JP3026853B2 - Component mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for mounting an electronic component on an electronic circuit board.

[0002]

2. Description of the Related Art In recent years, there has been a great demand in the mounting process of electronic parts to shorten the work tact in order to improve productivity.

Hereinafter, an example of a conventional electronic component mounting apparatus will be described with reference to the drawings.

FIG. 5 is an overall schematic view of a conventional electronic component mounting apparatus. Reference numeral 33 denotes a component supply unit for supplying an electronic component 36;
Reference numeral 4 denotes an XY robot, a head unit 3 having a suction nozzle 40.
5 is positioned at an arbitrary position. 37 is a suction nozzle 40
A recognition camera 39 for taking in the optical image of the electronic component 36 to which it is adsorbed and measuring the position error, carries in / out and carries out and holds the printed circuit board 38 by a table section composed of a pair of rails.
41 is a controller for the entire apparatus.

Next, the operation of the electronic component mounting apparatus will be described.

[0006] The printed circuit board 38 is carried in by the table section 39 and is held at the mounting position of the electronic component. The head unit 35 is moved by the XY robot 34 onto the component supply unit 33 on which the electronic component 36 is mounted, and the suction nozzle 4
0 falls to suck the electronic component 36. The head 35 to which the electronic component 36 has been sucked is moved by the XY robot 34 onto the recognition camera 37, and the recognition camera 37
The optical image of the electronic component 36 sucked at 0 is taken in, the positions of the suction nozzle 40 and the electronic component 36 are measured, and the position error is corrected. After the completion of the position correction, the electronic component 36 is mounted on the printed circuit board 3.
The printed circuit board 38 mounted on the mounting board 8 and completed to be mounted is carried out by the table section 39. The above sequence is controlled by the controller 41.

[0007]

However, in the above configuration, during mounting the electronic component 36 on the printed circuit board 38 after sucking the electronic component 36, the XY robot 34 is required to recognize the electronic component 36 sucked by the suction nozzle 40. Head part 3
5 must be once stopped on the recognition camera 37, and when stopped on the recognition camera 37, the time for charging the recognition light image to the CCD (charge coupled device) of the recognition camera 37. In addition, more time is required to calculate the position correction data.

While the speeding up of the XY robot for positioning is realized, the number of contact lead pins of electronic parts and the complexity of the shape have increased the recognition processing time. Therefore, even if the distance between the component supply unit 33, the recognition camera 37, and the printed circuit board 38 is shortened, it takes time to capture the recognition light image and calculate the position correction data as described above. Recognition camera 37
Have to stop for a long time.

In the mounting machine, the acceleration / deceleration time of the XY robot 34 is a major factor that restricts the mounting tact, and such a temporary stop increases the acceleration / deceleration time, thereby delaying the mounting tact. become.

In view of the above problems, the present invention provides a method for improving the loss of mounting tact due to the acceleration / deceleration time of the XY robot 34, and for efficiently taking measures such as capturing a recognition optical image of an electronic component and calculating correction data. To provide.

[0011]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a suction nozzle provided in a head unit sucks an electronic component from a component supply unit, and an optical image of the electronic component sucked by the suction nozzle is provided. A suction nozzle, an optical path in a block for transmitting an optical image of the electronic component sucked by the suction nozzle, and a block in a component mounting apparatus that mounts an electronic component on a printed circuit board after a camera captures and performs position correction processing. A first block including a first optical image transmission window for transmitting the optical image from the inner optical path, and a suction nozzle similar to the first block;
A second block having a light path in the block, and a second light image sending window; a recognition camera; a first light image receiving window for receiving a light image from the first block only when the first light image sending window is matched; And a second light image receiving window for receiving the light image from the second block only when the light image coincides with the second light image transmitting window, and recognizes the light images received from the first light image receiving window and the second light image receiving window. A main box for guiding the camera, a first block, a second block, and a head for holding the main box;
Raising and lowering each of the block and the second block independently,
When one of the blocks is at a position where the light image sending window and the corresponding light image receiving window coincide with each other and the light image is being captured by the recognition camera, the other block closes the other light image receiving window. Block drive control means for controlling the elevation position of the first block and the second block so as to perform a predetermined operation at the position.

[0012]

A pair of first blocks each having a suction nozzle for sucking an electronic component, an optical path in a block for transmitting a light image of the sucked electronic component to a recognition camera, and a light image sending window for sending the light image. The head unit including the second block moves to the component supply unit and performs an operation of sucking the electronic component. A recognition camera and a main box for guiding a light image from each block to the recognition camera are provided at an intermediate position between the pair of the first block and the second block. When one first block of the pair of blocks descends and sucks an electronic component, the other second block performs optical image data processing of the electronic component sucked in the previous stage, and removes the electronic component. keeping.

The first block that has sucked the electronic component by the suction nozzle rises and moves the optical image of the sucked electronic component from the optical image sending window to a position where it can enter the first optical image receiving window of the main box. The second block is at a position where the second optical image receiving window of the main box is closed, and the optical image of the electronic component sucked by the suction nozzle of the first block is taken into the recognition camera via the main box, At the same time, the head moves onto the printed circuit board, corrects the position of the electronic component held by the suction nozzle of the second block, and mounts it on the printed circuit board.

After completion of the electronic component mounting operation of the second block,
The head unit moves from the printed circuit board to the component supply unit, and moves to a supply position of a new electronic component to be sucked by the suction nozzle of the second block. During this time, the optical image of the recognized electronic component is recognized on the first block side. Data processing is performed.

After the suction nozzle of the second block sucks a new electronic component, the head moves to the printed circuit board, and the position of the electronic component sucked by the suction nozzle of the first block after the optical image data processing is completed is corrected. And attach it to the printed circuit board.
At this time, as in the case of the first block, the second block is located at a position where an optical image of the electronic component held by the suction nozzle can enter the second optical image receiving window of the main box from the optical image sending window. The block is located at a position where the first optical image receiving window of the main box is closed, and an optical image of the electronic component sucked by the suction nozzle of the second block is taken into a recognition camera, and subsequently, optical image data processing is performed.

When the electronic component sucked by the suction nozzle of the first block is mounted on the printed circuit board, the head unit returns to the component supply unit again, returns to the initial state, and the first block sucks a new electronic component. I do. The suction nozzles in the second block hold electronic components that have been subjected to optical image data processing.

Similarly, while one of the blocks is performing a suction or mounting operation of a component, the other block performs an optical image recognition operation of an electronic component that is being suction-held. Therefore, both blocks alternately perform the suction / mounting operation and the optical image recognition operation, and the optical image data processing of the electronic component is performed while the head unit moves between the printed board and the component supply unit. Does not stop while processing optical image data.

[0018]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.
This will be described with reference to FIG.

FIG. 1 is a schematic view of an electronic component mounting apparatus according to the present invention. In FIG. 1, reference numeral 1 denotes a printed board, 2 denotes a table section for carrying in / out and holding of the printed board 1, and 3 denotes a component supply section for supplying an electronic component 6. 5 is a pair of a first block 9 and a second block 16 having suction nozzles 11 and 18 for sucking the electronic component 6, respectively.
The recognition camera 23 and the main box 2 located in the middle
The head unit 2 is positioned in the X and Y directions by the XY robot 4. Details of the head section 5 will be described later with reference to FIGS. Reference numeral 7 denotes a controller for controlling the entire apparatus.

In the right part of FIGS. 2 and 3, a nut 13 and a .theta.-rotating motor 1 are mounted on a first block 9 containing a suction nozzle 11 equipped with a vacuum suction device (not shown).
0 is attached, the motor shaft of the θ rotation motor 10 is directly connected to the nozzle 11, and positions the nozzle 11 in the θ direction. Furthermore, the first block 9 can be slid up and down by the guide 12, and the motor 15
The suction nozzle 11 can be freely positioned in the vertical direction by rotating the nut 13 and moving the nut 13 up and down. Also, the component lighting 3 is provided inside the first block.
1 and a half mirror 25 provided as an optical path in the block, and the suction nozzle 11 penetrates the half mirror 25. On the side of the first block facing the main box 22, there is provided an optical image transmission window 42 for transmitting an optical image of the electronic component 6a reflected by the half mirror 25 when the component illumination 31 is turned on.

The same applies to the left part of FIGS. 2 and 3. A θ-rotation motor 17 is mounted on the second block 16 containing the suction nozzle 18, and its motor shaft is directly connected to the nozzle 18. ing. Further, the second block 16 can be slid up and down by the guide 19, and the nozzle 18 can also be freely moved in the vertical direction by a motor 20, a ball screw (not shown), and a nut (not shown) fixed to the block 16. Can be positioned. Similarly to the first block, inside the second block, there is a component mirror 32 and a half mirror 28 through which the suction nozzle 18 penetrates, and on the side surface facing the main box 22,
An optical image transmission window 43 is provided.

A main box 22 which is an optical image transmitting means having a lens barrel 21 having a recognition camera 23 and a lens 24 is fixedly provided at an intermediate portion between the first block 9 and the second block 16. .

The inside of the main box 22 has a structure as shown in FIG.
A first light image receiving window 29 and a second light image receiving window 30 are provided in the upper portion of the side surface on the block 16 side, respectively, and a mirror that reflects the light image taken in from the first light image receiving window 29 below. 26, and a half mirror 27 that reflects the light image captured from the upper second light image receiving window 30.

Next, the operation of the component mounting apparatus configured as described above will be described with reference to FIGS.

The printed circuit board 1 is carried into the table section 2 and held at the electronic component mounting position.

FIG. 4 is a schematic view showing the operation of the component mounting apparatus for picking up and mounting electronic components.

The head unit 5 is moved onto the component supply unit 3 by the XY robot 4 shown in FIG.
(A)). In the figure, the suction nozzle 18 of the second block 16 on the left side holds the electronic component 6b that has been suctioned in the previous stage of this figure and has processed the recognition data of the optical image.

Next, the first block 9 on the right side in the figure moves down (FIG. 4B), and after the suction nozzle 11 sucks the electronic component 6a on the component supply unit 3, the first block 9 moves up.
In the meantime, the second block 16 on the left side in the figure is in the state of holding the position shown in FIG. 4A and closes the second light image receiving window 30 above the main box 22, and the first block on the right side. By illuminating the component illumination 31 on the 9th side, the optical image of the electronic component 6 a sucked by the suction nozzle 11 is reflected by the half mirror 25 and sent out from the optical image sending window 42, and from the first optical image receiving window 29 to the main image. The light enters the box 22, is reflected by the mirror 26, passes through the half mirror 27, and is taken into the recognition camera 23 (FIG. 4C).

Next, the head unit 5 moves onto the printed circuit board 1 and mounts the electronic component 6b on which the position-corrected suction nozzle 18 of the second block 16 on the left side is sucked onto the printed circuit board 1 (FIG. 4D). ).

The suction nozzle 18 on the left side moves up after the mounting of the electronic component 6b is completed, and the head unit 5 moves from the printed circuit board 1 to the electronic component suction position on the component supply unit 3 again (FIG. 4E). ). During this time, the controller 7 shown in FIG.
Processes the light image of the electronic component 6a captured by the recognition camera 23, and calculates position correction data.

After moving onto the component supply unit 3, the suction nozzle 18 on the left side moves down to suck a new electronic component 6c (FIG. 4).
(F)) rise again.

Subsequently, the head unit 5 moves onto the printed circuit board 1, positions the electronic component 6a held by the right suction nozzle 11 on which the position correction data calculation has been completed to the mounting position, and mounts the electronic component 6a on the printed circuit board 1. At this time, the first light image receiving window 29 at the lower part of the main box 22 is closed by the first block 9 on the right side, and in the left block 16 raised to a position facing the upper second light image receiving window 30. The optical image of the electronic component 6c sucked by the suction nozzle 18 is reflected by the half mirror 28 and sent out from the light image sending window 43, enters the main box 22 from the second light image receiving window 30, and is reflected by the half mirror 27. And is taken into the recognition camera 23 (FIG. 4 (g)).

After the right suction nozzle 11 finishes mounting the electronic component 6a, the head unit 5 moves to the component supply unit 3 again, and
Returning to the state of FIG. 4A, the head unit 5 reciprocates between the component supply unit 3 and the printed circuit board 1 thereafter, and the suction nozzle of one of the blocks sucks a new electronic component so that the head unit 5 supplies the component. While moving to the section 3, the controller 7 performs data processing of the optical image of the electronic component sucked by the suction nozzle of the other block. Therefore, the head block 5 is not stopped during the optical image data processing of the electronic component sucked by the suction nozzle, and the first block and the second block perform the suction / mounting operation of the electronic component, the optical image recognition, and the data thereof. The electronic components are mounted on the printed circuit board 1 while alternately repeating the processing.

In this case, when the head unit 5 moves from the component supply unit 3 to the printed circuit board 1, the electronic component that has just been attracted to the suction nozzle of one block, and the optical image data is transmitted to the suction nozzle of the other block. In the case where the processed electronic component to be mounted is held and the head unit 5 returns from the printed circuit board 1 to the component supply unit 3, only the suction nozzle of one of the blocks holds the electronic component in the process of optical image data processing. You are doing.

In the above embodiment, only the initial operation is the first operation.
After the suction nozzle 11 of the block 9 sucks the electronic component, the electronic component is also sucked by the suction nozzle 18 of the second block 16, and the first part is moved while the head unit 5 moves from the component supply unit 3 to the printed circuit board 1. On the block 9 side, optical image recognition and optical image data processing are performed.

[0036]

According to the present invention, while the suction nozzle performs the suction / mounting operation of the electronic component, the recognition light image of the electronic component can be taken and data processing can be performed, and the time for stopping the XY robot can be reduced. Therefore, the mounting tact can be shortened and the production efficiency can be improved.

Further, since the two suction nozzles share one recognition camera and perform optical image recognition of the electronic components that have been suctioned, the structure of the equipment can be simplified and the cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing an embodiment of the present invention.

FIG. 2 is a perspective view illustrating details of a head unit of the component mounting apparatus.

FIG. 3 is a vertical sectional front view showing details of a head unit of the component mounting apparatus.

FIG. 4 is a schematic view showing a process of sucking and mounting an electronic component.

FIG. 5 is a perspective view schematically showing a conventional component mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed board 3 Component supply part 5 Head part 6 Electronic component 6a Electronic component 6b Electronic component 6c Electronic component 7 Controller 9 1st block 11 Suction nozzle 15 Motor 16 2nd block 18 Suction nozzle 20 Motor 22 Main box 23 Recognition camera 25 Half Mirror 28 Half mirror 29 First light image receiving window 30 Second light image receiving window 42 First light image sending window 43 Second light image sending window

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-3-225475 (JP, A) JP-A 64-800 (JP, A) JP-A-1-321700 (JP, A) JP-A 2- 124404 (JP, A) JP-A-3-208399 (JP, A) JP-A-3-241896 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/04 H05K 13 / 08

Claims (1)

(57) [Claims] 1. A suction nozzle provided in a head unit sucks an electronic component from a component supply unit, a recognition camera captures an optical image of the electronic component sucked by the suction nozzle, and performs a position correction process on a printed circuit board. A suction nozzle, an optical path in a block for transmitting an optical image of the electronic component sucked by the suction nozzle, and a first optical image transmission window for transmitting the optical image from the optical path in the block. A first block provided with: a suction nozzle similar to the first block;
A second block having a light path in the block, and a second light image sending window; a recognition camera; a first light image receiving window for receiving a light image from the first block only when the first light image sending window is matched; And a second light image receiving window for receiving the light image from the second block only when the light image coincides with the second light image transmitting window, and recognizes the light images received from the first light image receiving window and the second light image receiving window. A main box for guiding the camera, a first block, a second block, and a head for holding the main box;
Raising and lowering each of the block and the second block independently,
When one of the blocks is at a position where the light image sending window and the corresponding light image receiving window coincide with each other and the light image is being captured by the recognition camera, the other block closes the other light image receiving window. A component mounting apparatus comprising: a block drive control unit that controls a vertical position of a first block and a second block so as to perform a predetermined operation at a position.