JP4942439B2 - Electronic component mounting device - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that picks up an electronic component from a component supply unit by suction using a suction nozzle provided on a mounting head, and mounts the electronic component on a printed board that is transported by a transport device and fixed at a positioning position.

This electronic component mounting apparatus is known, for example, from Patent Document 1. In some cases, it is desired to grasp the position of an arbitrary printed circuit board among the plurality of printed circuit boards flowing in the apparatus. In this case, when the operator is constantly monitoring, the position of the printed circuit board whose position is to be grasped can be grasped.
Japanese Patent Laid-Open No. 2004-47818

  However, if the operator cannot constantly monitor and shifts to another work, it may lose sight of where the printed circuit board whose position is to be grasped is.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus capable of reliably grasping the position of a printed circuit board for which the position of a plurality of printed circuit boards flowing through the apparatus is desired.

For this reason, according to the first aspect of the present invention, an electronic component is picked up from a component supply unit by a suction nozzle provided on a mounting head, and mounted on a printed circuit board which is transported by a transport device and fixed at a positioning position. In the apparatus, a display device that displays the position of the printed circuit board, a designation device that designates a printed circuit board that is desired to grasp the position among the plurality of printed circuit boards that flow in the transport device, and an operation by the operator , And a control device that controls the display device to display a position where the designated printed circuit board is transported and moved by the transport device.

According to a second aspect of the present invention, there is provided an electronic component mounting apparatus in which an electronic component is picked up from a component supply unit by a suction nozzle provided in a mounting head, and mounted on a printed circuit board which is transported by a transport device and fixed at a positioning position. A display device for displaying the position of the printed circuit board, a designation device for designating a printed circuit board for which the position of the plurality of printed circuit boards flowing in the transport device is to be grasped by an operation by an operator, and a designation device designated by the designation device A first control device that controls the display device to display a position where the printed circuit board is transported and moved by the transport device; and the printed circuit board designated by the designation device is transported by the transport device to a predetermined value. A second control device is provided for controlling the transport device so as not to move downstream when the position is reached. It is characterized in.

According to a third aspect of the present invention, there is provided an electronic component mounting apparatus in which an electronic component is picked up and taken out from a component supply unit by a suction nozzle provided in a mounting head, and is mounted on a printed board which is transported by a transport device and fixed at a positioning position. A display device that displays the position of the printed circuit board, and a printed circuit board that is skipped so as not to mount an electronic component among the plurality of printed circuit boards that flow in the transfer device, and for which the position is to be grasped. If the specified device is specified by the operation of, and the printed circuit board specified by the specified device during the operation of the electronic component mounting device is not already specified, and the printed circuit board is not set to skip electronic components. The printed circuit board specified by the specified device is transported by the transport device. Characterized in that the moving position is provided a control device for controlling to display on the display device Te.

According to a fourth aspect of the present invention, there is provided an electronic component mounting apparatus in which an electronic component is picked up from a component supply unit by a suction nozzle provided in a mounting head, and mounted on a printed circuit board which is transported by a transport device and fixed at a positioning position. a display device for displaying the position of the printed circuit board, the printed circuit board to be grasped position a printed circuit board that is skipped set so as not to mount the electronic component of the plurality of the printed circuit board through the transfer device working a designating device for designating the operation by the user, as well as specify if and have done so the skip setting no printed circuit board that is designated is already been designated when not in operation of the electronic component mounting apparatus by the specified device, wherein The position where the printed circuit board designated by the designated device is conveyed by the conveying device and moved is displayed in the table. Characterized by providing a control device for controlling to display on.

  The present invention can provide an electronic component mounting apparatus that can surely grasp the position of a printed circuit board that is desired to grasp the position among the plurality of printed circuit boards flowing in the apparatus.

  Hereinafter, an embodiment of an electronic component mounting apparatus will be described based on the drawings. FIG. 1 is a plan view of an electronic component mounting device 1, and electronic components as a component supply device are supplied one by one to a component extraction position (component suction position) on a machine base (device main body) 2 of the electronic component mounting device 1. The known parts supply unit 3 group is divided into four blocks, that is, left and right left stages and right stages, and further divided into front and rear SIDE-A and SIDE-B for each stage. It is divided and arranged.

  A supply conveyor 4 is provided at an intermediate portion of the mounting device 1 so that the transport direction of the printed circuit board CB is the left-right direction. The supply conveyor 4 is provided with a positioning mechanism for positioning the printed circuit board CB received from the upstream device at the two positioning portions, and after the electronic components are mounted on the substrate CB, it is conveyed to the downstream device. . Note that a maximum number of five printed circuit boards CB can exist in the mounting apparatus 1, and the positioning mechanism is provided at the second and fourth (second from the right) positions from the left, and can be positioned. Is done.

  Reference numeral 8 denotes a pair of beams that are long in the X direction. A printed circuit board CB that is fixed by a positioning mechanism by sliding a slider fixed to each beam 8 along a pair of left and right guides by driving each linear motor 9. In addition, the component supply unit 3 is individually moved in the Y direction above the component delivery position (component adsorption position). The linear motor 9 includes a pair of left and right stators fixed to the base 2 and a mover fixed to lower portions of mounting plates provided at both ends of the beam 8.

  Each beam 8 is provided with a mounting head body 7 that moves along the guide by a linear motor 14 in the longitudinal direction, that is, in the X direction. The linear motor 14 includes a pair of front and rear stators fixed to the beam 8 and a movable element provided on the mounting head body 7. Each mounting head body 7 includes a mounting head 16 having twelve suction nozzles biased upward by springs.

  The mounting head 16 can be rotated in the θ direction by a pulse motor 21, and twelve suction nozzles (not shown) are arranged on the mounting head 16 on the circumference at predetermined intervals. 22 is provided so as to be movable up and down.

  Reference numeral 17 denotes a component recognition camera, which is provided for each of the mounting heads 16 for a total of four, and how much the electronic component is displaced and held with respect to the suction nozzle in the XY direction and the rotation angle. In order to recognize the position, all the electronic components sucked and held by the plurality of suction nozzles are collectively imaged, and a plurality of electronic components can be simultaneously imaged. Further, the component recognition camera 17 can confirm whether or not the electronic component D is sucked and held by the suction nozzle by taking an image. If the electronic component D is sucked and held by the suction nozzle, it is dropped into the discharge box 26 and collected. .

  Next, a description will be given below based on the control block diagram of the electronic component mounting apparatus 1 of FIG. A CPU (mounting control unit) 30 is a control unit that performs overall control of the mounting apparatus 1. The CPU (central processing unit) 30 is connected to a RAM (random access memory) 32 and a bus line via a bus line. A ROM (Read Only Memory) 33 is connected. Based on the data stored in the RAM 32, the CPU 30 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 33. That is, the CPU 30 controls the driving of the linear motors 19 and 14 and the pulse motors 21 and 22 through the interface 34 and the drive circuit 35.

  The RAM 32 stores mounting data relating to component mounting. For each mounting order (step number), the X direction (indicated by X), the Y direction (indicated by Y), and the angle within the printed circuit board. Information (indicated by Z), arrangement number information of each component supply unit 3, and the like are stored. The RAM 32 stores component arrangement data, which stores the type of each electronic component (component ID), the arrangement coordinates of the supply unit 3, and the like corresponding to the arrangement number of each component supply unit 3. Has been.

  A recognition processing device 31 is connected to the CPU 30 via the interface 34. The recognition processing device 31 performs recognition processing of an image captured by the component recognition camera 17.

  The image picked up by the component recognition camera 17 is displayed on a monitor 36 such as a CRT as a display device. The monitor 36 is provided with various touch panel switches 37, and various settings including settings for teaching designation can be performed by an operator operating the touch panel switch 37.

  The touch panel switch 37 has a transparent conductive film coated on the entire surface of a glass substrate, and electrodes are printed on four sides. For this reason, when a very small current is passed through the surface of the touch panel switch 37 and the operator touches it, a current change occurs in the electrodes on the four sides, and the coordinate value touched by the circuit board connected to the electrodes is calculated. Therefore, if the coordinate value matches a coordinate value in a coordinate value group stored in advance in the RAM 32 as a switch unit for performing a certain operation, the operation is performed.

  Here, an operation of pressing the touch panel switch 37 displayed on the monitor 36 and designating a printed circuit board CB for which the position of the plurality of printed circuit boards CB flowing in the apparatus is to be grasped based on FIG. explain.

  First, there are usually five printed circuit boards CB in the electronic component mounting apparatus 1, and when all the electronic components have been mounted on the printed circuit board CB, the printed circuit boards CB are sequentially moved in the downstream direction and printed at the most downstream position. The operation of discharging the board CB to the downstream apparatus and introducing the printed board CB from the upstream apparatus into the electronic component mounting apparatus 1 is performed.

  Then, on the screen as shown in FIG. 3, that is, the screen schematically representing the electronic component mounting apparatus 1, the operator grasps the position among the plurality of printed circuit boards CB flowing in the apparatus 1. When the switch unit 40 of the touch panel switch 37 corresponding to the second printed circuit board CB from the left is pressed and designated, the switch unit 40 changes from white to gray. After that, when the designated printed circuit board CB reaches the most downstream position of the electronic component mounting apparatus 1, a “Yes” switch of the touch panel switch 37 that specifies whether or not to control the electronic component mounting apparatus 1 to stop. When the CPU 41 controls the supply conveyor 4 that is a transport device as described above when a pressing operation is performed on the section 41 or the “no” switch section 42, the following description will be made assuming that the “Yes” switch section 41 is operated. The data set in this way is stored in the RAM 32.

  Next, an electronic component mounting operation will be described. First, the printed circuit board CB is carried from the upstream device to the first positioning portion (left side) via the supply conveyor 4, and the positioning operation is started by the positioning mechanism.

  Next, in accordance with the mounting data stored in the RAM 32, the CPU 30 picks up the electronic component to be mounted by the suction nozzle of the mounting head 16 corresponding to the component type of the electronic component from the predetermined component supply unit 3. At this time, the linear motors 9 and 14 are controlled by the CPU 30, and the suction nozzle of the mounting head 16 of each mounting head body 7 is positioned above the top electronic component of each component supply unit 3 that stores the electronic component to be mounted. In the Y direction, the linear motor 9 is driven to move each beam 8 along a pair of guides, and in the X direction, the linear motor 14 is driven to move each mounting head body 7 along the guides. .

  In this case, the suction nozzle of the left mounting head 16 takes out the electronic components from the SIDE-A and SIDE-B component supply units 3 before and after the left stage 1, but the mounting head 16 is rotated in the θ direction by the pulse motor 21. Then, the suction nozzle is lowered by the pulse motor 22, and is lifted after the electronic component D is reliably sucked from the component supply unit 3.

  When the mounting head 16 moves above the component recognition camera 17 and determines that the mounting head 16 has passed the recognition camera 17, the component recognition camera 17 is moving the beam 8. Simultaneously imaging all of the picked-up components of the mounting head 16 and capturing the images are performed, and the recognition processing device 31 performs component recognition processing.

  If the result of the component recognition process is a recognition abnormality such as, for example, the standing state of the electronic component or the sucking and holding of the defective electronic component, the mounting head 16 and the suction nozzle are moved above the discharge box 26 for recognition. The electronic component D related to the abnormality is dropped and the components are discarded.

  Then, after discarding the electronic components detected as abnormal, the CPU 90 maintains the vacuum suction for the electronic components determined to be normal detection or normal recognition, and lowers the suction nozzle one after another. The electronic component D is mounted on the printed circuit board CB in the first positioning portion.

  When all the electronic components are mounted on the printed circuit board CB, the printed circuit board CB in the first positioning unit is transported between the second positioning unit (on the right side), and the first positioning is newly performed from the leftmost position. It is mounted on the printed circuit board CB conveyed to the section as described above. When all the electronic components are mounted on the printed circuit board CB, each printed circuit board CB is transported in the downstream direction. Therefore, the other printed circuit board CB at the leftmost standby position is the first positioning unit. The printed circuit board CB between the first positioning part and the second positioning part is transported to the second positioning part.

  Therefore, the suction nozzle of the left mounting head 16 takes out the electronic component from the SIDE-A and SIDE-B component supply units 3 before and after the left stage to the printed circuit board CB in the first positioning unit. The electronic component is mounted on the printed circuit board CB in the second position, and the printed circuit board CB in the second positioning unit is attached to the right mounting head 16 from the SIDE-A and SIDE-B component supply units 3 before and after the right stage. The nozzle takes out the electronic component and mounts the electronic component on the printed circuit board CB in the second positioning portion.

  As described above, electronic components are mounted on the printed circuit board CB. Next, conveyance control of the printed circuit board CB will be described with reference to FIG. When the operation start switch portion of the touch panel switch 37 displayed on the monitor 36 is pressed, or when all electronic components are mounted on the printed circuit board CB in the first or second positioning portion, the CPU 30 conveys. A conveyance start command is sent to the drive motor of the supply conveyor 4 which is an apparatus, and conveyance of the printed circuit board CB is started.

  Then, after the conveyance of the printed circuit board CB is started and the electronic component is mounted on the printed circuit board CB that has reached the first or second positioning unit, the CPU 30 controls the electronic component mounting apparatus 1 to stop. It is determined whether or not the mode is the stop mode. If the mode is not the stop mode, the substrate is transported, and the stored contents of the predetermined area of the RAM 32 serving as the substrate information memory are shifted to the right (see FIG. 5). That is, for each substrate transport operation, for example, every time the CPU 30 sends a transport start command to the drive motor of the supply conveyor 4, or every time the drive motor rotates by a predetermined number of rotations (detected by the encoder), the CPU 30 uses the substrate information memory. The content stored in a predetermined area of a certain RAM 32 is shifted to the right.

  Further, on the screen as shown in FIG. 3, it is desired to grasp the position, for example, by pressing the switch unit 40 of the touch panel switch 37 corresponding to the printed circuit board CB in which an error has occurred during component mounting, and to stop the specified circuit board. When the designated board stop mode is set by pressing the “ON” switch section 41 for selecting the mode, the printed circuit board CB that has reached the most downstream position (discharge position) of the electronic component mounting apparatus 1 is switched to the switch section. If the printed circuit board CB is not designated by pressing 40, the contents stored in the predetermined area of the RAM 32 are sequentially shifted to the right. When a printed circuit board CB whose position is to be identified is designated, the CPU 30 sequentially turns the switch unit 40 to white and downstream of the printed circuit board CB on the basis of the stored contents of a predetermined area of the RAM 32. Since the switch part 40 on the side (right adjacent) is changed to gray, the operator can grasp where the printed circuit board CB is.

  That is, each time the printed circuit board CB is transported, the stored contents of a predetermined area of the RAM 32 are sequentially shifted to the right, and based on the stored contents, the CPU 30 turns the switch unit 40 white and the downstream switch unit 40 gray. The switch unit 40, which is designated and changed in color in accordance with the movement of the actual printed circuit board CB in the downstream direction, is controlled as if it moves to the right side, so where is the printed circuit board CB whose position is to be grasped. The worker can grasp this.

  If the printed circuit board CB that has been sequentially mounted with electronic components in this way and has reached the most downstream position (discharge position) of the electronic component mounting apparatus 1 is the printed circuit board CB designated by pressing the switch unit 40, Even if an electronic component is mounted on the printed circuit board CB that has reached the first or second positioning portion, the CPU 30 drives the supply conveyor 4 so that the printed circuit board CB at the discharge position is not discharged to the downstream device. The motor is controlled.

  Next, with reference to FIG. 6, an operation for performing a skip setting in which electronic components are not mounted on the printed circuit board in connection with specifying the printed circuit board whose position is to be grasped will be described. First, for example, a defective board is specified by pressing the switch section 40 of the touch panel switch 37 corresponding to the printed circuit board CB in the first positioning section on the screen as shown in FIG. Then, the CPU 30 determines whether or not the electronic component mounting apparatus 1 is in operation, and if it is in operation, it is next determined whether or not it has already been specified. Control is performed to cancel the designation (return to white), and the skip setting for not mounting the electronic component on the printed circuit board in the first or second positioning unit is canceled and the process ends.

  In addition, when it is determined whether or not it has already been specified during operation, if it has not been specified, it is determined whether or not skip has already been set, and if it has been set, it is terminated and must be set. Then, control is performed so as to specify the printed circuit board CB (discolored to gray), and the process ends.

  Furthermore, when a printed circuit board whose position is to be grasped is specified and the CPU 30 determines that the electronic component mounting apparatus 1 is not in operation, it is next determined whether or not it has already been specified. Control is performed so as to perform skip setting not to mount the electronic component on the specified printed circuit board CB. It is determined whether or not it has already been specified. If it has not been specified, it is determined whether or not skip has already been set. If it has been set, control is performed to cancel this specification and the first or second positioning unit. Then, the skip setting for not mounting the electronic component on the printed circuit board is canceled and the process ends. Further, it is determined whether or not it has already been specified. If it has not been specified, it is determined whether or not skip has already been set. If it has not been set, control is performed to specify the printed circuit board CB, and the process ends.

  When the skip setting is performed as described above, control is performed so that electronic components are not mounted on the printed circuit board CB. However, when a printed circuit board whose position is to be grasped is designated, the above-described processing is performed based on FIG. As described above, the substrate conveyance is controlled. Note that when the skip setting is made, the designation of the printed circuit board is not canceled.

  That is, when the operation start switch portion of the touch panel switch 37 displayed on the monitor 36 is pressed, or when all electronic components are mounted on the printed circuit board CB in the first or second positioning portion, the CPU 30. Sends a conveyance start command to the drive motor of the supply conveyor 4 as a conveyance device, and conveyance of the printed circuit board CB is started.

  Then, after the conveyance of the printed circuit board CB is started and the electronic component is mounted on the printed circuit board CB that has reached the first or second positioning unit, the CPU 30 controls the electronic component mounting apparatus 1 to stop. It is determined whether or not the mode is the stop mode. If the mode is not the stop mode, the substrate is transferred, and the stored contents of the predetermined area of the RAM 32 serving as the substrate information memory are shifted to the right.

  In addition, the switch unit 40 corresponding to the printed circuit board CB whose position is described with reference to the flowchart of FIG. 6 is designated, and the “perform” switch unit 41 for selecting the designated substrate stop mode is pressed to change the designated substrate stop mode. If set, if the printed circuit board CB that has reached the most downstream position (discharge position) of the electronic component mounting apparatus 1 is not the designated printed circuit board CB, the contents stored in the predetermined area of the RAM 32 are sequentially placed to the right. Based on the stored contents, the CPU 30 sequentially turns the switch unit 40 to white and the downstream (right adjacent) switch unit 40 to gray every time the printed circuit board CB is conveyed. The operator can grasp where the substrate CB is.

  Then, when the electronic components are sequentially mounted in this way and the designated substrate stop mode is set, the printed substrate CB that has reached the most downstream position (discharge position) of the electronic component mounting apparatus 1 is designated. If it is CB, even if an electronic component is mounted on the printed circuit board CB that has reached the first or second positioning portion, the printed circuit board CB at this discharge position is supplied by the CPU 30 so that it is not discharged to the downstream device. The drive motor of the conveyor 4 is controlled.

  For each substrate transport operation, for example, every time the CPU 30 sends a transport start command to the drive motor of the supply conveyor 4, or every time the drive motor rotates by a predetermined number of rotations (detected by the encoder), the CPU 30 is stored in the substrate information memory. The stored contents of a predetermined area of a certain RAM 32 are shifted to the right side, and the position of the printed circuit board designated corresponding to this is displayed on the screen. However, the present invention is not limited to this. A substrate detection device may be provided at the position, and the position may be controlled to be displayed on the screen when the printed circuit board CB is detected.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the above-described alternatives, modifications, or modifications. It includes modifications.

It is a top view of an electronic component mounting apparatus. It is a control block diagram. It is a figure which shows the setting screen displayed on the monitor. It is a figure which shows the control flowchart of conveyance of a printed circuit board. It is a figure which shows the content of the board | substrate information memory. It is a figure which shows the flowchart which concerns on designation | designated of the printed circuit board which wants to grasp | ascertain a position, and skip setting.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Component supply unit 4 Supply conveyor 16 Mounting head 30 CPU
32 RAM
36 Monitor 37 Touch panel switch

Claims (4)

In the electronic component mounting apparatus, the electronic component is picked up from the component supply unit by a suction nozzle provided in the mounting head and mounted on the printed circuit board which is transported by the transport device and fixed at the positioning position. A display device that displays a position, a designation device that designates a printed circuit board for which the position of the plurality of printed circuit boards that flow in the conveyance device is to be grasped by an operation by an operator , and a printed circuit board designated by the designation device is the conveyance An electronic component mounting apparatus comprising: a control device that controls the display device to display a position moved and moved by the device. In the electronic component mounting apparatus, the electronic component is picked up from the component supply unit by a suction nozzle provided in the mounting head and mounted on the printed circuit board which is transported by the transport device and fixed at the positioning position. A display device that displays a position, a designation device that designates a printed circuit board for which the position of the plurality of printed circuit boards that flow in the conveyance device is to be grasped by an operation by an operator , and a printed circuit board designated by the designation device is the conveyance A first control device that controls the display device to display a position moved and moved by the device, and when a printed circuit board designated by the designated device is conveyed by the conveyance device and reaches a predetermined position Is provided with a second control device for controlling the transport device so as not to move in the downstream direction. That electronic component mounting apparatus. In the electronic component mounting apparatus, the electronic component is picked up from the component supply unit by a suction nozzle provided in the mounting head and mounted on the printed circuit board which is transported by the transport device and fixed at the positioning position. A display device that displays the position of the printed circuit board that is skipped so as not to mount an electronic component among the plurality of printed circuit boards that flow through the transfer device, and is designated by an operation by an operator. Specify the device and the printed circuit board specified during the operation of the electronic component mounting apparatus by the specified device if the printed circuit board is not already specified, and is not set to skip so as not to mount the electronic component, and The printed circuit board specified by the specified device was transported and moved by the transport device. An electronic component mounting apparatus characterized by comprising a control unit for controlling to display the location on the display device. In the electronic component mounting apparatus, the electronic component is picked up from the component supply unit by a suction nozzle provided in the mounting head and mounted on the printed circuit board which is transported by the transport device and fixed at the positioning position. The operator designates a printed circuit board that is set to be skipped so as not to mount an electronic component from among the plurality of printed circuit boards that flow in the conveying device and is to be grasped by an operator's operation . The designated device and the printed circuit board designated when the electronic component mounting device is not in operation by this designated device are designated and if the skip setting is not completed, and designated by the designated device. The position where the printed circuit board is transported and moved by the transport device is displayed on the display device. An electronic component mounting apparatus characterized by a provided a control for controlling apparatus as.

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