KR101472434B1 - Electronic component mounting apparatus and mounting position correction data creating method - Google Patents

Abstract

The electronic component mounting apparatus includes a head unit including a mounting head spaced apart by a predetermined offset distance from the first imaging section and the first imaging section, and a mounting section for mounting the head unit in a horizontal plane, And a control unit for performing control. The control unit obtains the first error data by the positional deviation of the first image pickup unit to create the first error data group and obtains the second error data when the first image pickup unit is moved by the offset distance between the first image pickup unit and the placement head And acquires the second error data group. The control unit corrects the positional deviation in the horizontal direction when the mounting head is moved based on the first error data group and corrects the position error of at least one of the horizontal direction and the rotational direction of the mounting head based on the second error data group The misalignment is further corrected.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electronic component mounting apparatus and an electronic component mounting apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and a mounting position correction data creating method, and more particularly to an electronic component mounting apparatus having a head unit including an image pickup unit and a mounting position correction data creating method.

BACKGROUND ART Conventionally, an electronic component mounting apparatus having a head unit including an image pickup unit is known. Such an electronic component mounting apparatus is disclosed in, for example, Japanese Patent Application Laid-Open No. 2006-108457.

Japanese Patent Laid-Open Publication No. 2006-108457 discloses an electronic part having an image pickup unit and a head unit (suction head) including one mounting head (suction nozzle) arranged at intervals (offset interval) relative to the image pickup unit A mounting apparatus is disclosed. This electronic component mounting apparatus is configured to create correction data of the mounting position prior to electronic component mounting. Specifically, as a first step, the head unit is moved so that the image pickup section is positioned above the positioning mark of the jig substrate to which the positioning mark is attached, and the positional deviation of the image pickup section with respect to the positioning mark is acquired. As a second step, the head unit is moved so that the mounting head is positioned above the positioning mark, thereby mounting the component. The third step captures a part mounted by the imaging unit and acquires the positional displacement of the mounting component with respect to the positioning mark. Thus, the positional displacement data of the imaging section with respect to the positioning mark and the positional displacement data of the mounting component with respect to the positioning mark are acquired, and the sum of the positional displacement data of both is used as correction data of the mounting position. Japanese Unexamined Patent Application Publication No. 2006-108457 discloses a technique in which the displacement errors in the horizontal direction (landing error) caused by the vertical movement of the mounting head when the mounting head is mounted are used by using the displacement data of both sides, The mounting error and the mounting error accompanying the entire mounting control are reduced.

However, in the electronic component mounting apparatus disclosed in Japanese Patent Application Laid-Open No. 2006-108457, the entire head unit tilts in correcting the mounting position and the gap (offset interval) between the mounting head and the imaging unit in the head unit Not considered.

That is, the X and Y axes of the movement mechanism of the head unit are stretched and bent by thermal deformation, and the positional shift amount of the entire head unit is changed by the position coordinates, and the inclination of the head unit is changed. The mounting head spaced from the image pickup unit on the head unit by the inclination of the head unit is changed from the position based on the image pickup unit when the inclination of the head unit is changed to the position based on the image pickup unit when there is no inclination of the head unit Is changed.

Japanese Patent Laid-Open Publication No. 2006-108457 discloses that in the first step, the positional shift of the imaging section with respect to the positioning mark is obtained so that the imaging section can be accurately positioned above the positioning mark, while the mounting head and the imaging section Therefore, when the placing head is positioned above the same part positioning mark in the second step, the image pickup unit is disposed above the position coordinate separated by the offset distance from the acquired position coordinate in the first step. In other words, it is possible to correct a change in the positional shift amount of the entire head unit. However, the positional deviation of the imaging section above the positioning mark due to the inclination of the head unit and the positional deviation of the imaging section in the positional coordinates shifted by the offset distance therefrom are different. Therefore, even if the position displacement data of the mounting component (placement head) in the third step and the position displacement data of the imaging section in the first step are taken as the correction data of the mounting position, the displacement actually occurs at each position It is considered that there is a problem that the mounting position by the mounting head can not be accurately corrected.

In addition, due to inclination of the entire head unit, mounting angle error of the electronic components at the time of mounting occurs. In addition, mounting angle error of the electronic component at the time of mounting occurs due to the fact that the center axis of rotation of the mounting head is slightly inclined with respect to the mounting surface (substrate). When the rotational angle of the mounting head is changed when the rotational center axis of the mounting head is inclined from the vertical direction with respect to the mounting surface (substrate), the mounting angles of the electronic components are matched, The positional deviation of the mounting position of the electronic component is generated, and it is necessary to correct the mounting position in accordance with the rotational angle of the mounting head. Japanese Unexamined Patent Application Publication No. 2006-108457 does not take into consideration the inclination of the entire head unit or the direction of the component at the time of mounting, and thus the mounting position in the rotational direction can not be accurately corrected.

Further, when the center axis of rotation of the mounting head vibrates and rotates, the mounting position of the electronic component corresponding to the mounting angle of the electronic component at the time of mounting changes in the horizontal direction, so that the mounting position can not be accurately corrected. In addition, when the rotational center axis of the mounting head vibrates and rotates, the angle at which the rotational center axis of the mounting head is inclined from the vertical direction with respect to the mounting surface (substrate) changes. Therefore, The displacement is changed and the mounting position in the rotational direction can not be accurately corrected.

It is an object of the present invention to provide an electronic component mounting apparatus and a mounting position correction data creation method capable of more accurately correcting a mounting position.

In order to achieve the above object, an electronic component mounting apparatus according to a first aspect of the present invention includes: a head unit including a mounting head disposed at a predetermined offset distance from a first imaging section and a first imaging section; And a control unit for moving the head unit in a horizontal plane and rotating the mounting head to move the mounting head to the component mounting position. The control unit controls the first imaging unit to move the first imaging unit in the target position coordinates A first error data group is obtained by acquiring first error data by positional misalignment for each of a plurality of positional coordinates and the first error data group is obtained by moving the first image pickup unit by the offset distance between the first image pickup unit and the placement head from the target position coordinates , A positional deviation in the horizontal direction with respect to the target position coordinate of the mounting head, and a positional deviation when the electronic part is mounted by the mounting head Directional positional deviation of the first error data group is acquired for each of a plurality of positional coordinates to create a second error data group, and based on the mounting target positional coordinates and the first error data group, Correcting the positional deviation in the horizontal direction when the mounting head is moved to the mounting target position coordinates and correcting the positional deviation of the mounting head in the horizontal direction of the mounting head when the mounting head is moved based on the second error data group And further corrects at least one of the positional deviation and the positional deviation in the rotational direction.

The electronic component mounting apparatus according to the first aspect of the present invention includes a positional deviation in the horizontal direction due to the inclination of the rotational center axis of the mounting head with respect to the Z axis and at least the inclination in the horizontal direction of the head unit, (Offset interval) between the mounting head of the head unit and the first imaging unit, and a positional deviation of the electronic component in the horizontal direction with respect to the target mounting position at the time of mounting the electronic component at the target mounting position, The positional deviation of at least one of the positional deviations in the rotational direction based on the inclination of the rotational direction can be corrected, so that the mounting position can be more accurately corrected. In particular, when the offset distance between the first imaging unit and the placement head is large, the positional deviation of the electronic component in the horizontal direction from the target placement position due to the inclination of the head unit in the horizontal direction becomes large. It is preferable to correct at least the positional deviation in the horizontal direction with respect to the required electronic component.

In the electronic component mounting apparatus according to the first aspect, the second error data may include a horizontal coordinate value of the target position coordinate of the mounting head when the first imaging section is moved by the offset distance between the first imaging section and the mounting head, At least one of a positional shift in the rotational direction when the electronic component is mounted on the substrate at the target position by the placement head on the substrate at the position where the first imaging unit has been moved by the offset distance from the target position coordinate, And the control unit obtains the first error data when the first imaging unit is moved to the mounting target position coordinates based on the mounting target position coordinates and the first error data group, and based on the first error data, Corrects the positional deviation in the horizontal direction when the mounting head is moved to the position coordinates, The second error data is obtained when the mounting head is moved to the mounting target position coordinates based on the tooth coordinate and the second error data group and when the mounting head is moved to the mounting target position coordinates based on the second error data The positional deviation of at least one of a positional deviation in the horizontal direction and a positional deviation in the rotational direction of the display screen.

In the electronic component mounting apparatus according to the first aspect, preferably, the control section is configured to obtain the second error data group by a plurality of position coordinates and a plurality of rotation angles to generate the second error data group, The second error data when the mounting head is moved to a predetermined rotation angle is obtained based on the mounting target position coordinates, the predetermined rotation angle and the second error data group, and based on the obtained second error data Thereby further correcting the positional deviation when the mounting head is moved at a predetermined rotational angle with the mounting target position coordinates. Thus, even when the rotational axis of the mounting head vibrates and rotates, the position of the mounting head relative to the target mounting position when the electronic component is mounted at the target mounting position corresponding to the rotational angle of the mounting head along the mounting direction of the electronic component It is possible to correct at least one of the positional deviation and the positional deviation in the rotational direction with respect to the mounting direction, thereby correcting the mounting position more accurately.

In the electronic component mounting apparatus according to the first aspect, preferably, the head unit includes a plurality of mounting heads with different offset intervals with respect to the first imaging section, and the control section includes a second error So as to create a data group. With this configuration, the mounting positions of the mounting heads can be individually corrected more accurately.

In the electronic component mounting apparatus according to the first aspect, it is preferable that the electronic component mounting apparatus further includes a second image pickup section for picking up an electronic component picked up by the mount head, and the control section controls the position of the jig component picked up by the first pick- And the second image pickup section picks up the jig component, which is attracted to the placement head at a position shifted by the offset distance from the target position coordinate, by the second image pickup section so that the horizontal position of the placement head relative to the center position of the jig component And the positional deviation of at least one of the positional deviation of the mounting head and the positional deviation of the mounting head in the rotational direction of the mounting head is detected and acquired as second error data, And a second error data group is created by performing imaging by the second imaging unit of the jig component . With this configuration, it is possible to easily obtain the image of the jig component by the first image pickup section and the image pickup by the second image pickup section in a state in which the jig component is attracted to the inclination with respect to the Z axis of the rotation center axis of the mount head (Offset interval) between the mounting head and the first image pickup unit in the head unit, and a target mounting position based on at least the inclination in the horizontal direction of the head unit and the gap The second error data including at least one of positional displacement of the electronic component in the horizontal direction relative to the target mounting position at the time of mounting and positional deviation in the rotational direction based on at least the inclination of the head unit in the horizontal direction . In addition, when a jig component or a component is sucked from the mounting head, the suction position of the component to the mounting head may not be stabilized and may be dispersed. In this case, even if the position error is obtained by capturing the mounted jig component after the jig component is mounted and the second error data is acquired, the positional deviation of the component relative to the mounting head of the component attracted by the mounting head, The correlation is not obtained and positional deviation occurs in the mounted component even if the positional correction is performed at the time of mounting based on the second error data. On the other hand, according to the present invention, since the second error data is acquired by performing the image pickup by the second image pickup section in a state in which the jig component is sucked, the second error data can be obtained with high accuracy, The mounting position can be set to the correct position by performing the positional displacement correction at the time of mounting.

In this case, preferably, the control unit is configured to acquire the second error data for each of the plurality of position coordinates and the plurality of rotation angles to generate the second error data group, and moves the mounting head to the mounting target position coordinates The second error data when the mounting head is set at a predetermined rotation angle is determined based on the mounting target position coordinates, the predetermined rotation angle and the second error data group, and based on the obtained second error data, So as to further correct the positional deviation when the mounting head is moved at the rotational angle. Thus, even when the rotary shaft of the mounting head vibrates and rotates, the positional displacement of the electronic component in the horizontal direction relative to the target mounting position when mounting the electronic component at the target mounting position corresponding to the mounting direction of the electronic component, The positional deviation of at least one of the positional deviations in the rotational direction can be corrected, so that the mounting position can be corrected more accurately.

In the electronic component mounting apparatus according to the first aspect, preferably, the control section mounts the electronic component or the jig component on the substrate with the mounting head at a position shifted from the target position coordinate by the offset distance, One image pickup unit is moved to a target position coordinate to pick up an electronic part or a jig part so that at least one of a positional shift in the horizontal direction of the center position of the electronic component or the jig part with respect to the image pickup center, And the second error data is acquired based on the obtained positional deviation. The control unit carries out the mounting by the mounting head and the imaging by the first imaging unit for each of the plurality of position coordinates, thereby obtaining the second error data group . With such a configuration, it is possible to mount the electronic component or the jig component in the region of the substrate, and to pick up the component after the mounting, so that it is not necessary to move the head unit largely, and the second error data group can be created in a short time.

In this case, preferably, the control unit is configured to acquire the second error data for each of the plurality of position coordinates and the plurality of rotation angles to generate the second error data group, and moves the mounting head to the mounting target position coordinates The second error data when the mounting head is set at a predetermined rotation angle is determined based on the mounting target position coordinates, the predetermined rotation angle and the second error data group, and based on the obtained second error data, So as to further correct the positional deviation when the mounting head is moved at the rotational angle. Thus, even when the rotary shaft of the mounting head vibrates and rotates, the positional displacement of the electronic component in the horizontal direction relative to the target mounting position when mounting the electronic component at the target mounting position corresponding to the mounting direction of the electronic component, The positional deviation of at least one of the positional deviations in the rotational direction can be corrected, so that the mounting position can be corrected more accurately.

In the electronic component mounting apparatus according to the first aspect, preferably, the control section is configured to create the first error data group prior to the generation of the second error data group, And corrects the positional deviation in the horizontal direction when the first imaging unit is moved to the target position coordinate based on the target position coordinates and the first error data group when the second error data group is acquired for each of the coordinates. With this configuration, the second error data can be acquired at the correct position that does not include the error corresponding to the first error data by the correction using the first error data group when acquiring the second error data for each of the plurality of position coordinates have. As a result, since the acquisition of the second error data is facilitated, the generation of the second error data group can be easily performed.

A mounting position correction data generation method according to a second aspect of the present invention includes a head unit including a mounting head and a mounting head spaced apart from each other by a predetermined offset distance from the imaging section, The mounting position correction data creating method of the electronic component mounting apparatus for moving the mounting head to the component mounting position by rotating the mounting head together with the first error data A step of obtaining a first error data group by acquiring a plurality of positional coordinates of the target head by a plurality of positional coordinates, And the mounting direction of the mounting head in the direction of rotation when the electronic component is mounted by the mounting head A step of acquiring a second error data by at least one of positional shifts for each of a plurality of positional coordinates to create a second error data group; and a step of obtaining, based on the first error data group and the second error data group, And a step of creating mounting position correction data of the mounting head at the time of movement of the mounting head.

With this configuration, it is possible to acquire first error data corresponding to the position coordinates of the first imaging unit when the mounting head is arranged at the component mounting position, and to move from the component mounting position by the offset interval at the same angle as the mounting component angle The position of the mounting head in the horizontal direction due to the inclination of the head unit in the horizontal direction when the head unit is inclined, and the positional deviation of the mounting head in the horizontal direction due to the inclination of the rotational center axis of the mounting head with respect to the Z- It is possible to obtain second error data which is positional shift data of at least one of positional displacement in the horizontal direction or displacement of the rotational direction position when the electronic component is mounted on the substrate in the target direction position on the substrate. The first error data when the mounting head is moved from the first error data group to the component mounting position and the first error data when the mounting head is moved from the second error data group to the component mounting position The mounting position correction data of the mounting head can be precisely created by the second error data. Further, by using the prepared mounting position correction data, the mounting position can be more accurately corrected.

In the mounting position correction data creation method according to the second aspect, preferably, in the step of creating the second error data group, the second error data is acquired for each of a plurality of position coordinates and a plurality of rotation angles, Create a group. Thus, even when the rotational axis of the mounting head vibrates and rotates, the position of the mounting head relative to the target mounting position when the electronic component is mounted at the target mounting position corresponding to the rotational angle of the mounting head along the mounting direction of the electronic component It is possible to correct at least one of the positional deviation and the positional deviation in the rotational direction with respect to the mounting direction, thereby correcting the mounting position more accurately.

1 is a schematic plan view showing the configuration of a surface acoustic wave element according to the first to third embodiments of the present invention.
2 is a schematic side view of the surface mount machine according to the first to third embodiments of the present invention when viewed along the depth direction (Y2 direction).
Fig. 3 is a block diagram showing a control configuration of a surface treatment organ according to the first to third embodiments of the present invention. Fig.
4 is a schematic diagram for explaining a positional deviation caused by deformation of the X-axis and Y-axis of the head unit.
5 is a schematic diagram showing a jig plate for obtaining first error data.
6 is a diagram showing an example of a first error table made up of a plurality of first error data.
7 is a schematic diagram for explaining a method of acquiring second error data in the first embodiment of the present invention.
8 is a diagram showing an example of a second error table made up of a plurality of second error data.
9 is a view showing a control processing flow when creating the second error table in the surface mount apparatus according to the first embodiment of the present invention.
10 is a view showing a control processing flow of an arithmetic processing unit when mounting an electronic part by a surface mounting machine according to the first embodiment of the present invention.
11 is a schematic diagram for explaining a method of acquiring second error data in the second embodiment of the present invention.
12 is a view showing a control processing flow when creating the second error table in the surface mount apparatus according to the second embodiment of the present invention.
13 is a schematic diagram for explaining a method of acquiring second error data in the third embodiment of the present invention.
14 is a view showing a control processing flow when creating the second error table in the surface mount apparatus according to the third embodiment of the present invention.
15 is a diagram for explaining a method of acquiring first error data.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First Embodiment)

First, the structure of the surface ceramic body 100 according to the first embodiment of the present invention will be described with reference to Figs. 1 to 4, 7, 8, and 15. Fig. The surface yarn 100 is an example of the "electronic component mounting apparatus" of the present invention.

1 and 2, the surface mount orifice 100 according to the first embodiment of the present invention is an apparatus for mounting an electronic component 2 on a printed circuit board (wiring board) 1. As shown in Fig. The surface yarn organ 100 includes a base 5, a substrate transfer section 10 provided on the base 5, and a head unit 20 which is movable above the substrate transfer section 10 along the XY plane A support portion 30 for supporting the head unit 20 movably in the X direction and a movement mechanism portion 40 for moving the support portion 30 in the Y direction. As shown in Fig. 2, a cover 6 covering the respective parts is provided on the base 5 in the surface yarn 100. As shown in Fig. 2, the internal structure which is covered by the cover 6 and is invisible from the outside is also shown by a solid line for convenience of illustration.

On both sides (Y1 (Y2) side) of the substrate transfer section 10, a plurality of tape feeders 3 for feeding the electronic component 2 are arranged. The tape feeder 3 holds a reel (not shown) on which a plurality of electronic components 2 are wound with a tape held at a predetermined interval. The reel is rotated and the tape is fed, so that the electronic part 2 is supplied from the leading end portion. The head unit 20 has a function of obtaining the electronic part 2 from the tape feeder 3 and mounting the electronic part 2 on the printed board 1 on the substrate carrying part 10. [ Here, the electronic component 2 is an electronic component in the form of a small piece such as an IC, a transistor, a capacitor, and a resistor.

As shown in Fig. 1, the substrate carrying section 10 has a pair of conveyor sections 11 extending in the X direction, which is the conveying direction of the printed board 1. Further, a plurality of substrate sensors (not shown) for detecting the conveying condition of the printed substrate 1 are provided in the conveyor unit 11. Thus, the printed board 1 held by the conveyor unit 11 is conveyed based on the detection result of the substrate sensor. The substrate transfer section 10 is internally provided with a clamp mechanism for holding the printed circuit board 1 during transportation in a stopped state at the stop position at the time of component mounting.

2, the support portion 30 includes a ball screw shaft (X axis) 31 extending in the X direction, a servo motor 32 for rotating the ball screw shaft 31, a ball screw shaft 31 And a guide rail 33 extending along the guide rail 33. The head unit 20 also has a slide guide portion 21 to which a ball nut (not shown) to which the ball screw shaft 31 is screwed is attached. The head unit 20 is moved along the X direction together with the rotation of the ball screw shaft 31 while the slide guide portion 21 is guided by the guide rail 33. [

The support portion 30 is configured to be movable in the Y direction which is substantially orthogonal to the X direction in a state where the support portion 30 is mounted on the moving mechanism portion 40 fixed on the base 5. [ 1, the moving mechanism 40 includes a pair of frame members 40a and 40b and a ball screw shaft (Y axis) 41 A servo motor 42 for rotating the ball screw shaft 41, a guide rail 43a extending along the ball screw shaft 41, a guide rail 43a provided on the frame member 40b, And a parallel guide rail 43b. The guide rails 43a and 43b movably support both end portions (X direction) of the support portion 30. The support portion 30 is provided with a ball nut 35 to which the ball screw shaft 41 is screwed. The support portion 30 is guided by the guide rails 43a and 43b and is moved in the Y direction through the ball nut 35 together with the rotation of the ball screw shaft 41. [ Therefore, the head unit 20 is configured to be able to move the upper side of the base 5 to an arbitrary position along the X-Y plane by rotating the ball screw shafts 31 and 41.

2, the head unit 20 includes a substrate camera 22 attached to the side end portion (X1 direction side) of the head unit 20, (Six) mounting heads 23 which are provided at the lower end of the mounting head 23 on the Z1 direction side). Further, as shown in Fig. 1, the individual mounting heads 23 are arranged at positions separated from each other by offset intervals (distances) in the X direction from the board camera 22. As shown in Fig. 4, the first mounting head 23a and the second mounting head 23a are disposed in order from the mounting head 23 on the side closer to the board camera 22 with the position of the board camera 22 as the origin 23b), ... And the sixth mounting head 23f, the offset intervals become L1 to L6, respectively. 1, the positions of the respective mounting heads 23 and the board camera 22 in the head unit 20 are the same in the Y direction, and the respective mounting heads 23 and the board camera 22 Are arranged side by side in a straight line in the X direction. The board camera 22 is an example of the "imaging section" and the "first imaging section" of the present invention.

As shown in Fig. 2, each mounting head 23 has a function of adsorbing and holding the electronic component 2 by a negative pressure generated at the tip of the nozzle by a negative pressure generator (not shown). As shown in Fig. 3, each of the mounting heads 23 includes a servo motor (Z axis) 26 (refer to Fig. 3, one or more (the same number as the mounting head 23) (Z direction) with respect to the head unit 20 by a mechanism. 3), one or a plurality (the same number as the mounting head 23) of the servomotor (R axis) 27 (the same number as the mounting head 23 at most) and a rotating mechanism (not shown) . 2) is picked up from the tape feeder 3 (see Fig. 1) by the ascending and descending operations and the suctioning operation, and the printed board 1 (Fig. 1 The electronic component 2 is mounted on the printed board 1 at a predetermined component mounting position and a predetermined mounting angle (R-axis rotation angle).

Further, as shown in Fig. 1, two component cameras 60 are fixedly provided on the upper surface 5a of the base 5. As shown in Fig. 2, the component camera 60 has a function of picking up the lower surface side of the electronic component 2 picked up by the mounting head 23 from below. As a result, the position of the center of the mounting head 23 (the center of the suction nozzle) and the positional shift of the center of the electronic component 2 sucked by the mounting head 23 are discriminated. The component camera 60 is an example of the "second imaging unit" of the present invention.

As shown in Fig. 3, a control device 70 for controlling the operation of each part of the apparatus main body is incorporated in the surface body 100. As shown in Fig. The control device 70 includes an arithmetic processing unit (CPU) 71, a storage unit 72 (an operation program storage unit 72a and a correction data storage unit 72b), an image processing unit 73, 74). The calculation processing unit 71 is an example of the "control unit" of the present invention.

The operation processing unit 71 collectively manages the operations of the surface real-organ 100. The operation program storage unit 72a in the storage unit 72 stores a control program that can be executed by the operation processing unit 71 and a data flow required when the head unit 20 is moved. A first error table 7a and a second error table 7b to be described later are stored in the correction data storage unit 72b for correcting the mounting position of the electronic component 2 with respect to the printed board 1 have. The image processing section 73 has a role of internally generating data necessary for the operation of the surface real-organ 100 by processing the image data picked up by the board camera 22 and the component camera 60 . The first error table 7a and the second error table 7b are examples of the "first error data group" and the "second error data group" of the present invention, respectively.

The motor control section 74 is configured to control the respective servo motors of the surface mount 100 based on control signals output from the arithmetic processing section 71. The motor control section 74 is configured to control the substrate transport by the substrate transport section 10. The motor control unit 74 can recognize the XY coordinate of the head unit 20, the height position of the mounting head 23, and the rotation angle based on output signals from an encoder (not shown) of each servo motor .

Next, the first error table 7a and the second error table 7b stored in the storage section 72 (correction data storage section 72b) will be described.

In the first embodiment, the arithmetic processing unit 71 prepares the first error table 7a and the second error table 7b before mounting the electronic part 2, and stores the first error table 7a and the second error table 7b in the storage unit 72. [ The arithmetic processing unit 71 determines whether or not each of the mounting heads 7a and 7b at the time of moving to the component mounting position based on the first error table 7a and the second error table 7b during the mounting operation of the electronic component 2. [ 23 are corrected.

Here, the X axis (the ball screw shaft 31 and the guide rail 33) and the Y axis (the ball screw shaft 41 and the guide rail 43) of the head unit 20 are constituted by a long member. Therefore, even if the X axis and the Y axis are designed / manufactured with high precision, their shapes are slightly deformed. 4, the ball screw shaft 31 and the guide rail 33 are not completely straight along the X-direction, but have minute displacements, resulting in deformation as a whole. As a result, for example, since the ball screw shaft 31 is expanded by the thermal expansion in the X direction, the head unit 20 is displaced in the X direction. Further, the ball screw shaft 31 is bent, so that the head unit 20 is displaced in the Y direction as if the head unit 20 is bent along the ball screw shaft 31 as a whole. Thus, at the position U1 indicated by the solid line in FIG. 4 due to, for example, the bending of the ball screw shaft 31, the head unit 20 is inclined counterclockwise as a whole, At the indicated position U2, is reversely tilted in the clockwise direction, causing a displacement in the rotational direction. 4 schematically shows the shaft deformation and the posture of the head unit 20 exaggerated for convenience. Although not shown, a similar positional deviation occurs also for the Y-axis (the ball screw shaft 41 and the guide rails 43a and 43b). Further, due to the deformation of the X-axis and the Y-axis, the head unit 20 generates a positional deviation (posture deviation) not only in the horizontal direction but also in the Z-direction.

Actually, the head unit 20 may be slightly inclined with respect to the ball screw shaft 31 and the guide rail 33, or each of the mounting heads 23 may be mounted in a direction perpendicular to the horizontal plane (the printed board surface) Or the head unit 20 is slightly inclined from the head unit 20 as shown in Fig. Due to these mounting errors and the position and attitude deviation of the head unit 20 due to the deformation of the X and Y axes, position deviations (depending on position coordinates) are generated in the head unit 20 in accordance with the XY position coordinates.

The first error table 7a and the second error table 7b correspond to the substrate camera 22 (the first error table 7a) and the second error table 7b at the target position coordinates, respectively, in order to correct the positional shifts depending on these positional coordinates. And the positional deviation occurring when positioning the mounting head 23 (second error table 7b) is obtained for each positional coordinate.

First, a method of creating the first error table 7a will be described with reference to Fig. Forward 5 to be in at least two places provided on, for example, in six places a reference mark 50a {[coordinates _{(X 50a, Y 50a)]} ~50f [ the coordinates (X _{50f, 50f} Y)]} X-axis encoder And the feed amount based on the Y-axis encoder are adjusted to the respective coordinate values, and the substrate camera 22 is moved and picked up. Then, the image pickup axis displacement amount with respect to the reference mark (50a~50f) in the captured image as shown in Fig. _{15 [(ΔCX 50a, ΔCY 50a} ) ~ (ΔCX 50f, ΔCY 50f)] to obtain first And stores it as an error table 7a. Further, as shown in Fig. 15, the shift amount in a state in which the feed amount based on the encoder is insufficient is made positive. Thus, it is possible to correlate the position of the head unit 20 on which the board camera 22 is mounted with respect to the base 5. By using the first error data? C1 of the first error table 7a, it becomes possible to accurately position the substrate camera 22 at a predetermined target position coordinate.

That is, each coordinate of the forward (5) If any of the predetermined position to place the camera substrate 22 in the [P (Xp, Yp)], a reference mark _{(50a~50f) [(X 50a,} Y 50a) ~ ( by using a predetermined location a plurality of shifts of each displacement _{[(ΔCX 50a, ΔCY 50a)} ~ (ΔCX 50f, ΔCY 50f)] from the relation [P (Xp, Yp)] for the X _50f, Y _50f)] The shift amount? CXp,? CYp (in which the displacement amount in a state where the feed amount based on the encoder is insufficient) is obtained by the interpolation method (interpolation method). The head unit 20 is moved so that the position by the X-axis encoder is Xp + DELTA CXp and the position by the Y-axis encoder is Yp + DELTA CYp in order to make the shift amount zero.

By using the first error data? C1 of the first error table 7a, it is possible to accurately position the substrate camera 22 at a predetermined target positional coordinate even if elongation and bending occur in the X and Y axes It becomes. However, since the respective mounting heads 23 and the board camera 22 are separated by different offset intervals L1 to L6 (see Fig. 4), for example, any predetermined position P (Xp, Yp) It is necessary to move the board camera 22 to a position shifted by a corresponding offset interval L1 in order to position the mounting head 23a on the board 23a.

However, there is a case where the image pickup center C of the board camera 22 is positioned at the target position coordinate because the head unit 20 changes the posture (inclined) depending on the position coordinates, The position of the mounting head 23 is displaced relative to the target position coordinate in the case where the imaging center C is positioned at a position displaced by the distance L1. Therefore, the positional deviation of the mounting head 23 in a state in which the board camera 22 is moved to the position shifted by the offset distance from the target position coordinate is represented as DELTA H in the second error data C2 in the target position coordinate ). The creation of the first error table 7a is performed prior to the creation of the second error table 7b.

Next, a method of creating the second error table 7b will be described with reference to Figs. 2 and 7. Fig.

A glass jig component 110 as shown in Fig. 7 (a) is used to create the second error table 7b. A mark indicating the component center J is attached to the surface of the jig component 110, and it is possible to acquire the component center position by image recognition.

First, as shown in Fig. 7 (e), the jig component 110 is mounted at a desired position on the substrate (jig plate or printed board 1) by using the mounting head 23a. 7 (a), the positional coordinates of the center J of the parts of the jig component 110 are determined based on the X-axis encoder and the Y-axis encoder by imaging the jig component 110 with the board camera 22 obtaining a value for each of the feeding, and this with the target location coordinates _{[P 11 (X 11, Y} 11)]. When the head unit 20 is moved by driving the X axis and the Y axis so as to become the conveyance values even after the board camera 22 is moved away from the jig component 110, The center of gravity of the board camera 22 can be made coincident with the center of gravity of the board camera 22.

The first mounting head (23a) in about the target location coordinates (P ₁₁₎ from when moved in the X direction by the board camera (see Fig. 4) 22, offset distance (L1) corresponding to the, design, placement head (23a of Can be positioned above the target position coordinate P ₁₁ . In which mobility as 7 (b) as shown in the jig plate or the jig part 110 is loaded from the upper side of the printed circuit board 1 of the Drawings, the target location coordinates offset distance (L1) from (P ₁₁₎ by (or calculated by interpolation), the _{read-position [Ph (X 11 -L1, Y} 11)] in the first error first error data _{[(L1, ΔCY 11 ΔCX 11} ) ΔC1] from the corresponding table (7a) It is possible to precisely position the imaging center Ch (Ch represents the imaging center of the substrate camera 22 after the movement by the offset interval) of the substrate camera 22. [ That is, X-axis encoder on the X coordinates are X _{11 -} is carried out feed of the head unit 20, so that the _L1, the Y coordinate on the Y axis encoder ₁₁ Y + ₁₁ ΔCY _- L1 + ΔCX _11.

The jig component 110 is sucked by the first mounting head 23a in a state where the board camera 22 is positioned at the position Ph using the first error data? C1. However, when the head unit 20 is inclined in a counterclockwise direction (see Fig. 4), as shown in Fig. 7 (b) the position of the mount due to the offset distance of the head (23a), the head (23a) standing out actually adsorb the target location coordinates (P ₁₁₎ is not the jig part 110 in the position (H _11). At this time, the jig component 110 is angularly displaced in the clockwise direction with respect to the mounting head 23a by?

Then, the head unit 20 is moved to the position above the component camera 60 (see Fig. 2) (in this case also, the first error data? C1 corresponding to the position of the component camera 60) , And the lower surface image of the jig component 110 adsorbed by the first mounting head 23a is picked up by the component camera 60. In this case, Thus, as shown in Fig. 7C (the left and right images of the parts camera 60 are reversed to correspond to Fig. 7B), the center of the parts J and the mounting heads 23a the suction positions the displacement _{[ΔH (ΔHX 11, ΔHY 11} )] between [= with the center position of the head (23a)] (H ₁₁₎ is obtained. This attraction position shift is mainly caused by the inclination DELTA alpha of the head unit 20 and the difference between the inclination DELTA alpha of the mounting head 23a and the mounting position of the mounting head 23a at the time of picking up the component when the vertical movement axis is inclined from the vertical direction, Due to the difference in height position of the head 23a.

Since the suction position displacement is the displacement when the adsorbing jig part 110, with the target location coordinates (P ₁₁₎ on the substrate by lowering the head (23a) as shown in Fig. 7 (b) the target position coordinates The same positional deviation occurs even when the component is mounted on the pillar P ₁₁ . It is also possible to detect the angular displacement DELTA alpha (see Fig. 4) in the clockwise direction of the jig component 110 from the images of the two jig parts 110 in Figs. 7A and 7C. In this way the second error data [ΔC2 for carrying out part to the target location coordinates (P ₁₁₎ mounted by the obtained position deviation _{[ΔH (ΔHX 11, ΔHY 11} )] and the angular displacement (Δα) is mounted the head (23a) ( DELTA H, DELTA alpha)]. The angular displacement ?? in the clockwise direction of the jig component 110 caused by the counterclockwise inclination ?? of the head unit 20 is obtained by correcting the mounting head 23a in the anticlockwise direction? It is possible to solve the problem.

Thereafter, FIG. 7 (e) described as a target position the coordinates (P ₁₁₎ a predetermined small with the jig part 110 at a position (P ₁₂₎ moved by a predetermined, and Figure 7 (a) from indicating on ~ (c ). The above measurement operation is repeatedly carried out up to the measurement points (P _{11 to} P _mn ) of the grid shape of m rows x n columns. If the rotation angle (R axis) of the mounting head 23a at this time is r = 0, the table of? H in the second error data? C2 at r = 0 of the first mounting head 23a .

When the mounting head 23a (or the entire head unit 20) is mounted with a slight inclination and the rotational axis of the mounting head 23a does not coincide with the Z axis, as shown in Fig. 7 (d) The adsorption position is changed by the rotation angle of the head 23a. In FIG. 7 (d), the absorption positions [H ₁₁ (0), H ₁₁ (90) H ₁₁ (180), and H ₁₁ , H ₁₁ (270)] and the respective position deviations (ΔH90, ΔH180, ΔH270) [ΔH0 refers to ΔH in FIG. 7 (c)]. Therefore, tables of? H in the second error data? C2 are prepared for predetermined rotation angles (r = 0, 90, 180, and 270), respectively. Similarly, the rotation angle of the jig component 110 at the time of attraction is angularly displaced with respect to the rotation angle by the rotation angle of the mounting head 23a. The angular displacement caused by the inclination of the head unit 20 and the rotational axis of the mounting head 23a do not coincide with the Z axis from the images of the two jig parts 110 in Figs. 7 (a) and 7 (c) And the angular displacement occurring with respect to the rotation angle of the jig component 110 when the jig component 110 is rotated while being mounted in a direction different from the component direction of the jig component 110 at the time of attraction. For this reason, tables of DELTA alpha in the second error data DELTA C2 are also prepared for predetermined rotation angles (r = 0, 90, 180, and 270).

As a result of the above, for each of the rotation angles (r = 0, r = 90, r = 180 and r = 270) with respect to the first mounting head 23a, 4) are created. The process of obtaining the second error data [Delta] C2 ([Delta] H, [Delta] [alpha]) is applied to the second to sixth mounting heads 23b to 23f , The second error table 7b shown in Fig. 8 is created.

In this example, the board camera 22 and the mounting head 23 are arranged linearly in the X direction. However, when the mounting head 23 is offset also in the Y direction with respect to the board camera 22 It is sufficient to consider the movement of the Y coordinate as much as the offset distance as in the case of the X coordinate.

The mounting positions of the mounting heads 23 are corrected based on the first error table 7a and the second error table 7b when the electronic component 2 is mounted. For example, when the component mounting position M is the coordinate [P _mn (X _mn , Y _mn )] and the mounting angle θ is 0 ° and the mounting by the first mounting head 23a is performed , first the first error table coordinate position _{[Ph (X mn - L1,} Y mn)] obtained by subtracting the offset distance (L1) from (7a) first error data [ΔC1 corresponding to (ΔCX _{mn - L1,} ΔCY _mn) (Or calculated by an interpolation method). In addition, the second reference to the table with r = 0 ° of the mounting head (23a) from the error table (7b) to coordinates [P _mn (X _mn, Y _mn)] second error data [ΔH (ΔHX _mn corresponding to _{( 0)} and? HY _{mn (0)} ) are obtained. Based on the above, the corrected component mounting position [M (x, y)] (the feed value on the X-axis encoder and the feed value on the Y-axis encoder) is x = (X _mn -L ₁ + C M _{( m n - L 1 )} + H X _{mn (0)} ) and y = (Y _mn +? CY _mn +? HY _{mn (0)} ). Further, the component rotation angle in the R-axis motor is calculated as DELTA alpha _{mn (0) (} the second error data DELTA alpha is a positive value in the clockwise direction of the jig component 110, (Mounting angle) by correcting the rotation angle of the rotary shaft 23a by the detection value in the counterclockwise direction.

Using a _- represents an example of Figure 7 the mounting position correction, the component mounting position after the correction [M (x, y)] is the first error data _{[(L1, ΔCY 11 ΔCX 11} ) ΔC1] in 7 (b) Fig. position from the state placing the image pickup center (Ch) of the board camera 22 to (Ph) (with the head position is H _11), also the second error data in Figure 7 (c) [ΔH (ΔHX 11 (0), DELTA HY _{11 (0)} )] to correct the position of the board camera 22. As a result, it is possible to place in the example of FIG. 7 accurate component mounting a mounting head (23a) position _{{M [P 11 (X 11} , Y 11)]}.

Next, the control processing of the arithmetic processing unit 71 when creating the second error table 7b by the surface physical organ 100 of the first embodiment will be described with reference to Fig. 9. Fig. Here, an example of obtaining the second error data [? C2 (? H,?)] In order from the first mounting head 23a and in order from the rotational angle of 0 degrees will be described.

As shown in Fig. 9, first, in step S1, the head unit 20 is moved above the jig part 110 arranged at an arbitrary position. This may be the designation of the position coordinates by the operator or the jig component 110 may be recognized by moving the head unit 20 to scan by the board camera 22. [

In step S2, the jig component 110 is picked up by the board camera 22. The calculation processing unit 71 is transferred the value of the phase the target location coordinates (P _11), the coordinates of its center (J) of the jig part 110 from the captured image X-axis encoder, a transfer value according to the Y-axis encoder .

Step S3 In the first mounting at the target location coordinates (P ₁₁₎ given position by the X-axis encoder and Y-axis encoder position (Ph) is moved in the X direction by the board camera 22, the offset distance (L1) from the state And the jig component 110 is sucked by the head 23a (r = 0 deg.).

In step S4, the bottom image of the jig component 110 that has been adsorbed is picked up by the component camera 60. The arithmetic processing unit 71 calculates the displacement of the position between the component center J of the jig component 110 and the suction position H ₁₁ of the mounting head 23a from the picked-up image as the second error data ΔH (ΔX ₁₁ , ΔHY ₁₁ )]. Is obtained as the second error data [DELTA alpha (DELTA alpha ₁₁ )] which is the rotation error from the change in the angle of the direction of the jig component 110 in the captured image.

In step S5, it is judged whether or not the measurement has been completed for all the measurement points (target position coordinates (P _{11 to} P _mn )) in the grid pattern of m rows and n columns. If the measurement does not have all terminated, the procedure proceeds to step S6, the measurement point then moves by a predetermined amount (in this case, for example, P _12), the fixture part 110 is mounted on, in step S2 for the next measurement point ~ S4 are executed. Steps S2 to S6 are repeated to perform measurement (acquisition of second error data [Delta] C2 (DELTA H, DELTA alpha)] for all measurement points.

If it is determined in step S5 that the measurement has been completed for all the measurement points, the process proceeds to step S7 where the measurement is finished at all angles (r = 0, 90, 180 and 270) with respect to the placement head 23a Is determined. If the measurement has not been completed at all angles, the process proceeds to step S8. In step S6, the mounting head 23a is rotated by a predetermined angle (in this case, 90 degrees) (Returning to the step P ₁₁ ). Accordingly, steps S2 to S6 are executed for all angles (r = 0, 90, 180 and 270).

If it is determined in step S7 that the measurement is completed at all angles with respect to the placement head 23a, the process proceeds to step S9, and it is determined whether or not the measurement is completed for all the placement heads 23 (23a to 23f) . If the measurement has not been completed in all of the mounting heads 23 (23a to 23f), the process proceeds to step S10 and the corresponding offset interval (in this case, the mounting head 23b) In this case, the measurement in L2 is started. Thus, steps S2 to S8 are executed for all the mounting heads 23 (23a to 23f).

If it is determined in step S9 that the measurement has been completed for all the mounting heads 23 (23a to 23f), the process proceeds to step S11, and based on all the acquired second error data [? C2 (? H,?) The table 7b is created and the created second error table 7b is stored in the storage section 72 (correction data storage section 72b). As described above, control processing is performed when the second error table 7b is created.

Next, with reference to Figs. 2, 6, 8, and 10, the control processing flow of the arithmetic processing unit 71 when the electronic part 2 is mounted on the printed board 1 will be described. Descriptions of processes such as carry-in, carry-out and positioning of the printed board 1 are omitted.

First, as shown in Fig. 10, in step S21, on the basis of the control program (substrate production program) stored in the operation program storage section 72a (see Fig. 3), the electronic parts 2 to be adsorbed, 23 (23a to 23f), the component mounting position M and the mounting angle? Of the electronic component 2 are obtained.

In step S22, the electronic component 2 to be adsorbed is sucked and drawn by the predetermined mounting head 23. Further, the electronic part 2 is picked up by the part camera 60 (see Fig. 2), and the shift of the suction position of the electronic part 2 is obtained.

Subsequently, in step S23, the mounting position by the mounting head 23 is corrected based on the first error table 7a (see FIG. 6) and the second error table 7b (see FIG. 8). As described above, the first error data? C1 corresponding to the positional coordinate Ph obtained by subtracting the offset interval is obtained (or calculated by interpolation) from the first error table 7a. The second error data? C2 (? H,?) Corresponding to the component mounting position M and the mounting angle? Of the electronic component 2 are acquired (or interpolated) from the second error table 7b . A correction value for positioning the mounting head 23 at the component mounting position M is calculated from the first error data? C1 and the second error data? C2. When there is a positional deviation or an angular deviation at the time of picking up the electronic component 2 as a result of imaging of the electronic component 2 by the component camera 60, these correction amounts are also changed by? Of the second error data? C2 And the finally mounted mounting position is calculated.

Subsequently, in step S24, the head unit 20 is moved to the post-correction mounting position obtained in step S23. That is, the servo motor 32 (X-axis) and the servo motor 42 (Y-axis) are driven so that the encoder output value after correction is added to the encoder output values of the X and Y axes. Then, in step S25, after the servo motor 27 (R axis) is driven by the mounting head 23 at a rotational angle at which the correction amount corresponding to the second error data? Is added to the mounting angle? The component 2 (see Fig. 2) is mounted on the component mounting position M on the printed board 1 (see Fig. 2). Strictly speaking, as a result of adding the above amount of correction, the mounting position on the printed board 1 by the mounting head 23 (the mounting position of the mounting head 23 lowered to the printed board 1 to the printed board 1) ] Becomes the component mounting position M.

Then, in step S26, it is judged whether or not the component mounting data of unimplemented (unexecuted) remains in the substrate production program. If it is determined in step S26 that the mounting data remains (No determination), the process returns to step S21, and then the processes in steps S21 to S25 are repeated. If it is determined in step S26 that there is no mounting data (all mounted) (NO), the control is terminated.

In the first embodiment, as described above, the target location coordinates _{[P (P 11 ~P mn)} ] of a plurality of the first error data (ΔC1) of the board camera 22 to move the substrate camera 22 The first error table 7a is obtained for each of the position coordinates P _{11 to} P _mn and the position of the target position coordinate P in the target position coordinate P is calculated by moving the offset position between the substrate camera 22 and the mounting head 23 The second error data C2 (the positional deviation DELTA H in the horizontal direction and the positional deviation DELTA alpha in the rotational direction) of the mounting head 23 are acquired for each of the plurality of positional coordinates P _{11 to} P _mn , The table 7b is prepared and an arithmetic processing unit (not shown) for correcting the mounting position of the mounting head 23 at the time of movement to the component mounting position M based on the first error table 7a and the second error table 7b 71). Accordingly, the first error table (7a) and a plurality of position coordinates (P ₁₁ ~P _mn) second error data [ΔC2 (ΔH, Δα)] The components from the second error table (7b) made of a mounting position for each of the ( C corresponding to the position Ph shifted by the offset interval with respect to the component mounting position M and the second error data C2 (ΔH, Δα) corresponding to the component mounting position M, The mounting position of the mounting head 23 can be corrected by using the second error data [Delta] C2 ([Delta] H, [Delta] [alpha]). As a result, the distance (offset intervals L1 to L6) between the mounting head 23 and the board camera 22 in the head unit 20 and the electronic component 2 at a predetermined mounting angle the mounting position can be corrected while considering the rotation of the mounting head 23, so that the mounting position can be more accurately corrected.

In the first embodiment, the target position coordinates P (P) of the mounting head 23 at the position Ph at which the board camera 22 has been moved by the offset interval from the target position coordinates P (P _{11 to} P _mn ) (P ₁₁ ~P _mn)] when mounting the electronic component 2 and the positional deviation (ΔH) in the horizontal direction for, with the board camera 22 to the position (Ph) located in the given conditions in the head 23 to ? 2 (ΔH, Δα) due to the positional deviation Δα in the rotational direction of each of the plurality of position coordinates (P _{11 to} P _mn ) is generated to create the second error table 7b. The first error data? C1 when the substrate camera 22 is moved to the component mounting position M is obtained based on the component mounting position M and the first error table 7a, The displacement of the mounting head 23 in the horizontal direction when the mounting head 23 is moved to the component mounting position M is corrected based on the data? C1. The positional deviation ΔH in the horizontal direction of the mounting head 23 when the mounting head 23 is moved to the component mounting position M based on the component mounting position M and the second error table 7b, DELTA C2 (DELTA H, DELTA alpha)], which is composed of the position error DELTA C2 in the rotational direction and the positional deviation DELTA alpha in the rotational direction of the component mounting position M, based on the second error data DELTA C2 (DELTA H, DELTA alpha) The positional deviation DELTA H in the horizontal direction and the positional deviation DELTA alpha in the rotational direction are further corrected. The positional deviation DELTA H in the horizontal direction based on the horizontal inclination of the head unit 20 and the offset distance between the mounting head 23 and the board camera 22 in the head unit 20, The positional deviation DELTA alpha in the rotational direction can be corrected, so that the mounting position can be corrected more accurately.

In the first embodiment, a plurality of position coordinates (P _{11 to} P _mn ) and a plurality of rotation angles (r = 0 °, ? 2 (? H,?) For each of the first, second, third, fourth, fifth, Thereby, offset intervals between the mounting head 23 and the board camera 22 are individually set for each of the plurality of mounting heads 23, and an offset interval between the mounting head 23 and the board camera 22 It is possible to create the second error table 7b considering the rotation of the mounting head 23. Thus, the second error data [Delta] C2 ([Delta] H, [Delta] [alpha]) obtained by using the second error table 7b can be more appropriately corrected and the mounting positions for each mounting head 23 can be individually corrected more accurately can do.

In the first embodiment, the position of the jig component 110 picked up by the board camera 22 is acquired as the target position coordinate P, and the board camera 22 is moved from the target position coordinate P to the offset interval ( L1 to L6 of the jig component 110 are picked up by the component camera 60 so that the mounting head 23 And obtains the position error as the second error data? H. The pickup by the placement head 23 and the pickup by the component camera 60 are performed for each of a plurality of position coordinates P _{11 to} P _mn and a plurality of rotation angles (r = 0, 90, 180, 270) The calculation processing section 71 is configured to acquire the second error data? As the second error data by imaging and to generate the second error table 7b. Thereby, when the second error table 7b is created, the imaging of the jig component 110 by the substrate camera 22 and the imaging by the component camera 60 in the state in which the jig component 110 is adsorbed It is possible to easily obtain the second error data C2 (DELTA H, DELTA alpha) considering the movement of the offset interval and the rotation of the mounting head 23 only.

In general, the positional deviation of the mounted component is liable to occur when the mounting head 23 is detached from the electronic component 2 after mounting the component on the printed board 1. Therefore, when the jig component 110 mounted after jig component mounting, for example, is picked up by the board camera 22 at the time of preparation of the second error table 7b, The position of the jig component 110 tends to be displaced from the mounting of the jig component 110 until the image pickup is performed, and the accuracy of measurement of the second error data H is likely to be lowered. On the other hand, in the first embodiment, since the second error data [Delta] C2 ([Delta] H, [Delta] [alpha]) is obtained by picking up the jig component 110 by the component camera 60 in a state of being adsorbed, Is prevented. Therefore, in creating the second error table 7b, it is possible to obtain the second error data [Delta] C2 ([Delta] H, [Delta]) accurately.

In the first embodiment, the first error data? C1 corresponding to the position Ph shifted from the component mounting position M by the offset intervals L1 to L6 at the time of movement to the component mounting position M 1 from the error table 7a and acquires the second error data H corresponding to the position coordinates of the component mounting position M and the mounting angle? From the second error table 7b, The arithmetic processing unit 71 is configured to correct the mounting position of the mounting head 23 based on the first error data? C1 and the second error data? H and the offset distance between the mounting head 23. The first error data? C1 corresponding to the position coordinates Ph of the board camera 22 when the mounting head 23 is placed at the component mounting position M and the first error data? It is possible to perform the mounting position correction with high accuracy in consideration of the shift of the offset interval and the positional deviation due to the rotation to the mounting angle? On the basis of the second error data? H in the mounting angle?.

In the first embodiment, the arithmetic processing unit 71 is configured to create the first error table 7a prior to the creation of the second error table 7b. Then, the second error data [ΔC2 (ΔH, Δα)] obtained by a plurality of position coordinates for each target when the second error table to create a (7b) coordinate position _{[P (P 11 ~P mn)} ] and the first error table based on the (7a) and constitutes a target location coordinates _{[P (P 11 ~P mn)} ] by the calculation processing board camera 71 in the horizontal direction to correct the positional deviation at the time of movement (22). Thereby, when acquiring the second error data [Delta] C2 ([Delta] H, [Delta] [alpha]) for each of the plurality of position coordinates, the error corresponding to the first error data [Delta] C1 is not included by the correction using the first error table 7a The second error data [Delta] C2 ([Delta] H, [Delta] [alpha]) can be obtained at the correct position. As a result, the acquisition of the second error data [Delta] C2 ([Delta] H, [Delta] [alpha]) is facilitated, so that the second error table 7b can be easily created.

(Second Embodiment)

Next, a surface mounting machine according to a second embodiment of the present invention will be described with reference to Figs. 1, 3, 11, and 12. Fig. In the second embodiment, unlike the first embodiment in which the second error data H is obtained by picking up the jig component 110 picked up by the component camera 60, the mounted jig component 110 is mounted on the board camera The second error data? H is captured by the imaging unit 22 to capture the second error data? H.

The configuration of the surface seal organ 200 (see Fig. 1) according to the second embodiment is the same as that of the first embodiment, and thus the description thereof is omitted. The surface mount 200 is an example of the "electronic component mounting apparatus" of the present invention.

A method of creating the second error table 7b in the second embodiment will be described. The first error table 7a is prepared in advance in the same manner as in the first embodiment, and is stored in the storage section 72 (correction data storage section 72b). The second error data (H) at a rotation angle of 0 degrees at the first mounting head 23a (offset interval L1) will be described as an example.

First, the calculation processing unit 171. As shown in Fig. 11 (a) (see Fig. 3) is mounted at an offset distance (L1) position (Ph) is moved by from the board camera 22 to the target location coordinates (P ₁₁₎ The jig part 110 is mounted on the printed board 1 (or the jig plate) by the head 23a. At this time, the positional correction of the board camera 22 using the first error table 7a is not performed. Therefore, the image pickup center Ch of the board camera 22 is disposed at a position shifted from the position Ph. At this time, the position of the placement head (23a) (H ₁₁₎ [Part center (J)] is ΔCX (the displacement {first error data [ΔCh of the imaging center (Ch) for the position _{(Ph) 11 - L1, ΔCY} l1 (Corresponding to the second error data DELTA H) of the mounting head 23a in the position coordinates Ph shifted by the offset distance L1 and the positional deviation of the mounting head 23a And is disposed at a position shifted from the position coordinate P ₁₁ . The calculation processing section 171 is an example of the "control section" of the present invention.

Subsequently, the arithmetic processing unit 171 moves the substrate camera 22 to the target position coordinate P ₁₁ to pick up the jig component 110. At this time, the positional correction of the board camera 22 using the first error table 7a is not performed. Therefore, the image pickup center (C) of the target location coordinates (P ₁₁₎ in which the substrate camera 22 to move as shown in Fig. 11 (b) is arranged at a position deviated from the target position the coordinates (P _11). A positional deviation D1 between the center of the component J and the image pickup center C of the jig component 110 is obtained from the obtained captured image. Here, the target location coordinates (P ₁₁₎ and the image pickup center (C) the displacement (D2) is a first error data _{[ΔC1 (ΔCX 11, ΔCY 11} )] of the first error table (7a) between. Therefore, the position displacement (D3) between the target location coordinates (P ₁₁₎ and the center part (J) is obtained on the basis of the D1 and D2.

Here, the target location coordinates (P ₁₁₎ located to move by an offset distance (L1) from (Ph) and an imaging center of the displacement between the _{(Ch) [ΔCh (ΔCX 11} - L1, ΔCY 11)] is the first error table (Or can be calculated by an interpolation method). The imaging center Ch coincides with the position Ph and the position of the mounting head 23a at that time is determined as shown in Figure 11 (c) by adding the positional deviation (first error data) Hh as shown.

Where the spacing between (Hh) and the position (H ₁₁₎ is the displacement (ΔCh) position (Hh) on the basis of the position deviation (ΔCh) and the displacement (D3) as consistent and as shown in Figure 11 (d) and and it is possible to obtain the position gap (D4) between the target location coordinates (P _11). The positional deviation (D4) is a second error data _{[ΔH (ΔHX 11 (0)} , ΔHY 11 (0))] in the target location coordinates (P _11).

As is shown clearly from 11 (d), the first error data _{[ΔC1 (ΔCX 11-L1,} ΔCY 11)] by the [placement head (23a place the substrate camera 22 to the position (Ph) by using the ) (from Hh)], also the second error data [ΔH _{(ΔHX 11 (0)} in location correctly, ΔHY _{11 (0))]} the head (23a) mounted when correcting the position of the board camera 22 using the Can be placed at the component mounting position [M (P ₁₁ )].

The calculation processing unit 171 includes a plurality of target position coordinates using the method (P ₁₁ ~P _mn) and the placement head in each of the plurality of rotational angle (0 °, 90 °, 180 °, 270 °) [23 (23a~23f )] And the board camera 22 to perform imaging, thereby forming the second error table 7b.

Next, the control processing of the arithmetic processing unit 171 at the time of creating the second error table 7b by the surface mount organ 200 according to the second embodiment will be described with reference to Fig. As in the first embodiment, an example of obtaining the second error data? H in this order from the first mounting head 23a and in order from the rotation angle of 0 degrees will be described.

As shown in Fig. 12, first, to adsorb the jig part 110 to the head (23a) mounted in step S31, the offset of the substrate camera 22 from any of the target location coordinates (of the first point) (P ₁₁₎ The component is mounted at the position Ph shifted in the X direction by the interval L1. At this time, as described above, the positional correction of the board camera 22 using the first error table 7a is not performed. The center of the mounting head 23a and the jig component 110 coincide with each other and the rotational direction also becomes a predetermined angle when the jig component 110 is attracted to the mounting head 23a.

Then, the movement of the substrate camera 22 in the upper part of the first error table (7a) board camera 22 position correction target position coordinates (P ₁₁₎ is not performed in using in step S32 and, mounted at the step S31 And the jig component 110 is picked up by the board camera 22.

In step S33, the arithmetic processing unit 171 obtains the positional deviation D1 between the center of the component J and the center of gravity C of the jig component 110 and the angular variation? Of the jig component 110 from the captured image and the displacement (D1) and the first error table (7a) first error data _{[ΔC1 (ΔCX 11, ΔCY 11} ) and _{ΔCh (ΔCX 11 - L1, ΔCY} 11)] of the second error data {ΔC2 on the basis of the acquires _{[ΔH (ΔHX 11 (0)} , ΔHY 11 (0)), Δα 11 (0)]}.

When the second error data [Delta] C2 ([Delta] H, [Delta]) is acquired, the process proceeds to step S34 and it is determined whether or not the measurement has been completed for all measurement points (target position coordinates P _{11 to} P _mn ). If all of the measurements have not been completed, the flow proceeds to step S35. In step S35, the jig component 110 already mounted on the target position coordinate is picked up by the placement head 23a. At this time, in order to make the center of the mounting head 23a coincide with the jig part 110 in the state that the jig part 110 is attracted to the mounting head 23a and also to set the rotation direction to a predetermined angle, The position of the mounting head 23a (the position on each encoder on the X-axis and Y-axis) and the rotational angle of the mounting head 23a when the mounting head 110 is mounted on the target position coordinate, Axis servo motor, the Y-axis servo motor, and the R-axis servo motor of the mounting head 23a. After adsorption, the measuring point (P ₁₁₎ a predetermined small moving predetermined amount from the measuring point - in this case, for example, the target location coordinates (P _12)] to move the substrate camera 22 with respect to the X-direction by an offset distance (L1) And performs component mounting at the position Ph that is set (no correction by the first error table 7a). Steps S32 and S33 are then executed for the next measurement point. In this way, all the measurement points [target location coordinates (P ₁₁ ~P _mn)] second error data [ΔC2 (ΔH, Δα)] for is obtained.

The subsequent steps S36 to S40 are the same as the steps S7 to S11 of the first embodiment, and the description thereof will be omitted. As described above, control processing is performed when the second error table 7b according to the second embodiment is created.

In the second embodiment, as described above, the substrate camera 22 is moved by the mounting head 23 at a position shifted from the target position coordinates P (P _{11 to} P _mn ) by the offset intervals L1 to L6, The substrate camera 22 is moved to the target position coordinate P and the jig component 110 is imaged so that the component center of the jig component 110 with respect to the imaging center C J of the jig component 110 and obtains the second error data H based on the positional deviation D1 and obtains the second error data? The arithmetic processing unit 171 is constructed. The mounting by the mounting head 23 and the imaging by the substrate camera 22 are performed for each of a plurality of target position coordinates P _{11 to} P _mn and a plurality of rotation angles (0 °, 90 °, 180 °, and 270 °) Thereby constructing the arithmetic processing unit 171 to generate the second error table 7b. Thus, it is possible to easily obtain the second error data H considering the shift of the offset interval. Then, the second due to the mounting and rotating of a plurality of each rotation angle of the camera substrate 22, only readily target location coordinates (P ₁₁ ~P _mn) by repeating the image pick-up by each of the plurality of rotational angle The error table 7b can be created.

Other effects of the second embodiment are similar to those of the first embodiment.

(Third Embodiment)

Next, a surface mounting machine according to a third embodiment of the present invention will be described with reference to Figs. 1, 3, 13, and 14. Fig. In the third embodiment, the substrate camera 22 picks up the jig component 110 mounted with no correction by the first error table 7a, thereby obtaining the second error data [Delta] C2 (DELTA H, DELTA alpha) The second error data [Delta] C2 ([Delta] H, [Delta] [alpha]) is acquired by capturing the mounted jig component 110 by the board camera 22 by performing correction by the first error table 7a, Will be described.

The configuration of the surface seal organ 300 (see Fig. 1) according to the third embodiment is the same as that of the first embodiment, and the description is omitted. The surface mount 300 is an example of the "electronic component mounting apparatus" of the present invention.

A method of creating the second error table 7b in the third embodiment will be described.

First, FIG. 13 As shown in (a) calculation processing unit 271 (see Fig. 3) is mounted at an offset distance (L1) position (Ph) is moved by from the board camera 22 to the target location coordinates (P ₁₁₎ The jig part 110 is mounted on the printed board 1 (or the jig plate) by the head 23a. At this time, the calculation processing unit 271 first error table first error data _{[ΔCh (ΔCX 11 - L1,} ΔCY 11)] from (7a), the position coordinates of the obtained substrate camera 22 by (or calculated by interpolation) the . As a result, the image pickup center Ch is exactly coincident with the position Ph. At this time, the position {H ₁₁ (component center J)} of the mounting head 23a is the position error of the mounting head 23a at the position Ph after the shifting by the offset distance L1 by (ΔH)] it is disposed in shifted positions with respect to the target location coordinates (P _11). The arithmetic processing unit 271 is an example of the "control unit" of the present invention.

Subsequently, the arithmetic processing unit 271 moves the substrate camera 22 to the target position coordinate P ₁₁ to pick up the jig component 110. Even when the operation processing unit 271 performs the correction of the position coordinates of the first error by obtaining the substrate table, the first error data _{[ΔC1 (ΔCX 11, ΔCY 11} )] from (7a) camera 22. As a result, the imaging center C exactly coincides with the target position coordinate P ₁₁ as shown in Fig. 13 (b).

The arithmetic processing unit 271 then obtains the positional deviation D1 between the center of the component J and the center of gravity C of the jig component 110 from the captured image thus obtained as shown in Fig. 13C. Accordingly, the calculation processing unit 271 obtains a second error data _{[ΔH (ΔHX 11 (0)} , ΔHY 11 (0))] in the resulting positional displacement (D1) for the target location coordinates (P _11).

As is shown clearly from 13 (c), the first error data _{[ΔC1 (ΔCX 11-L1,} ΔCY 11)] placed the substrate camera 22 to the position (Ph) using the [placement head (23a ) position (H _11)] from, and the second error data [ΔH _{(ΔHX 11 (0)} a, ΔHY _{11 (0))]} substrate camera 22 when correcting the position with the head (23a) using the Can be accurately placed at the component mounting position [M (P ₁₁ )].

Then, the calculation processing unit 271 includes a plurality of target position coordinates using the method (P ₁₁ ~P _mn) and the placement head in each of the plurality of rotational angle (0 °, 90 °, 180 °, 270 °) [23 (23a 23f) and imaging by the board camera 22 to create the second error table 7b.

Next, the control processing of the arithmetic processing unit 271 when creating the second error table 7b by the surface mount organ 300 according to the third embodiment will be described with reference to Fig. In the same manner as the first embodiment, an example of obtaining the second error data? H in this order from the first mounting head 23a and sequentially from the rotational angle r = 0 will be described.

As shown in Fig. 14, first, in step S51 arithmetic processing unit 271 to adsorb the jig part 110 to the mounting head (23a), a substrate from a certain (the first point of) the target location coordinates (P ₁₁₎ The component placement is performed at the position Ph at which the camera 22 is moved in the X direction by the offset interval L1. At this time, by performing the positional correction of the board camera 22 using the first error table 7a, the component mounting is performed in a state where the image pickup center Ch of the board camera 22 is positioned at the position Ph.

Then, in step S52 arithmetic processing unit 271 is the image pickup center of the first error table (7a) board camera 22 performs the position correction, the substrate camera 22 to the target location coordinates (P ₁₁₎ of using a (C And the board camera 22 picks up the jig component 110 mounted in step S31.

In step S53, the arithmetic processing unit 271 obtains a positional deviation D1 between the center of the object J and the center of gravity C of the jig component 110 from the captured image, and based on the positional deviation D1, obtains the error data _{[ΔH (ΔHX 11 (0)} , ΔHY 11 (0))]. Further, the second error data [? (DELTA alpha _{11 (0} )] is acquired based on the change in angle of the jig component 110 from the captured image.

When the second error data [Delta] C2 ([Delta] H, [Delta]) is acquired, the process proceeds to step S54, and it is determined whether or not the measurement has been completed for all measurement points (target position coordinates P _{11 to} P _mn ). If all of the measurements have not been completed, the process proceeds to step S55. At step S55 the measurement points [target location coordinates (P _11)] a preset movement by a predetermined amount from the measuring point - in this case, for example, the target location coordinates (P _12)] to offset the board camera 22 with respect to the distance (L1) The component is mounted at the position Ph shifted in the X direction by the first error table 7a (correction is performed by the first error table 7a). Steps S52 and S53 are then executed for the next measurement point. Step S52~S55 are repeated whereby all the measurement points [target location coordinates (P ₁₁ ~P _mn)] second error data [ΔC2 (ΔH, Δα)] for is obtained.

The subsequent steps S56 to S60 are the same as the steps S36 to S40 of the second embodiment, and a description thereof will be omitted. As described above, control processing is performed when the second error table 7b according to the third embodiment is created.

In the third embodiment, similarly to the second embodiment, it is possible to easily obtain the second error data H considering the shift of the offset interval. Then, with the substrate camera 22 only readily target location coordinate by repeating the image pick-up operation by the (P ₁₁ ~P _mn), a plurality of rotational angle (0 ° in, 90 ° for each of the plurality of rotational angle, 180 And the second error table 7b resulting from the rotation of the first error table 7a, 270b, and 270c.

The other effects of the third embodiment are similar to those of the first embodiment.

Furthermore, the embodiments disclosed herein are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the appended claims rather than by the description of the embodiments, and includes all modifications within the meaning and range equivalent to the claims.

For example, in the first to third embodiments described above, an example in which the present invention is applied when a plurality of (six) mounting heads 23 are moved in a row in the X-axis direction However, the present invention is not limited to this. For example, the present invention may be applied when a rotary type head unit having a plurality of mounting heads 23 arranged in a toric shape on the lower surface side of the mounting head 23 is moved. In addition, in the rotary type head unit, the mounting heads 23 arranged in a torus shape are circularly moved in the horizontal direction on the lower surface side of the head unit, and the working positions of the respective mounting heads 23 are changed. In this case, the second error table may be created in consideration of the offset distance between the board camera 22 and the individual mounting heads 23 and the rotational angle of the mounting head.

In the first to third embodiments, the example in which six mounting heads are provided in the head unit is shown, but the present invention is not limited to this. The number of mounting heads may be any number.

In the first to third embodiments, the substrate camera 22 captures, for example, six reference marks 50a to 50f, which are at least two positions provided on the base 5, The first error table 7a may be created by using a glass jig plate 105 as shown in Fig.

A plurality of (m x n) reference marks R (R ₁₁ to R _mn ) attached in the form of a matrix of m rows and n columns in a direction orthogonal to each other (X axis and Y axis direction) )] Is printed. First, instead of the printed board 1, the jig plate 105 is mounted on the conveyor unit 11 and fixed at a predetermined position. Then, the head unit 20 is moved and the board camera 22 (see FIG. 2) So that the individual reference marks R (R ₁₁ to R _mn ) are sequentially picked up.

And obtains the shift amount from the reference mark R picked up from the obtained image. The imaging center C of the board camera 22 is moved to a reference mark (not shown) on the control program by driving the supporting unit 30 (X axis) and the moving mechanism unit 40 (Y axis) P ₁₁ (X ₁₁ , Y ₁₁ )] of the coordinate system R ₁₁ . At this time, the shift amount of the image pickup center C of the board camera 22 with respect to the coordinates [P ₁₁ (X ₁₁ , Y ₁₁ )] of the reference mark R ₁₁ is the shift amount of the image pickup center C in the picked- it is obtained as the distance (ΔCX _11, ΔCY ₁₁₎ between (R _11). Thus, the first error data (ΔC1) at the target location coordinates (P ₁₁₎ [the coordinates of the first reference mark (R ₁₁₎ a - is obtained. The first error data _{[ΔC1 (ΔCX 11, ΔCY 11} )] the target encoder output board camera 22 by tinge to {coordinates on a control program _{[P 11 (X 11, Y} 11)] the encoder output corresponding to a} Can be accurately moved to the coordinates [P ₁₁ (X ₁₁ , Y ₁₁ )].

The calculation of the first error data (correction amount) is performed for the plurality of (m x n) reference marks R (R ₁₁ to R _mn ) attached in a lattice pattern. Thus, as shown in Fig. 6, a first error table 7a in the form of a matrix of m rows and n columns composed of m 占 n first error data? C1 is created. For the position coordinates between the reference marks R ₁₁ to R _mn , the correction amount is calculated from the first error data (? C1) corresponding to several reference marks (R) adjacent to the position coordinates using a known interpolation method Can be calculated. Thus, it is possible to precisely position the substrate camera 22 at arbitrary position coordinates.

As a modification of the first to third embodiments, a glass jig plate 105 is used, and the first error data (? C1) at the measurement point (target coordinate position) of the grid of m rows and n columns and the second error data The first error table and the second error table are obtained by acquiring the error data [Delta] C2 ([Delta] H, [Delta] [alpha]), but the present invention is not limited to this. In the present invention, for example, only the error data for each axis for the X and Y axes may be acquired. That is, with respect to the X-axis 5 (7) 1 line 5 (Fig. 7) acquires the error data of only the measurement point, and for the Y-axis of the (P ₁₁ ~P _1n) of the first column of the ₍₁₁ P _m1 ~P The error data may be obtained only at the measurement point of the measurement point. At this time, the error table is a table including n pieces of error data of 1 row and n columns with respect to the X axis and m pieces of error data of m rows and 1 column with respect to the Y axis. In this case as well, it is possible to acquire the correction value of arbitrary position coordinates by combining the error data with respect to the X-axis coordinate and the error data with respect to the Y-axis coordinate, and the number of measurement points of error data can be reduced, And the processing time of the second error table can be shortened and the data amount of the error table can be reduced.

In addition, ΔH in the first error data (ΔC1) and the second error data (ΔC2) are obtained at the measurement point (target coordinate position) of the grid shape of m rows and n columns. From these error data, the X axis Error data) and the Y-axis (m number of m number of error data). In this case, for example, the average value of the m measurement points (P _{11 to} P _m1 ) in the first row is taken as the first-column error data on the X axis, and the error of the n columns (n) Create the data. Likewise, on the Y axis, m rows (m pieces) of error data are generated by an average value for each row. The error table is a table that includes n error data of one row and n columns with respect to the X axis and m error data of m rows and one column of the Y axis. In this case, since each error data included in the error table can be an average value of a plurality of measurements, it is possible to improve the accuracy of the error data compared with the case of performing only the measurement of only two axes.

In the first to third embodiments, the measurement points of the grid shape at the time of creating the second error table have been described as m rows and n columns, but the present invention is not limited to this. The number of measurement points may be a sufficient number of measurement points for calculating correction values of arbitrary position coordinates on the printed board.

In the first to third embodiments, the second error data (? H) is obtained at four angles (r = 0, 90, 180, 270) An example of creating the error table 7b has been shown, but the present invention is not limited to this. In the present invention, the second error table may be formed at a plurality of angles other than four angles, such as two angles (0 DEG, 180 DEG) and three angles (0 DEG, 120 DEG, 240 DEG).

In the first to third embodiments, the apparatus for moving the head unit 20 in the X-axis direction and the Y-axis direction and moving the mounting head 23 in the Z-axis direction includes a ball screw shaft, a ball nut, A servo motor for rotationally driving the screw shaft, and a drive device including an encoder for detecting the amount of rotation of the motor. However, a linear motor may be used instead of each of the driving devices of this type. In the case of a linear motor, the position of the mover is detected in the same manner as in the encoder by reading the position on the linear scale provided on the stator side by the position sensor provided on the mover side. In the case of a linear motor, the elongation of the stator and the bending of the rail for guiding the mover are generated, the head unit to which the mover is attached deviates in the horizontal direction, and the inclination is generated in the head unit. The electronic part 2 can be mounted on the board in a correct predetermined mounting position, which is a proper predetermined horizontal direction position and a correct predetermined mounting direction by using the table.

In the first to third embodiments described above, a plurality of mounting heads 23 are provided in the head unit 20. However, when the oscillation rotation of the rotational center shaft of the mounting head 23 can be almost neglected A first error table corresponding to one or a plurality of mounting heads when one or a plurality of mounting heads are installed and which is obtained by picking up a plurality of target position coordinates by the board camera 22, Which is obtained by picking up the component mounted or attracted only at the angle of 0 ° of the head 23 regardless of whether or not there is an inclination with respect to the Z axis of the rotation center axis of the mounting head 23, In mounting the corresponding mounting head from the error table to the predetermined target mounting position at the predetermined target component angle, the first error data (? C1) corresponding to the predetermined target mounting position Even if the mounting position (component center position) is corrected corresponding to one or a plurality of mounting heads based on the first error data? C1 and the second error data? H good. This makes it possible to eliminate the positional deviation caused by the inclination of at least the head unit 20 including the positional deviation in the horizontal direction due to the inclination of the rotational center axis of the mounting head with respect to the Z axis. Particularly, when the offset distance between the board camera and the mounting head is large, the displacement of the electronic component in the horizontal direction with respect to the target mounting position due to the inclination of the head unit in the horizontal direction becomes large. At least the positional deviation in the horizontal direction should be corrected for the electronic component. Further, when the oscillation rotation of the rotation center shaft of the mounting head 23 can be almost neglected, the second error data H corresponding to the predetermined target mounting position is not changed irrespective of the angle of the mounting head 23.

Similarly, in the case where the oscillation rotation of the rotation center shaft of the mounting head 23 can be almost neglected, and one or a plurality of mounting heads are provided in the head unit 20, The first error data? C1 and the component mounted or attracted only at the angle 0 of the mounting head 23 at a plurality of position coordinates are correlated with the inclination of the Z axis of the rotation center axis of the mounting head 23 And corrects the position of the center of gravity of the component based on the first error data (DELTA C1) and the second error data (DELTA alpha) corresponding to one or a plurality of mounting heads, The rotational angle of the mounting head 23 at the time of mounting may be corrected. This makes it possible to eliminate the positional deviation of the mounting angle with respect to the target mounting angle of the electronic component 2 due to the inclination of the head unit 20 at least.

It is also possible to obtain second error data? H at a plurality of angles of the mounting head 23 at a plurality of position coordinates to create a second error table to correspond to one or a plurality of mounting heads, On the basis of the first error data (? C1) obtained from the first error table based on the position of the target component (23) and the rotational angle of the mounting head (23) at the time of mounting, The positional deviation of the mounting head 23 in the horizontal direction at the time of mounting may be corrected on the basis of the second error data? H obtained from the error table. In addition to the inclination of the head unit 20, the electronic component 2 (refer to FIG. 2) caused by the oscillation rotation of the rotational center axis of the mounting head 23, which occurs irrespective of the inclination of the rotational center axis of the mounting head 23 with respect to the Z- In the horizontal direction can be eliminated.

Further, the second error table is created by obtaining the second error data DELTA alpha at a plurality of angles of the placement head 23 at a plurality of position coordinates, corresponding to one or a plurality of placement heads, On the basis of the first error data (? C1) obtained from the first error table based on the position of the target component (23) and the rotational angle of the mounting head (23) at the time of mounting, The rotational angle of the mounting head 23 at the time of mounting may be corrected on the basis of the second error data DELTA alpha obtained from the error table. This results in an inclination of the center axis of rotation of the mounting head 23 relative to the Z axis and a vibration rotation of the center axis of rotation of the mounting head 23 in addition to the inclination of the head unit 20, The positional deviation of the mounting angle with respect to the target mounting angle of the electronic component 2 generated based on the rotation angle of the electronic component 2 can be eliminated.

Claims (10)

A head unit including a first imaging unit and a mounting head spaced apart from the first imaging unit by a predetermined offset distance;
And a control unit for moving the head unit in a horizontal plane and rotating the mounting head to move the mounting head to a component mounting position,
Wherein,
A first error data group is obtained by acquiring first error data by a position shift of the first image pickup unit for each of a plurality of position coordinates when the first image pickup unit is moved with the target position coordinates,
A positional shift in the horizontal direction with respect to the target position coordinate of the mounting head when the first imaging section is moved by the offset distance between the first imaging section and the mounting head from the target position coordinate, A second error data group is obtained by acquiring second error data for at least one of the positional deviations in the rotational direction when the electronic component is mounted for each of a plurality of position coordinates,
Corrects positional shifts in the horizontal direction when the mounting head is moved to the mounting target position coordinates based on the mounting target position coordinates and the first error data group,
At least one of a positional deviation in the horizontal direction and a positional deviation in the rotational direction of the mounting head when the mounting head is moved to the mounting target position coordinates based on the mounting target position coordinates and the second error data group The electronic component mounting apparatus further comprises: The method according to claim 1,
The second error data includes a positional deviation in the horizontal direction with respect to the target position coordinate of the mounting head when the first imaging unit is moved by the offset distance between the first imaging unit and the mounting head from the target position coordinate, At least one of the positional shifts in the rotational direction when the electronic component is mounted on the substrate in the target direction position by the placement head on the substrate at the position where the first imaging unit has been moved by the offset distance from the target position coordinate Including,
Wherein,
The first error data when the first imaging unit is moved to the mounting target position coordinates based on the mounting target position coordinates and the first error data group is obtained and based on the first error data, Corrects the positional deviation in the horizontal direction when the mounting head is moved to the mounting position,
The second error data at the time of moving the placement head to the placement target position coordinates based on the placement target position coordinates and the second error data group is obtained and based on the second error data, Further corrects at least one of a positional deviation in the horizontal direction and a positional deviation in the rotational direction when the mounting head is moved to the mounting position of the electronic component mounting apparatus. The method according to claim 1,
The control unit is configured to acquire the second error data for each of a plurality of position coordinates and a plurality of rotation angles to generate the second error data group,
Wherein the control unit moves the mounting head to the mounting target position coordinates and sets the second error data when the mounting head is set to a predetermined rotation angle to the mounting target position coordinates, And corrects the positional deviation when the mounting head is moved at the predetermined rotational angle with the mounting target position coordinate based on the obtained second error data. Electronic component mounting apparatus. The method according to claim 1,
Wherein the head unit includes a plurality of mounting heads having different offset intervals with respect to the first imaging unit,
Wherein the control unit is configured to generate the second error data group for each of the plurality of mounting heads. The method according to claim 1,
Further comprising: a second image sensing unit for sensing an electronic component that is attracted to the mounting head,
Wherein,
Acquires, as the target position coordinates, the position of the jig component picked up by the first image pickup section,
And the second imaging unit picks up the jig component that is attracted to the placement head at a position where the first imaging unit is moved by the offset distance from the target position coordinate by the second imaging unit, The position error of at least one of a positional deviation in the horizontal direction and a positional deviation in the rotational direction of the mounting head is recognized and acquired as the second error data,
The control unit is configured to generate the second error data group by performing the pickup of the jig component by the placement head and the pickup of the jig component by the second imaging unit for each of a plurality of position coordinates And an electronic component mounting apparatus. 6. The method of claim 5,
The control unit is configured to acquire the second error data for each of a plurality of position coordinates and a plurality of rotation angles to generate the second error data group,
Wherein the control unit moves the mounting head to the mounting target position coordinates and sets the second error data when the mounting head is set to a predetermined rotation angle to the mounting target position coordinates, And corrects the positional deviation when the mounting head is moved at the predetermined rotational angle with the mounting target position coordinate based on the obtained second error data. Electronic component mounting apparatus. The method according to claim 1,
The control unit moves the first imaging unit to the target position coordinate after mounting the electronic part or the jig part on the substrate by the placement head at a position where the first imaging unit is moved by the offset distance from the target position coordinate, The positional shift of at least one of the positional deviation of the center position of the electronic component or the jig component in the horizontal direction and the positional deviation of the mounting head in the rotational direction with respect to the imaging center is recognized by imaging the electronic component or the jig component, And to obtain second error data based on the positional deviation,
Wherein the control unit is configured to create the second error data group by performing mounting by the mounting head and imaging by the first imaging unit for each of a plurality of position coordinates. 8. The method of claim 7,
The control unit is configured to acquire the second error data for each of a plurality of position coordinates and a plurality of rotation angles to generate the second error data group,
Wherein the control unit moves the mounting head to the mounting target position coordinates and sets the second error data when the mounting head is set to a predetermined rotation angle to the mounting target position coordinates, And corrects the positional deviation when the mounting head is moved at the predetermined rotational angle with the mounting target position coordinate based on the obtained second error data. Electronic component mounting apparatus. The method according to claim 1,
The control unit is configured to generate the first error data group prior to the generation of the second error data group,
Wherein the control unit acquires the second error data for each of the plurality of position coordinates and generates the second error data group when the first imaging unit is moved to the target position coordinate based on the target position coordinates and the first error data group And corrects the positional deviation in the horizontal direction. And a head unit including a pickup head and a mounting head spaced apart from each other by a predetermined offset distance from the imaging section, wherein the head unit is moved in a horizontal plane, and the mounting head is rotated so that the mounting head The mounting position correction data creating method of the electronic component mounting apparatus for moving the mounting position correction data to the mounting position,
A step of obtaining a first error data group by obtaining a first error data by a positional deviation of the imaging unit when the imaging unit is moved to a target position coordinate for each of a plurality of position coordinates,
A positional shift in the horizontal direction with respect to the target position coordinate of the mounting head when the imaging section is moved by an offset distance between the imaging section and the mounting head from the target position coordinate, A step of obtaining a second error data group by acquiring for each of a plurality of position coordinates second error data by at least one of positional shifts in the rotational direction at the time of mounting,
Based on the first error data group and the second error data group, mounting position correction data of the mounting head at the time of moving to the component mounting position .

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