JP4921346B2 - Adsorption position correction method in component mounting apparatus - Google Patents

Description

  The present invention relates to a method and apparatus for correcting a suction position when a component is picked up by a mounting head in a component mounting apparatus.

  In general, there is known a component mounting apparatus in which an electronic component is picked up from a component supply unit by a mounting head, transported onto a printed circuit board, and mounted. The mounting head has a nozzle shaft that can be moved up and down and rotated, and a suction nozzle that is detachably attached to the tip of the nozzle shaft. Select a suction nozzle that is different in size and shape depending on the type of component to be mounted. It can be attached. A head unit including one or more mounting heads can move over the component supply unit and the printed circuit board.

  In this type of component mounting device, it is desirable to reduce the displacement of the suction position in order to avoid a suction failure at the time of component suction. There has been a demand for precise adjustment.

  On the other hand, in the component mounting apparatus, the nozzle tip position may deviate from the normal position during component suction due to various factors, and this may cause a deviation between the nozzle tip position and the component center position.

  In order to correct such a deviation, it has been conventionally performed to pick up the suction nozzle with a component recognition camera, detect the position shift of the tip of the suction nozzle based on the image, and correct the component suction position accordingly. Yes.

For example, in the electronic component pickup device disclosed in Patent Document 1, first, before mounting a component, the suction nozzle held by the mounting head is set to a predetermined component recognition height, and the tip of the suction nozzle is moved to a component recognition camera. The amount of deviation of the tip of the suction nozzle with respect to the reference position (the center of the mounting head) is obtained based on the image and stored, and this is then stored after the suction nozzle picks up the component. Is imaged from below with a component recognition camera, the amount of displacement of the component center position relative to the reference position is determined from the image, and the average value of the displacement amount of the component center position for a plurality of times and the amount of displacement of the suction nozzle tip The movement amount of the mounting head to the component suction position is corrected so that the tip position of the suction nozzle matches the center position of the component. That is, the component suction position is corrected by feedback control.
Japanese Patent No. 3234021

  By the way, in addition to the positioning error of the suction component supply device, the error of the component supply means, the component shape error, etc. Changes in the nozzle tip position in the XY directions that occur when the suction nozzle descends from the component recognition height to the component suction height are included. The change in the nozzle tip position that occurs when the nozzle descends occurs when the nozzle shaft or the entire head unit is tilted due to a head unit assembly error, a head unit component connection error, or the like.

  Such an error due to a change in the nozzle tip position when the nozzle is lowered cannot be directly measured from an image obtained by imaging the suction nozzle at the component recognition height. In the conventional apparatus as disclosed in the above-mentioned patent publication, the positional deviation between the suction nozzle tip and the center of the component due to various error factors including such errors is corrected by feedback control.

  However, in this feedback control, the suction and recognition of the component is repeated a predetermined number of times, and the average value of the component center position is obtained by the predetermined number of processes, and then the average value of the component center position and the suction nozzle tip position are calculated. Since the suction position is corrected according to the misalignment, a considerable number of mounting operations are required before the correction is made. During this period, component suction mistakes occur frequently, resulting in component loss. There was a possibility that feedback correction values could not be acquired due to mistakes.

  In view of such circumstances, the present invention can detect a change in the nozzle tip position that occurs when the nozzle is lowered due to the inclination of the nozzle shaft, etc., distinguishing it from other error factors. It is an object of the present invention to provide a suction position correction method capable of correcting a deviation of the suction position caused by a change in the nozzle tip position at the time, and reducing component suction mistakes.

In order to solve the above problems, the suction position correction method of the present invention has a suction nozzle that can be moved up and down, and conveys a component sucked from a component supply unit by the suction nozzle onto a substrate to be mounted. Recognizing means comprising a mounting head for mounting at a predetermined position on the mounting substrate, and recognizing a component adsorbed by the suction nozzle in a state where the suction nozzle is at a predetermined recognition height after the component suction by the suction nozzle A suction position correction method in a component mounting apparatus comprising: a horizontal position change amount of the suction nozzle tip when the suction nozzle is at the recognition height and when the suction nozzle is lowered to the component suction height. Component adsorption by the nozzle tip position change detection process that detects the nozzle tip position change amount and the suction position correction amount including the correction amount according to the nozzle tip position change amount at the time of component suction Includes a correction control step of correcting the location, and in the nozzle tip position change amount detecting step, first the suction nozzle before the component adsorbed on the recognition of the suction nozzle tip by the recognition means while the height for the recognition The center position of the suction nozzle is detected based on the center position of the suction target part at the predetermined part supply position, and then the center position of the suction nozzle is set to correspond to the center position of the suction target part. After adjusting the horizontal position, lower the suction nozzle to the part suction height to suck the part, return the suction nozzle to the above recognition height, recognize the suction part by the recognition means, and the recognition result On the basis of this, a deviation of the component center position from the nozzle center position is detected, and this is used as a nozzle tip position change amount .

  According to this method, even if the suction nozzle tip position shifts due to various factors, by correcting the suction position accordingly, the shift between the component center position and the suction nozzle tip position can be made sufficiently small. Mistakes can be prevented.

  In particular, the nozzle tip position change amount detection process is performed in the equipment adjustment stage, etc., and this process can be used to detect the horizontal position change of the nozzle tip when the suction nozzle descends due to the inclination of the entire nozzle shaft and head unit. It can be detected separately from the cause of the adsorption deviation. In the component mounting operation, the component suction position is corrected in accordance with the amount of change in the nozzle tip position from the beginning, and suction mistakes can be prevented.

In the nozzle tip position change amount detection step, the nozzle center position is first detected based on recognition of the suction nozzle tip by the recognition means in a state where the component suction nozzle is set to the recognition height before component suction. The center position of the suction target component at the component supply position is detected, and then the horizontal position of the suction nozzle is adjusted so that the nozzle center position corresponds to the center position of the suction target component, and then the suction nozzle Is lowered to the component suction height to suck the component, the suction nozzle is returned to the above recognition height, the suction component is recognized by the recognition means, and the component center position shifts from the nozzle center position based on the recognition result. Is detected and this is the nozzle tip position.
Therefore, the nozzle tip position change amount can be detected easily and accurately.

  In the method of the present invention, in the nozzle tip position change amount detection step, it is preferable that the suction nozzle is rotated to detect the nozzle tip position change amount at a plurality of rotation angles.

  In this way, data on the amount of change in the nozzle tip position at various rotation angles can be obtained, and when a component is picked up during component mounting work, a correction value corresponding to the amount of change in the nozzle tip position at the nozzle rotation angle at that time is obtained. It is done.

  And a nozzle tip deviation amount detecting step for obtaining a deviation amount of the suction nozzle tip position with respect to a predetermined reference position in a state where the suction nozzle is at the recognition height. In the correction control step, It is preferable to correct the component suction position with a suction position correction amount including a correction amount according to the position change amount and a correction amount according to the displacement amount of the suction nozzle tip position detected in the nozzle tip shift amount detection step.

  In this way, in addition to the change amount of the nozzle tip position detected in the nozzle tip position change amount detection step, the deviation amount of the suction nozzle tip position detected in the deviation amount detection step is also taken into account, and the component suction is more accurately performed. The position is corrected.

  In addition, after the component is picked up by the suction nozzle, the amount of deviation of the component center from the center of the suction nozzle is detected by component recognition in a state where the suction nozzle is set to a predetermined recognition height, and the component suction position is It is preferable to further include a feedback correction amount calculation step for obtaining a feedback correction amount, and after the feedback correction amount is obtained, the feedback correction amount is preferably added to the correction control of the component suction position in the correction control step.

  In this way, when the feedback correction amount is obtained after the start of the component mounting operation, the feedback correction amount is further added, so that the component suction position can be corrected with higher accuracy.

  According to the component suction position correction method of the present invention, the horizontal position change of the nozzle tip when the suction nozzle is lowered can be detected separately from other suction displacement factors. By correcting the component suction position according to the amount of change in position, it is possible to prevent a suction error.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic plan view of a component mounting apparatus to which the present invention is applied, and FIG. 2 is a schematic front view of the mounting apparatus.

  The component mounting apparatus includes a main body mechanism unit 1 for mounting an electronic component C (IC, transistor, capacitor, etc.) on a printed circuit board (substrate to be mounted) P mainly by the operation of each unit mechanism, and a controller 30 (FIG. 3).

  The main body mechanism unit 1 includes a mounting machine body including a base 2 and the like, and a head unit 3 that is movable with respect to the mounting machine body.

  On the base 2 is disposed a conveyer 4 for conveying a printed circuit board. The conveyer 4 conveys a printed circuit board P placed on the upper part and moves to a predetermined mounting work position (the position shown in FIG. 1). ) To stop.

  On both sides of the conveyor 4, component supply units 5 are arranged, and these component supply units 5 are provided with multiple rows of tape feeders 5 a.

  Each tape feeder 5a is configured such that the electronic parts C are stored at predetermined intervals and the held tapes are led out from the reels, and the electronic parts C are intermittently dismounted so that the head unit 3 can take them out. To come out.

  The head unit 3 is disposed above the base 2 and is movable between the component supply unit 5 and a mounting work position where the printed circuit board (substrate to be mounted) P is disposed.

  Specifically, the head unit 3 is movable along an X axis and a Y axis that are orthogonal to each other on a plane substantially parallel to the surface of the printed circuit board P.

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 9 driven by a Y-axis servomotor 8 are disposed on the base 2. A support member 10 for the head unit is disposed on the fixed rail 7, and a nut portion 10 a provided on the support member 10 is screwed into the ball screw shaft 9.

  Further, the support member 10 is provided with a guide member 11 in the X-axis direction and a ball screw shaft 13 driven by an X-axis servo motor 12, and the head unit 3 is movably held by the guide member 11. A nut portion (not shown) provided on the head unit 3 is screwed onto the ball screw shaft 13.

  Accordingly, the support member 10 is moved in the Y-axis direction by driving the Y-axis servo motor 8, and the head unit 3 is moved in the X-axis direction with respect to the support member 10 by driving the X-axis servo motor 12. By this mechanism, the movement of the head unit 3 along the X-axis and Y-axis directions is realized.

  The head unit 3 is provided with mounting heads 15, and in the illustrated embodiment, six mounting heads 15 are provided in a line along the X-axis direction. Each mounting head 15 has a hollow nozzle shaft 15a extending in the vertical direction, and a suction nozzle 15b removably attached to the tip (lower end) of the nozzle shaft 15a. Parts can be sucked by the negative pressure supplied to the suction nozzle 15b through the nozzle shaft 15a. As the suction nozzle 15b, a plurality of types having different sizes and shapes are prepared, and the suction nozzle 15b selected according to the type of part to be sucked is attached to the tip of the nozzle shaft 15a. Yes.

  In addition, the head unit 3 is provided with an elevating mechanism that moves the mounting head in the vertical direction (Z-axis direction) and a rotation mechanism that rotates the mounting head 15 about the axis (around the R axis).

  The elevating mechanism has a Z-axis servomotor 16 (see FIG. 3). The Z-axis servomotor 16 moves the mounting head 15 in the vertical direction via a ball screw or the like. The rotation mechanism has an R-axis servomotor 17 (see FIG. 3), and the mounting head 15 is rotated around the R-axis in response to the rotational drive of the R-axis servomotor 17. .

  The head unit 3 is further provided with a substrate recognition camera 18 that performs substrate recognition by taking an image of a fiducial mark attached to the substrate.

  A component recognition camera 19 is provided on the base 2 at a predetermined position within the head unit movement range as a recognition means for recognizing the component sucked by the suction nozzle. The component recognition camera 19 captures an image of the electronic component (or the suction nozzle tip) adsorbed on the tip of the suction nozzle 15b from below under a reflected illumination condition by an illumination device (not shown) attached to the camera 19. Thus, it is possible to obtain a reflection image of the bottom surface of the electronic component (or the tip of the suction nozzle).

  Next, the control system in the present embodiment will be described with reference to FIG.

  The controller 30 is provided at an appropriate location inside the main body mechanism unit 1 and is a well-known CPU that executes logical operations, a ROM that stores initial settings, a RAM that temporarily stores various data during operation of the apparatus, and the like. It is composed of

  The controller 30 functionally includes a motor control unit 31, an external input / output unit 32, an image processing unit 33, a server communication unit 34, various storage units 35 to 37, and an arithmetic processing unit 38.

  The display unit 21 is connected to the controller 30, and the display unit 21 is configured to be able to display the driving state of the mounting machine in accordance with instructions from the arithmetic processing unit 38.

  The motor control unit 31 controls the driving of the Y-axis servo motor 8, the X-axis servo motor 12, the Z-axis servo motor 16 and the R-axis servo motor 27.

  The external input / output unit 32 inputs signals from various sensors 22 provided in the mounting machine, and outputs signals to various actuators 23 other than the servo motors 8, 12, 16, 27. It has become.

  The image processing unit 33 takes in image data from the board recognition camera 18 and the component recognition camera 19 and performs processing such as binarization. The server communication unit 34 communicates information and the like with the server.

  The storage means includes a storage program 35 for storing a component mounting processing program and various data necessary for mounting, a transport system data storage means 36 for storing various data relating to a transport system for transporting the printed circuit board, and component mounting. Facility specific data storage means 37 for storing data specific to each facility of the apparatus (for example, a nozzle lowering offset described later) is provided.

  The arithmetic processing unit 38 has an arithmetic function such as a CPU, and controls the motor control unit 31 and the image processing unit 33 in accordance with a program stored in the mounting program storage unit. .

  In particular, the arithmetic processing unit 38 calculates a nozzle tip position change amount that is a horizontal position change amount of the suction nozzle tip when the suction nozzle 15b is at the recognition height and when it is lowered to the component suction height. A nozzle tip position change amount detecting step to detect, a nozzle tip deviation amount detecting step for obtaining a deviation amount of the suction nozzle tip position with respect to a predetermined reference position in a state where the suction nozzle 15b is at the recognition height, and the suction After the component is picked up by the nozzle 15b, with the suction nozzle 15b at a predetermined recognition height, the amount of deviation of the component center with respect to the suction nozzle center is detected by component recognition, and feedback correction of the component pickup position is performed according to the detection result. A feedback correction amount calculation step for obtaining the amount, and a suction position correction amount including a correction amount according to the nozzle tip position change amount at the time of component suction. It is adapted to perform a correction control step of correcting the part suction position.

  Here, the change amount of the nozzle tip position when the suction nozzle is at the recognition height and when the suction nozzle is lowered to the component suction height (hereinafter referred to as a nozzle lowering offset in the embodiment) is shown in FIGS. This will be described with reference to FIG.

  The nozzle lowering offset is caused by a head unit assembly error, a head unit component manufacturing error, or the like. If the nozzle shaft 15a or the entire head unit has an inclination with respect to the Z-axis direction as shown in FIG. 4A due to these error factors, the nozzle tip position is in the inclination direction as the nozzle descends. As shown in FIG. 4B, the nozzle tip position Cn on the XY coordinates moves in the direction of the arrow a as the nozzle descends, and a descending offset occurs. In this case, if the nozzle shaft 15a is not bent, even if the nozzle shaft 15a is rotated, it only rotates around the center of the nozzle shaft, so that the nozzle tip position Cn does not change due to the rotation.

  Further, when the nozzle shaft 15a is bent as shown in FIG. 5 (a), the tip position Cn of the nozzle shaft can be changed by rotation as well as the change as shown in FIG. 5 (b). Change. That is, the direction of the downward offset changes by rotation as indicated by arrows b1 to b4.

  When the inclination of the nozzle shaft 15a or the entire head unit and the bending of the nozzle shaft 15a are combined as shown in FIG. 6 (a), the tip position of the nozzle shaft is shown in FIG. 6 (b). As Cn changes as it descends, the direction and magnitude of the change vary greatly with rotation. That is, as indicated by arrows c1 to c4, the direction and magnitude of the descending offset change greatly with rotation.

  Such downward offsets due to various factors are equipment-specific and do not vary after equipment adjustment.

  Therefore, such a descent offset is examined for a plurality of nozzle rotation angles in the equipment adjustment stage and stored in the equipment-specific data storage means.

  Next, processing executed by the controller 30 will be described based on the flowcharts shown in FIGS. 7, 9, and 10 with reference to FIG.

  FIG. 7 is a flowchart of a nozzle lowering offset detection process (nozzle tip position change amount detection step) performed in an equipment adjustment stage before the component mounting apparatus is operated. When this processing is started, the controller 30 moves the tip of the suction nozzle 15b from below with the component recognition camera 19 with the suction nozzle 15b raised to the component recognition height as shown in FIG. An image is taken, and based on the image, the deviation (dXa, dYa) of the nozzle tip center position from the nozzle reference position (regular nozzle tip position) is measured (step S1).

  Next, the suction target component 40 is appropriately determined from the component supply unit 5, and the head unit 3 is moved to a position where the board recognition camera 18 corresponds to the suction target component 40, as shown in FIG. 8B. The board recognition camera 18 picks up the suction target component 40 from above, and based on the image, the component center deviation from the suction reference position (part center position when the suction target part 40 is not displaced in the component supply unit) ( dXb, dYb) are measured (step S2).

  Next, as shown in FIG. 8C, the nozzle tip center position shift (dXa, dYa) and the component center shift so that the tip center of the suction nozzle 15b and the component center of the suction target component 40 correspond to each other. After the suction nozzle 15b is moved to a position corrected with respect to the suction reference position according to (dXb, dYb), the suction nozzle 15b is lowered to the part suction height to suck the suction target part 40 (step S3).

  After sucking the component in this way, the suction nozzle 15b is raised to the component recognition height and moved to the component recognition camera 19 as shown in FIG. 8D, and then sucked by the suction nozzle 15b. The component is imaged by the component recognition camera 19, and based on the image, the component suction displacement amount (dXo, dYo), which is the displacement amount between the nozzle tip center position and the component center position, is measured (step S4). The component suction deviation amount (dXo, dYo) at this time corresponds to the nozzle lowering offset.

  This nozzle lowering offset (part suction deviation amount) (dXo, dYo) is stored in the equipment specific data storage means 37 as equipment specific data (step S5).

  Next, it is determined whether or not acquisition of the nozzle descending offset is completed for all rotation angles (0 degree, 90 degrees, 180 degrees, and 270 degrees) for each predetermined rotation angle (for example, every 90 degrees) for the same nozzle. (Step S6) If not completed, the suction nozzle 15b is rotated in a predetermined forward rotation direction by a predetermined angle (for example, 90 degrees) (Step S7), and then the process returns to Step S1 and the following processing is repeated.

  If acquisition of the nozzle lowering offset at all rotation angles for the same nozzle is completed, it is determined whether acquisition of the nozzle lowering offset is completed for all nozzles (step S8). The detection nozzle is changed by moving (step S9), and then the process returns to step S1 to repeat the following processing.

  When acquisition of the nozzle lowering offset is completed for all nozzles, the control shown in FIG. 7 is terminated.

  FIG. 9 shows a nozzle eccentricity correction amount measurement process for measuring a deviation amount of the suction nozzle tip position in a state where the suction nozzle is at a component recognition height and obtaining a correction amount (hereinafter referred to as a nozzle eccentricity correction amount). (Nozzle tip deviation amount detection step). This processing is performed when the suction nozzle 15b is attached to or exchanged at the tip of the nozzle shaft 15a of the mounting head 15 for mounting components, and a nozzle eccentricity correction amount is obtained for each suction nozzle used for mounting.

  When this process starts, the controller 30 captures the tip of the suction nozzle 15b from below with the component recognition camera 19 in a state where the suction nozzle 15b is raised to the component recognition height, and the nozzle reference position is based on the image. The deviation (dXa, dYa) of the nozzle tip center position from (regular nozzle tip position) is measured (step S11). The deviation (dXa, dYa) of the center position of the nozzle tip is used as the nozzle eccentricity correction amount. And this measurement result is memorize | stored in the memory | storage means 35, such as a mounting program, as data for every use nozzle (step S12).

  Next, it is determined whether or not the acquisition of the nozzle eccentricity correction amount is completed for all the angles of the same nozzle at every predetermined rotation angle (for example, every 90 degrees) (step S13). 15b is rotated by 90 degrees in a predetermined forward rotation direction (step S14), and then the process returns to step S11 and the following processing is repeated. If acquisition of the nozzle eccentricity correction amount is completed for all angles, it is determined whether acquisition of the nozzle eccentricity correction amount is completed for all the suction nozzles 15b to be used (step S15). Then, the head unit 3 is moved to change the detection nozzle (step S16), and then the process returns to step S11 to repeat the subsequent processing.

  If the correction amount acquisition is completed, this flow ends.

  FIG. 10 is a flow of processing during component mounting work. This process includes a feedback correction amount calculation for obtaining a feedback correction amount for the component suction position, and a correction control step for correcting the component suction position by the suction position correction amount.

  That is, when the component is sucked from the component supply unit 5 by the mounting head 15 of the head unit 3, the controller 30 calculates from the nozzle descending offset data calculated and stored in the flow of FIG. The nozzle lowering offset corresponding to the suction nozzle 16b to be used and the suction angle is read, and the suction nozzle 16b to be used and the suction angle are calculated from the nozzle eccentricity correction amount data calculated and stored in the flow of FIG. The nozzle eccentricity correction amount corresponding to the nozzle offset is read out, and the component suction position is calculated in consideration of the nozzle descent offset and the nozzle eccentricity correction amount (step S21). That is, the component suction position is shifted by an amount corresponding to the addition of the nozzle lowering offset and the nozzle eccentricity correction amount.

  Next, it is determined whether or not there is a suction position feedback correction value obtained based on the measurement of the suction position deviation after the component suction for the past N times (for example, five times) (step S22). That is, during the mounting operation, the amount of deviation between the tip of the suction nozzle and the center of the component is detected based on the image picked up by the component recognition camera 19 after the component is picked up, and when the amount of deviation is detected N times, the suction position feedback corresponding to the average value is detected. Although the correction value is obtained, it is determined whether or not the suction position feedback correction value has been acquired by such processing.

  If there is a suction position feedback correction value, the feedback correction value is added to the component suction position obtained in step S21 (step S23).

  Next, the mounting head 15 is moved to the component suction position corrected in steps S21 to S23, and the suction nozzle 15b is lowered to suck the component (step S24).

  After the component suction, the suction nozzle 15b is raised to a predetermined height and the head unit 3 is moved onto the component recognition camera 19, and the component recognition camera 19 images the suction component from below and performs component recognition (step S25). Based on the component recognition, a relative deviation amount (dXn, dYn) between the component center and the suction nozzle tip center is calculated (step S26). Further, an average value of the relative deviation amounts for the past N times is calculated (step S27), and this is reflected in the subsequent control as a feedback correction value.

  After the component recognition, the head unit 3 is moved onto the printed circuit board P, and the component that has been attracted to the suction nozzle 15b of the mounting head 15 is mounted on the printed circuit board P (step S28).

  When the component mounting is completed, the process returns to step S21 and the subsequent processing is repeated to suck the next component.

  According to the method and apparatus of the present embodiment as described above, even when the suction nozzle tip position shifts due to various factors such as head unit assembly error or after manufacturing the head unit components, the suction position is corrected accordingly. By doing so, the deviation between the component center position and the suction nozzle tip position can be made sufficiently small to prevent suction mistakes.

  In particular, the nozzle lowering offset detection process shown in FIG. 7 performed in the facility adjustment stage or the like can detect the nozzle lowering offset due to the inclination of the entire nozzle shaft and the head unit, etc., separately from other suction deviation factors.

  In this case, in this embodiment, the measurement of the deviation of the nozzle tip center position based on the image obtained by capturing the suction nozzle 15b at the component recognition height from below with the component recognition camera 19 (step S1), and the substrate recognition camera 18 Measurement of the component center deviation based on the imaging of the suction target component 40 (step S2), and after moving the suction nozzle 15b to a position corrected according to the deviation of the nozzle tip center position and the component center deviation, the suction nozzle 15b is lowered to suck the suction target component 40 (step S3), and the component suction deviation amount based on the image picked up by the component recognition camera 19 after the suction nozzle 15b is raised to the component recognition height after the component suction. By measuring (step S4), the component recognition camera 19 and the board recognition camera can be used easily and accurately under the nozzle. It is possible to detect the offset.

  Further, when the nozzle is replaced, the nozzle eccentricity correction amount corresponding to the deviation amount of the suction nozzle tip position can be detected in the state where the suction nozzle is at the component recognition height by the nozzle eccentricity correction amount measurement flow of FIG. .

  In the process during the component mounting work shown in FIG. 10, the suction position is corrected according to the nozzle lowering offset and the nozzle eccentricity correction amount from the beginning of the mounting work before the suction position feedback correction value is acquired. The positional deviation between the center of the component and the tip of the suction nozzle can be made sufficiently small from the beginning of the mounting operation, and the occurrence of suction mistakes can be prevented.

  In addition, after the feedback correction value is acquired based on the measurement of the suction position deviation after the component suction for N times (for example, 5 times), the feedback correction value is further added to the component suction position, so that the accuracy is improved. The component suction position can be corrected well.

  In addition, the specific structure of the method of this invention is not limited to the said embodiment, A various change is possible.

  For example, as the nozzle lowering offset detection processing, instead of the processing shown in FIG. 7, when the suction nozzle is at the component recognition height, the nozzle tip center position shift is detected based on the image picked up by the component recognition camera. When the nozzle is lowered to the component suction height, the nozzle tip center position shifts when the suction nozzle is at the component recognition height, such as when the tip of the nozzle is detected by another camera and the nozzle tip center position is detected. And the deviation of the center position of the nozzle tip when the suction nozzle is lowered to the component suction height may be detected by separate detection means, and the difference between the two deviations may be obtained and used as the nozzle lowering offset.

  In the above-described embodiment, the component recognition camera 19 is used as a recognition unit for recognizing the suction component, and for recognizing the nozzle tip in the nozzle lowering offset detection process (FIG. 7) and the nozzle eccentricity correction amount measurement process (FIG. 9). However, a recognition means other than the camera, such as a laser recognition means for detecting a projection by irradiating a recognition object (component or nozzle tip) with a parallel light beam (laser) from the side may be used. .

It is a fragmentary top view of the component mounting apparatus with which this invention is applied. It is a partial front view of the said component mounting apparatus. It is a block diagram which shows a functional structure about the controller of the said component mounting apparatus. It is explanatory drawing which shows the nozzle descent | fall offset (nozzle tip position change) which arises when a suction nozzle descend | falls to component adsorption height in case the nozzle shaft or the whole head unit has inclination. It is explanatory drawing which shows the nozzle descent | fall offset when a nozzle shaft is bent. It is explanatory drawing which shows the nozzle descent offset when the inclination of a nozzle shaft or the whole head unit, and the bending of a nozzle shaft generate | occur | produce in combination. It is a flowchart which shows a nozzle descent offset detection process. (A)-(d) is explanatory drawing which shows each process of the nozzle descent | fall offset detection process shown in FIG. It is a flowchart which shows a nozzle eccentricity correction amount measurement process. It is a flowchart which shows the process in component mounting operation | work.

P Printed circuit board 3 Head unit 15 Mounting head 15a Nozzle shaft 15b Suction nozzle 18 Substrate recognition camera 19 Component recognition camera 30 Controller 35 Mounting program storage means 37 Equipment specific data storage means 38 Arithmetic processing means

Claims (4)

It has a suction nozzle that can be moved up and down and rotated, and includes a mounting head for transporting the component sucked from the component supply unit by this suction nozzle onto the mounted substrate and mounting it on a predetermined position of the mounted substrate. A suction position correction method in a component mounting apparatus having a recognition means for recognizing a component sucked by the suction nozzle in a state where the suction nozzle is set to a predetermined recognition height after the component suction by the suction nozzle,
A nozzle tip position change amount detecting step for detecting a nozzle tip position change amount that is a horizontal position change amount of the suction nozzle tip when the suction nozzle is at the recognition height and when the suction nozzle is lowered to the component suction height. When,
A correction control step of correcting the component suction position by a suction position correction amount including a correction amount according to the nozzle tip position change amount at the time of component suction ,
In the nozzle tip position change detection step, first, the nozzle center position is detected based on the recognition of the suction nozzle tip by the recognition means with the component suction nozzle at the recognition height before the component suction, while the predetermined part The center position of the suction target component at the supply position is detected, and then the horizontal position of the suction nozzle is adjusted so that the nozzle center position corresponds to the center position of the suction target component. After lowering the suction height to suck the part, the suction nozzle is returned to the recognition height, the suction part is recognized by the recognition means, and the deviation of the center position of the part from the nozzle center position is detected based on the recognition result. And this is made into the nozzle tip position change amount, The suction position correction method in the component mounting apparatus,   2. The suction position correction method in the component mounting apparatus according to claim 1, wherein, in the nozzle tip position change amount detection step, the suction nozzle is rotated to detect the nozzle tip position change amount at a plurality of rotation angles. . In a state where the suction nozzle is at the recognition height, it further includes a nozzle tip deviation amount detection step for obtaining a deviation amount of the suction nozzle tip position with respect to a predetermined reference position,
In the correction control step, the component suction is performed using the suction position correction amount including the correction amount according to the nozzle tip position change amount and the correction amount according to the suction nozzle tip position deviation amount detected in the nozzle tip deviation detection step. The suction position correction method according to claim 1, wherein the position is corrected. After the component is picked up by the suction nozzle, the component nozzle detects the amount of deviation of the component center from the suction nozzle center in the state where the suction nozzle is at a predetermined recognition height, and feedback correction of the component suction position according to the detection result A feedback correction amount calculating step for obtaining an amount is further included, and after the feedback correction amount is obtained, the feedback correction amount is added to the correction of the component suction position in the correction control step. The suction position correction method according to any one of claims 1 to 3 .

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