JP2006229095A - Board positioning device and board positioning method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To position a print board to stop it at a given board positioning position. <P>SOLUTION: A board recognizing camera captures an image of a positioning mark M on a print board S stopping at a given position on a board positioning unit 21, and a recognizing processor recognizes the position of the board S. A CPU calculates a shift quantity between a position of the board S that is detected by a board detecting sensor 41 and a position of the board S that is separated by a given distance from the detected position given by the sensor 41 on the basis of a recognition result given by the recognizing processor. When the CPU determines that the number of processed boards has reached a preset feedback number; the CPU calculates the average of respective shift quantities, multiplies the average by a given feedback factor to calculate a feedback value, adds and deducts an offset value to and from the feedback value to calculate a new offset value, and stores the new offset value in a RAM. The CPU then controls a motor of the board positioning unit 21 upon carrying out production operation on the basis of the stored new offset value. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate positioning apparatus and a substrate positioning method for conveying a printed board from a substrate supply conveyor unit to a substrate positioning unit to perform positioning in the conveyance direction.

2. Description of the Related Art Conventionally, there is known a board positioning device that stops a board at a predetermined position that is a predetermined distance away from a position at which a board detection sensor detects a printed board during conveyance of the printed board (see Patent Document 1).
Specification and drawing of Japanese Patent Application No. 2003-297578

  However, in the above-described conventional technology, it is difficult to stop at the predetermined position due to the weight of the printed circuit board, the frictional resistance between the conveyance belt and the printed circuit board, or the like. For example, if the printed circuit board stops at a position that is significantly different from a predetermined position, a substrate recognition error occurs, and a recovery operation by an operator such as an alignment operation is required, which hinders printed circuit board production.

  SUMMARY OF THE INVENTION An object of the present invention is to make it possible to stably stop a printed circuit board at a predetermined board positioning position as much as possible.

For this reason, according to the first aspect of the present invention, there is provided a board detection sensor for detecting a printed board conveyed by driving motors capable of controlling positions of the board supply conveyor section and the board positioning section, and the board detection sensor detects the printed board. Control means for controlling the motor of the board positioning unit so as to stop at a target stop position separated by a predetermined distance based on the offset value stored in the storage means from the position where the printed board is moved from the board supply conveyor unit. In the substrate positioning device that transports to the substrate positioning unit and positions in the transport direction,
A recognition processing device for recognizing the position of the printed circuit board by imaging a positioning mark attached on the printed circuit board stopped by the substrate positioning unit;
First calculation means for calculating a deviation amount between the actual stop position of the printed circuit board and the target stop position based on the recognition result of the recognition processing device;
Determining means for determining whether or not the number of substrates processed by the recognition processing apparatus has reached a set number of feedbacks;
A second calculating unit that calculates an average value of the respective deviation amounts when the determining unit determines that the predetermined number of feedbacks has been reached;
Third calculation means for calculating a feedback value by multiplying the average value calculated by the second calculation means by a predetermined feedback coefficient;
Fourth calculation means for calculating a new offset value by adding or subtracting the feedback value calculated by the third calculation means to the offset value;
Control means for controlling the motor of the substrate positioning unit during production operation based on the new offset value calculated by the fourth calculation means.

According to a second aspect of the present invention, there is provided a substrate detection sensor for detecting a printed board conveyed by driving a motor capable of controlling positions of the board supply conveyor unit and the board positioning unit, and a position at which the board detection sensor detects the printed board. Control means for controlling the motor of the board positioning unit to stop at a target stop position separated by a predetermined distance based on the offset value stored in the storage means, and positioning the printed board from the board supply conveyor unit. In the substrate positioning method for transporting to the part and positioning in the transport direction,
The board recognition camera images the positioning mark attached on the printed board stopped by the board positioning unit, and the recognition processing device recognizes the position of the printed board,
Based on the recognition result of the recognition processing device, the first calculation means calculates a deviation amount between the actual stop position of the printed circuit board and the target stop position,
The judging means judges whether or not the number of recognized substrates has reached the set number of feedbacks,
When the determination means determines that the predetermined number of feedbacks has been reached, the second calculation means calculates the average value of the deviation amounts,
The third calculation means calculates the feedback value by multiplying the average value calculated by the second calculation means by a predetermined feedback coefficient,
The fourth calculation means calculates a new offset value by adding / subtracting the feedback value calculated by the third calculation means to / from the offset value,
The control means controls the motor of the substrate positioning unit during the production operation based on the new offset value calculated by the fourth calculation means.

  According to a third invention, in the invention relating to the first or second substrate positioning device or the substrate positioning method, the number of feedback sheets can be set by a setting device.

  According to a fourth invention, in the invention relating to the first or second substrate positioning device or the substrate positioning method, the feedback coefficient can be set by a setting device.

  According to the present invention, the stop position of the printed circuit board can be stopped at a predetermined position as much as possible. Therefore, it is difficult to stop at the above-mentioned predetermined position due to the weight of the printed circuit board or the frictional resistance between the conveyance belt and the printed circuit board. Although restoration work by the operator such as the alignment operation is required and the production of the printed circuit board has been hindered, such a problem can be solved.

  Hereinafter, an embodiment in which a substrate transfer device and a substrate transfer method of the present invention are applied to a substrate transfer mechanism of a multi-function chip mounter (electronic component mounting device) will be described with reference to the accompanying drawings.

  The mounter 1 is configured so that various electronic components can be mounted on the printed circuit board S. FIG. 1 is a plan view of the mounter 1. The mounter 1 includes a machine base 2, a substrate supply unit 3 that extends in the left-right direction at the center of the machine base 2, and a front part (lower side of the figure). ) And rear parts (upper side in the drawing) of the machine base 2 are prepared.

  In the component supply unit, for example, a tape cassette feeder 4a that supplies electronic components in a state of being stored in a tape and a tray feeder 4b that supplies components in a state of being stored in a tray are arbitrarily arranged. .

  Further, the machine base 2 includes a group of adjacent component supply units, for example, within a range of two tape cassette feeders 4a arranged at the front (lower side in the drawing) of the machine base 2 and the rear part of the machine base 2. An X beam 5a that allows the first head unit 6a and the second head unit 6b to move in the X direction within the range of the tape cassette feeder 4a group and the tray feeder 4b arranged on the upper side of the figure, and the X beam 5a A pair of Y beams 5b that can move in the Y direction from the front part of the machine base 2 to the rear part of the machine base 2 with the substrate supply unit 3 interposed therebetween are prepared.

  A first head unit 6a and a second head unit 6b for picking up and mounting electronic components are mounted on the X beam 5a. Each head unit 6a, 6b is equipped with a mounting recognition head 9 equipped with a suction nozzle 7 (see FIG. 2) and a substrate recognition camera 9. A pair of component recognition cameras 10a and 10b and two nozzle stockers 11a and 11b are arranged on the machine base 2 with the board supply unit 3 interposed therebetween.

  Further, the printed circuit board S is supplied from the left side by the board supply unit 3, is fixedly set in the center of the machine base 2, and is discharged to the right side. For example, when the first head unit 6a is used to mount the electronic components supplied from the two tape cassette feeders 4a arranged on the front part (the lower side in the figure) of the machine base 2 on the substrate S. explain.

  First, by moving the X beam 5a and the first head unit 6a, the suction nozzle 7 is made to face the desired tape cassette feeder 4a to suck the electronic components. Subsequently, in the course of moving the first head unit 6a in the direction of the printed circuit board, the electronic component sucked by the suction nozzle 7 faces the component recognition camera 10a (on the front side of the machine base 2) and picks up an image. Then, the position is recognized by the recognition processing device 75, the first head unit 6a is further moved to a predetermined position on the printed board S, and the printed board S is mounted by the board recognition camera 9 mounted on the first head unit 6a. After imaging the positioning mark M and causing the recognition processing device 75 to recognize the printed circuit board position, the electronic component is mounted on the substrate S by correcting in the XYθ directions based on the component recognition and the board recognition result.

  The substrate supply unit 3 includes a substrate positioning unit 21 disposed in the center, a substrate supply conveyor unit 22 connected to the left side of the substrate positioning unit 21, and a substrate discharge conveyor unit 23 connected to the right side of the substrate positioning unit 21. have. The printed circuit board S is carried into the board positioning unit 21 from outside the apparatus by the board supply conveyor unit 22, and is fixedly set so as to receive the mounting of the electronic component by the positioning unit 21 and is not bent when mounting the component. Supported from below. Then, the printed circuit board S on which the mounting of the electronic components is completed is carried out of the apparatus from the board positioning unit 21 via the board discharge conveyor unit 23.

  By the way, an electronic component is mounted (mounted) on the substrate S positioned by the substrate positioning unit 21. At this time, a back-up pin 13 (see FIG. 2) described later from the back side of the substrate to prevent the substrate S from being bent. To support this. The printed circuit board S has a different arrangement depending on its size and thickness, whether there is a front part on the back side, and so on. Are rearranged so that they are arranged appropriately.

  Hereinafter, the substrate positioning unit 21 will be described with reference to FIGS. 2 and 3. The substrate positioning unit 21 moves the movable side substrate introduction table 31b back and forth according to the width of the printed substrate S to be introduced, and the fixed side substrate introduction table 31a and the movable side substrate introduction table 31b that respectively support the front and rear side ends of the substrate S. An introduction table moving device (not shown) that advances and retreats in the direction, and receives the printed circuit board S from the substrate supply conveyor unit 22 and conveys the belt to a predetermined component mounting position on both the substrate introduction tables 31a and 31b, and mounting of electronic components A conveyor-type substrate transfer device 33 (conveyor rollers 33a and 33b and a belt 34, which will be described later) is provided to convey the completed printed circuit board S from the component mounting position to the substrate discharge conveyor unit 23. Reference numeral 39 denotes an air cylinder, which is positioned in the width direction of the printed board S that has been carried into the board supply unit 3 by the operation of the air cylinder 39.

  Further, the substrate positioning unit 21 is configured such that the vertical movement lever 37 is moved up and down via an urging body (for example, a spring 36) by the operation of the air cylinder 35 fixed to the substrate introduction bases 31a and 31b. The substrate S can be brought into and out of contact with the conveyance level by the belt 34. That is, as shown in FIG. 3A, when the vertical movement lever 37 is moved downward, the substrate S is at the conveyance level position by the belt 34 and is conveyed downstream as the belt 34 is driven. . Further, as shown in FIG. 3B, when the vertical movement lever 37 is moved upward, the substrate S is transferred above the transfer level position, and therefore the substrate S is transferred by the belt 34. Freed from movement.

  Further, the substrate positioning unit 21 includes a large number of backup pins 13 that face and support the substrate S set at the positioning position from below, a backup table 14a in which a large number of backup pins 13 are erected, and a backup table 14a. And a backup pin lifting / lowering device 15 (see FIGS. 2 and 5) that lifts and lowers the backup pin 13 via the.

  The fixed-side substrate introduction table 31a and the movable-side substrate introduction table 31b are disposed so as to face each other, and the backup table 14a and the backup pin lifting / lowering device 15 are disposed below the substrate introduction tables 31a and 31b. It is arranged. The backup table 14a is formed in a substantially square shape in plan view, and a tweezer plate 14b for erecting the backup pin 13 is placed on the upper side of the backup table 14a. The backup pin 13 is mounted on the tweezer plate 14b. A large number of set holes for standing are formed.

  In the backup table 14a, the drive motor 16 is rotationally driven, the rotation is transmitted to the cam 18 via the belt 17, and the cam 18 is rotated so that the link body 19 in contact with the cam 18 is connected to the cam 18. Is swung along the outer peripheral diameter of the link body 19 and is moved up and down by being pushed up by the tip end portion 20 of the link body 19.

  On the other hand, the fixed-side substrate introduction table 31a has a “U” -shaped guide that guides the side end portion of the substrate S by an inner portion thereof and a conveyor roller 33a of the substrate transfer device 33 attached thereto. A groove 38 is formed. Similarly, the movable-side substrate introduction table 31b has a “U” -shaped guide that guides the side edge of the substrate S by the inner portion thereof and the conveyor roller 33a of the substrate transfer device 33 attached thereto. A groove 38 is formed. Further, an air cylinder 39 faces the guide groove 38 in the movable substrate introduction table 31b, so that the introduced substrate S can be pressed and fixed between the fixed substrate introduction table 31a.

  The substrate positioning unit 21 is provided with a first substrate detection sensor 40 and a second substrate detection sensor 41 (see FIG. 5), which are photosensors for detecting the printed circuit board S.

  Next, a control block diagram of the mounter 1 will be described with reference to FIG. Reference numeral 60 denotes a CPU as a control device that performs overall control of operations related to removal and mounting of electronic components of the mounter 1, 61 denotes a RAM (random access memory) as a storage device, and 62 denotes a ROM (read-only memory). ). The CPU 60 controls each drive source via the interface 63 and the drive circuit 64 for operations related to the removal and mounting of the electronic components of the mounter 1 according to the program stored in the ROM 62 based on the data stored in the RAM 61. Control.

  The RAM 61 stores mounting data including X coordinates, Y coordinates, mounting angles, component arrangement numbers in the tape cassette feeder 4a, etc. for each step number (mounting order), X size, Y size for each electronic component, and used suction nozzle. The part data including the number 7 is stored.

  Reference numeral 65 denotes an operation unit, which is a numeric keypad 66 for keying in numbers, a cursor key 67, a SET key 68 for setting a mode, a teaching key 69 for setting the electronic component mounting apparatus to a teaching mode, and setting the apparatus to an automatic operation mode. An automatic key 70 for turning the apparatus into a manual operation mode, a start key 72, an operation key 73, and a stop key 74.

  A recognition processing device 75 is connected to the CPU 60 via the interface 63. The recognition processing device 75 performs recognition processing of images captured by the component recognition cameras 10 a and 10 b and the board recognition camera 9. The processing result is sent to the CPU 60. That is, the CPU 60 outputs an instruction to the recognition processing device 75 so as to perform recognition processing (calculation of misalignment amount) on the images captured by the component recognition cameras 10a and 10b and the board recognition camera 9, and the recognition processing result. It is received from the recognition processing device 75.

  That is, when the amount of positional deviation is grasped by the recognition processing of the recognition processing device 75, the result is sent to the CPU 60, and the CPU 60 moves the X beam 5a in the Y direction by driving the Y axis motor 77 and the X axis motor. The first head unit 6a or the second head unit 6b is moved in the X direction by driving 76, and is rotated by θ by the pulse motor 78 to correct the rotational angular position about the X, Y direction and the vertical axis. Is.

  The recognition processing device 75 captures images captured by the component recognition cameras 10a and 10b and the board recognition camera 9, and the captured image is displayed on the CRT 79. The CRT 79 is provided with various touch panel switches 80, and the operator can perform various settings including settings for teaching designation by operating the touch panel switch 80.

  Reference numerals 81, 82, and 83 denote servo motors that drive the conveyors of the substrate supply conveyor unit 22, the substrate positioning unit 21, and the substrate discharge conveyor unit 23. The servo motors 81, 82, and 83 operate the conveyors on the conveyors. The printed board S is conveyed by a belt. The servo motors 81, 82, 83 are position-controllable motors, but instead of the servo motors, for example, pulse motors may be used.

  Basic data regarding the operation of the servo motors 81, 82, and 83 is stored in the ROM 52 in order to prevent rewriting. It should be noted that the basic data may be stored in the RAM 51 so that it can be rewritten according to the user's request. In addition to the basic data specified by the manufacturer, a data area that can be rewritten (arbitrarily set) according to the user's request may be provided in the RAM 51.

  Here, the basic data is motor drive waveform data, and as the basic data, for example, motor self-start data A, maximum speed data, acceleration / deceleration (tilt) data, and transport distance data are set. . Thereby, the conveyance time concerning one conveyance is specified.

  Next, description will be made below based on the teaching flowchart according to the first embodiment shown in FIG. First, when the teaching key 69 and the start key 72 are pressed, conveyance of the printed circuit board S is started. That is, the CPU 60 issues a drive signal to the servo motors 81 and 82 of the board supply conveyor unit 22 and the board positioning unit 21 via the interface 63 and the drive circuit 64 based on operation signals from the teaching key 69 and the start key 72. Then, the conveyance of the printed circuit board S is started.

  When the first timer 85 starts measuring the time when the conveyance is started and the printed circuit board S is caught somewhere and the first circuit board detection sensor 40 does not detect the printed circuit board S before the time-out of the first timer 85, the CPU 60 Is controlled to display an error on the CRT 79 or other display device or alarm device. If the first substrate detection sensor 40 detects the printed circuit board S before the first timer 85 times out (see FIG. 5), the second and The third timers 86 and 87 start timing.

  After the second timer 86 has timed out, the CPU 60 controls the servo motors 81 and 82 to start deceleration via the interface 63 and the drive circuit 64, and decelerates to an arbitrary speed so as to maintain a constant speed. Control. Thereafter, if the printed circuit board S is caught and the second circuit board detection sensor 41 does not detect the printed circuit board S before the time-out of the third timer 87, the CPU 60 displays an error display on the CRT 79 or other display device or alarm device. When the second substrate detection sensor 41 detects the printed circuit board S before the third timer 87 times out (see FIG. 6), the CPU 60 moves the servo motors 81 and 82 to an arbitrary position. Control to stop while decelerating (see FIG. 7).

  That is, the CPU controls the servo motors 81 and 82 so that the printed circuit board S stops at a target stop position advanced by a predetermined distance after the second circuit board detection sensor 41 detects the printed circuit board S. A predetermined distance, that is, a positioning offset value is stored in the RAM 61 (see FIG. 13). Further, when the printed board S is moved by the encoder (not shown) by the predetermined distance, the servo motors 81 and 82 are controlled to be stopped by the detection output from the encoder.

  Thereafter, a board recognition camera (not shown) images a positioning mark M attached on the printed board S stopped at an arbitrary position of the board positioning unit 21, and the recognition processor 75 recognizes the image. The actual stop position of the printed circuit board S is recognized. Then, if the recognition result is before the position where the recognition position is set, a positive error (shift amount) is obtained, and if the recognition position is before the position where the recognition position is set, a negative error ( The CPU 60 calculates the displacement amount), and the CPU 60 stores the positioning offset value calculated based on the recognition result (the displacement amount of the positioning mark is equal to the displacement amount of the stop position of the substrate) in the RAM 61, and the printed circuit board. Used during actual production operation of S.

  Here, editing of data relating to the feedback data of the board positioning position of the printed board S will be described with reference to FIG. First, when the operator operates the touch panel switch 80 displayed on the CRT 79, the CPU 60 displays a substrate positioning feedback data setting screen shown in FIG. Then, the “position feedback number” switch unit 90 is pressed, the “5” key switch unit 91 is pressed, then the “position feedback coefficient” switch unit 92 is pressed, and the “5” key switch unit 91 is pressed. When the “0” key switch section 93 is pressed and the “ENT” key switch section 94 is operated, the position feedback number is set to five, for example, and the position feedback coefficient is set to 50%, for example, and stored in the RAM 61.

  In this way, it is possible to set the number of position feedback and the position feedback coefficient that match the operator's intention. Therefore, for example, if you want to correct the deviation amount of the stop position as soon as possible, set this number to a small number or a large coefficient, and minimize the effect of a large deviation amount with a small number of sheets to correct the offset value. If it is desired to stabilize the stop position even if it is applied, the number of sheets can be increased or the coefficient can be reduced to cope with it.

  Then, the sampling position of the printed board S in the board positioning unit 21 is sampled and extracted five times, and the CPU 60 calculates the average value of the deviation from the above-described positioning offset value, and the position feedback set to this average value. The result obtained by multiplying the coefficient by 50% is added to or subtracted from the above-described positioning offset value and rewritten as a new positioning offset value, and can be applied to the subsequent positioning and conveyance of the printed circuit board.

  Next, the operation related to the conveyance of the printed circuit board S during the production operation will be described below based on the production operation flowchart shown in FIGS. When the automatic key 70 and the start key 72 are pressed, conveyance of the printed circuit board S is started. That is, the CPU 60 issues a drive signal to the servo motors 81 and 82 of the substrate supply conveyor unit 22 and the substrate positioning unit 21 via the interface 63 and the drive circuit 64 based on the operation signals from the automatic key 70 and the start key 72. Then, the conveyance of the printed circuit board S is started.

  When the first timer 85 starts measuring the time when the conveyance is started and the printed circuit board S is caught somewhere and the first circuit board detection sensor 40 does not detect the printed circuit board S before the time-out of the first timer 85, the CPU 60 Is controlled to display an error on the CRT 79 or other display device or alarm device. If the first substrate detection sensor 40 detects the printed circuit board S before the time-out of the first timer 85, the second and third timers 86 and 86 87 starts timing.

  After the second timer 86 has timed out, the CPU 60 controls the servo motors 81 and 82 to start deceleration via the interface 63 and the drive circuit 64, and decelerates to an arbitrary speed so as to maintain a constant speed. Control. Thereafter, if the printed circuit board S is caught and the second circuit board detection sensor 41 does not detect the printed circuit board S before the time-out of the third timer 87, the CPU 60 displays an error display on the CRT 79 or other display device or alarm device. If the second substrate detection sensor 41 detects the printed circuit board S before the time-out of the third timer 87, the CPU 60 stops the servo motors 81 and 82 while the printed circuit board S decelerates to an arbitrary position. Control as follows.

  In this case, the CPU 60 reads and sets the positioning offset value obtained by the above teaching from the RAM 61, and controls the printed circuit board S to stop while decelerating to an arbitrary position during the production operation.

  In this way, the printed board S is transferred from the board supply conveyor section 22 to the board positioning section 21 and stops at a predetermined position in the board positioning section 21 and is positioned (see FIG. 7).

  Subsequently, the air cylinder 39 is actuated to fix the printed circuit board S in the width direction and move the vertical movement lever 37 upward to raise the circuit board S (see FIG. 3B). Next, the backup pin lifting / lowering device 15 operates to raise the substrate to the mounting position and hold it horizontally. Then, in this positioned state, the CPU 60 moves the X beam 5a in the Y direction by driving the Y axis motor 77, and moves the first head unit 6a or the second head unit 6b in the X direction by driving the X axis motor 76. Then, the mounting head 8 is moved in the X and Y directions, the positioning mark M on the printed board S is imaged by the board recognition camera 9, and the recognition processing device 75 performs recognition processing.

  The recognition processing result is used not only for mounting electronic components but also for rewriting the printed board positioning offset value. That is, the CPU 60 calculates the amount of deviation based on the recognition result, stores it as one of the samplings in the RAM 61, and increments the number of processed substrates by “1” by a counter (not shown).

  Since the count value of the counter is “1”, the number of processed substrates has not reached the position feedback number “5”, and the electronic components held by the suction nozzle 7 are detected by the component recognition cameras 10a and 10b. The image is picked up and recognized by the recognition processing device 75, and the component recognition result is corrected by adding the substrate recognition processing result, and the mounting operation of the electronic component by the mounting head 8 is performed.

  Next, the process moves to a work for carrying out the printed circuit board S after all the electronic parts have been mounted. In this case, the air cylinder 39 is actuated to lower the substrate S at the mounting work level to the transport level by the conveyor. And the board | substrate S is conveyed to the board | substrate discharge conveyor part 23 side by the conveyor drive of the board | substrate positioning part 21 and the board | substrate discharge conveyor part 23. FIG. Thereafter, the board transfer operation and the component mounting operation are repeated in the same manner.

  At this time, as described above, the positioning mark M on the printed circuit board S is imaged, the CPU 60 calculates the amount of deviation based on the recognition result recognized by the recognition processing device 75, and this is stored in the RAM 61 as one of the samplings. When the counter is incremented by “1” and the count value of the counter is “5” and the number of processed substrates reaches the position feedback number “5”, the CPU 60 causes the five shift amounts stored in the RAM 61 to be stored. The average value of is calculated. Then, the CPU 60 multiplies the average value by the set position feedback coefficient 50% to calculate a feedback value, and adds / subtracts the feedback value to / from the previous positioning offset value and rewrites it to the new positioning offset value. Store.

  Therefore, after that, the mounting operation of the electronic component by the mounting head 8 is performed based on the new positioning offset value. As described above, the positioning offset value is rewritten every five processed substrates, and the production is performed. Is continued. When the production ends, the latest positioning offset value is stored in the RAM 61, and when the production starts again, the latest positioning offset value is used.

  Accordingly, it is difficult to stop the printed circuit board at a predetermined position due to the weight of the printed circuit board or the frictional resistance between the conveyance belt and the printed circuit board. When the printed circuit board stops at a position significantly different from the predetermined position, the substrate recognition shown in FIG. If the substrate recognition mark M is located outside the area A, the substrate recognition is abnormal, and a recovery operation by an operator such as the alignment operation is required, which causes a problem in the production of the printed circuit board. Can be resolved.

  Also, calculate the feedback value by calculating the average value of the deviation amount of the set substrate processing number and the set position feedback coefficient, and rewrite the new positioning offset value by adding or subtracting this feedback value to the previous positioning offset value. As a result, it is possible to avoid a significant change in the offset value in response to a change in the amount of deviation (especially a large change in a small number of sheets) and to stabilize the stop position of the printed circuit board. . Also, when printed circuit boards with a large amount of deviation are continuous, correction of the offset value based only on the average value of the amount of deviation is large and the correction value is large. In some cases, the amount of stop position deviation increases, but this can be avoided as much as possible by using a feedback coefficient.

  In the present embodiment, an example in which the present invention is applied to the mounter 1 is introduced. However, the present invention is not limited to this, and can be applied to various apparatuses having a substrate transport mechanism.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

It is a top view of a mounter. It is a side view of a mounter. It is a side view of the principal part of a board | substrate positioning part. It is a front view of a board | substrate conveyance apparatus. It is operation | movement explanatory drawing for showing the transfer operation from a board | substrate supply conveyor part to a board | substrate positioning part. It is operation | movement explanatory drawing for showing the transfer operation from a board | substrate supply conveyor part to a board | substrate positioning part. It is operation | movement explanatory drawing for showing the transfer operation from a board | substrate supply conveyor part to a board | substrate positioning part. It is a control block diagram. It is a figure which shows a board | substrate positioning feedback data setting screen. It is a figure which shows the flowchart of teaching. It is a figure which shows the flowchart which concerns on board | substrate positioning. It is a figure which shows the flowchart of a production driving | operation. It is a top view of a board | substrate positioning part.

Explanation of symbols

22 substrate supply conveyor unit 21 substrate positioning unit 40 first substrate detection sensor 41 second substrate detection sensor 60 CPU
61 RAM
81, 82 Servo motor

Claims (4)

A board detection sensor for detecting a printed board conveyed by driving a motor capable of controlling the positions of the board supply conveyor section and the board positioning section, and the board detection sensor stored in the storage means from the position where the board detection sensor detected the printed board. Control means for controlling the motor of the board positioning unit to stop at a target stop position separated by a predetermined distance based on the offset value, and transporting the printed board from the board supply conveyor unit to the board positioning unit In the substrate positioning device for positioning in the direction,
A recognition processing device for recognizing the position of the printed circuit board by imaging a positioning mark attached on the printed circuit board stopped by the substrate positioning unit;
First calculation means for calculating a deviation amount between the actual stop position of the printed circuit board and the target stop position based on the recognition result of the recognition processing device;
Determining means for determining whether or not the number of substrates processed by the recognition processing apparatus has reached a set number of feedbacks;
A second calculating unit that calculates an average value of the respective deviation amounts when the determining unit determines that the predetermined number of feedbacks has been reached;
Third calculation means for calculating a feedback value by multiplying the average value calculated by the second calculation means by a predetermined feedback coefficient;
Fourth calculation means for calculating a new offset value by adding or subtracting the feedback value calculated by the third calculation means to the offset value;
A substrate positioning apparatus comprising: control means for controlling the motor of the board positioning portion during production operation based on the new offset value calculated by the fourth calculating means. A board detection sensor for detecting a printed board conveyed by driving a motor capable of controlling the positions of the board supply conveyor section and the board positioning section, and the board detection sensor stored in the storage means from the position where the board detection sensor detected the printed board. Control means for controlling the motor of the board positioning unit to stop at a target stop position separated by a predetermined distance based on the offset value, and transporting the printed board from the board supply conveyor unit to the board positioning unit In a substrate positioning method for positioning in a direction,
The board recognition camera images the positioning mark attached on the printed board stopped by the board positioning unit, and the recognition processing device recognizes the position of the printed board,
Based on the recognition result of the recognition processing device, the first calculation means calculates the amount of deviation between the actual stop position of the printed circuit board and the target stop position,
The judging means judges whether or not the number of recognized substrates has reached the set number of feedbacks,
When the determination means determines that the predetermined number of feedbacks has been reached, the second calculation means calculates the average value of the deviation amounts,
The third calculation means calculates the feedback value by multiplying the average value calculated by the second calculation means by a predetermined feedback coefficient,
The fourth calculation means calculates a new offset value by adding / subtracting the feedback value calculated by the third calculation means to / from the offset value,
A substrate positioning method, wherein the control means controls the motor of the substrate positioning portion during production operation based on the new offset value calculated by the fourth calculating means.   The substrate positioning apparatus or the substrate positioning method according to claim 1, wherein the number of feedback sheets can be set by a setting device. The substrate positioning apparatus or the substrate positioning method according to claim 1, wherein the feedback coefficient can be set by a setting device.

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