JP5996979B2 - Electronic component mounting apparatus and mounting position correction data creation method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and a mounting position correction data creating method, and more particularly to an electronic component mounting apparatus including a head unit including an imaging unit and a mounting position correction data creating method.

  Conventionally, an electronic component mounting apparatus including a head unit including an imaging unit is known (for example, see Patent Document 1).

  Patent Document 1 includes a head unit (suction head) that includes one imaging unit and one mounting head (suction nozzle) disposed at an interval (offset interval) with respect to the imaging unit. An electronic component mounting apparatus is disclosed. This electronic component mounting apparatus is configured to create mounting position correction data prior to electronic component mounting. Specifically, as a first step, the head unit is moved so that the imaging unit is positioned above the positioning mark of the jig substrate with the positioning mark, and the positional deviation of the imaging unit with respect to the positioning mark is acquired. As a second step, the head unit is moved so that the mounting head is positioned above the same positioning mark, and component mounting is performed. As a third step, the component mounted by the imaging unit is imaged, and the displacement of the mounted component with respect to the positioning mark is acquired. Thus, the positional deviation data of the imaging unit with respect to the positioning mark and the positional deviation data of the mounted component with respect to the positioning mark are acquired, and the sum of both positional deviation data is used as the correction data for the mounting position. In the above-mentioned patent document 1, by using both positional deviation data, a horizontal movement error (landing error) accompanying a vertical movement when mounting the component of the mounting head, a movement error caused by a change in the movement path of the head unit. In addition, the mounting error associated with the entire mounting control is reduced.

JP 2006-108457 A

  However, in the electronic component mounting apparatus described in Patent Document 1, when the mounting position is corrected, the entire head unit is inclined, and the interval between the mounting head and the imaging unit in the head unit (offset interval) is It is not considered at all.

  That is, the X axis and Y axis of the moving mechanism of the head unit are stretched and wavy due to thermal distortion, and the positional deviation amount of the entire head unit changes according to the position coordinates, and the inclination of the head unit also changes. . When the inclination of the head unit changes, the mounting head that is separated from the imaging unit on the head unit changes the inclination of the head unit relative to the position relative to the imaging unit when there is no inclination of the head unit. The position with respect to the imaging unit changes as a reference.

  In the above-mentioned patent document 1, by acquiring the positional deviation of the imaging unit with respect to the positioning mark in the first step, the imaging unit can be accurately positioned above the positioning mark, while the mounting head and the imaging unit are only offset by an offset interval. When the mounting head is positioned above the same component positioning mark in the second step because it is separated, the imaging unit is located above the position coordinate that is separated from the position coordinate obtained in the first step by an offset interval. Will be placed. That is, it is possible to correct a change in the amount of positional deviation of the entire head unit. However, the positional deviation of the imaging unit above the positioning mark due to the tilt of the head unit is different from the positional deviation of the imaging unit at the position coordinates moved from there by the offset interval. Therefore, even if the sum of the positional deviation data of the mounted component (mounting head) in the third step and the positional deviation data of the imaging unit in the first step is used as the correction data for the mounting position, the actual position is different. Since the correction data is created based on the sum of the positional deviations, the mounting position by the mounting head cannot be corrected accurately.

  Furthermore, an electronic component mounting angle error occurs during mounting due to the inclination of the entire head unit. Furthermore, a mounting angle error of the electronic component at the time of mounting occurs because the rotation center axis of the mounting head is slightly inclined with respect to the mounting surface (substrate). When the rotation angle of the mounting head is changed when the rotation center axis of the mounting head is tilted from the vertical direction with respect to the mounting surface (substrate), the mounting angle of the electronic components corresponding to this rotation angle is the same, small, Since it changes between coincidence, large, and coincidence, a displacement in the mounting angle of the electronic component occurs, and it is necessary to correct the mounting position according to the rotation angle of the mounting head. In the above-mentioned Patent Document 1, there is a problem that the mounting position in the rotation direction cannot be accurately corrected because consideration is not given to the inclination of the entire head unit and the direction of components during mounting.

  Furthermore, when the center axis of rotation of the mounting head swings, the mounting position of the electronic component changes in the horizontal direction corresponding to the mounting angle of the electronic component during mounting, so the mounting position is accurately corrected. There is a problem that can not be. Also, when the rotation center axis of the mounting head swings, the angle at which the rotation center axis of the mounting head tilts from the vertical direction with respect to the mounting surface (substrate) changes, so it rotates according to the mounting angle of the electronic component. There is a problem that the positional deviation in the direction changes, and the mounting position in the rotational direction cannot be corrected accurately.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide an electronic component mounting apparatus and mounting position correction data generation capable of correcting the mounting position more accurately. Is to provide a method.

In order to achieve the above object, an electronic component mounting apparatus according to a first aspect of the present invention includes a first imaging unit and a mounting head that is spaced apart from the first imaging unit by a predetermined offset interval. And a control unit that controls to move the mounting head to a component mounting position by moving the head unit in a horizontal plane and rotating the mounting head, and the control unit performs first imaging at a target position coordinate. The first error data due to the positional deviation of the first imaging unit when moving the part is acquired for each of a plurality of position coordinates, and a first error data group is created. and positional deviation in the horizontal direction with respect to first imaging unit and the predetermined position coordinates of the mounting head at the time of moving the first image pickup unit offset distance between the mounting head, but offset interval from Jo Tokoro coordinates In position moved the first imaging unit, first obtains a second error data including the positional deviation in the rotational direction at the time of mounting the electronic parts mounting head on a substrate in the target direction position for each of the plurality of position coordinates Two error data groups are created, first error data for moving the first imaging unit to the mounting target position coordinates is obtained based on the mounting target position coordinates and the first error data group, and based on the first error data. The horizontal displacement when the mounting head is moved to the mounting target position coordinates is corrected, and the mounting head is moved to the mounting target position coordinates based on the mounting target position coordinates and the second error data group. It obtains a second error data including the horizontal position displacement and positional deviation in the rotational direction of the mounting head, upon moving the mounting head to mount the target location coordinates on the basis of the second error data It is configured to add corrected Re not a position of the horizontal position displacement and the rotation direction.

In the electronic component mounting apparatus according to the first aspect of the present invention, at least the horizontal inclination of the head unit and the mounting in the head unit are included, including the horizontal displacement due to the inclination of the rotation center axis of the mounting head with respect to the Z axis. head and based on the distance (offset distance) between the first imaging unit, the horizontal positional deviation of the electronic component with respect to the target mounting position for mounting an electronic component on a target mounting position and the horizontal direction of at least the head unit it is possible to correct the Re not a position in the rotational direction based on the inclination, it is possible to correct the mounting position more accurately.

In the electronic component mounting apparatus according to the first aspect, preferably, the control unit is configured to acquire the second error data for each of a plurality of position coordinates and a plurality of rotation angles and create a second error data group. Then, the mounting head is moved to the mounting target position coordinates, and second error data when the mounting head is set to a predetermined rotation angle is obtained based on the mounting target position coordinates, the predetermined rotation angle, and the second error data group. It is configured as follows. As a result, even when the rotation axis of the mounting head swings, it corresponds to the rotation angle of the mounting head according to the mounting direction of the electronic component, and is relative to the target mounting position when mounting the electronic component at the target mounting position. horizontal position displacement of the electronic component and, since it is possible to correct the Re not a position in the rotational direction with respect to the mounting direction, it is possible to correct the mounting position more accurately.

  In the electronic component mounting apparatus according to the first aspect described above, preferably, the head unit includes a plurality of mounting heads having different offset intervals with respect to the first imaging unit, and the control unit performs a first operation on each of the plurality of mounting heads. Two error data groups are created. If comprised in this way, the mounting position for every mounting head can be correct | amended more correctly each separately.

In the electronic component mounting apparatus according to the first aspect, preferably, the electronic component mounting apparatus further includes a second imaging unit for imaging the electronic component adsorbed by the mounting head, and the control unit is a jig component imaged by the first imaging unit. Is obtained as a target position coordinate, and the jig part adsorbed to the mounting head at a position where the first image pickup unit is moved from the target position coordinate by an offset interval is imaged by the second image pickup unit, thereby obtaining a jig part. the horizontal position of the mounting head with respect to the center position of the position moved by the offset distance from the goal position coordinates of each position in the rotational direction position when mounting the electronic parts mounting head on a substrate in the target direction position It is configured to recognize the deviation and obtain it as second error data, and pick up the jig part by the mounting head for each of a plurality of position coordinates, and the second imaging unit of the picked up jig part By performing the imaging by being configured to create a second error data group. If comprised in this way, it is easy to image the jig part by the first imaging unit and the second imaging unit with the jig part adsorbed, and easily rotate the rotation center axis of the mounting head. Including a horizontal displacement due to the inclination of the head unit with respect to the Z axis, and based on at least the inclination of the head unit in the horizontal direction and the interval between the mounting head and the first imaging unit in the head unit (offset interval) horizontal position displacement of the electronic component to the mounting position with respect to the target mounting position for mounting the electronic components and to obtain a position not a Re or Ranaru second error data of the rotational direction based on the horizontal tilt of at least the head unit be able to. Note that when picking up jig parts and parts with the mounting head, the picking position of the parts with respect to the mounting head may be unstable and vary. In this case, the mounting head of the component sucked by the mounting head is obtained even if the mounting error is obtained by imaging the mounted jig component after mounting the jig component and acquiring the second error data. Therefore, even if the position correction at the time of mounting based on the second error data is performed, the position shift of the mounted component occurs. On the other hand, according to the present invention, since the second error data is acquired by performing imaging by the second imaging unit in a state where the jig component is adsorbed, it is possible to acquire the second error data with high accuracy. Thus, the mounting position can be set to the correct position by correcting the positional deviation during mounting using the second error data.

In the electronic component mounting apparatus according to the first aspect, preferably, the control unit is configured to acquire the second error data for each of a plurality of position coordinates and a plurality of rotation angles and create a second error data group. Then, the mounting head is moved to the mounting target position coordinates, and second error data when the mounting head is set to a predetermined rotation angle is obtained based on the mounting target position coordinates, the predetermined rotation angle, and the second error data group. It is configured as follows. As a result, even when the rotation axis of the mounting head swings, the horizontal displacement of the electronic component relative to the target mounting position when mounting the electronic component at the target mounting position corresponds to the mounting direction of the electronic component. and, it is possible to correct the Re not a position in the rotational direction with respect to the mounting direction, it is possible to correct the mounting position more accurately.

In the electronic component mounting apparatus according to the first aspect, preferably, the control unit causes the mounting head to mount the electronic component or the jig component on the substrate at a position where the first imaging unit is moved from the target position coordinates by an offset interval. was followed, by imaging the electronic component or jig component by moving the first imaging unit to the target position coordinates, the horizontal position of the center position of the electronic component or jig component with respect to the imaging center, the goal position coordinates At the position moved by the offset interval, each position deviation from the rotational direction position when the electronic component is mounted on the target position on the substrate by the mounting head is recognized, and the second error data is based on the obtained position deviation. The second error data group is created by performing mounting by the mounting head and imaging by the first imaging unit for each of a plurality of position coordinates. Is constructed sea urchin. With this configuration, the electronic component or jig component can be mounted in the area of the substrate, and the component image after mounting can be taken, so there is no need to move the head unit greatly, and the second error data group can be stored in a short time. Can be created.

In the electronic component mounting apparatus according to the first aspect, preferably, the control unit is configured to acquire the second error data for each of a plurality of position coordinates and a plurality of rotation angles and create a second error data group. The second error data when the mounting head is moved to the mounting target position coordinates and the mounting head is set to the predetermined rotation angle is based on the mounting target position coordinates, the predetermined rotation angle, and the second error data group. It is configured to ask for. As a result, even when the rotation axis of the mounting head swings, the horizontal displacement of the electronic component relative to the target mounting position when mounting the electronic component at the target mounting position corresponds to the mounting direction of the electronic component. and, it is possible to correct the Re not a position in the rotational direction with respect to the mounting direction, it is possible to correct the mounting position more accurately.

A mounting position correction data creation method according to a second aspect of the present invention includes a head unit that includes an imaging unit and a mounting head that is spaced apart from the imaging unit by a predetermined offset interval. A mounting position correction data creation method for an electronic component mounting apparatus that moves the mounting head to a component mounting position by rotating the mounting head and moving the mounting head to the target position coordinates. A step of acquiring first error data due to positional deviation for each of a plurality of position coordinates to create a first error data group, and a mounting head when moving by an offset interval between the imaging unit and the mounting head at the target position coordinates a horizontal position, at a position shifted by an offset distance from the goal position coordinates, in the target direction position an electronic component in the mounting head on the substrate And creating a second error data group to obtain the second error data due to the deviation of the position of the rotational position for each of the plurality of position coordinates at the time of mounting, the first error data group and the second error data group And mounting position correction data for the mounting head when moving to the component mounting position.

If comprised in this way, the 1st error data corresponding to the position coordinate of the 1st image pick-up part when a mounting head is arranged in a component mounting position can be acquired, and it is the same as a mounting component angle from the component mounting position. The horizontal displacement of the mounting head due to the tilt of the head unit in the horizontal direction and the tilt of the mounting head in the horizontal direction due to the tilt of the rotation center axis of the mounting head with respect to the Z axis when the head unit is moved by the offset interval. the horizontal position of the mounting head misalignment containing, and can acquire the second error data is data of a deviation in the rotational direction position when mounting the electronic component by the mounting head on the substrate in the target direction position. Further, when moving to the component mounting position, the first error data when the mounting head is moved from the first error data group to the component mounting position and the mounting head from the second error data group are moved to the component mounting position. In this case, the mounting position correction data of the mounting head can be accurately generated by the second error data. Furthermore, by using the created mounting position correction data, the mounting position can be corrected more accurately.

In the mounting position correction data creation method according to the second aspect, preferably, in the step of creating a second error data group, the second error data is obtained for each of a plurality of position coordinates and a plurality of rotation angles. Create a data group. As a result, even when the rotation axis of the mounting head swings, it corresponds to the rotation angle of the mounting head according to the mounting direction of the electronic component, and is relative to the target mounting position when mounting the electronic component at the target mounting position. horizontal position displacement of the electronic component and, since it is possible to correct the Re not a position in the rotational direction with respect to the mounting direction, it is possible to correct the mounting position more accurately.

  According to the present invention, as described above, it is possible to provide an electronic component mounting apparatus and a mounting position correction data creation method capable of correcting the mounting position more accurately.

It is the typical top view which showed the structure of the surface mounter by 1st-3rd embodiment of this invention. It is a typical side view at the time of seeing the surface mounter by the 1st-3rd embodiment of the present invention along the depth direction (Y2 direction). It is the block diagram which showed the structure on the control of the surface mounter by 1st-3rd embodiment of this invention. It is a schematic diagram for demonstrating the position shift resulting from the distortion of the X-axis of a head unit, and a Y-axis. It is the schematic diagram which showed the jig | tool plate for acquiring 1st error data. It is the figure which showed an example of the 1st error table which consists of several 1st error data. It is a schematic diagram for demonstrating the acquisition method of the 2nd error data in 1st Embodiment of this invention. It is the figure which showed an example of the 2nd error table which consists of several 2nd error data. It is the figure which showed the control processing flow at the time of creating the 2nd error table in the surface mounter by 1st Embodiment of this invention. It is the figure which showed the control processing flow of the arithmetic processing part at the time of mounting the electronic component by the surface mounting machine by 1st Embodiment of this invention. It is a schematic diagram for demonstrating the acquisition method of the 2nd error data in 2nd Embodiment of this invention. It is the figure which showed the control processing flow at the time of creating the 2nd error table in the surface mounter by 2nd Embodiment of this invention. It is a schematic diagram for demonstrating the acquisition method of the 2nd error data in 3rd Embodiment of this invention. It is the figure which showed the control processing flow at the time of creating the 2nd error table in the surface mounter by 3rd Embodiment of this invention. It is a figure for demonstrating the acquisition method of 1st error data.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
First, the structure of the surface mounter 100 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 4, 7, 8 and 15. The surface mounter 100 is an example of the “electronic component mounting apparatus” in the present invention.

  A surface mounter 100 according to the first embodiment of the present invention is an apparatus for mounting an electronic component 2 on a printed circuit board (wiring board) 1 as shown in FIGS. 1 and 2. The surface mounter 100 includes a base 5, a substrate transport unit 10 provided on the base 5, a head unit 20 that is movable above the substrate transport unit 10 along the XY plane (paper surface), A support unit 30 that supports the head unit 20 so as to be movable in the X direction and a moving mechanism unit 40 that moves the support unit 30 in the Y direction are provided. Further, as shown in FIG. 2, the surface mounter 100 is provided with a cover 6 on the base 5 that covers each of the above parts. In FIG. 2, for convenience of illustration, the internal structure that is covered by the cover 6 and cannot be seen from the outside is indicated by a solid line.

  Multiple rows of tape feeders 3 for supplying the electronic components 2 are arranged on both sides (Y1 (Y2) side) of the substrate transport unit 10. The tape feeder 3 holds a reel (not shown) around which a tape holding a plurality of electronic components 2 at a predetermined interval is wound. By rotating the reel and feeding the tape, the electronic component 2 is supplied from the tip. The head unit 20 has a function of acquiring the electronic component 2 from the tape feeder 3 and mounting the electronic component 2 on the printed circuit board 1 on the substrate transport unit 10. Here, the electronic component 2 is a small piece of electronic component such as an IC, a transistor, a capacitor, and a resistor.

  As shown in FIG. 1, the substrate transport unit 10 includes a pair of conveyor units 11 extending in the X direction, which is the transport direction of the printed circuit board 1. In addition, the conveyor unit 11 is provided with a plurality of substrate sensors (not shown) that detect the conveyance status of the printed circuit board 1. Thereby, the printed circuit board 1 hold | maintained at the conveyor part 11 is conveyed based on the detection result of a board | substrate sensor. The board transport unit 10 is provided with a clamp mechanism that holds the printed board 1 being transported in a stopped state at a stop position during component mounting.

  As shown in FIG. 2, the support unit 30 includes a ball screw shaft (X axis) 31 that extends in the X direction, a servo motor 32 that rotates the ball screw shaft 31, and a guide rail 33 that extends along the ball screw shaft 31. ing. The head unit 20 has a slide guide portion 21 to which a ball nut (not shown) to which the ball screw shaft 31 is screwed is attached. Accordingly, the head unit 20 is moved along the X direction along with the rotation of the ball screw shaft 31 while the slide guide portion 21 is guided by the guide rail 33.

  Further, the support unit 30 is configured to be movable in the Y direction substantially orthogonal to the X direction while being placed on the moving mechanism unit 40 fixed on the base 5. Specifically, as shown in FIG. 1, the moving mechanism unit 40 includes a pair of frame members 40a and 40b, a ball screw shaft (Y axis) 41 provided in the frame member 40a extending in the Y direction, and a ball screw shaft 41. It has a servo motor 42 to be rotated, a guide rail 43a extending along the ball screw shaft 41, and a guide rail 43b provided on the frame member 40b and parallel to the guide rail 43a. Moreover, the guide rails 43a and 43b are supporting the both ends (X direction) of the support part 30 so that a movement is possible. The support 30 is provided with a ball nut 35 to which the ball screw shaft 41 is screwed. Thus, the support portion 30 is moved in the Y direction via the ball nut 35 along with the rotation of the ball screw shaft 41 while being guided by the guide rails 43a and 43b. Therefore, the head unit 20 is configured to be able to move above the base 5 to any position along the XY plane by rotating the ball screw shafts 31 and 41.

  Further, as shown in FIG. 2, the head unit 20 includes a substrate camera 22 attached to a side end (X1 direction side) of the head unit 20 and a lower surface side (Z1 direction side in FIG. 2) facing the printed circuit board 1. And a plurality of (six) mounting heads 23 each having a suction nozzle mounted at the lower end thereof. Further, as shown in FIG. 1, the individual mounting heads 23 are arranged at positions separated from the substrate camera 22 by different offset intervals (distances) in the X direction. 4, the first mounting head 23a, the second mounting head 23b,..., The sixth mounting head 23f are set in order from the mounting head 23 on the side closer to the substrate camera 22, with the position of the substrate camera 22 as the origin. Then, the offset intervals are L1 to L6, respectively. Here, as shown in FIG. 1, the Y head positions of the mounting heads 23 and the substrate cameras 22 in the head unit 20 are the same, and the mounting heads 23 and the substrate cameras 22 are arranged in a straight line in the X direction. It has shown about the example arrange | positioned by. The substrate camera 22 is an example of the “imaging unit” and “first imaging unit” in the present invention.

  As shown in FIG. 2, each mounting head 23 has a function of attracting and holding the electronic component 2 by the negative pressure generated at the nozzle tip by a negative pressure generator (not shown). As shown in FIG. 3, each mounting head 23 is a head unit 20 by means of a servo motor (Z axis) 26 (see FIG. 3, one or a plurality (the maximum is the same as the mounting head 23)) and a lifting mechanism (not shown). In contrast, it is configured to be movable in the vertical direction (Z direction). The mounting head 23 is configured to be rotated around the Z axis by a servo motor (R axis) 27 (see FIG. 3, one or a plurality (the maximum is the same as the mounting head 23)) and a rotation mechanism (not shown). Has been. As a result, each mounting head 23 sucks the electronic component 2 (see FIG. 2) from the tape feeder 3 (see FIG. 1) by the raising and lowering operation and the sucking operation, and predetermined components on the printed circuit board 1 (see FIG. 1). The electronic component 2 is configured to be mounted on the printed circuit board 1 at the mounting position and a predetermined mounting angle (R-axis rotation angle).

  As shown in FIG. 1, two component cameras 60 are fixedly installed on the upper surface 5 a of the base 5. As shown in FIG. 2, the component camera 60 has a function of imaging the lower surface side of the electronic component 2 attracted to the mounting head 23 from below. As a result, whether the shape of the electronic component 2 is good or not is determined, and the positional deviation of the center of the electronic component 2 attracted to the mounting head 23 with respect to the center of the mounting head 23 (center of the suction nozzle) is determined. The component camera 60 is an example of the “second imaging unit” in the present invention.

  Further, as shown in FIG. 3, the surface mounter 100 has a built-in control device 70 for controlling the operation of each part of the apparatus main body. The control device 70 is mainly configured by an arithmetic processing unit (CPU) 71, a storage unit 72 (operation program storage unit 72a and correction data storage unit 72b), an image processing unit 73, and a motor control unit 74. Yes. The arithmetic processing unit 71 is an example of the “control unit” in the present invention.

  The arithmetic processing unit 71 generally controls the operation of the surface mounter 100. The operation program storage unit 72a in the storage unit 72 stores a control program that can be executed by the arithmetic processing unit 71, data necessary for moving the head unit 20, and the like. The correction data storage unit 72b stores a first error table 7a and a second error table 7b, which will be described later, for correcting the mounting position of the electronic component 2 on the printed circuit board 1. Further, the image processing unit 73 has a role of internally generating data necessary for the operation of the surface mounter 100 by processing image data captured by the board camera 22 and the component camera 60. The first error table 7a and the second error table 7b are examples of the “first error data group” and the “second error data group” in the present invention, respectively.

  The motor control unit 74 is configured to control each servo motor of the surface mounter 100 based on a control signal output from the arithmetic processing unit 71. The motor control unit 74 is configured to control the substrate conveyance by the substrate conveyance unit 10. The motor control unit 74 is configured to be able to recognize the XY coordinates of the head unit 20, the height position and the rotation angle of the mounting head 23, and the like based on output signals from an encoder (not shown) included in each servo motor. ing.

  Next, the first error table 7a and the second error table 7b stored in the storage unit 72 (correction data storage unit 72b) will be described.

  In the first embodiment, the arithmetic processing unit 71 creates the first error table 7 a and the second error table 7 b prior to the mounting operation of the electronic component 2 and stores them in the storage unit 72. The arithmetic processing unit 71 corrects the mounting position of each mounting head 23 when moving to the component mounting position based on the first error table 7a and the second error table 7b during the mounting operation of the electronic component 2. It is configured to perform control.

  Here, since the X-axis (ball screw shaft 31 and guide rail 33) and Y-axis (ball screw shaft 41 and guide rail 43) of the head unit 20 are composed of long members, even if they are designed / manufactured with high precision. Its shape is slightly distorted. Taking the X axis as an example, as shown in FIG. 4, the ball screw shaft 31 and the guide rail 33 are not completely straight along the X direction, but have a slight displacement and are distorted as a whole. As a result, for example, when the ball screw shaft 31 extends in the X direction due to thermal expansion, the head unit 20 is displaced in the X direction, and further, the ball screw shaft 31 is swelled. The head unit 20 is inclined counterclockwise as a whole at the position U1 indicated by the solid line in FIG. 4 due to the undulation of the ball screw shaft 31 so as to sway along the two directions. On the other hand, at the position U2 indicated by (2), conversely, it is tilted clockwise, causing a positional deviation in the rotational direction. In FIG. 4, for the sake of convenience, the distortion of the shaft and the posture of the head unit 20 are exaggerated and schematically shown. Although illustration is omitted, the same misalignment also occurs with respect to the Y axis (ball screw shaft 41 and guide rails 43a and 43b). Further, due to the distortion of the X axis and the Y axis, the head unit 20 causes a positional deviation (posture deviation) not only in the horizontal direction but also in the Z direction.

  Further, in practice, the head unit 20 is assembled with a slight inclination with respect to the ball screw shaft 31 and the guide rail 33, or each mounting head 23 is slightly moved from the vertical direction (Z direction) to the horizontal plane (printed circuit board surface). There is an assembling error such that the head unit 20 is tilted. Due to these assembly errors and displacement of the position and orientation of the head unit 20 due to distortion of the X-axis and Y-axis, the head unit 20 has a position shift that varies depending on the XY position coordinates (depends on the position coordinates).

  Therefore, in order to correct the position shift depending on these position coordinates, the first error table 7a and the second error table 7b are respectively set to the substrate camera 22 (first error table 7a) and the mounting head 23 ( The positional deviation that occurs when positioning the second error table 7b) is obtained for each position coordinate.

  First, a method of creating the first error table 7a will be described with reference to FIG.

Reference mark 50a (coordinate _{(X 50a,} Y _50a)) of the at least two places provided on a base 5, for example six ～50F (coordinates _{(X 50f, Y} 50f)) and feeding by encoder X-axis The substrate camera 22 is moved so as to adjust the amount and the feed amount based on the Y-axis encoder to the respective coordinate values, and the deviations (ΔCX _50a , ΔCY _50a ) to the imaging center of the reference marks _50a to 50f on the image are taken. (ΔCX _50f , ΔCY _50f ) is obtained and stored as the first error table 7a. In addition, as shown in FIG. 15, the deviation | shift amount in the state with insufficient feed amount based on an encoder is set to positive. This makes it possible to correlate the position of the head unit 20 on which the board camera 22 is mounted with respect to the base 5, and by using the first error data ΔC1 of the first error table 7a, the board camera 22 is set to a predetermined target position coordinate. It is possible to position it accurately.

That is, when the substrate camera 22 is positioned at an arbitrary predetermined position P (Xp, Yp) on the base 5, predetermined with respect to the coordinates (X _50a , Y _50a ) to (X _50f , Y _50f ) of the reference marks ₅₀ a to ₅₀ f. From the relationship of the position P (Xp, Yp), the amount of displacement (ΔCXp, ΔCYp) (however, by using an interpolation method using a plurality of amounts of displacement (ΔCX _50a , ΔCY _50a ) to (ΔCX _50f , ΔCY _50f )) In order to make this deviation amount zero, the position by the X-axis encoder is Xp + ΔCXp and the position by the Y-axis encoder is Yp + ΔCYp. The head unit 20 is moved.

  By using the first error data ΔC1 of the first error table 7a, it is possible to accurately position the board camera 22 at a predetermined target position coordinate even when the X-axis and the Y-axis are stretched and undulated. . However, since each mounting head 23 and the substrate camera 22 are separated from each other by different offset intervals (L1 to L6) (see FIG. 4), for example, the mounting head 23a is placed at an arbitrary predetermined position P (Xp, Yp). In order to position, it is necessary to move the substrate camera 22 to a position shifted by the corresponding offset interval L1. However, the posture of the head unit 20 changes depending on the position coordinates when the imaging center C of the board camera 22 is positioned at the target position coordinates and when the imaging center C is positioned at a position shifted by the offset interval L1. Therefore, the position of the mounting head 23 is displaced with respect to the target position coordinates. Therefore, the positional deviation of the mounting head 23 in a state where the substrate camera 22 is moved to a position shifted from the target position coordinates by the offset interval is acquired as ΔH in the second error data ΔC2 at the target position coordinates.

  Next, a method for creating the second error table 7b will be described with reference to FIGS.

  For the creation of the second error table 7b, a glass jig part 110 as shown in FIG. 7A is used. A mark indicating the component center J is attached to the surface of the jig component 110, and the component center position can be acquired by image recognition.

First, as shown in FIG. 7E, the jig component 110 is placed on an arbitrary position on the substrate (the jig plate or the printed circuit board 1) using the mounting head 23a. Subsequently, by imaging the jig part 110 with the board camera 22, as shown in FIG. 7A, the position coordinates of the part center J of the jig part 110 are based on the X-axis encoder and the Y-axis encoder. Obtained as a feed value, this is set as the target position coordinate P ₁₁ (X ₁₁ , Y ₁₁ ). After moving the substrate camera 22 away from the jig part 110, if the head unit 20 is moved by driving the X-axis and Y-axis so as to obtain these feed values, it will again return to the part center J of the jig part 110. The imaging centers of the substrate camera 22 can be matched.

The first mounting head 23a, positioning the substrate camera 22 from the target location coordinates P ₁₁ is moved only in the X direction corresponding offset distance L1, the design, the mounting head 23a above the target position coordinates P ₁₁ Should be able to. Figure 7 (b) as shown in (Fig viewed jig parts 110 placed from above the fixture plate or the printed circuit board 1), this was the target location coordinates P ₁₁ is moved by the offset distance L1 position Ph For (X ₁₁ −L 1, Y ₁₁ ), the corresponding first error data ΔC 1 (ΔCX ₁₁ -L ₁ , ΔCY ₁₁ ) is read from the first error table 7 a (or calculated by an interpolation method), thereby obtaining the substrate camera 22. The imaging center Ch (Ch indicates the imaging center of the board camera 22 after movement for the offset interval) can be accurately positioned. That is, the head unit 20 is fed so that the X coordinate on the X axis encoder is X ₁₁ −L 1 + ΔCX ₁₁ −L ₁ and the Y coordinate on the Y axis encoder is Y ₁₁ + ΔCY ₁₁ .

The jig component 110 is sucked by the first mounting head 23a in a state where the substrate camera 22 is positioned at the position Ph using the first error data ΔC1. However, if the head unit 20 has a tilt Δα (see FIG. 4) in the counterclockwise direction, the offset Δα and the offset interval of the mounting head 23a with respect to the substrate camera 22 are set as shown in FIG. shift position of the resulting to mounting head 23a, in fact, together with the jig parts 110 in position H ₁₁ rather than the target position coordinate P ₁₁ is absorbed, the jig parts 110 with respect to mounting head 23a in the clockwise direction △ Adsorbed with an angular displacement of α.

Next, the head unit 20 is moved above the component camera 60 (see FIG. 2) (also in this case, the feed value in the X-axis encoder so as to eliminate the first error data ΔC1 corresponding to the position of the component camera 60, (Set the feed value in the Y-axis encoder) The lower surface image of the jig component 110 adsorbed by the first mounting head 23 a is captured by the component camera 60. As a result, as shown in FIG. 7C (a diagram in which the left and right images of the component camera 60 are reversed so as to correspond to FIG. 7B), the suction position (= mounting) of the component center J and the mounting head 23a. A positional deviation ΔH (ΔHX ₁₁ , ΔHY ₁₁ ) with respect to the center position (H ₁₁ ) of the head 23 a is acquired. This adsorption position shift is mainly due to the inclination Δα of the head unit 20 and the mounting head 23a when picking up the component when the vertical movement axis of the mounting head 23a is inclined from the vertical direction and when imaging the lower surface of the jig component 110. This occurs due to the difference in height position.

The suction misalignment, as shown in FIG. 7 (b), since the target position coordinates P ₁₁ on the substrate lowers the mounting head 23a is a position displacement when the adsorbing jig parts 110, the target position also that the same positional shift occurs when component mounting in the coordinate P _11. In addition, the clockwise angular displacement Δα of the jig component 110 can be detected from the images of the two jig components 110 shown in FIGS. 7A and 7C. The thus obtained positional deviation ΔH (ΔHX _11, ΔHY ₁₁₎ and angular displacement △ alpha and is, for performing component mounting into the target location coordinates _{P 11} by the mounting head 23a second error data △ C2 ([Delta] H, Δα). Note that the clockwise angular displacement Δα of the jig component 110 due to the counterclockwise inclination Δα of the head unit 20 is corrected by rotating the mounting head 23a counterclockwise by Δα before mounting. It can be eliminated and components can be mounted.

Thereafter, as shown in FIG. 7 (e), to a position _{P 12} which is moved by a predetermined amount set in advance from the target position coordinate _{P 11} equipped with a fixture part 110, FIG. 7 of (a) ~ (c) Perform the measurement operation. The above measurement operation is sequentially performed up to m-row × n-column grid-like measurement points (P _{11 to} P _mn ). If the rotation angle (R axis) of the mounting head 23a at this time is r = 0 °, a table of ΔH in the second error data ΔC2 at r = 0 ° of the first mounting head 23a is obtained.

When the mounting head 23a (or the entire head unit 20) is assembled with a slight inclination, and when the rotation axis of the mounting head 23a does not coincide with the Z-axis, as shown in FIG. The suction position changes depending on the rotation angle of 23a. In FIG. 7D, as an example, the suction positions H ₁₁ (0), H ₁₁ (90) _{, and} H ₁₁ (180) in a state where they are sucked at four angles of r = 0 °, 90 °, 180 °, and 270 °. _, H ₁₁ (270), and the respective positional deviations ΔH90, ΔH180, ΔH270 (see ΔH in FIG. 7C for ΔH0). Therefore, a table of ΔH in the second error data ΔC2 is created for each predetermined rotation angle (r = 0 °, 90 °, 180 °, 270 °). Similarly, depending on the rotation angle of the mounting head 23a, the angle in the rotation direction of the jig component 110 during suction is angularly displaced with respect to the rotation angle. From the images of the two jig parts 110 in FIGS. 7A and 7C, the angular displacement caused by the inclination of the head unit 20 and the rotation axis of the mounting head 23a do not coincide with the Z axis. In addition, an object including both angular displacements generated with respect to the rotation angle of the jig part 110 when the jig part 110 is rotated and mounted in a direction different from the part direction of the jig part 110 at the time of suction is detected. Therefore, a table of Δα in the second error data ΔC2 is also created for each predetermined rotation angle (r = 0 °, 90 °, 180 °, 270 °).

  As a result, a matrix table (m rows and n columns) for each of the rotation angles r = 0 °, r = 90 °, r = 180 ° and r = 270 ° with respect to the first mounting head 23a ( 4) is created. The above acquisition processing of the second error data ΔC2 (ΔH, Δα) is performed at offset intervals L2 to L6 corresponding to the remaining second mounting head 23b to sixth mounting head 23f (see FIG. 4), respectively. By performing the change, the second error table 7b shown in FIG. 8 is created.

  In this example, the substrate camera 22 and the mounting head 23 are linearly arranged in the X direction. However, when the mounting head 23 is also offset in the Y direction with respect to the substrate camera 22, the Y coordinate is used. Similarly to the X coordinate, the movement for the offset interval may be taken into consideration.

During the mounting operation of the electronic component 2, the mounting position of each mounting head 23 is corrected based on the first error table 7a and the second error table 7b. For example, when the component mounting position M is the coordinate P _mn (X _mn , Y _mn ), the mounting angle θ is 0 °, and mounting is performed by the first mounting head 23a, first, from the first error table 7a. First error data ΔC1 (ΔCX _mn−L1 , ΔCY _mn ) corresponding to the position coordinates Ph (X _mn −L1, Y _mn ) obtained by subtracting the offset interval L1 is acquired (or calculated by an interpolation method). Further, the r = 0 ° table of the mounting head 23a is referred to from the second error table 7b, and the second error data ΔH (ΔHX _{mn (0)} , ΔHY _{mn ( )} corresponding to the coordinates P _mn (X _mn , Y _mn ) ₀₎ ) is obtained. Based on the above, when the board camera 22 is used as a reference, the corrected component mounting position M (x, y) (feed value on the X-axis encoder, feed value on the Y-axis encoder) is x = (X _{mn -L1 + ΔCX (mn-L1} ) + ΔHX mn (0)), y = (Y mn + ΔCY mn + ΔHY mn (0)) is calculated as. The component rotation angle in the R-axis motor is calculated as _{Δα mn (0)} . (The second error data Δα has a positive detection value in the clockwise direction of the jig component 110, and corrects the rotation angle of the correct component by correcting the rotation of the mounting head 23a by the detection value in the counterclockwise direction before mounting. Parts can be mounted at the mounting angle.)

If the mounting position correction is shown in the example of FIG. 7, the component mounting position M (x, y) after the above correction uses the first error data ΔC1 (ΔCX ₁₁ -L1, ΔCY ₁₁ ) in FIG. 7B. The second error data ΔH (ΔHX _{11 (0)} , ΔHY _{11 (0)} ) is further obtained in FIG. 7C from the state where the imaging center Ch of the substrate camera 22 is arranged at the position Ph (mounting head position H ₁₁ ). In this way, the position of the substrate camera 22 is corrected. As a result, in the example of FIG. 7, the mounting head 23a can be accurately placed at the component mounting position M (P ₁₁ (X ₁₁ , Y ₁₁ )).

  Next, with reference to FIG. 9, the control processing of the arithmetic processing unit 71 when creating the second error table 7b by the surface mounter 100 of the first embodiment will be described. Here, an example in which the second error data ΔC2 (ΔH, Δα) is acquired sequentially from the first mounting head 23a and sequentially from the rotation angle 0 ° will be described.

  As shown in FIG. 9, first, in step S <b> 1, the head unit 20 is moved above the jig component 110 arranged at an arbitrary position. This may be the designation of position coordinates by the operator, or the head unit 20 may be moved so as to scan with the substrate camera 22 to recognize the jig component 110.

In step S <b> 2, the jig part 110 is imaged by the board camera 22. Arithmetic processing unit 71 obtains the coordinates of the component center J of the jig parts 110 from the captured image a target position coordinate P ₁₁ Sent on the X-axis encoder, a leading value on Y-axis encoder.

In step S3, the position Ph to the substrate camera 22 from the target position coordinate P ₁₁ is moved in the X direction by the offset distance L1, while being positioned by the X-axis encoder and Y-axis encoder, the first mounting head 23a ( r = 0 °), the jig component 110 is sucked.

In step S <b> 4, the lower surface image of the sucked jig component 110 is captured by the component camera 60. The arithmetic processing unit 71 acquires, as second error data ΔH (ΔX ₁₁ , ΔHY ₁₁ ), a position shift between the component center J of the jig component 110 and the suction position H ₁₁ of the mounting head 23 a from the captured image. Further, it is acquired as second error data Δα (Δα ₁₁ ), which is a rotation error, from the angle change in the direction of the jig component 110 in the captured image.

In step S5, the grid-like measurement points m rows and n columns (target location coordinates P _{11 to P mn)} whether the measurement all been finished is determined. If all the measurements have not been completed, the process proceeds to step S6, moves by a predetermined amount set in advance, and the jig part 110 is mounted at the next measurement point (in this case, for example, P ₁₂ ). Steps S2 to S4 are executed for the measurement points. By repeating steps S2 to S6, measurement (acquisition of second error data ΔC2 (ΔH, Δα)) is performed for all measurement points.

If it is determined in step S5 that the measurement has been completed for all the measurement points, the process proceeds to step S7, and the measurement is completed at all angles (r = 0 °, 90 °, 180 °, and 270 °) for the mounting head 23a. It is determined whether or not. If the measurement has not been completed for all angles, the process proceeds to step S8, the mounting head 23a is rotated by a predetermined angle (in this case, 90 °), and then the next measurement point (in this case, the first measurement point in this case). fixture parts 110 are mounted on the return to the target position coordinate _{P 11).} Thereby, steps S2 to S6 are executed for all angles (r = 0 °, 90 °, 180 °, and 270 °).

  When it is determined in step S7 that the measurement has been completed for all the mounting heads 23a, the process proceeds to step S9, and it is determined whether or not the measurement has been completed for all the mounting heads 23 (23a to 23f). If the measurement has not been completed for all the mounting heads 23 (23a to 23f), the process proceeds to step S10, and the offset interval corresponding to the next mounting head 23 (in this case, the mounting head 23b) (in this case, The measurement in L2) is started. Thereby, steps S2 to S8 are executed for all the mounting heads 23 (23a to 23f).

  If it is determined in step S9 that the measurement has been completed for all the mounting heads 23 (23a to 23f), the process proceeds to step S11, where the second error is determined by all the acquired second error data ΔC2 (ΔH, Δα). A table 7b is created, and the created second error table 7b is stored in the storage unit 72 (correction data storage unit 72b). As described above, the control process for creating the second error table 7b is performed.

  Next, a control processing flow of the arithmetic processing unit 71 when the electronic component 2 is mounted on the printed circuit board 1 will be described with reference to FIGS. 2, 6, 8, and 10. Note that description of processing such as loading, unloading, and positioning of the printed circuit board 1 is omitted.

  First, as shown in FIG. 10, in step S21, based on the control program (substrate production program) stored in the operation program storage unit 72a (see FIG. 3), the electronic component 2 to be picked up, the mounting head for picking up 23 (23a to 23f), the component mounting position M and the mounting angle θ of the electronic component 2 are acquired.

  In step S22, the electronic component 2 to be picked up is picked up by a predetermined mounting head 23 and taken out. In addition, the electronic component 2 is imaged by the component camera 60 (see FIG. 2), and an adsorption position shift of the electronic component 2 is acquired.

  Next, in step S23, the mounting position by the mounting head 23 is corrected based on the first error table 7a (see FIG. 6) and the second error table 7b (see FIG. 8). As described above, the first error data ΔC1 corresponding to the position coordinate Ph obtained by subtracting the offset interval is acquired (or calculated by the interpolation method) from the first error table 7a. Further, second error data ΔC2 (ΔH, Δα) corresponding to the component mounting position M and the mounting angle θ of the electronic component 2 is acquired (or calculated by an interpolation method) from the second error table 7b. From the ΔH of the first error data ΔC1 and the second error data ΔC2, a correction value for positioning the mounting head 23 at the component mounting position M is calculated as described above. Note that, as a result of imaging of the electronic component 2 by the component camera 60, if there is a positional deviation or angular deviation when the electronic component 2 is attracted, these correction amounts are also reflected by Δα of the second error data ΔC2, and finally The corrected mounting position is calculated.

  Next, in step S24, the head unit 20 is moved to the corrected mounting position obtained in step S23. That is, the servo motor 32 (X axis) and the servo motor 42 (Y axis) are driven so that the corrected encoder output value is added with the correction amount calculated for each X axis and Y axis encoder output value. Is done. In step S25, the servo motor 27 (R axis) is driven by the mounting head 23 to a rotation angle obtained by adding a correction amount corresponding to the second error data Δα to the mounting angle θ, and then the electronic component 2 (FIG. 2) is mounted at the component mounting position M on the printed circuit board 1 (see FIG. 2). Strictly speaking, as a result of adding the correction amount, the mounting position of the mounting head 23 on the printed circuit board 1 (the landing point of the mounting head 23 lowered to the printed circuit board 1 on the printed circuit board 1) is the component mounting position. M.

  In step S26, it is determined whether or not unmounted (unexecuted) component mounting data remains in the board production program. If it is determined in step S26 that mounting data remains (No determination), the process returns to step S21, and the processes of steps S21 to S25 are repeated thereafter. If it is determined in step S26 that there is no unmounted mounting data (all are mounted) (Yes determination), this control is terminated.

In the first embodiment, as described above, the first error data ΔC1 of the substrate camera 22 when the substrate camera 22 is moved to the target position coordinates P (P _{11 to} P _mn ) is converted into a plurality of position coordinates (P _{11 to} P _mn ) to obtain the first error table 7a, and at the target position coordinates P, a plurality of second error data ΔH of the mounting head 23 when the substrate camera 22 and the mounting head 23 are moved by the offset interval. The second error table 7b is created by obtaining the position coordinates (P _{11 to} P _mn ) and a plurality of rotation angles (r = 0 °, 90 °, 180 °, 270 °), and the first error table 7a and the first error table 7a Based on the two-error table 7b, the arithmetic processing unit 71 is configured to correct the mounting position of the mounting head 23 when moving to the component mounting position M. As a result, the first error table 7a and the second error data ΔC2 (ΔH) for each of the plurality of position coordinates (P _{11 to} P _mn ) and the plurality of rotation angles (r = 0 °, 90 °, 180 °, 270 °). , Δα) from the second error table 7b, the first error data ΔC1 corresponding to the position Ph moved by the offset interval with respect to the component mounting position M, and the second corresponding to the component mounting position M and the mounting angle θ. Error data ΔC2 (ΔH, Δα) is obtained, and the mounting position of the mounting head 23 can be corrected using the second error data ΔC2 (ΔH, Δα). As a result, the interval (offset intervals L1 to L6) between the mounting head 23 and the substrate camera 22 in the head unit 20 and the rotation of the mounting head 23 for setting the electronic component 2 to a predetermined mounting angle θ at the time of mounting. Since the mounting position can be corrected in consideration, the mounting position can be corrected more accurately.

In the first embodiment, the horizontal with respect to the target position coordinates _{P (P} 11 _{~P mn)} target position of the mounting head 23 at a position Ph moving the substrate camera 22 by the offset distance from the coordinate _{P (P} 11 _{~P mn)} A plurality of second error data ΔC2 (ΔH, Δα) based on the positional deviation ΔH in the direction and the positional deviation Δα in the rotational direction when the electronic component 2 is mounted by the mounting head 23 with the substrate camera 22 positioned at the position Ph. For each position coordinate (P _{11 to} P _mn ) to create the second error table 7b. Then, based on the component mounting position M and the first error table 7a, first error data ΔC1 when moving the board camera 22 to the component mounting position M is obtained, and based on the first error data ΔC1, the component mounting position M is obtained. The horizontal positional deviation when the mounting head 23 is moved is corrected. Further, based on the component mounting position M and the second error table 7b, a first displacement comprising a horizontal displacement ΔH and a rotational displacement Δα of the mounting head 23 when the mounting head 23 is moved to the component mounting position M. 2 Determine the error data ΔC2 (ΔH, Δα), and add the horizontal displacement ΔH and the rotational displacement Δα when mounting the component mounting position M based on the second error data ΔC2 (ΔH, Δα). to correct. Thus, the horizontal positional deviation ΔH and the rotational positional deviation Δα based on the horizontal inclination of the head unit 20 and the offset interval between the mounting head 23 and the substrate camera 22 in the head unit 20 can be corrected. As a result, the mounting position can be corrected more accurately.

In the first embodiment, with respect to each of the plurality of mounting heads 23, a plurality of position coordinates (P _{11 to} P _mn ) and a plurality of rotation angles (r = 0 °) with corresponding offset intervals (L 1 to L 6). , 90 °, 180 °, 270 °), the arithmetic processing unit 71 is configured to acquire the second error data ΔC2 (ΔH, Δα) and create the second error table 7b. Thereby, for each of the plurality of mounting heads 23, the offset interval between the mounting head 23 and the substrate camera 22, and the rotation of the mounting head 23 for setting the electronic component 2 to the mounting angle θ during mounting, It is possible to create the second error table 7b considering the above. Thereby, the second error data ΔC2 (ΔH, Δα) obtained using the second error table 7b can be made more appropriate, and the mounting position for each mounting head 23 can be corrected individually and more accurately.

In the first embodiment, the position of the jig component 110 imaged by the board camera 22 is acquired as the target position coordinate P, and the board camera 22 is moved from the target position coordinate P by an offset interval (L1 to L6). The jig component 110 attracted to the mounting head 23 is imaged by the component camera 60, so that the positional deviation of the mounting head 23 with respect to the component center J of the jig component 110 is recognized and acquired as the second error data ΔH. An arithmetic processing unit 71 is configured. Then, suction by the mounting head 23 and imaging by the component camera 60 are performed for each of a plurality of position coordinates (P _{11 to} P _mn ) and a plurality of rotation angles (r = 0 °, 90 °, 180 °, 270 °). Thus, the calculation processing unit 71 is configured to obtain the second error data Δα and create the second error table 7b. Thereby, in creating the second error table 7b, simply by imaging the jig component 110 by the substrate camera 22 and imaging by the component camera 60 in a state in which the jig component 110 is sucked, Second error data ΔC2 (ΔH, Δα) in consideration of the movement of the offset interval and the rotation of the mounting head 23 can be acquired.

  In general, the displacement of the mounted component is likely to occur when the mounting head 23 is separated from the electronic component 2 after mounting the component on the printed circuit board 1. For this reason, when the second error table 7b is created, for example, after mounting the jig component, and then imaging the mounted jig component 110 with the substrate camera 22 to acquire the positional deviation, after mounting the component, The position of the jig component 110 is likely to be shifted before imaging is performed, and the measurement accuracy of the second error data ΔH is likely to be lowered. On the other hand, in the first embodiment, since the second error data ΔC2 (ΔH, Δα) is acquired by imaging with the component camera 60 in a state where the jig component 110 is attracted, the positional deviation of the jig component 110 is obtained. Is prevented from occurring. Therefore, the second error data ΔC2 (ΔH, Δα) can be obtained with high accuracy in creating the second error table 7b.

  In the first embodiment, when moving to the component mounting position M, the first error data ΔC1 corresponding to the position Ph moved from the component mounting position M by the offset interval (L1 to L6) is obtained from the first error table 7a. The second error data ΔH corresponding to the mounting angle θ and the position coordinates of the component mounting position M is acquired from the second error table 7b, and the acquired first error data ΔC1 and second error data ΔH, The arithmetic processing unit 71 is configured to correct the mounting position of the mounting head 23 based on the offset interval of the mounting head 23. As a result, the first error data ΔC1 corresponding to the position coordinate Ph of the board camera 22 when the mounting head 23 is arranged at the component mounting position M, and the second error data ΔH at the component mounting position M and the mounting angle θ. Based on this, it is possible to perform a highly accurate mounting position correction in consideration of a positional deviation due to the movement of the offset interval and the rotation to the mounting angle θ.

(Second Embodiment)
Next, a surface mounter according to a second embodiment of the present invention will be described with reference to FIG. 1, FIG. 3, FIG. 11, and FIG. In the second embodiment, unlike the first embodiment in which the second error data ΔH is acquired by imaging the picked-up jig component 110 by the component camera 60, the mounted jig component 110 is imaged by the board camera 22. An example in which the second error data ΔH is obtained by doing so will be described.

  In addition, since the apparatus structure of the surface mounting machine 200 (refer FIG. 1) by 2nd Embodiment is the same as that of the said 1st Embodiment, description is abbreviate | omitted. The surface mounter 200 is an example of the “electronic component mounting apparatus” in the present invention.

  A method for creating the second error table 7b in the second embodiment will be described. It is assumed that the first error table 7a is created in advance in the same manner as in the first embodiment and stored in the storage unit 72 (correction data storage unit 72b). Further, an example of acquiring the second error data ΔH with a rotation angle of 0 ° in the first mounting head 23a (offset interval L1) will be described.

First, as shown in FIG. 11 (a), the arithmetic processing unit 171 (see FIG. 3) is a position Ph in which the substrate camera 22 is moved from the target location coordinates _{P 11} offset distance L1, the jig by mounting head 23a The component 110 is mounted on the printed circuit board 1 (or jig plate). At this time, position correction of the substrate camera 22 using the first error table 7a is not performed. For this reason, the imaging center Ch of the board camera 22 is arranged at a position shifted from the position Ph. At this time, the position H ₁₁ (component center J) of the mounting head 23a is misaligned with the imaging center Ch with respect to the position Ph (corresponding to the first error data ΔCh (ΔCX _11−L1 , ΔCY ₁₁ )) and the offset interval L1 minutes. by both of the positional deviation between the positional deviation of the mounting head 23a in the moving position coordinates Ph (corresponding to the second error data [Delta] H) of, are located offset relative to the target location coordinates P _11. The arithmetic processing unit 171 is an example of the “control unit” in the present invention.

Next, the arithmetic processing unit 171 causes the image the jig parts 110 by moving the substrate camera 22 to the target location coordinates _{P 11.} Also at this time, the position correction of the substrate camera 22 using the first error table 7a is not performed. Therefore, as shown in FIG. 11 (b), the imaging center C of the board camera 22 is moved to the target location coordinates P ₁₁ is arranged at a position shifted from the target position coordinates P _11. A positional deviation D1 between the component center J and the imaging center C of the jig component 110 is acquired from the obtained captured image. Here, the positional deviation D2 between the target location coordinates _{P 11} and imaging center C, the first error data ΔC1 (ΔCX _11, ΔCY ₁₁₎ of the first error table 7a is. Therefore, based on the D1 and D2, positional displacement D3 between the target location coordinates P ₁₁ and component center J is obtained.

Here, the positional deviation ΔCh (ΔCX ₁₁ -L ₁ , ΔCY ₁₁ ) between the position Ph moved from the target position coordinate P ₁₁ by the offset interval L 1 and the imaging center Ch is acquired (or interpolated) from the first error table 7 a. (Calculated by the method). If the positional deviation (first error data) ΔCh is added to the imaging center Ch, the imaging center Ch coincides with the position Ph, and the position of the mounting head 23a at that time becomes Hh as shown in FIG. .

Distance between the position Hh and the position _{H 11} coincides with the position deviation? Ch, as shown in FIG. 11 (d), based on the positional deviation? Ch and positional displacement D3, position Hh with the target location coordinates _{P 11} A positional deviation D4 between them can be acquired. This positional deviation D4 becomes the second error data ΔH (ΔHX _{11 (0)} , ΔHY _{11 (0)} ) at the target position coordinate P ₁₁ .

As is apparent from FIG. 11D, the first error data ΔC1 (ΔCX _11-L1 , ΔCY ₁₁ ) is used to further increase the state from the state in which the substrate camera 22 is disposed at the position Ph (position Hh of the mounting head 23a). If the position of the board camera 22 is corrected using the two error data ΔH (ΔHX _{11 (0)} , ΔHY _{11 (0)} ), the mounting head 23a can be accurately positioned at the component mounting position M (P ₁₁ ). .

Processing unit 171, using the method described above, a plurality of target location coordinates _P 11 _{to P mn} and a plurality of rotation angles (0 °, 90 °, 180 °, 270 °) to the mounting each head 23 (23 a to 23 f ) And imaging by the substrate camera 22 are performed to create the second error table 7b.

  Next, with reference to FIG. 12, the control processing of the arithmetic processing unit 171 when creating the second error table 7b by the surface mounter 200 of the second embodiment will be described. Similar to the first embodiment, an example in which the second error data ΔH is acquired sequentially from the first mounting head 23a and sequentially from the rotation angle 0 ° will be described.

Figure 12 As shown, the first, in step S31, to adsorb the jig parts 110 on the mounting head 23a, any (first point) of the target location coordinates _{P 11} to the board camera 22 by the offset distance L1 X direction The parts are mounted at the position Ph moved to. At this time, the position correction of the substrate camera 22 using the first error table 7a is not performed as described above. In the state in which the jig component 110 is attracted to the mounting head 23a, the center of the mounting head 23a and the jig component 110 coincide with each other, and the rotation direction is set to a predetermined angle.

Next, in step S32, the position correction of the board camera 22 using the first error table 7a moves the substrate camera 22 above the target position coordinates P ₁₁ without jig components mounted in the step S31 110 Is imaged by the substrate camera 22.

In step S33, the arithmetic processing unit 171 obtains a positional deviation D1 between the component center J and the imaging center C of the jig component 110 and an angle change Δα of the jig component 110 from the captured image, and the positional deviation D1 and the first deviation. first error data ΔC1 (ΔCX _11, ΔCY ₁₁₎ of 1 error table 7a and _{ΔCh (ΔCX 11-L1, ΔCY} 11) based on a second error data _{ΔC2 (ΔH (ΔHX 11 (0} ), ΔHY 11 (0 ₎ ), Δα _{11 (0)} ).

When the second error data ΔC2 (ΔH, Δα) is acquired, the process proceeds to step S34, and it is determined whether or not the measurement has been completed for all measurement points (target position coordinates P _{11 to} P _mn ). If all measurements have not been completed, the process proceeds to step S35. In step S35, the jig component 110 already mounted at the target position coordinates is sucked by the mounting head 23a. At this time, in a state where the jig part 110 is attracted to the mounting head 23a, the center of the mounting head 23a and the jig part 110 coincide with each other, and the rotation direction is set at a predetermined angle. The position of the mounting head 23a (the position on each encoder on the X axis and Y axis) and the rotation angle of the mounting head 23a when the component 110 is mounted at the target position coordinates are stored, and the X axis servo motor of the head unit 20 is stored. The position is reproduced using the Y-axis servo motor and the R-axis servo motor of the mounting head 23a. After the suction, the substrate camera 22 is moved in the X direction by the offset interval L1 with respect to the measurement point (in this case, for example, the target position coordinate P ₁₂ ) moved by a predetermined amount from the measurement point (P ₁₁ ). Component mounting is performed at the position Ph (no correction by the first error table 7a). And step S32 and S33 are performed about the following measurement point. As a result, the second error data ΔC2 (ΔH, Δα) is acquired for all the measurement points (target position coordinates P _{11 to} P _mn ).

  Since the subsequent steps S36 to S40 are the same as steps S7 to S11 of the first embodiment, description thereof will be omitted. As described above, the control process for creating the second error table 7b according to the second embodiment is performed.

In the second embodiment, as described above, the jig part 110 is mounted on the substrate by the mounting head 23 at a position where the substrate camera 22 is moved from the target position coordinates P (P _{11 to} P _mn ) by the offset interval (L 1 to L 6). Then, the substrate camera 22 is moved to the target position coordinate P to image the jig component 110, thereby recognizing the positional deviation D1 of the component center J of the jig component 110 with respect to the imaging center C, and the positional deviation. The arithmetic processing unit 171 is configured to acquire the second error data ΔH based on D1 and acquire the second error data Δα based on the angle change of the jig component 110. Then, mounting by the mounting head 23 and imaging by the substrate camera 22 are performed for each of the plurality of target position coordinates P _{11 to} P _mn and a plurality of rotation angles (0 °, 90 °, 180 °, 270 °). The arithmetic processing unit 171 is configured to create the second error table 7b. Thereby, it is possible to easily obtain the second error data ΔH considering the movement of the offset interval. Then, just repeating the imaging by mounting the substrate camera 22 for a plurality of rotation angle, easily, creation of the second error table 7b caused by the rotation of each of a plurality of rotation angles in the target location coordinates P ₁₁ to P _mn It can be performed.

  Other effects of the second embodiment are the same as those of the first embodiment.

(Third embodiment)
Next, a surface mounter according to a third embodiment of the present invention will be described with reference to FIG. 1, FIG. 3, FIG. 13, and FIG. In the third embodiment, the second error data ΔC2 (ΔH, Δα) is acquired by imaging the jig component 110 mounted without correction by the first error table 7a by the board camera 22, and the second embodiment. Differently, an example will be described in which the second error data ΔC2 (ΔH, Δα) is acquired by imaging the jig component 110 mounted after being corrected by the first error table 7a by the board camera 22.

  In addition, since the apparatus structure of the surface mounter 300 (refer FIG. 1) by 3rd Embodiment is the same as that of the said 1st Embodiment, description is abbreviate | omitted. The surface mounter 300 is an example of the “electronic component mounting apparatus” in the present invention.

  A method for creating the second error table 7b in the third embodiment will be described.

First, as shown in FIG. 13 (a), the arithmetic processing unit 271 (see FIG. 3) is a position Ph in which the substrate camera 22 is moved from the target location coordinates _{P 11} offset distance L1, the jig by mounting head 23a The component 110 is mounted on the printed circuit board 1 (or jig plate). At this time, the arithmetic processing unit 271 corrects the position coordinates of the board camera 22 by acquiring the first error data ΔCh (ΔCX ₁₁ -L ₁ , ΔCY ₁₁ ) from the first error table 7 a (or calculating by the interpolation method). I do. As a result, the imaging center Ch exactly matches the position Ph. At this time, the position H ₁₁ (part center J) of the mounting head 23a is in relation to the target position coordinate P _{11 due} to the positional deviation (second error data ΔH) of the mounting head 23a at the position Ph after movement by the offset interval L1. It is arranged at a position shifted. The arithmetic processing unit 271 is an example of the “control unit” in the present invention.

Next, the arithmetic processing unit 271 causes the image the jig parts 110 by moving the substrate camera 22 to the target location coordinates _{P 11.} Also at this time, the arithmetic processing unit 271 corrects the position coordinates of the substrate camera 22 by acquiring the first error data ΔC1 (ΔCX ₁₁ , ΔCY ₁₁ ) from the first error table 7a. As a result, the imaging center C, as shown in FIG. 13 (b), corresponds exactly to the target location coordinates _{P 11.}

And the arithmetic processing part 271 acquires the position shift D1 between the component center J of the jig | tool component 110, and the imaging center C from the acquired captured image, as shown in FIG.13 (c). Accordingly, the arithmetic processing unit 271, second error data ΔH positional deviation D1 obtained at the target location coordinates _{P 11 (ΔHX 11 (0)} , ΔHY 11 (0)) is acquired as.

As apparent from FIG. 13C, from the state in which the substrate camera 22 is arranged at the position Ph using the first error data ΔC1 (ΔCX ₁₁ -L1, ΔCY ₁₁ ) (position H _{11 of the} mounting head 23a), If the position of the board camera 22 is corrected using the second error data ΔH (ΔHX _{11 (0)} , ΔHY _{11 (0)} ), the mounting head 23a can be accurately placed at the component mounting position M (P ₁₁ ). it can.

Then, the arithmetic processing unit 271 uses the above-described method for each of the plurality of target position coordinates P _{11 to} P _mn and the plurality of rotation angles (0 °, 90 °, 180 °, 270 °). The second error table 7b is created by performing mounting by 23a to 23f) and imaging by the substrate camera 22.

  Next, with reference to FIG. 14, the control processing of the arithmetic processing unit 271 when creating the second error table 7b by the surface mounter 300 of the third embodiment will be described. Similar to the first embodiment, an example in which the second error data ΔH is acquired sequentially from the first mounting head 23a and sequentially from the rotation angle r = 0 ° will be described.

As shown in FIG. 14, first, in step S51, the arithmetic processing unit 271, adsorbing the jig parts 110 on the mounting head 23a, any (the first point) the target location coordinates _{P 11} from the board camera 22 Component mounting is performed at the position Ph moved in the X direction by the offset interval L1. At this time, by performing position correction of the board camera 22 using the first error table 7a, component mounting is performed in a state where the imaging center Ch of the board camera 22 is located at the position Ph.

Next, in step S52, the arithmetic processing unit 271 performs the position correction of the board camera 22 using the first error table 7a, and the target location coordinates _{P 11} moves the imaging center C of the substrate camera 22, step S31 The board component 22 is used to capture an image of the jig component 110 mounted in step S2.

In step S53, the arithmetic processing unit 271 acquires a positional deviation D1 between the component center J and the imaging center C of the jig component 110 from the captured image, and based on the positional deviation D1, the second error data ΔH (ΔHX _{11 (0)} , ΔHY _{11 (0)} ). Further, second error data Δα (Δα _{11 (0)} ) is acquired from the captured image based on the angle change of the jig component 110.

When the second error data ΔC2 (ΔH, Δα) is acquired, the process proceeds to step S54, and it is determined whether or not the measurement has been completed for all the measurement points (target position coordinates P _{11 to} P _mn ). If all measurements have not been completed, the process proceeds to step S55. In step S55, the measurement points measurement points moved by a predetermined amount set in advance from (target location coordinates P ₁₁₎ (in this case, for example, the target location coordinates P ₁₂₎ with respect to the substrate camera 22 by the offset distance L1 X direction The component is mounted at the position Ph moved to (with correction by the first error table 7a). And step S52 and S53 are performed about the following measurement point. By repeating steps S52 to S55, the second error data ΔC2 (ΔH, Δα) is acquired for all the measurement points (target position coordinates P _{11 to} P _mn ).

  Since the subsequent steps S56 to S60 are the same as steps S36 to S40 of the second embodiment, description thereof will be omitted. As described above, the control process for creating the second error table 7b according to the third embodiment is performed.

Also in the third embodiment, similarly to the second embodiment, it is possible to easily obtain the second error data ΔH in consideration of the movement of the offset interval. Then, simply by repeating mounting at a plurality of rotation angles and imaging by the substrate camera 22, a plurality of rotation angles (0 °, 90 °, 180 °, 270 °) at the target position coordinates P _{11 to} P _mn can be easily obtained. The second error table 7b resulting from each rotation can be created.

  Other effects of the third embodiment are the same as those of the first embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first to third embodiments, an example in which the present invention is applied when a plurality of (six) mounting heads 23 move the head units 20 arranged in a line in the X-axis direction has been described. The present invention is not limited to this. For example, the present invention may be applied when a rotary head unit including a plurality of mounting heads 23 arranged in an annular shape on the lower surface side of the mounting head 23 is moved. In the rotary head unit, the mounting heads 23 arranged in an annular shape are circulated in the horizontal direction on the lower surface side of the head unit, and the working positions of the mounting heads 23 are changed. Also in this case, the second error table may be created in consideration of the offset interval between the substrate camera 22 and each mounting head 23 and the rotation angle of the mounting head.

  Moreover, in the said 1st-3rd embodiment, although the example of the structure which provided six mounting heads in the head unit was shown, this invention is not limited to this. Any number of mounting heads may be used.

  Moreover, in the said 1st-3rd embodiment, the 1st error table 7a is created by imaging with the board | substrate camera 22 the reference marks 50a-50f used as the at least 2 places provided on the base 5, for example. However, the first error table 7a may be created using a glass jig plate 105 as shown in FIG.

On the surface of the jig plate 105, a plurality of (m × n) reference marks R (R ₁₁ ) are added in a grid of m rows and n columns along mutually orthogonal directions (X-axis and Y-axis directions). ~ _Rmn ) are printed. First, instead of the printed board 1, the jig plate 105 is placed on the conveyor unit 11 and fixed at a predetermined position, and then the head unit 20 is moved to individually use the board camera 22 (see FIG. 2). The reference marks R (R _{11 to} R _mn ) are sequentially imaged.

The amount of deviation from the captured reference mark R is obtained from the obtained image. As a specific example, for example, the support portion 30 (X-axis) and the moving mechanism 40 of the imaging center C of the driving board camera 22 (Y-axis), the coordinates of the reference mark R ₁₁ on the control program It is assumed that it is moved to P ₁₁ (X ₁₁ , Y ₁₁ ). At this time, the coordinates _{P 11 (X 11, Y 11} ) of the reference mark _{R 11} shift amount of the imaging center C of the board camera 22 for the distance between the imaging center C and the reference mark _{R 11} in the captured image (? Cx ₁₁ , ΔCY ₁₁ ). Thereby, the first error data ΔC1 at the target position coordinates P ₁₁ (the coordinates of the first reference mark R ₁₁ ) is acquired. By adding the first error data ΔC1 (ΔCX ₁₁ , ΔCY ₁₁ ) to the target encoder output value (encoder output value corresponding to the coordinates P ₁₁ (X ₁₁ , Y ₁₁ ) on the control program), the substrate camera 22 is added. Can be accurately moved to the coordinates P ₁₁ (X ₁₁ , Y ₁₁ ).

Such calculation of the first error data (correction amount) is sequentially performed for a plurality (m × n) of reference marks R (R _{11 to} R _mn ) arranged in a grid pattern. As a result, as shown in FIG. 6, an m × n matrix first error table 7 a made up of m × n pieces of first error data ΔC 1 is created. For the position coordinates between each of the reference marks R _{11 to} R _mn , the correction amount is calculated from the first error data ΔC 1 corresponding to some reference marks R adjacent to the position coordinates using a known interpolation method. Can be calculated. Thereby, it is possible to accurately position the board camera 22 at an arbitrary position coordinate.

As a modification of the first to third embodiments, the first error data ΔC1 and the second error data at the grid-like measurement points (target coordinate positions) of m rows and n columns using a glass jig plate 105 are used. Although an example in which the error data ΔC2 (ΔH, Δα) is acquired and the first error table and the second error table are created has been shown, the present invention is not limited to this. In the present invention, for example, only error data for each axis for the X axis and the Y axis may be acquired. That is, for the X axis, error data is acquired only at the measurement points in one row (P _{11 to} P _1n ) in FIG. 5 (FIG. 7), and for the Y axis, one column (P _{11 to} P _m1 ) may be used to acquire error data only. At this time, the error table is a table including n error data of 1 row and n columns with respect to the X axis and m error data of m rows and 1 column with respect to the Y axis. Even in this case, it is possible to obtain a correction value of an arbitrary position coordinate by combining error data with respect to the X-axis coordinates and error data with respect to the Y-axis coordinates, and further, the number of measurement points of the error data can be reduced. Therefore, it is possible to shorten the time for creating the first and second error tables and reduce the data amount of the error tables.

In addition, ΔH of the first error data ΔC1 and the second error data ΔC2 is acquired at a grid-like measurement point (target coordinate position) of m rows and n columns, and the X axis (1 row and n columns) is obtained from these error data. N error data) and an error table for two axes on the Y axis (m error data of m rows × 1 column) may be created. In this case, for example, for the error data in the first column of the X axis, an average value of m measurement points (P _{11 to} P _m1 ) in the first column is taken, and n columns of the X axis are calculated according to the average value for each column. Create (n) error data. Similarly, for the Y axis, m rows (m pieces) of error data are created based on the average value for each row. The error table is a table including n error data of 1 row and n columns for the X axis and m error data of m rows and 1 column for the Y axis. In this case, since each error data included in the error table can be an average value of a plurality of measurements, the accuracy of the error data can be improved as compared with the case where only the measurement for two axes is simply performed. Is possible.

  In the first to third embodiments, the grid-like measurement points when creating the second error table have been described as m rows and n columns, but the present invention is not limited to this. The number of measurement points is sufficient if there are a sufficient number of measurement points to calculate a correction value for an arbitrary position coordinate on the printed circuit board.

  In the first to third embodiments, the second error data ΔH is acquired with respect to each mounting head 23 at four angles (r = 0 °, 90 °, 180 °, 270 °), respectively. Although the example which created the table 7b was shown, this invention is not limited to this. In the present invention, the second error table may be created with a plurality of angles other than four angles such as two angles (0 °, 180 °) and three angles (0 °, 120 °, 240 °).

  In the first to third embodiments, as a device for moving the head unit 20 in the X-axis direction and the Y-axis direction and moving the mounting head 23 in the Z-axis direction, a ball screw shaft, a ball nut, and a ball screw shaft And a driving device comprising an encoder for detecting the amount of rotation of the motor. However, a linear motor may be used instead of each drive device of this type. In the case of a linear motor, the position sensor provided on the mover side reads the position on the linear scale provided on the stator side to detect the position of the mover in the same manner as the encoder. Even in the case of a linear motor, the extension of the stator side and the undulation of the rail that guides the mover occur, the head unit to which the mover is attached is displaced in the horizontal direction, and the head unit is tilted. Using the first error table and the second error table, the electronic component 2 can be mounted on the board at a correct predetermined horizontal position and a correct mounting position that is a correct predetermined mounting direction.

  In the first to third embodiments, the case where a plurality of mounting heads 23 are provided in the head unit 20 has been described. However, when the swing of the rotation center axis of the mounting head 23 can be almost ignored. Corresponds to one or a plurality of mounting heads in the case where one or a plurality of mounting heads are provided, and a first error table obtained by imaging a plurality of target position coordinates with the substrate camera 22, and a plurality of mounting heads A second error obtained by imaging the component mounted or attracted only at an angle of 0 ° of the mounting head 23 in position coordinates regardless of whether there is an inclination with respect to the Z axis of the rotation center axis of the mounting head 23 Corresponding to a predetermined target mounting position when mounting a corresponding mounting head at a predetermined target component angle from a second error table consisting only of data ΔH. First error data ΔC1 and second error data ΔH to be obtained, and based on these first error data ΔC1 and second error data ΔH, a mounting position (component center position) corresponding to one or a plurality of mounting heads. May be corrected. As a result, it is possible to eliminate at least the positional deviation caused by the inclination of the head unit 20 including the horizontal positional deviation caused by the inclination of the rotation center axis of the mounting head with respect to the Z axis. In particular, when the offset interval between the board camera and the mounting head is large, the horizontal displacement of the electronic component with respect to the target mounting position due to the horizontal tilt of the head unit also increases, so high mounting position accuracy in the horizontal direction is achieved. For the required electronic components, it is preferable to correct at least the horizontal displacement. Note that when the swing of the rotation center axis of the mounting head 23 can be almost ignored, the second error data ΔH corresponding to the predetermined target mounting position does not change regardless of the angle of the mounting head 23.

  Similarly, in the case where the swing around the rotation center axis of the mounting head 23 can be almost ignored, when the head unit 20 is provided with one or a plurality of mounting heads, it corresponds to one or a plurality of mounting heads. Regardless of the first error data ΔC1 and the component mounted or attracted at a plurality of position coordinates only at an angle of 0 ° of the mounting head 23, there is no inclination with respect to the Z axis of the rotation center axis of the mounting head 23. First, only the second error data Δα obtained by imaging is obtained, corresponding to one or a plurality of mounting heads, the component center position is corrected based on the first error data ΔC1, and based on the second error data Δα. Thus, the rotation angle of the mounting head 23 at the time of mounting may be corrected. Thereby, at least the displacement of the mounting angle with respect to the target mounting angle of the electronic component 2 due to the inclination of the head unit 20 can be eliminated.

  Also, second error data ΔH at a plurality of angles of the mounting head 23 is obtained at a plurality of position coordinates to create a second error table, corresponding to one or a plurality of mounting heads, and based on the target component mounting position. The component center position is corrected based on the first error data ΔC1 obtained from the error table, and the second error data ΔH obtained from the second error table based on the target component mounting position and the rotation angle of the mounting head 23 at the time of mounting. Based on the above, the horizontal displacement of the mounting head 23 during mounting may be corrected. As a result, in addition to the tilt of the head unit 20, the horizontal displacement of the electronic component 2 caused by the rotation of the rotation center axis of the mounting head 23 occurs regardless of the inclination of the rotation center axis of the mounting head 23 with respect to the Z axis. Can be eliminated.

  Further, second error data Δα at a plurality of angles of the mounting head 23 is obtained at a plurality of position coordinates to create a second error table, corresponding to one or a plurality of mounting heads, and based on the target component mounting position. The component center position is corrected based on the first error data ΔC1 obtained from the error table, and the second error data Δα obtained from the second error table based on the target component mounting position and the rotation angle of the mounting head 23 at the time of mounting. Based on the above, the rotation angle of the mounting head 23 at the time of mounting may be corrected. As a result, in addition to the inclination of the head unit 20, the rotation angle of the mounting head 23 at the time of mounting is caused by the inclination of the rotation center axis of the mounting head 23 with respect to the Z axis, The positional deviation of the mounting angle with respect to the target mounting angle of the electronic component 2 generated based on this can be eliminated.

2 Electronic component 5a First error table (first error data group)
5b Second error table (second error data group)
20 Head unit 22 Substrate camera (first imaging unit)
23 mounted head 60 component camera (second imaging unit)
71, 171, 271 Arithmetic processing part (control part)
72 Storage unit 100, 200, 300 Surface mounter (electronic component mounting apparatus)
110 jig parts ΔC1 first error data .DELTA.C2, [Delta] H, [Delta] [alpha] the second error data L1~L6 offset interval _{P (P} 11 _{~P mn) (target)} position coordinates

Claims (9)

A head unit including a first imaging unit, and a mounting head disposed at a predetermined offset interval from the first imaging unit;
A controller that controls the movement of the mounting head to a component mounting position by moving the head unit in a horizontal plane and rotating the mounting head;
The controller is
Obtaining first error data for each of a plurality of position coordinates to create a first error data group by moving the first image pickup unit to a target position coordinate by shifting the position of the first image pickup unit;
At a predetermined position coordinate, a horizontal direction relative to the predetermined position coordinate of the mounting head when the first imaging unit is moved from the predetermined position coordinate by an offset interval between the first imaging unit and the mounting head. and positional deviation, before SL moves only the first image pickup unit the offset distance from a predetermined position coordinates, and positional deviation in the rotational direction at the time of mounting electronic components by the mounting head on the substrate in the target direction position To obtain second error data including each of a plurality of position coordinates to create a second error data group,
Based on the mounting target position coordinates and the first error data group, first error data for moving the first imaging unit to the mounting target position coordinates is obtained, and the mounting target position coordinates are calculated based on the first error data. While correcting the horizontal displacement when the mounting head is moved to
Based on the the mounting target position coordinates and the second error data group, comprising said horizontal position displacement and positional deviation in the rotational direction of said mounting head for moving the mounting head to the mounting target position coordinates the seeking 2 error data, and is configured to Re not a position of the horizontal position displacement and the rotational direction of the time to move the mounting head to the mounting target position coordinates additional corrected based on the second error data Electronic component mounting equipment.   The control unit is configured to create the second error data group by acquiring the second error data for each of a plurality of position coordinates and a plurality of rotation angles, and moves the mounting head to the mounting target position coordinates. In addition, the second error data when the mounting head is set to a predetermined rotation angle is obtained based on the mounting target position coordinates, the predetermined rotation angle, and the second error data group. The electronic component mounting apparatus according to claim 1. The head unit includes a plurality of the mounting heads having different offset intervals with respect to the first imaging unit,
The electronic component mounting apparatus according to claim 1, wherein the control unit is configured to create the second error data group for each of the plurality of mounting heads. A second imaging unit for imaging the electronic component adsorbed by the mounting head;
The control unit acquires the position of the jig component imaged by the first imaging unit as the target position coordinates, and moves the first imaging unit from the target position coordinates by the offset interval at the mounting head. by imaged by the second imaging unit said jig component adsorbed in the horizontal position and a position moved by the offset distance from the pre Symbol target location coordinates of the mounting head with respect to the center position of the jig parts In the above configuration, the position error of each position with respect to the rotational direction position when the electronic component is mounted on the target position on the substrate by the mounting head is recognized and acquired as the second error data, and a plurality of position coordinates The second error data is obtained by performing the suction of the jig component by the mounting head and the imaging of the chucked jig component by the second imaging unit every time. It is configured to create an electronic component mounting apparatus according to claim 1 or 3. The control unit is configured to acquire the second error data for each of a plurality of position coordinates and a plurality of rotation angles to create the second error data group,
The mounting head position is moved to the mounting target position coordinates, and the second error data when the mounting head is set to a predetermined rotation angle is used as the mounting target position coordinates, the predetermined rotation angle, and the second error data. The electronic component mounting apparatus according to claim 4, wherein the electronic component mounting apparatus is configured to be obtained based on a group. The control unit mounts the electronic component or the jig component on the substrate by the mounting head at a position where the first imaging unit is moved from the target position coordinate by the offset interval, and then the first imaging unit is by move to the target location coordinates to image the electronic component or jig parts, the horizontal position of the center position of the electronic component or jig component with respect to the imaging center, only the offset distance from the pre Symbol target position coordinate movement obtained at the position to recognize the deviation of each position in the rotational direction position when mounting the electronic component by the mounting head on the substrate in the target direction position, the second error data based on the positional deviation obtained The second error data group is created by performing mounting by the mounting head and imaging by the first imaging unit for each of a plurality of position coordinates. It is configured as an electronic component mounting apparatus according to claim 1 or 3.   The control unit is configured and configured to acquire the second error data for each of a plurality of position coordinates and a plurality of rotation angles to create the second error data group, and the mounting head is set to the mounting target position coordinates. The second error data when the mounting head is set to a predetermined rotation angle is obtained based on the mounting target position coordinates, the predetermined rotation angle, and the second error data group. The electronic component mounting apparatus according to claim 6, wherein A head unit including an imaging unit and a mounting head disposed at a predetermined offset interval with respect to the imaging unit, and moving the head unit in a horizontal plane and rotating the mounting head, A mounting position correction data creation method for an electronic component mounting apparatus that moves a mounting head to a component mounting position,
Obtaining a first error data group for each of a plurality of position coordinates by generating first error data due to a positional shift of the imaging unit when moving the imaging unit to a target position coordinate; and
In the target position coordinates, the horizontal position of the mounting head for moving offset distance between the mounting head and the imaging unit, at a position moved by the offset distance from the pre Symbol target location coordinates, the on board Acquiring second error data for each of a plurality of position coordinates by creating a second error data group by shifting each position from a rotational direction position when mounting an electronic component at a target direction position with a mounting head; and
A mounting position correction data creating method comprising: creating mounting position correction data of the mounting head when moving to a component mounting position based on the first error data group and the second error data group.   The mounting position according to claim 8, wherein in the step of creating the second error data group, the second error data group is created by acquiring the second error data for each of a plurality of position coordinates and a plurality of rotation angles. Correction data creation method.

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