JP5027039B2 - Mounting method of electronic parts - Google Patents
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- JP5027039B2 JP5027039B2 JP2008093523A JP2008093523A JP5027039B2 JP 5027039 B2 JP5027039 B2 JP 5027039B2 JP 2008093523 A JP2008093523 A JP 2008093523A JP 2008093523 A JP2008093523 A JP 2008093523A JP 5027039 B2 JP5027039 B2 JP 5027039B2
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- 238000000034 method Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims description 13
- 238000012163 sequencing technique Methods 0.000 claims description 2
- 230000032258 transport Effects 0.000 description 35
- 238000012545 processing Methods 0.000 description 13
- 238000012546 transfer Methods 0.000 description 5
- 238000000605 extraction Methods 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 238000009434 installation Methods 0.000 description 1
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Description
本発明は、複数の基板位置決め位置を備えた搬送装置でプリント基板を搬送し、任意の位置決め位置にて位置決めしたプリント基板上に、各駆動源により一方向に移動可能な一対の各ビームに設けられ且つ各ビームに沿った方向に各駆動源により移動可能な装着ヘッドに設けられた吸着ノズルが電子部品を供給する部品供給装置より電子部品を取り出して、装着する電子部品の装着方法に関する。 In the present invention, a printed circuit board is transported by a transport device having a plurality of substrate positioning positions, and is provided on a pair of beams that can be moved in one direction by each drive source on the printed circuit board positioned at an arbitrary positioning position. Further, the present invention relates to a mounting method for an electronic component that is picked up and mounted by a suction nozzle provided on a mounting head that can be moved by each driving source in a direction along each beam.
プリント基板上に電子部品を装着する電子部品装着装置は、例えば、特許文献１などに開示されている。一般的に、装着順序毎に、Ｘ及びＹ座標、装着角度やどの部品供給ユニットを使用するかに関する装着データに基づいて、装着ヘッドに設けられた吸着ノズルによりプリント基板上に電子部品を装着する。
しかし、この複数の位置決め位置がある搬送装置が２列ある場合などには、この装着データだけでは、対応できなくなってきている。 However, when there are two rows of transfer devices having the plurality of positioning positions , it is no longer possible to deal with this mounting data alone.
そこで、本発明は複数の位置決め位置がある搬送装置が２列ある場合であっても、確実に対応するプリント基板上に電子部品を装着できるようにすることを目的とする。 Accordingly, an object of the present invention is to enable electronic components to be reliably mounted on a corresponding printed circuit board even when there are two rows of conveying devices having a plurality of positioning positions .
このため第１の発明は、複数の基板位置決め位置をそれぞれが備えた２列の搬送装置でプリント基板を搬送し、任意の位置決め位置にて位置決めしたプリント基板上に、各駆動源により一方向に移動可能な一対の各ビームに設けられ且つ各ビームに沿った方向に各駆動源により移動可能な装着ヘッドに設けられた吸着ノズルが電子部品を供給する部品供給装置より電子部品を取り出して、装着する電子部品の装着方法であって、前記２列の搬送装置のそれぞれに左右の位置決め部が設けられ、前記２列の搬送装置の左右の位置決め部のそれぞれにプリント基板が位置決めされ、装着順序毎に前記部品供給装置から電子部品をどの順序で吸着して取り出して、どの搬送装置のどの位置決め位置にあるプリント基板上に、どの装着ヘッドの吸着ノズルを使用して装着するかのデータに基づいて、一方の列の搬送装置の左右のうちの一方に位置決めされたプリント基板上に前記一対の各ビームのうちの一方のビームの装着ヘッドに設けられた吸着ノズルにより電子部品を装着すると共に、他方の列の搬送装置の左右のうちの他方に位置決めされたプリント基板上に前記一対の各ビームのうちの他方のビームの装着ヘッドに設けられた吸着ノズルにより電子部品を装着し、その後、一方の列の搬送装置の左右のうちの他方に位置決めされたプリント基板上に前記一対の各ビームのうちの一方のビームの装着ヘッドに設けられた吸着ノズルにより電子部品を装着するときには、他方の列の搬送装置の左右のうちの一方に位置決めされたプリント基板上に前記一対の各ビームのうちの他方のビームの装着ヘッドに設けられた吸着ノズルにより電子部品を装着することを特徴とする。 Therefore, according to the first aspect of the present invention , a printed circuit board is transported by a two-row transport device each having a plurality of substrate positioning positions , and each drive source is applied in one direction on the printed circuit board positioned at an arbitrary positioning position. A suction nozzle provided on a mounting head that is provided on each pair of movable beams and that can be moved by each drive source in a direction along each beam takes out the electronic components from a component supply device that supplies the electronic components and mounts them. The electronic component mounting method includes: left and right positioning portions provided in each of the two rows of conveying devices; and a printed circuit board is positioned in each of the left and right positioning portions of the two rows of conveying devices; In this order, the electronic components are picked up and taken out from the parts supply device, and the picking head of which mounting head is placed on the printed circuit board at which positioning position of which transport device. The mounting head of one of the pair of beams is provided on a printed circuit board positioned on one of the left and right of the conveying device in one row based on data on whether or not to use the An electronic component is mounted by the suction nozzle provided, and the mounting head of the other beam of the pair of beams is provided on a printed circuit board positioned on the other of the left and right of the transport device in the other row. The electronic component is mounted by the suction nozzle, and then the suction provided on the mounting head of one of the pair of beams on the printed circuit board positioned on the other of the left and right of the conveying device in one row when it is mounting the electronic component by the nozzle, the other Bee of the pair of each beam on the positioned printed board on one of the right and left in the other row transport apparatus And wherein the mounting the electronic component by the suction nozzle provided on the mounting head.
第２の発明は、請求項１に記載の電子部品の装着方法において、左右の基板位置決め位置にあるプリント基板上に、別々の装着ヘッドの吸着ノズルでそれぞれ電子部品を装着することを特徴とする。 According to a second aspect of the present invention, in the electronic component mounting method according to the first aspect, the electronic components are mounted on the printed circuit boards at the left and right substrate positioning positions by suction nozzles of separate mounting heads, respectively. .
第３の発明は、複数の基板位置決め位置をそれぞれが備えた２列の搬送装置でプリント基板を搬送し、任意の位置決め位置にて位置決めしたプリント基板上に、各駆動源により一方向に移動可能な一対の各ビームに設けられ且つ各ビームに沿った方向に各駆動源により移動可能な装着ヘッドに設けられた吸着ノズルが前記搬送装置の一外方にのみ設けられた部品供給装置より供給された部品供給装置より電子部品を取り出して、装着する電子部品の装着方法であって、前記２列の搬送装置のそれぞれに左右の位置決め部が設けられ、前記２列の搬送装置の左右の位置決め部のそれぞれにプリント基板が位置決めされ、装着順序毎に前記部品供給装置から電子部品をどの順序で吸着して取り出して、どの搬送装置のどの位置決め位置にあるプリント基板上に、どの装着ヘッドの吸着ノズルを使用して装着するかのデータに基づいて、一方の列の搬送装置の左右のうちの一方に位置決めされたプリント基板上に前記一対の各ビームのうちの一方のビームの装着ヘッドに設けられた吸着ノズルにより電子部品を装着すると共に、他方の列の搬送装置の左右のうちの他方に位置決めされたプリント基板上に前記一対の各ビームのうちの他方のビームの装着ヘッドに設けられた吸着ノズルにより電子部品を装着し、その後、一方の列の搬送装置の左右のうちの他方に位置決めされたプリント基板上に前記一対の各ビームのうちの一方のビームの装着ヘッドに設けられた吸着ノズルにより電子部品を装着するときには、他方の列の搬送装置の左右のうちの一方に位置決めされたプリント基板上に前記一対の各ビームのうちの他方のビームの装着ヘッドに設けられた吸着ノズルにより電子部品を装着することを特徴とする。
第４の発明は、請求項３に記載の電子部品の装着方法において、２列の搬送装置の基板位置決め位置にあるプリント基板上に、別々の装着ヘッドの吸着ノズルでそれぞれ電子部品を装着することを特徴とする。
In the third aspect of the invention, the printed circuit board is transported by a two-row transport device each having a plurality of substrate positioning positions, and can be moved in one direction by each drive source on the printed circuit board positioned at an arbitrary positioning position. A suction nozzle provided on a mounting head that is provided on each pair of beams and that can be moved by each drive source in a direction along each beam is supplied from a component supply device provided only on the outer side of the transport device. An electronic component mounting method for taking out and mounting an electronic component from the component supply device, wherein left and right positioning portions are provided in each of the two rows of transport devices, and the left and right positioning portions of the two rows of transport devices the printed circuit board is positioned in each removed from the component supply device for each placement sequencing adsorbed in any order the electronic component, pre in which positioning position of which conveying device Based on the data of which mounting head suction nozzle is used for mounting on the printed circuit board, each of the pair of beams on the printed circuit board positioned on one of the left and right of the conveying device in one row One of the pair of beams is mounted on a printed circuit board positioned on the other of the left and right of the conveying device in the other row while mounting the electronic component by a suction nozzle provided on the mounting head of one of the beams. the electronic component is mounted by the suction nozzles provided in the mounting head of the other beam, then one of the other to be positioned a pair of each beam on the printed circuit board of the left and right of the conveying device in one row by the suction nozzles provided in the beam of the mounting head when mounting the electronic components, the other row of the transport apparatus on the printed circuit board positioned on one of the left and right By the suction nozzles provided in serial other beam of the mounting head of the pair of the beams, characterized in that for mounting the electronic component.
According to a fourth aspect of the present invention, in the electronic component mounting method according to the third aspect, the electronic components are mounted on the printed circuit boards at the substrate positioning positions of the two rows of transfer devices by the suction nozzles of the separate mounting heads. It is characterized by.
本発明は、複数（左右）の位置決め位置がある搬送装置が２列ある場合で、それぞれの搬送路のそれぞれの位置決め部のプリント基板上に一対の各ビームに設けられたそれぞれの装着ヘッドの吸着ノズルにより電子部品を装着することがあっても、装着ヘッド同士の衝突しないように制御して確実に対応するプリント基板上に電子部品を装着できるようにすることができる。 In the present invention, when there are two rows of conveying devices having a plurality of (left and right) positioning positions, each mounting head provided on each of the pair of beams on the printed circuit board of each positioning portion of each conveying path is adsorbed. Even when the electronic component is mounted by the nozzle , the mounting can be controlled so that the mounting heads do not collide with each other so that the electronic component can be mounted on the corresponding printed circuit board.
以下図１に基づき、プリント基板Ｐ上に電子部品Ｄを装着する電子部品装着装置について、プリント基板Ｐを搬送する搬送ラインが１つである第１の実施の形態を説明する。電子部品装着装置１には、プリント基板Ｐを搬送する搬送ラインである１つの搬送装置２と、電子部品を供給する複数の部品供給ユニットが並設されて構成される部品供給装置３と、駆動源により一方向（Ｙ方向）に移動可能な一対のビーム４Ａ、４Ｂと、それぞれ複数の吸着ノズル（図示せず）を備えて前記各ビーム４Ａ、４Ｂに沿ってＸ方向に各駆動源により移動可能で取付体５を介して各ビーム４Ａ、４Ｂに取付けられる装着ヘッド６とが設けられている。 Hereinafter, a first embodiment in which an electronic component mounting apparatus for mounting an electronic component D on a printed circuit board P has one transport line for transporting the printed circuit board P will be described with reference to FIG. The electronic component mounting apparatus 1 includes a single conveyance device 2 that is a conveyance line that conveys the printed circuit board P, a component supply device 3 that includes a plurality of component supply units that supply electronic components, and a drive. A pair of beams 4A and 4B that can be moved in one direction (Y direction) by a source, and a plurality of suction nozzles (not shown), respectively, are moved by the drive sources in the X direction along the beams 4A and 4B. A mounting head 6 which is possible and is attached to each beam 4A, 4B via a mounting body 5 is provided.
前記搬送装置２は電子部品装着装置１の前後（紙面の上下）の中間部に配設され、上流側装置からプリント基板Ｐを受け継ぐ基板供給部２Ａと、前記各装着ヘッド６の吸着ノズルに吸着保持された電子部品を装着するために基板供給部２Ａから供給されたプリント基板Ｐを位置決め固定する位置決め部２Ｂ、２Ｂと、この各位置決め部２Ｂにおいて電子部品が装着されたプリント基板Ｐを受け継いで下流側装置に搬送する排出部２Ｃとから構成される。 The transport device 2 is disposed at an intermediate portion before and after the electronic component mounting device 1 (up and down on the paper surface), and is sucked by the substrate supply unit 2A that inherits the printed circuit board P from the upstream device and the suction nozzles of the mounting heads 6. Positioning portions 2B and 2B for positioning and fixing the printed circuit board P supplied from the substrate supply section 2A for mounting the held electronic components, and the printed circuit board P on which the electronic components are mounted in each positioning section 2B are inherited. It is comprised from the discharge part 2C conveyed to a downstream apparatus.
前記部品供給装置３は前記搬送装置２の一外方、例えば搬送装置２の手前側に複数並設され種々の電子部品を夫々その部品取出し部（部品吸着位置）に１個ずつ供給する部品供給ユニット群から構成される。 A plurality of the component supply devices 3 are arranged in parallel on the outside of the transfer device 2, for example, the front side of the transfer device 2, and supply various electronic components one by one to the component take-out portion (component suction position). Consists of units.
Ｘ方向に長い前後一対の前記ビーム４Ａ、４Ｂは、各Ｙ方向リニアモータ９の駆動により左右一対の前後に延びたガイドに沿って前記各ビームに固定されたスライダが摺動して個別にＹ方向に移動する。前記Ｙ方向リニアモータ９は、左右一対の基体１Ａ、１Ｂに沿って固定された上下一対の固定子と、前記ビーム４Ａ、４Ｂの両端部に設けられた取付板の下部に固定された可動子９Ａとから構成される。 The pair of front and rear beams 4A and 4B which are long in the X direction are individually moved along the sliders fixed to the beams along the pair of left and right front and rear guides driven by the Y direction linear motors 9. Move in the direction. The Y-direction linear motor 9 includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. 9A.
また、前記ビーム４Ａ、４Ｂにはその長手方向（Ｘ方向）にＸ方向リニアモータ１９によりガイドに沿って移動する装着ヘッド６が夫々内側に設けられており、前記Ｘ方向リニアモータ１９は各ビーム４Ａ、４Ｂに固定された前後一対の固定子と、各固定子の間に位置して前記装着ヘッド６に設けられた可動子とから構成される。 Each of the beams 4A and 4B is provided with a mounting head 6 which moves along the guide in the longitudinal direction (X direction) by an X direction linear motor 19, and the X direction linear motor 19 has each beam. It comprises a pair of front and rear stators fixed to 4A and 4B, and a mover provided on the mounting head 6 between the stators.
従って、各装着ヘッド６は向き合うように各ビーム４Ａ、４Ｂの内側に設けられ、前記搬送装置２の各位置決め部２Ｂ上のプリント基板Ｐや部品供給ユニットの部品取出し位置上方を移動する。 Accordingly, the mounting heads 6 are provided inside the beams 4A and 4B so as to face each other, and move above the component pick-up positions of the printed circuit board P and the component supply unit on the positioning portions 2B of the transport device 2.
そして、各装着ヘッド６には各バネにより下方へ付勢されている吸着ノズルが円周上に所定間隔を存して複数配設されており、この吸着ノズルは上下軸モータ２０により昇降可能であり、またθ軸モータ２１により装着ヘッド６を鉛直軸周りに回転させることにより、結果として各装着ヘッド６の各吸着ノズルはＸ方向及びＹ方向に移動可能であり、垂直線回りに回転可能で、且つ上下動可能となっている。 Each mounting head 6 is provided with a plurality of suction nozzles urged downward by respective springs at predetermined intervals on the circumference. The suction nozzles can be moved up and down by a vertical axis motor 20. In addition, by rotating the mounting head 6 around the vertical axis by the θ-axis motor 21, as a result, each suction nozzle of each mounting head 6 can move in the X direction and the Y direction, and can rotate around the vertical line. And can be moved up and down.
また、部品認識カメラ１０Ａにより各吸着ノズルに吸着保持された電子部品を一括して撮像して、認識処理装置２２により認識処理して吸着ノズルに対する電子部品の位置ズレが把握され、前記取付体５に取付けられた基板認識カメラ１０Ｂでプリント基板Ｐの位置決めマークを撮像して、認識処理装置２２により認識処理してプリント基板Ｐの位置が把握される。 In addition, the electronic parts picked up and held by the suction nozzles are picked up by the parts recognition camera 10A, and the recognition processing device 22 performs recognition processing to grasp the positional deviation of the electronic parts with respect to the suction nozzles. The board recognition camera 10B attached to the camera picks up an image of the positioning mark of the printed circuit board P, and the recognition processing device 22 performs recognition processing to grasp the position of the printed circuit board P.
図２は電子部品装着装置１の電子部品装着に係る制御のための制御ブロックであり、以下説明する。電子部品装着装置１の各要素はＣＰＵ（セントラル・プロセッシング・ユニット）１１が統括制御しており、この制御に係るプログラムを格納するＲＯＭ（リ−ド・オンリー・メモリ）１２及び各種データを格納するＲＡＭ（ランダム・アクセス・メモリ）１３がバスライン１４を介して接続されている。また、ＣＰＵ１１には操作画面等を表示するモニタ１５及び該モニタ１５の表示画面に形成された入力手段としてのタッチパネルスイッチ１６がインターフェース１７を介して接続されている。また、前記Ｙ方向リニアモータ９等が駆動回路２４、インターフェース１７を介して前記ＣＰＵ１１に接続されている。 FIG. 2 is a control block for control related to electronic component mounting of the electronic component mounting apparatus 1 and will be described below. Each element of the electronic component mounting apparatus 1 is centrally controlled by a CPU (Central Processing Unit) 11 and stores a ROM (Read Only Memory) 12 for storing a program related to this control and various data. A RAM (Random Access Memory) 13 is connected via a bus line 14. Further, a monitor 15 for displaying an operation screen and the like, and a touch panel switch 16 as input means formed on the display screen of the monitor 15 are connected to the CPU 11 via an interface 17. The Y-direction linear motor 9 and the like are connected to the CPU 11 via a drive circuit 24 and an interface 17.
前記ＲＡＭ１３には、部品装着に係るプリント基板Ｐの種類毎に装着データが記憶されており、その装着順序毎（ステップ番号毎）に、プリント基板Ｐ内での各電子部品の装着座標のＸ方向、Ｙ方向及び角度情報や、各部品供給ユニットの配置番号情報等が格納されている。また前記ＲＡＭ１３には、前記各部品供給ユニットの部品供給ユニット配置番号に対応した各電子部品の種類の情報、即ち部品配置データが格納されており、更には形状データ・認識データ・制御データ・部品供給データから成る部品ライブラリデータが格納されている。また、前記ＲＡＭ１３には、図３及び図４に示すような吸着ノズルによる電子部品の吸着取出・装着に係るデータなども格納されている。 The RAM 13 stores mounting data for each type of printed circuit board P related to component mounting, and the X direction of the mounting coordinates of each electronic component in the printed circuit board P for each mounting order (step number). , Y direction and angle information, arrangement number information of each component supply unit, and the like are stored. The RAM 13 stores information on the type of each electronic component corresponding to the component supply unit arrangement number of each component supply unit, that is, component arrangement data, and further includes shape data, recognition data, control data, and components. Parts library data consisting of supply data is stored. The RAM 13 also stores data related to the picking up and mounting of electronic components by the picking nozzle as shown in FIGS.
２２はインターフェース１７を介して前記ＣＰＵ１１に接続される認識処理装置で、前記部品認識カメラ１０により撮像して取込まれた画像の認識処理が該認識処理装置２２にて行われ、ＣＰＵ１１に処理結果が送出される。即ち、ＣＰＵ１１は部品認識カメラ１０により撮像された画像を認識処理（位置ずれ量の算出など）するように指示を認識処理装置２２に出力すると共に、認識処理結果を認識処理装置２２から受取るものである。
次に、図３の各搬送装置２の一方の位置決め部２Ｂに位置決めされた各プリント基板Ｐ上に対応するビーム４Ａ、４Ｂの装着ヘッド６の吸着ノズルにより電子部品を装着する電子部品の吸着取出・装着に係るデータについて、以下説明する。「ＵＰＯ」はステップ番号で、「Ｖ」は電子部品をプリント基板に装着するときにその番号のゾーン（プリント基板の左半分のゾーンは「１」、右半分のゾーンは「２」）の認識結果を使用することを意味し、「ビーム」の「Ａ」はビーム４Ａを、「Ｂ」はビーム４Ｂを使用することを意味し、「ＮＺＬ」は装着ヘッド６のその番号の吸着ノズルを使用することを意味し、「吸着順」は吸着ノズルで電子部品を吸着する順番を意味し、「装着角度反転」は「１」が装着角度を反転し、「０」が反転しないこと「意味し、「搬送レーン（Ａ／Ｂ）」の「Ａ」が奥側の搬送装置２を、「Ｂ」が手前側の搬送装置２を使用することを意味し、「装着基板（Ｌ／Ｒ）」の「Ｒ」は２つの位置決め位置（２つの位置決め部）のうちの右を、「Ｌ」は左を使用することを意味する。
図１における左方から右方へプリント基板Ｐが流れるが、ステップ番号「１−１−１」、「１−１−２」、「１−１−３」では、奥側の搬送装置２の右の位置決め部２Ｂ上のプリント基板Ｐ上に電子部品を奥側のビーム４Ａの装着ヘッド６の吸着ノズルで装着し、ステップ番号「１−１−４」、「１−１−５」、「１−１−６」では、手前側の搬送装置２の左の位置決め部２Ｂ上のプリント基板Ｐ上に電子部品を手前側のビーム４Ｂの装着ヘッド６の吸着ノズルで装着することとなる。
A recognition processing device 22 is connected to the CPU 11 via the interface 17. The recognition processing device 22 recognizes an image captured and captured by the component recognition camera 10. Is sent out. That is, the CPU 11 outputs an instruction to the recognition processing device 22 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the component recognition camera 10 and receives the recognition processing result from the recognition processing device 22. is there.
Next, the electronic components are picked up and attached by the suction nozzles of the mounting heads 6 of the corresponding beams 4A and 4B on each printed circuit board P positioned on one positioning portion 2B of each transport device 2 in FIG.・ The data related to wearing will be explained below. “UPO” is a step number, and “V” is a recognition of the zone of that number when the electronic component is mounted on the printed circuit board (the left half zone of the printed circuit board is “1” and the right half zone is “2”). "A" in "Beam" means that beam 4A is used, "B" means that beam 4B is used, and "NZL" means that the suction nozzle of that number of mounting head 6 is used. “Suction order” means the order in which electronic components are picked up by the suction nozzle. “Mounting angle reversal” means “1” reverses the mounting angle and “0” does not reverse. , “A” in the “transport lane (A / B)” means that the transport device 2 on the back side is used, and “B” means that the transport device 2 on the near side is used, and “mounting substrate (L / R)”. “R” indicates the right of the two positioning positions (two positioning parts), “L” indicates the left It means to use.
The printed circuit board P flows from the left side to the right side in FIG. 1, but at the step numbers “1-1-1”, “1-1-2”, and “1-1-3” The electronic component is mounted on the printed circuit board P on the right positioning portion 2B with the suction nozzle of the mounting head 6 of the back beam 4A, and step numbers “1-1-4”, “1-1-5”, “ In “1-1-6”, an electronic component is mounted on the printed circuit board P on the left positioning unit 2B of the transport device 2 on the near side by the suction nozzle of the mounting head 6 of the beam 4B on the near side.
以上の構成により、以下動作について説明する。先ず、プリント基板Ｐが図１の左方に位置する上流側装置（図示せず）より受継がれて奥側の搬送装置２の供給部２Ａ上に存在すると、供給部２Ａ上のプリント基板Ｐを右の位置決め部２Ｂへ移動させ、このプリント基板Ｐを位置決めして固定する。また、プリント基板Ｐが図１の左方に位置する上流側装置より受継がれて手前側の搬送装置２の供給部２Ａ上に存在すると、供給部２Ａ上のプリント基板Ｐを左の位置決め部２Ｂへ移動させ、このプリント基板Ｐを位置決めして固定する。この状態が図１の状態である。 With the above configuration, the operation will be described below. First, when the printed circuit board P is inherited from an upstream device (not shown) located on the left side of FIG. 1 and is present on the supply unit 2A of the transport device 2 on the back side, the printed circuit board P on the supply unit 2A is present. Is moved to the right positioning part 2B, and this printed circuit board P is positioned and fixed. Further, when the printed circuit board P is inherited from the upstream device located on the left side of FIG. 1 and is present on the supply unit 2A of the transport device 2 on the near side, the printed circuit board P on the supply unit 2A is placed on the left positioning unit. The printed board P is positioned and fixed. This state is the state of FIG.
そして、各搬送装置２において各プリント基板Ｐの位置決めがされると、奥側のビーム４ＡがＹ方向リニアモータ９によりＹ方向に移動すると共にＸ方向リニアモータ１９により装着ヘッド６がＸ方向に移動し、部品供給ユニットの部品取出し位置上方まで移動して上下軸モータの駆動により該当吸着ノズルを下降させて部品供給ユニットから電子部品の吸着取出・装着に係るデータの「吸着順」に従って電子部品を取出す。 When each printed circuit board P is positioned in each transport device 2, the back beam 4A is moved in the Y direction by the Y direction linear motor 9, and the mounting head 6 is moved in the X direction by the X direction linear motor 19. Then, move the component supply unit above the component extraction position, lower the corresponding suction nozzle by driving the vertical axis motor, and place the electronic component according to the `` Suction Order '' of the data related to the extraction and installation of electronic components from the component supply unit. Take out.
また、奥側の装着ヘッド６の吸着ノズルによる電子部品の取出しの後、手前側のビーム４ＢがＹ方向リニアモータ９の駆動によりＹ方向に移動すると共にＸ方向リニアモータ１９により装着ヘッド６がＸ方向に移動し、部品供給ユニットの部品取出し位置上方まで移動して上下軸モータの駆動により吸着ノズルを下降させて部品供給ユニット３から電子部品を取出すことができる。但し、奥側のビーム４Ａ又は手前側のビーム４Ｂの吸着ノズルが電子部品の取出し動作をする場合には、両ビーム４Ａ、４Ｂの装着ヘッド６同士が衝突しないように対応するＹ方向リニアモータ及びＸ方向リニアモータが制御される。即ち、Ｙ方向については両ビーム４Ａ、４Ｂが必要以上に近づかないように制御されると共にＸ方向については両装着ヘッド６が必要以上に近づかないように制御されて、両ビーム４Ａ、４Ｂの装着ヘッド６同士の衝突が防止される。 Further, after the electronic component is taken out by the suction nozzle of the mounting head 6 on the back side, the beam 4B on the near side moves in the Y direction by driving the Y-direction linear motor 9, and the mounting head 6 is moved to X by the X-direction linear motor 19. The electronic component can be taken out from the component supply unit 3 by moving in the direction, moving upward to the component extraction position of the component supply unit, and lowering the suction nozzle by driving the vertical axis motor. However, when the suction nozzle of the back beam 4A or the front beam 4B performs an electronic component take-out operation, a Y-direction linear motor and a corresponding Y-direction linear motor and a mounting head 6 that do not collide with each other. The X direction linear motor is controlled. That is, in the Y direction, both beams 4A, 4B are controlled so as not to approach more than necessary, and in the X direction, both mounting heads 6 are controlled so as not to approach more than necessary, so that both beams 4A, 4B are mounted. Collisions between the heads 6 are prevented.
そして、取出した後は両装着ヘッド６の吸着ノズルを上昇させて、両ビーム４Ａ、４Ｂの装着ヘッド６を装置本体に固定された部品認識カメラ１０Ａ上方を通過させ、この移動中に両装着ヘッド６の吸着ノズルに吸着保持された複数の電子部品を一括して撮像して、この撮像された画像を認識処理装置２２が認識処理して吸着ノズルに対する位置ズレを把握することができる。 After the removal, the suction nozzles of both mounting heads 6 are raised so that the mounting heads 6 of both beams 4A and 4B pass over the component recognition camera 10A fixed to the apparatus main body, and both mounting heads are moved during this movement. A plurality of electronic components sucked and held by the six suction nozzles can be picked up in a lump, and the picked-up image can be recognized by the recognition processing device 22 to grasp a positional deviation with respect to the suction nozzle.
その後、両ビーム４Ａ、４Ｂの基板認識カメラ１０Ｂを対応するプリント基板Ｐ上方へ移動させて、位置決めされているプリント基板Ｐに付された位置決めマークを撮像し、この撮像された画像を認識処理装置２２が認識処理してそれぞれプリント基板Ｐの位置を把握する。そして、ＲＡＭ１３に格納された前記装着データの装着座標に各プリント基板Ｐの位置認識結果及び各部品認識処理結果を加味して、それぞれの装着装着ヘッド６の吸着ノズルが位置ずれを補正しつつ、電子部品の吸着取出・装着に係るデータで示す装着ステップ番号に従ってそれぞれ電子部品を対応するプリント基板Ｐ上に装着する。 Thereafter, the substrate recognition camera 10B of both beams 4A and 4B is moved above the corresponding printed circuit board P to image the positioning mark attached to the positioned printed circuit board P, and the captured image is recognized. 22 recognizes and grasps the position of each printed circuit board P. Then, by adding the position recognition result of each printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data stored in the RAM 13, the suction nozzles of the respective mounting / mounting heads 6 correct the positional deviation, Each electronic component is mounted on the corresponding printed circuit board P according to the mounting step number indicated by the data relating to the picking up and mounting of the electronic component.
各プリント基板Ｐ上に各装着ヘッド６の吸着ノズルが電子部品を装着する場合には、両ビーム４Ａ、４Ｂの装着ヘッド６同士が衝突しないように対応するＹ方向リニアモータ及びＸ方向リニアモータが制御されるが、手前側のビーム４Ｂの装着ヘッド６の吸着ノズルは手前側の搬送装置２の左の位置決め部２Ｂ上のプリント基板Ｐ上に電子部品を装着し、奥側のビーム４Ａの装着ヘッド６の吸着ノズルは奥側の搬送装置２の右の位置決め部２Ｂ上のプリント基板Ｐ上に電子部品を装着するので、両ビーム４Ａ、４Ｂの装着ヘッド６同士が衝突しないように制御することは容易に行うことができる。 When the suction nozzle of each mounting head 6 mounts an electronic component on each printed circuit board P, the corresponding Y-direction linear motor and X-direction linear motor prevent the mounting heads 6 of both beams 4A and 4B from colliding with each other. Although controlled, the suction nozzle of the mounting head 6 of the front beam 4B mounts an electronic component on the printed board P on the left positioning portion 2B of the transport device 2 on the front side, and mounts the back beam 4A. Since the suction nozzle of the head 6 mounts an electronic component on the printed circuit board P on the right positioning portion 2B of the transport device 2 on the back side, control is performed so that the mounting heads 6 of both beams 4A and 4B do not collide with each other. Can be done easily.
次に、図４及び図５に基づいて、第２の実施形態について説明するが、奥側のビーム４Ａの装着ヘッド６の吸着ノズルが奥側の搬送装置２のプリント基板Ｐ上に電子部品を装着すると共に手前側のビーム４Ｂの装着ヘッド６の吸着ノズルが手前側の搬送装置２のプリント基板Ｐ上に電子部品を装着するが、各搬送装置２における２つの位置決め部２Ｂの両方にてプリント基板Ｐを位置決めして、各プリント基板上に電子部品を装着する実施形態であり、第１の実施形態と異なる点を重点として説明する。 Next, the second embodiment will be described with reference to FIGS. 4 and 5. The suction nozzle of the mounting head 6 of the back beam 4 </ b> A places electronic components on the printed circuit board P of the transport device 2 on the back side. At the same time, the suction nozzle of the mounting head 6 of the beam 4B on the front side mounts an electronic component on the printed circuit board P of the transport device 2 on the front side, but printing is performed at both of the two positioning portions 2B in each transport device 2. This is an embodiment in which the board P is positioned and an electronic component is mounted on each printed board, and the difference from the first embodiment will be mainly described.
図５の電子部品の吸着取出・装着に係るデータによれば、両搬送装置２の２つの位置決め部２Ｂにプリント基板Ｐをそれぞれ位置決めした後に、初めにこのデータの最上段部分のデータに従い、奥側の搬送装置２における左のプリント基板Ｐに対応するステップ番号「１−１−１」、「１−１−２」、「１−１−３」では、ビーム４Ａの装着ヘッド６が奥側の搬送装置２の左の位置決め部２Ｂに位置決めされた左のプリント基板Ｐに電子部品を装着すると共に、上から２段目部分のデータに従い、手前側の搬送装置２における右のプリント基板Ｐに対応するステップ番号「１−１−１」、「１−１−２」、「１−１−３」では、ビーム４Ｂの装着ヘッド６が手前側の搬送装置２の右の位置決め部２Ｂに位置決めされた右のプリント基板Ｐに電子部品を装着する。このこのように、左右、前後のプリント基板上に別のビームの装着ヘッドで電子部品を装着するため、両ビーム４Ａ、４Ｂの装着ヘッド６同士が衝突しないように制御することは容易に行うことができる。 According to the data relating to the picking and unloading of electronic parts shown in FIG. 5, after positioning the printed circuit board P on the two positioning portions 2B of the two conveying devices 2, respectively, At step numbers “1-1-1”, “1-1-2”, and “1-1-3” corresponding to the left printed circuit board P in the transport device 2 on the side, the mounting head 6 of the beam 4A is on the back side. The electronic component is mounted on the left printed circuit board P positioned at the left positioning portion 2B of the transport apparatus 2 and the right printed circuit board P in the transport apparatus 2 on the near side is attached according to the data of the second stage part from the top. At the corresponding step numbers “1-1-1”, “1-1-2”, “1-1-3”, the mounting head 6 of the beam 4B is positioned at the right positioning unit 2B of the transport device 2 on the near side. The right printed circuit board P Mounting the parts. As described above, since the electronic components are mounted on the left, right, and front and back printed boards with the mounting heads of the different beams, it is easy to control so that the mounting heads 6 of both beams 4A and 4B do not collide with each other. Can do.
この後、上から３段目部分のデータに従い、奥側の搬送装置２における右のプリント基板Ｐに対応する「１−１−４」、「１−１−５」、「１−１−６」では、ビーム４Ａの装着ヘッド６が奥側の搬送装置２の右の位置決め部２Ｂに位置決めされた右のプリント基板Ｐに電子部品を装着すると共に、最下段部分のデータに従い、手前側の搬送装置２における左のプリント基板Ｐに対応する「１−１−４」、「１−１−５」、「１−１−６」では、ビーム４Ｂの装着ヘッド６が手前側の搬送装置２の左の位置決め部２Ｂに位置決めされた左のプリント基板Ｐに電子部品を装着する。このように、左右、前後のプリント基板上に別のビームの装着ヘッドで電子部品を装着するため、両ビーム４Ａ、４Ｂの装着ヘッド６同士が衝突しないように制御することは容易に行うことができる。 Thereafter, “1-1-4”, “1-1-5”, “1-1-6” corresponding to the right printed circuit board P in the transport device 2 on the back side according to the data of the third step portion from the top. ”, The mounting head 6 of the beam 4A mounts the electronic component on the right printed circuit board P positioned on the right positioning portion 2B of the back side transport device 2, and transports the front side according to the data of the lowermost part. In “1-1-4”, “1-1-5”, and “1-1-6” corresponding to the left printed circuit board P in the apparatus 2, the mounting head 6 of the beam 4B is connected to the transport apparatus 2 on the near side. An electronic component is mounted on the left printed circuit board P positioned at the left positioning portion 2B. In this way, since the electronic components are mounted on the left and right, front and rear printed circuit boards with mounting heads with different beams, it is possible to easily control the mounting heads 6 of both beams 4A and 4B so as not to collide with each other. it can.
なお、第１及び第２の実施形態ともに、部品供給装置３を前記搬送装置２の一外方、例えば搬送装置２の手前側にのみ配設したが、これに限らず、奥側の搬送装置２の奥方に及び手前側の搬送装置２の手前にそれぞれ配設してもよい。 In both the first and second embodiments, the component supply device 3 is disposed only on the outer side of the conveying device 2, for example, on the front side of the conveying device 2. However, the present invention is not limited to this. 2 and in front of the transport device 2 on the near side.
更には、ビーム４Ａ及びビーム４Ｂの装着ヘッド６が奥側及び手前側の搬送装置２のいずれか又は左右両方の位置決め部２Ｂに位置決めされたプリント基板Ｐに電子部品を装着するようにしてもよい。 Furthermore, the mounting head 6 for the beam 4A and the beam 4B may mount the electronic component on the printed circuit board P positioned on the positioning unit 2B on either the left or right side of the transfer device 2 on the back side or the near side. .
以上のように本発明の実施態様について説明したが、上述の説明に基づいて当業者にとって種々の代替例、修正又は変形が可能であり、本発明はその趣旨を逸脱しない範囲で前述の種々の代替例、修正又は変形を包含するものである。 Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.
１ 電子部品装着装置
２ 搬送装置
２Ａ 位置決め部
３ 部品供給装置
４Ａ、４Ｂ ビーム
６ 装着ヘッド
Ｐ プリント基板
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveyance apparatus 2A Positioning part 3 Component supply apparatus 4A, 4B Beam 6 Mounting head P Printed circuit board
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| JP4390503B2 (en) * | 2003-08-27 | 2009-12-24 | パナソニック株式会社 | Component mounting apparatus and component mounting method |
| JP4325570B2 (en) * | 2005-02-25 | 2009-09-02 | パナソニック株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| JP4792346B2 (en) * | 2006-07-28 | 2011-10-12 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting apparatus and electronic component mounting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7316359B2 (en) | 2019-08-05 | 2023-07-27 | エナジーウィズ株式会社 | Electrode plate manufacturing apparatus and electrode plate manufacturing method |
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