JPH08195599A - Method and apparatus for detecting component mounting state in mounting apparatus - Google Patents

Abstract

PURPOSE: To achieve higher mounting accuracy by obtaining better calibration data by detecting a component mounting state based on an image position of a mark of a dummy component undergone image pickup. CONSTITUTION: Upon processing for obtaining calibration data, a dummy component 40 is mounted on a printed board, and dot-marks 41 applied to the dummy component 40 undergoes image pickup by a board recognizing camera 27, and the calibration data are obtained by detecting the mounting state of the dummy component based on this image, so that no limitation is imposed on the component to be a basis of the calibration data in relation to the visual field of the board recognizing camera 27. Therefore, even in an apparatus for mounting a component larger than the visual field of the board recognizing camera 27 and requiring high accuracy upon mounting, better calibration data can be obtained by carrying out the processing for obtaining the calibration data by using the dummy component 40 corresponding to that component, so that higher mounting accuracy can be achieved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounter for mounting a component on a printed circuit board, and in particular, it recognizes a component sucked by a nozzle member by a recognizing means and mounts the component in consideration of a suction displacement of the component with respect to the nozzle member. The present invention relates to a component device state detection method for such a mounting machine and the same device.

[0002]

2. Description of the Related Art Conventionally, a component mounting head unit having a nozzle member sucks components such as ICs from a component supply portion and transfers them onto a positioned printed circuit board and places them on a predetermined position of the printed circuit board. A mounting machine adapted to be mounted is generally known. Recently, in this type of mounting machine, an imaging camera for recognizing a printed circuit board is mounted on the head unit, and the fiducial mark on the printed circuit board is recognized by this camera to accurately detect the head unit and the printed circuit board. By installing a component recognition camera on the device that secures the mounting accuracy by detecting various positional relationships, and by mounting the component recognition camera on the mounting machine main body and recognizing the component after suction by this camera, the suction deviation of the component with respect to the nozzle member can be detected. A device has been proposed in which mounting is performed in consideration.

In such a mounting machine, the positional relationship between the imaging camera for component recognition mounted on the head unit and the nozzle member and the positional relationship between the movement reference of the head unit and the component recognition camera are set precisely. It is indispensable to properly maintain the relative positions and the operation amounts of these devices in order to improve the mounting accuracy. Therefore, the components are mounted on a trial basis before the operation of the mounting machine, and the mounting state (positional deviation, etc.)
It has been performed to adjust the relative positional relationship and operation amount of each device as described above, but since such adjustment work is a trial and error work, a high degree of skill is required. Workability is extremely poor.

Therefore, in an apparatus in which both the image pickup camera and the component recognition camera for recognizing the printed circuit board are mounted as described above, the component recognition camera recognizes the component after suction and the suction displacement of the component with respect to the nozzle member is detected. After mounting the components on the printed circuit board, the components are mounted on the printed circuit board by using an image pickup camera for recognizing the printed circuit board to check the component mounting status. Then, this is stored as correction data (calibration data) at the time of mounting.

[0005]

By the way, in the conventional apparatus for picking up the image of the mounted component by the image pickup camera for recognizing the printed circuit board for the purpose of detecting the fiducial mark on the printed circuit board, the field of view, that is, the image pickup range is reduced. There are naturally limits to the size of the parts that are narrow and can be recognized.
Therefore, in the above-described process for obtaining the calibration data, the largest camera that can capture the entire image is imaged by the image pickup camera for recognizing the printed circuit board, and the calibration data is obtained based on the image. .

However, in reality, there are cases where a component larger than the field of view of an image pickup camera for recognizing a printed circuit board and that requires high precision in mounting, for example, a component such as QFP is mounted. Therefore, in the conventional device,
If the calibration data is obtained based on a component that is smaller than a component such as QFP and does not require high accuracy for mounting, there is a possibility that sufficient precision may not be obtained when mounting the component such as QFP. Need to be resolved.

Further, in the above-mentioned conventional apparatus, when checking the component mounting state based on the image pickup by the image pickup camera for recognizing the printed circuit board, the image processing is performed in the same manner as the component recognition processing by the component recognizing means. In the case of a component having a part, the component is recognized by scanning the lead image accurately. Therefore, it is also necessary to improve this and shorten the time required for the above-described processing for obtaining the calibration data in terms of work efficiency.

The present invention has been made in order to solve the above problems, and an object of the present invention is to provide a position correcting method for a mounting machine and an apparatus therefor capable of further improving mounting accuracy.

[0009]

According to a first aspect of the present invention, there is provided a component mounting state detecting method for a mounting machine, comprising a head unit having a nozzle member for sucking a component, and the head unit sucks a component from a component supply side. In a mounter configured to recognize a component by the component recognition means and mount the component on a printed circuit board, a dummy component having a predetermined mark on the surface is sucked by a head unit, and the dummy component by the component recognition means. After the recognition, the mounting position is corrected based on the recognition result, the dummy component is mounted on the printed circuit board, and then the mark is picked up by the image pickup means for recognizing the printed circuit board provided in the head unit. The component mounting state is detected based on the image position of the imaged dummy component mark.

According to a second aspect of the present invention, there is provided a component mounting state detecting device for a mounting machine, wherein a head unit having a nozzle member for picking up a component, a driving means for moving the head unit, and a moving range of the head unit are arranged. In a mounting machine provided with a component recognition means, a dummy component having a predetermined mark on its surface, an image pickup means for recognizing a printed circuit board mounted on the head unit, and a dummy component mounted on the printed circuit board. Drive control means for operating the drive means so as to arrange the image pickup means at a predetermined image pickup position with respect to the mark, and calibration data used for mounting processing by detecting the component mounting state based on the image position of the imaged mark of the dummy component And a calculation means for obtaining

According to a third aspect of the present invention, there is provided a component mounting state detecting device for a mounting machine according to the second aspect, wherein the dummy component has a relatively large size and is required to have a high mounting accuracy. A plate-shaped member that imitates a component is provided with at least a pair of dot-shaped marks attached such that the midpoint is at the center position of this member.

[0012]

According to the component mounting state detecting method of the mounting machine described in claim 1, the mark of the dummy component mounted on the printed circuit board is imaged, and the mounting state of the component is detected based on the image position of the mark. Therefore, there is no inconvenience that the mounting state cannot be detected due to the relationship between the field of view of the imaging means for board recognition and the components to be mounted. Further, since the dummy parts are recognized based on the mark detection, the recognition process becomes easy,
It is possible to reduce the time required for this processing.

In the claims, the term "component recognition means" is based on detection of a projected image by irradiating a component with laser light in addition to an image pickup camera such as a CCD camera for picking up a so-called component image. It is also intended to include a device for recognizing parts by means of a device.

According to the component mounting state detecting device of the mounting machine described in claim 2, the component mounting state is detected by the above method, and the process for obtaining the calibration data based on the detection result is automatically performed.

According to the component mounting state detecting device of the mounting machine of the third aspect, the center position of the component can be detected by obtaining the midpoint of each dot-shaped mark image in the mounted dummy component. In addition, it is possible to detect the inclination of the component by obtaining the inclination degree of the line segment connecting the dot-shaped mark images.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A component mounting state detecting device of the present invention is shown in FIG.
It will be described with reference to FIGS.

1 and 2 show the structure of a mounter in which the component recognition apparatus according to the present invention is mounted. As shown in the figure, a conveyor 2 for conveying a printed circuit board is arranged on a base 1 of the mounting machine, and the printed circuit board 3 is conveyed on the conveyor 2 and stopped at a predetermined mounting work position. It has become. A component supply unit 4 is arranged on the side of the conveyor 2. The component supply unit 4 is provided with a feeder for supplying components, for example, a plurality of rows of tape feeders 4
a.

A head unit 5 for mounting components is installed above the base 1. The head unit 5 is movable across the component supply unit 4 and the component mounting unit where the printed circuit board 3 is located.
It can move in the axial direction (direction of the conveyor 2) and the Y-axis direction (direction orthogonal to the X-axis on the horizontal plane).

That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 rotatably driven by a Y-axis servomotor 9 are arranged on the base 1, and the head unit is mounted on the fixed rail 7. A support member 11 is arranged, and a nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. In addition, the support member 11 has an X
An axial guide member 13 and a ball screw shaft 14 driven by an X-axis servomotor 15 are arranged, and the head unit 5 is movably held by the guide member 13.
A nut portion (not shown) provided on the head unit 5 is screwed onto the ball screw shaft 14. And
By the operation of the Y-axis servomotor 9, the supporting member 11 is moved to Y
While moving in the axial direction, the head unit 5 moves in the X-axis direction with respect to the support member 11 by the operation of the X-axis servomotor 15.

Further, the Y-axis servomotor 9 and the X-axis servomotor 15 are provided with position detection devices 10 and 16 each composed of a rotary encoder, by which the moving position of the head unit 5 is detected. It is like this.

As shown in FIG. 3, the head unit 5 has first and second nozzle members 21 for attracting components,
22 is provided. Both nozzle members 21, 22
Are capable of moving in the Z-axis direction (vertical direction) and rotating around the R-axis (nozzle center axis) with respect to the frame of the head unit 5, respectively. The Z-axis servomotors 17, 18 and the R-axis servomotors 19, 20 is operated. The servo motors 17 to 20 are respectively provided with position detecting means 23 to 26, which are encoders, by which the nozzle members 21 and 22 are provided.
The operating position is detected. Further, each nozzle member 21, 22 is connected to a negative pressure supply means (not shown) via a valve or the like, and a negative pressure for component suction is supplied to the nozzle member 21, 22 when necessary.

Further, a board recognizing camera 27 (imaging means for recognizing a printed board) is attached to a side front part of the head unit 5. This board recognition camera 27
The image of the fiducial mark provided on the surface of the printed circuit board 3 at the time of mounting is taken, and the mark 4 provided on the dummy component 40 in the process of obtaining calibration data described later.
1, 42 are imaged. A light-emitting body 28 made up of a large number of LEDs is fixed to the front end (lower end) of the board recognition camera 27, and the light-emitting body 2 is attached during imaging.
The image is taken in by the board recognition camera 27 through the detection hole 28a provided in 8 while emitting light.

The dummy part 40 is formed corresponding to a relatively large part (QFP in this embodiment) having a large number of leads and requiring high mounting accuracy. Specifically, as shown in FIG. 5, linear marks 42 corresponding to the leads of the QFP are arranged side by side on the edge of a rectangular glass plate 43 (plate-shaped member) simulating the QFP, and The dummy component 40 is configured by adding a dot-shaped mark 41 at a symmetrical position on the diagonal of the glass plate 34 so that the point becomes the center position of the dummy component.

Further, the base 1 is provided with a component recognition camera 29 (component recognition means) for recognizing the suction state of the components sucked by the head unit 5. The component recognition camera 29 is arranged on the side of the component supply unit 4, and after the component supply unit 4 picks up a component, the head unit 5 is moved to a predetermined position above the component recognition camera 29. As a result, the suction component is imaged.

Next, the control system of the mounting machine will be described with reference to the block diagram of FIG.

A control device 30 as shown in FIG. 4 is mounted on the mounter, and the nozzle members 21 and 21 of the Y-axis and X-axis servomotors 9 and 15 and the head unit 5 are mounted.
The Z-axis servomotors 17 and 18, the R-axis servomotors 19 and 20, and the position detection means 10, 16 and 23 to 26 for the respective servomotors are all provided in the controller 30.
Is electrically connected to and is controlled by the control device 30. More specifically, the main arithmetic unit 3 having predetermined information for controlling the operation of the mounting machine in a centralized manner.
2 and an axis controller 3 controlled by the main calculator 32
1 is provided in the control device 30, and the servo motor and the like are connected to the axis control unit 31.

The axis control section 31 and the main calculation section 32 perform control for performing a predetermined mounting operation at the time of mounting, and
In the process of obtaining calibration data described later, the two dummy components 40 are sequentially mounted at predetermined component mounting positions on the printed circuit board 3, and the board recognition camera 27 is mounted at a position corresponding to the mounting position of each dummy component 40. It functions as a drive control means for moving the head unit 5 to be arranged.

An image processing unit 33 is connected to the main computing unit 32, and the board recognition camera 27 and the component recognition camera 29 are connected to the image processing unit 33. That is, the image data captured by the board recognition camera 27 and the component recognition camera 29 is subjected to predetermined image processing and output to the main calculation section 32, so that the main calculation section 32 performs the fiducial of the printed circuit board 3. The marks and the marks 41 and 42 of the dummy component 40 are recognized.

The control device 30 is further provided with a calibration data calculation section 34 (calculation means), the calibration data calculation section 34 is connected to the main calculation section 32 and the storage section 35, and further the storage section 35. Are connected to the main calculation unit 32.

When each mark 41 of the dummy component 40 is imaged by the board recognition camera 27 in the process of obtaining the calibration data, the image data is used as the calibration data calculation unit 34.
Is output to The calibration data calculation unit 34 obtains the center position of the dummy component 40 based on the image position of each mark 41, as described later in detail. Then, based on this, the nozzle members 21, 2 with respect to the reference point of the head unit
The error of the relative position 2 and the error of the recognition center position of the component recognition camera 29 are calculated, and calibration data is obtained from these errors, and this calibration data is stored in the storage unit 35.
Is stored. Then, at the time of mounting, the calibration data stored in the storage unit 35 is read out to the main calculation unit 32, and the mounting control is performed using this.

Next, the operation of the component mounting state detection (processing operation for obtaining the calibration data) in the mounting machine will be described.

In the mounting machine, for example, a process of obtaining calibration data in the mounting machine is performed based on the flowchart shown in FIG. 6 at the initial setting stage of the mounting machine or periodically as necessary. In the following description, the absolute coordinates shown in the simulated view of FIG. 7 will be used.

In this figure, (1) O; origin of absolute coordinates (2) P _A ; recognition center of substrate recognition camera 27 when head unit 5 moves (reference point of head unit 5) (3) P _B The recognition center of the component recognition camera 29 (4) R; the relative position of the nozzle member 21 (22) to the reference point of the head unit 5 (5) M ₁ ; the mounting position of the dummy component (6) M ₂ ; the mounting of the dummy component Position. Here, the recognition center of the board recognition camera 27, that is, the origin of the coordinate system of the board recognition camera 27 is defined as the reference point of the head unit 5, and this reference point is the origin O of the absolute coordinates.
Is defined as the movement base point of the head unit 5.
Therefore, the position P _A of the reference point when the head unit 5 moves is determined by the amount of movement of the head unit 5 from the movement base point in the X and Y directions, and has sufficient accuracy.

In this process, the printed circuit board 3 is fixed at a predetermined mounting work position at the time of mounting, and the board recognition camera 27 recognizes the fiducial mark attached to the printed circuit board 3 (step S1).

Next, the head unit 5 is moved to the component supply unit 4, and the dummy component 4 previously set in the component supply unit 4 by the one nozzle member 21.
0 (hereinafter referred to as the dummy member 40A) is picked up. After the dummy component 40A recognizes the component by the component recognition camera 29, the mounting position M of the printed circuit board 3 is detected.
₁ is attached (steps S2 to S4).

More specifically, the dummy component 40A picked up from the component supply unit 4 is arranged above the component recognition camera 29, and the component recognition camera 29 picks up an image of the component. Then, the center position of the dummy component 40A is obtained based on the normal image processing of the captured image of the dummy component 40, for example, image scanning of the mark 42 indicating the lead of the QFP, and the component recognition camera 29. The displacement amount of the center of the dummy component 40A with respect to the recognition center P _B is calculated, and the head unit 5 is moved to the target position in consideration of this displacement amount, and the dummy component 40A is mounted at the mounting position M ₁ .

When the first dummy component 40A is mounted, the head unit 5 is moved, and the second dummy component 40 (hereinafter referred to as the dummy member 40B) is sucked by the nozzle member 21. After the recognition camera 29 recognizes the component, this component has a predetermined angle, specifically, 1
The printed board 3 is mounted at the mounting position M _{2 while} being rotated by 80 ° (steps S5 to S7). At this time, as in the case of the first dummy component 40A, the deviation amount of the center of the dummy component 40B from the recognition center P _B of the component recognition camera 29 is obtained based on the image pickup by the component recognition camera 29. Then, the head unit 5 is moved to the target position in which the amount of displacement when the dummy component 40B is rotated by 180 ° and the relative position of the nozzle member 21 are taken into consideration, and the nozzle member 21 is rotated by 180 °. The lever dummy component 40B is mounted at the mounting position M ₂ .

When the mounting of the two dummy components 40A and 40B is completed in this way, the head unit 5 is successively moved above the component mounting positions M ₁ and M ₂ , that is, the board recognition camera 2.
The recognition center P _A of the dummy component 40 is moved to a position above the position corresponding to each dot mark 41 of each dummy component 40A, 40B, whereby the dummy component 40 by the board recognition camera 27 is moved.
Imaging of each mark 41 of A and B is performed (step S
8, S9).

When the images of the marks 41 of the dummy parts 40A and 40B are picked up, the image positions of the dummy parts 40A and 40B are determined based on the image data taken in by the board recognition camera 27 in the calibration data calculating section 34. Desired.
That is, for each dummy component 40A, B, the midpoint of each mark 41, that is, the center position of each dummy component 40A, B is determined, and based on this, the relative position of the nozzle member 21 and the recognition center of the component recognition camera 29 are determined. An error is obtained (steps S10 and S11).

More specifically, when the center position of each of the obtained dummy parts 40A and 40B is represented on the coordinates with the recognition center P _A of the board recognition camera 27 as the origin, the board recognition camera 27 and the nozzle member are described. If the relative positional relationship between the component 21 and the component recognition camera 29 is appropriate, the movement of the head unit 5 with respect to the movement base point O is appropriate as described above, and therefore the center positions of the dummy components 40A and 40B both overlap and the recognition center. It matches P _A (see FIG. 8).

However, when the relative positional relationship between the board recognition camera 27, the nozzle member 21 and the component recognition camera 29 is not properly maintained, each dummy component 40 is used.
A shift will occur between the center positions of A and B.

That is, when there is an error ΔE _{A in} the relative position R of the nozzle member 21, this error ΔE _A is regarded as a suction displacement (a displacement of the component center with respect to the nozzle rotation center) in the component recognition by the component recognition camera 29. Since the mounting position is corrected by the correction, the mounting position of the dummy component 40A mounted at 0 ° with respect to the recognition angle does not deviate, but the mounting position of the dummy component 40B mounted at 180 ° does not shift. _A deviation of twice the ΔE _A is added (see FIG. 9). Also,
If there is an error ΔE _{B at} the recognition center position P _B of the component recognition camera 29, ΔE _B is added to the dummy component 40A mounted at 0 ° as a displacement of the mounting position, and 18
For the dummy component 40B mounted at 0 °, ΔE _B
Is subtracted (see FIG. 10).

Therefore, in step S11, the relative position of the nozzle member 21 and the component recognition camera 2 are determined based on the above-described deviation of the center positions of the dummy components 40A and 40B.
The error of the recognition center of 9 is obtained, and the relative position of the nozzle member 21 and the component recognition camera 29
The recognition center position of is corrected, and the corrected calibration data is stored in the storage unit 35 (step S12).

When the calibration data is stored in this manner, the calibration process according to this flowchart is completed. The above is the process for one nozzle member 21, and in the mounting machine of the above-described embodiment, the above process is also performed for the nozzle member 22. That is, step S is performed for each nozzle member.
By repeating the processing from 2 to step S12,
Calibration data is calculated for each nozzle member 21 and 22 and stored in the storage unit 35.

As described above, according to the mounting machine, the dummy component 40 is mounted on the printed circuit board 3 in the process of obtaining the calibration data, and the dot-shaped mark 4 attached to the dummy component 40.
1 is picked up by the board recognition camera 27, and the mounting state of the dummy component 40 is detected based on this image to obtain the calibration data. There are no restrictions on the standard parts.

Therefore, even an apparatus that mounts a component that is larger than the field of view of the board recognition camera 27 and that requires high precision in mounting is compatible with that component as in the above embodiment. By performing the process of obtaining the calibration data using the dummy parts, it is possible to obtain better calibration data, and as a result, it is possible to improve the mounting accuracy.

Further, regarding the recognition of the dummy parts 40A and 40B in the process of obtaining the calibration data, the center position of each dummy component 40 can be obtained by obtaining the midpoint of the image of each mark 41, so a simple process With dummy parts 4
Recognition of 0 can be performed. Therefore, in the process of recognizing a component, the time required for the process of recognizing the component is shorter than that of the process of capturing the image of the entire component and recognizing the lead image by scanning the lead image accurately. The time required for can be shortened.

The mounting machine is an embodiment to which the component mounting state detecting device according to the present invention is applied, and the specific structure thereof can be appropriately changed without departing from the gist of the present invention. Is. For example, in the mounting machine described above, a dummy mark 40 is attached to the dummy component 40 with a linear mark 42 corresponding to the lead of the QFP, and the dummy component 40 is scanned by scanning the image of the mark 42 in the component recognition processing by the component recognition camera 29. Although the mark 42 is recognized, the dummy component 40 is recognized based on the image position of the dot-like mark 41 as in the component recognition by the board recognition camera 27 without attaching the mark 42 to the dummy component 40. It doesn't matter. According to this, compared to scanning the image of the mark 42 and recognizing the dummy component 40, the component recognition can be performed more easily, and therefore, the recognition processing can be performed in a shorter time. However, as in the embodiment, a linear mark 42 indicating the QFP lead is attached, and this mark 42
If the dummy component 40 is recognized by scanning the image of, the dummy component 40 can be mounted on the printed circuit board 3 with the same accuracy as that of recognizing and mounting the actual component. Can be expected to
It is desirable from the viewpoint of mounting accuracy.

Further, in the above embodiment, the error in the relative position of the nozzle members 21 and 22 with respect to the head unit reference point and the error in the recognition center position of the component recognition camera 29 are targeted as errors in the assembly and operation of the mounting machine. Although the calibration data is obtained, for example, in addition to this, the calibration data may be obtained with an error in the rotation direction (around the central axis of the nozzle member) of the component recognition camera 29 as a target. In this case, at the time of recognition by the board recognition camera 27, for example, the dummy component 40 mounted at 0 °
Since the deviation ΔE _C in the rotational direction is added to A (see FIG. 11), the calibration data can be calculated by finding this deviation ΔE _C. In this case, the deviation ΔE _C may be calculated based on the inclination of the line segment connecting the images of the marks 41.

Further, in the above embodiment, the dummy component 40 is used.
A dot-like mark 41 on the diagonal line of the
Although the linear mark 42 corresponding to the lead of P is provided, the shape, arrangement, number, etc. of the marks attached to the dummy component 40 may be appropriately set so that the dummy component 40 can be recognized more accurately. do it. However, the mark to be imaged by the board recognition camera 27 needs to be included in the field of view.

[0051]

As described above, according to the present invention,
Take an image of the mark of the dummy part mounted on the printed circuit board,
Since the mounting state of the component is detected based on the image position of this mark, there is no inconvenience that the mounting state cannot be detected due to the relationship between the field of view of the imaging means for board recognition and the component to be mounted, as in the conventional device. It is possible to obtain better calibration data, and as a result, it is possible to further improve the mounting accuracy. Further, since the mounting state is detected based on the recognition of the mark attached to the dummy component, the recognition process is facilitated and the time required for this process can be shortened.

In particular, at least a pair of dot-like marks are provided on a plate-shaped member simulating a relatively large-sized mounting component requiring high mounting accuracy so that the midpoint is located at the center position of the member. If the component is configured, the center position of the component can be detected by determining the midpoint of each dot-shaped mark image in the mounted dummy component, and the line segment connecting the dot-shaped mark images can be detected. The inclination of the component can be detected by determining the degree of inclination, and the mounting state of the component can be easily detected with a simple configuration.

[Brief description of drawings]

FIG. 1 is a plan view showing a mounter to which an example of a component mounting state detecting device according to the present invention is applied.

FIG. 2 is a front view showing a mounting machine to which an example of the component mounting state detecting device according to the present invention is applied.

FIG. 3 is a front view showing a head unit.

FIG. 4 is a block diagram showing a control system of the mounting machine.

FIG. 5 is a plan view showing an example of a dummy component.

FIG. 6 is a flowchart showing a detection process in the component mounting state detection device of the present invention.

FIG. 7 is a schematic view showing a positional relationship between a board recognition camera, a component recognition camera, and a nozzle member.

FIG. 8 is a diagram showing an example in which the center positions of the first and second dummy parts are represented on coordinates with the recognition center of the board recognition camera as the origin (relative relationship between the board recognition camera, the nozzle member, and the part recognition camera). If the data showing the physical relationship is proper).

FIG. 9 is a diagram showing an example in which the center positions of the first and second dummy parts are represented on coordinates with the recognition center of the board recognition camera as the origin (when there is an error in the relative position of the nozzle member). .

FIG. 10 is a diagram showing an example in which the center positions of the first and second dummy components are represented on coordinates with the recognition center of the board recognition camera as the origin (there is an error in the position of the recognition center of the component recognition camera). If you do).

FIG. 11 is a diagram showing an example in which the center position of the first dummy component is represented on coordinates with the recognition center of the board recognition camera as the origin (when there is an error in the rotation direction of the component recognition camera).

[Explanation of symbols]

 3 Printed Circuit Board 4 Component Supply Section 5 Head Unit 9 Y-Axis Servo Motor 10, 16, 23, 24, 25, 26 Position Detection Means 11 Support Member 13 Guide Member 15 X-Axis Servo Motor 17, 18 Z-Axis Servo Motor 19, 20 R-axis servo motors 21 and 22 Nozzle member 27 Board recognition camera 29 Component recognition camera 30 Control device 31 Axis control unit 32 Main calculation unit 33 Image processing unit 34 Calibration data calculation unit 35 Storage unit 40 Dummy component 41 Dot-shaped mark 42 Wire Mark

Claims (3)

[Claims] 1. A head unit having a nozzle member for picking up a component, wherein the head unit picks up a component from a component supply side, recognizes the component by a component recognition means, and mounts the component on a printed circuit board. In the configured mounter, a dummy component with a predetermined mark on the surface is sucked by the head unit, the dummy component is recognized by the component recognition means, and the mounting position is corrected based on the recognition result. A dummy component is mounted on the printed circuit board, and then the mark is imaged by an image pickup means for recognizing the printed circuit board provided in the head unit, and the component mounting state is determined based on the image position of the imaged mark of the dummy component. A method for detecting a component mounting state of a mounting machine, which is characterized by detecting. 2. A mounting machine comprising a head unit having a nozzle member for picking up a component, a driving unit for moving the head unit, and a component recognizing unit arranged within the moving range of the head unit A dummy component having a predetermined mark attached to it, an image pickup means for recognizing a printed circuit board mounted on the head unit, and the image pickup means arranged at a predetermined image pickup position with respect to the mark of the dummy component mounted on the printed circuit board. Therefore, it is provided with a drive control means for operating the drive means, and a calculation means for detecting a component mounting state based on the image position of the imaged dummy component mark to obtain calibration data to be used in the mounting process. Component mounting state detection device for mounting machine. 3. The at least one pair of dummy parts is attached to a plate-shaped member simulating a comparatively large-sized mounting part that requires high mounting accuracy so that the midpoint is at the center position of this member. The component mounting state detection device for a mounting machine according to claim 2, wherein the mounting state detection device includes a dot mark.