JP4504240B2 - Electronic component mounting method and electronic component mounting apparatus - Google Patents

Description

  The present invention relates to an electronic component mounting method and an electronic component mounting apparatus in which an electronic component is picked up by a suction nozzle provided on a plurality of mounting heads from a plurality of component supply unit groups and mounted on a printed circuit board.

This electronic component mounting apparatus is known, for example, from Patent Document 1. Then, the electronic components are mounted on the printed circuit board according to mounting data such as which electronic components are to be mounted and where for each mounting order.
Japanese Patent Laid-Open No. 2004-47818

  However, if there are many mounting points for electronic components taken out from a specific component supply unit, in an electronic component mounting apparatus having a plurality of mounting heads, the mounting time by each mounting head becomes uneven, and the production efficiency is reduced. bad.

  In view of this, the present invention provides a component supply unit that supplies electronic components with a large number of mounting points by distributing them to a plurality of component supply unit groups, thereby making the mounting time of each mounting head as uniform as possible, thereby improving production efficiency. The purpose is to improve.

For this reason, the invention relating to the mounting method of the first electronic component is an electronic component that is picked up by a suction nozzle provided in a plurality of mounting heads from a plurality of component supply unit groups and mounted on a printed circuit board. In the mounting method,
Calculate the shortest printed circuit board finish time from the total number of electronic component mounting points on the printed circuit board and the number of mounting points per unit time by multiple mounting heads based on the fastest mounting point per unit time of one mounting head .
From the number of mounting points for each component type and the fastest number of mounting points per unit time per mounting head, the shortest component finishing time by one mounting head for each component type is calculated,
It is notified that the component supply units of the component type having the shortest component finish time longer than the shortest printed circuit board finish time are distributed and arranged in a plurality of component supply unit groups.

The second electronic component mounting method is an electronic component mounting method in which an electronic component is picked up by a suction nozzle provided on a plurality of mounting heads from a plurality of component supply units and mounted on a printed circuit board. In
Calculate the shortest printed circuit board finish time from the total number of electronic component mounting points on the printed circuit board and the number of mounting points per unit time by multiple mounting heads based on the fastest mounting point per unit time of one mounting head .
From the number of mounting points for each component type and the fastest number of mounting points per unit time per mounting head, the shortest component finishing time by one mounting head for each component type is calculated,
It is notified that the component supply units of the component types having the shortest component finish time longer than the shortest printed circuit board finish time are distributed and arranged so that the number of mounting points is successively ½.

  The invention relating to the third electronic component mounting method is characterized in that, in the first or second invention, the upper limit number of the dispersed arrangement can be set for each component type.

  An invention relating to a fourth electronic component mounting method is characterized in that, in the first invention, the plurality of component supply unit groups are distributed and arranged for each mounting head.

According to a fifth electronic component mounting apparatus, an electronic component mounting apparatus for picking up an electronic component from a plurality of component supply units by suction nozzles provided on a plurality of mounting heads and mounting the electronic component on a printed circuit board. In
First calculation means for calculating the shortest printed circuit board finishing time from the total number of electronic component mounting points on the printed circuit board and the mounting points per unit time by a plurality of mounting heads based on the fastest mounting point per unit time of one mounting head When,
A second calculating means for calculating the shortest component finishing time by one mounting head for each component type from the number of mounting points for each component type and the fastest number of mounting points per unit time per mounting head ;
An informing means is provided for informing that the component supply units of the component type having the shortest component finish time longer than the shortest printed circuit board finish time are distributed and arranged in a plurality of component supply unit groups.

According to a sixth electronic component mounting apparatus, an electronic component mounting apparatus for picking up an electronic component from a plurality of component supply units by suction nozzles provided on a plurality of mounting heads and mounting the electronic component on a printed circuit board. In
First calculation means for calculating the shortest printed circuit board finishing time from the total number of electronic component mounting points on the printed circuit board and the mounting points per unit time by a plurality of mounting heads based on the fastest mounting point per unit time of one mounting head When,
A second calculating means for calculating the shortest component finishing time by one mounting head for each component type from the number of mounting points for each component type and the fastest number of mounting points per unit time per mounting head ;
Informing means for informing that the component supply units of the component types having the shortest component finishing time longer than the shortest printed circuit board finishing time are distributed and arranged so as to sequentially have 1/2 mounting points. To do.

  An invention relating to a seventh electronic component mounting apparatus is characterized in that, in the fifth or sixth invention, there is provided setting means for setting the upper limit number of the dispersed arrangement for each component type.

  According to the present invention, component supply units that supply electronic components with a large number of mounting points are arranged in a plurality of component supply unit groups so that the mounting time of each mounting head is made as uniform as possible, thereby improving production efficiency. Can be achieved.

  Hereinafter, an embodiment of an electronic component mounting apparatus will be described based on the drawings. FIG. 1 is a plan view of an electronic component mounting device 1, and electronic components as a component supply device are supplied one by one to a component extraction position (component suction position) on a machine base (device main body) 2 of the electronic component mounting device 1. The known component supply unit 3 group is divided into four blocks, that is, the left and right stages 1 and 2, and further divided into the front and rear SIDE-A and SIDE-B for each stage. It is divided and arranged.

  A supply conveyor 4 is provided at an intermediate portion of the mounting device 1 so that the transport direction of the printed circuit board CB is the left-right direction. The supply conveyor 4 is provided with a positioning mechanism for positioning the printed circuit board CB received from the upstream device at the two positioning portions, and after electronic components are mounted on the substrate P, the printed circuit board CB is transported to the downstream device. .

  Reference numeral 8 denotes a pair of beams that are long in the X direction. A printed circuit board CB that is fixed by a positioning mechanism by sliding a slider fixed to each beam 8 along a pair of left and right guides by driving each linear motor 9. In addition, the component supply unit 3 is individually moved in the Y direction above the component delivery position (component adsorption position). The linear motor 9 includes a pair of left and right stators fixed to the base 2 and a mover fixed to lower portions of mounting plates provided at both ends of the beam 8.

  Each beam 8 is provided with a mounting head body 7 that moves along the guide by a linear motor 14 in the longitudinal direction, that is, in the X direction. The linear motor 14 includes a pair of front and rear stators fixed to the beam 8 and a movable element provided on the mounting head body 7. Each mounting head body 7 includes a mounting head 16 having twelve suction nozzles biased upward by springs.

  The mounting head 16 can be rotated in the θ direction by a pulse motor 21, and twelve suction nozzles (not shown) are arranged on the mounting head 16 on the circumference at predetermined intervals. 22 is provided so as to be movable up and down.

  Reference numeral 17 denotes a component recognition camera, which is provided for each of the mounting heads 16 for a total of four, and how much the electronic component is displaced and held with respect to the suction nozzle in the XY direction and the rotation angle. In order to recognize the position, all the electronic components D sucked and held by the plurality of suction nozzles are collectively imaged, and a plurality of electronic components can be simultaneously imaged. Further, the component recognition camera 17 can confirm whether or not the electronic component D is sucked and held by the suction nozzle by taking an image. If the electronic component D is sucked and held by the suction nozzle, it is dropped into the discharge box 26 and collected. .

  Next, a description will be given below based on the control block diagram of the electronic component mounting apparatus 1 of FIG. A CPU (mounting control unit) 30 is a control unit that performs overall control of the mounting apparatus 1. The CPU (central processing unit) 30 is connected to a RAM (random access memory) 32 and a bus line via a bus line. A ROM (Read Only Memory) 33 is connected. Based on the data stored in the RAM 32, the CPU 30 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 33. That is, the CPU 30 controls the driving of the linear motors 19 and 14 and the pulse motors 21 and 22 through the interface 34 and the drive circuit 35.

  The RAM 32 stores mounting data relating to component mounting. For each mounting order (step number), the X direction (indicated by X), the Y direction (indicated by Y), and the angle within the printed circuit board. Information (indicated by Z), arrangement number information of each component supply unit 3, and the like are stored. The RAM 32 stores component arrangement data, which stores the type of each electronic component (component ID), the arrangement coordinates of the supply unit 3, and the like corresponding to the arrangement number of each component supply unit 3. Has been.

  A recognition processing device 31 is connected to the CPU 30 via the interface 34. The recognition processing device 31 performs recognition processing of an image captured by the component recognition camera 17.

  The image picked up by the component recognition camera 17 is displayed on a monitor 36 such as a CRT as a display device. The monitor 36 is provided with various touch panel switches 37, and various settings including settings for teaching designation can be performed by an operator operating the touch panel switch 37.

  The touch panel switch 37 has a transparent conductive film coated on the entire surface of a glass substrate, and electrodes are printed on four sides. For this reason, when a very small current is passed through the surface of the touch panel switch 37 and the operator touches it, a current change occurs in the electrodes on the four sides, and the coordinate value touched by the circuit board connected to the electrodes is calculated. Therefore, if the coordinate value matches a coordinate value in a coordinate value group stored in advance in the RAM 32 as a switch unit for performing a certain operation, the operation is performed.

  Here, when component supply units that supply electronic components with a large number of mounting points are distributed and arranged in a plurality of component supply unit groups, setting of the upper limit number of the distributed arrangement will be described with reference to FIG.

  First, the touch panel switch 37 displayed on the monitor 36 is pressed to display a setting screen for the upper limit number of distributed arrangements as shown in FIG. In this case, when the top up / down switch 37A is pressed, a menu of types of a plurality of printed circuit boards stored in the RAM 32 is displayed. Select the model name “PRINT001” of the printed circuit board CB to be set from now on. To do.

  Then, based on the mounting data corresponding to the model name “PRINT001”, the CPU 30 displays the arrangement number, the component ID (electronic component type), the number of mounting points, the shortest component finishing time Cs, and a numeric switch unit (not shown). ) Is displayed. Accordingly, by pressing the upper limit number switch unit 37B and the numeric switch unit (not shown), the upper limit number can be input one after another, and by pressing the OK switch unit 37C, the electronic name to be mounted on the model name “PRINT001”. The upper limit number of distributed arrangements can be set for each part.

  In this case, when this setting is completed, the CPU 30 calculates the shortest component finishing time Cs for each electronic component type based on the mounting data and displays it on the monitor 36. That is, the shortest component finishing time Cs of the component type “C1005T04G0xxx” is 28 (the number of mounting points of the electronic component type S) / 15,500 (the fastest mounting point per mounting head 16 described later) × 3,600. The shortest part finishing time Cs of the part type “C1005T05B0xxx” is approximately 2.79 seconds at 12 / 15,500 × 3,600 seconds, which is calculated in the same manner. Similarly, the component type “C1608T08B0xxx” is about 0.93 seconds, and the component type “C1608T08G0xxx” is about 1.39 seconds.

  When the setting of the upper limit number of the distributed arrangement of the component supply units 3 is completed, the CPU 30 first calculates the shortest board finishing time P. That is, if the fastest number of mounting points per hour of the electronic component mounting apparatus 1 is 62,000, the four mounting heads 16 are provided, so the fastest mounting point per mounting head 16 is 15,500. The shortest substrate finishing time P is 50 (the number of points on which the printed circuit board CB is attached) / 62,000 × 3,600 seconds, which is about 2.90 seconds. This calculation is performed to create a part set A to be distributed.

  Next, the CPU 30 determines whether or not there is a component s in the component set S that has the shortest component finish time Cs longer than the shortest substrate finish time P (about 2.90 seconds). In this case, if there is no long part s, all the elements of the part set S are added to the set A, and the process ends, but the set A becomes a part after distribution. However, as shown in FIG. 3, since the component type “C1005T04G0xxx” is applicable, the CPU 30 determines whether or not the number of components of the type to which the component s belongs next in the component set S is less than the upper limit of dispersion. Is done. In this case, if the number is not less than the upper limit number, the part s is added to the set A and the part s is deleted from the set S, but the upper limit number of the part type “C1005T04G0xxx” is set to “4”. If the number of the component supply units 3 that handle the component type “C1005T04G0xxx” is 1, it is less than “4”. Therefore, the components s are divided into components s1 and s2 by dividing the number of mounting points by 28 with a target of 1/2. To do. That is, as shown in FIG. 4, the number of mounting points of this part type “C1005T04G0xxx” is divided into two parts each having 14 pieces, and the shortest part finishing time Cs is about 3.50 which is half of about 6.50 seconds. 25 seconds.

  Next, the CPU 30 determines whether or not the shortest part finish time Cs1 (about 3.25 seconds) of one part s1 distributed in half is equal to or longer than the shortest board finish time P (about 2.90 seconds). Since it is determined and is the shortest substrate finishing time P or more, the part s1 is added to the set A. Next, the CPU 30 determines whether or not the shortest part finish time Cs2 (about 3.25 seconds) of the other part s2 is equal to or longer than the shortest board finish time P (about 2.90 seconds), and the shortest board finish time. Since it is greater than or equal to P, the part s2 is added to the set A.

  Then, the CPU 30 deletes the part s from the set S. Further, the CPU 30 determines whether there is a component in the component set S that has a shortest component finish time Cs greater than the shortest substrate finish time P (about 2.90 seconds). As shown in FIG. 4, which is a diagram showing a screen of the monitor 36 in a distributed state for the first time (a screen for notifying that it is to be distributed), the component type “C1005T04G0xxx” corresponds to it. Next, it is determined whether or not the number of parts to which the part belongs in the parts set S is less than the upper limit of dispersion. That is, since the upper limit number of the component type “C1005T04G0xxx” is set to “4”, the number of component supply units 3 handling the component type “C1005T04G0xxx” is currently “2” and “4”. Therefore, the parts are designated as parts s3, s4, s5, and s6 obtained by dividing the number of mounting points by 14 with a target of 1/2. That is, as shown in FIG. 5 which is a diagram showing a screen of the monitor 36 in a second dispersed state (a screen for notifying that distributed placement is performed), the number of mounting points of this component type “C1005T04G0xxx” is calculated. Each of the seven parts is divided into two parts, for a total of four parts, and the shortest part finish time Cs is about 1.63 seconds, which is half of about 3.25 seconds.

  Next, whether or not the shortest part finish times Cs3 and Cs5 (about 1.63 seconds) of one of the parts s3 and s5 distributed in half each is equal to or longer than the shortest board finish time P (about 2.90 seconds). Is determined by the CPU 30 and is less than the shortest substrate finishing time P, and the components s3 and s5 are added to the set S. Next, the CPU 30 determines whether or not the shortest part finishing time Cs4, Cs6 (about 1.63 seconds) of the other parts s4, s6 is equal to or longer than the shortest board finishing time P (about 2.90 seconds). Therefore, the parts Cs4 and Cs6 are added to the set S.

  Then, the CPU 30 deletes the parts s1 and s2 from the set S. As described above, the component supply unit 3 that handles “C1005T04G0xxx” is distributed and arranged in a total of four of SIDE-A and SIDE-B before and after the left and right stages 1 and 2, thereby By setting the shortest component finishing time to less than the shortest substrate finishing time P, the mounting time of each mounting head 16 can be equalized as much as possible, thereby improving the production efficiency.

  Next, an electronic component mounting operation will be described. First, the printed circuit board CB is carried into one positioning unit from the upstream device via the supply conveyor 4, and the positioning operation is started by the positioning mechanism.

  Next, in accordance with the mounting data stored in the RAM 32, the CPU 30 picks up the electronic component to be mounted by the suction nozzle of the mounting head 16 corresponding to the component type of the electronic component from the predetermined component supply unit 3. At this time, the linear motors 9 and 14 are controlled by the CPU 30, and the suction nozzle of the mounting head 16 of each mounting head body 7 is positioned above the top electronic component of each component supply unit 3 that stores the electronic component to be mounted. In the Y direction, the linear motor 9 is driven to move each beam 8 along a pair of guides, and in the X direction, the linear motor 14 is driven to move each mounting head body 7 along the guides. . In this case, the suction nozzle of the left mounting head 16 takes out the electronic components from the SIDE-A and SIDE-B component supply units 3 before and after the left stage 1, and puts the electronic components on the printed circuit board CB in one positioning portion. Installing.

  Since each predetermined supply unit 3 has already been driven and components can be taken out at the component suction position, the mounting head 16 is rotated in the θ direction by the pulse motor 21, and the suction nozzle is lowered by the pulse motor 22. Then, the electronic component D is reliably adsorbed from the component supply unit 3 and then rises.

  When the mounting head 16 moves above the component recognition camera 17 and determines that the mounting head 16 has passed the recognition camera 17, the component recognition camera 17 is moving the beam 8. Simultaneously imaging all the suction components D of the mounting head 16 and capturing the images are performed, and the recognition processing device 31 performs component recognition processing.

  If the result of the component recognition process is a recognition abnormality such as, for example, the standing state of the electronic component or the sucking and holding of the defective electronic component, the mounting head 16 and the suction nozzle are moved above the discharge box 26 for recognition. The electronic component D related to the abnormality is dropped and the components are discarded.

  Then, after discarding the electronic component detected as abnormal, the CPU 90 maintains the vacuum suction for the electronic component D determined to be normal detection or normal recognition, lowers the suction nozzle, and so on. The electronic component D is mounted on the printed circuit board CB in one positioning part.

  When all the electronic components are mounted on the printed circuit board CB, the printed circuit board CB in one positioning unit is transported to the other positioning unit, and the other printed circuit board CB in the upstream standby position is moved to the one positioning unit. The suction nozzle of the left mounting head 16 takes out electronic components from the SIDE-A and SIDE-B component supply units 3 before and after the left stage 1 to the printed circuit board CB in one positioning unit. The electronic component is mounted on the printed circuit board CB in one positioning unit, and the printed circuit board CB in the other positioning unit is connected to the right and left SIDE-A and SIDE-B component supply units 3 from the right stage 2. The suction nozzle of the mounting head 16 takes out the electronic component and mounts the electronic component on the printed circuit board CB in the other positioning portion.

  The variance is not limited to ½, but may be, for example, １ ／. In other words, even if the first half of the dispersion is performed, if the shortest component finish time is not shorter than the shortest printed circuit board finish time, if it is shorter than the shortest printed circuit board finish time by dispersing in three, In this way, dispersion of 1/3 is possible.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the above-described alternatives, modifications, or modifications. It includes modifications.

It is a top view of an electronic component mounting apparatus. It is a control block diagram. The setting screen of the upper limit number of distributed arrangement of a component supply unit is shown. It is a figure which shows the screen of the state arrange | positioned distributedly 1st time. It is a figure which shows the screen of the state distributed and arranged for the 2nd time. It is a figure which shows a flowchart.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Component supply unit 16 Mounting head 30 CPU
32 RAM
36 Monitor 37 Touch panel switch

Claims (7)

In the mounting method of the electronic component, the electronic component is picked up by a suction nozzle provided in a plurality of mounting heads from a plurality of component supply unit groups and mounted on the printed circuit board.
Calculate the shortest printed circuit board finish time from the total number of electronic component mounting points on the printed circuit board and the number of mounting points per unit time by multiple mounting heads based on the fastest mounting point per unit time of one mounting head .
From the number of mounting points for each component type and the fastest number of mounting points per unit time per mounting head, the shortest component finishing time by one mounting head for each component type is calculated,
An electronic component mounting method comprising notifying that component supply units having a component type longer than the shortest printed circuit board finish time are distributed and arranged in a plurality of component supply unit groups. In the mounting method of the electronic component, the electronic component is picked up by a suction nozzle provided in a plurality of mounting heads from a plurality of component supply unit groups and mounted on the printed circuit board.
Calculate the shortest printed circuit board finish time from the total number of electronic component mounting points on the printed circuit board and the number of mounting points per unit time by multiple mounting heads based on the fastest mounting point per unit time of one mounting head .
From the number of mounting points for each component type and the fastest number of mounting points per unit time per mounting head, the shortest component finishing time by one mounting head for each component type is calculated,
Electronic component mounting characterized by notifying that component supply units of component types having a minimum component finish time longer than the shortest printed circuit board finish time are sequentially distributed so as to have a mounting score of 1/2. Method.   The electronic component mounting method according to claim 1, wherein the upper limit number of the dispersed arrangement can be set for each component type.   2. The electronic component mounting method according to claim 1, wherein the plurality of component supply unit groups are distributed and arranged for each mounting head. In an electronic component mounting apparatus for picking up electronic components from a plurality of component supply units by suction nozzles provided on a plurality of mounting heads and mounting them on a printed circuit board,
First calculation means for calculating the shortest printed circuit board finishing time from the total number of electronic component mounting points on the printed circuit board and the mounting points per unit time by a plurality of mounting heads based on the fastest mounting point per unit time of one mounting head When,
A second calculating means for calculating the shortest component finishing time by one mounting head for each component type from the number of mounting points for each component type and the fastest number of mounting points per unit time per mounting head ;
An informing means is provided for notifying that a component supply unit of a component type longer than the shortest printed circuit board finish time is distributed and arranged in a plurality of component supply unit groups. Mounting device. In an electronic component mounting apparatus for picking up electronic components from a plurality of component supply units by suction nozzles provided on a plurality of mounting heads and mounting them on a printed circuit board,
First calculation means for calculating the shortest printed circuit board finishing time from the total number of electronic component mounting points on the printed circuit board and the mounting points per unit time by a plurality of mounting heads based on the fastest mounting point per unit time of one mounting head When,
A second calculating means for calculating the shortest component finishing time by one mounting head for each component type from the number of mounting points for each component type and the fastest number of mounting points per unit time per mounting head ;
Informing means for informing that the component supply units of the component types having the shortest component finishing time longer than the shortest printed circuit board finishing time are distributed and arranged so as to sequentially have 1/2 mounting points. Electronic component mounting device.   7. The electronic component mounting apparatus according to claim 5, further comprising setting means for setting the upper limit number of the distributed arrangement for each component type.

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