JP3128414B2 - Electronic component automatic mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method of supplying a desired electronic component by moving a supply table, which is provided with a plurality of component supply units for supplying electronic components, in parallel in a direction in which the units are arranged by a driving device. The present invention relates to an automatic electronic component mounting apparatus in which a unit is stopped at a component extraction position, an electronic component is extracted by an extraction nozzle, and is mounted on a printed circuit board.

[0002]

2. Description of the Related Art An electronic component mounting apparatus of this kind is disclosed in
No. 94355, a plurality of tape feeding devices corresponding to a component supply unit are arranged on a supply table, and the supply table moves in the arrangement direction, and a part is taken out from a desired unit by a take-out nozzle. Mounted on a printed circuit board.

[0003] In this type of electronic component automatic mounting apparatus, the component supply unit is insufficiently mounted, so that the unit is lifted and mounted, or the tape holder is lifted up for tape replacement, and then the user forgets to lower it. In such a case, the supply table may move and collide with the extraction nozzle. An abutting member that is displaced by contacting the portion when the supply table moves is provided in the middle of the movement path of the supply table.

[0004]

However, in the above prior art, the supply table is moved at a speed for normal component supply, that is, at a high speed for moving the component supply unit to the component removal position of the removal nozzle. Therefore, there is a drawback that the impact when colliding with the contact member is strong, and the contact member and the component supply unit are easily damaged.

Accordingly, an object of the present invention is to reduce the impact applied when the component supply unit hits the contact member for abnormality detection.

[0006]

SUMMARY OF THE INVENTION Accordingly, the present invention is directed to a method for moving a supply base, which is provided with a plurality of component supply units for supplying electronic components in parallel, in a direction in which the units are provided by a driving device. In the automatic electronic component mounting device that stops the unit that supplies the component at the component extraction position, takes out the electronic component by the extraction nozzle, and mounts the electronic component on the printed circuit board, the electronic component is brought into contact with the obstacle that collides with the extraction nozzle on the moving path of the supply table. An abutting member that is displaced, a detecting unit that detects an obstruction portion based on the displacement of the contact member, a command unit that instructs a timing at which the detecting unit should detect the obstruction portion, and Control means is provided for moving the driving device at a lower speed than during a normal component supply operation.

Further, according to the present invention, a plurality of component supply units for supplying electronic components are arranged in parallel and a supply table is moved by a driving device in a direction in which the units are arranged, and the unit for supplying desired electronic components is provided as a component. In an electronic component automatic placement device that stops at a removal position, takes out an electronic component by a removal nozzle, and mounts the electronic component on a printed circuit board, a contact member that is lifted on a moving path of a supply table and displaces by contacting a mounted component supply unit. Detecting means for detecting an abnormal mounting of the unit by the displacement of the contact member,
Command means for instructing a timing at which the detection means should detect the mounting abnormality, and control means for moving the driving device at a lower speed in comparison with a normal component supply operation in accordance with the command from the command means It is.

The present invention is also directed to a unit for supplying a desired electronic component by moving a supply table on which a plurality of component supply units for supplying electronic components are mounted in parallel in a direction in which the unit is arranged by a driving device. In an electronic component automatic placement device that stops at a removal position, takes out an electronic component by a removal nozzle, and mounts it on a printed circuit board, a contact member that is displaced by contacting an obstacle that collides with the removal nozzle on a moving path of a supply table, Detecting means for detecting an obstruction portion by displacement of the contacting member; command means for instructing the start of automatic operation of component mounting; Control means is provided for moving all of the units on the supply table at a lower speed than in the supply operation within a range detected by the detection means.

[0009]

The control means detects the obstruction such that the detection means detects the obstruction by the displacement of the contact member which is displaced by contacting the obstruction which collides with the take-out nozzle on the moving path of the supply table. The drive unit is controlled in accordance with the command of the command means for commanding the power timing, and the supply table is moved at a lower speed as compared with the normal component supply operation.

In addition, even when the component supply unit is lifted and mounted, the supply table is moved at a lower speed than in a normal component supply operation in accordance with a command from the command means. Also. Before the automatic operation of the component mounting operation, the supply table is moved at a low speed so that all the component supply units are detected by the detection means.

[0011]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 and 3, reference numeral 1 denotes a Y table which moves in the Y direction by rotation of a Y-axis motor 2, and 3 denotes a movement in the X direction on the Y table 1 by rotation of an X-axis motor 4. As a result, the printed circuit board 6 on which the chip-shaped electronic components 5 (hereinafter, referred to as chip components or components) are mounted is fixedly mounted on fixing means (not shown).

Reference numeral 7 denotes a supply table on which a number of component supply devices 8 as component supply units for supplying the chip components 5 are provided. Reference numeral 9 denotes a supply table drive motor, which rotates the ball screw 10 so that the supply table 7 is guided by the linear guide 12 via a nut 11 fitted with the ball screw 10 and fixed to the supply table 7, and X Move in the direction.
Reference numeral 13 denotes a rotary table which rotates intermittently. At the outer edge of the table 13, mounting heads 15 having six suction nozzles 14 as take-out nozzles are arranged at equal intervals in accordance with an intermittent pitch.

Reference numeral I denotes a suction station, which is a stop position of the mounting head 15 where the suction nozzle 14 sucks and picks up the component 5 from the supply device 8 due to the intermittent rotation of the rotary table 13. 5 is adsorbed. 16 is a component 5 to which the suction nozzle 14 sucks.
This is a component recognition device which recognizes the positional shift of the component 5 by recognizing the lower surface of the component 5 with a camera in a predetermined visual field range and recognizing and processing the captured screen, and is provided in the recognition station II.

Next mounting head 1 of recognition station II
The stop position of the position 5 is the angle correction station III, and the angle in which the angular position for correcting the angular position deviation of the chip component 5 based on the recognition result of the recognition device 16 is added to the predetermined angle amount indicated in the mounting data (not shown). The head rotation device 17 rotates the mounting head 15 in the θ direction by an amount.

The next stop position after the angle correction station III is the mounting station IV, on which the components 5 to be suctioned by the suction nozzles 14 of the station are mounted on the substrate 6. Reference numeral 20 denotes an elevating rod which moves up and down, engages with an oscillating lever 21 of the component supply device 8 and oscillates the chip component 5.
The chip component 5 is supplied to a component suction position of the suction nozzle 14 by intermittently feeding a component storage tape (not shown) enclosing the component at a predetermined interval in accordance with the interval. Reference numeral 22 denotes a tape reel for winding the component storage tape (not shown).

Next, with reference to FIGS. 4 and 5, a description will be given of the component supply device 8 and a mechanism for detecting lifting of the device 8. FIG. The component storage tape (not shown) fed from the tape reel 22 is rotatable about the support shaft 32 and is pressed by a suppressor 33 that rotates clockwise in FIG. The suppressor 33 can be lifted about the support shaft 32 when replacing the component storage tape.

The component supply device 8 is positioned by inserting a positioning pin 34 into a positioning hole (not shown) of the supply table 7, and is attached to the supply table 7 by engaging a lock lever 35 with a bar 36. If there is an installation error, the component supply device 8 is lifted up, comes off during the movement of the supply table 7, hits the suction nozzle 14, or is mounted in a horizontally displaced position. May not be able to adsorb the chip component 5.

Reference numeral 37 denotes a template as a contact member, which is supported on a support frame 39 extending from a support member 38 for supporting the rotary table 13 so as to be swingable right and left in FIG. The template 37 is made of a metal such as aluminum and when suspended as it is, it is close to the proximity sensor 41 as a detecting means provided on the support frame 39 and the sensor 41 is in the ON state.

As described above, when the component supply device 8 is lifted due to a mounting error, the component supply device 8 is mounted with the suppressor 33 raised, or when there is another obstacle, 7 moves, the template 37 hits and swings, and the sensor 41
The template 37 is further separated and turned off. The template 37 and the proximity sensor 41 are provided one on each side of the moving path of the supply table 7.

Next, the control block will be described with reference to FIG. Reference numeral 24 denotes a CPU as control means,
Based on the data stored in the RAM 26 according to the program stored in the M25, various operations related to component mounting are controlled. The recognition device 16 and the proximity sensor 41 are connected to the CPU 24 via the interface 27. The interface 27 is connected to a supply table drive motor 9 and the like via a start key 28 as a command means and a drive circuit 30, and is controlled by the CPU 24.

The RAM 26 stores mounting data as shown in FIG. The mounting data is different for each type of the printed circuit board 6 on which components are to be mounted, and is stored in the RAM 26 for each type of the printed circuit board 6.
Data (the column labeled "X"), Y data ("Y"
) And θ data (a column labeled “θ”) are stored. The reel number is a number indicating the arrangement position of the component supply device 8 on the supply stand 7, for example, “1”, “2”... I have. The X data and the Y data represent XY position coordinates at which the chip component 5 on the printed circuit board 6 is to be mounted, and the θ data is the θ direction at which the chip component 5 is to be mounted, that is, the chip component 5 to be sucked should be rotated. Indicates the angle amount. “E” in the column “C” indicates that component mounting per one piece of the printed circuit board 6 ends at this step number.

The operation of the above configuration will be described below. First, when the power of the electronic component mounting apparatus is turned on and the start key 28 is pressed, as shown in the flowchart of FIG.
U24 rotates the supply table drive motor 9 at a low speed, for example, to move the supply table 7 stopped at the left end of FIG. 2 to the right at a lower speed than the normal component supply device 8 moves for component supply. Let it. Then, if any one of the component supply devices 8 has not been securely mounted and has been lifted with respect to the supply table 7, the component supply device 8
Hits the template 37 with almost no impact,
The template 37 oscillates, the proximity sensor 41 is turned off, and the CPU 24 determines that an abnormality of an obstacle or an abnormality due to lifting has occurred, stops the movement of the supply stand, and displays this on a CRT (not shown). Do not enter automatic driving.

Next, when the operator notices that there is an abnormality, the operator reattaches the component supply device 8 to release the abnormal state. Thereafter, the supply table 7 automatically returns to the initial position. next,
When the start key 28 is pressed again, the supply table 7 moves at a low speed in the same manner as described above. Next, when the component supply device 8 is normally attached, the suppressor 33 is not lifted, and there is no other obstacle, there is nothing to come into contact with the template 37.
Is moved to the opposite side after passing through the template 37 on one side, the CPU 24 stops the supply board drive motor 9 and determines that there is no abnormality, and then starts automatic operation as follows.

The fact that the supply table 7 has passed the template 37 is determined by moving the distance set in advance as the destination. That is, first, the ball screw 10 is rotated by the rotation of the motor 9 in accordance with the intermittent rotation of the rotary table 13.
The supply table 7 moves along the linear guide 12 at a speed higher than the moving speed for detecting the above-described obstacle portion due to the rotation of the reel, and the reel number "1" of the step number "1" of the mounting data in FIG. Moves to the suction station I and stops.

Next, the chip component 5 supplied by the component supply device 8 by the suction nozzle 14 of the mounting head 15 stopped at the suction station I by the rotation of the rotary table 13
Is adsorbed. Next, when the mounting head 15 reaches the recognition station II due to the rotation of the rotary table 13,
Recognition of the positional shift of the chip component 5 sucked by the suction nozzle 14 is performed.

Next, when the rotary table 13 rotates and the head 15 reaches the angle correction station III,
The suction nozzle 14 is rotated by the head rotation device 17 by an angle amount obtained by adding the angle amount for correcting the angle deviation recognized in the recognition station to “θ1” of the θ data of the mounting data. The CPU 24 controls. Next, the head 15 reaches the mounting station IV, and the XY table 3
Moves in the X and Y directions, and the chip components 5
Is attached.

The mounting operation is performed as described above.
The automatic operation is stopped after the component mounting is completed for the predetermined number of printed circuit boards, the board type is changed, the component supply device 8 is replaced, and then when the start key 28 is pressed, the supply table 7 is changed to the template as described above. Although the component feeder 8 moves at a low speed without impact even if the component feeder 8 hits the same, for example, if the component feeder 8 is lifted off the suppressor 33, the suppressor 33 hits the template 37 and contacts the proximity sensor 41. Is turned off, the CPU 24
Determines the abnormality, stops the supply table drive motor 9, stops the supply table 7, and notifies the abnormality.

In this embodiment, the supply base 7 is moved at a low speed before the start of the automatic operation to detect a faulty part. However, the same operation may be performed after the power is turned on, or a component supply device may be used. When the detection operation is to be performed, such as when the part is out of the parts 8 and the replacement is performed, for example, when the detection start key is pressed, the CPU issues a command to move the supply table 7 at a low speed over the entire area. You may make it do.

Since the template 37 is provided on both sides of the suction station I, the movement for detecting the obstacle may be started from either side.

[0030]

As described above, according to the present invention, even when the component supply unit is lifted up or has an obstruction, the supply table is moved at a low speed for the detection and the detection is performed. Even if the unit collides, the impact is small, and the damage to the contact member and the component supply unit can be reduced.

[Brief description of the drawings]

FIG. 1 is a control block diagram of an electronic component automatic mounting apparatus to which the present invention is applied.

FIG. 2 is a plan view of the electronic component automatic mounting apparatus.

FIG. 3 is a side view of the electronic component automatic mounting apparatus.

FIG. 4 is a side view showing a component supply device and a template.

FIG. 5 is a front view showing a template and a proximity sensor.

FIG. 6 is a diagram showing mounting data.

FIG. 7 is a diagram showing a flowchart.

[Explanation of symbols]

 Reference Signs List 5 Chip-shaped electronic component (electronic component) 6 Printed circuit board 7 Supply table 8 Component supply device (component supply unit) 9 Supply table drive motor (drive device) 14 Suction nozzle (extraction nozzle) 24 CPU (control means) 28 Start key ( Command means) 33 suppressor 37 template (contact member) 41 proximity sensor (detection means)

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 13/02 H05K 13/08

Claims (3)

(57) [Claims] 1. A drive unit moves a supply table on which a plurality of component supply units for supplying electronic components are mounted in parallel in a direction in which the units are arranged, and the unit for supplying a desired electronic component is moved to a component extraction position. In an electronic component automatic placement device that stops and takes out an electronic component by a take-out nozzle and mounts it on a printed circuit board, a contact member that is displaced by contacting an obstacle that collides with the take-out nozzle on a moving path of a supply table; Detecting means for detecting a faulty part by displacement of the driving means, commanding means for instructing a timing at which the detecting means should detect the faulty part, and comparing the driving device in a normal component supply operation in accordance with a command from the commanding means. An electronic component automatic mounting device, characterized in that control means for moving the electronic component at a low speed is provided. 2. A plurality of component supply units for supplying electronic components are arranged in a row, and a supply table attached thereto is moved in a direction in which the units are arranged by a driving device, and the unit for supplying desired electronic components is moved to a component extraction position. In an electronic component automatic mounting apparatus that stops and takes out an electronic component by a take-out nozzle and mounts the electronic component on a printed circuit board, a contact member that is lifted on a moving path of a supply table and displaces by contacting a mounted component supply unit; Detecting means for detecting a mounting abnormality of the unit based on displacement of a member; command means for instructing a timing at which the detecting means should detect the mounting abnormality; and a normal component for driving the drive device in accordance with a command from the command means. An electronic component automatic mounting device, comprising a control means for moving the electronic component at a lower speed than during a supply operation. 3. A unit for supplying a plurality of component supply units for supplying an electronic component is moved in a direction in which the unit is mounted by a driving device, and the unit for supplying a desired electronic component is moved to a component extraction position. In an electronic component automatic placement device that stops and takes out an electronic component by a take-out nozzle and mounts it on a printed circuit board, a contact member that is displaced by contacting an obstacle that collides with the take-out nozzle on a moving path of a supply table; Detecting means for detecting an obstacle part by displacement of the actuator, command means for instructing the start of automatic operation of component mounting, and in response to a command from the command means, the drive device is operated during a normal component supply operation before the component mounting operation. An automatic electronic component mounting apparatus, further comprising control means for moving all of the units on the supply table at a relatively low speed within a range detected by the detection means.