JP5085509B2 - Electronic component mounting method, electronic component mounting apparatus, and electronic component mounting order determination method for electronic component mounting apparatus - Google Patents

Description

  The present invention relates to an electronic component mounting method, an electronic component mounting apparatus, and an electronic component mounting apparatus for mounting an electronic component on a printed circuit board that is picked up by a suction nozzle from a component supply device. The present invention relates to a component mounting order determination method. In particular, the apparatus includes a conveyance device that conveys a printed circuit board, a component supply device that is provided across the conveyance device and supplies electronic components, a pair of beams that can be moved in one direction by a drive source, and a suction nozzle. The present invention relates to an electronic component mounting method for an electronic component mounting apparatus including a mounting head that can be moved by a drive source in a direction along each beam, an electronic component mounting apparatus, and an electronic component mounting order determination method for the electronic component mounting apparatus.

This type of electronic component mounting apparatus is disclosed in, for example, Patent Document 1. In general, component supply devices for supplying electronic components are provided on both outer sides of a transfer device for transferring a printed circuit board, and a pair of beams provided with mounting heads are provided corresponding to the component supply devices. That is, each beam corresponds to each component supply device, and the mounting head of one beam generally takes out an electronic component from only the corresponding component supply device and mounts it on a printed board.
JP 2006-286707 A

  However, when component supply devices are provided on both sides of the transport device, particularly when using a tray feeder that places electronic components on the tray and allows them to be taken out by suction nozzles as one component supply device. When the number of electronic components to be taken out from the tray feeder and mounted on the printed circuit board of one kind of board type is small, the operating condition of the corresponding beam is deteriorated and the production efficiency is poor.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to improve the operational efficiency of a beam and improve the production efficiency even when there are few electronic components to be extracted from a component feeder such as a tray feeder.

For this reason, the first invention includes a transport device that transports a printed circuit board in the X direction, a component supply device that supplies electronic components, and a pair of left and right guides that extend in the Y direction perpendicular to the substrate transport direction of the transport device. A pair of beams that can be moved in the Y direction by a driving source by sliding along the slider, and each nozzle is provided with a suction nozzle inside each beam and moved by the driving source in the direction along each beam. The component supply device is provided on one outer side and the other outer side of the transport device, and the drive source is driven to be provided on one outer side. The mounting head and the mounting head provided on the other outer side are arranged between the printed circuit board on the transport device, the one component supply device on the outer side, and the component supply device on the other outer side. Move to each mounting head In the electronic component mounting device of the electronic component mounting device that takes out the electronic component from the component supply device by the suction nozzle and mounts it on the printed circuit board, the electronic component is mounted from the component supply device on one outer side. One external mounting head with a small number of electronic components takes out the electronic components supplied from the other external component supply device in order, and simultaneously extracts and installs the other external mounting head. It is characterized by doing.

According to a second aspect of the invention, there is provided a conveyance device that conveys the printed circuit board in the X direction, a component supply device that supplies electronic components, and a pair of left and right guides that extend in the Y direction perpendicular to the substrate conveyance direction of the conveyance device. A pair of beams that can slide and move in the Y direction by a drive source, and a suction nozzle that is provided inside each beam and can be moved by each drive source in the direction along each beam. A mounting head, the component supply device is provided on both outer sides of the transport device, and the drive heads are driven to connect the mounting heads provided on the beams to the printed circuit board and the component on the transport device. The electronic component of the electronic component mounting apparatus that is moved between the supply devices, takes out the electronic component from the component supply device by the suction nozzle provided in each mounting head, and mounts the electronic component on the printed circuit board. In the attaching method, one of the electronic components based on the mounting data storing the mounting coordinate information, the number information of the component supply device that supplies the electronic components, and the number information of the mounting head that mounts the electronic components. One of the external mounting heads, which is taken out from the component supply device on the side and mounted on the printed circuit board of one type of board, has a small number of electronic components supplied from the component supply device on the other side. It is characterized in that the mounting head of the other side picks up the electronic components at the same time and picks up and puts them in order.

According to a third aspect of the present invention, a slider slides along a transport device that transports a printed circuit board in the X direction and a pair of left and right guides that extend in the Y direction perpendicular to the substrate transport direction of the transport device. A pair of beams that can move in the Y direction, a mounting head that includes a suction nozzle and that can be moved by each drive source in a direction along each beam, and a tray that is provided on one outer side across the transport device A tray feeder for supplying the stored electronic components and a component supply device for supplying the stored electronic components on the other outer side; Is moved between the printed circuit board on the transport device, the tray feeder, and the component supply device, and the tray feeder and the From goods feeder in the mounting method of the electronic component of the electronic component mounting apparatus which takes out the electronic component is mounted on the printed circuit board, mounting coordinates for each mounting order of electronic component information, the component supply device for supplying electronic components number information, and one out of the number of parts to be mounted on the board type of the printed circuit board of adsorbed one type is supplied from the tray feeder on the basis of the mounting data stored the number information of the mounting head is small to mount the electronic component When there is no more electronic component to be taken out from the tray feeder and mounted on the printed circuit board, the other side mounting head uses the electronic component supplied from the component supply device and the other outer mounting head sequentially passes the electronic component. It is characterized in that it is taken out at the same time as it is taken out and attached.

According to a fourth aspect of the present invention, there is provided a conveyance device that conveys the printed circuit board in the X direction, a component supply device that supplies electronic components and is provided on both sides of the conveyance device, and a substrate conveyance direction of the conveyance device. A slider slides along a pair of right and left guides extending in the orthogonal Y direction and is movable in the Y direction by a driving source , and each of the beams is provided with a suction nozzle provided inside the beam. A mounting head that can be moved by each drive source in a direction along each beam. The drive source is driven and an electron from any of the component supply devices is provided by a suction nozzle of the mounting head provided on each beam. When there are few electronic components that can be taken out from the component supply device in which the suction nozzle of one beam is provided on the outer side of the beam and mounted on the printed circuit board , One of the beams the mounting head and the other mounting head of the other beam the supplied electronic components from the component supply device provided outside the is taken out in the order and at the same time taking out the electronic components sequentially, the printing It is mounted on a substrate.

According to a fifth aspect of the invention, there is provided a conveyance device that conveys the printed circuit board in the X direction, a component supply device that supplies electronic components, and a pair of left and right guides that extend in the Y direction perpendicular to the substrate conveyance direction of the conveyance device. A pair of beams that can slide and move in the Y direction by a drive source, and a suction nozzle that is provided inside each beam and can be moved by each drive source in the direction along each beam. A mounting head, the component supply device is provided on both outer sides of the transport device, and the drive heads are driven to connect the mounting heads provided on the beams to the printed circuit board and the component on the transport device. The electronic component of the electronic component mounting apparatus that is moved between the supply devices, takes out the electronic component from the component supply device by the suction nozzle provided in each mounting head, and mounts the electronic component on the printed circuit board. In the attaching method, one of the electronic components based on the mounting data storing the mounting coordinate information, the number information of the component supply device that supplies the electronic components, and the number information of the mounting head that mounts the electronic components. One of the external mounting heads, which is taken out from the component supply device on the side and mounted on the printed circuit board of one type of board, has a small number of electronic components supplied from the component supply device on the other side. And a step of determining the mounting order so that the mounting head sequentially picks up the electronic components at the same time and picks up the electronic components.
According to a sixth aspect of the present invention, a slider slides along a conveying device that conveys a printed circuit board in the X direction and a pair of left and right guides that extend in the Y direction perpendicular to the substrate conveying direction of the conveying device. A pair of beams that can move in the Y direction, a mounting head that includes a suction nozzle and that can be moved by each drive source in a direction along each beam, and a tray that is provided on one outer side across the transport device A tray feeder for supplying the stored electronic components and a component supply device for supplying the stored electronic components on the other outer side; Is moved between the printed circuit board on the transport device, the tray feeder, and the component supply device, and the tray feeder and the In an electronic component mounting method of an electronic component mounting apparatus that takes out an electronic component from a product supply apparatus and mounts the electronic component on the printed circuit board, information on mounting coordinates for each electronic component mounting order, and the electronic component mounting apparatus that supplies the electronic component Based on the number data and the mounting data storing the number information of the mounting head for mounting the electronic component, the number of components to be supplied from the tray feeder and taken out and mounted on the printed circuit board of one type of board is small. When there is no more electronic component to be taken out from the tray feeder and mounted on the printed circuit board, the other side mounting head uses the electronic component supplied from the component supply device and the other outer mounting head sequentially passes the electronic component. It is characterized in that it has a step of determining the mounting order so as to be taken out in order at the same time as taking out and to be put on.

  According to the present invention, even when there are few electronic components taken out from a component feeder such as a tray feeder, it is possible to improve the operational status of the beam and improve the production efficiency.

  A first embodiment of an electronic component mounting apparatus for mounting electronic components on a printed circuit board will be described below with reference to FIGS. The electronic component mounting device 1 includes a transport device 2 that transports the printed circuit board P in the X direction, a tray feeder 5 provided on one side of the transport device 2, that is, the back side (up in FIG. 1), A component supply device 3 such as a cart, which is provided on the other side of the transport device 2, that is, the front side (lower in FIG. 1) and supplies electronic components, for example, a plurality of component supply units, and a drive source. A pair of beams 7 and 8 movable in one direction and mounting heads 10 and 11 each having a suction nozzle and movable in the direction along each beam 7 and 8 by each drive source are provided.

  The tray feeder 30 stores electronic components, for example, a pallet 44 on which a tray 4 on which a large number of electronic components are arranged is placed, and stores the pallet 44 between a storage unit and a component supply position. A parts supply device that can be replaced, a magazine that stores a plurality of stages of pallets 44, a drawer mechanism that pulls out a predetermined pallet 44 of the magazine, and an elevator that raises the pallet 44 pulled out by the drawer mechanism to an electronic component supply position. However, the present invention is not limited to this, and the structure is not limited as long as it is a component supply device that supplies electronic components using the tray 4.

  The transport device 2 is disposed in an intermediate portion of the electronic component mounting device 1 and is sucked and held by the substrate supply unit that inherits the printed circuit board P from the upstream device and the suction nozzles 100 and 110 of the mounting heads 10 and 11. Positioning unit for positioning and fixing the printed circuit board P supplied from the substrate supply unit for mounting the electronic component, and a discharge unit for inheriting the printed circuit board P on which the electronic component is mounted by this positioning unit and conveying it to the downstream device It consists of.

  The component supply device 3 includes a feeder base 12, and a plurality of component supply units 13 as component supply units are detachably arranged on the feeder base 12, and various electronic components are respectively extracted from the component extraction unit. One by one is supplied to (part suction position).

  A pair of front and rear beams 7 (tray feeder 7 side) and a beam 8 on the other side (component feeder 3 side) that are long in the X direction are moved forward and backward by a pair of left and right front motors 9 by driving each Y direction linear motor 9. Sliders fixed to the beams slide along the extended guides and individually move in the Y direction. The Y-direction linear motor includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 9a fixed to lower portions of mounting plates provided at both ends of the beams 7 and 8. It consists of.

  The beams 7 and 8 are respectively provided with mounting heads 10 and 11 that move along the guide in the longitudinal direction (X direction) by an X-direction linear motor 23 (see FIG. 2). The directional linear motor includes a pair of front and rear stators fixed to the beams 7 and 8 and a mover provided on the mounting heads 10 and 11 between the stators.

  Accordingly, the mounting heads 10 and 11 are provided inside the beams 7 and 8 so as to face each other, and move above the printed circuit board P, the component supply unit 13 and the component extraction position of the tray 4 on the positioning unit of the transport device 2. To do.

  The mounting heads 10 and 11 are provided with suction nozzles biased downward by, for example, four springs on the circumference at predetermined intervals. It is also possible to simultaneously take out electronic components from a plurality of component supply units 13 arranged in parallel by suction nozzles located at the 3 o'clock and 9 o'clock positions. This suction nozzle can be moved up and down by a vertical axis motor 25 (see FIG. 2), and by rotating the mounting heads 10 and 11 around the vertical axis by a θ-axis motor 26 (see FIG. 2), as a result, each mounting head. Each of the suction nozzles 10 and 11 can move in the X direction and the Y direction, can rotate around a vertical line, and can move up and down.

  The mounting heads 10 and 11 are provided with board recognition cameras 14 and 14, respectively, for picking up an image of a positioning mark attached to the printed board P being positioned. Further, the component recognition camera 15 captures images of the electronic components sucked and held by the suction nozzles at once.

  FIG. 2 is a control block for control related to electronic component mounting of the electronic component mounting apparatus 1 and will be described below. Each element of the electronic component mounting apparatus 1 is centrally controlled by a CPU (Central Processing Unit) 16 and stores a ROM (Read Only Memory) 36 for storing a program related to this control and various data. A RAM (Random Access Memory) 17 is connected via a bus line 18. Further, a monitor 20 for displaying an operation screen and the like and a touch panel switch 21 as an input means formed on the display screen of the monitor 20 are connected to the CPU 16 via an interface 22. The Y-direction linear motor 9 and the like are connected to the CPU 16 via a drive circuit 24 and an interface 22.

  The RAM 17 stores NC data for each type (substrate type) of the printed circuit board P. This NC data includes operation data, setup data, mounting data, component arrangement data, and the like. The operation data includes NC data name comments, the size of the printed circuit board in the X and Y directions, the thickness of the printed circuit board, the presence / absence of advanced parts, the height of advanced parts, and the board finishing mode. The mounting data of, for example, board type A, which is a printed board having a large number of electronic components supplied from the tray feeder 5, is as shown in FIG. In this mounting data, when the printed board P of the board type A is produced by the electronic component mounting apparatus 1, the electronic components are alternately taken out from the component supply apparatus 3 or the tray feeder 5 and mounted on the printed board as efficiently as possible. The order of taking out the electronic components from the component supply device 3 and the tray feeder 5 is optimized and set in advance.

  Further, information on the type (component ID) of each electronic component corresponding to the component supply unit arrangement number of each component supply unit 13, that is, component arrangement data is shown in FIG. 4, and the arrangement number of the tray 4 in the tray feeder 5 is shown. FIG. 5 shows information on the type (component ID) of each corresponding electronic component, that is, component arrangement data. Further, the RAM 17 stores stage data indicating which tray (FDR) is stored in which stage in the tray feeder 5 shown in FIG.

  7 is stored in the RAM 17 in advance for a board type B that is a printed board produced next to the board type A and has a small number of electronic components supplied from the tray feeder 5. In this mounting data, when the electronic component mounting apparatus 1 produces the printed board P of the board type B, the electronic component is extracted from the component supply device 3 or the tray feeder 5 and mounted on the printed circuit board as efficiently as possible. The order of taking out the electronic components from the supply device 3 and the tray feeder 5 is optimized and set in advance. For example, the mounting head 10 (head No. 1) on one side, which is on the tray feeder 5 side with a small number of components to be mounted (that is, one side with a small number of components to be mounted) is, for example, step numbers “0009” to In “0012” or the like, the number of parts to be mounted is set through a step of determining by suction from the other supply device side. Further, the component arrangement data shown in FIG. 8 for the component supply unit, the component arrangement data shown in FIG. 9 for the tray feeder, and the stage data shown in FIG. 10 are stored in the RAM 17. Furthermore, the mounting data shown in FIG. 11 and the component supply unit shown in FIG. 12 are set in advance for the board type C which is a printed board produced next to the board type B and has no electronic components supplied from the tray feeder 5. Component arrangement data is stored in the RAM 17. For example, the mounting head 10 (head No. 1) on one side and on the tray feeder 5 side where there are no components to be mounted (that is, one side where there are no components to be mounted) is, for example, step numbers “0005” to “0005”. In “0008”, “0013” to “0016”, etc., the number of components to be mounted is set through a step of determining by suction from the other supply device side.

  The mounting data shown in FIG. 3 is the X direction of the mounting coordinates of each electronic component in each printed circuit board P with the upper left corner of each printed circuit board P as the origin for each mounting order (for each step number). (Right direction is positive in FIG. 1), Y direction (downward direction is positive in FIG. 1), mounting angle information, suction nozzle number information (indicated by “1” to “4”), and arrangement number of each component supply unit Information (FDR), number information of the mounting heads 10 and 11 (the mounting head 10 provided on the rear beam 7 is indicated by “1”, and the mounting head 11 provided on the front beam 8 is indicated by “2”) Etc. are stored.

  According to this mounting data, the step numbers “0001” to “0004” and “0009” to “0012”... Use the mounting head 10 (head number “1”) provided on the back beam 7. This means that electronic components are mounted on the printed circuit board P, and the step numbers “0005” to “0008” and “0013” to “0016” are the mounting heads 11 (heads) provided on the beam 8 on the near side. No. “2”) means that an electronic component is mounted on the printed circuit board P.

  The RAM 13 also stores component library data representing the characteristics of each electronic component composed of shape data, recognition data, control data, and component supply data.

  A recognition processing device 27 is connected to the CPU 16 via the interface 17. The recognition processing device 27 performs recognition processing of an image captured by the board recognition camera 14 or the component recognition camera 15. The processing result is sent to the CPU 16. That is, the CPU 16 outputs an instruction to the recognition processing device 27 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the board recognition camera 14 or the component recognition camera 15, and also recognizes the recognition processing result. 27 is received.

  With the above configuration, the operation will be described below.

  First, the operator presses the touch panel switch 21 displayed on the monitor 20, designates the type of the printed circuit board P to be produced as a board type A, and presses the operation switch, whereby the electronic component mounting apparatus 1 is produced. Start driving.

  Then, as shown by the arrow 33, when the printed circuit board P is inherited from the upstream device (not shown) and exists on the supply unit of the transport device 2, the printed circuit board P on the supply unit is moved to the positioning unit. The printed circuit board P is positioned and fixed in the plane direction and the vertical direction.

  When the printed circuit board P is positioned, the slider 7 slides in the Y direction along the guide extending in the front-rear direction by driving the Y-direction linear motor 9, and the X-direction linear motor is moved. 23, the mounting head 10 moves in the X direction, moves to above the component extraction position of the tray 4, and the suction nozzle 101 is lowered by driving the vertical axis motor to take out the electronic component from the tray 4. In this case, the plurality of suction nozzles 101 can take out electronic components from the tray 4 by moving and rotating the mounting head 10 in the X direction and further raising and lowering the suction nozzles 101.

  When the printed circuit board P is positioned, the CPU 16 moves the mounting heads 10 and 11 of both beams 7 and 8 into the tray 4 and the component supply unit according to the mounting data (see FIG. 3) of the board type A stored in the RAM 17. The electronic components are taken out from 13 at the same time (not “synchronous”) and are controlled to be simultaneously mounted on each printed circuit board P. In this case, both the beams 7 and 8 are controlled so as not to approach more than necessary in the Y direction, and both the mounting heads 10 and 11 are controlled not to approach more than necessary in the X direction. The collision of the eight mounting heads 10 and 11 is prevented.

  First, from step numbers “0001” to “0004”, electronic components are sequentially taken out by the mounting head 10 (head number “1” in FIG. 3) provided on the back beam 7 from the tray 4, From step numbers “0005” to “0008”, the electronic components are sequentially taken out from the component supply unit 13 by the mounting head 11 (head number “2” in FIG. 3) provided on the beam 8 on the near side. That is, at the step number “0001”, the electronic component is taken out from the tray 4 with the nozzle number “1” of the suction nozzle 101 of the mounting head 10 provided in the back beam 7 and the arrangement number “301”, and at the same time, the step number In “0005”, each mounting is performed such that the suction nozzle 111 with the nozzle number “1” of the mounting head 11 provided in the beam 8 on the near side takes out the electronic component from the component supply unit 13 with the arrangement number “211”. The heads 10 and 11 pick up and take out four electronic components according to the corresponding step numbers. At this time, the start of component suction by the mounting head 11 on the front side and the start of component suction by the mounting head 10 on the back side, and the end of suction of all components by the mounting head 11 on the front side and the mounting head on the back side are performed. There is a case where the end of the suction of all the parts by 10 is shifted.

  Further, after the removal, the suction nozzles 101 and 111 of both mounting heads 10 and 11 are raised so that the mounting heads 10 and 11 pass above the component recognition camera 15 and both mounting heads 10 and 11 are moved during this movement. The four suction nozzles 101 and 111 are respectively picked up and picked up by four electronic components, and the recognition processing device 27 recognizes the picked-up images to process the picked-up images. Grasp the misalignment of electronic components.

  Thereafter, the substrate recognition camera 8 provided on the mounting heads 10 and 11 of both beams 7 and 8 is moved above each printed circuit board P, and a positioning mark attached to the printed circuit board P positioned on the transport device 2. The recognition processing device 27 recognizes the captured image and grasps the position of each printed circuit board P. Then, by adding the position recognition result of each printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, each suction nozzle 101, 111 corrects the positional deviation, and each electronic component is transferred to each printed circuit board P. Install on top.

  That is, for the electronic components from step numbers “0001” to “0004”, the suction nozzle 101 of the mounting head 10 provided on the back beam 7 is fed from the tray 4 and held on the printed circuit board P. At the same time as mounting with correction, the suction nozzle 111 of the mounting head 11 provided on the beam 8 on the near side is supplied from the component supply unit 13 and held by suction for the electronic components from step numbers “0005” to “0008”. The electronic components thus mounted are sequentially mounted on the printed circuit board P while being corrected. Also in this case, the corresponding Y-direction linear motor 9 and X-direction linear motor 23 are controlled by the CPU 16 so that the mounting heads 10 and 11 of both beams 7 and 8 do not collide. At this time, the start of component mounting by the mounting head 11 on the front side and the start of component mounting by the mounting head 10 on the back side, and the end of mounting all components by the mounting head 11 on the front side and the mounting head on the back side. In some cases, the end of the mounting of all the parts by 10 is different.

  Next, from step numbers “0009” to “0012”, electronic components are sequentially taken out from the back tray 4 by the mounting head 10 provided on the back beam 7, and at the same time, step numbers “0013” to “0016” are taken. Until then, the electronic component is taken out from the component supply unit 13 on the near side by the mounting head 11 provided on the beam 8 on the near side. Moreover, after this take-out, as described above, both the mounting heads 10 and 11 move, and during this time, the recognition processing device 22 performs recognition processing to grasp the positional deviation of the sucked electronic component with respect to the suction nozzle.

  Then, by adding the position recognition result of each printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, each suction nozzle 101, 111 corrects the positional deviation, and each electronic component is transferred to each printed circuit board P. Install on top. That is, for the electronic components from step numbers “0009” to “0012”, the electronic components sucked and held by the suction nozzle 101 provided in the mounting head 10 provided in the back beam 7 are corrected on the printed circuit board P. At the same time, the electronic components from step numbers “0013” to “0016” are printed with the electronic components sucked and held by the suction nozzle 111 provided on the mounting head 11 provided on the beam 8 on the near side. Sequentially mounted on the substrate P while correcting.

  In this way, after the electronic components having the step numbers “0009” to “0012” are taken out from the tray 4 and mounted, the tray feeder 5 is used by the CPU 16 until the mounting head 10 reaches above the tray 4. The tray 4 located on the transport device 2 side is replaced with the tray 4 with the arrangement number “301”.

    Then, from the step numbers “0017” to “0020”, the electronic components are sequentially taken out from the back side tray 4 by the mounting head 10 provided on the back side beam 7, and at the same time, the step numbers “0021” to “0024”. Until then, the electronic component is taken out from the component supply unit 13 on the near side by the mounting head 11 provided on the beam 8 on the near side. Moreover, after this take-out, as described above, both the mounting heads 10 and 11 move, and during this time, the recognition processing device 22 performs recognition processing to grasp the positional deviation of the sucked electronic component with respect to the suction nozzle.

  Then, by adding the position recognition result of each printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, each suction nozzle 101, 111 corrects the positional deviation, and each electronic component is transferred to each printed circuit board P. Install on top. That is, for the electronic components from step numbers “0017” to “0020”, the electronic components sucked and held by the suction nozzle 101 provided in the mounting head 10 provided in the back beam 7 are corrected on the printed circuit board P. At the same time, the electronic components from step numbers “0021” to “0024” are printed with the electronic components sucked and held by the suction nozzle 111 provided on the mounting head 11 provided on the beam 8 on the near side. Sequentially mounted on the substrate P while correcting.

    Next, similarly, from step numbers “0025” to “0028”, electronic components are sequentially taken out from the back side tray 4 by the mounting head 10 provided on the back side beam 7 and at the same time, the step number “0029”. To “0032”, the electronic components are taken out from the component supply unit 13 on the near side by the mounting head 11 provided on the beam 8 on the near side. Then, electronic components from step numbers “0025” to “0028” are sequentially mounted on the printed circuit board P while being corrected, and at the same time electronic components from step numbers “0029” to “0032” are corrected on the printed circuit board P. While wearing sequentially.

  Thereafter, the electronic components housed in the tray 4 and the component supply unit 13 are taken out by the mounting head 10 on the back side and the mounting head on the near side, and are sequentially mounted on the printed circuit board P and printed on one sheet. When the mounting of the electronic component on the board P is completed, the printed board P is carried out by the transport device 2, and a new printed board is carried in from the upstream side, and the electronic component is mounted on the printed board as described above. The In this way, the electronic components housed in the tray 4 and the component supply unit 13 are divided and held by the mounting head 10 on the back side and the mounting head 11 on the front side, and are sequentially mounted on the printed circuit board. The mounting tact can be made as short as possible.

  Then, after the production of the printed board of the board type A is completed, the operator then presses the touch panel switch 21 displayed on the monitor 20 to take out the type of the printed board P to be produced from the tray feeder 5. By designating the board type B having a small number of electronic components to be mounted and pressing the operation switch, the production operation of the printed board of the board type B is started.

  When the printed circuit board P of the substrate type B is inherited from the upstream device (not shown) and exists on the supply unit of the transport device 2, the printed circuit board P on the supply unit is moved to the positioning unit. The substrate P is positioned and fixed in the planar direction and the vertical direction.

  When the printed circuit board P is positioned, the CPU 16 mounts the mounting heads 10 and 11 of both beams 7 and 8 on the tray 4 and the component supply unit according to the mounting data of the board type B described in FIG. The electronic components are taken out from 13 at the same time (not “synchronous”) and controlled to be mounted on each printed circuit board P.

  In the mounting data of the board type B, when the printed board P of the board type B is produced by the electronic component mounting apparatus 1, the number of electronic parts to be taken out and mounted from the tray feeder 5 and the electronic parts to be taken out from the component supply apparatus 3 and mounted. In this embodiment, when the number of electronic components taken out from the tray feeder 5 and attached is smaller than the number of electronic components taken out from the component supply device 3 and mounted, The same suction nozzle is attached to each of the mounting head 11 and the mounting head 11, so that the balance between the number of electronic components that the mounting head 10 takes out and mounts and the number of electronic components that the mounting head 11 takes out and mounts is the same as much as possible. In other words, the electronic components to be taken out by the suction heads 101 and 111 of the mounting heads 10 and 11 are allocated and the steps are allocated. .

  Further, since the beam 7 cannot pass the beam 8 and enter the component mounting device 3 on the near side, as many electronic components as possible are allocated to the tray feeder 5 and the number of electronic components allocated to the component supply device 3 is minimized. Thus, the operating rate of the mounting head 10 can be improved as much as possible.

  In this case, both the beams 7 and 8 are controlled so as not to approach more than necessary in the Y direction, and both the mounting heads 10 and 11 are controlled not to approach more than necessary in the X direction. The collision of the eight mounting heads 10 and 11 is prevented.

  First, from the mounting data step numbers “0001” to “0004” shown in FIG. 7, the mounting head 10 (head number “1” in FIG. 3) provided on the beam 7 on the back side from the tray 4 performs electronic components. Are sequentially taken out, and electronic components are placed from step numbers “0005” to “0008” by the mounting head 11 (head number “2” in FIG. 3) provided on the beam 8 on the near side from the component supply unit 13. It is taken out in order. That is, at the step number “0001”, the electronic component is taken out from the tray 4 with the nozzle number “1” of the suction nozzle 101 of the mounting head 10 provided in the back beam 7 and the arrangement number “301”, and at the same time, the step number In “0005”, each mounting is performed such that the suction nozzle 111 with the nozzle number “1” of the mounting head 11 provided on the beam 8 on the near side takes out the electronic component from the component supply unit 13 with the arrangement number “201”. The heads 10 and 11 pick up and take out four electronic components according to the corresponding step numbers. At this time, as in the production of the substrate type A, the start of component suction by the front mounting head 11 and the start of component suction by the rear mounting head 10 are all performed by the front mounting head 11. There is a case where the end of the suction of the component and the end of the suction of all the components by the mounting head 10 on the back side are different.

  Further, after the removal, as in the production of the substrate type A described above, both mounting heads 10 and 11 are moved, and during this time, the recognition processing device 22 performs recognition processing and suction nozzles for electronic components that are sucked. Grasping the positional deviation with respect to.

  Then, by adding the position recognition result of each printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, each suction nozzle 101, 111 corrects the positional deviation, and each electronic component is transferred to each printed circuit board P. Install on top. That is, for the electronic components from step numbers “0001” to “0004”, the electronic components sucked and held by the suction nozzle 101 provided in the mounting head 10 provided in the back beam 7 are corrected on the printed circuit board P. At the same time, the electronic components with the step numbers “0005” to “0008” are printed with the electronic components sucked and held by the suction nozzle 111 provided on the mounting head 11 provided on the beam 8 on the near side. Sequentially mounted on the substrate P while correcting.

  The electronic components supplied from the tray feeder 5 are only the electronic components from the above-mentioned step numbers “0001” to “0004”, and the electronic components on the printed circuit board P after the above-described removal and mounting operation of the electronic components are completed. The mounting operation will be described below.

  In the component mounting data shown in FIG. 7, the mounting step of the electronic component after the supply of the electronic component from the tray feeder 5 is also set. Based on this mounting step, electronic components having step numbers “0009” to “0032” are mounted on the printed circuit board P.

  That is, as shown in FIG. 13, the mounting head 10 provided on the back beam 7 moves above the component supply unit 13 on the near side, and from the step numbers “0009” to “0012”, the mounting head 10. The electronic components are taken out from the component supply unit 13 in order, and at the same time, from step numbers “0013” to “0016”, the electronic components are taken out from the component supply unit 13 by the mounting head 11 provided on the beam 8 on the near side. The After the removal, as described above, both the mounting heads 10 and 11 are passed over the component recognition cameras 15 and 15 provided side by side on the front side, and both mounting heads 10 and 11 are moved during this movement. Each of the four electronic components sucked and held by the four suction nozzles 101 and 111 is collectively imaged, and the recognition processing device 27 recognizes the picked-up images, and the electrons for the suction nozzles 101 and 111 are picked up. Grasp the misalignment of parts.

  Then, by adding the position recognition result of each printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, each suction nozzle 101, 111 corrects the positional deviation, and each electronic component is transferred to each printed circuit board P. Install on top. That is, for the electronic components from step numbers “0009” to “0012”, the electronic components sucked and held by the suction nozzle 101 of the mounting head 10 provided on the back beam 7 are sequentially corrected on the printed circuit board P. At the same time as mounting, the electronic components of step numbers “0013” to “0016” are corrected on the printed circuit board P by the electronic components sucked and held by the suction nozzle 111 of the mounting head 11 provided on the beam 8 on the near side. While wearing sequentially.

  Thus, when producing one printed circuit board, when the number of electronic components supplied from the tray feeder 5 is small, the mounting head 10 of the beam 7 provided on the same side as the tray feeder 5, that is, the back side is used. After the electronic component is removed from the tray feeder 5 and the mounting operation to the printed circuit board P is completed, the beam moves in the direction of the component supply unit 13, and the mounting head 10 enters the near side beyond the printed circuit board P. Since the electronic component is taken out from the component supply unit 13 in the same manner as the mounting head 11 and mounted on the printed circuit board P, the mounting head 10 on the tray feeder 5 side can be used for the production of the printed circuit board. 7, that is, the operating condition of the mounting head 10 can be improved and the production efficiency of the printed circuit board P can be improved.

  Then, from the step numbers “0017” to “0020”, the back beam 7 enters the component supply unit 13 in the same manner as the electronic components from the step numbers “0009” to “0012”. The electronic components are taken out from the component supply unit 13 in order by the mounting head 11 provided on the beam 8 on the near side from the component supply unit 13 on the near side at the same time from step numbers “0021” to “0024”. Is taken out. Moreover, after this take-out, as described above, both the mounting heads 10 and 11 move, and during this time, the recognition processing device 22 performs recognition processing to grasp the positional deviation of the sucked electronic component with respect to the suction nozzle.

  Then, by adding the position recognition result of each printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, each suction nozzle 101, 111 corrects the positional deviation, and each electronic component is transferred to each printed circuit board P. Install on top. That is, for the electronic components from step numbers “0017” to “0020”, the electronic components sucked and held by the suction nozzle 101 of the mounting head 10 provided on the back beam 7 are sequentially corrected on the printed circuit board P. At the same time as mounting, the electronic components from step numbers “0021” to “0024” are placed on the printed circuit board P by being sucked and held by the suction nozzle 111 provided in the mounting head 11 provided in the beam 8 on the near side. Sequentially wear while correcting.

  Next, similarly, from step numbers “0025” to “0028”, the electronic components are sequentially taken out from the front-side component supply unit 13 by the mounting head 10 provided on the back beam 7 at the same time. From “0029” to “0032”, electronic components are taken out from the component supply unit 13 on the near side by the mounting head 11 provided on the beam 8 on the near side. Then, electronic components from step numbers “0025” to “0028” are sequentially mounted on the printed circuit board P while being corrected, and at the same time electronic components from step numbers “0029” to “0032” are corrected on the printed circuit board P. The electronic component mounting apparatus 1 produces printed boards P one by one.

  As described above, when the printed board P of the board type B is produced, the mounting head 10 provided on the beam 7 on the tray feeder 5 side is supplied from the tray feeder 5 according to the mounting data shown in FIG. After the supply of the electronic components is finished, the vehicle enters the component supply unit 13 opposite to the tray feeder 5 and receives the supply of the electronic components from the component supply unit 13 in the same manner as the mounting head 11 provided on the beam 8. Since the electronic components are continuously mounted on the printed circuit board P, the operating condition of the beam 7, that is, the mounting head 10, can be further improved, and the production efficiency of the printed circuit board P can be improved as much as possible.

  Thereafter, when the printed board P of the board type B is produced, the electronic component from the component supply unit 13 is moved to the rear side when the electronic component is taken out from the tray feeder 5 every time one printed board P is produced. When the mounting head 10 and the mounting head 11 on the near side are taken out in parallel and sequentially mounted on the printed circuit board P, and mounting of the electronic components on one printed circuit board P is completed, the printed circuit board P is transferred to the transport device. 2 and a new printed board is carried in from the upstream side, and the electronic component is mounted on the printed board as described above. As described above, when the number of electronic components to be taken out from the tray 4 is small, the electronic components housed in the component supply unit 13 are divided and held by the mounting head 10 on the back side and the mounting head 11 on the near side. Since mounting is sequentially performed on the printed circuit board, mounting tact time can be shortened as much as possible.

  When the printed circuit board P of the board type B is produced, the steps in which the mounting head 10 takes out the electronic components from the tray feeder 5 and mounts them as shown in the mounting data shown in FIG. 0004 ", and after the electronic component was taken out from the tray feeder 5 and mounted, the electronic component was taken out from the component feeder 3 and mounted. However, when producing one printed board P of board type B, The mounting head 10 may take out the electronic component from the tray feeder 5 and mount it. That is, the production efficiency of the printed circuit board P can be improved as much as possible regardless of where the mounting head 10 takes out the electronic component from the tray feeder 5 and mounts it.

  Then, after the production of the printed board of the board type B is completed, the operator then presses the touch panel switch 21 displayed on the monitor 20, and supplies the type of the printed board P to be produced from the tray feeder 5, for example. By designating the board type C having no electronic component to be performed and pressing the operation switch, the production operation of the printed board of the board type C is started.

  When the printed circuit board P of the substrate type C is inherited from the upstream device (not shown) and exists on the supply unit of the transport device 2, the printed circuit board P on the supply unit is moved to the positioning unit. The substrate P is positioned and fixed in the planar direction and the vertical direction.

  When the printed circuit board P is positioned, the CPU 16 mounts the mounting heads 10 for both beams 7 and 8 according to the mounting data for the board type C described in FIG. 11 and the component arrangement data shown in FIG. , 11 takes out electronic components from the component supply unit 13 at the same time (not “synchronous”) and controls them to be mounted on each printed circuit board P. In this case as well, both beams 7 and 8 are controlled so as not to approach more than necessary in the Y direction, and both mounting heads 10 and 11 are controlled not to approach more than necessary in the X direction. , 8 are prevented from colliding with the mounting heads 10 and 11.

  First, the step numbers “0001” to “0004” and the step numbers “0005” to “0008” of the mounting data shown in FIG. 11 are applied to the beams 7 and 8 on the back side and the near side from the component supply unit 13. Electronic components are sequentially taken out by both of the provided mounting heads 10 and 11 (head numbers “2, 1” in FIG. 11). That is, in step number “0001”, the electronic component is taken out from the component supply unit 13 whose nozzle number “1” of the suction nozzle 101 of the mounting head 10 provided in the back beam 7 is the arrangement number “201”. At the step number “0005”, the suction nozzle 111 with the nozzle number “1” of the mounting head 11 provided on the beam 8 on the near side takes out the electronic component from the component supply unit 13 with the arrangement number “231”, respectively. The four electronic components are picked up from the component supply unit 13 and taken out according to the corresponding step numbers of the mounting heads 10 and 11. At this time, as in the production of each board type described above, the start of component suction by the front mounting head 11 and the start of component suction by the rear mounting head 10 are all performed by the front mounting head 11. There is a case in which the end of the suction of the parts is different from the end of the suction of all parts by the mounting head 10 on the back side.

  In addition, after the removal, both mounting heads 10 and 11 are moved in the same manner as in the production of the substrate type described above, and the recognition processing device 22 performs the recognition process during this time to the suction nozzle of the electronic component that is sucked. Know the displacement.

  Then, by adding the position recognition result of each printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, each suction nozzle 101, 111 corrects the positional deviation, and each electronic component is transferred to each printed circuit board P. Install on top.

  In the component mounting data shown in FIG. 11, mounting steps after step number “0009” are also set. Based on this mounting step, electronic components having step numbers “0009” to “0032” are mounted on the printed circuit board P.

  That is, as shown in FIG. 13, the mounting head 10 provided on the back beam 7 moves above the component supply unit 13 on the near side, and from the step numbers “0009” to “0012”, the mounting head 10. The electronic components are taken out from the component supply unit 13 in order, and at the same time, from step numbers “0013” to “0016”, the electronic components are taken out from the component supply unit 13 by the mounting head 11 provided on the beam 8 on the near side. The After the removal, as described above, both the mounting heads 10 and 11 are passed over the component recognition cameras 15 and 15 provided side by side on the front side, and both mounting heads 10 and 11 are moved during this movement. Each of the four electronic components sucked and held by the four suction nozzles 101 and 111 is collectively imaged, and the recognition processing device 27 recognizes the picked-up images, and the electrons for the suction nozzles 101 and 111 are picked up. Grasp the misalignment of parts.

  Then, by adding the position recognition result of each printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, each suction nozzle 101, 111 corrects the positional deviation, and each electronic component is transferred to each printed circuit board P. Install on top. That is, for the electronic components from step numbers “0009” to “0012”, the electronic components sucked and held by the suction nozzle 101 of the mounting head 10 provided on the back beam 7 are sequentially corrected on the printed circuit board P. At the same time as mounting, the electronic components of step numbers “0013” to “0016” are corrected on the printed circuit board P by the electronic components sucked and held by the suction nozzle 111 of the mounting head 11 provided on the beam 8 on the near side. While wearing sequentially.

  Then, from the step numbers “0017” to “0020”, the back beam 7 enters the component supply unit 13 in the same manner as the electronic components from the step numbers “0009” to “0012”. The electronic components are taken out from the component supply unit 13 in order by the mounting head 11 provided on the beam 8 on the near side from the component supply unit 13 on the near side at the same time from step numbers “0021” to “0024”. Is taken out. Moreover, after this take-out, as described above, both the mounting heads 10 and 11 move, and during this time, the recognition processing device 22 performs recognition processing to grasp the positional deviation of the sucked electronic component with respect to the suction nozzle.

  Then, by adding the position recognition result of each printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, each suction nozzle 101, 111 corrects the positional deviation, and each electronic component is transferred to each printed circuit board P. Install on top.

  Next, similarly, from step numbers “0025” to “0028”, the electronic components are sequentially taken out from the front-side component supply unit 13 by the mounting head 10 provided on the back beam 7 at the same time. From “0029” to “0032”, electronic components are taken out from the component supply unit 13 on the near side by the mounting head 11 provided on the beam 8 on the near side. Then, electronic components from step numbers “0025” to “0028” are sequentially mounted on the printed circuit board P while being corrected, and at the same time electronic components from step numbers “0029” to “0032” are corrected on the printed circuit board P. The electronic component mounting apparatus 1 produces printed boards P one by one.

  As described above, when the printed board P of the board type C is produced, the beam 7 is provided even when the electronic component is not taken out from the tray feeder 5 in accordance with the setting data shown in FIG. The mounting head 10 enters the component supply unit 13 side opposite to the tray feeder 5, receives electronic components from the component supply unit 13, and receives electronic components on the printed circuit board P in the same manner as the mounting head 11 provided on the beam 8. Since the components are continuously mounted, it is possible to further improve the operational status of the beam 7, that is, the mounting head 10, and to improve the production efficiency of the printed circuit board P as much as possible.

  In addition, when the printed board P of the board type C is produced after the printed board P of the board type B is produced, the above-described operation is performed even if the setup work for removing the tray feeder 5 and attaching the component feeding apparatus including the component feeding unit is eliminated. As described above, the mounting head 10 can be used for the production of the printed circuit board P of the substrate type C, and it is possible to avoid a decrease in production efficiency.

Thereafter, at the time of production of the printed board P of the board type C, every time one printed board P is produced, the electronic components from the component supply unit 13 are paralleled by the mounting head 10 on the back side and the mounting head 11 on the front side. When the electronic components are mounted on one printed circuit board P, the printed circuit board P is unloaded by the transport device 2 and a new printed circuit board is upstream. From the side, the electronic component is mounted on the printed circuit board as described above. As described above, when the number of electronic components to be taken out from the tray 4 is small, the electronic components housed in the component supply unit 13 are divided and held by the mounting head 10 on the back side and the mounting head 11 on the near side. Since mounting is sequentially performed on the printed circuit board, mounting tact time can be shortened as much as possible.
In addition to the tray feeder 5, even when a component supply device such as the component supply device 3 other than the tray feeder 5 on one side, that is, the back side, is provided when a single printed board is produced. When the number of parts to be removed from the parts supply device is small, the beam 7 on one side is applied to the beam 7 on one side after the part removal step from the parts supply device is completed or during the part removal step from the parts supply device. By providing a step of taking out an electronic component from the component supply unit 13 on the other side by the provided mounting head 10 and mounting it on the printed circuit board, the operating rate of the mounting head 10 can be improved. As a result, the production efficiency of the printed circuit board P can be improved as much as possible.

  Further, the Y-direction linear motor and the X-direction linear motor corresponding to the beams 7 and 8 are controlled by the CPU 16, and the component supply device is provided by the suction nozzles 101 and 111 of the mounting heads 10 and 11 provided in the beams 7 and 8. 3 or the tray feeder 5 can take out the electronic components. For this reason, depending on the board type of the printed circuit board to be produced, it is possible to take out electronic components from the tray feeder 5 by the mounting heads 10 and 11 and improve the operating rate of each mounting head.

  In the first embodiment described above, an example in which an electronic component is mounted on a printed board with respect to one electronic component mounting apparatus 1 has been described, but FIG. 2 is a schematic plan view of a mounting line L connecting electronic component mounting apparatuses 31 and 32. FIG. In the electronic component mounting apparatuses 31 and 32, the component supply unit 3 is connected to the back side instead of the tray feeder of the electronic component mounting apparatus 1, and other mechanisms are the same as those of the electronic component mounting apparatus 1.

  In this way, the printed circuit board P is sent to the mounting line L configured by connecting the plurality of electronic component mounting apparatuses 1, 31, and 32, as indicated by the arrow 33, and Components are supplied from the component supply device 13, electronic components are taken out by the mounting heads 10 and 11 provided on the beams 7 and 8, and mounted on the printed circuit board P. In the electronic component mounting apparatus 1, the tray 4 of the tray feeder 5 is disposed on the printed circuit board P on which the electronic components are mounted via the electronic component mounting apparatuses 31 and 32 as described in the first embodiment. When the electronic component is supplied from the component feeder 3 and taken out by the mounting head 10, the mounting head 11 takes out the electronic component from the component supply device 3 and mounts it on the printed circuit board P. 10 is placed on the component supply device 3 side, and the electronic components are taken out from the component supply device 3 and mounted. Therefore, the tray for producing the printed board P of the board type with a small number of electronic components taken out from the tray feeder 5 and mounted. The operating rate of the mounting head 10 on the feeder 5 side can be improved.

  As a result, the operation efficiency of the electronic component mounting apparatus 1 can be improved, and when the printed circuit board P produced by the upstream electronic component mounting apparatus 32 is transported to the electronic component mounting apparatus 1, the electronic component mounting is performed. It is possible to avoid as much as possible that the production in the apparatus 1 is delayed and waiting for conveyance, and the production efficiency of the entire mounting line can be improved.

  As the mounting data on the mounting line, mounting data for the entire mounting line may be created, or mounting data may be created for the electronic components to be mounted allocated to the electronic component mounting apparatuses 1, 31, 32. .

  The suction nozzles 101 attached to the mounting head 10 and the suction nozzles 111 provided to the mounting head 11 are assumed to be common. It becomes possible to take out an electronic component from

  Further, even when the suction nozzle 101 attached to the mounting head 10 is a tray suction nozzle, that is, a suction nozzle for electronic components housed in the tray 4 (referred to as a tray suction nozzle), this suction nozzle. The electronic component may be taken out from the component supply device 3 on the opposite side. Further, suction nozzles for the component supply device 3 other than the tray suction nozzles may be attached to the mounting head 10, and at this time, more than four suction nozzles may be attached to the mounting head 10. Thus, the types of suction nozzles 101 attached to the mounting head 10 can be increased.

  Further, in each of the embodiments described above, the electronic component is mounted by positioning one printed circuit board P in each of the electronic component mounting apparatuses 31, 32, and 1. However, the present invention is not limited to this. May be positioned and mounted, or two conveying devices 2 may be provided to position one or two printed boards P and mount electronic components.

  When positioning two printed circuit boards P and mounting an electronic component, the two printed circuit boards may be simultaneously carried into and out of the electronic component mounting apparatus 1, and in particular, the two printed circuit boards may be of the same substrate type. In this case, the production efficiency can be improved by carrying in and carrying out at the same time. Further, it is possible to more efficiently produce a printed circuit board by regarding two printed circuit boards as one printed circuit board, optimizing the order of taking out or mounting the components, and mounting the electronic components on the printed circuit board.

  Further, in the above-described embodiment, the mounting heads 10 and 11 of the electronic component mounting apparatus 1 are provided so as to face the beams 7 and 8 inward, as shown in FIGS. 15, 16, and 17. Like the electronic component mounting apparatus 50 of another embodiment, the beam 51 and the beam 52 having a width wider than the beam 51 and both ends positioned outside the beam are supported by the left and right support rejects 61 and 62, respectively. Are provided so as to be slidable in the Y direction. The mounting heads 10 and 11 may be suspended below the beams 51 and 52 so as to be slidable in the X direction and movable up and down. At this time, the up / down stroke of the head 11 provided on the higher beam 52 or the up / down stroke of the suction nozzle 111 is larger than the up / down stroke of the head 10 of the beam 51 or the up / down stroke of the suction nozzle 111. 15, 16, and 17, the same reference numerals are given to the same mechanisms as those in the electronic component mounting apparatus 1 shown in FIG. 1, and detailed descriptions thereof are omitted.

  By adopting such a configuration, the mounting head 10 provided on the beam 51 as well as the electronic component mounting apparatus 1 is not only the tray feeder 5 which is a component supply apparatus on the back side with a small number of electronic components to be taken out, It is possible to enter the component supply device 3 on the near side (see FIG. 16), and the operating rate of the mounting head 10 can be improved as with the electronic component mounting device 1. Further, the beam 51 overtakes the beam 52, and the mounting head 10 can be positioned in front of the mounting head 11, that is, on the component supply device side, so that the operating rate of the mounting head 10 can be further improved.

  As a result, the operation efficiency of the electronic component mounting apparatus 50 can be improved.

  Further, like the electronic component mounting apparatus 50 of the other embodiments shown in FIGS. 15, 16 and 17, the heights of the beams 51 and 52 are made different, and the mounting heads are different from the mounting heads 10 and 11, respectively. Similarly, it may be provided so as to face the side surfaces of the beams 51 and 52. With this configuration, the height of the beams 51 and 52 is compared with the case where the mounting head is suspended from the beams. Difference can be suppressed, and as a result, the height of the electronic component mounting apparatus can be minimized.

  Further, the mounting head may be hung under each beam having the same or substantially the same height as the beams 7 and 8 of the electronic component mounting apparatus 1 described above. By hanging from each beam, the horizontal projection of each mounting head from each beam can be reduced as much as possible. As a result, each beam can be brought close to each other, and each mounting Collisions between the heads can be avoided as much as possible.

  Further, unlike the electronic component mounting apparatus 1 or the electronic component mounting apparatus 50, the electronic component supply means is not provided on both the back side and the front side, but the supply means is provided on one of them, and the supply means is provided on both sides. Each beam may be provided at a different height as possible, or a mounting head may be provided below each beam.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a schematic plan view of the electronic component mounting apparatus of 1st Embodiment. It is a control block diagram. It is a figure which shows the mounting data of the board | substrate type A. FIG. It is a figure which shows the component arrangement | positioning data of the component supply apparatus of the board | substrate type A. FIG. It is a figure which shows the component arrangement | positioning data of the tray feeder of the board | substrate type A. FIG. It is a figure which shows the step data in the tray feeder of the board | substrate kind A. FIG. It is a figure which shows the mounting data of the board | substrate kind B. FIG. It is a figure which shows the component arrangement | positioning data of the component supply apparatus of the board | substrate type B. FIG. It is a figure which shows the component arrangement | positioning data of the tray feeder of the board | substrate kind B. FIG. It is a figure which shows the step data in the tray feeder of the board | substrate kind B. FIG. It is a figure which shows the mounting data of the board | substrate type C. FIG. It is a figure which shows the component arrangement | positioning data of the component supply apparatus of the board | substrate type C. FIG. It is a schematic plan view of the electronic component mounting apparatus when the beam on the tray feeder side enters the component supply apparatus side in the first embodiment. It is a schematic plan view of the mounting line which connected the some electronic component supply apparatus containing the electronic component mounting apparatus provided with the tray feeder. It is a schematic plan view of the electronic component mounting apparatus of other embodiment. In other embodiment, it is a schematic plan view of the electronic component mounting apparatus when the beam on the tray feeder side enters the component supply apparatus side. It is a schematic plan view of the principal part of the electronic component mounting apparatus of other embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveyance apparatus 3 Component supply apparatus 4 Tray 5 Tray feeder 7, 8 Beam 10, 11 Mounting head 13 Component supply unit P Printed circuit board

Claims (6)

The slider slides along a conveying device that conveys the printed circuit board in the X direction, a component supply device that supplies electronic components, and a pair of left and right guides that extend in the Y direction perpendicular to the substrate conveying direction of the conveying device. A pair of beams that can be moved in the Y direction by a driving source, and a mounting head that is provided inside each of the beams and that has a suction nozzle and can be moved by each driving source in a direction along each of the beams, The component supply device is provided on one outer side and the other outer side of the conveying device, and the mounting head provided on one outer side by driving each driving source and the other outer side Each of the mounting heads is moved between a printed circuit board on the conveying device, one of the component supply devices on the outer side, and the other component supply device on the outer side. To the suction nozzle provided in In the electronic component mounting device of the electronic component mounting device that takes out the electronic component from the component supply device and mounts it on the printed circuit board, the number of electronic components that are taken out from the component supply device on one outer side and mounted One of the few outer mounting heads takes out and mounts the electronic components supplied from the other outer component supply device at the same time that the other outer mounting head sequentially takes out. How to install electronic parts. The slider slides along a conveying device that conveys the printed circuit board in the X direction, a component supply device that supplies electronic components, and a pair of left and right guides that extend in the Y direction perpendicular to the substrate conveying direction of the conveying device. A pair of beams that can be moved in the Y direction by a driving source, and a mounting head that is provided inside each of the beams and that has a suction nozzle and can be moved by each driving source in a direction along each of the beams, The component supply device is provided on both outer sides of the transfer device, and the drive heads are driven to connect the mounting heads provided on the beams between the printed circuit board on the transfer device and the component supply device. An electronic component mounting method for an electronic component mounting apparatus that is moved to take out an electronic component from the component supply device by a suction nozzle provided in each mounting head and mount the electronic component on the printed circuit board. , The mounting coordinate information for each mounting order of the electronic components, the number information of the component supply device that supplies the electronic components, and the mounting data that stores the number information of the mounting head that mounts the electronic components. The number of components to be removed from the component supply device and mounted on the printed circuit board of one type of board is small. One external mounting head attaches the electronic component supplied from the other component supply device to the other external mounting device. A method of mounting an electronic component, wherein the head sequentially extracts and mounts the electronic components in sequence.   A slider slides along a conveyance device that conveys the printed circuit board in the X direction and a pair of left and right guides that extend in the Y direction perpendicular to the substrate conveyance direction of the conveyance device, and can be moved in the Y direction by a drive source. A pair of beams, a mounting head each provided with a suction nozzle and movable by each drive source in a direction along each beam, and an electronic component supply provided on one outer side with the transport device interposed therebetween and stored in a tray A tray feeder and a component supply device for supplying the electronic component that is provided outside the other, and drives each of the drive sources so that the mounting heads provided on the two beams are placed on the transport device. The tray feeder and the component supply device are moved by a suction nozzle provided in each mounting head by moving between a printed circuit board, the tray feeder and the component supply device. In an electronic component mounting method of an electronic component mounting apparatus that takes out an electronic component and mounts it on the printed circuit board, information on mounting coordinates for each electronic component mounting order, number information on the component supply device that supplies the electronic component, and Mounting on one outer side with a small number of components to be mounted on a printed circuit board of one type of substrate supplied from the tray feeder based on mounting data storing mounting head number information for mounting electronic components When there are no more electronic components to be removed from the tray feeder and mounted on the printed circuit board, the electronic components supplied from the component supply device are removed in order as the other outer mounting head sequentially removes the electronic components. An electronic component mounting method comprising: taking out and mounting the electronic component.   A conveyance device that conveys the printed circuit board in the X direction, a component supply device that supplies electronic components and is provided on both sides of the conveyance device, and extends in the Y direction perpendicular to the substrate conveyance direction of the conveyance device. A pair of beams that slide along a pair of left and right guides and can be moved in the Y direction by a drive source, and a direction along each beam provided with suction nozzles provided inside each beam. And a mounting head movable by each driving source, and the driving source is driven so that the electronic component can be taken out from any of the component supply devices by the suction nozzle of the mounting head provided on each beam. When there are few electronic components to be taken out from the component supply device in which the suction nozzle of one beam is provided on the outer side of one beam and mounted on the printed circuit board, The mounting head of the system removes the electronic components supplied from the component supply device provided on the outside of the other side at the same time that the mounting head of the other beam sequentially picks up the electronic components and mounts them on the printed circuit board. An electronic component mounting apparatus characterized by that. The slider slides along a conveying device that conveys the printed circuit board in the X direction, a component supply device that supplies electronic components, and a pair of left and right guides that extend in the Y direction perpendicular to the substrate conveying direction of the conveying device. A pair of beams that can be moved in the Y direction by a driving source, and a mounting head that is provided inside each of the beams and that has a suction nozzle and can be moved by each driving source in a direction along each of the beams, The component supply device is provided on both outer sides of the transfer device, and the drive heads are driven to connect the mounting heads provided on the beams between the printed circuit board on the transfer device and the component supply device. An electronic component mounting method for an electronic component mounting apparatus that is moved to take out an electronic component from the component supply device by a suction nozzle provided in each mounting head and mount the electronic component on the printed circuit board. , The mounting coordinate information for each mounting order of the electronic components, the number information of the component supply device that supplies the electronic components, and the mounting data that stores the number information of the mounting head that mounts the electronic components. The number of components to be removed from the component supply device and mounted on the printed circuit board of one type of board is small. One external mounting head attaches the electronic component supplied from the other component supply device to the other external mounting device. An electronic component mounting order determination method for an electronic component mounting apparatus, comprising: a step of determining a mounting order so that the head sequentially picks up and mounts the electronic components. A slider slides along a conveyance device that conveys the printed circuit board in the X direction and a pair of left and right guides that extend in the Y direction perpendicular to the substrate conveyance direction of the conveyance device, and can be moved in the Y direction by a drive source. A pair of beams, a mounting head each provided with a suction nozzle and movable by each drive source in a direction along each beam, and an electronic component supply provided on one outer side with the transport device interposed therebetween and stored in a tray A tray feeder and a component supply device for supplying the electronic component that is provided outside the other, and drives each of the drive sources so that the mounting heads provided on the two beams are placed on the transport device. The tray feeder and the component supply device are moved between the printed board, the tray feeder and the component supply device by the suction nozzle provided in each mounting head. In an electronic component mounting method of an electronic component mounting apparatus that takes out an electronic component and mounts it on the printed circuit board, information on mounting coordinates for each electronic component mounting order, number information on the component supply device that supplies the electronic component, and Mounting on one outer side with a small number of components to be mounted on a printed circuit board of one type of substrate that is supplied from the tray feeder based on mounting data storing mounting head number information for mounting electronic components When there are no more electronic components to be removed from the tray feeder and mounted on the printed circuit board, the electronic components supplied from the component supply device are removed in order as the other outer mounting head sequentially removes the electronic components. The electronic component mounting order of the electronic component mounting apparatus is characterized by having a step of determining the mounting order to take out and mount Method.

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