JP2009206405A - Component mounting method and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately mount components while reducing the effect caused by rotational backlash, adsorption nozzle bending (nozzle deviation from perpendicular line during falling), imaging conditions and the like by keeping constant control of a component recognition state, a rotation direction of adsorption nozzle, a positional condition and the like during component mounting even when an angle during component mounting is different from an angle during component adsorption. <P>SOLUTION: The disclosed method includes the steps of: calculating a differential mounting angle α; rotating an adsorption nozzle 108 at the differential angle α and then adsorbing a component 102 with the adsorption nozzle 108; rotating the adsorbed component 102 to an imaging position of a component recognition camera 120 in a predetermined rotating direction together with the adsorption nozzle 108; calculating a mounting correction angle β that is an angle for recognizing the rotated component 102 at the imaging position and mounting it onto a circuit board 104; rotating the component to the mounting correction angle β in the direction identical to the rotating direction to the imaging position; and mounting the rotated component 102 on the circuit board 104. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a component mounting method and a component mounting device, and in particular, by a mounting head having a suction nozzle for sucking a component that can be rotated, the component supplied to the component supply unit is sucked by the suction nozzle and is sucked. It is suitable for use in a component mounting method in which a component is recognized by a component recognition camera and the recognized result is used to mount the component on a circuit board. It is possible to prevent deterioration of component mounting accuracy due to rotation of the suction nozzle. The present invention relates to a component mounting method and a component mounting apparatus.

  Conventionally, after a component such as an IC is sucked from a component supply unit by a mounting head having a suction nozzle for component suction, the mounting head is moved onto a circuit board positioned at a predetermined position of the component mounting unit, A component mounting apparatus shown in Patent Document 1 that mounts components at predetermined positions on a circuit board is generally known. In such a component mounting apparatus, the mounting head can be moved in the X-axis direction and the Y-axis direction (planar), and the suction nozzle can be moved in the Z-axis direction (perpendicular to the X and Y axes). It is possible to rotate around the Z axis. That is, the component mounting apparatus is provided with driving means for movement and rotation in each direction. By controlling the driving means and the negative pressure supply means for the suction nozzle by the control means of the component mounting apparatus, the component mounting apparatus can automatically perform the suction and mounting of the parts.

  In the component mounting apparatus, it is necessary to mount the component accurately at a predetermined position on the circuit board. For this reason, for example, regarding the displacement of the component suction position by the suction nozzle, the component recognition position shift is calculated by performing component recognition based on imaging by the component recognition camera after the component suction, and the component mounting position accordingly Corrections have been made. Also, before starting the use of the component mounting device, or after repair or replacement such as when the suction nozzle is replaced, first check the error of the component mounting position, and correct the component mounting position using the corresponding calibration data This has also been done conventionally.

Japanese Patent Laid-Open No. 60-1900

  However, in general, the components in the component supply unit are arranged at a certain position and orientation, but depending on the component layout on the circuit board, the orientation in which the components are mounted varies. That is, the component sucked by the suction nozzle is not necessarily mounted on the circuit board at the sucked angle, and is rotated by 45 degrees, 90 degrees, 180 degrees, or the like. Then, the component rotated to an angle at which the component is mounted (referred to as a mounting angle) is imaged by the component recognition camera and rotated again to correct the error of the mounting position. For this reason, there is a possibility that the rotation direction is different from the rotation direction performed before imaging, and in this case, a rotation error due to the rotation can also cause a displacement of the component mounting position.

  In addition, the rotation angle and direction of the suction nozzle change with this change in the mounting angle, so that the position of the component mounting position is shifted due to bending of the suction nozzle (deviation from the vertical line when the nozzle is lowered) or eccentricity. There is a possibility. For example, when a component is mounted, the mounting angle is changed by component recognition. At this time, when the mounting angle is 0 degree, assuming that the suction nozzle tip tends to shift due to bending of the suction nozzle (deviation from the vertical line when the nozzle is lowered) or eccentricity, the mounting angle is 90 degrees, 180 degrees, Even in the case of 270 degrees or the like, there is a problem in that the tip of the suction nozzle is displaced during component mounting and the component mounting position is displaced.

  In addition, when the mounting angle is not 90 degrees or 180 degrees, the direction of the shape image of the recognized component is oblique with respect to the direction in which the individual sensor elements forming the imaging surface of the component recognition camera are arranged. There was a problem that sufficient component recognition accuracy could not be obtained for correcting the component mounting position.

  In order to solve such a problem, it is conceivable to adjust the positional deviation of the component mounting position by the above-described calibration data by software processing according to the component mounting angle. However, the calibration data includes errors due to various factors. If calibration data is available for all mounting angles, the amount of data will be enormous, so the suction nozzle bends by software processing according to the mounting angle. It has been extremely difficult to accurately mount components by adjusting only a predetermined error due to a deviation from the vertical line when the nozzle is lowered.

  In view of the above circumstances, the present invention keeps the control of the component recognition state and the rotation direction / position condition of the suction nozzle constant at the time of component mounting even when the angle at the time of component mounting and the angle at the time of component suction are different. A component mounting method and a component mounting device that can reduce the influence of rotation, bending of the suction nozzle (deviation from the vertical line when the nozzle is lowered), imaging conditions, etc. The issue is to provide.

  In the invention according to claim 1 of the present application, a component supplied to a component supply unit is sucked by a suction nozzle, the sucked component is recognized by a component recognition camera, and the component is recognized by using the recognized result. In the component mounting method to be mounted on the circuit board, a step of obtaining a differential mounting angle which is a difference between an angle at which the component is supplied at the component supply unit and an angle at which the component is mounted on the circuit board; Rotating the differential mounting angle and then sucking the component to the suction nozzle; rotating the sucked component together with the suction nozzle in a predetermined rotation direction to the imaging position of the component recognition camera; Recognizing the rotated component at the imaging position, obtaining a mounting correction angle that is an angle to be mounted on the circuit board, and rotating to the mounting correction angle in the same direction as the rotation direction to the imaging position. And that steps are those the rotated part provided with a step of mounting on the circuit board.

  According to this method, since the rotation direction of the suction nozzle before and after the recognition of the parts is the same, it is possible to prevent the displacement of the component mounting position due to the error caused by the rotation due to the different rotation directions, and the parts with high accuracy. Can be installed. Since the suction nozzle rotates the differential mounting angle and then picks up the component, the angular position of the suction nozzle when mounting the component is almost the same as the angular position of the suction nozzle before the rotation of the differential mounting angle (reference (Referred to as an angle). For this reason, since the component mounting characteristics including the bending of the suction nozzle at the reference angle are constant, the component mounting position is stable. That is, it is easy to correct the displacement of the component mounting position, and the component can be mounted with higher accuracy by adjusting the displacement of the component mounting position with calibration data as necessary.

  In the invention according to claim 2 or 4 of the present application, the adsorbed component has a direction in which a plurality of sensor elements forming an imaging surface of the component recognition camera are aligned and a direction of a shape image when the component is imaged. It is assumed that the image is rotated to the imaging position that is substantially parallel.

  According to this method / apparatus, the adsorbed component is predetermined until the direction in which the plurality of sensor elements forming the imaging surface of the component recognition camera are aligned and the direction of the shape image when the component is imaged are substantially parallel. Since it is rotated together with the suction nozzle in the rotation direction, it is possible to reduce an imaging error (referred to simply as an imaging error) of components caused by the arrangement direction of sensor elements on the imaging surface. For this reason, it is possible to recognize a part without impairing the recognition capability of the part recognition camera without being affected by the part mounting angle, and the recognition accuracy is improved. By improving the recognition accuracy, it is possible to mount components with higher accuracy.

  The invention according to claim 3 of the present application also includes a component supply unit to which components are supplied, a mounting head having a suction nozzle for sucking the components and mounting them on a circuit board, and a component sucked by the suction nozzle. A component recognition camera that performs recognition, and a component mounting apparatus that controls the suction nozzle using a result of recognition of the component, and an angle at which the component is supplied in the component supply unit and the circuit board A calculating means for obtaining a differential mounting angle that is a difference from an angle at which the component is mounted; and the suction nozzle is rotated at the differential mounting angle before suction of the component, and the component is suctioned together with the suction nozzle after suction. Rotating means for rotating in a predetermined rotation direction to the imaging position of the recognition camera, and obtaining a mounting correction angle that is an angle at which the component recognition camera images the component at the imaging position and mounts it on the circuit board There is provided a component mounting apparatus characterized by comprising a control means for controlling the suction nozzle to rotate in the same direction as the rotation direction of the image pickup position to the mounting angle of correction.

  According to the present invention, since the component is rotated and mounted after the component recognition in the same direction as the direction rotated before the component recognition, the influence of the rotation can be reduced, so the component is mounted with high accuracy. can do.

  In addition, the picked-up component has a predetermined rotation direction to the imaging position where the direction in which the plurality of sensor elements forming the imaging surface of the component recognition camera are aligned and the direction of the shape image when the component is imaged is substantially parallel In the case of rotating together with the suction nozzle, it is possible to reduce imaging errors caused by the arrangement direction of the sensor elements on the imaging surface. For this reason, it is possible to recognize a part without impairing the recognition capability of the part recognition camera without being affected by the part mounting angle, and the recognition accuracy is improved. By improving the recognition accuracy, it is possible to mount components with higher accuracy.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1 is a schematic diagram of a component mounting apparatus according to the present embodiment, FIG. 2 is a schematic diagram of an imaging surface of a component recognition camera, FIG. 3 is a block diagram showing the configuration of the entire control system, and FIG. FIG. 5 is a diagram showing an example of an overall flowchart up to the mounting operation, FIG. 5 is a diagram showing a detailed flowchart of the main part after step 4 in FIG. 4, and FIG. 6 shows the sharing of the mode of FIG. FIG. 7 is a diagram showing the angular relationship between the component and the suction nozzle when processing is performed in the modes (A) to (D) shown in FIG. 5, and FIG. 8 is the mode (A) to (D) shown in FIG. 9 is a diagram showing another angular relationship between the component and the suction nozzle when processed in FIG. 9, and FIG. 9 is a diagram showing the angular relationship between the component and the suction nozzle when processed in the mode (E) shown in FIG. .

  Initially, the structure of the component mounting apparatus of this embodiment is demonstrated. As shown in FIG. 1, the component mounting apparatus 100 includes a component supply unit 106 to which the component 102 is supplied, and a mounting head having a suction nozzle 108 that sucks the component 102 (see FIG. 3) and mounts it on the circuit board 104. 110 and a component recognition camera 120 for recognizing the component 102 sucked by the suction nozzle 108. Further, as shown in FIG. 1, the component mounting apparatus 100 extends in the left-right direction slightly behind the X-axis moving mechanism 112 and Y-axis moving mechanism 114 that move the mounting head 110 in the XY-axis direction. A substrate transfer path 118 and a main body 130 are provided. With such a configuration, the component mounting apparatus 100 sucks the component 102 supplied to the component supply unit 106 with the suction nozzle 108, recognizes the sucked component 102 with the component recognition camera 120, and uses the recognized result. The component 102 can be mounted at a predetermined position on the circuit board 104 by controlling the suction nozzle 108.

  As shown in FIG. 1, the X axis moving mechanism 112 moves the mounting head 110 having the suction nozzle 108 in the X axis direction, and the Y axis moving mechanism 114 moves the X axis moving mechanism 112 and the mounting head 110 to Y. Move in the axial direction.

  The mounting head 110 includes a Z-axis moving mechanism (not shown) that moves the suction nozzle 108 so as to move up and down in the vertical direction (Z-axis direction). A suction axis moving mechanism (not shown) for rotating the suction nozzle 108 around its nozzle axis (suction axis) is provided. The mounting head 110 is mounted with a substrate recognition camera 122 that images a substrate mark (not shown) formed on the circuit substrate 104.

  The component recognition camera 120 is arranged at an appropriate position within the movable range of the mounting head 110, for example, at a side portion of the component supply unit 106, and can image the component 102 sucked by the suction nozzle 108 from below. In the component recognition camera 120, if it is an imaging target, for example, the component 102, the imaging surface 120A of the component recognition camera 120 is formed by a plurality of sensor elements 120B as shown in FIG. Since the sensor elements 120B are regularly arranged in a plane, the imaging surface 120A has a rectangular shape. Note that the orientation of the shape image when the component 102 is imaged in the component supply unit 106 is an oblique angle with respect to the direction in which the plurality of sensor elements 120B forming the imaging surface 120A of the component recognition camera 120 are arranged in the present embodiment. It is not and is in a substantially parallel state. For this reason, the inclination error θ1 of the substantially parallel shape image that is not oblique to the sensor element 120B is smaller than θ2 that has an oblique angle (for example, 45 degrees) to the sensor element 120B, as shown in FIG. θ2> θ1), and if the rotation angle is 90 degrees or a multiple thereof (180 degrees, 270 degrees, 360 degrees, etc.) even if the component 102 is rotated after suction, the component recognition camera 120 does not impair its recognition ability. An image of the component 102 can be taken with high accuracy. Such errors related to the tilt errors θ1 and θ2 are referred to as imaging errors.

  A configuration of a control system of the entire component mounting apparatus 100 is shown in FIG. 3, and related components will be described below. The controller 132 provided in the main body 130 includes a microcomputer (CPU), RAM, and ROM, and includes an X-axis motor 113, a Y-axis motor 115, a Z-axis motor 116, a θ-axis motor 117, a display device 134, It is connected to a storage device 136, a keyboard 138, a mouse 140, an image recognition device 142, etc., and controls the entire component mounting device 100.

  Here, the θ-axis motor 117 is a drive source of the θ-axis rotation mechanism of the suction nozzle 108 as will be described later. In other words, the θ-axis motor 117 and the controller 132 constitute rotating means for rotating the suction nozzle 108 before suction of the component 102 and rotating the component 102 together with the suction nozzle 108 in a predetermined rotation direction after suction. . As will be described later, the image recognition device 142 images the component 102 with the component recognition camera 120 and transmits the component recognition data to the controller 132. That is, the θ-axis motor 117, the controller 132, and the image recognition device 142 obtain an angle (referred to as a mounting correction angle) β at which the component 102 is imaged by the component recognition camera 120 and mounted on the circuit board 104, and the mounting correction is performed. The control means is configured to control the suction nozzle 108 so as to rotate the component 102 in the same direction as the predetermined rotation direction up to the angle β.

  The X-axis motor 113 is a drive source for the X-axis moving mechanism 112 and moves the mounting head 110 in the X-axis direction. The Y-axis motor 115 is a drive source for the Y-axis moving mechanism 114 and drives the X-axis moving mechanism 112 in the Y-axis direction.

  The Z-axis motor 116 is provided in the mounting head 110 and is a drive source of a Z-axis drive mechanism (not shown) that raises and lowers the suction nozzle 108 in the Z-axis direction (height direction). The θ-axis motor 117 is a drive source for a θ-axis rotation mechanism (not shown) of the suction nozzle 108. The Z-axis motor 116 and the θ-axis motor 117 are provided with position detection means 116A and 117A (not shown) each composed of a rotary encoder so that the vertical position and rotation angle of the suction nozzle 108 can be detected. It has become. The mounting head 110 is provided with a pipe (not shown) for supplying a negative pressure for sucking the component 102 by the suction nozzle 108.

  The display device (monitor) 134 displays component data, calculation data, an image of the component 102 captured by the component recognition camera 120, and the like on its display surface.

  The storage device 136 is configured by a flash memory or the like. Information (referred to as component data) such as the number of terminals, the terminal arrangement, the size, and the shape of the component 102 input by the keyboard 138 and the mouse 140 is stored in the component supply unit 106. Information (referred to as component supply data) such as the position and orientation of the component 102 to be supplied, component layout information (referred to as substrate data) such as the position and angle of each component mounted on the circuit board 104, and unillustrated It is used to store component data, component supply data, board data, etc. transmitted from the host computer. Further, the board correction data of the circuit board 104 by the board mark imaged by the board recognition camera 122 is also stored.

  The keyboard 138 and the mouse 140 are used for inputting data such as component data.

  As shown in FIG. 3, the image recognition device 142 recognizes an image of the component 102 sucked by the suction nozzle 108 and includes a memory 144, a CPU 146, and an A / D converter 148. Here, an analog image signal output from the component recognition camera 120 that images the picked-up component 102 is converted into a digital signal by the A / D converter 148 and stored in the memory 144, and the CPU 146 based on the image data. The component 102 that has been sucked is recognized. That is, the image recognition device 142 calculates the center and inclination (referred to as component recognition data) of the component 102 and recognizes the suction posture of the component 102. The image recognition device 142 is connected to the board recognition camera 122, processes the board mark image captured by the board recognition camera 122, recognizes the board mark position, and calculates the board correction data of the circuit board 104. be able to. The image recognition device 142 can transmit the above-described component recognition data and board correction data to the controller 132.

  Next, with reference to FIG. 4 which is an example of an overall flow chart from the component suction operation to the component mounting operation in the present embodiment, a description will be given with particular attention to the angle.

  First, when the component adsorption operation for component mounting starts, the board data corresponding to the component mounting position on the circuit board 104 from the part mounting list of the production program for mounting the part 102 on the circuit board 104 is obtained from the controller 132. Is read out. At the same time, the component supply data of the component 102 of the component supply unit 106 and the board correction data (Δx, Δy, Δθ) of the circuit board 104 obtained by imaging the board mark with the board recognition camera 120 in advance are also read out to the controller 132. (Step S2).

  Next, from the above data, an angle at which the component 102 is supplied in the component supply unit 106 (referred to as a component supply angle) and an angle at which the component 102 is mounted on the circuit board 104 (referred to as a component mounting angle) are obtained. The difference mounting angle α (= part mounting angle−part supply angle) is obtained. Here, the differential mounting angle α (−φ ≦ α <360−φ) is calculated by defining the clockwise direction (CW) as viewed from the top of the component 102 as the positive side and the counterclockwise direction (CCW) as the negative side. (Step S4). Since the calculation process at this time is performed by the controller 132, the controller 132 functions as an arithmetic means.

  Next, the mounting head 110 is moved above the component supply unit 106 (step S6).

  Next, the suction nozzle 108 is rotated in a predetermined rotation direction (described later) by the differential mounting angle α (or 360−α) by the rotating means constituted by the controller 132 and the θ-axis motor 117 (step S10).

  Next, the suction nozzle 108 is lowered, and the component 102 supplied to the component supply unit 106 is sucked by the suction nozzle 108. After the component suction, the suction nozzle 108 moves up while sucking the component 102 (step S12).

  Next, the component 102 sucked by the suction nozzle 108 is moved to the upper part of the component recognition camera 120, and the sucked component 102 is arranged in a direction in which a plurality of sensor elements 120B forming the imaging surface 120A of the component recognition camera 120 are arranged. And the orientation of the shape image when the component 102 is imaged is rotated together with the suction nozzle 108 in the predetermined rotation direction until the imaging position becomes substantially parallel (referred to as a predetermined angle) (step S14).

  Next, the component recognition camera 120 images the component 102 at the above-described imaging position / angle (recognition position). The captured image of the component 102 is subjected to image processing by the image recognition device 142, the component 102 is recognized, and data on the center position / inclination of the component 102 (component recognition data) is extracted (step S16). Then, the component recognition data is transmitted to the controller 132. The component recognition data is converted by the controller 132 into recognition error data (a value that can take either a positive value or a negative value) with reference to a reference angle (0 degree) described later from the upper surface of the component 102.

  Next, the controller 132 reads the board correction data and board data from the storage device 136, and uses the converted recognition error data and the predetermined angle used in step S14 to mount the circuit board 104 at an angle. A correction angle β is obtained (step S18).

  Next, the component 102 is rotated to the mounting correction angle β by the θ-axis motor 117 in the same direction as the rotation direction (predetermined rotation direction) of the component 102 to the imaging position (recognition position) described above, and the angle correction is performed. This is done (step S20).

  Finally, with the angle corrected, the suction nozzle 108 is lowered onto the circuit board 104, and the component 102 is mounted at a predetermined position (step S22).

  In order to describe the above-described predetermined rotation direction and predetermined angle, step S4 and subsequent steps in FIG. 4 will be described in detail with reference to FIG. For convenience, when the component 102 of the suction nozzle 108 is supplied to the component supply unit 106, a reference angle (0 degree) that is an angle before starting the component suction operation is shown in FIGS. As shown, the angle is expressed as CW or CCW as appropriate, with CW as the positive side and CCW as the negative side as the downward direction (the direction of the solid straight arrow). Furthermore, as described above, the orientation of the shape image when the component 102 is imaged in the component supply unit 106 is an oblique angle with respect to the direction in which the plurality of sensor elements 120B forming the imaging surface 120A of the component recognition camera 120 are arranged. They are not parallel and are in a substantially parallel state.

  After the differential mounting angle α is calculated (step S4), the differential mounting angle α is basically divided into four modes (A) to (D) according to the angle. However, a special case of mode (A) (from 0 degree to −φ degree) is provided as mode (E), and FIG. 6 shows the relationship between differential mounting angle α and modes (A) to (E). Note that the angle φ is an angle provided for switching the modes (A) to (E) so that the same rotation direction (predetermined rotation direction) can be ensured until component mounting even if recognition error data is added. is there. The angle φ can be greater than 0 and 45 degrees or less, and can be determined by conditions such as the specifications of the component mounting apparatus 100 and the usage environment. Here, when the angle φ is 45 degrees, the mode (A) and the mode (E) are in the same angle range (see FIG. 6), so the angle φ is 45 degrees or less.

  When the differential mounting angle α is 0 ≦ α <(90−φ) degrees (YES in steps S80 and S86), the mode (A) operation is performed as shown in FIG. That is, as shown in FIG. 5, the suction nozzle 108 is rotated by the differential mounting angle α degrees in the CCW direction as the predetermined rotation direction (step S100). Then, the component 102 is sucked by the suction nozzle 108 (step S120). Next, the component 102 is rotated 90 degrees as a predetermined angle in the CCW direction, which is the same direction as the predetermined rotation direction described above (step S140).

  Next, the component 102 is picked up by the component recognition camera 120, recognition error data is obtained, and the mounting correction angle β is calculated by calculation processing (step S180). Here, the orientation of the shape image when the component 102 is imaged in the component supply unit 106 is in the direction in which the plurality of sensor elements 120B forming the imaging surface 120A of the component recognition camera 120 are arranged, based on the definition for the predetermined angle described above. The angle is not at an angle. For this reason, even if the component 102 is rotated by 90 degrees, which is a predetermined angle after the component is picked up, the orientation of the shape image of the component 102 is that of the plurality of sensor elements 120B forming the imaging surface 120A of the component recognition camera 120 at the imaging position. It is not an oblique angle with respect to the direction in which it is arranged, but is substantially parallel. For this reason, even when the component 102 is provided with a large number of minute terminals, the tilt of the component 102 can be sensitively recognized without impairing the recognition capability of the component recognition camera 120.

  Further, the suction nozzle 108 sucks the component 102 by rotating the differential mounting angle α in the CCW direction, which is the rotation direction, from the reference angle before the component 102 is sucked. For this reason, the component 102 can be mounted at the differential mounting angle α by returning the angle of the suction nozzle 108 to substantially the reference angle.

  The suction nozzle 108 is rotated 90 degrees in the CCW direction from the time when the part 102 is picked up until the part is recognized, and has already been rotated α degrees in the CCW direction before the part 102 is picked up. Recognition error data is added, and the mounting correction angle β is (270−α + recognition error data) degrees in the CCW direction. The differential mounting angle α is 0 ≦ α <(90−φ), the angle φ is 0 <φ ≦ 45, and the mounting correction angle β is a value larger than zero.

  Next, the suction nozzle 108 is moved and rotated to the mounting correction angle β degrees in the CCW direction, which is the same direction as the predetermined rotation direction described above (step S200).

  When the differential mounting angle α is equal to or greater than (90−φ) degrees and smaller than (180−φ) degrees (YES in step S82), the mode (B) operation is performed as shown in FIG.

  That is, as shown in FIG. 5, the suction nozzle 108 is rotated by the difference mounting angle α degrees in the CCW direction as the predetermined rotation direction (step S102). Then, the suction nozzle 108 sucks the component 102 (step S122).

  Next, the component 102 is picked up by the component recognition camera 120, recognition error data is obtained, and the mounting correction angle β is calculated by calculation processing (step S182). Note that the predetermined angle to the imaging position (recognition position) here is 0 (does not rotate). Here, the orientation of the shape image when the component 102 is imaged in the component supply unit 106 is oblique with respect to the direction in which the plurality of sensor elements 120B forming the imaging surface 120A of the component recognition camera 120 are arranged as described above. It is not an angle. For this reason, after the component suction, the component 102 does not form an oblique angle with respect to the direction in which the plurality of sensor elements 120B forming the imaging surface 120A of the component recognition camera 120 is arranged at the imaging position, but is substantially parallel. For this reason, even when the component 102 is provided with a large number of minute terminals, the tilt of the component 102 can be sensitively recognized without impairing the recognition capability of the component recognition camera 120.

  Further, the suction nozzle 108 sucks the component 102 by rotating the differential mounting angle α in the CCW direction, which is the rotation direction, from the reference angle before the component 102 is sucked. For this reason, the component 102 can be mounted at the differential mounting angle α by returning the angle of the suction nozzle 108 to substantially the reference angle.

  The suction nozzle 108 has not been rotated from picking up the component 102 until component recognition, but has already rotated α degrees in the CCW direction before picking up the component 102. In addition, the mounting correction angle β is (270− (α−90) + recognition error data) degrees in the CCW direction. The differential mounting angle α is (90−φ) ≦ α <(180−φ), the angle φ is 0 <φ ≦ 45, and the mounting correction angle β is a value larger than zero.

  Next, the suction nozzle 108 is moved and rotated to the mounting correction angle β degrees in the CCW direction, which is the same direction as the predetermined rotation direction described above (step S202).

  When the differential mounting angle α is equal to or greater than (180−φ) degrees and smaller than (270−φ) degrees (YES in step S84), the mode (C) operation is performed as shown in FIG.

  That is, as shown in FIG. 5, the suction nozzle 108 is rotated by the differential mounting angle (360−α) degrees in the CW direction as the predetermined rotation direction (step S104). Then, the suction nozzle 108 sucks the component 102 (step S124). Next, the component 102 is rotated 90 degrees as a predetermined angle in the CW direction, which is the same direction as the predetermined rotation direction described above (step S144).

  Next, the component 102 is picked up by the component recognition camera 120, recognition error data is obtained, and the mounting correction angle β is calculated by calculation processing (step S184). Here, the orientation of the shape image when the component 102 is imaged in the component supply unit 106 is oblique with respect to the direction in which the plurality of sensor elements 120B forming the imaging surface 120A of the component recognition camera 120 are arranged as described above. It is not an angle. For this reason, even if the component 102 is rotated by 90 degrees, which is a predetermined angle after the component is picked up, the orientation of the shape image of the component 102 is that of the plurality of sensor elements 120B forming the imaging surface 120A of the component recognition camera 120 at the imaging position. It is not an oblique angle with respect to the direction of alignment, but is substantially parallel. For this reason, even when the component 102 is provided with a large number of minute terminals, the tilt of the component 102 can be sensitively recognized without impairing the recognition capability of the component recognition camera 120.

  Further, the suction nozzle 108 sucks the component 102 by rotating the differential mounting angle (360-α) in the CW direction, which is the rotation direction, from the reference angle before the component 102 is sucked. For this reason, the component 102 can be mounted at the differential mounting angle α by returning the angle of the suction nozzle 108 to substantially the reference angle.

  The suction nozzle 108 has rotated 90 degrees in the CW direction from the time when the part 102 is sucked to the part recognition, and has already rotated (360-α) degrees in the CW direction before the part 102 is sucked. Recognition error data obtained by component recognition is added, and the mounting correction angle β becomes (α−90) −recognition error data) degrees in the CW direction. The differential mounting angle α is (180−φ) ≦ α <(270−φ), the angle φ is 0 <φ ≦ 45, and the mounting correction angle β is larger than 0.

  Note that the rotation direction of the suction nozzle 108 is different between the mode A (, B, E) and the mode C (, D). Therefore, in the mode C (, D), as described above, the addition and subtraction of the recognition error data when obtaining the mounting correction angle β of the mode A (, B, E) is reversed.

  Next, the suction nozzle 108 is moved and rotated to the mounting correction angle β degrees in the CW direction, which is the same direction as the predetermined rotation direction described above (step S204).

  When the differential mounting angle α is equal to or greater than (270−φ) degrees and smaller than (360−φ) degrees (NO in step S84), the mode (D) operation is performed as shown in FIG.

  That is, as shown in FIG. 5, the suction nozzle 108 is rotated by a differential mounting angle (360−α) degrees in the CW direction as the predetermined rotation direction (step S106). Then, the component 102 is sucked by the suction nozzle 108 (step S126). Next, the component 102 is rotated 180 degrees as a predetermined angle to the imaging position (recognition position) in the CW direction, which is the same direction as the predetermined rotation direction described above (step S146).

  Next, the component 102 is picked up by the component recognition camera 120, recognition error data is obtained, and a mounting correction angle β is calculated by calculation processing (step S186). Here, the orientation of the shape image when the component 102 is imaged in the component supply unit 106 is oblique with respect to the direction in which the plurality of sensor elements 120B forming the imaging surface 120A of the component recognition camera 120 are arranged as described above. It is not an angle. For this reason, even if the component 102 is rotated by 180 degrees, which is a predetermined angle after the component is picked up, the orientation of the shape image of the component 102 is that of the plurality of sensor elements 120B that form the imaging surface 120A of the component recognition camera 120 at the imaging position. It is not an oblique angle with respect to the direction of alignment, but is substantially parallel. For this reason, even when the component 102 is provided with a large number of minute terminals, the tilt of the component 102 can be sensitively recognized without impairing the recognition capability of the component recognition camera 120.

  Further, the suction nozzle 108 sucks the component 102 by rotating the differential mounting angle (360-α) in the CW direction, which is the rotation direction, from the reference angle before the component 102 is sucked. For this reason, the component 102 can be mounted at the differential mounting angle α by returning the angle of the suction nozzle 108 to substantially the reference angle.

  The suction nozzle 108 rotates 180 degrees in the CW direction from the time when the part 102 is sucked to the part recognition, and has already been rotated (360-α) degrees in the CW direction before the part 102 is sucked. The mounting correction angle β obtained by component recognition is ((α−180) −recognition error data) degrees in the CW direction. The differential mounting angle α is (270−φ) ≦ α <(360−φ), the angle φ is 0 <φ ≦ 45, and the recognition error data is smaller than the angle φ. Is also a large value.

  Next, the suction nozzle 108 is moved and rotated to the mounting correction angle β degrees in the CW direction, which is the same direction as the predetermined rotation direction described above (step S206).

  When the differential mounting angle α is between (−φ) degrees and 0 degrees (YES in step S80, NO in step S86), the operation in mode (E) is performed as shown in FIG.

  That is, the suction nozzle 108 is rotated by the difference mounting angle α degrees in the CW direction as the predetermined rotation direction (step S108). Then, the suction nozzle 108 sucks the component 102 (step S128). Next, the component 102 is rotated 90 degrees as a predetermined angle in the CCW direction (predetermined rotation direction) which is the opposite direction to the rotation direction described above (step S148). Thereafter, the picked-up component 102 is imaged by the component recognition camera 120, recognition error data is obtained, and the mounting correction angle β is calculated by calculation processing (step S188).

  Here, as described in the mode (A), the component 102 does not form an oblique angle with respect to the direction in which the plurality of sensor elements 120B forming the imaging surface 120A of the component recognition camera 120 are arranged. For this reason, the inclination of the component 102 can be sensitively recognized without impairing the recognition capability of the component recognition camera 120.

  Next, the suction nozzle 108 is moved and rotated to the mounting correction angle β degrees in the CCW direction, which is the same direction as the rotation direction to the imaging position (recognition position) described above (step S208).

  An example in which the above-described operation is specifically applied is shown in FIGS.

  FIG. 7 shows the suction nozzle 108 from the left in the figure when the differential mounting angle α is 0 degree, 90 degrees, 180 degrees, and 270 degrees (each corresponding to modes (A) to (D)). Is at the reference angle (the state before step S10 in FIG. 4 or the state before steps S100 to S108 in FIG. 5), and when the component 102 is sucked by the suction nozzle 108 (the state in step S12 in FIG. Or the state of steps S120 to S128 in FIG. 5) when the component 102 is recognized by the component recognition camera 120 (the state of step S16 in FIG. 4 or between steps S140 to S148 and S180 to S188 in FIG. 5). State), when the component 102 is rotated by the mounting correction angle β (state in step S20 in FIG. 4 or states in steps S200 to S208 in FIG. 5). ing. Note that the dotted circumferential arrow in FIG. 7 indicates the rotation direction and rotation angle of the suction nozzle 108. Similarly, a solid circumferential arrow indicates a rotation angle from a component supply angle in the component supply unit 106 to a component mounting angle in the circuit board 104. The component 102 is provided with a component mark 102A for convenience in order to indicate the rotation angle of the component on its upper surface.

  FIG. 8 shows the respective cases where the differential mounting angle α is 45 degrees, 135 degrees, 225 degrees, and 315 degrees (each corresponding to modes (A) to (D)). Indicates when the differential mounting angle α is 350 degrees (corresponding to mode (E)). In FIG. 9, the angle φ is, for example, 15 degrees.

  In this way, the component mounting angles are the conditions of FIG. 7 (0 degrees, 90 degrees, 180 degrees, 270 degrees), the conditions of FIG. 8 (45 degrees, 135 degrees, 225 degrees, 315 degrees), and the conditions of FIG. 350 degrees), the suction nozzle 108 is basically rotated by a differential mounting angle in advance according to the processing contents determined by four modes (more specifically, five modes) before the component suction, and the component 102 Is rotated in a predetermined rotation direction after being picked up, and rotated in the same direction as the predetermined rotation direction after component recognition. Therefore, the suction nozzle 108 is rotated by a maximum of (360 + φ) degrees before the component suction operation. As a result, the component 102 is moved to the component mounting position, and the component 102 is mounted. Thereby, even when the suction nozzle 108 is bent, eccentric, or the like, even if the component mounting angle is changed, highly accurate and stable component mounting accuracy is ensured. In detail, it can be shown as follows.

  Since the rotation direction of the suction nozzle 108 before and after the recognition of the component 102 is the same, the displacement of the component mounting position due to an error caused by the rotation due to the different rotation direction can be prevented, and the component 102 is mounted with high accuracy. can do.

  Further, since the suction nozzle 108 sucks the component 102 after rotating the differential mounting angle α, the angular position of the suction nozzle 108 at the time of mounting the component is substantially the same as the angular position of the suction nozzle 108 before the rotation of the differential mounting angle. It can be kept at the same position (reference angle). That is, component mounting can be performed at the same angular position (reference angle) of the suction nozzle 108. For this reason, since the component mounting characteristics including the bending of the suction nozzle 108 at the reference angle are constant, the component mounting position is stable. That is, it is easy to correct the displacement of the component mounting position, and the component can be mounted with higher accuracy by adjusting the displacement of the component mounting position with calibration data as necessary.

  Further, the sucked component 102 is predetermined until the direction in which the plurality of sensor elements 120B forming the imaging surface 120A of the component recognition camera 120 are arranged and the direction of the shape image when the component 102 is imaged are substantially parallel. Since it is rotated together with the suction nozzle 108 in the rotation direction, the imaging error of the component 102 caused by the arrangement direction of the sensor elements 120B on the imaging surface 120A can be reduced. For this reason, it is possible to recognize a component without impairing the recognition capability of the component recognition camera 120 without being affected by the component mounting angle, and the recognition accuracy is improved. By improving the recognition accuracy, it is possible to mount components with higher accuracy.

  Although the present invention has been described with reference to the present embodiment, the present invention is not limited to the present embodiment. That is, it goes without saying that improvements and design changes can be made without departing from the scope of the present invention.

  For example, in this embodiment, the adsorbed component 102 is substantially parallel to the direction in which the plurality of sensor elements 120B forming the imaging surface 120A of the component recognition camera 120 are aligned and the direction of the shape image when the component 102 is imaged. However, the present invention is not limited to this.

  Further, for example, in this embodiment, in the description of FIGS. 5 to 9, the orientation of the component 102 in the component supply unit 106, the reference angle of the suction nozzle 108, how to determine the modes (A) to (E), and the suction nozzle 108 Although the description has been made with the rotation direction / angle and the rules defined, the present invention is not limited to this.

  Further, as shown in FIG. 10, the angle of the component 102 at the time of component recognition can be made the same in order to further improve the recognition accuracy. For example, based on the angle of mode (A), in mode (B), it is rotated 90 degrees in the CCW direction at the time of recognition, in mode (C) is further rotated 180 degrees in the CW direction, and in mode (D) is further rotated 90 degrees in the CW direction. Thus, the component 102 is recognized, and when the component is mounted, the component can be mounted by correcting the rotation from the imaging position (recognition position).

Schematic diagram of the component mounting apparatus according to the present embodiment Schematic diagram of the imaging surface of the component recognition camera Block diagram showing the configuration of the entire control system The figure which shows an example of the whole flow figure from component adsorption operation to component mounting operation similarly The figure which similarly shows the detailed flowchart of the main part after step S4 of FIG. The figure showing the sharing of the mode of FIG. 5 based on a difference mounting angle similarly Similarly, the angle relationship between the component and the suction nozzle when processing is performed in the modes (A) to (D) shown in FIG. The figure showing another angular relationship between the component and the suction nozzle when processing is performed in the modes (A) to (D) shown in FIG. Similarly, the figure showing the angular relationship between the component and the suction nozzle when processed in the mode (E) shown in FIG. The figure showing the angle relationship of the components at the time of processing by mode (A)-(D) in another embodiment, and a suction nozzle

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Component mounting apparatus 102 ... Component 104 ... Circuit board 106 ... Component supply part 108 ... Adsorption nozzle 110 ... Mounting head 112 ... X-axis moving mechanism 113 ... X-axis motor 114 ... Y-axis moving mechanism 115 ... Y-axis motor 116 ... Z Axis motor 117 ... θ axis motor 120 ... Component recognition camera 120A ... Imaging surface 120B ... Sensor element 122 ... Board recognition camera 132 ... Controller 136 ... Storage device 142 ... Image recognition device

Claims (4)

In a component mounting method of sucking a component supplied to a component supply unit with a suction nozzle, recognizing the sucked component with a component recognition camera, and mounting the component on a circuit board using the recognized result,
A step of obtaining a differential mounting angle that is a difference between an angle at which the component is supplied in the component supply unit and an angle at which the component is mounted on the circuit board;
Rotating the suction nozzle at the differential mounting angle and then sucking the component onto the suction nozzle;
The sucked component is rotated together with the suction nozzle in a predetermined rotation direction to the imaging position of the component recognition camera;
Recognizing the rotated component at the imaging position and obtaining a mounting correction angle that is an angle to be mounted on the circuit board;
Rotating in the same direction as the rotation direction to the imaging position to the mounting correction angle;
Mounting the rotated component on the circuit board;
A component mounting method comprising:   The sucked component is rotated to the imaging position where the direction in which the plurality of sensor elements forming the imaging surface of the component recognition camera are aligned and the direction of the shape image when the component is imaged are substantially parallel. The component mounting method according to claim 1. A component supply unit to which the component is supplied, a mounting head having a suction nozzle that sucks the component and mounts it on the circuit board, and a component recognition camera that recognizes the component sucked by the suction nozzle, In the component mounting apparatus that controls the suction nozzle using the recognized result of the component,
A calculation means for obtaining a differential mounting angle that is a difference between an angle at which the component is supplied in the component supply unit and an angle at which the component is mounted on the circuit board;
Rotating means for rotating the suction nozzle at the differential mounting angle before suction of the component and rotating the component together with the suction nozzle to the image pickup position of the component recognition camera after suction.
The component recognition camera captures a component at the imaging position and obtains a mounting correction angle that is an angle at which the component is mounted on the circuit board. Control means for controlling the nozzle;
A component mounting apparatus comprising:   The sucked component is rotated to the imaging position where the direction in which the plurality of sensor elements forming the imaging surface of the component recognition camera are aligned and the direction of the shape image when the component is imaged are substantially parallel. The component mounting apparatus according to claim 3.

Images