JP4989517B2 - Mounting method of electronic parts - Google Patents

Description

  In the present invention, an electronic component supplied from a component supply apparatus is taken out by a suction nozzle provided in a mounting head, and the electronic component is imaged by a component recognition camera, and is subjected to recognition processing and mounted on a printed circuit board. The present invention relates to an electronic component mounting method.

This type of electronic component mounting method is disclosed, for example, in Patent Document 1. Even if component library data representing the characteristics of an electronic component is prepared, there are many cases in which an electronic component recognition error occurs immediately after the start of printed circuit board production due to subtle variations in electronic components or insufficient confirmation.
JP-A-6-61700

  In this case, it is necessary to suspend production, perform parts library data teaching and electronic part recognition test, and correct part library data, but discard the printed circuit board and mounted electronic parts. It will be.

Therefore, the present invention provides an electronic component mounting method capable of correcting the component pick-up position in the component supply unit so as not to discard the printed circuit board and the mounted electronic component without interrupting the production of the printed circuit board. Objective.

For this reason, the first invention takes out electronic components supplied from various component supply units by each suction nozzle provided in the mounting head, images the electronic components with a component recognition camera, performs recognition processing, and performs printed circuit board processing. In the electronic component mounting method to be mounted on the printed circuit board, the coordinates on which the electronic component is to be mounted, the arrangement number of the component supply unit for supplying the electronic component, and the like are based on the specified mounting data. The first time when the mounting head is moved, the electronic component supplied from the component supply unit is taken out by the suction nozzles, and the electronic component is moved to the positioning unit and mounted on the fixed printed circuit board. Before the electronic component is taken out from the component supply unit by the suction nozzle. In the case where the first time the electronic component is taken out by taking the, after the component pickup position in the component feeding unit by imaging by the camera to check the component pickup position, and wherein the retrieving after this confirmation.

The present invention can provide an electronic component mounting method capable of correcting a component pick-up position in a component supply unit so as not to discard the printed circuit board and the mounted electronic component without interrupting production of the printed circuit board. .

  Hereinafter, an embodiment of an electronic component mounting apparatus for mounting an electronic component on a printed circuit board will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1. A plurality of component supply units 3 for supplying various electronic components one by one to a component take-out portion (component adsorption position) are provided on a base 2 of the apparatus 1. It is installed side by side. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the opposing component supply unit 3 groups. The supply conveyor 4 conveys the printed circuit board P received from the upstream device to the positioning unit 5, and after the electronic parts are mounted on the substrate P positioned and fixed by the positioning mechanism (not shown) by the positioning unit 5, the discharge conveyor 6 is conveyed.

  8A and 8B are a pair of beams that are long in the X direction, and the screw shaft 10 is rotated by driving the Y-axis motor 9, respectively, and the component extraction positions of the printed circuit board P and the component supply unit 3 along the pair of left and right guides 11 ( The component suction position) is individually moved in the Y direction.

  Each of the beams 8A and 8B is provided with a mounting head 7B that can be rotated by a θ-axis motor 14 on a mounting body 7A that moves along a guide (not shown) by an X-axis motor 12 in the longitudinal direction, that is, the X direction. It has been. Each mounting head 7B is equipped with a vertical axis motor 13 for moving an arbitrary one of the six suction nozzles 17 up and down, and the θ-axis motor 14 is mounted. Therefore, each suction nozzle 17 of the mounting head 7B can move in the X direction and the Y direction (planar direction), can rotate around a vertical line, and can move up and down. Reference numeral 16 denotes a component recognition camera that images an electronic component sucked and held by the suction nozzle 17, and reference numeral 18 denotes a board recognition camera that images a positioning mark attached to the printed board P.

  Next, in the control block diagram of FIG. 2, each element of the electronic component mounting apparatus 1 is centrally controlled by a CPU (Central Processing Unit) 30, and a ROM (Read An only memory (31) and a RAM (random access memory) 32 for storing various data are connected via a bus line 33. Further, a monitor 34 for displaying an operation screen and the like, and a touch panel switch 35 as input means formed on the display screen of the monitor 34 are connected to the CPU 30 via an interface 36. The Y-axis motor 9 and the like are connected to the CPU 30 via a drive circuit 38 and an interface 36.

  The RAM 32 stores mounting data for each type of printed circuit board P related to component mounting, and the X direction of the mounting coordinates of each electronic component in the printed circuit board P for each mounting order (step number). , Y direction and angle information, arrangement number information of each component supply unit 3, and the like are stored. The RAM 32 stores information on the type of each electronic component corresponding to the component supply unit arrangement number of each component supply unit 3, that is, component arrangement data, and further features of the electronic component for each component ID. The component library data relating to the X-direction and Y-direction lengths, thickness information, nozzle IDs of the suction nozzles used, and the like are stored.

  A recognition processing device 37 is connected to the CPU 30 via the interface 36. The recognition processing device 37 performs recognition processing of an image captured by the component recognition camera 16, and the processing result is sent to the CPU 30. Is sent out. In other words, the CPU 30 outputs an instruction to the recognition processing device 37 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the component recognition camera 16 and receives the recognition processing result from the recognition processing device 37. is there.

  Next, based on FIG. 5, the operation mode setting and various operation settings related to component mounting will be described. First, when the operator operates the touch panel switch 35 displayed on the monitor 34, the screen shown in FIG. 5 can be displayed. Reference numeral 40 denotes a “normal operation mode” switch for selecting a normal operation mode for causing a normal printed circuit board production operation. Reference numeral 41 denotes a test strike in which the first printed circuit board that has started the production operation can perform teaching work described later. It is a “trial driving mode” switch section for selecting an operation mode.

  42A and 42B are “Yes” and “No” switch portions for specifying whether or not to check the suction position of the component supply unit 3, and 43A and 43B are component library data for component recognition NG (component recognition error). “Yes” switch section for specifying whether to correct or not, “No” switch section, 44A and 44B are “Yes” switch sections for specifying whether or not to confirm the mounting coordinates on the printed circuit board, “ "No" switch part, 45A, 45B are "Yes" switch part, "No" switch part, 46 to specify after confirming the position of electronic components mounted on the printed circuit board This is a “start” switch part that is pressed when starting operation, and the above switch part is constituted by a touch panel switch 35. It is.

  The above configuration will be described based on the flowchart shown in FIG. 4 following FIG. 3 and FIG. 3. First, when the normal operation mode is selected and the “start” switch unit 46 is pressed, the CPU 30 prints in the normal operation mode. The production operation of the substrate P is started, and when the printed circuit board P is inherited from the upstream device (not shown) and exists on the supply conveyor 4, the printed circuit board P on the supply conveyor 4 is moved to the positioning unit 5. And fix the positioning. The mounting data stored in the RAM 32, that is, mounting data in which the XY coordinate position to be mounted on the printed circuit board P, the rotation angle position around the vertical axis, the FDR number (arrangement number of each component supply unit 3), and the like are designated. Accordingly, in the Y direction, the Y axis motor 9 is driven to move the beam 8A or 8B along the pair of guides 11, and in the X direction, the X axis motor 12 is driven to select any of the suction nozzles 17 of the corresponding mounting head 7B. The electronic component to be mounted is moved above a predetermined component supply unit 3, the vertical axis motor 13 is driven, the suction nozzle 17 is lowered, and the electronic component is sucked and taken out.

  Further, while the suction nozzle 17 is moved above the component recognition camera 16, the electronic component held by suction is imaged (fly imaging) and recognized by the recognition processing device 37, and the beam 8 A or 8 B is moved above the printed circuit board P. Then, the positioning mark attached to the printed circuit board P is picked up and recognized by the recognition processing device 37. Based on the result, the suction nozzle 17 is moved to the mounting position of the mounting data again by moving the board P upward. All the electronic components sucked and held by the suction nozzles 17 of the mounting head 7B are mounted on the printed circuit board P while correcting the positional deviation in consideration of the amount recognition result.

  The electronic components are repeatedly taken out, recognized, and mounted until all the electronic components to be mounted on one printed circuit board P are completed. When all the electronic components are completed, the printed circuit board P is conveyed from the positioning unit 5 to the discharge conveyor 6. Then, the production relating to the electronic component mounting of the first printed board P is completed, and the production for the second printed board P is performed.

  The above is the production operation in the normal operation mode. Next, the operation when the trial operation mode is selected will be described below. First, when the “start” switch unit 46 is pressed, the printed circuit board P on the supply conveyor 4 is moved to the positioning unit 5 to be positioned and fixed as described above, but the operation mode is the trial operation mode. Next, the CPU 30 determines whether or not to confirm the mounting coordinates on the printed circuit board.

  Here, when the “no” switch unit 44B is set by confirming the mounting coordinates, the CPU 30 controls the beam 8A or 8B (mounting head 7B) to move above the component supply unit 3. When the switch section 44A is operated and set, control is performed so that the beam 8A or 8B (mounting head 7B) moves above the printed circuit board P.

  Then, the CPU 30 performs control related to teaching of the mounting coordinates for the electronic component to be mounted by the mounting head 7B of the beam 8A or 8B. That is, based on the mounting data, the CPU 30 moves the beam 8A or 8B and the board recognition camera 18 images the position on the printed board P where the first electronic component is mounted. The CPU 30 detects the mounting data and the component library data. The graphics DG of the external shape of the electronic component created based on the above and the captured image are displayed on the monitor 34 together with the other switch units.

  Therefore, the operator looks at this screen, determines the relationship between the position of the graphics DG of the electronic component outline and the position of the land LN of the printed circuit board P, and if both positions are misaligned so that there is a problem. The “teach execution” switch unit 50 is pressed. If there is no problem, the “next” switch unit 51 is pressed. In this case, when the “teach execution” switch unit 50 is pressed, each of the “moving” switch units (not shown) on the top, bottom, left, and right is displayed on the monitor 34, and graphics are generated based on the operation of each “move” switch unit. The DG can be moved, and the CPU 30 can align the positions while grasping the movement amount. When the “◯” switch unit 52 is pressed after this alignment, execution of teaching is confirmed, and the mounting coordinates of the mounting data are corrected in consideration of the movement amount, and then stored in the RAM 32. The “×” switch unit 54 is pressed when it is desired to cancel or cancel teaching execution.

  Then, when the “next” switch unit 51 is pressed, the CPU 30 moves the beam 8A or 8B based on the mounting data to determine the position on the printed circuit board P where the electronic component is to be mounted next. The CPU 30 causes the monitor 34 to display the graphic DG of the external shape of the electronic component created based on the mounting data and the component library data and the captured image on the monitor 34 (see FIG. 6), as described above. If necessary, the mounting data can be corrected. In this way, the number of electronic components sucked and held by each suction nozzle of the mounting head 7B is repeated, and when the total number is finished, "start" The pressing operation of the switch unit is validated, and the process proceeds to the next step.

  That is, when the teaching of mounting coordinate confirmation is finished, the CPU 30 stores the mounting data stored in the RAM 32, that is, the XY coordinate position to be mounted on the printed circuit board P, the rotational angle position about the vertical axis, and the FDR number (each component supply unit). 3), the Y-axis motor 9 is driven in the Y direction to move the beam 8A or 8B along the pair of guides 11, and the X-axis motor 12 is driven in the X direction. Then, one of the suction nozzles 17 of the corresponding mounting head 7B is moved above a predetermined component supply unit 3 in order to take out the electronic component to be mounted.

Here, the CPU 30 determines whether or not to confirm the suction position of the component supply unit 3, but when the “No” switch unit 42 </ b> B is set by operating, the CPU 30 drives the vertical axis motor 13. Then, the suction nozzle 17 is lowered to control the electronic component to be picked up and taken out. When the “ON” switch unit 42A is operated and set, the suction nozzle 17 of the mounting head 7B next picks up the electronic component. Then, it is determined whether or not the electronic component to be taken out is taken out for the first time for the component supply unit 3. If it is determined that it is not the first time, the CPU 30 drives the vertical axis motor 13 to control the lowering of the suction nozzle 17 to suck and take out the electronic components. The electronic component is controlled according to the teaching of the suction position coordinates of the component supply unit 3.
That is, the CPU 30 moves the beam 8A or 8B and the board recognition camera 18 images the position of the electronic component supplied to the suction position, and the CPU 30 displays the captured image on the monitor 34 together with the other switch units.

  Therefore, the operator looks at this screen and judges from the relationship between the position of the electronic component supplied to the suction position and the screen center position. "Press the switch part. If there is no problem, press the" next "switch part. In this case, when the “teach execution” switch unit is pressed, the recognition processing device 37 recognizes the image captured by the board recognition camera 18, the CPU 30 calculates the amount of deviation, and the amount of deviation is displayed on the monitor 34. The operator corrects the component suction position of the component supply unit 3 and stores it in the RAM 32.

  When the “next” switch unit 51 is pressed, the beam 8A or 8B is moved above the suction position of the component supply unit 3 to be taken out for the first time for the component supply unit 3 and supplied to the suction position. The board recognition camera 18 picks up the position of the electronic component, and the CPU 30 displays the picked-up image on the monitor 34 together with the other switches, and the operator looks at this screen to see the electronic component supplied to the suction position. Judging from the relationship between the position and the screen center position, if the positions of the two positions are misaligned, press the “Teach execution” switch. If there is no problem, press the “Next” switch. Press operation. In this case, when the “teach execution” switch unit is pressed, as described above, the recognition processing device 37 recognizes the image captured by the board recognition camera 18 and the CPU 30 calculates the amount of deviation, and the amount of deviation is monitored. 34, the operator corrects the component suction position of the component supply unit 3 and stores it in the RAM 32. Thus, the operator repeats the number of electronic components to be taken out for the first time for the component supply unit 3, When the operation is finished, the pressing operation of the “start” switch unit is validated, and the process proceeds to the next step.

  Accordingly, the CPU 30 moves the suction nozzle 17 to a position above the suction position in the case of the component supply unit 3 that does not require correction, and in the case of the corrected component supply unit 3, the corrected suction position. Is moved upward, and the electronic components are picked up and taken out.

  Next, the CPU 30 determines whether or not to correct the component library data at the time of component recognition NG. If the “No” switch unit 43B is set by operating, the CPU 30 determines that the beam 8A or 8B and the mounting are performed. While moving the head 7B over the component recognition camera 16, the component recognition camera 16 is sucked and held by the suction nozzle 17 of the mounting head 7B while moving and picks up an image of the electronic component (fly image), and is recognized by the recognition processing device 37. If there is a deviation amount with respect to the suction nozzle 17, it moves to the mounting position of the printed circuit board P while correcting it by adding this to the mounting data, and mounting each electronic component one after another.

  Further, when the “ON” switch unit 43A for correcting the part library data is operated and set during the part recognition NG, the CPU 30 moves the beam 8A or 8B and the mounting head 7B to the position above the all parts recognition camera 16. After the stop, the component recognition camera 16 is sucked and held by the suction nozzle 17 of the mounting head 7B to pick up an image of the electronic component (stop shooting), and the recognition processing device 37 performs a recognition process, and the CPU 30 recognizes a recognition error (recognition). NG), if there is a deviation amount with respect to the suction nozzle 17, it moves to the mounting position of the printed circuit board P while correcting it by adding this to the mounting data, and mounting each electronic component one after another To do.

  However, if it is determined that there is a recognition error electronic component, the CPU 30 displays a list related to the recognition error and an image captured by the component recognition camera 16 on the monitor 34, as shown in FIG. This list is composed of the number of the suction nozzle 17 that sucks and holds the electronic component DN related to the recognition error, the component ID (name unique to the electronic component), the “discard” switch unit 57, and the “teach” switch unit 58. The “execute” switch unit 59 is also displayed.

  Therefore, here, the operator sees the image, whether to discard or teach the electronic component DN of the number “01” of the suction nozzle 17 in the list, for example, the length of the lead, the lead width, and the size of the electronic component are If the operator determines that the difference is a recognition error and that the parts library data is clearly wrong, the “teach” switch unit 58 is pressed and the “execute” switch unit 59 is further operated. The screen shown is displayed on the monitor 34.

  Here, for the electronic component DN having the number “01” of the suction nozzle 17, when it is desired to correct the lead length, when the “lead length” switch unit 64 is pressed, the CPU switches the “tenkey” switch unit (not shown). To display. Accordingly, when the operator inputs the length to be corrected by operating the “ten-key” switch unit and presses the “save” switch unit 65 and the “x” switch unit 66, the CPU 30 corrects the corrected lead length. Control is performed so as to store the component library data in the RAM 32 and to return to the display shown in FIG.

  In addition, by pressing the “teach” switch unit 60, the component data can be automatically recreated by image processing.

  Next, for the electronic component of number “05” of the suction nozzle 17, when it is determined that the lead is bent or the lead is missing and it is determined that the electronic component is to be discarded, the “discard” switch unit 57 is pressed, When the “start” switch unit 67 is operated, the CPU 30 controls to discard the electronic component sucked and held by the suction nozzle 17 set to be discarded, and then removes the electronic component from the component supply unit 3 again. The electronic component sucked and held by the suction nozzle 17 of the mounting head 7B is moved to a position above the component recognition camera 16, and after stopping, the component recognition camera 16 is sucked and held by the suction nozzle 17 of the mounting head 7B. Is recognized and processed by the recognition processing device 37, and the CPU 30 recognizes a recognition error (recognition NG) based on the corrected component library data. When it is determined that there is no child component, if there is a deviation amount with respect to the suction nozzle 17, the mounting data is corrected by adding this to the mounting position of the printed circuit board P, and all the electronic components of the mounting head 7B are successively displayed. Installing.

  When the “start” switch unit 67 is operated, the CPU 30 controls to discard the electronic components sucked and held by the suction nozzle 17 set to be discarded, and other electronic components are mounted on the printed circuit board P. An electronic component of the same type as the electronic component discarded after the completion is taken out of the component supply unit 3 again, moved to the upper position of the component recognition camera 16 and imaged, and recognized by the recognition processing device 37. If there is a deviation amount with respect to the nozzle 17, it may be moved and mounted to the mounting position of the printed circuit board P while being corrected by adding this to the mounting data.

  Then, after all the electronic components are mounted on the printed circuit board P, the CPU 30 determines whether or not the position of the electronic components mounted on the printed circuit board P is to be confirmed. If all of the electronic components to be mounted on one printed circuit board P are completed, the removal, recognition, and mounting of the electronic components are repeated until all the electronic components are completed. Control is performed to release the mode, the printed circuit board P is conveyed from the positioning unit 5 to the discharge conveyor 6, and the production related to the mounting of the electronic components on the first printed circuit board P is completed. On the other hand, production is performed in the normal operation mode instead of the trial operation mode.

  Further, when the “ON” switch unit 45A is set by operating, control is performed so that the mounting positions of all the electronic components mounted by the mounting head 7B are confirmed. That is, the electronic component mounted on the printed circuit board P by the mounting head 7B is imaged for each electronic component by the substrate recognition camera 18 and displayed on the monitor 34, thereby confirming whether the electronic component is mounted at the position to be mounted. It can be carried out. Then, after confirming the mounting positions of all the electronic components, the electronic components are repeatedly taken out, recognized, and mounted until all the electronic components to be mounted on one printed circuit board P are completed. The CPU 30 performs control so as to cancel the trial driving operation mode, conveys the printed circuit board P from the positioning unit 5 to the discharge conveyor 6, and the production related to mounting of electronic components on the first printed circuit board P is completed. For the printed circuit board P, the production is performed in the normal operation mode instead of the trial operation mode.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a schematic plan view of an electronic component mounting apparatus. It is a control block diagram. It is a figure which shows a flowchart. It is a figure which shows the flowchart following FIG. It is a figure which shows the screen for performing various operation setting which concerns on the setting of an operation mode, and other components mounting | wearing. It is a figure which shows the image of the electronic component external shape, the image which imaged the electronic component, and another switch part. It is a figure which shows the list relevant to a recognition error, and the image which the component recognition camera imaged. It is a figure which shows the teaching screen of parts library data.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Component supply unit 7B Mounting head 16 Component recognition camera 17 Suction nozzle 18 Substrate recognition camera 30 CPU
32 RAM
34 Monitor 37 Recognition processing device

Claims (1)

An electronic component supplied from various component supply units is picked up by each suction nozzle provided in the mounting head, the electronic component is imaged by a component recognition camera, and recognition processing is performed to mount the electronic component on a printed circuit board. In the component mounting method, the mounting head moves based on mounting data in which coordinates for mounting the electronic component on the printed circuit board, an arrangement number of the component supply unit for supplying the electronic component, and the like are designated, and the component With respect to the first printed circuit board that has started the production operation of taking out the electronic parts supplied from the supply unit by the respective suction nozzles, moving the electronic parts to the positioning unit, and mounting the electronic parts on the fixed printed circuit board, the suction nozzles before taking out the electronic components from the component feeding unit, the first electronic component to the component feeding unit In the case taken out, after capturing the component pickup position in the component feeding unit with the camera to check the component pickup position, the mounting method of the electronic component, characterized in that taking after this confirmation.