JP2006253457A - Method and device for assembling printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To conduct a predetermined operation in an operation device even when the size of a printed circuit board in its conveyance direction exceeds a limit. <P>SOLUTION: The electronic components of a step number 0001 of mounting data are not extracted in a mounting operation. The electronic components of the next step number 0002 are extracted, and since "C" and Date are "-", the mounting of the electronic components is carried out without changing the substrate positioning position. Since the X coordinates of the next step numbers 0003 to 0005 exceed the limit of the size of a printed circuit board S in its X direction, the electronic components of the next step numbers 0006 to 0013 are extracted and mounted, and then the mounting of those electronic components are carried out. Since the "C" of the next step number 0000 of the next development data is "L", and Date are "2"; the substrate positioning position is changed, its conveyance from the right to left hand and its positioning is carried out, substrate recognition is executed, and the electronic components of the next step numbers 0003 to 0005 are extracted and mounted. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  In the present invention, the printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, the positioning device positions in the conveyance direction, and the work head moves to a predetermined position on the printed circuit board designated for each work order of work data. The present invention relates to a printed circuit board assembly method and a printed circuit board assembly apparatus that perform a predetermined operation.

2. Description of the Related Art Conventionally, there is known a board positioning device that stops a board at a predetermined position that is a predetermined distance away from a position at which a board detection sensor detects a printed board during conveyance of the printed board (see Patent Document 1).
Specification and drawing of Japanese Patent Application No. 2003-297578

  However, in the electronic component mounting apparatus as a printed board assembly apparatus provided with the above-described board positioning apparatus, there is a limit to the size of the printed board that can be handled (size in the transport direction), so printing exceeding a certain length is possible. There was a problem that electronic components could not be mounted on the substrate.

  Accordingly, an object of the present invention is to provide a printed circuit board assembly method and a printed circuit board assembly apparatus that allow a work head to perform a predetermined operation even when the size in the transport direction of the printed circuit board exceeds the size that can be handled.

  Therefore, according to the first aspect of the present invention, the printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, and the positioning device is positioned in the conveyance direction, and is placed at a predetermined position on the printed circuit board designated for each work sequence of work data. In a printed circuit board assembly method in which a work head moves and performs a predetermined work, if the work head cannot perform a predetermined work on the printed circuit board positioned by the positioning device, the positioning position of the printed circuit board is changed. The work head is adapted to perform a predetermined work.

  According to a second aspect of the present invention, the printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, the positioning device positions in the conveyance direction, and the work head is placed at a predetermined position on the printed circuit board designated for each work order of work data. In the method of assembling a printed circuit board, the work head continuously performs the predetermined work within the movement range in the X and Y directions on the printed circuit board positioned by the positioning device, and thereafter performs the predetermined work. The work head is configured to change the positioning position of the printed circuit board to perform the work on the printed circuit board outside the range of movement which has not been performed.

  According to a third aspect of the present invention, the printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, the positioning device positions in the conveyance direction, and the work head is placed at a predetermined position on the printed circuit board designated for each work order of work data. In a printed circuit board assembly method in which a predetermined work is performed by moving the head, when the work head cannot perform a predetermined work on the printed circuit board positioned by the positioning device, the printed circuit board is transported again to a different position. The working head performs a predetermined work after positioning.

  According to a fourth aspect of the invention, the printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, and the positioning device positions in the conveyance direction, and the work head is placed at a predetermined position on the printed circuit board designated for each work order of work data. In the printed circuit board assembling method in which the work head moves to perform a predetermined work by moving the work head to a predetermined position on the printed circuit board designated for each work order of the work data, The printed circuit board is transported in a direction opposite to the normal transport direction and positioned, and when there is instruction data for the work head to perform a predetermined work, such a predetermined work is performed. To do.

  According to a fifth aspect of the present invention, the printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, the positioning device positions in the conveyance direction, and the work head is placed at a predetermined position on the printed circuit board designated for each work order of work data. In the printed circuit board assembling method in which the work head moves to perform a predetermined work by moving the work head to a predetermined position on the printed circuit board designated for each work order of the work data, When there is instruction data for changing the positioning position of the printed circuit board so that the work head performs a predetermined work, the predetermined work is performed in that way.

  According to a sixth aspect of the present invention, the printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, the positioning device positions in the conveyance direction, and the work head is placed at a predetermined position on the printed circuit board designated for each work order of work data. In the printed circuit board assembly method in which the robot moves and performs the specified work, the mounting of electronic components in the order specified by the mounting data or the tact priority mode that reduces the number of times of printed circuit board positioning as much as possible and shortens the printed circuit board finishing time When one of the order priority modes is selected and the tact priority mode is selected, the work head can continuously perform the predetermined work on the printed circuit board positioned by the positioning device, and thereafter The work head performs a work that could not be performed by changing the positioning position of the printed circuit board. When the mounting order priority mode is selected, the work head performs a predetermined operation on the printed circuit board positioned by the positioning device, and when the predetermined operation cannot be performed, the printed circuit board is positioned. The position is changed so that the work head performs a predetermined work.

  According to a seventh aspect of the present invention, the printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, the positioning device positions in the conveyance direction, and the work device is placed at a predetermined position on the printed circuit board designated for each work order of work data. In a printed circuit board assembly apparatus that performs predetermined work by moving the position of the printed circuit board, if the work apparatus cannot perform the predetermined work on the printed circuit board that has been positioned by the positioning apparatus, the positioning position of the printed circuit board is changed. Control means for controlling the work device to perform a predetermined work is provided.

  According to an eighth aspect of the present invention, the printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, the positioning device positions in the conveyance direction, and the work device is placed at a predetermined position on the printed circuit board designated for each work order of work data. In the printed circuit board assembly apparatus that moves and moves the predetermined work, the work apparatus can continuously perform the work that allows the work apparatus to perform the predetermined work on the printed circuit board that has been positioned by the positioning device. Control means for changing the positioning position of the printed circuit board so as to be performed by the working device is provided.

  According to a ninth aspect of the present invention, the printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, the positioning device positions in the conveyance direction, and the work device is placed at a predetermined position on the printed circuit board designated for each work order of work data. In a printed circuit board assembly apparatus that moves and moves a predetermined work, when the work apparatus cannot perform a predetermined work on the printed circuit board that has been positioned by the positioning device, the printed circuit board is moved in the opposite direction of the normal conveyance direction. And a control means for controlling the work device so as to perform a predetermined work.

  According to a tenth aspect of the present invention, there is provided a printed circuit board in which a printed circuit board is conveyed from a substrate supply conveyor unit to a substrate positioning unit, the positioning device performs positioning in the conveying direction, and the working device moves to a predetermined position on the printed circuit board to perform a predetermined operation. In the assembling apparatus, storage means for storing work data including position data for the work device to perform a predetermined work on the printed circuit board designated for each work order and instruction data for instructing a change of the positioning position, and the work order of the work data When there is the instruction data while the work apparatus moves to a predetermined position on the printed circuit board specified every time and performs the predetermined work, the positioning position is changed and transported in the direction opposite to the normal transport direction. Control means for controlling to perform positioning and performing a predetermined work is provided.

  In an eleventh aspect of the invention, the printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, the positioning device performs positioning in the conveyance direction, and the working device moves to a predetermined position on the printed circuit board to perform a predetermined operation. In the assembling apparatus, storage means for storing work data including position data for the work device to perform a predetermined work on the printed circuit board designated for each work order and instruction data for instructing a change of the positioning position, and the work order of the work data Control means for controlling to change the positioning position and perform the predetermined work when there is the instruction data while the work device moves to the predetermined position on the printed circuit board specified every time and performs the predetermined work. It is provided.

  According to a twelfth aspect of the present invention, a printed circuit board is transported from a substrate supply conveyor unit to a substrate positioning unit, the positioning device positions in the transport direction, and the working device moves to a predetermined position on the printed circuit board to perform a predetermined operation. In the assembly device, select either the tact priority mode that reduces the number of times the printed circuit board is positioned and shortens the printed circuit board finishing time, or the mounting order priority mode that mounts electronic components in the order specified by the mounting data. A printed circuit board that is positioned by the positioning device when the tact priority mode is selected by the selection unit; and a control unit that controls to execute the mode selected by the selection unit. On top of that, the work device can perform a predetermined work continuously and cannot perform the predetermined work after that. The work device performs the work by changing the positioning position of the printed circuit board. When the mounting order priority mode is selected, the work device performs a predetermined work on the printed circuit board positioned by the positioning device. When the predetermined work cannot be performed, the control means controls the position of the printed circuit board so that the working device performs the predetermined work.

  The present invention can provide a printed circuit board assembling method and a printed circuit board assembling apparatus that allow the working device to perform a predetermined operation even when the size in the transport direction of the printed circuit board exceeds the size that can be handled.

  There are an adhesive application device for applying an adhesive on a printed circuit board, an electronic component mounting device for mounting an electronic component on the printed circuit board, and the like as a printed circuit board assembly device. Here, a multifunctional chip mounter (electronic component mounting device) Will be described below with reference to the accompanying drawings.

  The mounter 1 is configured so that various electronic components can be mounted on the printed circuit board S. FIG. 1 is a plan view of the mounter 1. The mounter 1 includes a machine base 2, a substrate supply unit 3 that extends in the left-right direction at the center of the machine base 2, and a front part (lower side of the figure). ) And rear parts (upper side in the drawing) of the machine base 2 are prepared.

  In the component supply unit, for example, a tape cassette feeder 4a that supplies electronic components while being stored in a tape and a tray feeder 4b that supplies components while being stored in a tray are arbitrarily arranged. .

  Further, the machine base 2 includes a group of adjacent component supply units, for example, within a range of two tape cassette feeders 4a arranged at the front (lower side in the figure) of the machine base 2, and the rear part of the machine base 2. An X beam 5a that enables the first head unit 6a and the second head unit 6b to move in the X direction within the range of the tape cassette feeder 4a group and the tray feeder 4b arranged on the upper side of the figure, and the X beam 5a A pair of Y beams 5b that can move in the Y direction from the front part of the machine base 2 to the rear part of the machine base 2 with the substrate supply unit 3 interposed therebetween are prepared.

  A first head unit 6a and a second head unit 6b for picking up and mounting electronic components are mounted on the X beam 5a. Each head unit 6a, 6b is equipped with a mounting recognition head 9 equipped with a suction nozzle 7 (see FIG. 2) and a substrate recognition camera 9. A pair of component recognition cameras 10a and 10b and two nozzle stockers 11a and 11b are arranged on the machine base 2 with the board supply unit 3 interposed therebetween.

  Further, the printed circuit board S is supplied from the left side by the board supply unit 3, is fixedly set in the center of the machine base 2, and is discharged to the right side. Then, for example, when the first head unit 6a is used to mount the electronic components supplied from the two tape cassette feeders 4a arranged on the front part (the lower side in the figure) of the machine base 2 on the substrate S. explain.

  First, by moving the X beam 5a and the first head unit 6a, the suction nozzle 7 faces the desired tape cassette feeder 4a to suck the electronic components. Subsequently, in the course of moving the first head unit 6a in the direction of the printed circuit board, the electronic component sucked by the suction nozzle 7 faces the component recognition camera 10a (on the front side of the machine base 2) and picks up an image. Then, when the position is recognized by the recognition processing device 75 and the first head unit 6a is further moved to a predetermined position on the printed circuit board S to mount an electronic component on the printed circuit board S for the first time, the first head unit After the positioning mark M of the printed circuit board S is imaged by the circuit board recognition camera 9 mounted on 6a and the printed circuit board position is recognized by the recognition processing device 75, correction in the XYθ direction is performed based on these component recognition and board recognition results. The electronic component is mounted on the substrate S.

  As shown in FIG. 4, the substrate supply unit 3 includes a substrate positioning unit 21 disposed in the center, a substrate supply conveyor unit 22 connected to the left side of the substrate positioning unit 21, and a right side of the substrate positioning unit 21. It has the board | substrate discharge | emission conveyor part 23 which continues. The printed circuit board S is carried into the board positioning unit 21 from outside the apparatus by the board supply conveyor unit 22, and is fixedly set so as to receive the mounting of the electronic component by the positioning unit 21 and is not bent when mounting the component. Supported from below. Then, the printed circuit board S on which the mounting of the electronic components is completed is carried out of the apparatus from the board positioning unit 21 via the board discharge conveyor unit 23.

  By the way, an electronic component is mounted (mounted) on the substrate S positioned by the substrate positioning unit 21. At this time, a back-up pin 13 (see FIG. 2) described later from the back side of the substrate to prevent the substrate S from being bent. To support this. The printed circuit board S has a different arrangement depending on its size and thickness, whether there is a front part on the back side, and so on. Are rearranged so that they are arranged appropriately.

  Hereinafter, the substrate positioning unit 21 will be described with reference to FIGS. 2 and 3. The substrate positioning unit 21 moves the movable side substrate introduction table 31b back and forth according to the width of the printed substrate S to be introduced, and the fixed side substrate introduction table 31a and the movable side substrate introduction table 31b that respectively support the front and rear side ends of the substrate S. An introduction table moving device (not shown) that advances and retreats in the direction, and receives the printed circuit board S from the substrate supply conveyor unit 22 and conveys the belt to a predetermined component mounting position on both the substrate introduction tables 31a and 31b, and mounting of electronic components A conveyor-type substrate transfer device 33 (conveyor rollers 33a and 33b and a belt 34, which will be described later) is provided to convey the completed printed circuit board S from the component mounting position to the substrate discharge conveyor unit 23. Reference numeral 39 denotes an air cylinder, which is positioned in the width direction of the printed board S that has been carried into the board supply unit 3 by the operation of the air cylinder 39.

  Further, the substrate positioning unit 21 is configured such that the vertical movement lever 37 is moved up and down via an urging body (for example, a spring 36) by the operation of the air cylinder 35 fixed to the substrate introduction bases 31a and 31b. The substrate S can be brought into and out of contact with the conveyance level by the belt 34. That is, as shown in FIG. 3A, when the vertical movement lever 37 is moved downward, the substrate S is at the conveyance level position by the belt 34 and is conveyed downstream as the belt 34 is driven. . Further, as shown in FIG. 3B, when the vertical movement lever 37 is moved upward, the substrate S is transferred above the transfer level position, and therefore the substrate S is transferred by the belt 34. Freed from movement.

  Further, the substrate positioning unit 21 includes a large number of backup pins 13 that face and support the substrate S set at the positioning position from below, a backup table 14a in which a large number of backup pins 13 are erected, and a backup table 14a. And a backup pin lifting / lowering device 15 (see FIGS. 2 and 5) that lifts and lowers the backup pin 13 via the.

  The fixed-side substrate introduction table 31a and the movable-side substrate introduction table 31b are disposed so as to face each other, and the backup table 14a and the backup pin lifting / lowering device 15 are disposed below the substrate introduction tables 31a and 31b. It is arranged. The backup table 14a is formed in a substantially square shape in plan view, and a tweezer plate 14b for erecting the backup pin 13 is placed on the upper side of the backup table 14a. The backup pin 13 is mounted on the tweezer plate 14b. A large number of set holes for standing are formed.

  In the backup table 14a, the drive motor 16 is rotationally driven, the rotation is transmitted to the cam 18 via the belt 17, and the cam 18 is rotated so that the link body 19 in contact with the cam 18 is connected to the cam 18. Is swung along the outer peripheral diameter of the link body 19 and is moved up and down by being pushed up by the tip end portion 20 of the link body 19.

  On the other hand, the fixed-side substrate introduction table 31a has a “U” -shaped guide that guides the side end portion of the substrate S by an inner portion thereof and a conveyor roller 33a of the substrate transfer device 33 attached thereto. A groove 38 is formed. Similarly, the movable-side substrate introduction table 31b has a “U” -shaped guide that guides the side edge of the substrate S by the inner portion thereof and the conveyor roller 33a of the substrate transfer device 33 attached thereto. A groove 38 is formed. Further, an air cylinder 39 faces the guide groove 38 in the movable substrate introduction table 31b, so that the introduced substrate S can be pressed and fixed between the fixed substrate introduction table 31a.

  The substrate positioning unit 21 is provided with a first substrate detection sensor 40 and a second substrate detection sensor 41 (see FIG. 5), which are photosensors for detecting the printed circuit board S.

  Next, a control block diagram of the mounter 1 will be described with reference to FIG. Reference numeral 60 denotes a CPU as a control device that performs overall control of operations related to removal and mounting of electronic components of the mounter 1, 61 denotes a RAM (random access memory) as a storage device, and 62 denotes a ROM (read-only memory). ). The CPU 60 controls each drive source via the interface 63 and the drive circuit 64 for operations related to the removal and mounting of the electronic components of the mounter 1 according to the program stored in the ROM 62 based on the data stored in the RAM 61. Control.

  The RAM 61 stores mounting data including X coordinates, Y coordinates, mounting angles, component arrangement numbers in the tape cassette feeder 4a, etc. for each step number (mounting order), X size, Y size, and used suction nozzle for each electronic component. The part data including the number 7 is stored.

  Reference numeral 65 denotes an operation unit, which is a numeric keypad 66 for keying in numbers, a cursor key 67, a SET key 68 for setting a mode, a teaching key 69 for setting the electronic component mounting apparatus to a teaching mode, and setting the apparatus to an automatic operation mode. An automatic key 70 for turning the apparatus into a manual operation mode, a start key 72, an operation key 73, and a stop key 74.

  A recognition processing device 75 is connected to the CPU 60 via the interface 63. The recognition processing device 75 performs recognition processing of images captured by the component recognition cameras 10 a and 10 b and the board recognition camera 9. The processing result is sent to the CPU 60. That is, the CPU 60 outputs an instruction to the recognition processing device 75 so as to perform recognition processing (calculation of misalignment amount) on the images captured by the component recognition cameras 10a and 10b and the board recognition camera 9, and the recognition processing result. It is received from the recognition processing device 75.

  That is, when the amount of positional deviation is grasped by the recognition processing of the recognition processing device 75, the result is sent to the CPU 60, and the CPU 60 moves the X beam 5a in the Y direction by driving the Y axis motor 77 and the X axis motor. The first head unit 6a or the second head unit 6b is moved in the X direction by driving 76, and is rotated by θ by the pulse motor 78 to correct the rotational angular position about the X, Y direction and the vertical axis. Is.

  The recognition processing device 75 captures images captured by the component recognition cameras 10a and 10b and the board recognition camera 9, and the captured image is displayed on the CRT 79. The CRT 79 is provided with various touch panel switches 80, and the operator can perform various settings including settings for teaching designation by operating the touch panel switch 80.

  Reference numerals 81, 82, and 83 denote servo motors that drive the conveyors of the substrate supply conveyor unit 22, the substrate positioning unit 21, and the substrate discharge conveyor unit 23. The servo motors 81, 82, and 83 operate the conveyors on the conveyors. The printed board S is conveyed by a belt. The servo motors 81, 82, 83 are position-controllable motors, but instead of the servo motors, for example, pulse motors may be used.

  Basic data regarding the operation of the servo motors 81, 82, and 83 is stored in the ROM 52 in order to prevent rewriting. It should be noted that the basic data may be stored in the RAM 51 so that it can be rewritten according to the user's request. In addition to the basic data specified by the manufacturer, a data area that can be rewritten (arbitrarily set) according to the user's request may be provided in the RAM 51.

  Here, the basic data is motor drive waveform data, and as the basic data, for example, motor self-start data A, maximum speed data, acceleration / deceleration (tilt) data, and transport distance data are set. . Thereby, the conveyance time concerning one conveyance is specified.

  The CPU controls the servo motors 81 and 82 so that the second board detection sensor 41 detects the printed board S and stops at a target stop position that the printed board S has advanced a predetermined distance. A predetermined distance, that is, a positioning offset value is stored in the RAM 61. Further, when the printed board S is moved by the encoder (not shown) by the predetermined distance, the servo motors 81 and 82 are controlled to be stopped by the detection output from the encoder.

  Here, the mounting data of the printed circuit board S as shown in FIG. 9, that is, the electronic components supplied from the tape cassette feeder 4a installed at which arrangement number (F) for each mounting order are represented by the X coordinate position (X) and When an electronic component is mounted on the printed circuit board S based on mounting data for mounting at the Y coordinate position (Y), as shown in FIG. Since the size of the printed circuit board S that can be handled at 21 exceeds 460 mm in the X direction, an area that cannot be mounted at the positioning position X (an electronic component that can be mounted at the positioning position Y and that has step numbers 0003 to 0005), a positioning position X, and Area that can be mounted even at Y (step numbers 0006 to 0008, 0010 to 0012), area that cannot be mounted at the positioning position Y (position In the fixed position X, there are step numbers 0001, 0002, and 0009) that can be mounted, and in order to mount in any area, the tact priority mode that shortens the printed circuit board finishing time by reducing the number of times of printed circuit board positioning as much as possible. The selection operation for selecting the mounting order priority mode for mounting electronic components in the order specified by the mounting data will be described.

  First, the touch panel switch 80 displayed on the CRT 79 is operated to display a mode selection screen as shown in FIG. 10, and when the tact priority mode switch section 80A is pressed, the tact priority mode is selected and the mounting order priority mode switch section. When the user presses 80B, the mounting order priority mode is selected, and when the optimization execution switch unit 80C is further operated, the selected mode is set, and optimization is executed based on the mounting data. In this case, when the tact priority mode is selected, the CPU 60 creates the development data A shown in FIG. 11 based on the mounting data so as to reduce the number of times the printed circuit board is positioned, and the mounting order priority mode is selected. In FIG. 12, the development data B shown in FIG.

  This development data is composed of a step number, C, and Data, and sequence processing is performed in order from the top of this development data. When “C” is “L”, this means that the substrate positioning position is changed. The data to be positioned is determined by “1” or [2]. That is, in the case of “1”, the printed board S is transported and positioned from the left to the right in the board positioning unit 21, and in the case of “2”, after the printed board S is transported from the left to the right, In the substrate positioning part 21, the positioning is performed by returning from the right to the left.

  Next, the operation of this production operation will be described below based on the production operation flowchart shown in FIG. If the production operation for pressing the automatic key 70 and the start key 72 is started and the printed circuit board S is not carried into the board supply conveyor unit 22, it waits to be carried in from the upstream device, and if it is carried in, the printing is performed. The conveyance of the substrate S is started. That is, the CPU 60 issues a drive signal to the servo motors 81 and 82 of the substrate supply conveyor unit 22 and the substrate positioning unit 21 via the interface 63 and the drive circuit 64 based on the operation signals from the automatic key 70 and the start key 72. Then, the conveyance of the printed circuit board S is started.

  Then, when the tact priority mode is set in which the number of times of positioning the printed circuit board is reduced as much as possible to shorten the finishing time of the printed circuit board, the development data A shown in FIG. Therefore, the CPU 60 confirms the content of “C” of the expanded data A. In this case, since “C” of step number 0000 of development data A is “L” and Date is “1”, the board positioning position is changed (in this case, the meaning of determining the first positioning position) ), The substrate positioning unit 21 carries it from the left to the right for positioning. That is, since Date is “1”, the printed board S is positioned at the positioning position X shown in FIG.

  Therefore, when the CPU 60 drives the servo motors 81 and 82 of the board supply conveyor unit 22 and the board positioning unit 21 and the second board detection sensor 41 detects the printed board S, the CPU 60 moves the servo motors 81 and 82 to the second board. Control is performed so that the detection sensor 41 stops while decelerating to a position moved N mm after light shielding by the printed circuit board S (detection of the presence of the printed circuit board S). Note that a range surrounded by a dotted line of the printed circuit board S indicates a range in which an electronic component can be mounted.

  In this way, the printed board S is transferred from the board supply conveyor section 22 to the board positioning section 21 (see FIG. 5), and stops at a predetermined position in the board positioning section 21 through the state shown in FIG. (See FIG. 7).

  Subsequently, the air cylinder 39 is actuated to fix the printed circuit board S in the width direction and move the vertical movement lever 37 upward to raise the circuit board S (see FIG. 3B). Next, the backup pin lifting / lowering device 15 operates to raise the substrate to the mounting position and hold it horizontally. Then, in this positioned state, the CPU 60 moves the X beam 5a in the Y direction by driving the Y axis motor 77, and moves the first head unit 6a or the second head unit 6b in the X direction by driving the X axis motor 76. Then, the mounting head 8 is moved in the X and Y directions, the positioning mark M on the printed board S is imaged by the board recognition camera 9, and the recognition processing device 75 performs recognition processing.

  Then, the CPU 60 moves the first head unit 6a or the second head unit 6b in the XY direction so as to take out the electronic component having the step number 0001 of the mounting data, for example, above the tape cassette feeder 4a having the arrangement number “110”. To remove the electronic component.

  The electronic component taken out and held by the suction nozzle 7 is imaged by the component recognition camera 10a or 10b, recognized by the recognition processing device 75, and corrected by adding the substrate recognition processing result to the component recognition result. Then, the mounting operation of the electronic component by the mounting head 8 is performed.

  Next, the electronic component of step number 0002 of the mounting data is taken out and recognized, and since “C” and Date are “−”, mounting is performed without changing the substrate positioning position. , 0004 and 0005 have an X coordinate exceeding 460 mm, which is the size of the printed board S in the X direction, that is, electrons outside the mountable range due to movement of the mounting head 8 surrounded by the dotted line of the printed board S in the XY direction. Since it is a position where the component cannot be mounted, and mounting of the electronic components of step numbers 0003, 0004, and 0005 is set after the electronic component of step number 0013 as shown in the development data A of FIG. The electronic component of step number 0006, which can be mounted without changing the positioning position, is taken out, recognized, and mounted. .

  Thereafter, the electronic components are similarly taken out, recognized, and mounted until the step numbers 0007 to 0013 where the X coordinate does not exceed 460 mm. Then, since “C” of step number 0000 of the next development data is “L” and Date is “2”, the substrate positioning position is changed, and the substrate positioning unit 21 carries it from the right to the left for positioning. do. However, the CPU 60 drives the servo motor 82 of the board positioning unit 21 to convey it to the right and stop it when the first board detection sensor 40 no longer detects the presence of the printed board S, and then drives it to reverse. The first substrate detection sensor 40 detects the presence of the printed circuit board S (shielded by the printed circuit board S) and then controls to stop while decelerating to a position moved N mm.

  Therefore, when the printed circuit board S is positioned at the positioning position Y and the positioning is confirmed (confirmed by the encoder), the board recognition is executed. That is, in this positioned state, the CPU 60 moves the first head unit 6a or the second head unit 6b in the X and Y directions, images the positioning mark M on the printed board S by the board recognition camera 9, and recognizes the recognition processing device 75. Recognize and process.

  Then, the first head unit 6a or the second head unit 6b is moved in the X and Y directions, the electronic components are taken out from the corresponding tape cassette feeder 4a or tray feeder 4b, subjected to component recognition processing, and mounted on the printed circuit board S. To do. In this case, the X coordinates of the aforementioned step numbers 0003, 0004 and 0005 exceed the 460 mm which is the size in the X direction of the printed board S which can be handled, but as described above, it could not be mounted at the positioning position X of the printed board S. Since the electronic component is changed to the positioning position Y, as shown in FIG. 15, the electronic component can be mounted because it is within the range surrounded by the dotted line of the printed circuit board S. The step numbers 0003, 0004 and 0005 Takes out electronic components, performs component recognition processing and mounting.

  In this case, the electronic component picked up and held by the suction nozzle 7 is imaged by the component recognition camera 10a or 10b, recognized by the recognition processing device 75, and the substrate recognition processing result is added to the component recognition result. The electronic component is mounted by the mounting head 8 after correction.

  Next, the process moves to a work for carrying out the printed circuit board S after all the electronic parts have been mounted. In this case, the air cylinder 39 is actuated to lower the substrate S at the mounting work level to the transport level by the conveyor. And the board | substrate S is conveyed to the board | substrate discharge conveyor part 23 side by the conveyor drive of the board | substrate positioning part 21 and the board | substrate discharge conveyor part 23. FIG. Thereafter, the board transfer operation and the component mounting operation are repeated in the same manner.

  Next, when the mounting order priority mode for mounting electronic components in the order specified by the mounting data is set, the development data B shown in FIG. 12 created based on the mounting data is stored in the RAM 61. Therefore, the electronic component is taken out, component recognition processing and mounting are performed while the printed circuit board S is positioned according to this.

  That is, for the electronic components of step numbers 0001 and 0002 whose X coordinate does not exceed 460 mm, the electronic components are placed on the printed circuit board S which is conveyed from the left to the right and positioned at the positioning position X in the substrate positioning unit 21. After mounting, the 0000 “C” next to the step number 0002 is “L”, the Date is “2”, and the mounting positions of the electronic components from the step numbers 0003 to 0006 are out of the moving range of the mounting head 8. Since the electronic components up to step numbers 0003 to 0006 can no longer be mounted, the board positioning position is changed to the positioning position Y, and the board positioning unit 21 transports it from the right to the left, and the print positioned as described above. Electronic components of step numbers 0003 to 0008 are mounted on the substrate S, and then step number 000 Next, “C” of 0000 is “L”, Date is “1”, and the mounting positions of the electronic components up to step numbers 0009 to 0012 are out of the movement range of the mounting head 8 until the step numbers 0009 to 0012 are reached. Since the electronic component cannot be mounted, the board positioning position is changed to the positioning position X, and the board positioning unit 21 carries the board from the left to the right, and the step number 0009 is placed on the printed board S positioned as described above. Electronic parts up to 0012 are mounted.

  As described above, the electronic components up to step numbers 0006 to 0008 whose X coordinate exceeds 460 mm as well as step numbers 0006 to 0008 that do not exceed 460 mm are conveyed and positioned from the right to the left by the board positioning unit 21. As shown in FIG. 12, the mounting positions of the electronic components up to step numbers 0006 to 0008 are within the range where mounting is possible at any of the positioning positions X or Y of the printed circuit board S. This is for mounting without changing the substrate positioning position.

  As described above, in the mounting order priority mode, there is a possibility that the number of times of changing the substrate positioning position may be two times or more. However, in the tact priority mode, the number is changed to one, and as a result, it takes to finish one printed circuit board. The time can be shortened, and the mounting order priority mode can be selected, the electronic components can be actually mounted, and the mounting time can be compared with the tact priority mode.

  In addition, the tact priority mode or the mounting order priority mode can be selected by a personal computer (personal computer) provided separately from the mounter. The development data B may be created and sent to the mounter, or the mounter may perform an electronic component mounting operation based on the sent development data A or development data B.

  In the present embodiment, an example in which the present invention is applied to the mounter 1 is introduced. However, the present invention is not limited to this, and can be applied to various apparatuses having a substrate transport mechanism.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

It is a top view of a mounter. It is a side view of a mounter. It is a side view of the principal part of a board | substrate positioning part. It is a front view of a board | substrate conveyance apparatus. It is operation | movement explanatory drawing for showing the transfer operation from a board | substrate supply conveyor part to a board | substrate positioning part. It is operation | movement explanatory drawing for showing the transfer operation from a board | substrate supply conveyor part to a board | substrate positioning part. It is operation | movement explanatory drawing for showing the transfer operation from a board | substrate supply conveyor part to a board | substrate positioning part. It is a control block diagram. It is a figure which shows mounting data. It is a figure which shows a mode selection screen. It is a figure which shows the expansion | deployment data A. It is a figure which shows the expansion | deployment data B. It is a figure which shows the flowchart of a production driving | operation. It is a top view of the board | substrate positioning part which shows the positioning position X of a printed circuit board. It is a top view of the board | substrate positioning part which shows the positioning position Y of a printed circuit board. It is a figure which shows each mounting area of a printed circuit board.

Explanation of symbols

6a, 6b Head unit 7 Suction nozzle 8 Mounting head 21 Substrate positioning unit 22 Substrate supply conveyor unit 40 First substrate detection sensor 41 Second substrate detection sensor 60 CPU
61 RAM
81, 82 Servo motor

Claims (12)

  The printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, and the positioning device performs positioning in the conveyance direction, and the work head moves to a predetermined position on the printed circuit board specified for each work data work sequence, and a predetermined work is performed. In the method of assembling a printed circuit board, when the work head cannot perform a predetermined work on the printed circuit board in a state of being positioned by the positioning device, the position of the printed circuit board is changed so that the work head performs the predetermined work. A printed circuit board assembling method characterized by the above.   The printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, and the positioning device performs positioning in the conveyance direction, and the work head moves to a predetermined position on the printed circuit board specified for each work data work sequence, and a predetermined work is performed. In the printed circuit board assembly method, the work head continuously performs a predetermined work in the movement range in the XY directions on the printed circuit board positioned by the positioning device, and thereafter the predetermined range of the movement range in which the predetermined work cannot be performed. A printed circuit board assembly method, wherein the work head performs an operation on an external printed circuit board by changing a positioning position of the printed circuit board.   The printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, and the positioning device performs positioning in the conveyance direction, and the work head moves to a predetermined position on the printed circuit board specified for each work data work sequence, and a predetermined work is performed. In the method of assembling a printed circuit board, when the work head cannot perform a predetermined operation on the printed circuit board positioned by the positioning device, the printed circuit board is transported again to a different position and positioned to perform the operation. A printed circuit board assembly method, wherein the head performs a predetermined operation.   The printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, and the positioning device performs positioning in the conveyance direction, and the work head moves to a predetermined position on the printed circuit board specified for each work data work sequence, and a predetermined work is performed. In the printed circuit board assembly method, the work head moves to a predetermined position on the printed circuit board designated for each work order of the work data and performs a predetermined work. A printed circuit board assembling method characterized in that when there is instruction data for carrying out a predetermined work by carrying and positioning in a direction opposite to the carrying direction, such a predetermined work is carried out.   The printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, and the positioning device performs positioning in the conveyance direction, and the work head moves to a predetermined position on the printed circuit board specified for each work data work sequence, and a predetermined work is performed. In the printed circuit board assembling method, the positioning position of the printed circuit board is used as the work data content while the work head moves to a predetermined position on the printed circuit board designated for each work order of the work data and performs a predetermined work. A printed circuit board assembling method characterized in that when there is instruction data for the work head to carry out a predetermined work by changing the above, such a predetermined work is carried out.   The printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, and the positioning device performs positioning in the conveyance direction, and the work head moves to a predetermined position on the printed circuit board specified for each work data work sequence, and a predetermined work is performed. In the printed circuit board assembly method, either the tact priority mode that reduces the number of times the printed circuit board is positioned to shorten the printed circuit board finish time or the mounting order priority mode that mounts electronic components in the order specified by the mounting data When the tact priority mode is selected, the work head can continuously perform the predetermined work on the printed circuit board positioned by the positioning device, and the predetermined work cannot be performed thereafter. The work head performs work by changing the positioning position of the printed circuit board, When the arrival order priority mode is selected, the work head performs a predetermined operation on the printed circuit board positioned by the positioning device, and changes the positioning position of the printed circuit board when the predetermined operation cannot be performed. A printed circuit board assembly method, wherein the work head performs a predetermined work.   The printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, and the positioning device performs positioning in the conveyance direction, and the work head moves to a predetermined position on the printed circuit board specified for each work data work sequence, and a predetermined work is performed. In the printed circuit board assembly apparatus that performs the above-described operation, when the work head cannot perform a predetermined work on the printed circuit board that has been positioned by the positioning device, the work head performs a predetermined work by changing the positioning position of the printed circuit board. A printed circuit board assembly apparatus, characterized by comprising control means for performing control.   The printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, and the positioning device performs positioning in the conveyance direction, and the work head moves to a predetermined position on the printed circuit board specified for each work data work sequence, and a predetermined work is performed. In the printed circuit board assembly apparatus that performs the above-described operation, the work head can continuously perform the work that allows the work head to perform a predetermined work on the printed circuit board that has been positioned by the positioning device, and the work that cannot be performed after the work can be performed. A printed circuit board assembly apparatus, characterized in that control means is provided for controlling the work head so that the work head is changed.   The printed circuit board is conveyed from the substrate supply conveyor unit to the substrate positioning unit, and the positioning device performs positioning in the conveyance direction, and the work head moves to a predetermined position on the printed circuit board specified for each work data work sequence, and a predetermined work is performed. In the printed circuit board assembly apparatus that performs the above, when the work head cannot perform a predetermined operation on the printed circuit board that has been positioned by the positioning device, the printed circuit board is transported in a direction opposite to the normal transport direction. A printed circuit board assembly apparatus, characterized by comprising control means for positioning and controlling the work head to perform a predetermined work.   In a printed circuit board assembly apparatus in which a printed circuit board is conveyed from a substrate supply conveyor unit to a substrate positioning unit, the positioning device performs positioning in the conveyance direction, and the work head moves to a predetermined position on the printed circuit board to perform a predetermined operation. Work data comprising position data for the work head to perform a predetermined work on the designated printed circuit board and instruction data for instructing a change in positioning position, and a print designated for each work order of the work data When there is the instruction data while the work head moves to a predetermined position on the substrate and performs the predetermined work, the positioning position is changed and the work is moved in the direction opposite to the normal transport direction to perform the predetermined work. And a control means for controlling the printed circuit board.   In a printed circuit board assembly apparatus in which a printed circuit board is conveyed from a substrate supply conveyor unit to a substrate positioning unit, the positioning device performs positioning in the conveyance direction, and the work head moves to a predetermined position on the printed circuit board to perform a predetermined operation. Work data comprising position data for the work head to perform a predetermined work on the printed circuit board designated for each time and instruction data for instructing a change of the positioning position, and a print designated for each work order of the work data And a control means for controlling to perform the predetermined work by changing the positioning position when the instruction data is present while the work head moves to a predetermined position on the substrate and performs the predetermined work. Printed circuit board assembly device. In a printed circuit board assembly apparatus in which a printed circuit board is conveyed from a substrate supply conveyor unit to a substrate positioning unit, a positioning device performs positioning in the conveying direction, and a work head moves to a predetermined position on the printed circuit board to perform a predetermined operation. The selection means to select either the tact priority mode that reduces the number of positioning times as much as possible to shorten the finish time of the printed circuit board or the mounting order priority mode that mounts electronic components in the order specified by the mounting data. Control means for controlling to execute the mode selected by the means, and when the tact priority mode is selected by the selection means, the working head is placed on the printed circuit board positioned by the positioning device. The work that can perform the predetermined work is performed continuously, and the work that cannot be performed after that is performed The work head performs the work by changing the positioning position of the lint substrate, and when the mounting order priority mode is selected, the work head performs a predetermined work on the printed circuit board positioned by the positioning device. The printed circuit board assembly apparatus, wherein when the predetermined work cannot be performed, the control means controls the position of the printed circuit board to be changed and the work head to perform the predetermined work.

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