JPH1197897A - Method and device for mounting component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow highly precise mounting of a component, without being affected by looseness and backlashes, etc., of a mechanism for holding and rotating a component-handling means. SOLUTION: A component-handling means 2 for holding a component 1 is, by a preliminary rotation control means 60, rotated preliminarily in a fixed direction around a part handling center line X before recognition of angular position of the component 1, then the angular position of the component 1 is recognized by a recognizing camera 3, and when a discriminating means 61 discriminates that the component 1 is not at a specified angular position, the component-handling means 2 is rotated for correction, around the component handling center line X, in the same direction as the preliminary rotation by a correction rotation control means 62 for the component 1 to be at a specified angular position, and attached to an attachment object 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for mounting components, and is used when an electronic component is mounted on a circuit board to manufacture an electronic circuit board.

[0002]

2. Description of the Related Art A conventional process for mounting an electronic component on a circuit board will be described with reference to FIG. 5 and FIG. 3 showing a component mounting apparatus according to an embodiment of the present invention. 1 is picked up while being held or sucked by the suction nozzle 2 or the like, and the angular position of the picked-up electronic component 1 around the electronic component handling center line X such as the suction nozzle 2 is recognized by the recognition camera 3. 1 is a predetermined angle position with respect to the required orientation of the electronic component 1 based on the recognition of the component mounting position of the circuit board 5 to be mounted. Rotating the suction nozzle 2 and the like
The electronic component 1 is rotated around the component handling center line X to correct the positioning of the electronic component 1 and then mounted on the circuit board 5.

[0003] Thus, various electronic components 1 can be mounted at predetermined positions on the circuit board 5 in a predetermined direction.

[0004]

However, in the above-described conventional mounting method and apparatus, the orientation of the electronic component 1 mounted at each position on the circuit board 5 sometimes becomes inappropriate, resulting in mounting errors and This is the cause of defective products.

[0005] In this regard, the present inventors have repeatedly examined various experiments and found that the rattling of the mechanism for holding and rotating the suction nozzle to correct the angular position of the electronic component 1 by rotating the suction nozzle 2 was discussed. It has been found that there is a case where the rotation direction is displaced between the rotation source receiving the rotation and the suction nozzle 2 due to the influence of the backlash or the like, and the electronic component 1 cannot be rotated by a required angle.

An object of the present invention is to position a component at a required angular position with high accuracy without being affected by backlash or the like of a mechanism for holding and rotating a component handling means such as a suction nozzle based on such knowledge. It is an object of the present invention to provide a component mounting method and device which can be mounted by mounting.

[0007]

In order to achieve the above object, according to the first aspect of the present invention, there is provided a component mounting method comprising: holding a component to be supplied by gripping or sucking by a component handling unit; After recognizing the angular position around the component handling center line, if it is the predetermined angular position, if it is not the predetermined angular position, rotate the component handling means around the component handling center line and correct the position of the component. In the component mounting method for mounting on a mounting target, the component handling means holding the component is moved around the component handling center line before recognizing the angular position of the component by using the component mounting apparatus according to the second aspect of the present invention. After pre-rotating in a certain direction and positioning, recognize the angular position of the part,
When the part is not in the predetermined angular position,
It is characterized in that the component is rotated by correction around the component handling center line in the same direction as the preliminary rotation, and the component is positioned and corrected to be at a predetermined angular position before mounting.

In such a configuration, after the component handling means holds the component supplied by the component supply means,
Since the component is pre-rotated in a certain direction around the center line of the component handling, the rotation of this component handling means in a certain direction should not be any type of backlash or back that will cause a deviation in the direction of rotation from the source of rotation. The positioning state is reached without rush. Next, the angular position of the component held by the component handling means in this state around the component handling center line is recognized, and when the angular position is not the predetermined angular position, the component handling means is moved around the component handling center line in the preliminary rotation direction. The component is positioned and corrected so that the component is at a predetermined angular position and then mounted, so that the correction rotation drive of the suction nozzle is performed between the rotation source and the rotation source in the positioning state. It is achieved without play while maintaining the state of no backlash or backlash that causes a deviation in the direction, and the parts are in the specified angular position without the effects of backlash or backlash of the mechanism that holds and rotates the part handling means. As a result, components can be mounted with high precision at predetermined angular positions at predetermined positions on the mounting target.

The angular position of the component is shifted in the forward correction direction that can be corrected by the rotation in the predetermined direction, and is shifted in the reverse correction direction that can be corrected by the rotation in the opposite direction. In either case, the correction can be made by simply rotating the lens in the predetermined direction as described above.

However, the correction rotation angle in the case of a shift in the reverse correction direction becomes large. Therefore, after the rotation in the direction opposite to the predetermined direction is more than the required angle for correcting the deviation in the reverse correction direction, the rotation is more than the play in the rotation direction due to the backlash or the backlash, and then the correction rotation in the predetermined direction is performed. Thereby, high-precision positioning correction without the influence of play as described above can be performed, which is substantially equivalent to the correction rotation in a predetermined direction according to the first aspect of the present invention, and belongs to the category of the first aspect of the invention. It has the feature that the correction time can be shortened.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, typical embodiments of the present invention will be described in detail with reference to FIGS.

The present embodiment is an example of a component mounting apparatus for manufacturing an electronic circuit board by mounting and mounting the electronic component 1 on a circuit board 5. As shown in FIG. 1, the overall configuration is such that an intermittent rotation drive device 12 is installed on a support substrate 11, and a main shaft 13 protrudes downward from the support substrate 11.
A bearing 15 is mounted on a support cylinder 14 fixed to the lower surface of the support substrate 11.
It is supported so that it can rotate.

A rotary head 16 is fixed to the lower end of the main shaft 13, and a plurality of mounting heads 17 can be raised and lowered on the outer peripheral portion of the rotary head 16 at an angular pitch corresponding to the index rotation angle of the intermittent rotation drive device 12. It is arranged in.

Each mounting head 17 is provided with a linear guide 18, and the support block 1 mounted on the rotary head 16.
It is supported so that it can go up and down at 9. A cam follower 20 is attached to the upper end of the linear guide 18 and is engaged with an ascending / descending cam groove 21a of a cam cylinder 21 fitted to the outer periphery of the support cylinder 14 so as to be able to move up and down. Cam cylinder 2
Reference numeral 1 is moved up and down by a predetermined stroke by a vertical movement mechanism including a cam, a bell crank lever, and the like (not shown).

As shown in FIG. 1, for example, the mounting head 17 is provided with a plurality of kinds of suction nozzles 2 or chuck members or the like, which are held by a rotating body 42 as component handling means for mounting components. And the rotating body 42
By rotating, necessary objects are moved to the use position at each time, and are switched and used.

In this switching use, as shown in FIG. 2, only the suction nozzle 2 which is moved to the use position by the rotation of the rotating body 42 moves down to a predetermined position, and protrudes downward from the others. The height is controlled by the end face cam 41 so that the suction nozzles 2 and the like which are not used do not interfere with the other. Further, the suction nozzle 2 is fitted into the nozzle shaft 43 so as to be slidable up and down, and is urged by a buffer spring 44 so as to be always at a lower position. Buffers excessive working loads. The nozzle shaft 43 is fitted so as to be vertically slidable and rotatable on an outer cylinder 45 supported rotatably by the rotating body 42, and the nozzle shaft 43 is engaged with the pin 46 and the elongated hole 47. The end face cam 41 can be driven via the cam follower 52 by the upward biasing force of the spring 48.

An engagement member 51 is provided on the outer periphery of the lower portion of the nozzle shaft 43 for the following operation so that the nozzle shaft 43 can be rotated alone when an external force exceeding a certain level acts thereon. Is provided with the cam follower 52. At the upper end of the outer cylinder 45, an engaging portion 53 is provided on
The nozzle shaft 43 is forcibly rotated by a necessary amount in a necessary direction by engaging the rotating means 4 with the rotating means 4 so that the angle can be changed around the component handling center line X. It is. The solid line and the imaginary line of the rotating means 4 in FIG. 2 show a state where they are viewed at positions shifted from each other by 90 degrees. That is, the engaging portions 53 at two positions on the diameter line are used.
Have a width that engages each other.

At the stop position of each mounting head 17 due to the intermittent rotation of the rotary head 16, as shown in FIG. 3, a component supply station S1, a preliminary rotation station S2, a recognition station S3, a correction rotation station S4, and a component mounting station S5. , A return rotation station S6 and the like.

The rotating head 16 is driven by the intermittent rotation driving device 12.
Is rotated intermittently, the mounting heads 17 are moved to the stations S1 to S6, and the linear guide 1 is moved by the elevation cam grooves 21a and the cam followers 20.
8 is located at a height corresponding to each of the stations S1 to S6. During this movement, the cam barrel 21 is kept at the upper movement position,
Each mounting head 17 is maintained at a height that does not interfere with others.

Each of the mounting heads 17 is temporarily stopped for a predetermined time in each of the stations S1 to S6. At the time of this stop, the cam cylinder 21 is temporarily moved down, and the mounting head 17 is moved by a predetermined stroke for holding the electronic component 1 at the component supply station S1 and mounting the electronic component 1 at the component mounting station S5. Move down.

The component supply station S1 is provided with a component supply mechanism 32 in which component supply cassettes 31 are mounted by the number of required electronic components 1 or a plurality of component supply cassettes are mounted for frequently used electronic components. The component supply cassette 31 containing the electronic component 1 is moved to the component supply position so that the predetermined electronic component 1 can be supplied to the suction nozzle 2 that has moved there.

The preliminary rotation station S2, the correction rotation station S4, and the return rotation station S6 include:
The rotating means 4 is provided so that the suction nozzle 2 that holds the electronic component 1 of the mounting head 17 that has moved to these positions can be rotated by a predetermined angle in a predetermined direction.

The recognition station S3 includes a recognition camera 3
The angular position of the electronic component 1 sucked and held by the suction nozzle 2 of the mounting head 17 moved there,
That is, the angular position of the suction nozzle 2 around the component handling center line X is image-recognized, and it is determined whether or not the angular position is a predetermined angular position according to the recognition information of the position on the circuit board 5 where the electronic component 1 is mounted. To be determined.

The component mounting station S5 has a component mounting table 56 for supporting the circuit board 5 on which components are mounted.
Is provided, the supporting circuit board 5 is moved in the XY2 directions perpendicular to each other when viewed from above, and the position at which the electronic component 1 carried by the mounting head 17 at each time is to be mounted is defined as a component mounting position. And a predetermined electronic component 1 is mounted at a predetermined position.

Next, operation control of a series of component mounting will be described with reference to the sequence flow shown in FIG.

First, at the component supply station S1, the electronic component 1 supplied by the suction nozzle 2 is sucked and held and picked up. When the electronic component 1 reaches the preliminary rotation station S2, the rotating means 4 is controlled by the preliminary rotation control means 60. Then, the suction nozzle 2 is preliminarily rotated by a predetermined amount in a predetermined direction around the component handling center line X in the direction indicated by the arrow A for positioning. As a result, any rattling or backlash that shifts in the rotational direction by driving in the direction A between the suction nozzle 2 and the outer cylinder 45 that is the rotation source that receives the rotation in the certain direction. The positioning will be lost. The angular position of the electronic component 1 held by the suction nozzle 2 in this state around the component handling center line X is recognized at the next recognition station S3, and the position on the circuit board 5 where the electronic component 1 is to be mounted. The determination unit 61 determines whether the position is a predetermined angle position according to the information recognition result.

When it is not at the predetermined angular position, the mounting head 17 having the suction nozzle 2 holding the electronic component 1 by suction is held.
Reaches the correction rotation station S4, the rotation means 4 is controlled by the correction rotation control means 62, and the electronic component 1
The suction nozzle 2 is corrected and rotated in the same direction of the arrow A as in the case of the preliminary rotation, so that is at a predetermined angular position.

The deviation of the angular position of the electronic component 1 is shifted by + α in the forward correction direction which can be corrected by the rotation in the direction A as shown in FIG. As shown, there is a case where there is a shift of -α in the reverse correction direction that can be corrected by the rotation in the direction B opposite to the direction A.

In either case, correction can be made by rotating the suction nozzle 2 in the same direction A as shown in FIGS. 3 (a) and 3 (b).

As described above, if the direction of the electronic component 1 is corrected by correctingly rotating the suction nozzle 2 in the direction of A as in the preliminary rotation, the correction rotation drive may cause any backlash or other deviation that may cause a shift in the driving direction. This is achieved without play by maintaining the state at the time of the preliminary rotation without backlash, and the positioning correction can be performed with high accuracy so that the electronic component 1 is at a predetermined angular position.

However, in the case of FIG. 3B, if the correction is made only by the rotation in the direction of A, the required rotation angle becomes large. Therefore, as shown by the broken line in FIG. 2 is rotated in the B direction by at least the play BR in the rotation direction due to the backlash or the backlash or the like more than the required angle of the correction, and then is corrected and rotated in the A direction, so that the influence of the play as described above is eliminated. Highly accurate positioning correction is possible. This is because the play specifies
If this is taken into account in the calculation for setting the correction rotation amount, it is equivalent to eliminating the influence of play and correcting the rotation only in the A direction. The present embodiment shown in FIG. 4 adopts this method and shortens the time.

Further, when the suction nozzle 2 pre-rotated at the pre-rotation station S2 is disengaged from the rotation means 4, and when the suction nozzle 2 reaches the correction rotation station S4 and re-engages with the rotation means 4, the pre-rotation is performed. If there is a possibility that the rotation direction A does not rattle or backlash with respect to the rotation direction in the direction A due to the rotation, the pre-rotation drive is performed while the rotation means 4 is engaged with the suction nozzle 2 at the recognition station S3. , The recognition, the determination, and the correction rotation drive may be performed consistently. However, 1
Since there is a problem that the time required at one station becomes long, it is preferable to provide a dedicated rotating means 4 for each mounting head 17 and use it while moving it together. In this case,
If necessary, it is possible to preferably maintain the forced positioning state until the next component mounting station S5 is reached and component mounting is performed.

The electronic component 1 thus positioned at the correction rotation station S4 with high precision reaches the component mounting station S5 by the mounting head 17, and is precisely positioned at a predetermined position on the circuit board 5 positioned there. Attached, improving both product quality and yield.

At the return rotation station S6, the suction means 2 on which the electronic component 1 has been mounted is rotated by the rotation means 4 so as to return to the initial rotation position.

The present invention is applicable to all cases where various components other than the electronic component 1 are mounted on various mounting objects other than the circuit board 5 with high precision positioning. It is valid.

[0036]

According to the present invention, a component can be mounted at a predetermined angle at a predetermined position on an object to be mounted with high accuracy without being affected by backlash or backlash of a mechanism for holding and rotating the component handling means. be able to.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a component mounting apparatus as a representative embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a holding and rotating mechanism of a mounting head having a suction nozzle of the apparatus of FIG. 1;

FIG. 3 is an explanatory diagram showing an operation cycle from component holding to component mounting of the apparatus of FIG. 1;

FIG. 4 shows the operation of the device shown in FIG. 1 according to the operation cycle shown in FIG. 3;
9 is a flowchart illustrating an example of two component mounting steps.

FIG. 5 is a flowchart showing a conventional component mounting process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Suction nozzle 3 Recognition camera 4 Rotation means 5 Circuit board 12 Intermittent rotation drive device 13 Main shaft 14 Support cylinder 16 Rotating head 17 Mounting head 18 Linear guide 19 Support block 20 Cam follower 21 Cam cylinder 21a Elevating cam groove 32 Parts supply Mechanism 43 Nozzle shaft 45 Outer cylinder 46 Pin 47 Slot 53 Engagement part 56 Component mounting table 60 Preliminary rotation control means 61 Judgment means 62 Correction rotation control means X Component handling center line

 ──────────────────────────────────────────────────の Continued on the front page (72) Hiroshi Nasu, Inventor 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Hiroyuki Kiyomura 1006 Kadoma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (2)

[Claims] 1. A part to be supplied is held by gripping or suction by a part handling means, an angular position of the held part around a component handling center line is recognized, and if the angular position is a predetermined angular position, a predetermined angle is maintained. If it is not an angular position, in the component mounting method where the component handling means is rotated around the component handling center line to correct the position of the component and then mounted on the mounting target, the component handling means holding the component is changed to the angular position of the component Before recognizing, after pre-rotating and positioning in a certain direction around the component handling center line, the angular position of the component is recognized, and when the component is not at the predetermined angular position, the component handling means is the same as the preliminary rotation. The component must be positioned and corrected so that it is at a predetermined angular position by rotating the component in the direction around the component handling center line before mounting. Component mounting method according to claim. 2. A component supply means, a component mounting table for holding and positioning a mounting object on which a component is mounted and providing the component mounting, and a component handling means repeatedly moved between the component supply means and the component mounting table. The component supplied from the component supply means is held by gripping or suction by the component handling means, carried to the component mounting table, and repeatedly mounted on the mounting table at a predetermined position of the mounting target. A mounting mechanism, a recognizing means for recognizing an angular position of the component held by the component handling means around the component handling center line, and a component handling means holding the component before being recognized by the recognizing means, A pre-rotation means for pre-rotating and positioning in a predetermined direction around the component, and whether the angular position of the part recognized by the recognition means is a predetermined angular position Only when the determination result is not at the predetermined angular position, the component held by rotating the component handling means holding the component in the same direction as the preliminary rotation before the component mounting is determined only when the determination result is not the predetermined angular position. A component mounting device comprising: a correction rotation unit that performs positioning correction so as to be at a predetermined angular position.