plurality of imaging data with different resolutions obtained by imaging the part with the resolution changed by an imaging device that can arbitrarily change the resolution. It is determined whether or not the part can be recognized, and the resolution of the imaging data at which the position or shape of the part is determined to be recognizable is created as part data for each type of part. Accordingly, by using the component data, it is possible to appropriately perform work using the component, such as component mounting work, based on the imaging data.

1 is a perspective view showing a board-to-board working system; FIG. It is a perspective view which shows a mounting apparatus. It is a block diagram which shows a control apparatus. It is a figure which shows notionally imaging an electronic component. It is a figure which shows notionally imaging an electronic component. It is a schematic diagram showing a data creation device. 4 is a flowchart for creating component data; It is a figure which shows component data conceptually. FIG. 10 is a diagram conceptually showing determination of a mounting work job according to the magnification of a parts camera.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

FIG. 1 shows a board-to-board work system 10 . A board-to-board work system 10 shown in FIG. 1 is a system for mounting electronic components on a circuit board. The board-to-board work system 10 is composed of two electronic component mounting apparatuses (hereinafter sometimes abbreviated as “mounting apparatuses”) 12 . The two mounting devices 12 are arranged in a row adjacent to each other. In the following description, the direction in which the mounting devices 12 are arranged is called the X-axis direction, and the horizontal direction perpendicular to that direction is called the Y-axis direction.

The two mounting devices 12 have substantially the same configuration. Therefore, one of the two mounting devices 12 will be described as a representative. The mounting device 12 has one system base 14 and two mounting machines 16 adjacent on the system base 14 . Each mounting machine 16, as shown in FIG. 28. The mounting machine main body 20 is composed of a frame 30 and a beam 32 mounted on the frame 30 .

The transport device 22 comprises two conveyor devices 40,42. The two conveyor devices 40 and 42 are arranged on the frame 30 so as to extend parallel to each other and in the X-axis direction. Each of the two conveyor devices 40 and 42 conveys the circuit board supported on each conveyor device 40 and 42 by an electromagnetic motor (see FIG. 3) 46 in the X-axis direction. Also, the circuit board is fixedly held at a predetermined position by a board holding device (see FIG. 3) 48 .

The moving device 24 is an XY robot type moving device. The moving device 24 includes an electromagnetic motor (see FIG. 3) 52 for sliding the slider 50 in the X-axis direction and an electromagnetic motor (see FIG. 3) 54 for sliding in the Y-axis direction. A mounting head 28 is attached to the slider 50 , and the mounting head 28 is moved to any position on the frame 30 by the operation of two electromagnetic motors 52 and 54 .

The supply device 26 is a feeder-type supply device and is arranged at the front end of the frame 30 . The supply device 26 has a tape feeder 70 . The tape feeder 70 accommodates the component tape in a wound state. A component tape is a tape in which a component is stored in each of a plurality of storage units provided in the tape. Then, the tape feeder 70 feeds out the component tape by means of a feeder 76 (see FIG. 3). Thereby, the feeder-type supply device 26 supplies the electronic components at the supply position by feeding out the component tape.

The mounting head 28 mounts electronic components on the circuit board. The mounting head 28 has a suction nozzle 78 provided on the lower end surface. The suction nozzle 78 communicates with a positive/negative pressure supply device (see FIG. 3) 80 via negative pressure air and positive pressure air passages. The suction nozzle 78 sucks and holds an electronic component with negative pressure, and releases the held electronic component with positive pressure. The mounting head 28 also has a nozzle lifting device (see FIG. 3) 82 for lifting the suction nozzle 78 . The mounting head 28 changes the vertical position of the electronic component held by the nozzle lifting device 82 .

The mounting machine 16 also includes a mark camera (see FIG. 3) 86 and a parts camera 88 . The mark camera 86 is fixed to the bottom surface of the slider 50 while facing downward. This allows the mark camera 86 to image any position on the frame 30 . The parts camera 88 is arranged facing upward between the transport device 22 and the supply device 26 . Thereby, the parts camera 88 can image the electronic parts held by the mounting head 28 . Although the parts camera 88 will be described in detail later, it is a device whose magnification can be changed, and is set to an arbitrary magnification for each mounting machine. Incidentally, as a mechanism for changing the magnification, various mechanisms such as a mechanism for changing the focal length of the lens, a mechanism for changing the refractive index of the lens using a liquid lens or the like can be employed.

Further, the board-related work system 10 includes a control device 100 as shown in FIG. The control device 100 includes a controller 102 , a plurality of drive circuits 106 and an image processing device 108 . A plurality of drive circuits 106 are connected to the electromagnetic motors 46 , 52 , 54 , substrate holding device 48 , delivery device 76 , positive/negative pressure supply device 80 and nozzle lifting device 82 . The controller 102 includes a CPU, ROM, RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 106 . Accordingly, the controller 102 controls the operations of the conveying device 22 , the moving device 24 , and the like. The controller 102 is also connected to an image processing device 108 . The image processing device 108 processes the imaging data obtained by the mark camera 86 and the parts camera 88, and the controller 102 acquires various information from the imaging data.

With the configuration described above, in the board-related work system 10 , the circuit board is transported inside the four mounting machines 16 by the transporting device 22 , and each mounting machine 16 mounts electronic components on the circuit board. Specifically, first, the circuit board is carried into the most upstream mounting machine 16 among the four mounting machines 16 . Then, in the mounting machine 16, the circuit board is transported to the working position by a command from the controller 102, and fixedly held by the board holding device 48 at that position. Next, the mark camera 86 moves above the circuit board and images the circuit board. At this time, imaged data obtained by imaging by the mark camera 86 is transmitted to the controller 102 via the image processing device 108, and the imaged data is analyzed by the controller 102. FIG. Thereby, information about the holding position of the circuit board and the like is calculated.

Also, the tape feeder 70 feeds the component tape and supplies the electronic components at the supply position according to the command from the controller 102 . Then, the mounting head 28 moves above the electronic component supply position, and the suction nozzle 78 sucks and holds the electronic component. Next, the mounting head 28 holding the component moves above the parts camera 88 , and the electronic component held by the suction nozzle 78 is imaged by the parts camera 88 . Imaged data obtained by imaging with the parts camera 88 is transmitted to the controller 102 via the image processing device 108, and the imaged data is analyzed by the controller 102. FIG. Accordingly, information regarding the holding position of the electronic component by the suction nozzle 78 and the like is calculated. Subsequently, the mounting head 28 moves above the circuit board and mounts the held electronic component on the circuit board using the holding position of the circuit board, the holding position of the electronic component by the suction nozzle 78, and the like. . Then, when the work of mounting the electronic components on the circuit board is completed, the circuit board is transported downstream and carried into the mounting machine 16 arranged on the downstream side. Then, the above-described mounting work is sequentially performed by each mounting machine 16 to produce a circuit board with electronic components mounted thereon.

As described above, in the board-related work system 10, the parts camera 88 captures an image of the electronic component held by the suction nozzle 78 in each of the four mounters 16, and the image of the electronic component held by the suction nozzle 78 is calculated based on the image data. An electronic component is mounted on a circuit board using a component holding position or the like. However, since electronic components of various sizes are to be mounted on the circuit board, in order to properly image the electronic components of different sizes, the work system for board 10 has four mounters 16 each having a different magnification. A configurable parts camera 88 is provided.

Specifically, in the parts camera 88 capable of changing the magnification, the resolution per pixel is changed. That is, for example, as shown in FIG. 4, in order to image an electronic component 110, an imaging field of view 112 with a length dimension of 1000 μm in a predetermined direction is required. Also, the number of pixels in the predetermined direction of the parts camera 88 is 100 pixels. Therefore, when the electronic component 110 is imaged in the imaging field 112 of 1000 μm, the resolution per pixel is 10 (=1000 μm/100 pixels) μm/pixel. In other words, if the electronic component 110 is imaged with a resolution of 10 μm/pixel, the entire electronic component 110 can be imaged.

On the other hand, if the electronic component 120, which is about 1/10 the size of the electronic component 110, is imaged with a resolution of 10 μm/pixel, the entire electronic component 120 can be imaged, but the imaging data with a resolution of 10 μm/pixel Then, there is a possibility that the shape of the electronic component 120 cannot be properly recognized. That is, in imaging data with a resolution of 10 μm/pixel, the shape of the electronic component 120 is represented by data of about 10 pixels in a predetermined direction. be.

For this reason, for example, as shown in FIG. 5, the magnification of the parts camera 88 is increased so that the imaging field of view 122 has a length dimension of 100 μm in a predetermined direction. In this way, even if the magnification of the parts camera 88 is increased, the performance of the parts camera 88 itself, that is, the number of pixels in a predetermined direction does not change, so it is 100 pixels. Therefore, when the electronic component 120 is imaged in the imaging field 122 of 100 μm, the resolution per pixel is 1 (=100 μm/100 pixels) μm/pixel. Thus, when the electronic component 120 is imaged with a resolution of 1 μm/pixel, the shape of the electronic component 120 is represented by 100 pixels of data in a given direction in imaging data with a resolution of 1 μm/pixel. That is, the imaging data with a resolution of 1 μm/pixel has 100 times the amount of data indicating the electronic component 120 as compared with the imaging data with a resolution of 10 μm/pixel, and the shape of the electronic component 120 can be appropriately recognized. .

On the other hand, only part of the electronic component 110 can be imaged in the imaging field of view 122 having a length dimension of 100 μm in a predetermined direction. Considering this, the small electronic component 120 is preferably imaged with a resolution of 1 μm/pixel, and the large electronic component 110 is preferably imaged with a resolution of 10 μm/pixel. Note that the resolution per pixel is inversely proportional to the magnification of the camera. For this reason, when the resolution of 10 μm/pixel is used as a reference, that is, when the magnification of the camera in the imaging field of view 112 having a length dimension of 1000 μm in a predetermined direction is set to 1, the reference resolution (10 μm/ A resolution of 1 μm/pixel, which is 1/10 of a pixel), gives a camera magnification of 10×. That is, the electronic component 120 having a small size is preferably imaged at a magnification of 10 times, and the electronic component 110 having a large size is preferably imaged at a magnification of 1 time.

In this way, electronic parts of different sizes are preferably imaged by the parts camera 88 by changing the magnification, that is, the resolution. However, if the magnification is changed for each component type and the electronic component is imaged during the mounting operation of the electronic component by the mounting machine 16, the cycle time becomes long. Therefore, in the board-related work system 10 , the parts cameras 88 of the four mounters 16 are set to different magnifications. The parts camera 88 can be changed to an arbitrary magnification of 1 to 10 times, that is, to an arbitrary resolution of 1 to 10 μm/pixel. The parts camera 88 of the mounting machine 16a is set to 1 times (10 μm/pixel), the parts camera 88 of the mounting machine 16b is set to 3 times (10/3≈3.3 μm/pixel), and the parts camera 88 of the mounting machine 16c is set to 3 times (10/3≈3.3 μm/pixel). The parts camera 88 is set to 6 times (10/6≈1.7 μm/pixel), and the parts camera 88 of the placement machine 16d is set to 10 times (1 μm/pixel). Incidentally, in the board-related work system 10, the four mounting machines 16a to 16d are arranged from the upstream side in the order of the mounting machine 16a, the mounting machine 16b, the mounting machine 16c, and the mounting machine 16d.

For example, a large electronic component 110 is mounted by a mounting machine 16a equipped with a parts camera 88 with a low magnification, and a small electronic component 120 is mounted by a mounting machine 16d equipped with a parts camera 88 with a high magnification. A part mounting job is created so that For this purpose, it is necessary to specify an appropriate magnification for each part type based on the size and shape of the part body of each part type, and the size and shape of characteristic portions such as electrodes. Therefore, in the data creation device, component data including an appropriate magnification corresponding to the component type is created.

Specifically, the data creation device 150 is composed of a stage 152 and a parts camera 154, as shown in FIG. 6 is a schematic diagram showing the data generation device 150 as viewed from the side. The stage 152 is for placing an electronic component 160 to be imaged on its upper surface. The parts camera 154 is fixedly arranged above the stage 152 while facing downward. As a result, the parts camera 154 captures an image of the electronic component 160 placed on the upper surface of the stage 152 . The parts camera 154 is of the same type as the parts camera 88 arranged on the mounting machine 16 . In other words, the parts camera 154 can also be changed to any magnification from 1 to 10 times. In addition, the imaging distance of the parts by the parts camera 154 is the same as the imaging distance of the parts by the parts camera 88 in the placement machine 16 . That is, the distance between the parts camera 154 in the data generation device 150 and the upper surface of the stage 152 is the same as the parts camera 88 in the placement machine 16 when the parts held by the suction nozzle 78 are imaged by the parts camera 88. It is set to be the same as the distance to the lower surface of the suction nozzle 78 .

The data creation device 150 also has a controller 170 and an image processing device 172, as shown in FIG. The controller 170 includes a CPU, ROM, RAM, etc., is mainly a computer, and is connected to the image processing device 172 . The image processing device 172 processes the imaging data obtained by the parts camera 154, and the controller 170 acquires various information from the imaging data. The controller 170 then executes various processes according to the flowchart shown in FIG.

Specifically, the operator places the electronic component 160 to be imaged on the upper surface of the stage 152 and operates a predetermined button, thereby executing the processing according to the flowchart shown in FIG. First, the magnification of the parts camera 154 is set (S100). At this time, first, the magnification of the parts camera 154 is set to 1×. Then, an image is captured by the parts camera 154 (S102). Subsequently, imaging data obtained by the imaging is analyzed by the controller 170 (S104). At this time, the position of electronic component 160 is recognized based on the imaging data. That is, the position of the characteristic portion of the electronic component 160 is recognized based on the imaging data, for example, using a seek line template (Japanese Patent No. 3759983). A characteristic part is, for example, an electrode part of the electronic component 160 . For example, the position of the electronic component 160 is recognized by recognizing the position of the edge of the electrode portion in the image of the imaging data.

However, for example, as shown in FIG. 4, when the electronic component 120 is imaged in the imaging field 112, the position of the characteristic portion of the electronic component 120 cannot be recognized because the amount of data indicating the electronic component 120 is small. In some cases, the position of electronic component 120 cannot be recognized. Moreover, even if the position of the electronic component 120 can be recognized, the recognition result may not be appropriate because the position of the characteristic portion cannot be clearly recognized. On the other hand, for example, as shown in FIG. 5, when the electronic component 110 is imaged in the imaging field 122, only part of the electronic component 110 is imaged, so the position of the electronic component 110 cannot be recognized. In this way, when the position of the electronic component cannot be recognized, the magnification at the time of imaging and the fact that the position of the electronic component cannot be recognized are associated and temporarily stored. On the other hand, when the position of the electronic component can be recognized, the magnification at the time of imaging and the fact that the position of the electronic component has been recognized are associated and temporarily stored.

Then, it is determined whether or not the parts have been imaged at all magnifications that can be imaged by the parts camera 154 (S106). Then, when the parts have not been imaged at all magnifications that can be imaged by the parts camera 154 (S106: NO), the processes of S100 to S104 are executed. That is, since the parts camera 154 can be changed to any magnification from 1 to 10 times as described above, the magnification is changed from 1 to 2, 3, and 4 in order to capture and , an analysis of the imaging data is performed. Then, when the part is imaged at a magnification of 10 times and the imaged data is analyzed, it is determined that the part has been imaged at all magnifications that can be imaged by the parts camera 154 (S106: YES), and the part data is created (S108). The component data includes the dimensions of the electronic component in a predetermined direction, for example, the length dimension in the X direction (hereinafter referred to as "size X") and the length dimension in the Y direction (hereinafter referred to as "size Y"). ) and the magnification at the time of imaging the component when the position of the electronic component can be recognized (hereinafter referred to as “recognizable magnification”). Size X and size Y may be calculated when the controller 170 analyzes the imaging data in S104. Alternatively, the size X and the size Y obtained in advance by the data creation device 150 may be reflected in the part data. Then, the part data is stored in the controller 170 of the data generation device 150 for each part type.

Specifically, as shown in FIG. 8, size X (=1000 μm), size Y (=500 μm), and recognizable magnification (=1 to 2 times) are stored as component data of electronic component 160a. With this component data, the position of the electronic component 160a can be recognized when the electronic component 160a is imaged at a magnification of 1 to 2 times. , it can be seen that the position of the electronic component 160a cannot be recognized. In the component data of the electronic component 160b, the position of the electronic component 160b can be recognized when the electronic component 160b is imaged at a magnification of 2 to 5 times. It can be seen that the position of the electronic component 160b cannot be recognized when the image is captured at a magnification of . In the component data of the electronic component 160c, the position of the electronic component 160c can be recognized when the electronic component 160c is imaged at a magnification of 5 to 8 times. It can be seen that the position of the electronic component 160c cannot be recognized when the image is captured at a magnification of 10 times. Further, in the component data of the electronic component 160d, the position of the electronic component 160d can be recognized when the electronic component 160d is imaged at a magnification of 8 to 10 times. , the position of the electronic component 160d cannot be recognized. Note that the table shown in FIG. 8 also displays the resolution corresponding to the recognizable magnification.

In this way, when the data creation device 150 creates component data corresponding to the component type, the created component data is input from the data creation device 150 to the job creation device 180 (see FIG. 3). Then, in the job creating device 180, a job of component mounting work to be executed by each mounting machine 16 is created in accordance with the recognizable magnification included in the component data. That is, when the recognizable magnification included in the component data is low, the electronic component corresponding to the component data is mounted by the mounting machine 16 having the parts camera 88 with the low magnification, and the recognition included in the component data is performed. When the possible magnification is high, a component mounting work job is created so that the electronic component corresponding to the component data is mounted by a mounting machine 16 having a high-magnification parts camera 88. - 特許庁

Specifically, the recognizable magnification of the electronic component 160a is 1 to 2 times, the recognizable magnification of the electronic component 160b is 2 to 5 times, and the recognizable magnification of the electronic component 160c is 5 to 8 times. The recognizable magnification of the electronic component 160d is 8 to 10 times. Then, the magnification of the parts camera 88 of the mounter 16a is increased to 1, the magnification of the parts camera 88 of the mounter 16b is increased to 3, the magnification of the parts camera 88 of the mounter 16c is increased to 6, and the magnification of the parts camera 88 of the mounter 16d is increased. The magnification of 88 is set to 10 times. Therefore, in the job creating apparatus 180, the electronic component corresponding to the component data is mounted by the mounting machine 16 having the parts camera 88 capable of imaging at a recognizable magnification included in the component data. is created.

That is, since the recognizable magnification of the electronic component 160a is 1 to 2 times, as shown in FIG. 9, the mounting operation of the electronic component 160a is performed by the mounting machine 16a having the parts camera 88 of 1 times magnification. A mounting job is created as follows. Further, since the recognizable magnification of the electronic component 160b is 2 to 5 times, the job of the mounting work is arranged so that the mounting work of the electronic component 160b is executed by the mounting machine 16b having the parts camera 88 with a magnification of 3 times. is created. Further, since the recognizable magnification of the electronic component 160c is 5 to 8 times, the job of the mounting work is arranged so that the mounting work of the electronic component 160c is executed by the mounting machine 16c having the parts camera 88 with a magnification of 6 times. is created. Further, since the recognizable magnification of the electronic component 160d is 8 to 10 times, the job of the mounting work is arranged so that the mounting work of the electronic component 160d is executed by the mounting machine 16d having the parts camera 88 with a magnification of 10 times. is created.

In this way, when the job of the mounting work is created by the job creation device 180 , the job is input to the control device 100 of the work system for substrate 10 . Then, the controller 102 of the control device 100 executes the mounting work according to the job, thereby ensuring proper mounting work. In other words, in the four placement machines 16, the parts cameras 88 are set to have different magnifications, but in each placement machine 16, the parts cameras 88 of the magnifications provided in each placement machine 16 can be used to determine the positions of the parts and the parts. An operation of mounting an electronic component whose shape can be recognized is performed. Therefore, in each mounter 16, the position and shape of the component are appropriately recognized based on the imaging data, and the holding position of the component by the suction nozzle 78 is appropriately calculated. As a result, the mounting accuracy of the parts is increased, and appropriate mounting work is ensured.

Incidentally, in the above embodiment, the board-to-board work system 10 is an example of a work system. The mounting machine 16 is an example of a mounting work machine and a work machine. The suction nozzle 78 is an example of a holder. The parts camera 88 is an example of a second imaging device. Data creation device 150 is an example of a data formation device. Parts camera 154 is an example of a first imaging device. Job creation device 180 is an example of a decision device.

It should be noted that the present invention is not limited to the above embodiments, and can be implemented in various modes with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, the magnification at the time of imaging when the position of the electronic component can be recognized based on the imaging data is determined as the recognizable magnification. good too. Specifically, based on the imaging data, the external shape of the electronic component is extracted, and the magnification at the time of imaging when the size X and the size Y can be calculated may be determined as the recognizable magnification. Alternatively, size information about the size of the part such as size X and size Y is created in advance, and it is determined whether or not a member having a shape corresponding to the size information can be extracted from the imaging data. If a member having a shape corresponding to the information can be extracted, it may be determined that the shape of the component can be recognized based on the imaging data, and the magnification at the time of imaging may be determined as the recognizable magnification.

Further, in the above embodiment, the magnification of the parts camera 88 is fixed in each placement machine 16, but the magnification of the parts camera 88 may be arbitrarily changed to perform the placement operation. That is, for example, in one mounting machine 16a, when mounting the electronic component 160a, the magnification of the parts camera 88 is changed to 1, the electronic component 160a is imaged, and the electronic component 160a is mounted. . Further, in one mounter 16a, the magnification of the parts camera 88 is changed to 3 times during the mounting work of the electronic component 160b, the electronic component 160b is imaged, and the mounting work of the electronic component 160b is executed. Further, in one mounter 16a, the magnification of the parts camera 88 is changed to 6 times during the mounting work of the electronic component 160c, the electronic component 160c is imaged, and the mounting work of the electronic component 160c is executed. Further, in one mounter 16a, the magnification of the parts camera 88 is changed to 10 times during the mounting work of the electronic component 160d, the electronic component 160d is imaged, and the mounting work of the electronic component 160d is executed. In this way, in one mounting machine 16a, by changing the magnification of the parts camera 88 according to the calculable magnification of the part data and performing the imaging and mounting work, one or a small number of mounting machines can be mounted. With the machine 16, it is possible to perform the work of mounting a plurality of types of parts having different sizes.

Further, in the above embodiment, the parts camera 88 whose magnification can be arbitrarily changed is arranged in the mounting machine 16, but a parts camera whose magnification cannot be arbitrarily changed is arranged in the mounting machine 16. may be set. However, in such a case, a parts camera with a magnification of 1 is arranged in the mounting machine 16a, a parts camera with a magnification of 3 is arranged in the mounting machine 16b, and a parts camera with a magnification of 3 is arranged in the mounting machine 16c. A parts camera with a magnification of 6 times is arranged, and a parts camera with a magnification of 10 times is arranged in the mounting machine 16d.

In the above embodiment, the parts camera 88 of the mounter 16 and the parts camera 154 of the data creation device 150 are of the same type. 154 may be of a different type. However, when the parts camera 88 and the parts camera 154 are of different types, the computable magnification of the parts data is corrected according to the capability value such as the resolution of each camera. In the above-described embodiment, the imaging distance of the part by the parts camera 88 in the placement machine 16 and the imaging distance of the part by the parts camera 154 in the data generation device 150 are set to be the same. can be different. However, if the imaging distance in the mounting machine 16 and the imaging distance in the data generation device 150 are different, the calculable magnification of the component data is corrected according to the difference in the imaging distances.

10: Work system for board (work system) 16: Mounting machine (mounting work machine) (work machine) 78: Suction nozzle (holding tool) 88: Parts camera (second imaging device) 150: Data creation device 154: Parts camera (First imaging device) 180: Job creation device

Claims (1)

A determination device for determining a type of a component to be subjected to mounting work to be performed in each of the plurality of mounting work machines for a work system including a plurality of mounting work machines,
Each of the plurality of mounting work machines has a second imaging device, and is configured to perform component mounting work based on image data captured by the second imaging device. is configured such that the resolutions of the two or more second imaging devices of at least two or more mounted work machines are different from each other,
Whether the position or shape of the part can be recognized in each of a plurality of imaging data with different resolutions obtained by imaging the part with the resolution changed by the first imaging device that can arbitrarily change the resolution is determined, and the resolution of the imaging data determined to allow recognition of the position or shape of the part is created as part data for each type of part, the plurality of A determining device for determining a type of component according to the resolution of a second imaging device of each mounting work machine ,
at least one second imaging device among the plurality of second imaging devices possessed by the plurality of mounting work machines is a device capable of changing resolution;
The at least one second imaging device capable of changing resolution,
A determining device for imaging a component with a resolution fixed to an arbitrary resolution in a mounting work machine having the at least one second imaging device.

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