JP4405848B2 - Electronic component mounting method and electronic component mounting apparatus - Google Patents

Description

  The present invention supplies an electronic component from an arbitrary component supply unit among a plurality of component supply units to a component suction position, and sucks and removes the electronic component by a suction nozzle based on an offset value related to the component supply position. The present invention relates to an electronic component mounting apparatus that captures an image of an electronic component sucked by a suction nozzle and mounts it on a printed circuit board by performing a recognition process using a recognition processing device.

Before taking the electronic component from the component supply unit and mounting it on the printed circuit board, the electronic component picked up and held by the suction nozzle is imaged by the component recognition camera, and the suction position deviation information obtained by the recognition processing by the recognition processing device is obtained. Each component supply unit is reflected in the next suction (see, for example, Patent Document 1).
JP 2000-141174 A

  However, it is important to select an optimal offset value in order to increase the suction rate of electronic components. However, the method of feeding back the offset value with the correction value based on the recognition result is not sufficient. There wasn't. In particular, the correspondence in the correlation between the remaining amount of electronic components and the offset value in the component supply unit has been insufficient.

  In view of the above, an object of the present invention is to further stabilize the adsorption rate by sufficiently dealing with the correlation between the remaining amount of electronic components and the offset value in the component supply unit.

Therefore, according to the first aspect of the present invention, an electronic component is supplied from any component supply unit to a component suction position among a plurality of component supply units, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting method of imaging the electronic component sucked by the suction nozzle with the component recognition camera, performing the recognition processing by the recognition processing device and mounting the printed circuit board on the printed circuit board,
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Store and
It is determined whether the correlation is strong, based from the history of the stored said offset value on the correlation between the said offset value is updated with the number of remaining electronic components,
To the suction position of the next the component feeding unit in accordance with the offset value calculated in accordance with the approximate curve function based on the correlation between the offset value and the updated number of remaining electronic components when the correlation is determined to strong An electronic component supply operation is performed.

According to a second aspect of the present invention, an electronic component is supplied from an arbitrary component supply unit among a plurality of component supply units to a component suction position, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting method of imaging the electronic component sucked by the suction nozzle with the recognition camera and performing the recognition processing by the recognition processing device and mounting it on the printed circuit board,
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Store and
From this stored offset value history , determine the degree of correlation based on the correlation between the remaining number of electronic components and the updated offset value ,
Adsorption of the next the component feeding unit in accordance with the offset value calculated in accordance with the approximate curve function based on the correlation between the offset value and the updated number of remaining electronic components in the case of the correlation degree is determined to a certain level greater than The electronic component is supplied to the position.

According to a third aspect of the present invention, an electronic component is supplied from an arbitrary component supply unit among a plurality of component supply units to a component suction position, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting method of imaging the electronic component sucked by the suction nozzle with the recognition camera and performing the recognition processing by the recognition processing device and mounting it on the printed circuit board,
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Store and
From this stored offset value history , determine the degree of correlation based on the correlation between the remaining number of electronic components and the updated offset value ,
When it is determined that the degree of correlation is greater than or equal to the first reference value and less than or equal to the second reference value greater than the first reference value , the updated offset value and the remaining number of electronic components and the updated offset value and performing the feed operation of the electronic component to the pickup position of the next the component feeding unit follows the weighting of the offset value calculated according to a correlation curve based on the correlation between the.

According to a fourth aspect of the present invention, an electronic component is supplied from an arbitrary component supply unit among a plurality of component supply units to a component suction position, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting method of imaging the electronic component sucked by the suction nozzle with the recognition camera and performing the recognition processing by the recognition processing device and mounting it on the printed circuit board,
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Store and
From this stored offset value history , determine the degree of correlation based on the correlation between the remaining number of electronic components and the updated offset value ,
Characterized in that said performing supply operation of the electronic component to the pickup position of the next the component feeding units follow the updated the offset value when it is determined that the correlation degree is weak.

According to a fifth aspect of the present invention, an electronic component is supplied from an arbitrary component supply unit among a plurality of component supply units to a component suction position, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting device that images the electronic component sucked by the suction nozzle with the recognition camera, and that is recognized and processed by the recognition processing device and mounted on the printed circuit board,
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Storage means for storing;
Determining means for determining whether the correlation is stronger based on the correlation between the offset value and the updated remaining number of electronic components from the history of the stored the offset value to the storage means,
Following the component feeding units follow the offset value calculated in accordance with the approximate curve function based on the correlation between the remaining number and the updated offset value of the electronic component when the correlation is determined to strong by this judgment means And a control means for controlling the electronic component to be supplied to the suction position.

According to a sixth aspect of the present invention, an electronic component is supplied from an arbitrary component supply unit among a plurality of component supply units to a component suction position, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting device that images the electronic component sucked by the suction nozzle with the recognition camera, and that is recognized and processed by the recognition processing device and mounted on the printed circuit board,
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Storage means for storing;
Determination means for determining a correlation between the degree of this based on the correlation between the offset value and the updated remaining number of electronic components from the history of the stored the offset value to the storage means,
If it is determined by the determination means that the degree of correlation exceeds a certain level , the next corresponding component according to the offset value calculated according to the approximate curve function based on the correlation between the remaining number of electronic components and the updated offset value Control means for controlling the electronic component to be supplied to the suction position of the supply unit is provided.

According to a seventh aspect of the present invention, an electronic component is supplied from an arbitrary component supply unit among a plurality of component supply units to a component suction position, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting device that images the electronic component sucked by the suction nozzle with the recognition camera, and that is recognized and processed by the recognition processing device and mounted on the printed circuit board,
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Storage means for storing;
Determining means for determining the degree of correlation based on the correlation between the remaining number of electronic components and the updated offset value from the history of the offset value stored in the storage means;
When the determination means determines that the degree of correlation is greater than or equal to the first reference value and less than or equal to the second reference value greater than the first reference value, the offset value to be updated and the remaining number of electronic components are updated. and control means for controlling so as to supply operation of the electronic component to the pickup position of the next the component feeding unit follows the weighting of the offset value thus calculated correlation curve based on the correlation between the said offset value Is provided.

According to an eighth aspect of the present invention, an electronic component is supplied from an arbitrary component supply unit among a plurality of component supply units to a component suction position, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting device that images the electronic component sucked by the suction nozzle with the recognition camera, and that is recognized and processed by the recognition processing device and mounted on the printed circuit board,
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Storage means for storing;
Determination means for determining the correlation degree based on the correlation between the offset value and the updated remaining number of electronic components from the history of the stored the offset value to the storage means,
Control means for controlling the electronic component supply operation to the next suction position of the component supply unit according to the updated offset value when the determination means determines that the degree of correlation is weak ; It is provided.

  According to the present invention, it is possible to further stabilize the adsorption rate by sufficiently dealing with the correlation between the remaining amount of electronic components and the offset value in the component supply unit.

  Embodiments of the present invention will be described below with reference to the drawings. First, in the plan view of the electronic component mounting apparatus 5 in FIG. 1, reference numeral 11 denotes a Y table that moves in the Y direction by driving a Y axis drive motor 12, and 13 denotes a Y table 11 driven by an X axis drive motor 14. The XY table moves in the XY direction as a result of moving in the X direction, and the printed circuit board 9 on which the chip-like electronic component 8 is mounted is fixed and mounted on a fixing means (not shown).

  Reference numeral 17 denotes a component supply base in which a plurality of lanes for arranging a plurality of component supply units, which will be described later, are arranged side by side. It is arranged in the lane. Reference numeral 19 denotes a supply table driving motor. When the ball screw 20 is rotated, the component supply table 17 is guided to the linear guide 22 via a nut 21 fitted to the ball screw 20 and fixed to the supply table 17. Move in the X direction. Reference numeral 23 denotes an intermittently rotating rotary table, and mounting heads 25 having a plurality of suction nozzles 24 as take-out nozzles are arranged at equal intervals according to the intermittent pitch on the outer edge of the table 23.

  The stop position due to the intermittent rotation of the rotary table 23 of the mounting head 25 where the suction nozzle 24 sucks and takes out the electronic component 8 from the supply unit 18 is the suction station A, and the mounting head 25 descends at the suction station A. Thus, the suction nozzle 24 sucks and takes out the electronic component 8.

  The position B is a recognition station in which the mounting head 25 that has sucked the electronic component 8 stops due to the intermittent rotation of the rotary table 23, and an image of the component 8 is picked up by the component recognition camera 15, so Recognition processing is performed by the recognition processing device 43.

  The position C is a mounting station where the mounting head 25 stops in order to mount the electronic component 8 held by the suction nozzle 24 on the printed circuit board 9, and the XY table 13 moves as the mounting head 25 moves down to a predetermined position. The component 8 is mounted on the printed circuit board 9 stopped at the position.

  Further, as shown in FIG. 2, the mounting head 25 is attached to a linear guide 32 via a head block 31 and is movable up and down with respect to the rotary table 23.

  Reference numeral 26 denotes an elevating lever that moves up and down to oscillate the oscillating lever 27 of the component supply unit 18, and an unillustrated storage wound around the tape supply reel 28 by oscillating the elevating lever 27 at the suction station A. The storage tape as a member is fed, and the electronic component 8 stored in the storage tape is supplied to the suction position of the nozzle 24.

  The storage tape stores electronic components in the respective storage portions of the carrier tape, and peels the cover tape so that the electronic components sent to the component take-out position (component suction position) are transferred by the suction nozzle 24. It is the composition to take out.

  Next, the control block diagram of FIG. 3 will be described. Each electronic component mounting device 5 includes a CPU 40 as a control unit that performs overall control of the mounting device 5 and a RAM connected to the CPU 40 via a bus line. (Random Access Memory) 41 and ROM (Read Only Memory) 42 are provided. Then, based on the data stored in the RAM 41, the CPU 40 operates according to the program stored in the ROM 42 for each drive source via the interface 44 and the drive circuit 48 for the operation related to taking out and mounting the electronic component of the electronic component mounting apparatus. Oversee and control.

  The RAM 41 stores mounting data for each type of printed circuit board 9 related to component mounting. For each mounting order (for each step number), the X direction (indicated by X) in the printed circuit board 9, Y Information of direction (indicated by Y) and angle (indicated by Z), arrangement number information of each component supply unit 18 and the like are stored. The RAM 41 stores information on the types (component IDs) of electronic components corresponding to the component supply unit arrangement numbers (lane numbers) of the component supply units 18 for each type of the printed circuit boards 9, that is, component arrangement information. Further, component library data relating to the size of the electronic component is stored for each component ID.

  The RAM 41 stores, for each component supply unit 18, offset values in the X direction and the Y direction related to the suction position, which is the component extraction position by the suction nozzle 24 of each component supply unit 18. This offset value is for slightly deviating the component suction position for each component supply unit 18, and for correcting the shift amount so that suction can be reliably taken out.

  A recognition processing device 43 is connected to the CPU 40 via the interface 44. The recognition processing device 43 performs recognition processing of an image captured by the component recognition camera 15, and the processing result is sent to the CPU 40. Is sent out. That is, the CPU 40 outputs an instruction to the recognition processing device 43 so as to perform recognition processing (calculation of the amount of misalignment) of the image captured by the component recognition camera 15 and receives the recognition processing result from the recognition processing device 43. It is.

  That is, when the amount of positional deviation is grasped by the recognition processing of the recognition processing device 43, the result is sent to the CPU 40, and the CPU 40 drives the XY by the Y axis drive motor 12 and the X axis drive motor 14 of the previous XY table 13. By moving the printed circuit board 9 in the direction, the suction nozzle 24 used by the pulse motor 47 is rotated by θ, and the rotational angular position around the X and Y directions and the vertical axis is corrected.

  The recognition processing device 43 captures an image captured by the component recognition camera 15, and the captured image is displayed on the CRT 45. The CRT 45 is provided with various touch panel switches 46 as input means for data setting, and various settings can be performed by an operator operating the touch panel switch 46. A keyboard may be used as the input means.

  Reference numeral 50 denotes a management personal computer including a microcomputer connected to the electronic component mounting apparatus 5 via the Ethernet (registered trademark) 51. The management personal computer 50 is also externally connected via the Ethernet (registered trademark) 51. It is connected to the memory 52.

  The operation will be described below with the above configuration. First, the printed circuit board 9 is supplied from the upstream device, is fixed by the fixing means on the XY table 13, and moves to the component mounting position. Further, when the mounting head 25 stops at the suction station A by intermittent rotation through the index mechanism of the rotary table 23, the supply base 17 is moved by the drive of the supply base drive motor 19, and the mounting data stored in the RAM 41 is stored. Accordingly, the component supply unit 18 for storing the electronic component 8 to be supplied is stopped at the suction position of the suction nozzle 24 of the mounting head 25 of the suction station A, and the electronic component 8 is taken out when the suction nozzle 24 is lowered.

  At this time, the elevating lever 26 is lowered to swing the swing lever 27 of the component supply unit 18, and the storage tape wound in the tape supply reel 28 is fed at the suction station A and stored in the storage tape. The electronic component 8 is supplied to the suction position of the nozzle 24. Further, the CPU 40 controls the supply table drive motor 19 and the index mechanism according to the offset values in the XY directions related to the component suction positions stored in the RAM 41, and the supply table 17 is driven by the supply table drive motor 19 in the X direction. In the Y direction, the rotary table 23 is moved by driving the index mechanism to correct the component suction position, and the electronic component 8 is taken out by lowering the suction nozzle 24.

  Since each suction position is slightly deviated from the designed position for each component supply unit 18, offset values in the X direction and the Y direction are stored in the RAM 41 for each component supply unit 18. .

  Next, the rotary table 23 rotates intermittently via the index mechanism, and the mounting head 25 holding the electronic component 8 moves to the next station and stops, and further rotates to the recognition station B. Moving. Then, the electronic component 8 picked up by the suction nozzle 24 is picked up by the component recognition camera 15, and the image is recognized by the recognition processing device 43, and the positional deviation of the electronic component 8 relative to the suction nozzle 24 is recognized.

  Next, when the recognition process is completed, the CPU 40 of the electronic component mounting apparatus 5 calculates the amount to be corrected based on the recognition result in addition to the XY coordinates and mounting angle of the mounting data stored in the RAM 41. At this time, the CPU 40 drives the Y-axis drive motor 12 and the X-axis drive motor 14 by adding a pulse motor 47 that rotates the suction nozzle 24 and the correction amount to the position indicated by the mounting data in the plane direction. To do.

  Then, the rotary table 23 rotates intermittently to reach the mounting station C, and the electronic component 8 that has finished the angular positioning taking the correction amount into consideration is moved to the XY table 13 to finish the positioning in the plane direction. Install on top.

  In this manner, the electronic components 8 are sequentially picked up and taken out from the various component supply units 18, and the electronic components 8 are mounted on the printed circuit board 9. Then, the printed circuit board 9 on which all the electronic components 8 are mounted is delivered to the downstream device, and the electronic components 8 are mounted on the printed circuit board 9 in the same manner.

  As shown in FIG. 4, in this case, as described above, the mounting position is corrected and the electronic component 8 is mounted on the printed circuit board 9, but the X and Y directions are set for each component supply unit 18. An offset value is stored in the RAM 41, feedback processing is performed based on the recognition processing by the recognition processing device 43, and the offset value is updated at the next component feeding to the suction position of the component supply unit 18. In the next supply to the suction position, the suction positioning is performed.

  That is, a feedback process is performed, and the CPU 40 controls the supply stand drive motor 19 and the index mechanism according to the offset value updated at the time of the next component feeding to the suction position of the component supply unit 18 to supply the X direction. By moving the supply table 17 by driving the table drive motor 19 and moving the rotary table 23 by driving the index mechanism in the Y direction, the component suction position is corrected and suction positioning is performed. The electronic component 8 is taken out by descending.

  Then, the history of offset data relating to the updated offset value as shown in FIG. 5 is stored in the external memory 52. In FIG. 5, the feeder ID is the name of the component supply unit 18, the component ID is the name of the electronic component 8, and this history is the feeder ID, component ID, component manufacturer stored in order of data number (component extraction order). The remaining number of electronic components in the storage tape wound around the tape supply reel 28, the offset value, and the like.

  The remaining number is set for each component supply unit 18 (for example, stored in the RAM 41), so a counter (not shown) of “1” for each component removal from the maximum number stored. The CPU 40 can grasp by subtracting.

  Such offset data histories are stored in the external memory 52 by a predetermined amount. For example, about one turn of the storage tape wound around the tape supply reel 28 of each component supply unit 18 is stored. In other words, data for about one turn of the storage tape wound around the tape supply reel 28 is taken.

  Then, as shown in FIG. 8, the operator operates the management personal computer 50 from the history of offset data stored in the external memory 52 in this way, for example, according to a certain data extraction condition, for example, a feeder ID (part supply Target data is extracted for each (unit name) (see FIG. 6) and for each component ID (component name) (see FIG. 7).

  Then, the management personal computer 50 performs processing based on the extracted target data to obtain a correlation coefficient R that is a degree of correlation between the remaining number of electronic components and the offset value, or approximate curve function f (x ). This approximate curve is a curve drawn with the X axis as the remaining number of electronic components and the Y axis as an updated offset value that is the amount of deviation from the intended suction position. Further, since the data relating to the correlation coefficient R and the approximate curve function f (x) is transmitted to the electronic component mounting apparatus 5 via the Ethernet (registered trademark) 51, the CPU 40 stores these data in the RAM 41. Will be stored.

  That is, when the production operation related to the subsequent mounting of the electronic component is started, the data related to the correlation coefficient R is transmitted to the electronic component mounting apparatus 5 via the Ethernet (registered trademark) 51, and the CPU 40 stores these data. Stored in the RAM 41.

  As shown in FIG. 9, when the CPU 40 determines that the correlation coefficient R is smaller than the first reference value r1, the conventional mounting operation by suction positioning is performed. Therefore, in the same way as the data acquisition as described above (as in the past), feedback processing is performed based on the recognition processing by the recognition processing device 43, and the next time the component is fed to the suction position of the component supply unit 18 While the offset value is updated, the electronic component 8 is taken out while the suction positioning control is performed at the time of supply to the next suction position.

  When the CPU 40 determines that the correlation coefficient R is greater than the second reference value r2, the mounting operation by the mode A suction positioning is performed. Therefore, according to the data concerning the approximate curve function f (x) transmitted together with the correlation coefficient R, that is, according to the approximate curve, the suction positioning control is performed when the CPU 40 supplies the next suction position, and the electronic component 8 Extraction will be performed. That is, according to the offset value calculated according to the approximate curve function, the electronic component is supplied to the next suction position of the component supply unit.

  If the CPU 40 determines that the correlation coefficient R is greater than or equal to the first reference value r1 and less than or equal to the second reference value r2, a mounting operation by mode B suction positioning is performed. Accordingly, the suction positioning control is performed when the CPU 40 supplies the next suction position according to the arbitrarily determined weighting of the data relating to the approximate curve function f (x) transmitted together with the correlation coefficient R and the updated offset value. The electronic component 8 is taken out while being carried out. Only one type of weighting may be stored in advance in the RAM 41, or for example, several types may be stored corresponding to the correlation coefficient R and selected by the operator or automatically selected by the CPU 40. . Here, the smaller the value of the correlation coefficient R (closer to the first reference value r1), the smaller the ratio of data related to the approximate curve function f (x) with respect to weighting, and the updated offset value ratio. By increasing the value, the adsorption rate can be further stabilized.

  In mode A, for example, an offset due to the cause of the mounting apparatus itself, for example, an offset that may occur when the lane in which the component supply unit is disposed is changed, and this offset is approximated by a curve. The suction positioning control may be performed in consideration of the function f (x). By performing the suction positioning control in this way, the suction rate can be further stabilized even when the lane of the component supply unit is changed. The correlation coefficient R may be determined on the management personal computer 50 side.

  In addition, regarding the history of offset data stored in the external memory 52, instead of the remaining number of electronic components, for example, the supply rate of electronic components (0% before the start of component supply, which decreases with the supply of components, the remaining number 100% when 0) or the like may be used.

  The electronic component mounting apparatus of the present embodiment is a so-called rotary table type high-speed chip mounter, but is not limited to this. It may be applied to a mounter.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

It is a top view of an electronic component mounting apparatus. It is a side view of an electronic component mounting apparatus. It is a control block diagram. It is a flowchart figure which stores the log | history of offset data. It is a figure which shows the historical data of offset data. It is the figure which extracted the log | history data of offset data based on feeder ID. It is the figure which extracted the historical data of offset data based on component ID. It is a flowchart figure for extracting object data from history data of offset data, and obtaining a correlation coefficient and an approximate curve function. It is a flowchart figure by which a mode is selected based on the value of a correlation coefficient.

Explanation of symbols

5 Component mounting device 15 Component recognition camera 17 Component supply stand 18 Component supply unit 24 Suction nozzle 40 CPU
41 RAM
43 Recognition processing device 50 Personal computer for management 52 External memory

Claims (8)

An electronic component is supplied from any component supply unit to a component suction position among a plurality of component supply units, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting method in which the picked-up electronic component is imaged, recognized by the recognition processing device, and mounted on the printed circuit board.
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Store and
It is determined whether the correlation is strong, based from the history of the stored said offset value on the correlation between the said offset value is updated with the number of remaining electronic components,
To the suction position of the next the component feeding unit in accordance with the offset value calculated in accordance with the approximate curve function based on the correlation between the offset value and the updated number of remaining electronic components when the correlation is determined to strong An electronic component mounting method characterized by performing an electronic component supply operation. An electronic component is supplied from any component supply unit to a component suction position among a plurality of component supply units, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting method in which the picked-up electronic component is imaged, recognized by the recognition processing device, and mounted on the printed circuit board.
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Store and
From this stored offset value history , determine the degree of correlation based on the correlation between the remaining number of electronic components and the updated offset value ,
Adsorption of the next the component feeding unit in accordance with the offset value calculated in accordance with the approximate curve function based on the correlation between the offset value and the updated number of remaining electronic components in the case of the correlation degree is determined to a certain level greater than An electronic component mounting method comprising: supplying an electronic component to a position. An electronic component is supplied from any component supply unit to a component suction position among a plurality of component supply units, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting method in which the picked-up electronic component is imaged, recognized by the recognition processing device, and mounted on the printed circuit board.
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Store and
From this stored offset value history , determine the degree of correlation based on the correlation between the remaining number of electronic components and the updated offset value ,
When it is determined that the degree of correlation is greater than or equal to the first reference value and less than or equal to the second reference value greater than the first reference value , the updated offset value and the remaining number of electronic components and the updated offset value electronic component mounting method and performing supply operation of the electronic components to the pickup position of the next the component feeding unit follows the weighting of the offset value calculated according to a correlation curve based on the correlation between the. An electronic component is supplied from any component supply unit to a component suction position among a plurality of component supply units, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting method in which the picked-up electronic component is imaged, recognized by the recognition processing device, and mounted on the printed circuit board.
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Store and
From this stored offset value history , determine the degree of correlation based on the correlation between the remaining number of electronic components and the updated offset value ,
Electronic component mounting method characterized in that for supplying operation of the electronic component to the pickup position of the next the component feeding units follow the offset value is updated when it is determined that the correlation degree is weak. An electronic component is supplied from any component supply unit to a component suction position among a plurality of component supply units, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting apparatus that images the picked-up electronic components and performs recognition processing by the recognition processing device and mounts on the printed circuit board,
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Storage means for storing;
Determining means for determining whether the correlation is stronger based on the correlation between the offset value and the updated remaining number of electronic components from the history of the stored the offset value to the storage means,
Following the component feeding units follow the offset value calculated in accordance with the approximate curve function based on the correlation between the remaining number and the updated offset value of the electronic component when the correlation is determined to strong by this judgment means An electronic component mounting apparatus, comprising: a control unit configured to control the electronic component to be supplied to the suction position. An electronic component is supplied from any component supply unit to a component suction position among a plurality of component supply units, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting apparatus that images the picked-up electronic components and performs recognition processing by the recognition processing device and mounts on the printed circuit board.
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Storage means for storing;
Determination means for determining a correlation between the degree of this based on the correlation between the offset value and the updated remaining number of electronic components from the history of the stored the offset value to the storage means,
If it is determined by the determination means that the degree of correlation exceeds a certain level , the next corresponding component according to the offset value calculated according to the approximate curve function based on the correlation between the remaining number of electronic components and the updated offset value An electronic component mounting apparatus comprising: control means for controlling to perform an operation of supplying an electronic component to a suction position of a supply unit. An electronic component is supplied from any component supply unit to a component suction position among a plurality of component supply units, and an electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting apparatus that images the picked-up electronic components and performs recognition processing by the recognition processing device and mounts on the printed circuit board.
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Storage means for storing;
Determining means for determining the degree of correlation based on the correlation between the remaining number of electronic components and the updated offset value from the history of the offset value stored in the storage means;
When it is determined by this determination means that the degree of correlation is greater than or equal to the first reference value and less than or equal to the second reference value greater than the first reference value , the updated offset value and the remaining number of electronic components are updated. and control means for controlling so as to supply operation of the electronic component to the pickup position of the next the component feeding unit follows the weighting of the offset value thus calculated correlation curve based on the correlation between the said offset value An electronic component mounting apparatus characterized by comprising: An electronic component is supplied from any component supply unit to a component suction position among a plurality of component supply units, and the electronic component is suctioned and taken out by a suction nozzle based on an offset value related to the component supply position. In the electronic component mounting apparatus that images the picked-up electronic components and performs recognition processing by the recognition processing device and mounts on the printed circuit board,
A history of the offset value that has been updated in advance by a predetermined amount corresponding to the remaining number of the electronic components is obtained from the amount of positional deviation of the electronic components with respect to the suction nozzle before the electronic components are taken out from the component supply unit and mounted on the printed circuit board. Storage means for storing;
Determination means for determining the correlation degree based on the correlation between the offset value and the updated remaining number of electronic components from the history of the stored the offset value to the storage means,
Control means for controlling the electronic component supply operation to the next suction position of the component supply unit according to the updated offset value when the determination means determines that the degree of correlation is weak ; An electronic component mounting apparatus characterized by being provided.

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