JP2585918Y2 - Electronic component automatic mounting device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a plurality of component supply devices in which a mounting head disposed at a predetermined interval around the periphery of a rotary table that rotates intermittently is disposed on a supply table at a predetermined take-out position. The desired component supply device is moved to the take-out stop position by the movement of the supply table, sucks the supplied electronic component, and mounts the component on the printed board at the mounting stop position by intermittent rotation of the rotary table. The present invention relates to a device for automatically mounting electronic components.

[0002]

2. Description of the Related Art In an electronic component automatic mounting apparatus of this type, as disclosed in Japanese Patent Application Laid-Open No. 3-52299, a component supply apparatus provided on the supply table by moving a component supply table by a suction nozzle is disclosed. Take out the chip component from the desired component supply device, recognize the component misalignment by the recognition device, rotate the nozzle by the nozzle rotation positioning device based on the recognition result, perform angular positioning, and then mount it on the printed circuit board. Thus, there is only one suction station which is the stop position of the rotary table where the suction nozzle can suction. In such an electronic component automatic mounting apparatus, the moving speed of the supply table is lower than the speed of the intermittent rotation of the rotary table, and when the intermittent rotation is performed at the highest speed, the component suction by one head is completed. Even if the next head moves to the component suction stop position, the supply table is in a state where one of the component supply devices, that is, the next supply device can be moved to the suction position or not, so that the component mounting can be speeded up. The movement of the supply table was an obstacle.

[0003]

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a high-speed picking-up of electronic components in a case where a supply table is moved from a component supply device provided on the supply table to pick up electronic components. And

[0004]

SUMMARY OF THE INVENTION For this reason, the present invention is directed to a plurality of mounting heads which are arranged at a predetermined interval around the periphery of a rotary table which rotates intermittently and which is arranged on a supply table at a predetermined take-out position. The desired component supply device among the component supply devices moves to the take-out stop position by the movement of the supply table, sucks the supplied electronic component, and intermittently rotates the rotary table to the printed board at the mounting stop position. In the electronic component automatic mounting apparatus for mounting the component, the mounting head enables the mounting head to pick up electronic components at the plurality of stop positions of the intermittent rotation of the rotary table on the same supply table. It is determined which of the above-mentioned stop positions for picking up a component is to pick up a component based on data designating a component supply device that supplies the component for each component mounting order. It is provided with a control means for controlling so as to perform the component adsorbed on the mounting head stop position.

[0005]

According to the above construction, when the rotary table is stopped, the mounting head which is closer to the desired component supply device among the mounting heads at the plurality of unloading stop positions reaches the stop position of the head by the movement of the supply table. The supplied electronic component is taken out, and the component is mounted on a printed circuit board.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings. In FIGS. 1, 2 and 3, (1) is a Y table that moves in the Y direction by rotation of a Y-axis motor (2), and (3) is a Y table that is rotated by an X-axis motor (4). Moving in the X direction on the Y table (1) results in XY
An XY table that moves in the direction, on which a printed circuit board (6) on which a chip-shaped electronic component (5) (hereinafter, referred to as a chip component or a component) is mounted is fixed and mounted on fixing means (not shown).

[0007] (7) is a supply table, chip parts (5)
A large number of component supply devices (8) for supplying the components are provided. In this embodiment, it is assumed that the component supply devices (8) have the same width in the arrangement direction and are disposed at equal intervals.
(9) is a supply stand drive motor, and a ball screw (10)
By rotating the nut, the ball screw (10) is fitted through a nut (11) fixed to the supply table (7).
The supply table (7) is guided by the linear guide (12) and moves in the X direction. (13) is a rotary table which rotates intermittently. At the outer edge of the table (13), mounting heads (15) having six suction nozzles (14) are arranged at regular intervals according to the intermittent pitch. I have.

Due to the intermittent rotation of the rotary table (13), the suction nozzle (14) is supplied from the supply device (8) to the component (5).
1 and 3, there are two stop positions for the mounting head (15) that sucks and takes out the sucking station (I) and the sucking station (I) and the sucking station ( II). In the state where the mounting head (15) is stopped at the two suction stations, as shown in FIG. 3, the suction nozzle (14) moves the supply table (7) and the component supply device (8) causes the tape (not shown) to move. Feeding electronic parts (5)
To be releasably supplied,
The suction nozzles (14) of both suction stations can simultaneously pick up the component (4). The suction nozzle (14) is positioned at the 3 o'clock position of the clock hand (the position indicated by the solid line) with respect to the mounting head (15) in FIG. .
At the suction stations (I) and (II), the mounting head (1
The lowering of 5) causes the suction nozzle (14) to suction the component (5).

(III) is a component presence / absence detection station for detecting whether or not the suction nozzle (14) sucks and holds the electronic component. The component presence / absence detection device (17) detects the holding of the component (5). The presence or absence is detected. The detection device (1
7) The presence / absence detection is performed based on the light-transmitting / shielding state of the light emitting / receiving sensor (not shown). (IV) is a recognition station where the mounting head (15) sucking the component (5) stops due to the intermittent rotation of the rotary table (13), and the component (5) for the suction nozzle (14) by the component recognition device (18).
Is recognized.

(V) and (VI) are two mounting stations (2) at which the mounting head (15) stops to mount the component (5) held by the suction nozzle (14) on the printed circuit board (6). The part (5) is mounted on the printed circuit board (6) which is stopped at a predetermined position by the movement of the XY table (3) due to the lowering of the mounting head (15). You.

In (VII), as described above, the suction nozzle (14) to be used for suction is positioned at the 3 o'clock position of the mounting head (15), and the suction nozzle (14) is selected. ) Is a nozzle selection station for projecting from the head by a projection mechanism (not shown). The mounting head (15) holds the rotary table (13) inside and outside.
Head elevating shaft (1)
9) attached to the lower part of the shaft (19)
The upper part is fixed to an L-shaped roller mount (20). An upper cam follower (21) and a lower cam follower (2) projecting inward from the upper part of the roller mounting body (20).
2) is pivotably supported.

A support 23 shown in FIG. 2 supports the rotary table 13 so as to be rotatable downward in the horizontal direction. A cylindrical cam (2) is provided around the support 23.
4) is formed. The cylindrical cam (24) is sandwiched between the upper cam follower (20) and the lower cam follower (21) by a spring (not shown), and the head (15) is supported by the cam (24) while the rotary table (1) is held.
It moves by the rotation of 3).

In each of the suction stations (I) and (II) and each of the mounting stations (V) and (VI), the cam (24) is cut out, and the suction station (I) is cut. In (2), the rotation of a cam (26) rotated by an index motor (58), which will be described later, swings a lever (28) with a cam follower (27) engaged with the cam (26). Cylindrical cam (2
4) The rod (30) attached to the upper part of the vertical moving body (29) that supports the cam followers (21) and (22) disposed in the cutout portion is moved up and down to move the mounting head (15). Is vertically movable for picking up parts. In the raised position, the vertical moving body (29) moves from the cylindrical cam (24) to the cam follower (21) (22) as shown in FIG.
Is at a height where you can transfer. Reference numeral (31) denotes a solenoid for a suction clutch, and an engagement lever (32) attached to a rod of the solenoid (31) is operated by the solenoid (3).
The rod is retracted by the excitation of 1) and the lever (3
When (2) swings clockwise in FIG. 2, the lever (32) releases the locking of the lever (28), and the mounting head (15) is placed in a state capable of moving up and down. When the solenoid (31) is demagnetized and its rod is projected, the lever (32) swings counterclockwise in FIG. 2 to hold the lever (28) with the mounting head (15) raised. A mechanism is formed.

At the back side of the drawing sheet of FIG. 2, the vertical movement mechanism of the mounting head (15) and the suction solenoid (59) to be described later are the same for the suction station (II) as for the suction station (I). The cam of the suction station (II) is also rotated by an index motor (58) coaxially with the cam (26), and the cam has the same shape as the cam (26). (31) (5
When both 9) are excited to release the lever (28) and the lever corresponding to the lever (28), the mounting head (15) is simultaneously lowered at both stations.

Numeral (34) is an up-down moving body provided at a position where the cylindrical cam (24) is cut out at the mounting station (VI) so as to be able to move up and down, similarly to the case of the suction station. The mounting head (15) is supported and moved up and down by a cam (35) via a cam follower (36), a lever (37) and a rod (38). The cam (35) also rotates by the rotation of the index motor (58). The mounting clutch solenoid (39) and lever (40) form a clutch mechanism as in the case of the suction station. Further, a similar vertical movement mechanism of the mounting head (15) and its clutch mechanism are formed at the mounting station (V) on the back side of the paper surface of FIG.

(43) The chip component (5) which is built in the mounting head (15) and is rotated around the substantially center of the head (15) by rotating the suction nozzle (14). Angular positioning and suction nozzle (1
4) a drive power supply cord for transmitting a current from a drive circuit (57) to be described later for driving a pulse motor (44) for changing a position with respect to the mounting head (15) and selecting a nozzle. It is connected to the mounting head (15). A vacuum tube (45) communicates with a vacuum source (not shown) for sucking the chip component (5) from the suction nozzle (14).

In FIG. 2, reference numeral (49) denotes an elevating lever which moves up and down to swing the swing lever (50) of the component supply device (8). The tape (not shown) wound in the reel is fed, and the chip component (5) stored in the tape is supplied to the suction position of the nozzle (14). The lifting lever (49) is a component supply device (8) for supplying the component (5) to the mounting head (15) stopped at the suction station (I).
Of the mounting head (15) which is provided at a position where the swing lever (50) can be swung, and also stops at the position of the suction station (II) on the back side of the paper surface of FIG. Component supply device (8) taken out by suction nozzle (14)
Lifting levers for swinging the swinging levers (50) are also provided, and these lifting levers are also used when the component (5) is not taken out, that is, when the mounting head (15) is not lowered. There is provided a clutch mechanism (not shown) for preventing the tape from being fed in order to supply the tape.

In FIG. 4, (53) is a CPU,
RAM according to a program stored in ROM (54)
Various operations related to component mounting are controlled based on the data stored in (55). A recognition device (18), a driving circuit (57), and the like are connected to the CPU (53) via an interface (56). The drive circuit (57) includes an index motor (58) that rotates to intermittently rotate the rotary table (13) via an index unit (not shown), the supply table drive motor (9), X
Axis motor (4), Y axis motor (2), each head (15)
Pulse motor (31), suction clutch solenoids (31) and (59) and mounting clutch solenoid (3
9) (60) are connected. The mounting clutch solenoid (60) is a solenoid used for the clutch mechanism of the mounting station (V).

The RAM (55) stores NC data as shown in FIGS. The NC data is stored in the RAM (55) for each type of the printed circuit board (6), but includes a reel number, X data (a column labeled "X"), Stored are Y data (a column labeled “Y”) and θ data (a column labeled “θ”). The reel number is a number indicating the arrangement position of the component supply device (8) on the supply table (7). In the case of the present embodiment, the arrangement position of the component supply device (8) on the left end of FIG. The numbers are 2, 3 ... to the left. The X data and the Y data represent the XY position coordinates where the chip component (5) on the printed circuit board (6) is to be mounted.
The data indicates the θ direction in which the chip component (5) is to be mounted, that is, the amount of angle by which the sucked chip component (5) should be rotated. “E” in the column “C” indicates that component mounting per printed circuit board (6) is completed in this step.

The operation of the above configuration will be described below. First, when a start key (not shown) of the automatic operation is pressed, the automatic operation is started, and the printed circuit board (6) is XY-texted.
When the printed board (6) is placed and fixed on the cable (3), the mounting operation of the component (5) is started according to the steps of the NC data (FIG. 5) of the board (6).

That is, the reel number 1 in step 1 is read out, and the motor (9) is rotated so that the component supply device (8) of the reel number stops at the component take-out position of the suction station (II), and the supply table is rotated. (7) is moved. First, it is determined which of the pick-up stations to take out the component supply device (8) designated by the NC data at the component pick-up position, by determining whether the reel number for picking up the subsequent component becomes larger or smaller. If the reel number of the next step number is larger than the reel number of the next step number, the reel number of the next step number 2 is larger than the reel number of the first step number. If it is larger, such determination may be made. Next, by rotating the rotary table (13), a nozzle (14) suitable for the component type of the component supply device (8) is selected by the rotation of the pulse motor (31), and is projected by a projection mechanism (not shown). When the mounting head (15) reaches the suction station (II), the suction solenoid (3) is used.
9) is a state in which the mounting head (15) is prevented from descending while the rod is protruded while being demagnetized, and the suction solenoid (59) is excited to draw the rod and lock the lever (32). When released, the mounting head (15) is lowered by the rotation of the index motor (58) and the vertical moving body (not shown) is lowered by the driving of a cam (not shown), and the component supply device (8) is lowered by the lifting lever (not shown). The chip component (5) sent to the component supply position of the component supply device (8) by the swing of the swing lever (50) due to
Is sucked by the suction nozzle (14).

Next, due to the intermittent rotation of the rotary table (13), the head (15) moves to the component presence / absence detection station (III), and the component presence / absence detection device (17) detects the presence / absence of a component. It is assumed that the presence of a result part has been detected. Next, when the head (15) moves by the intermittent rotation of the rotary table (13) and reaches the recognition station, the component recognition device (18) recognizes the component (5) sucked by the suction nozzle (14). Do.

Next, the head (15) is moved from the recognition station by the rotation of the rotary table (13), but the CPU (53) may find that the angular deviation is Δθ according to the recognition result of the recognition device (16). If recognized, NC
A command is issued to the drive circuit (57) so as to rotate the rotor (32) by an angle “90−Δθ” in which the positional deviation is added to 90 degrees of the θ data of the data, and the drive circuit (57) sends the angle to the angle. A corresponding pulse current is output to the motor (31). As a result, the rotor (32) of the motor (31) rotates by the angle “90−Δθ”, the suction nozzle (14) rotates by the rotation amount of the rotor (32), and is adjusted to an angular position of 90 degrees.

Next, when the mounting head (15) reaches the mounting station (V), the mounting solenoid (60) is excited and the mounting head (15) can be lowered, so that the solenoid (39) is in the state where it can be lowered. With the rod protruding, the mounting head (15) is prevented from lowering at the mounting station (VI), and the cam is rotated to mount the mounting station (V) in the same manner as the suction station. Head (1
5) is lowered, and is mounted at a coordinate angle of (X1, Y1) on the printed circuit board (6) at a mounting angle of 90 degrees. The XY table (3) is an X-axis motor (4) to be mounted at the position.
The rotation of the Y-axis motor (2) and the recognition device (1)
In the recognition result of 6), the suction nozzle (14) indicates “90−Δθ”.
The moving amount is corrected by correcting the displacement caused by the rotation.

Next, for the chip part (5) in step 2 of the NC data in FIG. 5, the rotary table (13) is intermittently picked up in step 1 after the pick-up of the part in step 1 is performed in the suction station (II). The suction station (I
The mounting head (15) moved to (I) is lowered, and the supply table (7) moves to the left in FIG. 1 by one component supply device (8) (hereinafter referred to as one pitch). (I
The component supply device (8) of the reel number 2 is located at I), and components are taken out from the supply device (8). Thereafter, the presence / absence detection, component recognition and angle positioning of the component are performed in the same manner, and the mounting of the component (5) is performed at the mounting station (V).

In this way, the reel number is incremented by one until step 6, so that the moving amount of the supply table (7) is closer to the component pick-up position of the suction station (II). -The component supply device (8) specified in the station (II) moves so as to stop, and the component (5) is sucked in the station (II). Next, in step 7, the reel number becomes 1, and in step 6, as shown in FIG. 3, the supply table (7) for one pitch of the component supply device (8) moves rightward from the component pick-up position of the suction station (I). Since it is only necessary to move (the CPU (53) determines which of the take-out positions is closer by calculation by comparison.
If they are the same, take the next step closer. ), The supply table (7) is moved one pitch to the right so that the component supply device (8) of reel number 1 is located at the component removal position of the suction station (I). At this time, the index motor (58) is set so that the rotary table (13) stops.
Is stopped, and at the time of step 6, the suction station (I) is stopped.
The mounting head (15), which has been stopped at the time, performs the component removal of Step 7 as it is. At this time, the rotary table (13) may be intermittently rotated without stopping the index motor (58) due to other factors, and may be taken out by the next head (15).

Next, in step 8, the reel number is 2, and the picking-up is performed at the suction station (I). Next, since the reel number is 7 in step 9 and the state of step 8 is as shown in FIG. 3, it is closer to take out at the suction station (II), so that the supply table (7) moves one pitch to the left. The rotary table (13) performs intermittent rotation twice, and the mounting head (15) stopped at the nozzle selection station (VII) at the time of step 7
Is moved to the suction station (II), and the head (1) is moved.
In 5), the chip component (5) is taken out. In this case, it appears that waste is caused by performing the intermittent rotation twice, but the maximum movement speed of one pitch of the supply table (7) is 0.15 seconds and the maximum of one intermittent rotation of the rotary table (13) is obtained. Assuming that the speed is also 0.15 seconds, when only one suction station is provided, the supply table (7) must move 6 pitches from reel numbers 2 to 7 but 6
The time required for the pitch movement is 0.9 seconds, whereas when two suction stations are provided as in the present embodiment, the time required for two intermittent rotations is 0.3 seconds, and the supply table needs a long distance. It can be seen that even if (7) can be moved a little earlier, the time will be shorter if two suction stations are provided. During the first intermittent rotation of the two intermittent rotations, the lifting lever (49) and the other lifting lever are locked by a clutch mechanism (not shown) so as not to lower, and the suction solenoid (31). (59) also prevents the mounting head (15) from lowering.

Next, the component (5) is mounted in the same manner. In step 2 of FIG. 5, the part (5)
Of detecting the presence or absence of parts after suction
If it is assumed that the absence of the component (5) has been detected, the recovery of that step is performed, but the suction nozzle (14) to be used has already been selected and protruded at the nozzle selection station (VII). Therefore, the station (VII)
The CPU (53) so that the mounting head (15) of the station immediately before the step (5) sucks the component (5) of the step 2.
Is determined. That is, after the component pick-up in step 5 is completed, the reel number 5 is picked up by the pick-up station (II) to pick up the component (5) in step 2, so that the reel number is assigned to the pick-up station (I). The CPU (53) decides to move 2 and moves the supply stand (7). Also at this time, the intermittent rotation is performed in a stopped state, but may be performed intermittently.

Next, in step 6, the reel number 6
The supply table (7) does not have to be moved to take it out (as shown in FIG. 3), and the component (5) is taken out after rotating the rotary table (13) twice. Also in this case, compared with the case where only one suction station is provided, the time for returning to a longer distance in the direction of a smaller reel number for recovery and the moving distance of the supply table (7) for returning to the original step 6 for recovery. , The time for two intermittent rotations is shorter.

Next, in the case of another substrate (6), if the NC data is created as shown in FIG.
In step (53), the supply table (7) is moved so that the position reel number 5 of the suction station (II) is stopped by judging that the data can be suctioned simultaneously for two steps. Then, the reel number 1 is placed at the position of the suction station (I).
Is located. At this time, the suction solenoid (31) (5
9) is excited, the rod is retracted, and the mounting head (1)
5) can be lowered, and by the rotation of the cam (26) and the cam for the suction station (II), the mounting heads (15) of both stations are lowered and the lifting lever (49) and other lifting and lowering are performed. When the lever is lowered, the swing lever (50) swings, and both chip components (5) supplied to the supply position are taken out by the suction nozzle (14).

Thereafter, it rotates intermittently twice, and during the first intermittent rotation, is locked by a clutch mechanism (not shown) so that the lifting lever (49) and other lifting levers do not descend. 31) and (59) also do not lower the mounting head (15). The subsequent operation at each station is performed in the same manner as described above. Next, in steps 3 and 4, simultaneous adsorption is performed in the same manner.

Thereafter, the supply table (7) moves one pitch at a time until step 8, but the movement for simultaneously sucking steps 9 and 10 moves by 5 pitches. When the NC data is created and simultaneously sucked, the moving distance of the supply table (7) can be extremely small. Same NC
When data includes both cases where components can be taken out one step at a time as shown in FIG. 5 and cases where two steps can be picked up at the same time, take out one step at a time or two steps at a time. For this purpose, two or more steps may be read ahead and controlled so that the suction can be performed simultaneously when the suction can be performed simultaneously.

In the mounting stations (V) and (VI),
The solenoids (39) and (60) are selected and excited and demagnetized so that the next mounting position is mounted at a station closer to the current position. If they can be mounted simultaneously, the solenoids (39) and (60) may be excited to lower the mounting heads (15) of the stations (V) and (VI) to mount the component (5). It is sufficient to create NC data so that mounting can be performed at the same time.

In this embodiment, the suction station (I)
In (II), the position of the suction nozzle (14) shown by the solid line in FIG. 3 was the take-out position, but by rotating the motor (44) of the head (15), the suction nozzle (14) was moved to the position shown by the broken line. ) Can be positioned, and the chip component (5) can be taken out from the component supply device (8) at this position. For this purpose, an elevating lever (49) may be additionally provided at these positions. That is, in FIG. 3, the lever (4) is positioned at the reel numbers 2, 4, 6, and 8.
9) may be arranged. The lowering of the mounting head (15) may be as in this embodiment. With this arrangement, the component supply device (8) for taking out the component (5) is moved to the closest position among the four take-out positions, and only the mounting head (15) to which the component take-out position belongs can be lowered. The solenoids (31) and (59) are excited and demagnetized, and the selected suction nozzle (14) of the descending head (15) is rotated and positioned at a component pick-up position where the pick-up nozzle (14) is to be picked up. Then, the chip component (5) may be taken out from the take-out position. In this case, components cannot be simultaneously sucked from two take-out positions of the same head (15), but the chip components (5) can be simultaneously sucked at any position of each mounting head (15). This can be performed, and the number of cases in which simultaneous suction can be performed increases, and the number of steps in which simultaneous suction can be performed when creating NC data can be increased. The lever (49) for component supply at the component pick-up position and the corresponding lever may be fixedly provided at each position, but may be moved in the direction of movement of the supply table (7) to provide each position. May enable the supply operation. Alternatively, the supply operation may not be performed by feeding the tape at these take-out positions, but the supply operation may be performed in advance when the supply position is at another position.

Further, unlike the present embodiment, the position shown in FIG. 7 may be used as a component take-out position in another embodiment. In this case, components can be taken out by three mounting heads (62), and two suction nozzles (6
There are take-out positions according to 3), and six take-out positions can be realized. Two or three heads (62) for simultaneous suction
At the same time. Suction nozzle (6
3) is located at the position where the solid line is taken out or the position where the broken line is taken out. Reference numeral (64) denotes a component supply device disposed at equal intervals on the supply table (65), and the supply table (65) is movable in the direction in which the component supply device (64) is disposed.

Further, in this embodiment, the cam (26) and the cam of the suction station (II) lower the mounting head (15) at the same timing. However, if the timing is shifted, the same rotary table is used. If the one-pitch supply table (7) can move during the stop time of (13), one of the mounting heads (15) takes out a part and then the other head (15) moves down. And 1
Parts can be taken out by moving the pitch. Alternatively, if the movement by one pitch cannot be made in time, the time during which the index motor is slowed down or stopped and the mounting head (15) is stopped may be lengthened. The mounting head (1) is driven by an independent driving source such as a motor at both or one of the suction stations (I) and (II) without using the cam (26).
5) may be lowered. Also, if the timing of the mounting head (15) is shifted, the suction position of the component (5) is corrected in the moving direction of the supply table (7), and the chip component (5) is suctioned at the center of the suction nozzle (14) as much as possible. In this case, even when simultaneous suction is performed, it is possible to perform correction by moving the supply table (7) slightly after taking out one of them.

Also, in the mounting stations (V) and (VI), if the timing of the cam is changed or the timing is shifted by another driving source to mount the component (5), the components (5) are slightly separated. The component (5) sucked by both heads (15) is mounted even in the same stop time zone of the rotary table (13) even if it is at the position. Further, in the present embodiment, an example is shown in which the mounting head (15) is provided with a plurality of nozzles (14), but a mounting head having only one nozzle may be used.

Further, in this embodiment, the angle position (including selection) of the suction nozzle (14) can be changed even while the rotary table (13) is moving by mounting a motor on the mounting head (15). At a predetermined station, the head itself or each nozzle is angularly positioned by a rotary drive source at a position other than the rotary table (13), and the nozzle itself is rotated to select a nozzle to be used. Even in this case, by using a plurality of suction stations and mounting stations, the moving distance of the supply table (7) is reduced, the moving distance of the XY table (3) is reduced, or simultaneous suction and simultaneous mounting is performed. And component mounting can be performed at high speed.

In this embodiment, the component suction positions of the two stations are provided at positions where simultaneous suction is possible. However, the suction nozzle (14) is stopped above the component supply position of the component supply device (8). If the mounting head (15) can be lowered for component suction, a plurality of component pick-up positions may be provided at positions where simultaneous suction is not possible. Further, the first embodiment and the second embodiment
In the embodiment, the suction is performed using only one suction nozzle in the same head, but the suction may be performed using two suction nozzles simultaneously. Then, in the case of the first embodiment, components can be picked up at a maximum of four locations at the same time, and in the case of the second embodiment, components can be picked up at the same time at a maximum of six locations.

In this embodiment, both the suction station and the mounting station are provided at two places. However, only the suction station may be provided at two places, and the mounting station may be provided at one place.

[0041]

As described above, according to the present invention, the electronic components can be suctioned by the mounting head near the desired component supply device at a plurality of pick-up stop positions, so that the moving distance of the supply table is shortened, and the suction of the electronic components is required. Time is reduced.

[Brief description of the drawings]

FIG. 1 is a plan view of the electronic component automatic mounting apparatus of the present invention.

FIG. 2 is a side view of the mounting device.

FIG. 3 is a plan view showing a state in which a mounting head stops at two suction stations.

FIG. 4 is a control block diagram of the present invention.

FIG. 5 is a diagram showing NC data.

FIG. 6 is a diagram showing NC data.

FIG. 7 is a plan view showing a state of a suction station according to another embodiment.

[Explanation of symbols]

 (5) Chip-shaped electronic component (electronic component) (6) Printed circuit board (7) Supply table (8) Component supply device (13) Rotary table (15) Mounting head

Continuation of the front page (56) References JP-A-2-167635 (JP, A) JP-A-6-296095 (JP, A) JP-A-2-207595 (JP, A) JP-A-4-22194 (JP) , A) JP-A-61-274826 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 13/00-13/04

Claims (1)

(57) [Scope of request for utility model registration] 1. A desired component of a plurality of component supply devices in which a mounting head disposed at a predetermined interval on a peripheral edge of a rotary table intermittently rotating is disposed on a supply table at a predetermined take-out position. An electronic component automatic mounting device in which a supply device is moved to the take-out stop position by the movement of the supply table, sucks the supplied electronic component, and mounts the component on the printed board at the mounting stop position by intermittent rotation of the rotary table. In the above, at the plurality of stop positions of the intermittent rotation of the rotary table on the same supply table, the mounting head enables the mounting head to suck the electronic component from the component supply device , and
Specify the component supply device that supplies components for each mounting sequence
Which stop position for picking up parts
The component to be picked up by the
Control means for controlling the receiving head to suck components
Automatic electronic part mounting apparatus, wherein a is provided.