JPH10209693A - Method and machine for mounting part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To adjust the part mounting position accurately by sustaining constant conditions related to the state of a nozzle member at the time of mounting even when the mounting angle is varied thereby eliminating the effect due to bending of the nozzle member or the like. SOLUTION: A head unit movable between a part feeding section and a part mounting section is provided with a nozzle member, an R-axis servo motor 25 for turning the nozzle member, and the like. A main controller 30 is provided with a section 33 for storing a mounting angle, i.e., an angular variation in the part mounting direction at the part mounting section relative to the part mounting direction at the part feeding section, determined at a rotary angle of nozzle in a specific rotational direction. The nozzle member is brought into a state turned by the mounting angle reversely to the specific rotational direction from a specified reference rotational angular position by a main operating section 34 in the main controller 30, and the like, prior to sucking the part and returned back to the reference rotational angular position after sucking the part before mounting the part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method and an apparatus for mounting a component sucked from a component supply unit on a printed circuit board of a component mounting unit by a head unit having a rotatable component suction nozzle member. is there.

[0002]

2. Description of the Related Art Conventionally, a head unit having a nozzle member for picking up a component sucks an electronic component such as an IC from a component supply section and then places the electronic component on a printed circuit board positioned and positioned at a predetermined component mounting section. A mounting apparatus in which a head unit is moved to mount components at a predetermined position on a printed circuit board is generally known. In this mounting apparatus, usually, the head unit is movable in the X-axis direction and the Y-axis direction, and the nozzle member is movable and rotatable in the Z-axis direction. The driving means is provided, and the driving means and the negative pressure supply means for the nozzle member are controlled by the control unit, so that the electronic components are automatically sucked and mounted.

[0003]

In this type of mounting apparatus, it is necessary to accurately mount components at predetermined mounting positions on a printed circuit board. For this reason, for example, regarding the shift of the component suction position due to the nozzle member, the position shift is detected by component recognition based on an image captured by a camera or the like after the component suction, and the mounting position is corrected accordingly. Also, at the time of initial adjustment before starting use of the mounting device, when replacing the nozzle member, etc., the mounting position error due to initial error factors is checked by performing mounting on a test basis, etc. Setting has been conventionally performed.

If the nozzle member is bent or eccentric, etc., there is a possibility that an error may occur in the mounting position due to the bending or eccentricity. This is only dealt with by setting data, but this makes it difficult to mount with high accuracy when the mounting angle changes.

In general, in this type of mounting apparatus, components are arranged in a fixed direction in a component supply unit. However, the direction of components at the time of mounting varies depending on the layout of components on a printed circuit board. The sucked parts are not necessarily mounted on the printed circuit board as they are, but are mounted by rotating 90 ° or 180 °.
The mounting angle changes variously, such as being rotated and mounted. Conventionally, since the rotation angle of the nozzle member changes with the change of the mounting angle, the direction of the shift of the mounting position due to the bending of the nozzle member also changes,
It is unavoidable that an error is caused only by constant calibration data.

In order to solve such a problem, it is conceivable to adjust the calibration data by software processing according to the mounting angle. However, since the calibration data includes errors due to various factors, it is necessary to adjust the calibration data by software processing. It is extremely difficult to adjust only a specific error due to nozzle bending or the like.

SUMMARY OF THE INVENTION In view of the above circumstances, the present invention eliminates the effects of bending of a nozzle member and maintains the component mounting position by maintaining conditions relating to the state of the nozzle member at the time of mounting even when the mounting angle changes. It is an object of the present invention to provide a mounting method and an apparatus capable of adjusting with high accuracy.

[0008]

The invention according to claim 1 is
A head unit having a component supply unit for supplying components, a component mounting unit on which a printed circuit board is installed, and a rotatable component suction nozzle member, which is movable between the component supply unit and the component mounting unit. In the component mounting method in which the head unit sucks a component from the component supply unit and mounts the component on the printed circuit board of the component mounting unit, the component supply unit performs A mounting angle, which is an angle change of the component placement direction in the component mounting portion with respect to the component placement direction, is determined by a nozzle rotation angle in a specific rotation direction, and the nozzle member is moved from a predetermined reference rotation angle position in a direction opposite to the specific rotation direction. After the nozzle member is rotated by the mounting angle, the nozzle member sucks the component from the component supply unit, and then returns the nozzle member to the reference rotation angle position. Is rolling, is then obtained by a predetermined component mounting position on the printed circuit board in the component mounting unit so as to mount the components.

According to this method, the nozzle member is rotated by the mounting angle in the direction opposite to the specific rotation direction before the component is sucked, and is returned to the reference rotation angle position after the component is sucked, whereby the nozzle member is sucked by the nozzle member. The component is mounted in a state rotated in the specific direction by the mounting angle, while the nozzle member is always in the reference rotation angle position at the time of mounting regardless of the mounting angle. Therefore, even when the nozzle member is bent, the mounting position does not vary depending on the mounting angle, and even if the calibration data of the mounting position is set in advance under a certain condition at the time of initial adjustment or the like as necessary. Then, even when the mounting angle changes, the mounting accuracy of the components can be kept good.

According to a second aspect of the present invention, in the method according to the first aspect of the present invention, after the parts are sucked and after the nozzle member is returned to the reference rotation angle position, the parts sucked by the nozzle member are removed. Recognition is performed to perform component recognition for detecting a shift in the component suction position, and after this component recognition, component mounting is performed while taking into account a correction according to the shift in the component suction position.

According to this method, the component recognition is corrected by the component recognition in accordance with the deviation of the component suction position. In particular, regardless of the mounting angle, the component recognition is performed in a state where the nozzle member is at the reference rotation angle position as in the mounting. Is performed, the mounting position is accurately corrected.

According to a third aspect of the present invention, there is provided a component supply unit for supplying a component, a component mounting unit on which a printed circuit board is installed,
A head unit having a rotatable component suction nozzle member and movable between the component supply unit and the component mounting unit, and a component mounted on the printed circuit board of the component mounting unit by sucking components from the component supply unit A mounting unit having a control unit for controlling the operation of the head unit and the nozzle member so as to mount a component on the component, a driving unit for rotating the nozzle member, and a component mounting in the component placement direction in the component supply unit. Mounting angle storage means for storing a value obtained by calculating the mounting angle, which is an angle change in the component disposition direction in the unit, as a nozzle rotation angle in a specific rotation direction, and moving the nozzle member from a predetermined reference rotation angle position prior to component suction. While the state where the nozzle is rotated by the mounting angle in a direction opposite to the specific rotation direction is described above, the state where the nozzle member is returned to the reference rotation angle position after component suction and before component mounting. To rotate is obtained by a nozzle rotation control means for controlling said drive means.

According to a fourth aspect of the present invention, there is provided the apparatus according to the third aspect of the present invention, further comprising a component recognizing means for recognizing the component sucked by the nozzle member and detecting a shift of the component suction position. The nozzle rotation control means controls the nozzle member to rotate until the nozzle member returns to the reference rotation angle position after component suction and before component recognition.

According to such a mounting apparatus, the above mounting method is effectively executed.

[0015]

Embodiments of the present invention will be described with reference to the drawings. 1 and 2 show the overall structure of a component mounting apparatus according to one embodiment of the present invention. As shown in these figures, a conveyor 2 for transporting a printed board is arranged on a base 1, and the printed board 3 is mounted on the conveyor 2.
It is conveyed above and stopped at a predetermined mounting work position (component mounting portion).

At the side of the conveyor 2, a component supply unit 4
Is arranged. The component supply unit 4 includes a component supply feeder, for example, a multi-row tape feeder 4a.
It has. The tape feeder 4a has a tape that stores and holds electronic components such as ICs and transistors at equal intervals, the tape is led out from a reel, and components can be taken out from the tape at the front end of the feeder. Further, as the components are picked up, the tape is intermittently fed out by a ratchet type feeding mechanism.

Above the base 1, a head unit 5 for mounting components is provided. The head unit 5 is movable across the component supply unit 4 and the component mounting unit where the printed circuit board 3 is located.
It can move in the axial direction (the direction of the conveyor 2) and the Y-axis direction (the direction orthogonal to the X-axis on a horizontal plane).

That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 rotated and driven by a Y-axis servomotor 9 are disposed on the base 1, and a head unit is mounted on the fixed rail 7. A support member 11 is provided, and a nut portion 12 provided on the support member 11 is screwed to the ball screw shaft 8. The support member 11 has X
An axial guide member 13 and a ball screw shaft 14 driven by an X-axis servo motor 15 are provided, and the head unit 5 is movably held by the guide member 13,
A nut portion (not shown) provided on the head unit 5 is screwed to the ball screw shaft 14. And
By the operation of the Y-axis servo motor 9, the support member 11
The head unit 5 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15 while moving in the axial direction.

The Y-axis servomotor 9 and the X-axis servomotor 15 are provided with position detecting means 10 and 16 each composed of a rotary encoder so that the moving position of the head unit 5 can be detected. Has become.

As shown in FIG. 3, the head unit 5 is provided with a nozzle member 21 for sucking a component 20 so as to be able to move up and down and to rotate, and a Z-axis servo motor 23 which is a driving means for moving up and down the nozzle member. And an R-axis servo motor 25 as a driving means for rotating the nozzle member. Each of the servo motors 23 and 25 can be rotated forward and backward. Servo motors 23 and 25 have position detecting means 24 and 26 comprising rotary encoders, respectively.
Are provided, so that the vertical position and the rotation angle of the nozzle member 21 are detected.

Further, the head unit 5 is provided with a camera 27 for board recognition, and
Piping (not shown) for supplying negative pressure for component suction to 1
Etc. are provided.

On the other hand, a camera 2 for component recognition
8 are provided. The camera 28 is disposed at an appropriate position within the movable range of the head unit 5, for example, at a side of the component supply unit 4.

FIG. 4 shows a specific example of a control system provided in the mounting apparatus. In this figure, servomotors 9, 15, 23, 25 for the Y-axis, X-axis, Z-axis and R-axis of the head unit 5 and position detecting means 10, 16, 24, 26 provided respectively are controlled. It is electrically connected to an axis controller (driver) 31 of a main controller 30 which is a unit. The board recognition camera 27 provided in the head unit 5 and the component recognition camera 28 provided on the base 1 are connected to an image processing unit 32 provided in the main controller 30. .

The image processing section 32 reads an image of the component picked up by the camera 28 and performs predetermined image processing when the recognition of the picked-up component is performed based on the image picked up by the camera 28. , The center position and angle of the chip component are detected. When recognizing the board for detecting the position of the board 3, the image processing section 32 reads an image sent from the board recognizing camera 27 and performs predetermined image processing on the image. A dual mark is detected.

Further, the main controller 30 is provided with a mounting angle storage unit 33. The mounting angle storage unit 33 associates the mounting angle, which is an angle change of the component placement direction in the component mounting unit with respect to the component placement direction in the component supply unit 4, with the component mounting position on the printed circuit board to be mounted. It is stored as data. That is, the layout of component mounting is determined by the printed circuit board to be mounted, and the type and mounting angle of the component corresponding to the component mounting position are specified according to the layout. The mounting angle corresponding to the board and the component mounting position is stored as a table.

The axis controller 31, the image processing unit 32, and the mounting angle storage unit 33 are connected to a main operation unit 34 in the main controller 30. The main processing unit 34 performs a series of mounting operations of picking up components from the component supply unit 4 by the head unit 5, recognizing the components based on the image captured by the camera 28, and mounting the components on the printed circuit board 3. So that each of the servomotors 9 and 1 can be controlled via the axis controller 31.
5, 23, 25, and at the time of component recognition,
A component mounting position correction amount is obtained based on the processing in the image processing unit 32.

Further, the main processing unit 34 reverses the nozzle member 21 from a predetermined reference rotation angle position to a specific rotation direction (the rotation direction when the mounting angle is determined by the specific nozzle rotation direction) before component suction. The R-axis servomotor 25 is controlled so as to rotate the nozzle member 21 in the direction until the nozzle member 21 returns to the reference rotation angle position after component suction and before component mounting while rotating the nozzle member 21 in the direction by the mounting angle. Thus, the nozzle rotation control means is constituted.

The mounting method by this mounting apparatus will be described with reference to the flowchart of FIG.

When the process for component mounting starts,
First, according to the component mounting position of the printed circuit board, the mounting angle α
Is read from the mounting angle storage unit 33 (step S
1). Next, the head unit 5 is moved to the component supply unit 4, and the suction nozzle 21 is rotated by -α (steps S2 and S3). Then, the nozzle member 21 is lowered, and the component 20 is sucked from the component supply unit 4 (Steps S4 and S5).

After the components are sucked, the nozzle member 5 is raised and the nozzle member is rotated in the forward direction by the mounting angle α, thereby returning the nozzle member 5 to the reference rotation angle position (steps S6 and S7). Then, the head unit 5 is moved to a position corresponding to the component recognition camera 28 (step S8). Then, the camera 28 picks up an image of the suction component 20 and performs component recognition based on the image, thereby obtaining a position shift of the suction component 20 and calculating a position correction amount according to the position shift (step S9). .

The component mounting position is corrected based on the correction amount and the calibration data previously checked and stored in the memory.
The component is mounted on the corrected mounting position (steps S10 and S11).

The rotation operation of the nozzle member according to the mounting angle according to the above method will be specifically described with reference to FIG. In this figure, a circle represents the nozzle member 21, a fan-shaped mark in the circle represents the absolute angle of the nozzle member 21, and a triangular mark at the corner of the component 20 represents the component angle. And these marks are provided for convenience in the drawings. The absolute angle of the nozzle member 21 is defined as a reference rotation angle (0 °) when the fan-shaped mark is at the upper right in the drawing, with the counterclockwise direction being plus and the clockwise direction being minus.

As shown in this figure, when the mounting angle is 0 °, the nozzle member 2 is moved over each stage of suction, recognition and mounting.
The absolute angle of 1 is kept at 0 °, and the component 20 is mounted at the angle at the time of supply. However, when the mounting angle is 90 °, the nozzle member 21 is rotated before suction, so 9
After the component 20 is sucked in this state, the nozzle member is returned to 0 °, and recognition and mounting are performed. Even when the mounting angle is 180 ° or −90 °, the nozzle member 21 is rotated before suction, so that
The angles are set to 80 ° and 90 °, and recognition and mounting are performed after the nozzle member 21 is returned to 0 ° after the components are sucked.

As described above, the mounting angles are 90 ° and 180 °.
Even when the nozzle member 21 is variously changed to ° and −90 °, the nozzle member 21 is rotated in the opposite direction by the mounting angle before suction and returned to the base after suction, so that the component is supplied only by the above angle with respect to supply and suction. While being mounted in a rotated state, the nozzle member 21 is always at the reference rotation angle (0 °) at the time of recognition and mounting. Thus, even when the mounting angle is changed when the nozzle member 21 is bent or eccentric, stable mounting accuracy is ensured.

That is, in the related art, the absolute angle of the nozzle member is set to 0 ° at the time of suction and recognition, and the nozzle member is rotated by the mounting angle at the time of mounting. If it is assumed that the tip of the nozzle member tends to shift in the positive direction of the X-axis at the time of mounting, the shift of the tip of the nozzle member at the time of mounting is 90 °, 180 °, and -90 °, It fluctuates in the negative direction of the X-axis and the negative direction of the Y-axis. For this reason, calibration data for the mounting position deviation under predetermined conditions (for example, when the absolute angle of the nozzle member is 0 °) is determined in advance during initial adjustment or the like. However, if the mounting angle changes, the mounting position varies and an error occurs.

On the other hand, according to the present embodiment, since the absolute angle of the nozzle member 21 at the time of mounting is constant irrespective of the mounting angle, physical conditions such as the bending of the nozzle member 21 become constant, and There is no variation in the mounting position. Therefore, if calibration data is obtained in advance under certain conditions, the mounting position is appropriately adjusted based on this and the correction amount based on component recognition, and the component 20 is mounted with high accuracy.

Further, by rotating the nozzle member 21 in the reverse direction by the mounting angle before the suction, the absolute angle of the nozzle member 21 at the time of suction changes, and if the nozzle member 21 is bent, the component suction position is affected. However, the deviation of the suction position is corrected by the component recognition. In particular, since the nozzle member 21 is set to the same fixed absolute angle at the time of component recognition as at the time of mounting, the mounting position is properly corrected and mounting accuracy is improved. Can be

In the method of the present invention, the state in which the nozzle member 21 is rotated from the reference rotation angle position by the mounting angle in the direction opposite to the specific rotation direction before the suction,
As a result, it means that such a state may be obtained. For example, when the mounting angle shown in FIG.
In the case of °, rotate the nozzle member 90 ° in the negative direction (clockwise).
270 ° in the forward direction (counterclockwise) instead of being rotated
The same state may be obtained by rotating. Further, rotating the nozzle member 21 to the state in which the nozzle member 21 returns to the reference rotation angle position after the component is sucked also means that the nozzle member 21 only needs to be rotated so as to be in the same state as the reference rotation angle position as a result. .

[0039]

As described above, the present invention is applied to a case where components are mounted in a specific rotation direction while being rotated by a mounting angle corresponding to a component layout of a printed circuit board with respect to a component arrangement direction in a component supply unit. Before suctioning the components, the nozzle member is rotated from the reference rotation angle position by the mounting angle in a direction opposite to the specific rotation direction, the components are sucked in this state, and then the nozzle member is returned to the reference rotation angle position. After mounting the components, the components are mounted at the mounting angle according to the request, and even if the nozzle member is bent, the mounting position does not vary depending on the mounting angle. The components can be mounted with stable accuracy.

Then, if necessary, calibration data is obtained at the time of initial adjustment or the like, and component recognition is performed in a state where the nozzle member is returned to the reference rotation angle position after component suction, and mounting according to the shift of the suction position. If the position is corrected, the component can be mounted with high accuracy regardless of the mounting angle.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of an entire mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic front view of the mounting device.

FIG. 3 is a schematic front view of a head unit provided in the mounting apparatus.

FIG. 4 is a block diagram showing a control system.

FIG. 5 is a flowchart illustrating a mounting method.

FIG. 6 is an explanatory diagram showing a rotation operation of a nozzle member according to a mounting angle according to the mounting method.

[Description of Signs] 3 Printed circuit board 4 Component supply unit 5 Head unit 20 Components 21 Nozzle member 25 R-axis servo motor 28 Camera for component recognition 30 Main controller 32 Image processing unit 33 Mounting angle storage unit 34 Main calculation unit

Claims (4)

[Claims] 1. A component supply unit for supplying a component, a component mounting unit on which a printed circuit board is installed, and a rotatable component suction nozzle member, which can move between the component supply unit and the component mounting unit. In the component mounting method in which the head unit sucks a component from the component supply unit and mounts the component on the printed circuit board of the component mounting unit, the head unit prior to the component suction,
The mounting angle, which is the change in the angle of the component placement direction in the component mounting unit with respect to the component placement direction in the component supply unit, is determined by the nozzle rotation angle in the specific rotation direction, and the nozzle member is rotated from the predetermined reference rotation angle position by the specific rotation After having been rotated by the mounting angle in the direction opposite to the direction, the component is sucked from the component supply unit with this nozzle member, and then the nozzle member is rotated until returning to the reference rotation angle position, Thereafter, a component is mounted at a predetermined component mounting position on a printed circuit board in a component mounting section. 2. After component suction and after returning the nozzle member to the reference rotation angle position, component recognition is performed to recognize a component sucked by the nozzle member and detect a shift of the component suction position. 2. The component mounting method according to claim 1, wherein after the component recognition, the component mounting is performed while taking into account a correction according to the shift of the component suction position. 3. A component supply unit for supplying components, a component mounting unit on which a printed circuit board is installed, and a rotatable component suction nozzle member, which is movable between the component supply unit and the component mounting unit. And a control unit for controlling the operation of the head unit and the nozzle member so as to suck a component from the component supply unit and mount the component on the printed circuit board of the component mounting unit. In the apparatus, a driving means for rotating the nozzle member and a mounting angle, which is a change in the angle of the component placement direction in the component mounting section with respect to the component placement direction in the component supply section, are determined by the nozzle rotation angle in the specific rotation direction. A mounting angle storage unit for storing a value, and a state in which the nozzle member is rotated from the predetermined reference rotation angle position by the mounting angle in a direction opposite to the specific rotation direction before component suction. On the other hand, a component mounting apparatus comprising: nozzle rotation control means for controlling the driving means so as to rotate the nozzle member to a state in which the nozzle member returns to the reference rotation angle position after component suction and before component mounting. . 4. A component recognizing means for recognizing a component sucked by the nozzle member and detecting a shift of a component suction position, and until the nozzle rotation control means returns the nozzle member to the reference rotation angle position. 4. The component mounting apparatus according to claim 3, wherein the rotation control is performed after the component is sucked and before the component is recognized.