JP3265931B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting electronic components on a substrate.

[0002]

2. Description of the Related Art Conventionally, a parts cassette for storing electronic parts is placed on a moving table, and the moving table is moved on a linear moving path. Electronic component mounting apparatuses that take out electronic components and mount electronic components on a positioned substrate are widely used.

In recent years, in order to further improve the mounting speed of electronic components, the operation of the electronic component transfer section has been accelerated. However, in a conventional electronic component mounting apparatus, the operation of an electronic component supply unit such as a moving table for positioning a desired parts cassette at a pickup station may not be able to follow the speed of the electronic component transfer unit.

FIGS. 19 and 20 are explanatory views of the operation of a conventional electronic component mounting apparatus. In the figure, a parts cassette P in which different kinds of electronic components are stored on a moving table 1 respectively.
a1 to the parts cassette Pa8 are placed at an arrangement pitch t. When the transfer head 2 reaches the immobile stop position 4, the electronic component is taken out by the nozzle 3 provided below the transfer head 2. In the state of FIG. 19, since the parts cassette Pa4 is located at the stop position 4, the electronic component is taken out from the parts cassette Pa4. In the next sequence, if it is assumed that electronic components should be taken out of the parts cassette Pa5, the moving table 1 immediately stores X as shown in FIG.
Must be moved in the direction by a movement distance D0 (one pitch t in this example).

[0005]

Here, the moving distance D0
Is large or the moving ability of the moving table 1 is low,
Even if the electronic component transfer unit completes the operation for one sequence,
In some cases, the moving table 1 may not be completely moved to the position shown in FIG. Therefore, the electronic component transfer unit must wait or skip until the moving table 1 completes the predetermined operation. For this reason, even if the speed of the electronic component transfer unit is increased, there is a problem that it is difficult to improve the mounting speed itself due to the operation of the moving table 1.

Accordingly, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of performing high-speed mounting while saving the moving time of the moving table as much as possible.

[0007]

In order to achieve the above-mentioned object, the present invention has a vertical rotating shaft and a parts cassette.
Transfer head provided with a plurality of different types of nozzles provided at a position eccentric from the rotation center of the rotation shaft so as to rotate with a rotation radius smaller than the arrangement pitch of the rotation shafts A plurality of pickup stations including a pickup station for rotating the transfer head about a rotation axis to pick up an electronic component provided in a parts cassette by the nozzle, and a mounting station for mounting the electronic component on a substrate by the nozzle. a rotary mechanism for moving the station, the pick-up position determining means for selecting one of the pick-up two positions set in said pick-up station according to implement sequential order, the juxtaposed parts cassettes before
Move horizontally with a movement distance smaller than the pitch
A moving table for positioning the parts cassette in the selected pick-up position A can Rukoto, a plurality of nozzles protruding station and the pickup station for projecting the nozzles to be used downwardly from the nozzles of the plurality of stations Rotating shaft driving means for rotating the rotating shaft to move the nozzle to the selected pickup position at the pickup preparation station during the operation, and electronic parts by driving the parts cassette positioned at the selected pickup position Parts cassette driving means for feeding the tape in which is stored,
An electronic component mounting apparatus is constituted by a moving mechanism for moving the parts cassette driving means in the lateral direction.

In addition, while the transfer head having a plurality of nozzles of different types is rotated by a rotary mechanism around a rotation axis, the transfer head is smaller than the arrangement pitch of the parts cassette.
The electronic component of the parts cassette reciprocating in the horizontal direction is moved by the moving table capable of moving the moving distance in the horizontal direction. At the pickup station, the nozzle to be used among the plurality of nozzles provided in the transfer head is moved downward. An electronic component mounting method for protruding and picking up and mounting on a substrate at a mounting station, wherein one of two pick-up positions set at the pick-up station is selected in accordance with a mounting sequence and the transfer is performed at a pick-up preparation station. By rotating the mounting head about its rotation axis, the nozzle eccentric from this rotation axis is turned into a part cassette about this rotation axis.
The parts cassette is rotated by a radius of rotation smaller than the array pitch and moved to the selected pickup position, thereby increasing the lateral movement distance of the parts cassette. In response to the fluctuation, the parts cassette driving means including the pressing means for pressing the tape feed lever of the parts cassette is moved laterally by the moving mechanism.

[0009] In more before the station than the pick-up station, transfer of the moving table when the transfer head of the station to pick up an electronic component in the pick-up station
The moving distance is determined as the current moving distance based on the program data from the difference from the cassette mounting position of the transfer head located at the immediately preceding station, and the next moving distance is determined based on the program data. From the cassette mounting position of the transfer head located at the station immediately after that, and from these two differences, the transfer head is moved in the direction approaching the parts cassette picked up by the nozzle. By rotating it to the center, the pickup position of the nozzle was determined.

After picking up the electronic component at the pick-up station, when observing the electronic component picked up by the nozzle at the recognition station, the transfer head is rotated about the rotation axis to obtain the electronic component. Is positioned at the recognition position of the recognition unit provided in the recognition station, and the positional shift of the electronic component is detected.

[0011]

According to the above construction, of the two intersections of the circle centered on the rotation center of the transfer head and the movement path, the intersection closest to the component take-out opening of the parts cassette from which the next electronic component is to be taken out is selected. The moving distance of the moving table is shortened, and the pressing means of the parts cassette driving means is preliminarily moved to the pressing position of the tape feed lever of the parts cassette so as to be on standby. The time can be reduced, and as a result, the operation speed of the electronic component mounting apparatus itself can be improved.

By determining the pickup position from the current movement distance of the parts cassette or the next movement distance, the operation efficiency can be further increased and the speed can be increased. Further, by rotating the transfer head about the rotation axis, it becomes possible to recognize the electronic component at a higher speed.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the electronic component mounting apparatus,
FIG. 3 is a front view of parts cassette driving means provided in the electronic component mounting apparatus. FIG. 4 is a plan view of a rotating plate of the electronic component mounting apparatus, and FIG. 5 is a partially enlarged view of a cylindrical cam of the electronic component mounting apparatus. 6 is a block diagram of a control system of the electronic component mounting apparatus, FIG. 7 is a partially enlarged plan view of the electronic component mounting apparatus, FIGS. 8 and 9 are operation explanatory diagrams of the electronic component mounting apparatus, and FIG. FIGS. 11A, 11B, and 11C are diagrams for explaining the operation of the electronic component mounting apparatus.

In FIG. 1, a substrate 1 is provided in front of a base 5.
A substrate transport conveyor 6 for carrying in the substrate 3 and a substrate transport conveyor 7 for carrying out the substrate 13 are provided. In the center of the front part of the base 5, a Y table 8 driven by a Y motor 9 is provided.
Is mounted, and an X table 10 driven by an X motor 11 is mounted on the Y table 8. Further, a holder 12 for holding a substrate 13 is placed on the X table 10. Therefore, the Y motor 9 and the X motor 1
1 is driven to receive the substrate 13 loaded by the substrate transport conveyor 6 with the holder 12 positioned between the substrate transport conveyors 6 and 7, holding the substrate 13 by the holder 12, and mounting electronic components. After the mounting is completed, the holder 12 can be moved again between the substrate transport conveyors 6 and 7, and the substrate 13 can be delivered to the substrate transport conveyor 7 and carried out.

An electronic component supply unit 20 is provided at the rear of the base 5. The rail base 21 is fixed to the rear part of the base 5, and a feed screw 22 is rotatably supported on the rail base 21. The motor 23 rotates the feed screw 22 so as to protrude from a rear portion of a moving table 24 slidably engaged with the rail base 21, and moves a feed nut 25 screwed to the feed screw 22 in the X direction (lateral direction). By moving, the moving table 24 moves in the X direction. A number of parts cassettes Pa1, Pa2,..., Pa12 accommodating different types of electronic components are arranged side by side on the moving table 24, and component take-out ports Q1, Q2,. The electronic component is taken out from Q12. Further, the board transfer conveyor 6, the board transfer conveyor 7, and the electronic component supply unit 2
Between 0, the recognition unit 30 and the nozzle selection unit 31 are arranged so as to face each other. In the present invention, the direction in which the part cassettes Pa1 to Pa12 are fed by the moving table 24 is defined as a horizontal direction (X direction).

The electronic component transfer section 40 circulates a plurality of transfer heads 43 between the substrate 13, the nozzle selection section 31, the electronic component supply section 20, and the recognition section 30 while rotating in an index manner. Then, the electronic component is taken out from the parts cassette, and the electronic component is mounted on the substrate 13. Next, FIG.
The electronic component transfer unit 40 will be described with reference to FIGS. A plurality of transfer heads 43 provided on the peripheral edge of the disk-shaped rotary plate 41 circulate and rotate in each of the stations to be described later, when a rotary shaft 42 attached to the center of the disk 41 performs index rotation. That is, the rotating plate 41, the rotating shaft 42, and the like constitute a rotary mechanism for rotating the transfer head 43 about the rotating shaft 42.

The upper part of the transfer head 43 is mounted on a rotary shaft 44, and the rotary shaft 44 of the transfer head is partly formed as a spline. Mounted on As shown in FIG. 7, the rotation shafts 44 of these transfer heads 43 are mounted at equal intervals on a circle C1 about the rotation center of the rotation plate 41, and when the rotation plate 41 rotates, the transfer heads 43 is the circle C1
(Radius R) is rotated in the direction of arrow M.

In FIGS. 2 and 7, the transfer head 43 has a plurality of nozzles 45 of different types at positions eccentric with respect to the rotation shaft 44. That is, a plurality of nozzles 45 are arranged on a circle C2 centered on the rotation center (rotation shaft 44) of the transfer head 43. Further transfer head 4
Reference numeral 3 shows a structure in which only the nozzles selected for sucking the electronic components are projected downward, and other unused nozzles are housed inside. Japanese Patent Application Laid-Open No. 2-99000 can be cited as an example of a similar transfer head structure.

In FIG. 2 and FIG.
Numeral 6 is for rotating the rotating shaft 44, and the rotating shaft of the head motor 46 is connected to the rotating shaft 44 via a timing belt 46a and the like. Therefore, the head motor 4
When nozzle 6 is driven, as shown in FIG.
2, the pickup position of the nozzle 45 and the rotation angle (direction) of the electronic component sucked to the nozzle 45 can be adjusted.

As shown in FIG. 4, the transfer head 43 includes preliminary stations S1 and S2, and a nozzle projecting station S3 for projecting only a desired nozzle from a plurality of nozzles provided in the transfer head 43 downward. Pickup preparation stations S4 and S5 for rotating the nozzle 45 by 180 ° about the rotation shaft 44 to select a pickup position of the nozzle 45, as will be described later, and the electronic component supply unit 20.
Pick-up station S6 for picking up and picking up electronic components from the camera, and a recognition position adjusting station for adjusting the position of electronic components at the next recognition station S9 by rotating the nozzle 45 by 90 ° clockwise or counterclockwise about the rotating shaft 44. S7, S8, an electronic component recognition station S9 that checks the attitude of the electronic component to detect a positional shift or an angular shift from an ideal position, and determines the attitude of the electronic component in advance in consideration of the angular shift detected by the recognition station S9. Each of the electronic component angle correction stations S10 and S11 for setting a predetermined mounting angle and the mounting station S12 for mounting an electronic component on the board 13 is circulated by rotating in an index manner around a rotary shaft 42. It is. Reference numeral 30 denotes a recognition unit provided in the recognition station S9, and reference numeral 30a denotes a camera. Note that U6 in FIG.
“U10” is a parts cassette mounting position number indicating the mounting position of the parts cassette set on the moving table 24.

As shown in FIG. 2, the upper end of the rotating shaft 44 is rotatably connected to a block 47.
A cam follower 48 and a cam follower 49 are attached to both ends. The cam follower 49 moves in contact with the cam surface of the cylindrical cam 50 that does not rotate. As shown in FIG.
A cutout 53 is provided in a part of the cam surface of the cylindrical cam 50 at a position corresponding to the pickup station S6 and the mounting station S12. At a position facing the notch 53, a cam receiver 51 for receiving the cam follower 48 is provided. The cam receiver 51 is moved up and down by driving means (not shown).

When the rotating plate 41 rotates by the index, the pickup station S6 and the mounting station S12 are rotated.
The cam follower 48 that has moved to the cam receiver 51 moves to the cam receiver 51 and stops, while the cam follower 49 that has rolled on the cam surface of the cylindrical cam 50 stops at the notch 53. In this state, at the pickup station S6 or the mounting station S12, the cam receiver 51 is lowered with respect to the top plate 52 by driving means (not shown),
As a result, the nozzle 45 performs a lowering operation and a raising operation toward the substrate 13 or the electronic component supply unit 20, whereby the electronic component is taken out at the pickup station S6 and the electronic component can be mounted at the mounting station S12. It has become.

FIG. 7 shows the vicinity of the pickup station of the electronic component mounting apparatus according to the present embodiment. In FIG. 7, L
, Pa12 indicate the movement paths of the component take-out ports Q1, Q2, ..., Q12 of the part cassettes Pa1, Pa2, ..., Pa12. When the moving table 24 is moved in the X direction, the component take-out ports Q1, Q2, .., Q12 also move in the X direction along the movement path L. In the pick-up station S6, the circle C2 of the transfer head 43 and the above-described movement path L intersect at two points T1 and T2.
In the present embodiment, the electronic component supply unit 20 and the electronic component transfer unit 40 are arranged such that the movement route L substantially coincides with the center of the circle C2.
Is provided. Thereafter, T1 is the first stop position, T2
Is referred to as a second stop position. As will be described later, the first stop position T1 corresponds to the pickup position A, and the second stop position corresponds to the pickup position B. Fig. 8
As shown in FIG. 9 and FIG.
The rotation radius r of the chisel 45 is the arrangement pitch t of the parts cassette.
And the moving table 24 has this arrangement pitch.
It is possible to move laterally with a moving distance smaller than t
It is.

When picking up an electronic component P from a parts cassette storing a desired electronic component P, the moving table 24 is moved to move the parts cassette to the first stop position T1 or the second stop position T2. To move the nozzle 45 for sucking the electronic component P by driving the head motor 46 such that the component outlet for accommodating the desired electronic component P is located directly above the stop position where the component outlet is positioned. The head 43 is rotated. Then, at the pick-up station S6, the component take-out port and the nozzle 45
Then, the transfer head 43 is lowered and raised, and the electronic component P is suction-adsorbed to the lower end of the nozzle 45 to be picked up.

Next, the parts cassette driving means and a moving mechanism for moving the parts cassette driving means in the lateral direction according to the position of the parts cassette will be described with reference to FIGS. In FIG. 2, the parts cassette is configured by mounting a supply reel 69 on a rear portion of a main body 68. A tape containing electronic components is wound around the supply reel 69. A lever 70 projects from the main body 68. When the upper end of the lever 70 is pressed, the tape is drawn out of the supply reel 69 and is pitch-fed toward the tip of the main body 68 (to the left in FIG. 2). The structure of such a parts cassette is well known.

Reference numeral 71 denotes a pressing rod serving as a pressing means serving as a main part of the parts cassette driving means. A roller 72 is mounted on the lower end of the pressing rod. The pressing rod 71 is held by a guide 73 so as to be slidable in the vertical direction. The guide 73 is mounted on the front surface of the movable plate 74. A guide 75 having a U-shaped cross section is mounted on the upper part of the pressing rod 71. A roller 76 is fitted on the guide 75. The roller 76 is pivotally attached to the tip of a lever 77. The lever 77 is pivotally attached to an arm 78 with a pin 79, and the arm 78 is connected to a drive rod 80. When the driving rod 80 reciprocates in the direction of the arrow driven by the power not shown, the arm 78 and the lever 77 swing in the direction of the arrow, and the pressing rod 71 moves up and down. When the pressing rod 71 is lowered, the roller 72 presses the upper end of the lever 70 of the parts cassette, and the tape is fed at a pitch. That is, the components denoted by reference numerals 71 to 75 constitute parts cassette driving means. Note that the parts cassette is a well-known one, and a detailed description of its structure will be omitted.

Next, the parts cassette driving means 71 to 75
A moving mechanism for moving the in the lateral direction will be described. A slider 81 is mounted on the back of the movable plate 74. The slider 81 is slidably fitted on a horizontal guide rail 82. A nut 83 is mounted on the back of the movable plate 74. A horizontal ball screw 84 is screwed into the nut 83. Therefore, when the motor 85 is driven and the ball screw 84 rotates forward and backward, the nut 83
4, the movable plate 74 moves in the lateral direction (X direction). The pressing rod 71 integrated with the movable plate 74 also moves in the lateral direction. In FIG. 3, reference numeral 21a denotes a rail on the rail base 21, and 24a denotes a slider attached to the lower surface of the moving table 24. When the motor 23 is driven to rotate the feed screw 22 as described above, the moving table 24 It moves on 21a in the horizontal direction (X direction).

As described above, the nozzle 4 of the transfer head 43
5 selects two pickup positions A and B. Therefore, it is necessary to selectively move the parts cassettes to the positions corresponding to the two pickup positions A and B accordingly. In FIG. 3, the levers of the parts cassette U indicated by reference numerals 70a and 70b show the case where the parts cassette U has stopped at the positions corresponding to the two pickup positions A and B. Such levers 70a, 7
According to the position of 0b, the motor 85 is driven to position the pressing rod 71 directly above the respective levers 70a and 70b, and the levers 70a and 70b can be pressed.

In FIG. 6, a CPU 60 includes a ROM 61
Each element in FIG. 6 is controlled based on the control program stored in. The RAM 62 is provided with an area for storing various kinds of program data necessary for executing the control program in addition to the electronic component supply data shown in FIG. Reference numeral 63 denotes an electronic component supply unit controller that controls driving of the motor 23 of the electronic component supply unit 20. Reference numeral 64 denotes an electronic component transfer unit controller, which controls the driving of a motor (not shown) for rotating the rotating shaft 42 and an elevating unit for elevating the cam receiver 51. 65 is XY
It is a table controller that positions the substrate 13 at a predetermined position by controlling the driving of the X motor 11 and the Y motor 9 and the like. Reference numeral 66 denotes a parts cassette driving means controller, which controls a driving means for reciprocating the driving rod 80 and a motor 85. 67 is a drive circuit for driving the head motor 46. A recognition processing unit 30b processes the image signal from the camera 30a of the recognition unit 30 to recognize the electronic component P. These various controllers and drive circuits operate according to instructions from the CPU 60 as control means.

Next, the operation of picking up the electronic component P will be described with reference to FIGS. In the drawing, two upward thick arrows indicate the position of the nozzle 45 of the transfer head 43 at the first stop position T1 (the pickup position A) and the position of the nozzle 45 of the transfer head 43. Nozzle 43 at second stop position T2
(Pickup position B).

In FIG. 8, the nozzle 4 of the transfer head 43
Reference numeral 5 is located on the first stop position T1, and is about to pick up the electronic component P from the component outlet Q4 of the parts cassette Pa4. Note that the nozzle 45 of the transfer head 43 takes the first stop position T1 or the second stop position T2.
Is determined in advance by the pickup preparation station S4,
This is selected in S5. This selection method will be described later with reference to FIGS. In FIG. 8, the nozzle 45 of the transfer head 43 is connected to the parts cassette Pa4.
Above the component take-out port Q4.

FIG. 9 shows how the subsequent transfer head 43 picks up the electronic component P from the part cassette Pa5.
This will be described with reference to FIG. In this case, the component take-out port Q5 of the parts cassette U5 is moved so as to match either the first stop position T1 or the second stop position T2. From the state of FIG. 2 stop position T2
In the pickup preparation stations S4 and S5, the stop position of the nozzle 45 of the transfer head 43 is set to the second stop position T2, the moving table 24 is driven, and the parts cassette is driven. Pa5
Is positioned so that the component take-out port Q5 of FIG.

Then, at the pickup station S6, the nozzle 45 of the succeeding transfer head 43 and the parts cassette Pa
When the position of the component extraction port Q5 of No. 5 coincides with the arrow T2, the transfer head 43 is lowered and raised, and the electronic component P is picked up by the nozzle 45. Here, assuming that the distance (arrangement pitch) between the parts cassettes is t and the radius of the circle C2 is r, the moving distance D1 of the moving table 24 at this time is D1 = t−2r, particularly r = t / 4 in the present embodiment. Therefore, the moving distance D1 = t / 2. That is, the nozzle 45 is connected to the rotating shaft 4
By rotating 180 ° about 4, 2r = t /
Since the moving distance of 2 can be obtained, the moving distance of the moving table 24 can be shortened by the moving distance of half of the moving distance in the conventional electronic component mounting apparatus.

Next, the operation of the electronic component supply section 20 based on the electronic component supply data of FIG. 10 will be described with reference to FIGS. In FIG. 10, the left column is a sequence number, the center column is a part cassette number to be taken out, and the right column is data indicating which of the first stop position T1 and the second stop position T2 is to be selected. FIG. 10 and FIG.
4 (to be described later) and other program data necessary for operating the apparatus are registered in the RAM 62 or the like. In addition,
The data relating to the stop position is set in advance by simulation or the like so that the electronic components can be mounted on one board 13 most efficiently.

First, the CPU 60 sends a command to the electronic component transfer section controller 64 to move the transfer head 43 that is to pick up the electronic component P at sequence number 1 from the preliminary stations S1 and S2 to the nozzle projecting station S3. Then, the CPU 60 reads the nozzle selection data stored in the RAM 62 and
A command is sent to 1 to make a predetermined nozzle protrude downward.
When the projection of the selected nozzle is completed, the rotating plate 41 is rotated by the index to move the transfer head 43 for which the nozzle selection is completed to the pickup preparation stations S4 and S5. Then, the CPU 60 reads the column of the sequence number 1 of the electronic component supply data stored in the ROM 61, and reads the data relating to the stop position of the parts cassette positioned by the sequence number 1. In this example, since the stop position of the component take-out port Q1 of the parts cassette Pa1 is the first stop position T1, the CPU 60 sets the position of the transfer head 43 to the position corresponding to the first stop position T1. Then, a command is sent to the drive circuit 67 of the head motor 46 for horizontally rotating the transfer head 43. Also C
The PU 60 sends a command to the electronic component supply unit controller 63 to position the component take-out port Q1 of the parts cassette Pa1 to the first stop position T1, and causes the positioning to be performed. At the same time, the motor 85 is driven to move the pressing rod 71 to the first stop position T1.

Next, the rotating plate 41 is rotated by one index to transfer the transfer head 43 to the pickup station S6.
To lower the pressure rod 71 to drive the parts cassette Pa1 and lower the transfer head 43.
The electronic component P is picked up from the component take-out port Q1 of the parts cassette Pa1 which is moved up and positioned at the first stop position T1. Thereafter, the transfer head 43 is moved to the recognition position selection stations S7 and S8, the recognition station S9, and the electronic component angle correction stations S10 and S11.
The electronic component P is mounted on the substrate 13 at the mounting station S12 by performing various processes and operations. By performing such an operation in parallel with the subsequent transfer head 43, the electronic components P are mounted on the substrate 13 one after another.

FIG. 11 shows a pickup operation based on the electronic component supply data of FIG. FIG. 11 (a)
Is the state when sequence number 1 is executed, FIG.
FIG. 11C shows a state when the sequence number 2 is executed.
Indicates a state when sequence number 3 is executed.
In sequence number 2, since the parts cassette Pa2 is positioned at the second stop position, the moving table 24 (FIG. 1)
The movement distance D1 of the reference) only needs to be D1 = 0.5t. In the sequence number 3, the electronic component P is picked up from the same parts cassette Pa2 as the sequence number 2, so there is no need to move the moving table 24. However, the electronic number P is picked up in the sequence number 5 from the parts cassette Pa3. So, this part cassette P
In order to make a3 as close as possible to the second stop position T2, the moving table 24 is moved to the left by 0.5t to position the parts cassette at the first stop position T1.

As described above, since the moving distance D1 per one movement of the moving table 24 can be shortened and the positioning time of the moving table 24 can be shortened correspondingly, the operation of the electronic component supply unit 20 is delayed, so that the entire electronic component mounting apparatus is reduced. There is no reduction in operating speed.

Next, another example of a method of operating the apparatus will be described with reference to FIGS. FIG. 12 is a plan view of a main part of an electronic component mounting apparatus according to one embodiment of the present invention.
FIG. 13 is a data configuration diagram of the electronic component mounting apparatus.
Which of the two pickup positions A and B is selected in the order of the sequence numbers. FIG.
FIG. 5 is an operation explanatory view of the electronic component mounting apparatus, and shows pickup positions by nozzles selected in sequence number order. 15 to 18 show flowcharts of the operation of the electronic component mounting apparatus. Figure 1
8 shows the operation in step 3 of FIG. 15 in detail.

The operation will be described below with reference to the drawings. First, step 1 in FIG.
In step 1, the rotation shaft 44 of the transfer head 43 is rotated to move the nozzle 45 to be used to the nozzle protruding position side (outside). In FIG. 12, the nozzle 45 used
Is painted black, and by rotating the rotary shaft 44 in the direction of the arrow at the preliminary stations S1 and S2,
Move the selected nozzle 45 to the nozzle projecting position (outside)
FIG. In FIG. 12, the head motor 46 and the timing belt 46a are omitted. Note that in the flowcharts of FIGS.
S1 to S12 described on the right side of each drawing are stations where the operation is performed.

Next, in step 2 of FIG. 15, the selected nozzle 45 is moved by the nozzle projection 31 to the transfer head 4.
3 downward. That is, unused nozzles (white nozzles) 45 are raised and stored in the transfer head 43, and only the used nozzles (black nozzles) 45 are projected downward so that electronic components can be picked up. . As a mechanism for projecting and storing such a nozzle, a mechanism described in Japanese Patent Application Laid-Open No. 2-99000 is known.

Next, in step 3, the pickup position A or B is determined. Hereinafter, the method of determining the pickup position will be described in detail with reference to the flowcharts of FIGS. 12 to 14 and FIG. Here, the transfer head 4 located at the nozzle selection station S3 in FIG.
3 is an electronic component P of sequence number 4 in FIG.
The following description will be made with reference to the operation diagram of FIG. 14 by taking as an example which of the pickup positions A and B picks up a component). 12 and FIG.
In FIG. 4, A is the left pick-up position, and B is the right pick-up position.
Is rotated 180 ° about the rotation axis 44,
The nozzle 45 selects the pickup position A or B.
In FIG. 12, the rotation of the rotary shaft 44 when the pickup position A is selected is indicated by a dashed arrow, and when the pickup position B is indicated by a solid arrow. This pickup position A,
B corresponds to the first stop position T1 and the second stop position T2 as described above.

In step 3-1 in FIG. 18, cassette mounting position numbers u8, u8, u9 of parts cassettes storing parts to be picked up by the transfer head 43 located in the stations S4, S3, S2 in FIG. 13
Of the sequence numbers 3, 4, and 5).
Read from AM62. That is, when the pickup position in sequence number 4 is determined in the nozzle selection station S3, the stations S before and after that are determined.
Attention is also paid to the sequence numbers 3 and 5 of 4, S2.

In the next step 3-2, the number of part cassette movement pitches (current movement pitch number) of the movement table 24 when the transfer head 43 of the nozzle selection station S3 picks up parts = u (S3) -u. (S
Find 4). In this example, u (S3) -u (S4) = u
8-u8 = 0. Note that u (S3) and u (S4) are the transfer heads 4 located at the station numbered in parentheses.
Reference numeral 3 denotes a part cassette mounting position number of a parts cassette storing parts to be picked up.

Next, in step 3-3, the number of moving pitches of the parts cassette of the moving table (the next moving pitch number) = u (S2) -u (S3) when the transfer head 43 of the standby station S2 picks up parts. Ask for.
In this example, u (S2) -u (S3) = u9-u8 = 1.

Next, in step 3-4, condition (1)
Is determined. This time, the moving pitch number is 0 or more (that is, the moving table 24 stops or moves in the right direction N1 in FIG. 12), and the next moving pitch number is 0 or less (that is, the moving table 24 stops or the left direction in FIG. 12). When the movement is to N2) (when Yes), the process proceeds to step 3-7, and the pickup position of the component by the nozzle 45 of the transfer head 43 located at the nozzle selection station S3 is set to B (see also FIG. 13).

If No in step 3-4, condition (2) is determined in step 3-5.
Condition (2) is whether the current movement pitch number is larger than 0 and the next movement pitch number is larger than 0. Here, when the condition (2) is satisfied, the process proceeds to step 3-7 as Yes, and the pickup position A is determined.
If the condition (2) is not satisfied, the process proceeds to step 3-6 as No, and the pickup position B is determined.
As described above, when the transfer head 43 located at the nozzle selection station S3 determines which of the pickup positions A and B should be selected, the preceding station S
4 and the subsequent station S2.

When the pickup position A or B is determined in step 3 of FIG. 15 as described above, the process proceeds to step 4 and the transfer head 43 is rotated at the pickup preparation stations S4 and S5. 4
4, the nozzle 45 is rotated to the determined pickup position A or B. The pickup position of sequence number 4 determined in this example is B (the pickup position B of sequence number 4 in FIG. 13).
See).

Next, in step 5 of FIG. 16, the transfer head 43 of the pickup preparation station S5 determines whether to pick up a component from the same part cassette as the transfer head 43 of the pickup station S6. If Yes, at step 6, it is determined whether or not the pickup positions of the nozzles 45 of the transfer head 43 of the pickup preparation station S5 and the transfer head 43 of the pickup station S6 are the same.

If No in Steps 5 and 6, it is determined in Step 7 whether the pickup position of the transfer head 43 of the pickup preparation station S5 is B or not. If Yes, the parts cassette storing the parts to be picked up by the transfer head of the pickup preparation station S5 is moved to the pickup position B in step S8. Then, in step 11, the pressing rod 71 is moved to the pickup position B side, and in step 1
4 is performed.

If No in step 7 (that is, if the pickup position is A), in step 9 the parts cassette storing the parts to be picked up by the transfer head of the pickup preparation station S5 is moved to the pickup position A. In step 12, the pressing rod 71 is moved to the pickup position A side, and the process proceeds to step 14.
If Yes in Step 6, the moving table does not move in Step 10, the position of the pressing rod 71 remains in Step 13, and the process proceeds to Step 14. Steps 5 to 7 are performed at the pickup preparation station S5, and steps 8 to 13 are performed when the transfer head 43 is moving from the pickup preparation station S5 to the pickup station S6. Step 14
Is performed at the pickup station S6.

As described above, if the component is picked up at the predetermined pick-up position A or B, next, FIG.
The process proceeds to Step 15 of FIG. In step 15, the rotation shaft of the transfer head is rotated to move the nozzle that has absorbed the component so that the nozzle is positioned above the observation window K (recognition position) of the optical system. In this case, when the component is picked up at the pickup position A, the rotating shaft 44 is rotated 90 ° in a counterclockwise direction (see the broken arrow).
Turn 90 ° clockwise (see solid arrow). By reversing the rotation direction of the rotating shaft 44 according to the pickup position in this way, the time required for the nozzle 45 adsorbed on the component to move above the observation window K of the recognition unit 30 is reduced.

Next, in step 16, the pickup position is set to B
It is determined whether or not. If No in step 16,
The process proceeds to step 17, where the suction angle θ ₀ is sent to the recognition processing unit 30b connected to the recognition unit 30 as it is. Then, in step 19, an angle deviation Δθ with respect to the suction angle θ ₀ is obtained,
In step 21, the rotation angle θ = (mounting angle θ _m ) −90 °
− (Θ ₀ −Δθ) is calculated.

If Yes in step 16, the suction angle θ ₀ = θ ₀ + 180 ° is calculated in step 18, and the calculated suction angle θ ₀ is sent to the recognition processing unit 30b. Then, in step 20, an angle deviation Δθ with respect to the suction angle θ ₀ is obtained,
The process proceeds to step 21 to calculate the rotation angle θ.

The processing of steps 16 to 18 will be further described.
explain in detail. Observe by difference in pickup position
The directions of the components located in the window K are different by 180 °.
Therefore, when the recognition processing unit 30b recognizes a component,
A recognition error occurs if differences in the orientation of parts are not taken into account
there is a possibility. Therefore, in this example, the pickup position A
The pickup angle at pickup position B
θ₀180 ° to the
Corrections have been made. Note that the suction angle θ ₀About
Data together with the part cassette mounting position number data
Are stored in the RAM 62. Mounting angle θ_mIs
Along with the mounting coordinate data of the components mounted on the substrate 13, R
It is stored in AM62.

After the rotation angle θ has been calculated as described above, the rotation axis 44 of the transfer head 43 is rotated by the rotation angle θ in step 22, and the component is mounted on the substrate 13 at the mounting angle θ _m.
Set to be installed in. Next, at step 23, the substrate 1
3 and the components are mounted on the substrate 13 in step 24. Thus, a series of operations is completed.

Step 15 is a recognition position adjustment station S7, S8, steps 16 to 21 are a recognition station S9, step 22 is an electronic component angle correction station 10, 11, and step 24 is a mounting station S.
12 is performed.

According to the electronic component mounting apparatus of this embodiment, the operation of moving the nozzle 45 to the selected pickup position, the operation of moving the nozzle 45 picking up the component above the observation window K of the recognition unit 30 and the operation of the component The operation of setting the posture of the camera to the mounting angle θ _m can be realized by rotating the rotation shaft 44. For this reason, the structure of the electronic component mounting apparatus does not become complicated.

Further, by mounting the same number of head motors 46 as driving means for rotating the rotating shaft 44 to the rotating plate 41 as the number of transfer heads 43, the above-described three operations are executed in parallel and the components are moved at high speed. Can be mounted on a substrate.

The present invention is not limited to the above embodiment. For example, in the above embodiment, the transfer head 4
Although the head motor 46 for horizontally rotating the transfer head 3 is provided, the present invention is also applicable to an electronic component mounting apparatus in which the means for horizontally rotating the transfer head 43 is disposed outside the rotation system of the rotating plate 41.

[0061]

According to the present invention, the moving distance of the moving table can be shortened, and the substantial moving time of the electronic component supply unit can be shortened accordingly. As a result, the operation speed of the electronic component mounting apparatus itself can be improved. can do. In addition, by moving the pressing means of the parts cassette driving means to the pressing position of the tape feed lever of the parts cassette in advance by the moving mechanism and making it stand by, it is possible to feed the tape at a high speed, thereby mounting the electronic components on the board. Speed can be increased.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a front view of a parts cassette driving unit provided in the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 4 is a plan view of a rotating plate of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 5 is a partially enlarged view of a cylindrical cam of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 6 is a block diagram of a control system of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 7 is a partially enlarged plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 8 is an explanatory diagram of an operation of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 9 is an operation explanatory view of the electronic component mounting apparatus in one embodiment of the present invention.

FIG. 10 is a data configuration diagram of an electronic component mounting apparatus according to an embodiment of the present invention.

11A is a diagram illustrating an operation of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 11B is a diagram illustrating an operation of an electronic component mounting apparatus according to an embodiment of the present invention. Operation explanation diagram of electronic component mounting device

FIG. 12 is a plan view of a main part of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 13 is a data configuration diagram of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 14 is an explanatory view of the operation of the electronic component mounting apparatus in one embodiment of the present invention.

FIG. 15 is a flowchart of the operation of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 16 is a flowchart of the operation of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 17 is a flowchart of the operation of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 18 is a flowchart of the operation of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 19 is a diagram illustrating the operation of a conventional electronic component mounting apparatus.

FIG. 20 is a diagram illustrating the operation of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 13 Substrate 20 Electronic component supply part 24 Moving table 30 Recognition part 31 Nozzle protrusion part 40 Electronic component transfer part 43 Transfer head 44 Rotating shaft 45 Nozzle 70 Lever 71 Press rod (Press means) 72 Roller 83 Nut 84 Ball screw 85 Motor C2 Circle L Moving path A, B Pickup position S6 Pickup station S9 Recognition station S12 Mounting station Pa1 Parts cassette Pa2 Parts cassette Pa3 Parts cassette Pa4 Parts cassette Pa5 Parts cassette Pa6 Parts cassette Pa7 Parts cassette

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 3/30 H05K 13/00-13/04

Claims (11)

(57) [Claims] 1. A parts cassette having a vertical rotating shaft and a parts cassette
A transfer head which type provided in a position eccentric from the rotation center of the rotation axis of this <br/> to rotate at a small turning radius than the arrangement pitch of with different plurality of nozzles, the transfer A rotary for moving a plurality of stations including a pick-up station for rotating a head around a rotation axis to pick up electronic components provided in a parts cassette with the nozzle and a mounting station for mounting the electronic components on a substrate by the nozzle. wherein the mechanism, and the pickup position determining means for selecting in accordance with one implementation sequence order of the pick-up two positions set in said pick-up station, the juxtaposed parts cassettes
Before moving laterally by a small travel distance than the arrangement pitch
It a moving table for positioning the parts cassette has been pick-up position selected be capable of, the nozzle projection station and the pickup station for projecting the nozzles to be used downwardly from the plurality of nozzles of the plurality of stations A rotating shaft driving means for rotating the rotating shaft to move the nozzle to the selected pickup position side in a pickup preparation station during, and driving a parts cassette positioned at the selected pickup position to drive the electronic components; An electronic component mounting apparatus, comprising: a part cassette driving means for feeding a stored tape. 2. An electronic component mounting apparatus according to claim 1, further comprising a moving mechanism for moving said parts cassette driving means in a lateral direction. 3. The moving head is rotated by 180 ° by being driven by the rotating shaft driving means, so that a moving distance corresponding to the rotation diameter of the nozzle is obtained, and the moving distance of the parts cassette by the moving table is increased. 2. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is shortened. 4. A pressing means for pressing a tape feed lever of the parts cassette, wherein the parts cassette driving means presses a tape feed lever of the parts cassette.
2. The electronic component mounting apparatus according to claim 1, further comprising up-down moving means for vertically moving the pressing means, wherein the moving mechanism moves the pressing means in a lateral direction by a rotation diameter of the nozzle. 5. A movement smaller than an arrangement pitch of a parts cassette while rotating a transfer head provided with a plurality of nozzles of different types by a rotary mechanism around a rotation axis.
The electronic component of the parts cassette reciprocating in the horizontal direction is moved by the moving table capable of moving the distance in the horizontal direction. At the pickup station, the nozzle to be used among the plurality of nozzles provided in the transfer head is projected downward. Electronic component mounting method for picking up and mounting on a substrate at a mounting station, wherein one of two pick-up positions set at the pick-up station is selected according to a mounting sequence and the transfer is performed at a pick-up preparation station. By rotating the head about its axis of rotation, the nozzle eccentric from this axis of rotation is attached to the parts cassette about this axis of rotation.
The parts cassette is rotated by a radius of rotation smaller than the array pitch and moved to the selected pickup position, thereby increasing the lateral movement distance of the parts cassette. An electronic component mounting method, characterized in that a parts cassette driving means including a pressing means for pressing a tape feed lever of the parts cassette is moved in a lateral direction by a moving mechanism in accordance with the fluctuation. 6. A nozzle provided on said transfer head at a pick-up station for electronic components of a parts cassette reciprocating in a horizontal direction by a moving table while rotating the transfer head about a rotation axis by a rotary mechanism. picked up by an electronic component mounting method for mounting a substrate in a loading station, the transfer tape
The moving distance is smaller than the arrangement pitch of the parts cassette.
It is possible to move laterally with a release, the sequences pin nozzles offset from the rotation axis by rotating the transfer head about its axis of rotation about a rotary shaft
The part cassette is rotated by a rotation radius smaller than that of the switch to increase the lateral movement distance of the parts cassette, and the eccentric distance of the nozzle from the rotation axis is set to ４ of the arrangement pitch of the parts cassette. To 18 around the rotation axis.
By rotating the part cassette by 0 °, 1 /
An electronic component mounting method characterized by gaining a moving distance for two pitches. 7. The electronic component mounting method according to claim 6, wherein the rotation axis is rotated again after the pickup to set the mounting angle of the electronic component. 8. An arrangement of parts cassettes while rotating a transfer head at a plurality of stations by a rotary mechanism.
It is possible to move laterally with a moving distance smaller than the pitch
At a pickup station, electronic components of a parts cassette that reciprocate in a horizontal direction by a movable table are picked up by a nozzle provided on the transfer head, and are mounted on a substrate at a mounting station. The electronic component is configured such that the nozzle eccentric from the rotation axis is rotated with a rotation radius smaller than the arrangement pitch about the rotation axis to increase the lateral movement distance of the parts cassette. In a mounting method, a moving distance of the moving table when a transfer head of the station picks up an electronic component at the pick-up station at a station a plurality of positions before the pick-up station is moved this time based on program data. As distance And the next moving distance is calculated from the difference between the transfer head and the cassette mounting position of the transfer head located at the next station based on the program data. An electronic component mounting method, wherein the transfer head is rotated about the rotation axis in a direction approaching a parts cassette picked up by the nozzle from the difference between the two, and a pickup position of the nozzle is determined. . 9. An arrangement of parts cassettes while rotating a transfer head at a plurality of stations by a rotary mechanism.
It is possible to move laterally with a moving distance smaller than the pitch
At a pickup station, electronic components of a parts cassette that reciprocate in a horizontal direction by a movable table are picked up by a nozzle provided on the transfer head, and are mounted on a substrate at a mounting station. The electronic component is configured such that the nozzle eccentric from the rotation axis is rotated with a rotation radius smaller than the arrangement pitch about the rotation axis to increase the lateral movement distance of the parts cassette. In the mounting method, after picking up the electronic component at the pickup station, upon observing the electronic component picked up by the nozzle at the recognition station, by rotating the transfer head around the rotation axis, Recognition station for electronic components By positioning the recognition position of the disposed the recognition unit, the electronic component mounting method characterized by detecting the positional deviation of the electronic component. 10. A clockwise rotation direction of the transfer head.
10. The electronic component mounting method according to claim 9, wherein the electronic component is moved to the recognition position at a high speed by selecting one of the counterclockwise directions. 11. The electronic component mounting method according to claim 10, wherein the rotation angle is rotated to set the mounting angle of the electronic component after detecting the positional deviation.