JP5325673B2 - Electronic component mounting device - Google Patents

Description

  According to the present invention, an image picked up by a substrate recognition camera is recognized by a recognition processing device, and an electronic component taken out by a holding unit provided in a mounting head from a component supply device based on the recognition result is placed on a printed circuit board. The present invention relates to an electronic component mounting apparatus to be mounted.

  An electronic component mounting apparatus is disclosed in, for example, Patent Document 1 and the like, but an image of a recognition mark attached to a printed circuit board is captured by a substrate recognition camera provided in a mounting head for mounting the electronic component, and the substrate recognition camera The captured image is recognized by the recognition processing device, and the electronic component taken out by the suction nozzle, which is a holding means provided in the mounting head, from the component supply device based on the recognition result, that is, the position of the printed circuit board, is printed on the printed circuit board. Install on top.

  Sometimes, for example, a board recognition camera captures an electronic component mounted on a printed circuit board, displays the captured image on a monitor, and the work manager confirms the position of the mounted electronic component.

JP 2003-283194 A

  However, since a small electronic component is displayed on the monitor in a small size, the work manager can display this image in the horizontal direction or the vertical direction by operating the monitor equipped with the touch panel switch or operating the mouse manually. Since the electronic parts were arbitrarily enlarged and displayed and the mounted electronic parts were confirmed, it was a laborious work.

  Accordingly, an object of the present invention is to improve work efficiency by reducing the work load for checking a captured image of an electronic component of a work manager as much as possible.

Therefore, according to the first aspect of the present invention, the recognition mark attached to the printed circuit board is imaged by the substrate recognition camera, the recognition processing device performs the recognition processing, and the electronic device held by the holding unit based on the recognition processing result. In an electronic component mounting apparatus for mounting a component on the printed circuit board, a monitor for displaying an image of the specified electronic component mounted on the printed circuit board captured by the substrate recognition camera, and a predetermined range of the size of the electronic component A storage device for storing an enlarged display magnification determined for each, and the monitor according to an enlarged display magnification stored in the storage device to which the specified electronic component on the printed circuit board imaged by the substrate recognition camera corresponds. larger table and a control device provided for controlling so as to enlarge the storage device, which is determined for each predetermined range in the X-direction size of the electronic component The magnification and the enlarged display magnification determined for each predetermined range of the size in the Y direction are stored, and the control device in the X direction of the designated electronic component on the printed board imaged by the board recognition camera. The electronic component designated on the monitor is enlarged and displayed according to a small enlarged display magnification of the enlarged display magnification in the X direction and the enlarged display magnification in the Y direction stored in the storage device corresponding to the size and the size in the Y direction. It is characterized by controlling as follows.

According to a second aspect of the present invention, the recognition mark attached to the printed circuit board is imaged by the substrate recognition camera, the recognition processing device performs the recognition processing, and the electronic component held by the holding means based on the recognition processing result is obtained. In the electronic component mounting apparatus mounted on the printed circuit board, a monitor that displays an image of the designated electronic component mounted on the printed circuit board captured by the substrate recognition camera, and a peripheral dead space around the electronic component on the monitor Control for obtaining a display magnification obtained by dividing the size of the electronic component by the size of the designated electronic component on the printed circuit board, and controlling to display an image of the designated electronic component on the display screen at the display magnification An apparatus is provided.

ADVANTAGE OF THE INVENTION According to this invention, the work load which confirms the captured image of the electronic component with which it was mounted | worn on the printed circuit board of the work manager and was designated can be reduced as much as possible, and work efficiency can be improved.

The top view of an electronic component mounting apparatus is shown. It is a control block diagram. It is a figure which shows mounting data. It is a figure which shows the data which concern on the kind of each electronic component corresponding to the arrangement | positioning number of a component supply unit. It is a figure which shows parts library data. It is explanatory drawing about 1st Embodiment displayed on an enlarged scale. It is explanatory drawing about 2nd Embodiment displayed in an enlarged manner. It is a figure which shows the correlation table of the size of an electronic component, and an enlarged display magnification. It is explanatory drawing about 3rd Embodiment displayed in an enlarged manner.

  An embodiment of an electronic component mounting apparatus 1 for mounting an electronic component on a printed circuit board P, which is a circuit board provided with a circuit on the substrate, will be described below with reference to FIG. The electronic component mounting device 1 includes a transport device 2 for transporting the printed circuit board P, a component supply device 3 for supplying electronic components disposed on the front side and the back side across the transport device 2, and a drive. A pair of beams 4A and 4B movable in one direction (Y direction) by a source and a plurality of (for example, twelve) holding nozzles 5 as holding means, respectively, are provided in the direction along each of the beams 4A and 4B. A mounting head 6 that is movable by each drive source is provided.

  The transport device 2 is disposed at an intermediate portion of the electronic component mounting device 1 and mounts a substrate supply unit that inherits the printed circuit board P from the upstream device and an electronic component that is sucked and held by the suction nozzle 5 of each mounting head 6. In order to do so, the printed circuit board P is supplied with a printed circuit board P. The printed circuit board P is positioned and fixed, and the printed circuit board P on which the electronic component is mounted is transferred to the downstream device. Is done.

  The component supply device 3 includes a feeder base 3A attached to the main body of the electronic component mounting device 1, and a plurality of electronic components arranged in parallel on the feeder base 3A, one for each component take-out portion (component suction position). It is composed of a group of component supply units 3B to be supplied one by one. The component supply unit 3B is equipped with a storage tape that covers a large number of electronic components with cover tapes that are stored at regular intervals in each storage section formed of a concave portion of the carrier tape. By peeling the cover tape, the electronic components are supplied one by one to the component extraction position of the component supply unit 3B, and are extracted from each storage portion by the suction nozzle 5 of the mounting head 6.

  The pair of front and rear beams 4A and 4B, which are long in the X direction, are individually moved by sliding the sliders fixed to the beams 4A and 4B along a pair of left and right front and rear guides driven by the Y direction linear motor 7. Move in the Y direction. The Y-direction linear motor 7 includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 7A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. It consists of.

  The beams 4A and 4B are provided with the mounting heads 6 that move along the guides in the longitudinal direction (X direction) by the X direction linear motor 9, respectively. A pair of front and rear stators fixed to the beams 4A and 4B and a mover provided on the mounting head 6 between the stators.

  Accordingly, the mounting heads 6 are provided inside the beams 4A and 4B so as to face each other, and move above the printed circuit board P on the positioning unit of the transfer device 2 and the component extraction position of the component supply unit 3B.

  Each mounting head 6 is provided with twelve suction nozzles 5 biased downward by respective springs at predetermined intervals along the circumference. It is also possible to simultaneously take out electronic components from a plurality of component supply units 3B arranged in parallel by the suction nozzle 5 located at the 9 o'clock position. The suction nozzle 5 can be moved up and down by a vertical axis motor 10, and the mounting head 6 is rotated around a vertical axis by a θ-axis motor 11. As a result, each suction nozzle 5 of each mounting head 6 is moved in the X direction and Y direction. It can move in the direction, can rotate around a vertical line, and can move up and down.

  Reference numeral 8 denotes a component recognition camera that images the electronic component sucked and held by the suction nozzle 5, and reference numeral 12 denotes a substrate recognition camera 12 for imaging recognition marks M1 and M2 for confirming the position of the printed circuit board P. 6 is installed. Further, there is a case where the work manager temporarily stops the mounting operation of the electronic component mounting apparatus 1 and wants to confirm the position of the electronic component mounted on the printed circuit board P. At this time, the board recognition camera 12 takes an image of the electronic component. Then, the captured image may be displayed on the monitor 25. Furthermore, when it is desired to confirm the position of the electronic component at the component extraction position of the component supply unit 3B, the board recognition camera 12 may pick up the electronic component and display the picked-up image on the monitor 25. .

  FIG. 2 is a control block for control related to electronic component mounting of the electronic component mounting apparatus 1 and will be described below. Each element of the electronic component mounting apparatus 1 is centrally controlled by a CPU (Central Processing Unit) 21 and stores a ROM (Read Only Memory) 22 for storing a program related to this control and various data. A RAM (Random Access Memory) 23 is connected via a bus line 24. Further, a monitor 25 for displaying an operation screen and the like, and a touch panel switch 26 as input means formed on the display screen of the monitor 25 are connected to the CPU 21 via an interface 27. The Y-direction linear motor 9 and the like are connected to the CPU 21 via a drive circuit 28 and an interface 27.

  In the RAM 23, as shown in FIG. 3, the RAM 21 is represented by the X direction ("X") of the mounting coordinates of each electronic component in the printed circuit board P for each mounting order (step number). ), Y direction (represented by “Y”) and angle information (represented by “Z”), arrangement number information of each component supply unit 5 (represented by “feeder”), and the like. Stored. The RAM 21 stores information (see FIG. 4) of the type (component ID) of each electronic component corresponding to the arrangement number of each component supply unit 5, and further the size of the electronic component for each component ID. In addition, component library data (see FIG. 5) relating to features such as feed pitch is stored.

  A recognition processing device 29 is connected to the CPU 21 via the interface 27. The recognition processing device 29 performs recognition processing of an image captured by the board recognition camera 8 or the component recognition camera 12. The processing result is sent to the CPU 21. That is, the CPU 21 outputs an instruction to the recognition processing device 29 so as to perform recognition processing (calculation of misalignment amount, etc.) on an image captured by the board recognition camera 8 or the component recognition camera 12, and also recognizes the recognition processing result. 29 is received.

  With the above configuration, when the setup change is completed and the electronic component mounting apparatus 1 is automatically operated, the first printed board P is transported from the upstream apparatus to the board positioning unit by the transport apparatus 2, and is positioned and fixed by the positioning mechanism. The

  Next, according to the mounting data as shown in FIG. 3 stored in the RAM 23, each mounting head 6 moves, and the electronic component to be mounted by the suction nozzle 5 corresponding to the component type of the electronic component is set to a predetermined component supply unit 3B. Take it out by adsorption. More specifically, the suction nozzle 5 with the nozzle number “2” of the mounting head with the head number “1” (hereinafter referred to as the mounting head with the back side) 6 provided on the back beam 4A has the step number “0001”. It moves so as to be positioned above the component supply unit 3B of the feeder number “103”. In the Y direction, the Y direction linear motor 7 is driven to move the beam 4A, and in the X direction, the X direction linear motor 9 is driven. Since the mounting head 6 on the back side has moved and the component supply unit 3B has already been driven by the feed motor and the peeling motor, and the component can be taken out at the component pickup / removal position, the vertical axis motor 10 is in the suction state. The nozzle 5 is lowered to suck and take out the electronic components, and then the mounting head 6 on the back side is raised.

  Next, as described above, the mounting head 6 on the back side moves above the component supply unit 3B of the feeder number “107” of the step number “0002” and the vertical axis motor 10 has the nozzle number “4”. The electronic components up to the step number “0012” are placed on the 12 suction nozzles 5 of the mounting head 6 on the back side so that the suction nozzle 5 is lowered to pick up and take out the electronic components, and then the mounting head 6 is lifted. Is taken out and held by suction.

  Then, the mounting head 6 on the back side moves so as to mount the electronic component at a predetermined position on the printed circuit board P positioned by the substrate positioning unit. While moving the mounting head 6, the component recognition is performed while moving. The electronic component sucked and held by each suction nozzle 5 when passing the upper position of the camera 8 is imaged by the component recognition camera 10 (fly recognition).

  Based on this imaging result, the recognition processing device 29 recognizes how much the electronic component is displaced and held with respect to the suction nozzle 5 by the recognition processing device 29, and the Y-direction linear motor 7 is recognized. The suction nozzle 5 that holds the electronic component by driving the X-direction linear motor 9 moves to the printed circuit board P.

  Then, before mounting the electronic component on the printed circuit board P, the recognition mark M1 attached to the printed circuit board P by the substrate recognition camera 12 provided on the mounting head 6 attached to one beam 4A for mounting the electronic component. , M2 is picked up, the image picked up by the board recognition camera 12 provided in the mounting head 6 on the back side is recognized by the recognition processing device 29, and the recognition result, that is, based on the position of the printed board. The electronic component taken out by the suction nozzle 5 provided on one mounting head 6 from the component supply unit 3B is mounted on the printed circuit board P, and the suction nozzle 5 of the mounting head 6 mounted on the other beam 4A is used. The recognition result obtained by the substrate recognition camera 12 provided on the mounting head 6 on the back side and picked up by the recognition processing device 29 is also used when mounting. So that the control for mounting electronic components on the printed circuit board P is made Te.

  In other words, prints that have been imaged by the substrate recognition camera 12 attached to the mounting head 6 on the back side and recognized by the recognition processing device 29 at the mounting coordinates of the mounting data from step numbers “0001” to “0012”. The Y direction linear motor 7, the X direction linear motor 9 and the θ axis motor 11 are corrected and controlled by the CPU 21 in consideration of the position recognition result of the substrate P and the position recognition processing result of each component, and the suction of the mounting head 6 on the back side is controlled. Each of the electronic components is mounted at a predetermined position on the printed circuit board P while the nozzle 5 corrects the positional deviation.

  Next, the mounting head 6 with the head number “2” provided on the beam 4B on the front side takes out the electronic components from the step numbers “0013” to “0024” and moves as described above while moving the component recognition camera. The electronic component picked up and held by each suction nozzle 5 when passing through the upper position 8 is imaged by the component recognition camera 10.

  Then, the position recognition processing result of each component, the position recognition result of the printed circuit board P, and the position recognition processing result of each component as described above are added to each mounting coordinate of the mounting data from step numbers “0013” to “0024”. Then, the Y direction linear motor 7, the X direction linear motor 9 and the θ-axis motor 11 are corrected and controlled by the CPU 21, while the suction nozzle 5 of the mounting head 6 on the back side corrects the positional deviation, and the electronic components are respectively printed boards. Mounted at a predetermined position on P.

  Similarly, the mounting operation to the first printed circuit board P is completed by mounting the electronic components up to the last step number on the printed circuit board P, but this is also the first printed circuit board P, and the work management is performed. The user wants to confirm the position of a certain electronic component that is mounted.

  At this time, the touch panel switch 26 which is a designation means displayed on the monitor 25 is operated to designate a certain electronic component mounted on the printed board P, and the board recognition camera 12 takes an image of the electronic component and automatically The captured image that has been enlarged is displayed on the monitor 25. In this case, the CPU 21 controls the display screen so that the display size of the electronic component is constant regardless of the size of the display screen of the monitor 25 even when the size of the electronic component is different.

  That is, if the size of the electronic component D1 to be displayed on the monitor 25 is small, the enlarged display magnification is high, and conversely if the electronic component D2 is large in size, the enlarged display magnification is low. The first embodiment to be enlarged and displayed will be specifically described below with reference to FIG. 6. The component ID of the electronic component D1 to be displayed according to the component library data (see FIG. 5) stored in the RAM 23. Is “AAAAAA”, the component display size in the X direction (fixed to a predetermined size) is set to the size of the electronic component D1 in the X direction XX1 millimeters (hereinafter, millimeters are omitted). The CPU 21 divides to obtain an enlarged display magnification in the X direction, and the component display size in the Y direction (fixed to a predetermined size) is determined in the Y direction of the electronic component D1. The size is YY1 and the CPU 21 divides to obtain an enlarged display magnification in the Y direction.

  Then, according to the enlarged display magnification obtained by the division, the CPU 21 multiplies each calculated enlarged display magnification by XX1 of the size in the X direction of the electronic component D1 and YY1 of the size in the Y direction in advance. Control is performed so that the display is performed on the monitor 25 with the component display sizes in the determined X and Y directions. In this case, the monitor 25 displays an enlarged component image DG (captured image) of the electronic component D1 whose component ID is “AAAAAA” and a component graphic GG corresponding to the electronic component D1 on a small screen. The

  If the component ID of the electronic component D2 to be displayed is “BBBBB” in accordance with the component library data (see FIG. 5), the component display size in the X direction (fixed to a predetermined size) is fixed. .) Is divided by the size XX2 of the electronic component D2 in the X direction to obtain an enlarged display magnification in the X direction, and the component display size in the Y direction (fixed to a predetermined size in advance). The CPU 21 divides the electronic component D2 by the size YY1 in the Y direction to obtain an enlarged display magnification in the Y direction.

  Then, the CPU 21 multiplies the respective enlarged display magnifications obtained by dividing the electronic component D2 in the X-direction size XX2 and the Y-direction size YY2, thereby determining the component display sizes in the predetermined X-direction and Y-direction. Is controlled to be displayed on the monitor 25. In this case, an enlarged component image DG (captured image) of the electronic component D2 whose component ID is “BBBBB” and a component graphic GG corresponding to the electronic component D2 are displayed on the monitor 25. The

Therefore, as described above, the board recognition camera 12 images the electronic component mounted on the printed circuit board P, regardless of the size of the electronic component, and the display screen of the monitor 25. Since the captured image can be displayed on the monitor 25 in a predetermined size that is determined in advance, the work manager can mount the image without enormous work of manually enlarging and displaying the captured image. The position of the electronic component can be confirmed, and the work efficiency can be improved. Next, when the work manager confirms the position of a certain electronic component mounted, the touch panel switch 26 displayed on the monitor 25 is displayed. The board recognition camera 12 takes an image of a certain electronic component mounted on the printed circuit board P by operating and automatically displays a captured image on the monitor 25. The second embodiment will be described with reference to FIG.

  In the second embodiment, the captured image of the electronic component is displayed at an enlarged display magnification determined in stages for each size of the electronic component to be displayed, and stored in the RAM 23 in advance. The X direction of the electronic component to be displayed is determined from the enlarged display magnification for each size in a certain range in the X direction and the enlarged display magnification for each size in a certain range in the Y direction as shown in FIG. This is an embodiment in which display is performed using a smaller enlarged display magnification among the enlarged display magnifications in the X direction and Y direction corresponding to the size in the Y direction. The electronic component may be displayed using an enlarged display magnification corresponding to one of the sizes in the X direction and the Y direction, for example, the longer size.

  If the component ID of the electronic component D1 to be displayed is “AAAAAA” according to the component library data (see FIG. 5) stored in the RAM 23, the size in the X direction is XX1, and the size in the Y direction is YY1. Specifically, in the case of an electronic component called “1005”, the size in the X direction is 10 millimeters and the size in the Y direction is 5 millimeters, which corresponds to the size in the X direction of the electronic component D1 to be displayed. The enlargement display magnification of “10 mm or more and less than 20 mm” is 2.00 times, but the enlargement display magnification in the Y direction corresponding to the size in the Y direction is “5 mm or more and less than 10 mm” and is 4.00 times. Therefore, the CPU 21 controls to display an enlarged image at a magnification of 2.00 times, which is a small magnification.

  Therefore, the CPU 21 multiplies the size XX1 in the X direction of the electronic component D1 and the size YY1 in the Y direction by 2.00 which is an enlarged display magnification selected (determined) from the size of the electronic component D1. Control is performed so that the display is performed on the monitor 25 with the component display sizes in the X and Y directions. In this case, on the monitor 25, a component image DG (captured image) enlarged and displayed twice as large as the electronic component D1 having the component ID “AAAAAA” and a component graphics GG corresponding to the electronic component D1 are displayed. .

  If the component ID of the electronic component D2 to be displayed is “BBBBB” according to the component library data (see FIG. 5) stored in the RAM 23, the size in the X direction is XX2, and the size in the Y direction is YY2. Specifically, in the case of an electronic component called “3216”, the size in the X direction is 32 millimeters and the size in the Y direction is 16 millimeters, which corresponds to the size in the X direction of the electronic component D2 to be displayed. Since the magnification display magnification in the X direction is “30 mm or more”, it is 1.00 times. However, the magnification display magnification in the Y direction corresponding to the size in the Y direction is “10 mm or more and less than 20 mm”, so it is 2.00 times. Therefore, the CPU 21 controls to display an enlarged image at a magnification of 1.00, which is a small magnification.

  Therefore, the CPU 21 multiplies the size XX1 in the X direction of the electronic component D2 and the size YY1 in the Y direction by 1.00 which is an enlarged display magnification selected (determined) from the size of the electronic component D2. Control is performed so that the display is performed on the monitor 25 with the component display sizes in the X and Y directions. In this case, the monitor 25 displays a component image DG (captured image) that is displayed as an enlarged display of the electronic component D2 whose component ID is “BBBBB” and a component graphic GG corresponding to the electronic component D2. .

  Therefore, as described above, the board recognition camera 12 captures an image of the electronic component mounted on the printed circuit board P, and displays the captured image on the monitor 25 at an enlarged display magnification corresponding to the size of the electronic component. As a result, it is possible to check the position of the mounted electronic components without the time and effort required for the work manager to enlarge and display the captured image manually, thereby improving work efficiency. Can do.

  Next, when the work manager confirms the position of a certain electronic component, the touch panel switch 26 displayed on the monitor 25 is operated so that the certain electronic component mounted on the printed circuit board P is replaced with the substrate recognition camera 12. A third embodiment of the technique for displaying the captured image that has been captured and automatically enlarged on the monitor 25 will be described with reference to FIG.

  In the third embodiment, the size of the electronic component image displayed on the monitor 25 is the same as the component display size of the electronic component image determined by the size of the display screen of the monitor 25. Is displayed at an enlarged display magnification determined in (1). Specifically, the image is picked up on the display screen so that the interval between the component image DG captured of the electronic component and the component graphics GG is constant and the peripheral dead space of the component graphics GG is constant. This is an embodiment for displaying an image of an electronic component.

  That is, according to the component library data (see FIG. 5) stored in the RAM 23, if the component ID of the electronic component D1 to be displayed is “AAAAAA” (the display screen size MX1-X direction of the monitor 25 in the X direction). The CPU 21 divides the peripheral dead space DX1 × 2) by the size XX1 of the electronic component D1 in the X direction to obtain an enlarged display magnification in the X direction, and (the display screen size MY1-Y of the monitor 25 in the Y direction) The CPU 21 divides the peripheral dead space DY1 × 2) in the direction by YY1 having the size in the Y direction of the electronic component D1, and obtains an enlarged display magnification in the Y direction.

  Then, according to the enlarged display magnification obtained by the division, the CPU 21 multiplies the calculated enlarged display magnification by XX1 of the size in the X direction and YY1 of the size in the Y direction by the CPU 21 to monitor the electronic component D1. 25 so that the image is enlarged and displayed. In this case, the monitor 25 has a peripheral dead space DS on the display screen (DX1 in the X direction and DY1 in the Y direction), and an enlarged display of the electronic component D1 with the component ID “AAAAAA”. The displayed component image DG (captured image) and component graphics GG corresponding to the electronic component D1 are displayed.

  If the component ID of the electronic component D2 to be displayed is “BBBBB” according to the component library data (see FIG. 5), the display screen size MX2 in the X direction of the monitor 25 and the peripheral dead space DX2 × in the X direction 2) is divided by XX2 of the size of the electronic component D2 in the X direction to obtain an enlarged display magnification in the X direction, and (display screen size MY2 of the monitor 25 in the Y direction and peripheral dead space DY2 in the Y direction) X2) is divided by YY2 of the size of the electronic component D2 in the Y direction, and the enlarged display magnification in the Y direction is obtained.

  Then, according to the enlarged display magnification obtained by the division, the CPU 21 multiplies the calculated enlarged display magnification by XX1 of the size in the X direction and YY1 of the size in the Y direction by the CPU 21 to monitor the electronic component D1. 25 so that the image is enlarged and displayed. In this case, the monitor 25 has a peripheral dead space DS on the display screen (DX direction in the X direction and DY2 in the Y direction), and an enlarged display of the electronic component D2 having the component ID “BBBBB”. The displayed component image DG (captured image) and component graphics GG corresponding to the electronic component D2 are displayed.

  Accordingly, as described above, the board recognition camera 12 images the electronic component mounted on the printed circuit board P so that the peripheral dead space of the part graphics GG on the display screen is constant, or the part image on the display screen. Since the image of the captured electronic component can be displayed so that the peripheral dead space of the DG is constant, the work manager is required to enlarge the captured image manually and to display it. Therefore, the position of the mounted electronic component can be confirmed, and the working efficiency can be improved.

  In the first to third embodiments described above, the captured component image DG and component graphics GG of the electronic component are displayed, but the component graphics GG may not necessarily be displayed. In this case, in the third embodiment, when the component graphics GG is not displayed, the component image DG may be displayed so that the peripheral dead space of the captured component image DG of the electronic component is constant. .

  The work manager confirms the captured image of the electronic component, as described in the above embodiment, the substrate recognition camera images the electronic component mounted on the printed circuit board, and the captured image is used as a monitor. This is a case where the position of the electronic component is displayed and the position of the mounted electronic component is confirmed. However, the present invention is not limited to this case, and the case of confirming the position of the electronic component at the component suction / extraction position of the component supply unit is also applicable.

  In addition, the imaging of electronic components is not limited to the board recognition camera, but other recognition cameras may be used. However, the recognition processing apparatus captures the recognition mark attached to the printed board and performs the recognition process. If the board recognition camera is used, the electronic component mounting apparatus that can grasp the position of the apparatus has an inexpensive and simple configuration.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Component supply apparatus 3B Component supply unit 5 Suction nozzle 12 Substrate recognition camera 21 CPU
23 RAM
25 Monitor 26 Touch Panel Switch 29 Recognition Processing Device

Claims (2)

After the recognition mark attached to the printed circuit board is imaged by the circuit board recognition camera and the recognition processing device performs the recognition processing, the electronic component held by the holding means is mounted on the printed circuit board based on the recognition processing result. In the electronic component mounting apparatus, a monitor for displaying an image of the specified electronic component mounted on the printed circuit board imaged by the substrate recognition camera, and an enlarged display magnification determined for each predetermined range of the size of the electronic component And a control unit for causing the monitor to display an enlarged display according to an enlargement display magnification stored in the storage device corresponding to the electronic component designated on the printed board imaged by the board recognition camera. a control device is provided, wherein the storage device, the electronic X-direction enlargement display magnification determined for each predetermined range of sizes of components and Y direction size An enlarged display magnification determined for each predetermined range is stored, and the control device includes a size in the X direction and a size in the Y direction of the specified electronic component on the printed circuit board imaged by the board recognition camera. Is controlled so as to enlarge and display the designated electronic component on the monitor in accordance with a smaller enlarged display magnification of the enlarged display magnification in the X direction and the enlarged display magnification in the Y direction stored in the corresponding storage device. electronic component mounting apparatus to be.   After the recognition mark attached to the printed circuit board is imaged by the circuit board recognition camera and the recognition processing device performs the recognition processing, the electronic component held by the holding means is mounted on the printed circuit board based on the recognition processing result. In the electronic component mounting apparatus, a monitor for displaying an image of a specified electronic component mounted on the printed circuit board imaged by the substrate recognition camera, and a size of a peripheral dead space of the electronic component on the monitor were imaged A control device for obtaining a display magnification divided by the size of the designated electronic component on the printed circuit board and controlling the image of the designated electronic component to be displayed at the display magnification on a display screen; An electronic component mounting apparatus characterized by the above.

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